MAX5136

MAX5136
MAX5136AGTG+
RELIABILITY REPORT
FOR
MAX5136AGTG+
PLASTIC ENCAPSULATED DEVICES
February 26, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX5136AGTG+
Conclusion
The MAX5136AGTG+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX5134-MAX5137 is a family of pin-compatible and software-compatible 16-bit and 12-bit DACs. The MAX5134/MAX5135 are low-power, quad
16-/12-bit, buffered voltage-output, high-linearity DACs. The MAX5136/MAX5137 are low-power, dual 16-/12-bit, buffered voltage-output, high-linearity
DACs. They use a precision internal reference or a precision external reference for rail-to-rail operation. The MAX5134-MAX5137 accept a wide +2.7V
to +5.25V supply-voltage range to accommodate most low-power and low-voltage applications. These devices accept a 3-wire
SPI(tm)-/QSPI(tm)-/MICROWIRE(tm)-/DSP-compatible serial interface to save board space and reduce the complexity of optically isolated and
transformer-isolated applications. The digital interface's double-buffered hardware and software active-low LDAC provide simultaneous output
updates. The serial interface features an active-low READY output for easy daisy-chaining of several MAX5134-MAX5137 devices and/or other
compatible devices. The MAX5134-MAX5137 include a hardware input to reset the DAC outputs to zero or midscale upon power-up or reset, providing
additional safety for applications that drive valves or other transducers that need to be off during power-up. The high linearity of the DACs makes these
devices ideal for precision control and instrumentation applications. The MAX5134-MAX5137 are available in an ultra-small (4mm x 4mm), 24-pin
TQFN package and are specified over the -40°C to +105°C extended industrial temperature range.
Maxim Integrated Products. All rights reserved.
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MAX5136AGTG+
II. Manufacturing Information
A. Description/Function:
Pin-/Software-Compatible, 16-/12-Bit, Voltage-Output DACs
B. Process:
S4
C. Number of Device Transistors:
D. Fabrication Location:
Texas
E. Assembly Location:
ASAT China, UTL Thailand, Unisem Malaysia, ISPL Philippines
F. Date of Initial Production:
July 24, 2008
III. Packaging Information
A. Package Type:
24-pin TQFN 4x4
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
48°C/W
K. Single Layer Theta Jc:
2.7°C/W
L. Multi Layer Theta Ja:
36°C/W
M. Multi Layer Theta Jc:
2.7°C/W
IV. Die Information
A. Dimensions:
97 X 97 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX5136AGTG+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maximic.com/. Current monitor data for the S4 Process results in a FIT Rate of 4.6 @ 25C and 79.2 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DB34-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA, 1.5x VCCMax Overvoltage per
JESD78.
Maxim Integrated Products. All rights reserved.
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MAX5136AGTG+
Table 1
Reliability Evaluation Test Results
MAX5136AGTG+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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