DATA SHEET BCW69; BCW70 PNP general purpose transistors Product specification

DATA  SHEET BCW69; BCW70 PNP general purpose transistors Product specification
DISCRETE SEMICONDUCTORS
DATA SHEET
BCW69; BCW70
PNP general purpose transistors
Product specification
Supersedes data of 1999 Apr 19
2004 Feb 06
Philips Semiconductors
Product specification
PNP general purpose transistors
BCW69; BCW70
FEATURES
PINNING
• Low current (max. 100 mA)
PIN
• Low voltage (max. 45 V).
APPLICATIONS
DESCRIPTION
1
base
2
emitter
3
collector
• General purpose switching and amplification.
DESCRIPTION
PNP transistor in a SOT23 plastic package.
NPN complements: BCW71 and BCW72.
handbook, halfpage
3
3
MARKING
1
TYPE NUMBER
MARKING
CODE(1)
BCW69
H1*
BCW70
H2*
2
1
2
Top view
MAM256
Note
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
TYPE
NUMBER
BCW69
PACKAGE
NAME
−
DESCRIPTION
VERSION
plastic surface mounted package; 3 leads
SOT23
BCW70
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
−50
V
VCEO
collector-emitter voltage
open base; IC = −2 mA
−
−45
V
VEBO
emitter-base voltage
open collector
−
−5
V
IC
collector current (DC)
−
−100
mA
ICM
peak collector current
−
−200
mA
IBM
peak base current
Ptot
total power dissipation
Tstg
−
−200
mA
−
250
mW
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
2004 Feb 06
Tamb ≤ 25 °C
2
Philips Semiconductors
Product specification
PNP general purpose transistors
BCW69; BCW70
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
500
K/W
note 1
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
MAX.
UNIT
IE = 0; VCB = −20 V
−
−
−100
nA
−
−
−10
µA
−
−
−100
nA
BCW69
−
90
−
BCW70
−
150
−
BCW69
120
−
260
BCW70
215
−
500
−
emitter cut-off current
IC = 0; VEB = −5 V
hFE
DC current gain
IC = −10 µA; VCE = −5 V
DC current gain
VBEsat
TYP.
IE = 0; VCB = −20 V; Tj = 100 °C
collector cut-off current
IEBO
VCEsat
MIN.
IC = −2 mA; VCE = −5 V
collector-emitter saturation
voltage
IC = −10 mA; IB = −0.5 mA
−80
−300
mV
IC = −50 mA; IB = −2.5 mA; note 1 −
−150
−
mV
base-emitter saturation voltage
IC = −10 mA; IB = −0.5 mA
−
−720
−
mV
IC = −50 mA; IB = −2.5 mA; note 1 −
−810
−
mV
VBE
base-emitter voltage
IC = −2 mA; VCE = −5 V
−600
−
−750
mV
Cc
collector capacitance
IE = Ie = 0; VCB = −10 V;
f = 1 MHz
−
4.5
−
pF
fT
transition frequency
IC = −10 mA; VCE = −5 V;
f = 100 MHz
100
−
−
MHz
F
noise figure
IC = −200 µA; VCE = −5 V;
RS = 2 kΩ; f = 1 kHz; B = 200 Hz
−
−
10
dB
Note
1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
2004 Feb 06
3
Philips Semiconductors
Product specification
PNP general purpose transistors
BCW69; BCW70
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2004 Feb 06
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
TO-236AB
4
Philips Semiconductors
Product specification
PNP general purpose transistors
BCW69; BCW70
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Feb 06
5
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/04/pp6
Date of release: 2004
Feb 06
Document order number:
9397 750 12405
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