MAX3204E

MAX3204E
MAX3204E
RELIABILITY REPORT
FOR
MAX3204EETT+
PLASTIC ENCAPSULATED DEVICES
July 5, 2012
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Sokhom Chum
Quality Assurance
Reliability Engineer
Maxim Integrated Products. All rights reserved.
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MAX3204E
Conclusion
The MAX3204EETT+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
IV. .......Die Information
II. ........Manufacturing Information
V. ........Quality Assurance Information
III. .......Packaging Information
VI. .......Reliability Evaluation
.....Attachments
I. Device Description
A. General
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are low-capacitance ±15kV ESD-protection diode arrays designed to protect sensitive electronics
attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND. The
MAX3202E/MAX3203E/MAX3204E/MAX3206E protect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV
Air-Gap Discharge, as specified in IEC 61000-4-2. These devices have a 5pF capacitance per channel, making them ideal for use on high-speed data
I/O interfaces. The MAX3202E is a two-channel device intended for USB and USB 2.0 applications. The MAX3203E is a triple-ESD structure intended
for USB On-the-Go (OTG) and video applications. The MAX3204E is a quad-ESD structure designed for Ethernet and FireWire® applications, and the
MAX3206E is a six-channel device designed for cell phone connectors and SVGA video connections. All devices are available in tiny 4-bump
(1.05mm x 1.05mm) WLP, 6-bump (1.05mm x 1.57mm) WLP, 9-bump (1.52mm x 1.52mm) WLP, 6-pin (3mm x 3mm) TDFN, and 12-pin (4mm x 4mm)
TQFN packages and are specified for -40°C to +85°C operation.
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MAX3204E
II. Manufacturing Information
A. Description/Function:
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD-Protection Arrays for
High-Speed Data Interfaces
B. Process:
BCD88
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Taiwan, China, Thailand
F. Date of Initial Production:
April 3, 2003
III. Packaging Information
A. Package Type:
6L TDFN
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0265 / D
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
1
J. Single Layer Theta Ja:
55°C/W
K. Single Layer Theta Jc:
9°C/W
L. Multi Layer Theta Ja:
42°C/W
M. Multi Layer Theta Jc:
9°C/W
IV. Die Information
A. Dimensions:
44X64 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
3.0 microns (as drawn)
F. Minimum Metal Spacing:
3.0 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX3204E
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= ___1___
MTTF
=
_______1.83_______ (Chi square value for MTTF upper limit)
192 x 4340 x 45 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 24.4 x 10-9
= 24.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the BCD88 Process results in a FIT Rate of 0.06 @ 25C and 1.08 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot ICB0AQ001C D/C 0239)
The RT70-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2000V Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250mA.
Maxim Integrated Products. All rights reserved.
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MAX3204E
Table 1
Reliability Evaluation Test Results
MAX3204EETT+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
45
0
ICB0AQ001C, D/C 0239
Note 1: Life Test Data may represent plastic DIP qualification lots.
Maxim Integrated Products. All rights reserved.
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