MAX1574

MAX1574
MAX1574ETB+
RELIABILITY REPORT
FOR
MAX1574ETB+
PLASTIC ENCAPSULATED DEVICES
April 5, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX1574ETB+
Conclusion
The MAX1574ETB+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1574 charge pump drives up to three white LEDs with regulated constant current for uniform intensity. By utilizing adaptive 1x/2x
charge-pump modes and very-low-dropout current regulators, it achieves 180mA output drive capability and high efficiency over the 1-cell
lithium-battery input voltage range. Fixed-frequency (1MHz) switching allows for tiny external components, and the regulation scheme is optimized to
ensure low EMI and low input ripple. The MAX1574 uses an external resistor to set the fullscale 100% LED current. An enable input (EN) is used for
simple on/off control or can be pulsed repeatedly to set lower LED current in multiple steps down to 5%. Once the desired brightness is set, the
MAX1574 maintains constant LED current as long as EN is kept high. If EN is kept low for more than 2ms, the MAX1574 enters shutdown. The
MAX1574 is available in a 10-pin 3mm x 3mm TDFN package (0.8mm max height).
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MAX1574ETB+
II. Manufacturing Information
A. Description/Function:
180mA, 1x/2x, White LED Charge Pump in 3mm x 3mm TDFN
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
Texas
E. Assembly Location:
UTL Thailand, Unisem Malaysia, ISPL Philippines
F. Date of Initial Production:
December 28, 2003
III. Packaging Information
A. Package Type:
10-pin TDFN 3x3
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0806
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
54°C/W
K. Single Layer Theta Jc:
8.5°C/W
L. Multi Layer Theta Ja:
41°C/W
M. Multi Layer Theta Jc:
8.5°C/W
IV. Die Information
A. Dimensions:
62 X 93 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX1574ETB+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maximic.com/. Current monitor data for the B8 Process results in a FIT Rate of 0.28 @ 25C and 17.30 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PN33 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX1574ETB+
Table 1
Reliability Evaluation Test Results
MAX1574ETB+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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