brmobile

brmobile
ST’s solutions
for mobile devices
Content
Introduction............................................................................................ 4
MEMS and Sensors.............................................................................. 5
Imaging solutions.............................................................................. 12
Audio solutions................................................................................... 15
Mobile security solutions............................................................... 17
NFC tags................................................................................................. 19
Serial EEPROM..................................................................................... 21
Signal conditionning....................................................................... 23
Microcontrollers.................................................................................. 24
Radio frequency................................................................................ 32
Smart antenna tuning.................................................................... 34
Interfaces................................................................................................ 37
Protection and EMI filtering......................................................... 40
Power management....................................................................... 44
Introduction
STMicroelectronics is a leading semiconductor supplier in the mobile industry and provides solutions to
both mobile platform suppliers and mobile device manufacturers (OEM/ODM). ST has proven products
for the cellular handset and mobile device markets and ships billions of products to the mobile industry
every year.
These products include the world’s most deployed MEMS accelerometers, gyroscopes, magnetometers, pressure sensors, compasses and
inertial modules, state-of-the-art analog and digital MEMS microphones, high-quality audio headphone and speaker amplifiers, touch-sensor
controllers with multi-touch capabilities, Near Field Communication Secure MCUs for SIM, M2M SIM and Secure Elements, a wide RF product
offer based on Integrated passive device technology, ESD protection and EMI filtering products (IPAD™), interface devices, level translators, I/O
expanders, antenna tuner, analog switches, supervisors and smart resets, imaging solutions with photonic sensors like proximity and gesture
sensors, ranging sensors, ambient light sensors, high-efficiency power management devices and innovative lighting management solutions. ST
is an active player in all major standardization initiatives.
• High-volume manufacturing capacity
• Multiple production sites
• Integrated HW and SW solutions
• High-quality products, already tested in different application fields
• Strong commitment to Sustainable Technology
4
Interface and
interconnected devices
signal conditioning
Op amps, comparators
Imaging solutions
Proximity and gesture sensors, ranging
sensors, and ambient light sensors
memory
Serial EEPROM
(2 Kbits up to 2 Mbits) in a miniature
packages
Sensors and user
interfaces
Accelerometers, gyroscopes,
pressure sensors, iNEMO-Inertial
modules, digital compasses,
proximity sensors, touchscreen
controllers, optical finger navigation
sensors, and temperature sensors
Radio frequency
Couplers, diplexers, baluns, and band-pass filters
Protection and EMI filtering
ESD and EOS protections, EMI filtering
Level translators, I/O expanders, camera
interfaces, analog switches, supervisors and
smart resets
Microcontrollers
32-bit STM32 ARM® Cortex® -based
MCUs and 8-bit STM8 MCUs offer a
wide choice of solutions
NFC, SIM and secure
elements
NFC controllers and transceivers, and
secure MCUs
Audio solutions
MEMS digital and analog
microphones, headphone
and speaker amplifiers
Power management
LDO and DC-DC converters,
battery management, Flash LED
and backlight drivers, and OLED
display power supplies, battery
monitoring
Smart antenna tuning
Tunable RF capacitors, and dynamic impedance
matching controllers
MEMS and Sensors
Enhanced user interfaces, gaming, OIS and much more
ST has shipped 10 billion micro-electromechanical sensors and has one of the industry’s most extensive
MEMS portfolio including accelerometers, gyroscopes, digital compasses, inertial modules, MEMS
microphones, and environmental sensors including pressure, temperature, and humidity sensors.
Digital compasses: accurate compass heading in any conditions
ST’s digital compasses include combo solutions, with an accelerometer and magnetic sensor integrated
in a single LGA package, to give the possibility of designing a solution locating the magnetic sensor in
the suitable position of printed circuit board (PCB).
Accurately detecting the direction and magnitude of external magnetic fields and using accelerometer
measurements for tilt compensation, ST’s digital compasses ensure very accurate compass heading
even when the portable device is inclined.
ST’s low-noise e-compasses offer better than 3 mgauss resolution and a wide range of full scales, all
selectable by the user: up to ±16g full scale acceleration and up to ±16 gauss magnetic field full
scale. The compass family includes embedded self-test and smart power functionalities to minimize
current consumption. The LSM303C is board- and software-compatible with the latest generation of
accelerometers, thus offering maximum design flexibility.
Key BENEFITS
• Superior sensing precision combined
with low power consumption
• Extended magnetic-scale range
• Minimized measurement noise
• Very small package to address footprint
reduction
• Temperature detection for advanced
thermal drift compensation
• New possibilities for advanced navigation and location-based services in
increasingly-portable consumer devices
5
Accelerometer + gyroscope SIP solution featuring multiple
degrees of freedom
iNEMO inertial modules integrate complementary types of sensors to offer more compact, robust
and easy-to-assemble solutions compared to discrete MEMS products. iNEMO solutions bring motion
sensing systems to the level required for the most demanding applications, such as enhanced gesture
recognition, gaming, augmented reality, indoor navigation, and localization-based services.
The 6-axis accelerometer
and gyroscope family
offers best-in-class accuracy, stability and
resolution ensuring ultra-low-power, alwayson activity for advanced tracking and smart
motion capture.
2.5 x 3.0 x 0.83 mm
6
Power consumption (mA)
(high perf mode)
EIS/OIS
features
Package
size (mm)
Digital interface
Gyro ODR
(Hz)
LSM6DS3H
1.1
yes/yes
2.5x3x0.83
I2C/SPI + aux SPI
for OIS/EIS
3333
LSM6DS3
1.25
yes/no
2.5x3x0.83
I2C/SPI
1666
LSM6DS33
1.25
yes/no
3x3x0.86
I C/SPI
1666
Part number
2.5 x 3.0 x 0.83 mm
2
3 x 3 x 0.86 mm
Digital gyroscopes
ST’s new digital gyroscopes are the perfect synthesis of accuracy and design flexibility
ST’s latest gyroscopes feature excellent accuracy as a result of their unique and patented mechanical
structure based on a single driving mass.
ST developed specific gyroscopes for addressing user interface (L3GD20H) or Optical Image Stabilization
(L2G2IS) applications boasting superior output stability over time and temperature, removing the need
for any further calibration on customer side.
They offer user-selectable full scales, ranging from ±100 to ±2000 dps, to cater for gaming, navigation,
and OIS applications.
L3GD20H features
• Full scale ±245/±500/±2000 dps for UI,
±100/±200 dps for OIS
• I2C/SPI digital interface
• 16-bit data output
• 8-bit (UI) and 12-bit (OIS) temperature data
output
• Wide supply voltage: up to 3.6 V
• Low-voltage compatible IOs (1.8 V)
• Embedded power-down and sleep modes
• Embedded temperature sensor
• Fast turn-on and wake-up
• User-enabled integrated filters
• Embedded 32 levels of 16-bit data output
FIFO (UI)
Key BENEFITS
• ECOPACK® RoHS and “Green” compliant
• High performance in terms of
• High shock survivability
accuracy, and stability
• Design flexibility
• Extremely low power consumption
lengthens battery life
• Temperature detection for
advanced thermal drift
compensation
• Enables faster system wake up
L2G2IS features
• ±100/±200 dps full-scale range
Key BENEFITS
• 3- and 4-wire SPI digital interface
• Low noise and low latency device
• Embedded temperature sensor
• High stability in temperature reducing
• Integrated low- and high-pass filters with
user-selectable bandwidth
• Wide supply voltage range: 1.71 to 3.6 V
• Embedded self-test
• Power-down and sleep modes for smart
power saving
OIS algorithm complexity
• Embedded temperature sensor data
can be accessed through SPI digital
interface by application
• Robustness for ultrasonic cleaning
process
• ECOPACK®, RoHS and «Green» compliant
Device summary
Features
Typ. angular rate range (FS) (dps)
Driving frequency (kHz)
Angular rate noise density (°/s/√Hz)
ODR (Hz)
Programmable interrupts
Embedded FIFO
Typ. current consumption (mA)
Supply voltage range (V)
Operating temperature range (˚C)
Applications
Digital interfaces
Size (mm)
L3GD20H
L2G2IS
±245/±500/±2000
±100/±200
20
20
0.011
0.006
up to 800
9090
2
N/A
32 levels of 16-bit data output
N/A
5
3.8
2.2 to 3.6
1.71 to 3.6
-40 to +85
-40 to +85
Gaming, pointing devices, navigation and motion
control
Optical image stabilization (OIS)
I2C/SPI
SPI (3/4 W)
3x3x1
2.3 x 2.3 x 0.7
7
3-axis digital accelerometers
ST’s ultra-low-power accelerometers for advanced motion recognition and power management features
Housed in ultra-small packages and featuring excellent stability over time and temperature, ST’s
accelerometers are the ideal choice for all the most demanding consumer and industrial applications.
The LIS3DSH, LIS3DH, LIS2HH12, LIS2DH12, LIS2DE12, and LIS2DS12 accelerometers are able to operate in
ultra-low-power modes, thus lowering the overall system power consumption and extending the device’s
battery life. They also offer smart motion features, such as sleep-to-wakeup and return-to-sleep functions,
to easily design the most intuitive and precise user interfaces.
Key FEATURES
• Embedded digital functions (pedometer,
• Selectable full-scale up to ±16g
• High resolution
• Power-down, sleep and ultra-low-power
operating modes for advanced power saving
• Smart embedded functions such as 4D/6D
orientation detection auto wakeup and
return-to-sleep
• Programmable interrupts and embedded FIFO
step detector, step counter, and SMD)
• Embedded state machines for custom
motion recognition (LIS3DSH)
• Digital interfaces: I²C/SPI
• Output data rates from 1 Hz to 6.4 kHz
• Embedded temperature sensor
Key BENEFITS
• Extremely accurate motion-sensing
capabilities in ever smaller and
sleeker consumer gadgets
• Design flexibility
• Extremely low power consumption
maximizes battery life
• Embedded FIFO for smart data
storage and power saving
• State machines enable custom
motion recognition inside the sensor,
further reducing system complexity
• Temperature detection for advanced
thermal drift compensation
8
DEVICE SUMMARY
Features
LIS2DS12
LIS3DSH
LIS3DH
LIS2HH12
LIS2DH12
LIS2DE12
±2g/4g/8g/16g
±2g/4g/8g/16g
±2g/4g/8g/16g
±2g/4g/8g
±2g/4g/8g/16g
±2g/4g/8g/16g
14 bit
14 bit
12 bit
14 bit
12 bit
8 bit
120
150
220
130
220
350μg/√Hz
ODR =1600Hz
1, 12.5, 25, 50, 100,
200, 400, 800, 1600,
3200, 6400
3.125, 6.25, 12.5, 25,
50, 100, 400, 800,
1600
1, 10, 25, 50, 100,
200, 400, 1250, 1600,
5000
10, 50,100,
200,400,800
1, 10, 25, 50, 100,
200, 400, 1620, 5376
1, 10, 25, 50, 100,
200, 400, 1620, 5376
Programmable
interrupts
2
2
2
2
2
2
Embedded FIFO
256 level
32 level
32 level
32 level
32 level
32 level
Supply voltage
(V)
1.62 to 1.98
1.7 to 3.6
1.7 to 3.6
1.7 to 3.6
1.7 to 3.6
1.7 to 3.6
Temperature
range (˚C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
I²C/SPI
I²C/SPI
I²C/SPI
I²C/SPI
I²C/SPI
I²C/SPI
2 x 2 x 0.86
3x3x1
3x3x1
2x2x1
2x2x1
2x2x1
Basic function and
programmable motion
detection by FSM
Basic function: 6D/4D
orientation detection,
free-fall detection,
motion detection,
click - double click,
and wake up
Basic function and
anti-aliasing filter:
6-axis detection,
6D/4D orientation
detection
Basic function: 6D/4D
orientation detection,
free-fall detection,
motion detection,
click - double click,
and wake up
Basic function: 6D/4D
orientation detection,
free-fall detection,
motion detection,
click - double click,
and wake up
Full scale
Output resolution
Noise density
(µg/√Hz)
Output data rate
(Hz)
Digital interfaces
Size (mm)
Advanced digital
functions
Basic function and
pedometer, step
detector and step
counters, tilt function,
sensor hub, and
always-on experience
MEMS pressure sensors
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer
STMicroelectronics LPS25HB and LPS22HB pressure sensors integrate ST’s consolidated technology with
the new fully molded package to further improve robustness, reliability, and moisture resistance while
reducing package thickness.
With their ultra-low height of 0.76 mm, LPS25HB and LPS22HB sensors offer high design flexibility and easy
implementation into multi-functional applications: from smartphones, tablets, and wearable technology
such as sports watches, smart watches, fitness bands, and Internet-of-Things (IoT) products.
APPLICATIONS
Key Features
• Weather forecast
• 260 to 1260 hPa digital output
• Barometric altitude
barometer
• Ascent/descent detection
• Current consumption: 4 μA
• Vertical speed indication
• Selectable ODR from 1 to 25 Hz
• Indoor navigation (floor detection)
• SPI and I2C
• Enhanced GPS navigation
• Embedded FIFO
• Supply voltage: 1.7 to 3.6 V
• Package: 2.5 x 2.5 x 0.76 (typ.)
or 2 x 2 x 0.8 (max.) mm
9
Touch sensing
WQHD display
Wake-up gesture
Waterproof touch
Curved screen
Passive pen
Multi-finger
gloved touch
Ultra-low power capacitive multi-touch screen controller for 2” to 13” screens
10
FingerTip capacitive touchscreen controller
FingerTip provides an optimal mix of low power, small size, low external part count and versatile features with unmatched true multi-touch
performance in a single-chip touchscreen controller.
The touchscreen controller can detect, classify, and track 10 finger touches with fast a report rate and response times.
The touch acquisition analog front-end has a wide dynamic range capable of coping with touchscreens of different sizes and configurations.
This offers the flexibility to use FingerTip with multiple touchscreens using different ITO designs and overlay materials. One- or two-layer ITO
sensors are supported using glass or PET substrates. FingerTip provides support for curved displays through proprietary node compensation
hardware.
FingerTip’s low-noise capacitive analog front-end provides enhanced noise suppression capabilities for various noise sources such as display,
3-phase noise and severe common mode noise introduced by battery chargers.
The device utilizes ST proprietary hardware and firmware techniques to significantly reduce power in low-power active and low-power idle
modes, and incorporates multiple TX driving methods that can further boost the SNR and report rate.
Advanced features
• Multi-mode sensing technology: Detects water on the top of the screen without false touch or line breaking
• Multi-finger glove operation
• Small passive stylus
All types of SYNC mode (HSYNC and VSYNC) support, which enables touch sampling to be synchronized with the display SYNC signal to work
even with quad high definition displays.
The main processor implements a powerful
32-bit ARM Cortex-M3 core with Flash
memory that is capable of providing a high
level of overall touch performance in terms
of noise rejection, response time, and power
consumption.
The device supports an I²C serial interface,
I²C master interface, HID over I²C interface,
and SPI interface for greater flexibility.
Key features
• Scan rate > 150 Hz
• Touch screen size with round or
• High SNR
square form factor
• Noise immunity to all sources
• Support all types of Touch ITO
• GPIO for button support
• I²C interface
• Support for multi-finger, thick glove, wet
• Ultra-low power modes for longer
battery life
• Small and thin QFN (4 x 4 x 0.4 mm )
fingers and 1mm passive pen touches
Temperature sensors
DIGITAL TEMPERATURE SENSOR
STTS751
ST’s digital temperature sensors are high-precision CMOS ICs with a delta-sigma analog-to-digital converter (ADC) and I²C compatible serial
digital interface. The on-board delta-sigma ADC converts the measured temperature to a digital value that is calibrated in degrees Celsius.
These temperature sensors feature low power consumption, up to 12-bit resolution and can operate over a temperature range
as wide as -40 to +125 °C.
Key features
• Accuracy: ±1.0 °C (typ.), ±1.5 °C (max.)
from 0 to +85 °C
• Operating voltage: 2.25 to 3.6 V
• Operating temperature:
-40 to +125 °C
• Dual alarm
• Programmable resolution
• Tiny packages
UDFN-6L (2 x 2 mm),
SOT23-6L (1.69 x 2.9 mm)
• 9- to 12-bit resolution
• Low operating current: 50 μA (typ.)
• Low standby current: 3 μA (typ.)
• One-shot mode for power saving
• Supports 400 kHz serial clock
UDFN-6L, 2 x 2 x 0.5 mm
ANALOG TEMPERATURE SENSOR
STLM20 ultra-low-power precision temperature sensor
The analog temperature sensors feature ultra-low power consumption and provide superior linearity at much lower currents than a high
accuracy thermistor and can operate over a temperature range as wide as -55 to +130 °C.
They are ideal for regulating the gain of the power amp of any RF device including eReader, GPS devices, and medical instrumentation, where
low power, small size, accuracy, and linearity over the full temperature range are fundamental.
Key features
• Operating voltage range: 2.4 to 5.5 V
• Precision analog voltage output tempe-
• Operating temperature range:
rature sensor
• ±1.5 °C temperature accuracy
at 25 °C
• Ultra-low quiescent supply current:
• 4.8 μA (typ.), 8.0 μA (max.)
• -55 to 130 °C
• Packages: ultra-small
UDFN-4L (1 x 1.3 mm),
SOT323-5L (2 x 1.25 mm)
UDFN-4L, 1 x 1.3 x 0.5 mm
11
Imaging solutions
VL6180X combines an IR light source, a proximity sensor and an ambient
light sensor in a single integrated module
12
STMicroelectronics offers a family of high-accuracy and target-independent ranging sensors, leveraging
ST’s own patented technology called FlightSense™ using the Time-of-Flight (ToF) principle.
ST’s family of products featuring high performance, small footprint and low power consumption is ideally
suited for wireless applications and handheld devices.
First to enable high-volume production of fully integrated and small-sized Time-of-Flight products, ST’s
Imaging solutions are opening for more innovative use-cases and for user-experience enhancements for
a wide variety of devices and application markets.
ST’s internal manufacturing and supply chain guarantees supply as required by high-volume
applications such as mobile phones or tablets.
Key benefits
Key Applications
• Fully integrated module: IR laser emitter,
• Mobile devices
Key features
ranging sensor and ALS.
No need for external LEDs
• Only SPAD (single photon avalanche diode)
array-based product on market
• Absolute distance measurement
(in millimeters, register output)
• Independent of target reflectance: workes
with dark colours, gloves
• Can work with coverglass (offset and
crosstalk compensation)
• Accurate and low power
Proximity detection
• Ambient light sensing
• Simple but robust gesture control
• Home appliances
• Power on/off, volume +/• Collision avoidance for cleaning robots
(wall and cliff)
• User detection
• Automatic faucet control
• Industrial
• Object detection and ranging
• Human-machine interface
• 3-in-1 Time-Of-Flight module:
•
proximity sensor, ALS (ambient
light sensing) and basic gesture
control
• Development tools and technical
support
• Driver and API available
• Full set of documentation on
www.st.com/VL6180X
• Proximity sensor NUCLEO expansion board compatible with STM32
NUCLEO family
System architecture
The VL6180X contains an array of SPAD (Single Photon Avalanche Diode) detectors. The SPAD array forms part of an advanced system
architecture that can detect the arrival of individual photons and hence calculate the time taken for the photon to leave the module, hit the
target and then return back to the module. Actual distance measurement combined with signal amplitude allows simple, but robust, gesture
recognition to enable multiple use cases.
Furthermore, the VL6180X’s ultra-low-power system architecture is perfectly suited to the demanding requirements of wireless and consumer
products.
Module design
All components needed to support the proximity sensor and ambient light sensor are embedded in the simple optical module. No mechanical
gaskets or additional lens systems are required to complete the industrial design.
The module can be mounted on the host PCB using a standard reflow profile or flex attached.
Its unique time-of-flight properties allow the module to be hidden behind a wide variety of cover-glass materials. This enables very innovative
product design with the possibility of removing the hole that normally forms part of the industrial design.
SYSTEM BLOCK DIAGRAM
VL6180X module
VL6180X module
VL6180X silicon
GPIO-0
GPIO-1
SDA
SCL
Ranging
ALS
AVDD
Microcontroller
NVM
RAM
GND
IR emitter driver
IRIR+
13
IR emitter (VCSEL)
VL6180X Nucleo expansion board
Time-of-flight principle
VL6180X
Photon
travel time
Emitter
Target
Sensor
Distance
Measured
distance
Photon
travel time
=
X
2
Speed of
light
Sensors and human interface products
Accelerometers
LIS2DS12
Ultra-low-power, high-performance 3-axis digital output accelerometer, embedded smart digital features, 2x2 LGA package, 12 bit
LIS3DSH
Ultra-low-power high-performance 3-axis nano accelerometer, embedding 2 finite-state machines
LIS3DH
Ultra-low-power, high-performance 3-axis digital output accelerometer, 3x3 LGA package, 12 bit
LIS2HH12
High-performance 3-axis digital output accelerometer, 2x2 LGA package, 14 bit
LISDH12
Ultra-low-power, high-performance 3-axis digital output accelerometer, 2x2 LGA package, 12 bit
LISDE12
Ultra-low-power, high-performance 3-axis digital output accelerometer, 2x2 LGA package, 8 bit
L3GD20H
3-axis digital output gyroscope for User Interface
Digital gyroscopes
L2G2IS
2-axis digital output gyroscope for OIS
iNEMO inertial modules
LSM6DS3H
3D accelerometer and 3D gyroscope, 2.5x3 LGA package, supporting multimode connections, high performance for OIS
LSM6DS3
3D accelerometer and 3D gyroscope, 2.5x3 LGA package, supporting multimode connections
LSM6DS33
3D accelerometer and 3D gyroscope, 3x3 LGA package
LSM303C
Ultra-compact, high-performance e-compass 3D accelerometer and 3D magnetometer module
Digital compasses
Pressure sensors
LPS25HB, LPS22HB
260 to 1260 mbar absolute digital output barometer
iNEMO engine sensor fusion libraries
iNEMOEngine_LI3
A free software library for motion-detection system evaluation
iNEMOEngine_PI3P
A compiled software library with data-fusion algorithms for multiple sensor output processing
Proximity sensors
VL6180X
Proximity sensor, gesture and ambient light sensing (ALS) module
HTS221
Capacitive digital sensor for relative humidity and temperature
Humidity and temperature sensor
14
Digital / Analog temperature sensors
STTS751
2.25 V low-voltage local digital temperature sensor
STLM20
Ultra-low-current 2.4 V precision analog temperature sensor
FingerTip
Ultra-low power capacitive multi-touch screen controller for 2” to 13” screens
STLED524
5 x 24 dot intelligent matrix LED display driver
Touchscreen controllers
Display driver
Audio solutions
MEMS microphones and audio subsystems
High-quality audio is the differentiating factor for multimedia-rich mobile platforms. ST manufactures
state-of-the art analog and digital microphones with MEMS technology enabling crystal-clear sound and
conversations. Our audio amplifier portfolio ranges from class G headphone drivers to class D speaker
drivers that deliver high-quality sound extremely efficiently. Customers can also tune the complete audio
system with ST’s APWorkbench™ software.
MEMS microphones
Headphone amplifiers
MEMS microphones target all audio
applications where small size, high sound
quality, reliability, and affordability are key.
Our microphones meet price points set by the
traditional electret condenser microphones
(ECM), while featuring superior reliability
and robustness. ST’s MEMS microphones
perfectly pair with our latest generation of
Sound Terminal® audio processing devices,
that feature a dedicated built-in interface for
direct connection of a MEMS microphone,
saving part count and cost.
Very high audio quality and low power
consumption with capacitor-less class G
architectures in tiny flip-chip packages.
Speaker amplifiers
Wide range of filterless class D audio
amplifiers for mono and stereo applications
with gain control, 3D sound effects, and anticlipping.
Key features
• Microphones: Excellent SNR
(>63 dB) with full frequency response (20 Hz to 20 kHz) in small
package (3 x 4 x 1 mm)
• Headphone and speaker
amplifiers: High audio quality
(PSRR, SNR, THD+N) for headsets
in high-efficiency class G topologies; high power in low battery
voltages with Class D technology
• Audio system design: ST’s
APWorkbench™ software to
browse through ST’s audio
portfolio, and select, control and
tune the complete audio system
easily and accurately
15
Featured products
High-performance, low-power digital mems microphone with 63 db snr
MP34DT01/ MP34DT01-M
The MP34DT01 and MP34DT01-M are ultra-compact, low-power, omnidirectional, digital MEMS microphones built with a capacitive sensing
element and an IC interface. The sensing element that detects the acoustic waves is manufactured using a special silicon micromachining
process dedicated to producing audio sensors. The IC interface is manufactured using a CMOS process so that a dedicated circuit may be
designed to provide a digital signal externally in PDM format. The MP34DT01 and MP34DT01-M have an acoustic overload point of 120 dBSPL
with a 63 dB signal-to-noise ratio and -26 dBFS sensitivity. The MP34DT01-M is assembled in metal cap package.
Key features
• Single supply voltage
• Low power consumption
• 120 dBSPL acoustic overload point
• 63 dB signal-to-noise ratio
• Omnidirectional sensitivity:
–26 dBFS sensitivity
• PDM output
• HCLGA package
• Top port design
• SMD compliant
• EMI shielded
•
16
Top port mems audio microphone with analog output in 3.35 X 2.5 X 0.98 METAL PACKAGE
MP23AB02B
The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce
audio sensors.
The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio.
The MP23AB02B is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range
from -40 to +85 °C.
Key features
• SNR: 64 dB
• Sensitivity: -38 dBFS
• Acoustic overload point:
125 dBSPL
• Supply voltage: 1.6 to 3.6 V
• Current consumption: 150 μA
• Flat frequency response
• Size: 3.35 x 2.5 x 0.98 mm
Mobile security solutions
F
ST21N
C
NFC controller
ST33 SWP-SIM
ST33 SE & eUICC
ST54
NFC & SE SiP
NFC and secure element
Near field communication (NFC) technology is at the heart of an expanding spectrum of easy-to-use,
intuitive, contactless applications. These target a broad range of electronics devices such as handsets,
wearables, and other consumer electronics devices.
STMicroelectronics provides a global offer of products and solutions for NFC enablement. This includes
state-of-the-art NFC controllers and a set of secure 32-bit Flash-based microcontrollers to address SWPSIM, embedded secure elements (SE), M2M SIM, and eUICC. Secure solutions are delivered as discrete
ICs, or system-in-package for optimized solutions.
NFC controller
The ST21NFC product family is based on a
microcontroller architecture with embedded
EEPROM and multiple connectivity channels.
The devices comply with all relevant
standards, that address all possible NFC use
cases.
• ISO/IEC 14443 A, B, F
• ISO/IEC 15693 and ISO/IEC 18092
compliant
• Active load modulation is already included
in the above standards
• Extremely low power consumption
• Up to 3 SWP for UICC, eUICC and SE
• Card, reader/writer and peer-to peer
modes
• Power by RF field capability
Secure element, SWP-SIM,
eUICC
The ST33 family has been designed to meet
the advanced EAL5+/EMVCO security and
performance requirements, combining the
latest Flash technologies with the highest
security levels on the secure ARM® Cortex™
SC300 core.
• 32-bit ARM® SecureCore® SC300™ core
• From 512 Kbytes to 1.2 Mbytes of Flash
memory
• 1.8 V, 3 V and 5 V VCC range
• High-performance cryptographic engine
• SWP, ISO and SPI interfaces
• EMVCo and CC-EAL5+ certifications
• Optional MIFARE® and M4M® support
• Wafer, micro-module, DFN8, and WLCSP
packages
Key benefits
• No compromise on security
• Multiple application support
• Design flexibility
• One stop shop
17
Secure element
Lowering the complexity of secured OS
management, the ST33 secure element is
an ST33 with a pre-loaded state-of-the-art
Global Platform GP2.2 OS. A wide range of
configurations are available to meet market
demand.
• Java JC 3.0.1
• Global Platform GP2.2
Amendment A, C, D, E
• Up to 600 Kbytes of user Flash memory
• EMVCo and CC EAL5+
• Multiple TSM support
• Optional MIFARE® Classic, DESFire® and
Mifare4Mobile®
NFC CONTROLLER SECURE
ELEMENT COMBO
As part of global NFC offer and to minimize
the PCB footprint impact of NFC, the ST54
product family is a system in package made
by stack an ST21NFC NFC controller and an
ST33 secure element.
• Turnkey stack solution
• All NFC use cases supported
• BGA 4.0 x 4.0 x 0.9 mm
• Pin compatibility with ST21NFC
NFC Components and architectures (*)
UICC
Or/And
eUICC
ISO
s so r
Proce
k
18
ta c
NFC S
Or/And
eSE
SPI
NFC
SWP
(*) ST also offers NFC tags, please refer to section NFC tags
NFC and secure element products
Accelerometers
ST21NFCB
NFC controller with I²C, SPI, GPIOs and SWP interfaces
Multiple secure element capable with automatic AID routing via SWP
ST21NFCC
NFC controller with I²C, SPI, GPIOs and SWP interfaces
Multiple secure element capable with automatic AID routing via SWP, supporting active booster front-end
ST33G1M2
Secure MCU with 32-bit ARM® SecurCore® SC300™ CPU,
MIFARE®, SWP, ISO, SPI, GPIO interface and high-density Flash memory (1280 Kbytes)
ST33H768
Secure MCU with 32-bit ARM® SecurCore® SC300™ CPU,
MIFARE®, SWP, ISO, SPI, GPIO interface and high-density Flash memory (768 Kbytes)
ST54D
SIP (System In Package) with NFC controller, 32-bit secure microcontroller and Global Platform GP2.2 OS
ST54E
SIP (System In Package) with NFC controller, 32-bit secure microcontroller and Global Platform GP2.2 OS, supporting RF front-end booster
NFC tags
NFC/RFID tags with ISO/IEC 14443 Type A RF interface, NDEF memory
and 128-bit password protection
ST’s ST25TA ICs provide the NFC Forum Type 4 Tag RF interface and built-in NDEF (NFC Data Exchange
Format) message support. The embedded EEPROM memory density spans from 512 bits to 64 Kbits,
covering a wide spectrum of applications including content-rich virtual business cards and smart signs.
The ST25TA series delivers state-of-the-art RF performance and features a user-programmable digital
CMOS General Purpose Output (GPO) that eliminates the need for an external component to trigger the
host wake-up.
KEY BENEFITS
KEY APPLICATIONS
• Wide memory density options from 2 K to
• Smart posters
Key features
64 K bits
• High-reliability EEPROM
• Built-in NDEF format support
• Strong password protection scheme
• Read or Write operations counter
• Flexible user-programmable GPO
• NFC business cards
• ISO/IEC 14443 Type A
• Consumer electronics
• NFC Forum Type 4 Tag
• Wireless handover
• 13.56 MHz carrier frequency
• Gaming
• 512-bit, 2-Kbit, 16-Kbit and
• Industrial
• Traceability
• Wearable electronics
64-Kbit densities
• 56-bit unique identifier
• 128-bit password protection
• Optional 20-bit counter
• Optional RF status digital output
• 5- and 8-lead UFDFPN packages
• Bumped wafer die form packages
• 25 or 50pF tuning capacitance
• 200 years data retention
• 1 million write erase cycles
19
DEVICE SUMMARY
Part number
RF interface
Memory size
Data protection
(128 bit password)
20 bit Counter
Package
RF status output
ST25TA512
ISO 14443A Type A
512 bits
Yes
Yes
SBN12 *
No
ST25TA02K
ISO 14443A Type A
2 Kbits
Yes
Yes
SBN12 *
No
ST25TA02K-P
ISO 14443A Type A
2 Kbits
Yes
Yes
UFDFPN5 and 8,
SBN12 *
Yes
ST25TA16K
ISO 14443A Type A
16 Kbits
Yes
No
SBN12 *
No
ST25TA64K
ISO 14443A Type A
64 Kbits
Yes
No
SBN12 *
No
* SBN12: Sawn and Bumped wafer (die form), 120µm thickness
20
Serial EEPROM
ST’s EEPROMs perfectly meet the major market requirement of flexibility, with a complete portfolio of
densities from 2 Kbits up to 2 Mbits. I2C and SPI buses are offered in standard and miniature packages,
accommodating power supplies from 1.6 to 5.5 V. ST guarantees its portfolio at 4 million E/W cycles per
byte, 100 million cycles per device, and 200 years data retention.
Standard EEPROM in WLCSP are recommended each time non-volatile memory is required and available board space is less than 1 mm²:
• Communication modules
• Display drive modules
• Camera modules
UFDFPN5 package (1.4 x 1.7 mm) with reduced footprint is also available.
This makes ST’s EEPROMs the first choice for parameter and data management in Mobile applications.
Million cycles per byte
Ideal choice for heavy cycling
WLCSP package
Wide portfolio with high compatibility
Less than 1 mA
Low power consumption compared
to other NVMs
UFDFPN5 package
16-Kbit up to 128-Kbit I²C
21
KEY BENEFITS
Key features
• Optimized footprint
• Reduced dimension at 0.72 mm²
• Thinnest profile
• Protect the whole/defined blocks of the EEPROM by software, against undesirable write
instructions even if device has no hardware write protect pin (4-ball design)
• Mount several EEPROMs on the same I²C bus, even if device has no chip enable pin (4-ball
design)
WLCSP
series
Memory
density
Software
write
protect
M24C32S-FCU6T/T
32-Kbit
M24C32S-FCU6T/TF
Part number
22
Compatible
4-ball design
Profile
Ball
size
Pinout
compatibility
Min pitch
(mm)
Back
side
coating
Device
select code
max. X
(mm)
max. Y
(mm)
max.
(mm)
typ.
(mm)
Yes
0.853
0.853
0.300
0.185
M24C64S
0.4 x 0.5
No
1010 001x
32-Kbit
Yes
0.853
0.853
0.330
0.185
M24C64S
0.4 x 0.5
Yes
1010 001x
M24C64S-FCU6T/T
64-Kbit
Yes
0.853
0.853
0.300
0.185
M24128S
0.4 x 0.5
No
1010 001x
M24C64S-FCU6T/TF
64-Kbit
Yes
0.853
0.853
0.330
0.185
M24128S
0.4 x 0.5
Yes
1010 001x
M24128S-FCU6T/T
128-Kbit
Yes
0.853
0.853
0.300
0.185
M24C64S
0.4 x 0.5
No
1010 001x
M24128S-FCU6T/TF
128-Kbit
Yes
0.853
0.853
0.330
0.185
M24C64S
0.4 x 0.5
Yes
1010 001x
M24C32T-FCU6T/TF
32-Kbit
Yes
0.853
0.853
0.330
0.185
M24C64T
0.4 x 0.5
Yes
1010 000x
M24C64T-FCU6T/TF
64-Kbit
Yes
0.853
0.853
0.330
0.185
M24128T
0.4 x 0.5
Yes
1010 000x
M24128T-FCU6T/TF
128-Kbit
Yes
0.853
0.853
0.330
0.185
M24C64T
0.4 x 0.5
Yes
1010 000x
M24C08-FCT6TP/T
8-Kbit
No
0.715
0.705
0.330
0.185
M24C16
0.4 x 0.4
No
1010 0zzx
M24C16-DFCU6TP/K
16-Kbit
No
0.745
0.839
0.300
0.185
M24C08
0.4 x 0.4
No
N/A
M24C32-FCU6TP/TF
32-Kbit
No
0.815
0.694
0.345
0.160
M24C64-FCU
0.4 x 0.4
Yes
1010 000x
M24C32M-FCU6T/TF
32-Kbit
No
0.815
0.694
0.345
0.160
M24C64M-FCU
0.4 x 0.4
Yes
1010 100x
M24C64-FCU6TP/TF
64-Kbit
No
0.815
0.694
0.345
0.160
M24C32-FCU
0.4 x 0.4
Yes
1010 000x
M24C64M-FCU6T/TF
64-Kbit
No
0.815
0.694
0.345
0.160
M24C32M-FCU
0.4 x 0.4
Yes
1010 100x
DEVICE SUMMARY
SWP
4-ball design
Dimension
for 128-Kbit EEPROM
• Thickness less than 0.3 mm
• Software write protect feature
• Device select code option
Signal conditionning
Operational amplifiers and comparators for handheld devices
STMicroelectronics is a leading supplier of power-saving and space-saving op amps and comparators
offering a wide portfolio of products.
ST’s op amps and comparators enhance the signal chain by being the perfect companion chips for ST’s
microcontrollers and analog sensors.
In addition to providing industry-standard solutions supported with a large production capability, ST offers
upgraded versions of op amps and comparators that include better accuracy, standby functions and
tiny packages. On top of upgraded versions, ST also offers high-performance zero-drift and nanopower
op amps and comparators.
• Heart-rate monitoring by light reflection
• Gesture recognition by electromyography
• Infrared emitter-receiver for remote control
• Ultra-violet light measurement
• Air quality sensor signal conditioning
• Wireless battery charging
DEVICE SUMMARY
Part number
Description
Supply current (µA)
Package
TSU101, TSU102, TSU104
Nanopower 5 V CMOS op amp
0.58
SC70-5, DFN8 2 x 2, QFN16 3 x 3
TSZ121, TSZ122, TSZ124
Very high accuracy (5 µV) zero drift micropower 5 V op amp
31
SC70-5, DFN8 2 x 2, QFN16 3 x 3
TSV711, TSV712, TSV714
High accuracy (Vio < 200 µV) micropower CMOS op amp
10
SC70-5, DFN8 2 x 2, QFN16 3 x 3
TSV731, TSV732, TSV734
High accuracy (Vio < 200 µV) micropower CMOS op amp
60
SC70-5, DFN8 2 x 2, QFN16 3 x 3
Rail to rail input/output high merit factor op amp
820
DFN6 1.3 x 1.6
Rail-to-rail 0.9 V nanopower comparator
0.21
SC70-5, DFN8 2 x 2, QFN16 3 x 3
TSV991A
TS881, TS882, TS884
23
Microcontrollers
STM32 SMART AND WIDE CHOICE OF SOLUTIONS FOR WEARABLE DEVICES
By choosing one of ST's microcontrollers for mobile application, you gain
from our leading expertise in MCU architecture, technology, multi-source
manufacturing and support. ST's product portfolio contains a comprehensive
STM32
range of microcontrollers, from robust, low-cost 8-bit MCUs, 32-bit ARM®®
based Cortex -M0 and M0+, Cortex®-M3, Cortex®-M4 and up to Cortex®-M7 Flash
microcontrollers with a great choice of peripherals. Leveraging its wide and market-proven
portfolio, ST offers a selection of STM32 microcontrollers perfectly fitting wearable devices
targeting applications such as:
• Healthcare and consumer fitness and wellness
• Medical
• Portable infotainment
• Monitoring and safety in industrial applications
In these applications, high precision, low power consumption, compact form factor, and
outstanding performance are a must and ST’s products take into account the needs of the
most recent and innovative wearable devices.
8-bit MCUs
• Wide range of processing
performance
• Low power and energy efficiency
• Multiple and flexible power modes
• Wide voltage operation range
• Batch acquisition mode (BAM)
• LCD drivers
• Serial audio interfaces
• RTC with Calendar
• Multiple peripherals
• Advance analog features
• WLCSP packages
• Small and thin UQFN packages
32-bit MCUs
24
STM8
Ultra-low-power
Mainstream
High-performance
ST MCU Finder: All ST MCUs in your hand
The ST MCU Finder app for mobile devices is the best way to explore the STM32 and STM8 portfolio of more than 700 references of
microcontrollers and development boards.
Define the part that best fits your application with the powerful search engine: choose and save your search criteria, compare and sort the
results. Instantly access technical documentation, key features, functional block diagrams, and prices for our MCUs and development tools.
Share your results with colleagues and directly buy online at our distributors.
Download the complete documentation library and stay synced with the latest releases from ST.
Stay connected and keep up to date with the STM32 and STM8 world through our social media, community and news feeds.
Supported languages: English, Chinese (simplified and traditional), and Japanese.
STM32 – The reference in sensor hubs
A complete microcontroller offer including ultra-low-power
STM32L as well as high-performance and power-efficient
STM32F401/411 to address sensor hub applications in
smartphones, tablets, and wearable devices. STM32 sensor hub
microcontrollers enable low power, low latency sensor fusion and implement an innovative
batch acquisition mode (BAM) allowing ultra-low-power sensor data acquisition. The
application range is wide and covers from simple activity trackers (suggestion) implementing
a single accelerometer up to smartphones with 9-axis accelerometer, gyroscope &
magnetometer combined with environmental sensor and audio with MEMS microphones.
STM32 sensor hub microcontrollers are available with 3rd party motion processing libraries
including Always-on sensor fusion, gesture recognition, activity & sleep monitoring, context
awareness, and indoor navigation with map matching on both AndroidTM and Windows®
platforms.
Key Features
• Cortex®-M0+, M3 and M4 devices
• Up to 100 MHz with FPU
• Up to 125 DMIPS, 339 CoreMark
• Up to 1 Mbyte of Flash memory
and 128 Kbytes of RAM
• Batch Acquisition Mode (BAM)
• Current down to 87 µA/MHz in
Run mode
• Current down to 300 nA in Stop
mode
• I2C, SPI/I2S, USB, USART, and SDIO
• ADC and DFSDM (PDM to PCM)
• From WLCSP25 down to
2 x 2.2 mm
Sensors
G sensors
Gyroscope
Compass
Proximity
I2C (1 Mbit/s)
SPI (42 Mbit/s)
12-bit ADC
Motion coprocessor
Main processor
1.8/3.3 V
1.8 V
STM32
I2C (1 Mbit/s)
SPI (42 Mbit/s)
USB OTG FS
Application
processor
Pressure
Ambient light
Gesture recognition
Micro
Context awareness
Sensor fusion
STM32 Dynamic Efficiency™
Less dynamic power
More performance
STM32L
Ultra-low-power MCUs
Indoor navigation
25
STM32 – the reference in advanced graphic user interfaces
Enhanced user experience with the Chrom-ART Accelerator™
STM32 high-performance products take full advantage of ST’s
proprietary Chrom-ART Accelerator™ to offer advanced graphic
capabilities with minimum processing overhead.
Through the combination of processing acceleration, rich
connectivity and optimized architecture, STM32 high-performance MCUs can handle both the
demanding real-time processing and enhanced GUI that would otherwise require even more
powerful – and more power-hungry – processors.
Key Features
• Chrom-ART Accelerator™
enabling efficient 2D copy,
transparency effects and pixel
format conversion independently
from the main CPU
• MIPI-DSI controller supporting up
to 720 p / 30 Hz resolution
• TFT-LCD controller supporting up
to XGA resolution
• LCD parallel interface supporting
8080/6800 modes
• Power efficiency
• Maximum integration
26
Support for the most advanced display technology
ST introduced the world's first MIPI-Display Serial Interface (DSI) -enabled microcontroller, opening the door to the most advanced displays from
the mobile phone industry with higher pixel density and lower power consumption. Efficiently combining the Chrom-ART Accelerator™ and
the new MIPI-DSI interface, ST's latest STM32 high-performance microcontrollers enable high resolution and enhanced user experience in the
smallest product form factors.
Rich graphic ecosystem
The STM32 ecosystem offers a large choice of advanced graphic libraries taking the full advantage of the Chrom-ART Accelerator™ and
simplifying your GUI design.
STM32 – the reference in audio and voice
Low-power audio DSP replacement
STM32L4 ultra-low-power and STM32F4 Dynamic Efficiency™
product lines combine advanced processing capabilities,
outstanding low power consumption, and maximum integration to
offer the ideal low-power audio and voice solutions for wearable
applications.
Leveraging ST’s proprietary ART Accelerator™, the two product lines achieve zero wait
state execution from internal Flash memory and deliver the full processing capabilities of the
Cortex-M4 core running at up to 80 and 100 MHz. The Cortex-M4 DSP instruction set and
the embedded floating point unit boost the performance capabilities, enabling advanced audio
processing.
STM32L4 ultra-low-power and STM32F4 Dynamic Efficiency™ access lines achieve an
outstanding 100 µA/MHz power consumption in Run mode and offer a Batch Acquisition Mode
(BAM) enabling extended battery life by exchanging batches of data through communication
peripherals while maintaining the rest of the system, including the CPU, in power-saving
modes.
Always-on acquisition
(PDM to PCM & signal conditioning)
Low-power sound detector
< 410 µA
• 100/125 DMIPS
• DSP & FPU
• 100 µA/MHz in Run mode
• Batch Acquisition Mode
• Maximum integration
Voice trigger detection
< 22 mA
Sub-microwatt acquisition thanks to batch acquisition mode (BAM)
27
Wide range of processing performance, connectivity features and optimized software
ST's scalable STM32 microcontroller portfolio offers a wide range of processing performance and embedded SRAM sizes to meet a large
number of audio application requirements. In addition, STM32 microcontrollers embed numerous audio interfaces with I2S, TDM and PDM
support as well as audio dedicated PLLs to achieve audio accuracy.
STM32 microcontrollers also offer rich connectivity features with USB, SDMMC, camera, and display interfaces to meet the requirements for the
most advanced applications.
Equally important, the STM32 software ecosystem facilitates the development of audio and voice applications by providing optimized internal
and third-party audio software as well as hardware kits for prototyping. The software offer includes internal voice and audio codecs with MP3,
AAC, WMA, Speex, ADPCM, G711, and G726 support. It also includes synchronization software, as well as audio post-processing solutions
with SRC, equalization, bass management, smart volume control, and visualization. The STM32 ecosystem also gives access to a wide range of
optimized third-party software including voice command solutions.
STM32 and STM8 – the references in touch sensing and wireless
STM32 and STM8L families: Integrated touch-sensing functions
Certain STM32 microcontrollers feature a full
hardware touch-sensing acquisition module
STM8 L
based on self-capacitance technology. These
devices include several I/Os (up to 24 channels)
for integrating multiple touch keys and providing developers with a single-device solution.
14ch
12ch
STM32F3x
STM32F0x
24ch
24ch
12ch
14ch
STM32L4
STM32L0
24ch
Microcontroller-based I/Os internally
coupled to touch sensing controller
with up to 24 channels
24ch
Touch sensing acquisition
< 5% CPU load.
Based on charge transfer acquisition
Free-of-charge software libraries
(C source code, firmware examples)
Self -capacitance
Adapted development tools:
STM-STUDIO and STM32CubeMX
28
STM8 - STM32 families: Wireless charging system
From basic waveform generation for low-end devices up to complex waveform generation, our
MCU mainstream series ensures extreme flexibility for the digital control of the coil.
Timers with flexible PWM generation,
dead-time management, or
complemented output.
• ARM Cortex-M4 + FPU at 72 MHz – 90 DMIPS
• From 16 to 512 Kbytes of Flash memory
• Mixed-signals: CCM-SRAM, 16-bit ΣΔ ADC, hi-res timer
• ARM Cortex-M3 at 72 MHz – 61 DMIPS
• From 16 Kbytes to 1 Mbyte of Flash memory
• STM32 foundation: USB, Ethernet, CEC…
• ARM Cortex-M0 at 48 MHz – 38 DMIPS
• From 16 to 256 Kbytes of Flash memory
• Entry-level, cost-sensitive: 32-bit MCU at 32 cents, USB, CAN…
• STM8 core at 24 MHz
STM8 S
• From 4 to 128 Kbytes of Flash memory, plus E2Data
• Robust and reliable for basic functions
STM32 and STM8 – the references in power management
• Entry-level in ultra-low-
STM8L family: 8-bit ultra-low-power MCU family
The STM8L, based on the 8-bit STM8 core, benefits from our proprietary ultra-low-leakage
process, shared with the STM32L family, and features an ultra-low power consumption of
0.30 µA with the lowest power mode.
STM8 L
STM32L family: the 32-bit ultra-low power mcu family
ST’s ultra-low-power MCU platform is based on a proprietary ultra-low-leakage technology.
STM32L0 (ARM® Cortex®-M0+), STM32L1 (Cortex-M3), STM32L4 (Cortex-M4) and the
STM8L (8-bit proprietary core) represent a large range of devices addressing devices supplied
from batteries or through energy harvesting and grant an optimized cost/performance ratio in
all kinds of low-power applications.
This ultra-low-power platform with the industry’s lowest current variation between
25 and 125 °C ensures outstandingly low current consumption at elevated temperatures.
The MCUs reach the industry's lowest power consumption of 350 nA in Stop mode (with
SRAM retention), while maintaining the wakeup time as low as 3.5 µs.
The new STM32L4 is the convergence of the ultra-low-power and high performance providing
100 DMIPS with DSP instructions and floating point unit, more memory (up to 1 Mbyte of Flash
memory) and innovative features.
DMIPS
Performance
power performance
• Targeting cost-sensitive
applications
• Ultra-low-power
market-proven solutions
• Best in class in
ultra–low-power performance
• 32-bit ARM Cortex-M4 core with floating point unit (FPU)
• From 256 Kbytes to 1 Mbyte of Flash memory
• Lowest power mode + RAM + RTC: 0.6 µA
100
100
• 32-bit ARM Cortex-M3 at 32 MHz
• From 32 to 512 Kbytes of Flash memory
75
• Lowest power mode + RAM + RTC: 1.2 µA
26
25
0
• 32-bit ARM Cortex-M0+ at 32 MHz
L4
50
5
STM8L
16
L0
32
• From 8 to 192 Kbytes of Flash memory
33
• Lowest power mode + RAM + RTC: 0.8 µA
• 8-bit STM8 core at 16 MHz
L1
STM8 L
32
80
MHz
• From 2 to 64 Kbytes of Flash memory
• Lowest power mode + RAM +RTC: 0.5 µA
29
STM32 - BRIDGING BETWEEN VOLTAGE DOMAINS
The STM32F0x8 and STM32F3x8 are specific low-voltage lines,
helping overcome the challenges when adding a companion chip
to a low-voltage host processor. The microcontrollers with Cortex
M0 or Cortex M4 cores connect to the same digital power domain
as the host, such as a 1.8 V power supply, while allowing on-chip peripherals to operate from
higher voltages such as 3.3 V.
This combination of 1.8 V digital supply voltage and independent analog domain is particularly
strong where a wide analog dynamic range is required, or for connecting directly to USB
devices. It leads to an immediate cost advantage in mobile system architectures.
Key features
• Multiple voltage domains in one
chip
• No level shifter required
• Cortex-6M0 or Cortex-6M4
• Up to 90 DMIPS
• Small footprint (WCSP package
down to 2.6 x 2.7 mm)
1.8V STM32
VDD 1.8V
VDD I/O 3.3V
I/O at 1.8V
USB 3.3V
SPI at 1.8V
ADC In 0 to 2.7V
ADC of STM32F3x8
fully functional
down to 1.865 V
VDD Analog 2.7V
30
STM32 for antenna tuning
Thanks to their low pin count and ultra-small footprint, STM32F0
and L0 MCUs are ready to be used for simple auxiliary functions
like flexible switches or control elements for antenna tuning. A rich
peripheral set, wide operating range, and low power consumption
values allow easy integration into mobile architectures, while 38 DMIPS give enough headroom
for execution of control algorithms.
R
F
I
C
Sensor
Key features
• Low pin count QFN or WLCSP
down to 4.4 mm²
• ARM Cortex-M0/M0+
• Up to 38 DMIPS
• Ultra-low current consumption
STM32CubeMx power consumption calculator wizard
With the STM32CubeMX configuration and initialization C code generator, select your chip and configure its peripherals and power supply.
Then use its Power Consumption Calculator wizard to define a sequence of steps representing your application and analyze its power
consumption and battery life results.
31
Radio frequency
Integrated passive devices for RF front-end antenna tuners
32
STMicroelectronics provides a wide RF product offer based on its integrated passive device (IPD)
technology. IPD solutions based on glass substrate can offer a low parasitic and high-Q solution suitable
for RF applications.
Baluns
Couplers
Baluns use ST’s process to integrate
high-quality RF passive components
on a single glass substrate. As well as
balanced/unbalanced conversion, they can
also integrate a matching network in a
footprint smaller than 1 mm2 for the complete
function.
Wideband couplers use ST’s process to
integrate high-quality RF passive components
on a single glass substrate. They are
intended for cellular applications (GSM,
WCDMA, LTE). The range includes highdirectivity, frequency selector and various
coupling factor devices.
Diplexers
Band-pass filters
Cost- and size-efficient way to combine
different complementary radio access paths
into a single antenna, combine dual antenna
feeds into single feeds or vice versa.
Improves RF system performance through
cost-efficient frequency filtering for cellular
and ISM bands. RF IPDs provide highperformance RF solutions with low sensitivity
to top shielding.
Key benefits
• Size: up to 80% board saving
• Cost: up to 40% cost saving
• Performance: improved RF
immunity
• Low component height
compared to low-temperature
co-fired ceramic technologies
• Fewer board placement variation
effects than discrete due to
monolithic implementation
• High predictability from simulation
enabling fast production response
time
Featured products
Smallest high-directivity wide-band couplers with integrated attenuators
CPL and DCPL series
The CPL and DCPL are single- and dual-path antenna couplers used to closely monitor
the forward and reverse power between the RF power amplifier and the antenna. By also
integrating attenuators on coupled and isolated ports, the antenna couplers simplify circuit
design while saving cost and PCB space. This additional integration is achieved using ST’s
proprietary integrated passive device (IPD) technology. Other types of couplers need separate
attenuators.
In addition, insulated glass-substrate fabrication and wafer-level packaging reduce total
device height and footprint compared to alternative low-temperature co-fired ceramic (LTCC)
technology. ST now offers a range of couplers with various coupling levels and an integrated
flattener.
Key features
• 50-ohm nominal input/output
impedance
• Operating frequency range:
700 to 2700 MHz
• Less than 0.2 dB insertion loss
• 20 to 40 dB typical coupling factor
• 25 dB typical directivity
• Component and PCB area:
• 1.3 mm2 for single path
(incl. integrated attenuators)
• 2.4 mm2 for dual path
(incl. integrated attenuators)
Low-loss frequency diplexer
DIP1524-01D3
The DIP1524-01D3 is a diplexer to separate GPS/Glonass signals and WLAN, Bluetooth or
LTE band VII signals received on the same antenna. The 20 dB of attenuation between bands
guarantees a good separation between GPS and the other RF signals. This diplexer uses ST’s
proprietary integrated passive device (IPD) technology developed to address the needs of
passive integration in RF applications.
The DIP1524-01D3 is available in a flip-chip package with a pitch of 0.4 mm and does not
require any extra PCB land around the component such as for LTCC packages. ST’s solution is
extremely small and saves over 50% more PCB space than conventional solutions.
Key features
• Operating frequency range:
1600 MHz and 2400 to 2700 MHz
• 0.65 to 0.85 dB insertion loss
• 20 dB attenuation between bands
• -20 to -10 dB return losses
• Component and PCB area:
1.1 mm2
• 50% space saving versus LTCC
solutions
device summary
Balun companion chip
BALF-SPI-01D3
BALF-SPI-02D3
BAL-CC1101-01D3
BAL-NRF01D3 + 0.8 pF
50 Ohm / Conjugate match balun to SPIRIT1 at 868/915 MHz
50 Ohm / Conjugate match balun to SPIRIT1 at 433 MHz
50 Ohm / Conjugate match balun to CC1101 at 868/915 MHz
50 Ohm / Conjugate match balun to nRFnRF51422-QFAACA/C0, nRF51822-QFAACA/C0, nRF51822-QFABAA/A0
BAL-NRF01D3
50 Ohm / Conjugate match balun to nRF24LE1, nRF24AP2-1CH, nRF24AP2-8CH
BAL-NRF02D3
50 Ohm / Conjugate match balun to nRF51822-CEAA, nRF51422-CEAA,
nRF51822-CDAB, nRF51822-CFAC, nRF51422-CDAB, nRF51422-CFAC
BALF-NRF01D3
50 Ohm / Conjugate match balun to nRF51422-QFAADAA/E00, nRF51422-QFABA00, nRF51822-QFAAFA0/GC0/G00, nRF51822-QFABB00
BALF-NRF01E3
50 Ohm / Conjugate match balun to nRF51422-QFAADAA/E00, nRF51422-QFABA00, nRF51822-QFAAFA0/GC0/G00, nRF51822-QFABB00,
nRF51822-QFAAH00, nRF51822-QFABC00,nRF51822-QFACA00
BALF-2690-02D3
BALF-NRG-01D3
50 Ohm / Conjugate match balun to STLC2690
50 Ohm / Conjugate match balun to BlueNRG
DLPF-GP-01D3
Dual low-pass filter matched to GreenPeak GP540/560 RF IC
BAL-CC25-01D3
50 Ohm / Conjugate match balun to CC2540/44, CC2530/31/33, CC8520/21/30/31
BAL-CC25-02D3
50 Ohm / Conjugate match balun to CC2541
33
Smart antenna tuning
RF front-end antenna tuners
34
ST’s smart antenna tuners offer high quality and high reliability RF tunable capacitors based on a
ferroelectric material composed of baryum strontium and titanate (BST). This new tunable material allows
the implementation of dynamic impedance matching for wireless handsets, which improves power
amplifier efficiency and battery life while simultaneously reducing the likelihood of dropped or missed
calls.
tunable capacitors
BST CONTROLLERs
The STPTIC series of integrated tunable
capacitors offers excellent RF performance,
low power consumption, and high linearity
required in adaptive RF tuning applications.
Standard capacitor values ranging from 1.5
to 8.2 pF with a tuning ratio of 3.5:1 or 5:1.
They are available in miniature chip-scale
packages.
The STHVDAC series are dedicated devices
able to control tunable capacitors. They
provide a high-voltage digital-to-analog
converter (DAC), specifically designed to
control and meet the wide tuning bias voltage
requirement of BST tunable capacitors.
Devices include SPI and MIPI RFFE serial
interfaces.
Key features
• High tuning range (5:1)
• Excellent RF linearity (IP3 > 65 dB)
• High Q factor (Q > 60 @ 1 GHz)
• Miniature CSP package with single
footprint all PTIC values
• Battery-powered operation with
low-power mode to reduce power
consumption
• Compliant with MIPI RFFE interface
for easy integration in mobile
phone RF front-ends
• Dynamic control to optimize
capacitor transition time thanks to
turbo and glide modes
Featured products
SMALLEST HIGH QUALITY FACTOR RF TUNABLE CAPACITOR
STPTIC G2 series
The STPTIC G2 series of integrated tunable capacitors offers excellent RF performance, low
power consumption, and high linearity required in adaptive RF tuning applications. These
tunable capacitors are controlled through an extended bias voltage ranging from 1 to 24 V to
provide a 5:1 tuning ratio. Capacitor values are range from 1.5 to 8.2 pF and are packaged in
a 4-ball chip-scale package to allow designers to use a single footprint for all PTIC values. The
G2 series features 70dBc 3rd harmonic rejection. When higher harmonic rejection is required,
the L2 series is also available. The implementation of STPTIC G2 series of tunable capacitors
in mobile phones enables significant improvement in term of radiated performance, making the
performance almost insensitive to the external environment.
Key features
• Miniature CSP package with single
footprint all PTIC values
• Capacitor can be connected in a
shunt or series configuration
• Capacitor bias is low frequency,
low noise ANALOG control
• Number of capacitors in the stack
is increased for higher linearity: 24
(standard) for G series (x24) and
48 (high)for L series
• High tuning range (5:1)
• Excellent RF linearity (IP3 > 65 dB)
• High Q factor Q > 60 @ 1 GHz
35
New antenna-tuning circuit boosts LTE smartphone performance
STHVDAC series
ST’s STHVDAC-253M integrates three high-voltage DACs, allowing it to simultaneously
optimize antenna performance in three different frequency bands. It supports all MIPI RFFE
features such as extended mode, triggers, 26 MHz clock operation, and brings stronger signal/
more bars, fewer dropped calls, faster downloads, and longer battery life. Housed in a flip-chip
0.4 mm pitch package, the STHVDAC-253M embodies the best-in-class antenna performance
in a compact and cost-effective solution.
Key features
• 16-bump chip-scale package
(1.7 x 1.7 mm) with 0.4 mm pitch
• Battery-powered operation with
low power mode to reduce power
consumption
• Integrated boost converter with
3 programmable outputs
(from 0 to 24 V)
• Compliant with MIPI RFFE interface
for easy integration in mobile
phone RF front-end
• Dynamic control to optimize
capacitor transition time thanks to
turbo and glide mode
device summary
Tunable capacitors F1 series
STPTIC-xxF1M6
Tunable capacitor, 3.5:1 tuning ratio QFN 1.2x1.6 mm
Tunable capacitors G1 series
STPTIC-xxG1H5
Tunable capacitor, 3.5:1 tuning ratio CSP 0.5 mm pitch
Tunable capacitors L1 series
STPTIC-27L1M6
2.7 pF Tunable capacitor, 3.5:1 tuning ratio QFN 1.2x1.6 mm, high linearity
Tunable capacitors G2 series
STPTIC-15G2C5
1.5 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-27G2C5
2.7 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-33G2C5
3.3 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-39G2C5
3.9 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-47G2C5
4.7 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-56G2C5
5.6 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-68G2C5
6.8 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
STPTIC-82G2C5
8.2 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch
Tunable capacitors L2 series
STPTIC-27L2C5
2.7pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm, high linearity
BST controllers
STHVDAC-303F6
STHVDAC-253MF3
36
3 ouputs, 30 V , 0.5 mm pitch CSP package, SPI interface
3 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface
STHVDAC-253MTGF3
3 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface, turbo and glide modes
STHVDAC-256MTGF3
6 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface, turbo and glide modes
Interfaces
Interface secure digital (SD) cards with ST level translators.
Increase the number of I/O ports and enhance the control capability of existing platforms with ST’s
Xpander™ technology.
Direct audio and data signals on mobile devices with audio and high-speed switches.
Improve design and user experience with ST’s smart reset devices that remove the need for dedicated
reset buttons or having to remove the battery when a device freezes.
Prevent over-discharging and system start-up with low battery with supervisor devices.
Level translators
Camera interfaces
ST’s dual-supply level translators are the
ideal solution for bidirectional level translation
with mixed voltage systems of 1.8 V, 3.3 V
and 5 V.
Deserializer for SMIA CCP1 and CCP2.
Dual mode deserializer for SMIA/CCP2 and
MIPI/CSI-2.
I/O expanders
I/O expanders with advanced features:
keypad scanning, PWM and rotator general
I/O expanders with 8-16 I/Os.
key benefits
• Flexibility in system design versus
monolithic implementation
• Easier verification of subsystems
• Faster development time by using
discrete components
• Deserializer enables use of parallel
interface baseband with serial
cameras
37
Analog switches
Analog switches
SEL
When multiplexing audio lines, ST’s special
negative power supply rail reduces the
audible click/pop noise when switching
between multiple sources.
key benefits
• Flexibility in system design versus
monolithic implementation
• Easier verification of subsystems
• Faster development time by using
discrete components
High-speed switches
For high-frequency lines such as USB and
CCP (compact camera port), ST’s offers a
choice of switches compliant with USB 2.0
(HS) specifications and bandwidths up to
950 MHz.
Analog switch
Real-time clock
ST’s M41T62LC6F real-time clock is the
perfect match for wearable devices when
size, weight, and power-efficiency matters.
It offers a very low frequency error at 25 °C
which equates to about 5 seconds per month,
an ultra-low power consumption of 350 nA in
standby, and comes in an ultra-small
1.5 x 3.2 mm package with an embedded
crystal oscillator.
key benefits
• Timekeeping voltage down to 1 V
• Ultra-small package with embedded
• Programmable alarms with wakeup
crystal oscillator
• 1.5 x 3.2 x 0.8 mm
• Ultra-low power consumption
(350 nA in standby)
functions
• ± 2 ppm accuracy by digital
calibration
• Compatible with Li-Ion battery voltages
Supervisors and smart resets
38
Smart resets
key APPLICATIONS
ST’s family of Smart Reset™ ICs provides dual-assert manual-reset (push-button) inputs
called smart reset inputs that make it possible to reliably resolve system hang or freeze
conditions.
Dual-assert manual-reset inputs require the user to assert two inputs simultaneously to initiate
the system reset function.
STM6519 and STM6524 are single- and dual- push-button smart reset ICs that add flexibility
and user convenience at reduced size.
• Smartphones, tablets, smart watches
• Wearable / IoT devices
• Multimedia and MP3 players
• Activity trackers
• Portable navigation devices
• Any application that requires 1 or 2
delayed push buttons
Supervisors
Smart voltage supervisors with on/off controls; prevents over-charging and starting system
with low battery.
VCC
key benefits
• Ideal for touch screen devices with
VCC
VCC
RST
STM65
device
SR1
RESET
CSRC
LED
SR0
MCU/
Baseband/
PMU
IO/INT/NMI
IO/INT GND
VSS
Push-button
switch
Push-button
switch
non-removable batteries
• Reuses existing keys for reset, no
need for dedicated reset key
Featured products
High-performance SD card level translator
ST6G3244
The ST6G3244 is a dual-supply, low-voltage 6-bit bidirectional CMOS level translator for SD, miniSD and microSD cards. Designed for use as
an interface between baseband and memory cards, it achieves high-speed operation while maintaining CMOS low power dissipation.This device
is intended for two-way asynchronous communication between data buses. All inputs are equipped with protection circuits against electrostatic
discharge, giving them ESD and transient excess voltage immunity.
Low drop-out
voltage regulator
LDO
Key features
• Supports 60 MHz clock rate
• Supports DDR mode for SD
Host
CPU
ESD
2 kV
ST6G3244ME
ESD
15 kV
and EMI
ESD 15 kV
Card™
• Compliant with
• SD Specification Part 1 Physical Layer Specification 3.00
(SDR12, SDR25, DDR50)
• SD Specification Part 1 Physical
Layer Specification 2.00
• Bidirectional with direction control
pin
• EMI filtering and signal
conditioning
39
device summary
ST2378E
ST6G3244
STMPE1600
STMPE1801
STG5123
STG3692
STG3696
STG4158
STG4160
STG3220
STG5678
STM6519
STM6524
STBP110
STBP120
M41T62
Level translators
8-bit, auto directional, OE, 15 kV ESD
6-bit, SD3.0 card I/F, CSP25
I/O expanders
16-bit basic I/O expander, low power
18-bit enhanced I/O expander
Analog switches
Single SPDT, 1 Ω, DFN6
Quad SPDT, USB2, QFN16
Dual SPDT, USB2, QFN10
Single SPDT, 0.6 Ω, CSP6
Single SPDT, 0.5 Ω, CSP8
Dual SPDT, USB2, QFN10
Dual SPDT, negative rail, CSP12
Smart resets
Single push button, DFN6
Dual push button, DFN6
Supervisors
1.2 A, 170 mΩ RDS(on), DFN8
2.0 A, 90 mΩ RDS(on), DFN10
Real-time clock
Ultra-low-power serial real-time clock, LCC8 package (3.2 x 1.5 mm), supply current 350 nA, supply voltage 1.3 to 4.4 V
Protection and EMI filtering
Crowbar
GR1089/ ITU-T Kx - Networking
Clamping
EOS - 10/1000 µs and 8/20 µs
EOS - ISO 7637 - Automotive
ST
complete
product offer
TVS clamping
diodes and ICS
Automotive-grade
TVS clamping
diodes
and arrays
EOS - ISO 10605 - Automotive
TVS clamping
arrays
ESD - IEC 61000 - 4-2
Active
protection
40
TVS crowbar
diodes and ICS
Specific requirements
Current-limiting
terminations
Protection devices
IPAD™ products integrate the various functions required by wireless applications, such as ESD protection
diodes, EMI low-pass or common-mode filters, line terminations, and pull-up or pull-down resistors.
ST’s complete protection and filtering range with integrated or standalone solutions offers design flexibility
while bringing space saving and high system immunity.
ESD protection
EOS protection
Our solutions are not only specified against
the highest level of IEC 61000-4-2 for
robustness, but also target the lowest
clamping voltages, and lowest residual
currents for the highest protection efficiency.
Protective devices for clamping arrays,
rail-to-rail topologies, USB ports and highspeed ports are driven by requirements for
robustness, efficiency, and transparency.
ST proposes dataline and powerline high
power-density protection, rated against
IEC 61000-4-5. These EOS 8/20 µs
protection devices are available in a large
choice of packages, from 0402 to SMC,
bringing flexibility to designers and reliability
to the application.
Key features
• Robust ESD protection at system
level including high-speed
serial interfaces
EMI and common mode filtering
Audio, video
Computer, consumer
Display, camera, keypad
Memory, SIM card
Standard multiline bus
USB
Audio and video IPAD
Memory and SIM card IPAD
USB IPAD
ST has developed a complete range of
EMI filter and CMF (ECMF™) components
dedicated to audio and video interfaces
such as microphones, headsets, speakers,
earphones, and analog TV out or HDMI. These
devices provide efficient filtering of wireless
frequencies above 800 MHz as well as
superior ESD protection with extremely low
clamping voltages.
A complete range of IPAD™ components
dedicated to memory-card interfaces such
as used for microSD, T-Flash or SIM cards.
These devices provide efficient filtering of
wireless frequencies above 800 MHz as well
as superior ESD protection with extremely
low clamping voltage. Available in CSP or
micro-QFN packages, these filters cover new
standards such as SDA3.0 (SDR 104).
These devices combine EMI low-pass or
common-mode filters, ESD protection, and
pull-up or pull-down resistors to support
USB 2.0 and USB 3.1 specifications.
Displays and cameras
Standard multiline bus IPAD
ST’s ECMF™ series offers silicon commonmode filters combined with high-efficiency
ESD protection. Now available in micro-QFN
and CSP packages, this series offers ultracompact form factors and covers high-speed
serial interface standards including MIPI.
The ECMF devices are designed to avoid
RF antenna desense and to protect ICs
against destructive electrostatic discharges
(ESD). They are particularly well suited for
applications frequently subjected to RF linkloss, due to the high-speed differential links
– USB or MIPI – combined with antenna RF,
Bluetooth, or Wi-Fi connectivity.
A complete range of IPAD™ components
designed for bottom connectors and generalpurpose uses for mobile phones. These
devices provide efficient filtering of wireless
frequencies above 800 MHz as well as
superior ESD protection with extremely low
clamping voltages. Available in CSP or microQFN packages, RC or LC topologies, low- or
high- line capacitance, these multiline filters
immunize both digital and analog lines.
Key features
• Single chip interface integrating
resistors, capacitors, inductors,
and ESD components
• PCB space saving up to 80% of
board area compared to equivalent
discrete solutions
41
Featured products
USB flow-thru ESD protection
HSP051-4N10
ST’s new HSP051-4N10 alleviates the increasing sensitivity to ESD events from the user through the external connector of high-speed
differential-line transceivers such as USB 3.1 (10 Gbit/s) or HDMI 2.0 4K (5.94 Gbit/s) interfaces. This ESD array is compatible with USB Type
C connectors and protects ICs from contact discharges up to 8 kV as defined by IEC 61000-4-2 Level 4, with very low dynamic resistance
(0.48 Ω). Its 1.9 mm² and 4-channel flow-through µQFN-10L package is only 0.32 mm thick with a 0.4 mm pitch, and minimizes impedance
mismatch. With only 0.35 pF line capacitance, signal integrity is preserved, providing a 10 GHz bandwidth.
Key features
• Flow-through routing to keep
signal integrity
• Ultralarge bandwidth: 10 GHz
• Ultralow capacitance:
• 0.2 pF (I/O to I/O)
• 0.35 pF (I/O to GND)
• Very low dynamic resistance:
0.48 Ω
• Low leakage current: 100 nA at
25 °C
42
Common-mode filters with integrated esd protection
ECMF04-4HSWM10
Smartphones are exposed to antenna input power sensitivity decrease due to common-mode noise radiating in Rx bands coming from USB
data transmissions. This may lead to RF link loss and consequently to user frustration. The latest common-mode filter in ST’s ECMF™ series –
the ECMF04-4HSWM10 – features deep attenuation of common-mode noise at GSM, W-CDMA, LTE, GPS, BT and Wi-Fi (2.4 GHz and 5 GHz)
frequencies, combined with a robust +8 kV contact discharge ESD protection. Housed in a tiny µQFN package, it is compatible with the new USB
Type C connector, and saves up to 30% of the PCB area compared to an equivalent discrete solution.
Key features
• Ultra wide differential bandwidth:
up to 7 GHz
• High common-mode attenuation
(Scc21): from 800 MHz to 5 GHz
• Compliance with IEC 61000-42 discharge with low clamping
voltage
• Low DC resistance
• 60% PCB space saving versus
discrete solution
device summary
ECMF04-4HSM10
ECMF06-6HSM16
EMIF0x-1502Mx
ECMF04-4AMX12
ECMF06-6AM16
EMIF04-EAR02M8
EMIF02-SPK03F2
EMIF02-SPK02F2
ESDA5-1BF4
EMIF03-SIM03F3
EMIF03-SIM05F3
EMIF06-MSD02N16
EMIF06-HSD04F3
ECMF02-2BF3
ECMF02-2AMX6
ECMF02-4CMX8
ECM02-0730V12M12
USBULC6-3F3
EMIF01-1003M3
EMIF02-1003M16
EMIF04-1005M8
EMIF06-1005M/N12
EMIF08-1005M/T16
HSP051-4M5(1)
ESDAXLC6-1BU2
HSP051-4N10
ESDARF02-1BU2CK
ESDALC6V1-5T6
ESDALC6V1M3
ESDAVLC5-1BF4
ESDAULC5-1BF4
SMM4F24A
SMM4F13A
ESDA7P60-1U1M
ESDA13P70-1U1M(1)
Display, camera and keypad IPAD
2-pair common-mode filter with integrated ESD protection in micro-QFN
3-pair common-mode filter with integrated ESD protection in micro-QFN
4/6/8-line low-capacitance EMI filter and ESD protection in micro-QFN
2-pair common-mode filter with integrated ESD protection in micro-QFN
3-pair common-mode filter with integrated ESD protection in micro-QFN
Audio jack IPAD
2-line EMI filter for earphones + 2-line EMI filter for microphones with integrated ESD protection in micro-QFN
2-line EMI filter and ESD protection for speakers with 0.07 Ω typ. DC line
2-line EMI filter and ESD protection for speakers with 0.35Ω typ. DC line resistance
Single line bidirectional ESD protection in 0201 package with < 10 V remaining voltage
Memory and SIM card IPAD
3-line EMI filter and ESD protection for SIM card interfaces in chip scale package 0.4 mm
3-line EMI filter and ESD protection for SIM card interfaces + NFC in chip scale package
6-line EMI filter and ESD protection for mini and microSD cards, SD3.0 in micro-QFN
6-line EMI filter and ESD protection for mini and microSD cards, SD3.0 UHS-1 in chip scale package
USB 2.0 High Speed
Single-pair common-mode filter with integrated ESD protection in chip scale package 0.4 mm
Single-pair common-mode filter with integrated ESD protection in micro-QFN
Single-pair common-mode filter + ID pin + VBUS with integrated ESD protection in micro-QFN
Single-pair ESD + common-mode filter + ID pin & Vbus 9 V ESD protection
3-line ESD protection with 8.5 GHz bandwidth in chip scale package
Standard multiline bus IPAD
1-line EMI filter with integrated ESD protection in micro-QFN
2-line EMI filter with integrated ESD protection in micro-QFN
4-line EMI filter with integrated ESD protection in micro-QFN
6-line EMI filter with integrated ESD protection in micro-QFN
8-line EMI filter with integrated ESD protection in micro-QFN
Super speed USB and HDMI 2.0
4-line ultra-large bandwidth (12 GHz) ESD protection in 1.3 x 0.8 mm pitch µQFN flow-thru package
Single-line ESD protection for high-speed lines in 0201 package
4-line ultra-large bandwidth ESD protection in 1.9 x 1.0 mm flow-thru package
Single-line extra-low-capacitance (20 GHz bandwidth) bidirectional ESD protection in 0201 package
Clamping array
5-line 1 x 1 mm ESD protection in micro-QFN
Dual low-capacitance for ESD protection in micro-QFN
Single-line very-low-capacitance (7 pF max) bidirectional ESD protection in 0201 package
Single-line ultra-low-capacitance (3 pF max) bidirectional ESD protection in 0201 package
EOS protection for USB power delivery (pin Vbus)
20 V / 60 A (8/20 µs) EOS and ESD protection
13 V / 85 A (8/20 µs) EOS and ESD protection
5 V / 60 A (8/20 µs) EOS and ESD protection
9 V / 70 A (8/20 µs) EOS and ESD protection
Note: 1. Under development - target datasheet and samples available upon request.
43
Power management
44
ST’s power management ICs especially designed for use in mobile devices provide high efficiency
and low standby power consumption with high power density for a wide range of functions including
solutions for battery charging and monitoring, LED drivers for backlights and camera flashes, power
supplies for OLEDs as well as switching and linear voltage regulators and are available in a choice of
miniature packages for reduced footprint and height.
LDO regulators
Our range of LDOs features an optimal combination of low dropout voltage, low quiescent
current, fast transient response, low noise and high power supply rejection even with no
external capacitor. With output voltages ranging from 0.8 to 5 V and current from
50 to 300 mA, they are available in miniature packages making them ideal for use in mobile
devices.
Key features
• Large selection of output voltages
and currents
• Miniature DFN, SOT and
chip-scale packages
• Very low quiescent current
• Ultra-low noise and high PSRR for
RF circuit power supplies
• Requires no bypass capacitor
Featured products
LDBL20
200 mA - low quiescent LDO in ultra-miniature bump-less csp
Small is good in mobile devices. Smallest is best: LDBL20 is world’s smallest 200 mA LDO
with its amazing 0.47x0.47 mm bump-less chip-scale package (CSP). In addition to its low
quiescent current, shutdown feature, a large selection of output voltages and tiny size makes it
a great help for designers.
Key features
• 200 mV typical dropout at 200 mA
• Low quiescent current
20 µA @ no load
100 µA @ 200 mA
• 0.03 µA in OFF mode
• Output voltage range
from 0.8 to 5 V in 50 mV steps
• Bump-less CSP (0.49 x 0.49 mm)
•
•
DC-DC Converters
In mobile, battery-operated applications high efficiency and small size are paramount and
that’s what drove us in the development of our dedicated DC-DC converters. Available in stepdown, step-up and buck-boost topologies, they feature high switching frequencies and low
quiescent current and are hosted in miniature DFN or chip-scale packages.
Key features
• Miniature chip-scale packages
• Very low quiescent current
• High switching frequency for
reduced losses and size
• Step-down, step-up and buck-
boost topologies supported
Featured products
ST1S15, 500 mA step-down converter
The ST1S15 is a high-efficiency miniaturized step-down converter with 500 mA output current
from an input voltage ranging from 2.3 to 5.5 V. Thanks to its capability to run at a 6 MHz
switching frequency, the ST1S15 can use the smallest nominal values for the inductor (470
nH) and for the output capacitor (4.7 µF) still providing very good load and line transients.
Hosted in a small 6-bump chip-scale package, it provides invaluable help in reducing size and
efficiency.
Key features
• 500 mA output with
85% efficiency
• 45 µA quiescent current
• PFM or PWM operation for highest
efficiency over whole load range
• Ultra-fast load and line transient
• Flip-chip package
(1.19 x 0.93 mm)
45
Battery management
ST’s range of battery management solutions includes linear and single- or dual-input switching
chargers, a chipset for wireless charging for implementations compliant with industry
standards, standalone gas-gauge for accurate battery state-of-charge reporting and PMIC with
charger, gas gauge and LDOs. Many solutions for a single problem: keeping your battery in
great shape for a prolonged, useful life.
Key features
• Extensive integration for reduced
external component count and size
• Miniature QFN, DFN and chip-scale
packages
• Very low quiescent current
• High efficiency
Featured products
STWBC and STWLC03, RX and TX chipset for wireless chargers
The STWBC and STWLC03 form a complete transmitter and receiver chip-set for wireless
chargers. With their optimized set of analog peripherals – such as ADCs and timers for PWM
generation - their efficient CPU and the on-chip of non-volatile memory, they require just a
handful of external components to implement a complete wireless chargers that can be easily
made to comply with PMA and Qi industry standards.
Key features
• Qi and PMA standards supported
• Extensive set of on-chip
peripherals
• Integrated synchronous rectification DC-DC converter (STWLC03)
• Native support for half- and fullbridge topologies (STWBC)
• On-chip NVM memory
STBCFG01, battery charger with OTG boost and voltage mode fuel gauge for singlecell Li+ batteries
The STBCFG01 is a highly integrated power management IC with all the necessary functions
to charge single cell Li-Ion batteries, monitor the battery charge and generate 5 V to supply
USB OTG bus powered devices. High switching frequency and low quiescent current ensure
high efficiency in the charger section while the voltage mode fuel gauge provides accurate
estimation of the state of requiring no external sensing resistor to keep external part count low
and size small also thanks to a small 2.3 x 2.2 mm CSP.
Key features
• High efficiency switching battery
charger
• 1.2 A max. charging current and
20 V max tolerant input with OVP
• 500 mA supply for USB OTG
• High accuracy voltage mode fuel
gauge
• Small-footprint flip-chip package,
25 bumps (2.3 x 2.2 mm)
Battery monitoring
46
Gas gauge IC for handheld applications
The STC3115 and STC3117 include the hardware functions required to implement a lowcost gas gauge for battery monitoring. The devices use current sensing, Coulomb counting
and accurate measurements of the battery voltage to estimate the state-of-charge (SOC)
of the battery. An internal temperature sensor simplifies implementation of temperature
compensation.
An alarm output signals a low SOC condition and can also indicate low battery voltage. The
alarm threshold levels are programmable.
The STC3115 and STC3117 offer advanced features to ensure high-performance gas gauge
functions in all application conditions.
The devices are available in a 10-bump CSP package (1.4 x 2.0 mm) and in a 9-bump CSP
package (1.5 x 1.6 mm) perfect for ultra-mobile, small form-factor applications, and the
STC3115 also comes in a 10-lead DFN package (2.0 x 3.0 mm) that is easier to solder and
has greater PCB bending tolerance.
LED drivers and display supplies
The many LEDs used in modern mobile terminals require driving solutions that are optimized
for the different uses of the light source. ST offers a large portfolio of energy-efficient display
supplies and drivers designed for boost topologies used by high-brightness LED solutions with
multiple dimming controls for backlight LEDs as well as for high-efficiency, synchronous buckboost topologies designed for driving a single or multiple strings of white LED for electronic
flash units. We offer also highly-integrated optimized low-noise DC-DC converters for passive
(PMOLED) and active (AMOLED) OLEDs with negative voltage capability.
Key features
• Extensive integration for reduced
external component count and size
• Very low quiescent current
• High efficiency, low noise
• Miniature QFN, DFN and chip-scale
packages
Featured products
STOD32W, triple DC-DC converter for AMOLED display supplies.
Integrating a main step-up converter, an inverting DC-DC converter, and an auxiliary step-up
converter – with programmable output voltage - the STOD32W provides an optimized solution
for AMOLED display panel supplies as well as an optimized TDMA noise filter to minimize
flickering. The STOD32W comes in an optimized flip-chip package to help reduce the size of
the final application.
Key features
• 100 mA/4.6 V main step-up
converter
• Negative step-up with up to -4.6 V
programmable output voltage
• 55 mA auxiliary step-up with up to
7.6 V programmable output voltage
• High efficiency, low noise
• Miniature flip-chip package
(1.6 x 1.7 mm)
device summary
LDBL20
LD39130S
LD39115J
LD39050
LD39030SJ
LD39020
LD59015
LDCL015
LDLN015
LDK120
LDK130
STLQ50
STLQ015
ST1S15
STBB2
STBB3J
STBB3JCC
STBCFG01
STBC02(1)
STBC03(1)
L6924D
L6924U
STNS01
STWBC
STWLC03(1)
STOD32W
STOD1317B
STP4CMP
STCF04
Note: 1. Under Development
LDO regulators
200 mA, low-quiescent current and High PSRR in 0.49 x 0.49 mm bump-less csp
300 mA, ultra-low-quiescent current with automatic green-mode
150 mA, ultra-low-drop, low IQ, low noise
500 mA, ultra-low-drop and power good
300 mA, ultra-low-drop, soft start
200 mA, low quiescent current and High PSRR
150 mA, very-low-noise, high PSSR
150 mA, capacitor less, ultra low drop
150 mA, ultra-low-noise, high PSRR
200 mA low quiescent current and low noise
300 mA low quiescent current and low noise
50 mA, ultra-low IQ, very low drop
150 mA, ultra-low IQ, very low drop
DC-DC converters
500 mA, 6 MHz, PFM/PWM step-down converter
800 mA 2.5 MHz, high-efficiency dual mode buck-boost DC-DC converter
2 A, 2 MHz, high-efficiency dual mode buck-boost DC-DC converter
2 A, high-efficiency single inductor buck-boost DC-DC converter and high brightness white LED driver
Battery management
Switch-mode single cell Li+ battery charger with OTG boost, voltage mode fuel gauge and LDO
450 mA linear battery charger with switch matrix and LDO
650 mA linear battery charger with switch matrix and LDO
1 A wall/USB charger for Li-ion and Li-Po
Single cell Li-Ion battery charger IC for USB port and AC adapter
Li-Ion Linear Battery Charger with LDO
Digital controller for wireless battery charger transmitters Qi 1.1.2 A11 certified, PMA compatible
Dual mode Qi/ PMA wireless power receiver
LED and Display supply
100 mA triple DC-DC converter for AMOLED displays
170 mA 13 V, high-efficiency boost converter with LDO for AMOLED displays
Low-voltage 4-channel constant current LED driver with charge pump for backlight
High-power white LED SuperCap driver with I2C interface
47
© STMicroelectronics - December 2015 - Printed in United Kingdom - All rights reserved
The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies
All other names are the property of their respective owners
Order code: BRMOBILE1215
For more information on ST products and solutions, visit www.st.com
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