Документация ca064c-c0g

Документация ca064c-c0g
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is an
advanced passive technology where multiple capacitor elements
are integrated into one common monolithic structure. Array
technology promotes reduced placement costs and increased
throughput. This is achieved by alternatively placing one device
rather than two or four discrete devices. Use of capacitor arrays
also saves board space which translates into increased board
density and more functions per board. Arrays consume only
a portion of the space required for standard chips resulting in
savings in inventory and pick/place machine positions.
time and voltage and boasts a negligible change in capacitance
with reference to ambient temperature. Capacitance change is
limited to ±30 ppm/ºC from -55°C to +125°C.
KEMET automotive grade array capacitors meet the demanding
Automotive Electronics Council's AEC–Q200 qualification
requirements.
KEMET’s C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.”The Electronics
Industries Alliance (EIA) characterizes C0G dielectric as a Class
I material. Components of this classification are temperature
compensating and are suited for resonant circuit applications
or those where Q and stability of capacitance characteristics are
required. C0G exhibits no change in capacitance with respect to
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Ordering Information
CA
06
4
C
Ceramic Case Size Number of Specification/
Array
(L" x W")1 Capacitors
Series
05 = 0508
06 = 0612
2=2
4=4
C = Standard
X = Flexible
Termination
104
K
4
G
Capacitance
Code (pF)
Capacitance
Tolerance
Voltage
Dielectric
2 significant
digits +
number of
zeros
J = ±5%
K = ±10%
M = ±20%
8 = 10 V G = C0G
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
A
C
TU
Failure Rate/ Termination
Design
Finish2
A = N/A
Packaging/Grade
(C-Spec)3
C = 100%
Matte Sn
L = SnPb (5%
minimum)
Blank = Bulk Bag
(Commercial Grade)
TU = 7" Tape & Reel
(Commercial Grade)
AUTO = 7" Reel
(Automotive Grade)
AUTO 7411 = 13"
Reel/Punched Paper
(Automotive Grade)
AUTO 7210 = 13" Reel/
Embossed Plastic
(Automotive Grade)
All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs using the
"0612" nomenclature. "CA064" replaces "C1632" in the ordering code.
2
Additional termination finish options may be available. Contact KEMET for details.
2,3
SnPb termination finish option is not available on automotive grade product.
3
Additional reeling or packaging options may be available. Contact KEMET for details.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L"x W") and thickness dimension. See "Chip Thickness/Packaging Quantities" and
"Tape & Reel Packaging Information" sections of this document.
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information" section of this document.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These
products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
1
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned1
Yes (with approval and
sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
1
PPAP (Product Part Approval Process) Level
1
2
3
4
5
KEMET
assigned1
●
●
●
●
●
AUTO
○
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
0508 (2-CAP)
0612 (4-CAP)
Top View
L
BW
T
CL
P
Ref
T
BL
W
P
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
BW
Bandwidth
BL
Bandlength
0508
1220
1.30 (0.051)
±0.15 (0.006)
2.10 (0.083)
±0.15 (0.006)
0.53 (0.021)
±0.08 (0.003)
0.30 (0.012)
±0.20 (0.008)
1632
1.60 (0.063)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
0.40 (0.016)
±0.20 (0.008)
0.30 (0.012)
±0.20 (0.008)
0612
L
W
BL
CL
Profile View
BW
P
P Ref
Top View
Profile View
T
Thickness
See Table 2 for
Thickness
P
Pitch
P
Reference
1.00 (0.039)
±0.10 (0.004)
0.50 (0.020)
±0.10 (0.004)
0.80 (0.031)
±0.10 (0.004)
0.40 (0.016)
±0.05 (0.002)
Benefits
•
•
•
•
•
•
•
•
-55°C to +125°C operating temperature range
Saves both circuit board and inventory space
Reduces placement costs and increases throughput
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0508 (2-element) and 0612 (4-element) case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V
Capacitance offerings ranging from 10 pF to 2,200 pF
Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request (5%
minimum)
• Flexible termination option available upon request
• Commercial and Automotive (AEC–Q200) grades available
Applications
Typical applications include those that can benefit from board area savings, cost savings and overall volumetric reduction such as
telecommunications, computers, handheld devices and automotive.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
-55°C to +125°C
±30 ppm/ºC
0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
C0G
All
All
0.5
Capacitance
Shift
Insulation
Resistance
0.3% or ±0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0508 – 0612 Case Sizes)
Case Size/Series C0508C/X (CA052C/X 2-Cap Case Size)
Capacitance
Capacitance
Code
Voltage Code
8
4
3
5
1
8
4
3
5
1
2
Rated Voltage
(VDC)
10
16
25
50
100
10
16
25
50
100
200
Capacitance
Tolerance
10 pF
12 pF
15 pF
18 pF
22 pF
27 pF
33 pF
39 pF
47 pF
56 pF
68 pF
82 pF
100 pF
120 pF
150 pF
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
112
122
132
152
162
182
202
222
Capacitance
Capacitance
Code
C0612C/X (CA064C/X 4-Cap Case Size)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
PA
Rated Voltage (VDC)
10
16
25
50
Voltage Code
8
4
3
5
Case Size/Series
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
100
10
16
25
50
100
200
1
8
4
3
5
1
2
C0508C/X (CA052C/X 2-Cap Case Size)
C0612C/X (CA064C/X 4-Cap Case Size)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
PA
MA
0508
0612
0.80 ± 0.10
0.80 ± 0.10
0
0
0
0
4,000
4,000
10,000
10,000
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC-7351
EIA SIZE
CODE
METRIC
SIZE
CODE
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
C
Y
X
P
V1
V2
C
Y
X
P
V1
V2
C
Y
X
P
V1
V2
0508/CA052
1220
1.60
1.00
0.55
1.00
3.50
3.30
1.50
0.90
0.50
1.00
2.90
2.80
1.40
0.75
0.45
1.00
2.40
2.50
0612/CA064
1632
1.80
1.10
0.50
0.80
3.90
4.40
1.80
0.95
0.50
0.80
3.30
3.90
1.70
0.85
0.40
0.80
2.80
3.60
Density Level A: For low-density product applications. Provides a wider process window for reflow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 0612 case size.
V2
P
X
Y
V1
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
Termination Finish
SnPb
100% Matte Sn
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
30 seconds maximum
Time 25°C to Peak
Temperature
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
tL
Tsmax
Tsmin
tS
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
Ramp-Down Rate (TP to TL)
TP
Temperature
Profile Feature
25
25° C to Peak
Time
6°C/second maximum 6°C/second maximum
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling
JESD22 Method JA–104
Biased Humidity
MIL–STD–202 Method 103
Moisture Resistance
MIL–STD–202 Method 106
1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
Thermal Shock
MIL–STD–202 Method 107
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
Storage Life
MIL–STD–202 Method 108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Barrier Layer
(Ni)
Base Metal
(Cu)
Dielectric Material
(CaZrO3)
Base Metal
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Construction – Flexible Termination
Detailed Cross Section
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Barrier Layer
(Ni)
Epoxy Layer
(Ag)
Base Metal
(Cu)
Dielectric Material
(CaZrO3)
Base Metal
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic
EIA Case Size
Tape size (W)*
7" Reel
13" Reel
Punched Paper
7" Reel
Pitch (P1)*
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
4
4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
R Reference
Note 2
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1016_C0G_ARRAY_SMD • 12/12/2014
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Sasso Marconi, Italy
Tel: 39-051-939111
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
2835 KEMET Way
Simpsonville, SC 29681
Southeast
Lake Mary, FL
Tel: 407-855-8886
Espoo, Finland
Tel: 358-9-5406-5000
Northeast
Wilmington, MA
Tel: 978-658-1663
Beijing, China
Tel: 86-10-5829-1711
Shanghai, China
Tel: 86-21-6447-0707
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Central
Novi, MI
Tel: 248-306-9353
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 12/12/2014
18
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