LMH0074 SMPTE 259M / 344M Adaptive Cable Equalizer LMH0074 FEATURES DESCRIPTION

LMH0074 SMPTE 259M / 344M Adaptive Cable Equalizer LMH0074 FEATURES DESCRIPTION
LMH0074
www.ti.com
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
LMH0074 SMPTE 259M / 344M Adaptive Cable Equalizer
Check for Samples: LMH0074
FEATURES
DESCRIPTION
•
•
•
•
The LMH0074 SMPTE 259M / 344M Adaptive Cable
Equalizer is designed to equalize data transmitted
over cable (or any media with similar dispersive loss
characteristics). The equalizer operates over a wide
range of data rates from 125 Mbps to 540 Mbps and
supports SMPTE 259M and SMPTE 344M.
1
2
•
•
•
•
•
•
•
SMPTE 259M and SMPTE 344M Compliant
Supports DVB-ASI at 270 Mbps
Data Rates: 125 Mbps to 540 Mbps
Equalizes up to 400 Meters of Belden 1694A at
270 Mbps
Manual Bypass and Output Mute with a
Programmable Threshold
Single-Ended or Differential Input
50Ω Differential Outputs
Single 3.3V Supply Operation
Industrial Temperature Range: −40°C to +85°C
208mW Typical Power Consumption with 3.3V
Supply
Footprint Compatible with the LMH0044 and
the GS9074A
The LMH0074 implements DC restoration to correctly
handle pathological data conditions. The equalizer
may be driven in either a single ended or differential
configuration.
Additional features include separate carrier detect
and output mute pins which may be tied together to
mute the output when no signal is present. A
programmable mute reference is provided to mute the
output at a selectable level of signal degradation.
APPLICATIONS
•
•
•
SMPTE 259M and SMPTE 344M Serial Digital
Interfaces
Serial Digital Data Equalization and Reception
Data Recovery Equalization
Typical Application
6.8 nH
Coaxial Cable
1 PF
LMH0074 Adaptive
Cable Equalizer
SDI
SDO
SDI
SDO
4.7 PF
75:
Outputs
75:
4.7 PF
1 PF
37.4:
MUTE
MUTEREF
MUTE
MUTEREF
CD
AEC+
BYPASS
AEC1 PF
CD
BYPASS
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
LMH0074
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
−0.5V to 3.6V
Supply Voltage
−0.3V to VCC+0.3V
Input Voltage (all inputs)
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+150°C
Lead Temperature
(Soldering 4 Sec)
+260°C
Package Thermal Resistance
θJA 16-pin WQFN
θJC 16-pin WQFN
+43°C/W
+9°C/W
ESD Rating (HBM)
8kV
ESD Rating (MM)
(1)
250V
"Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of "Electrical Characteristics" specifies acceptable device operating conditions.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (VCC – VEE)
3.3V ±5%
Input Coupling Capacitance
1.0 µF
AEC Capacitor (Connected between
AEC+ and AEC-)
1.0 µF
Operating Free Air Temperature (TA)
−40°C to +85°C
DC ELECTRICAL CHARACTERISTICS
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
Parameter
VCMIN
Test Conditions
Input Common Mode Voltage
VSDI
Input Voltage Swing
VCMOUT
Output Common Mode Voltage
VSDO
Output Voltage Swing
Reference
Min
SDI, SDI
At LMH0074 input
(3) (4)
720
50Ω load, differential
MUTEREF
MUTEREF Range
CD Output Voltage
Carrier not present
CD
800
Min to mute outputs
(1)
(2)
(3)
(4)
(5)
2
Supply Current
950
750
mVP-P
1.3
V
0.7
V
V
0.4
See (5)
mVP−P
V
3.0
V
V
Max to force outputs active
ICC
V
2.6
MUTE
Units
VCC –
VSDO/2
Carrier present
MUTE Input Voltage
Max
1.9
SDO, SDO
MUTEREF DC Voltage
(floating)
Typ
63
0.8
V
77
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
The maximum input voltage swing assumes a nonstressing, DC-balance signal; specifically, the SMPTE-recommended color bar test
signal. Pathological or other stressing signals may not be used. This specification is for 0m cable only.
Supply current depends on the amount of cable being equalized. The current is highest for short cable and decreases as the cable
length is increased. Refer to Figure 2.
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
LMH0074
www.ti.com
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
AC ELECTRICAL CHARACTERISTICS
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
Parameter
BRMIN
Minimum Input Data Rate
BRMAX
Maximum Input Data Rate
Jitter for various Cable Lengths
(with equalizer pathological)
tr,tf
Output Rise Time, Fall Time
Test Conditions
Reference
Min
SDI, SDI
Typ
Max
Units
125
Mbps
540
Mbps
270 Mbps, Belden 1694A,
400 meters (2)
0.2
UI
270 Mbps, Belden 8281,
280 meters (2)
0.2
UI
20% – 80%
(2)
100
220
ps
(2)
SDO, SDO
Mismatch in Rise/Fall Time
See
2
15
ps
tOS
Output Overshoot
See (2)
1
5
%
ROUT
Output Resistance
Single-ended (3)
50
Ω
RLIN
Input Return Loss
See (4)
18-20
dB
RIN
Input Resistance
Single-ended
1.3
kΩ
CIN
Input Capacitance
Single-ended (3)
1
pF
(1)
(2)
(3)
(4)
SDI, SDI
15
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
Specification is ensured by design.
Input return loss is dependent on board design. The LMH0074 meets this specification on the SD074 evaluation board from 5MHz to
1.5GHz.
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
3
LMH0074
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
www.ti.com
SDI
3
VEE
4
CD
MUTE
VCC
13
LMH0074
(top view)
5
6
7
8
MUTEREF
2
14
BYPASS
SDI
15
AEC-
1
16
AEC+
VEE
VCC
CONNECTION DIAGRAM
12
VEE
11
SDO
10
SDO
9
VEE
Figure 1. 16-Pin WQFN Package
See Package Number RUM0016A
Pin Descriptions
Pin
4
Name
Description
1
VEE
Negative power supply (ground).
2
SDI
Serial data true input.
3
SDI
Serial data complement input.
4
VEE
Negative power supply (ground).
5
AEC+
AEC loop filter external capacitor (1µF) positive connection.
6
AEC-
AEC loop filter external capacitor (1µF) negative connection.
7
BYPASS
Bypasses equalization and DC restoration when high. No equalization occurs in this mode.
8
MUTEREF
Mute reference. Sets the threshold for CD and (with CD tied to MUTE) determines the maximum cable
to be equalized before muting. MUTEREF may be unconnected for maximum equalization.
9
VEE
Negative power supply (ground).
10
SDO
Serial data complement output.
11
SDO
Serial data true output.
12
VEE
Negative power supply (ground).
13
VCC
Positive power supply (+3.3V).
14
MUTE
Output mute. To disable the mute function and enable the output, MUTE must be tied to GND or a low
level signal. To force the outputs to a muted state, tie to VCC. CD may be tied to this pin to inhibit the
output when no input signal is present. MUTE has no function in BYPASS mode.
15
CD
Carrier detect. CD is high when no signal is present. CD has no function in BYPASS mode.
16
VCC
Positive power supply (+3.3V).
DAP
VEE
Connect exposed DAP to negative power supply.
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
LMH0074
www.ti.com
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
Block Diagram
BYPASS
Output
Driver
SDI
SDI
DC
Restoration/
Level Control
Equalizer
Filter
Energy
Detect
SDO
SDO
Energy
Detect
6
Automatic
Equalization
Control
Carrier
Detect/
Mute
CD
MUTE
MUTEREF
AEC+
AEC-
DEVICE OPERATION
BLOCK DESCRIPTION
The Equalizer Filter block is a multi-stage adaptive filter. If Bypass is high, the equalizer filter is disabled.
The DC Restoration / Level Control block receives the differential signals from the equalizer filter block. This
block incorporates a self-biasing DC restoration circuit to fully DC restore the signals. If Bypass is high, this
function is disabled.
The signals before and after the DC Restoration / Level Control block are used to generate the Automatic
Equalization Control (AEC) signal. This control signal sets the gain and bandwidth of the equalizer filter. The
loop response in the AEC block is controlled by an external 1µF capacitor placed across the AEC+ and AECpins.
The Carrier Detect / Mute block generates the carrier detect signal and controls the mute function of the output.
This block utilizes the CD and MUTE signals along with Mute Reference (MUTEREF).
The Output Driver produces SDO and SDO.
MUTE REFERENCE (MUTEREF)
The mute reference sets the threshold for CD and (with CD tied to MUTE) determines the amount of cable to
equalize before automatically muting the outputs. This is set by applying a voltage inversely proportional to the
length of cable to equalize. As the applied MUTEREF voltage is increased, the amount of cable that can be
equalized before carrier detect is de-asserted and the outputs are muted is decreased. MUTEREF may be left
unconnected for maximum equalization before muting.
CARRIER DETECT (CD) AND MUTE
Carrier detect CD indicates if a valid signal is present at the LMH0074 input. If MUTEREF is used, the carrier
detect threshold will be altered accordingly. CD provides a high voltage when no signal is present at the
LMH0074 input. CD is low when a valid input signal is detected.
MUTE can be used to manually mute or enable SDO and SDO. Applying a high input to MUTE will mute the
LMH0074 outputs. Applying a low input will force the outputs to be active.
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
5
LMH0074
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
www.ti.com
CD and MUTE may be tied together to automatically mute the output when no input signal is present.
INPUT INTERFACING
The LMH0074 accepts either differential or single-ended input. The input must be AC coupled. Transformer
coupling is not supported.
The LMH0074 correctly handles equalizer pathological signals for standard definition serial digital video, as
described in SMPTE RP 178.
OUTPUT INTERFACING
The SDO and SDO outputs are internally loaded with 50Ω. They produce a 750 mVP-P differential output, or a
375 mVP-P single-ended output.
6
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
LMH0074
www.ti.com
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
APPLICATION INFORMATION
PCB LAYOUT RECOMMENDATIONS
Refer to the following Application Note on TI's website: AN-1372, “LMH0034 PCB Layout Techniques.” The PCB
layout techniques in the application note apply to the LMH0074 as well.
SUPPLY CURRENT VS. CABLE LENGTH
The supply current (ICC) depends on the amount of cable being equalized. The current is highest for short cable
and decreases as the cable length is increased. Figure 2 shows supply current vs. Belden 1694A cable length for
270 Mbps data.
SUPPLY CURRENT (mA)
75
70
65
60
55
0
100
200
300
400
BELDEN 1694A CABLE LENGTH (m)
Figure 2. Supply Current vs. Belden 1694A Cable Length, 270 Mbps
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
7
LMH0074
SNLS277D – AUGUST 2007 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
•
8
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0074
PACKAGE OPTION ADDENDUM
www.ti.com
17-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMH0074SQ/NOPB
ACTIVE
WQFN
RUM
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L074
LMH0074SQE/NOPB
ACTIVE
WQFN
RUM
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L074
LMH0074SQX/NOPB
ACTIVE
WQFN
RUM
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L074
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMH0074SQ/NOPB
WQFN
RUM
16
LMH0074SQE/NOPB
WQFN
RUM
LMH0074SQX/NOPB
WQFN
RUM
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH0074SQ/NOPB
WQFN
RUM
16
1000
210.0
185.0
35.0
LMH0074SQE/NOPB
WQFN
RUM
16
250
210.0
185.0
35.0
LMH0074SQX/NOPB
WQFN
RUM
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
SQB16A (Rev A)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LMH0074SQ/NOPB LMH0074SQE/NOPB LMH0074SQX/NOPB
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement