2011 RECOMMENDED Electronics Assembly Materials

2011 RECOMMENDED Electronics Assembly Materials

2011 RECOMMENDED

Electronics Assembly Materials

New for 2011 see Page 4 for details

Table of Contents

Products Pages

Solder Paste

Fluxes

Solder Wire

Bar Solder

Additional Flux Materials 16

TSF Products 17

Other products

Helpful Information

18

19

4-7

8-11

12-13

14-15

Formula

Application

Alloy

Product

Characteristics

Residue Characteristics

Typical Metal Percentage and mesh size

Compliant Specifications

Suggested Packaging Style

Coming soon: Kester Lead-Free, Halogen-Free

NXG3 NXG33

No-Clean Stencil Printing

Sn96.5Ag3.0Cu0.5

No-Clean Stencil Printing

Sn96.5Ag3.0Cu0.5

Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically bright as SnPb joints. Prints down to 01005 pad sites.

Designed to be reflowable in air as well as nitrogen.

Designed to exceed customers' expectations for high yield lead-free manufacturing. NXG33 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically bright as

SnPb joints. Prints down to 01005 pad sites. Designed to be reflowable in air as well as nitrogen. Post soldering, the NXG33 offers minimized defects, including head-in-pillow and QFN/BGA voiding.

Light colored

88.5%, -400/+500 (Type 4)

Telcordia Issue 1 GR-78-CORE

IPC/J-STD-004B Flux Designator ROL0

500g jar; 600 or1400g cartridges

Light colored

88.5%, -400/+500 (Type 4)

Telcordia Issue 1 GR-78-CORE

IPC/J-STD-004B Flux Designator ROL0

500g jar; 600 or1400g cartridges

STANDARD SOLDER PASTE REFLOW PROFILE

FOR KESTER PASTE CONTAINING

ALLOYS: Sn96.5Ag3.0Cu0.5 or Sn96.5Ag3.5

Stage 1- Preheat Zone

(Rapid Heating Stage)

The purpose of this zone is to quickly bring the assembly up to a temperature where solder paste can become highly chemically active.

Stage 2- Soak Zone

(Temperature Equalization Stage)

The purpose of this stage is for the thermal mass of the assembly to reach a uniform temperature plateau so that there is a very small differential between the hottest and coldest soldering locations on the assembly.

Stage 3- Reflow Zone

(Rapid Heating and Cooling)

The purpose of this stage is to rapidly heat the assembly above the melting (liquidus) temperature of the solder and subsequently cool the assembly down quickly to solidify the solder. Wetting of solder onto teh substrate and component metalizations occurs in the reflow zone.

Formula

Application

Alloy

Product

Characteristics

Residue Characteristics

Typical Metal Percentage

Compliant Specifications

Suggested Packaging Style

Formula

Application

Alloy

Product

Characteristics

Residue Characteristics

Typical Metal Percentage

Compliant Specifications

Suggested Packaging Style

Kester Lead-Free

NXG1

No-Clean Stencil Printing

Sn96.5Ag3.0Cu0.5

EnviroMark™ 907

No-Clean Stencil Printing

Sn96.5Ag3.0Cu0.5

Designed to exceed customers' expectations for high yield lead-free manufacturing. NXG1 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically bright as SnPb joints. Prints down to

0201 pad sites. Designed to be reflowable in air as well as nitrogen.

EM907 is a first generation solder paste engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen.

Light colored

88.5%, -325/+500 (Type 3)

Telcordia Issue 1 GR-78-CORE

IPC/J-STD-004B Flux Designator ROL1

500g jar; 600 or1400g cartridges

Light colored

88.5%, -325/+500 (Type 3)

Telcordia Issue 1 GR-78-CORE

IPC/J-STD-004B Flux Designator ROL0

500g jar; 600 or1400g cartridges

EnviroMark™ 828

Water-Soluble Stencil Printing

Sn96.5Ag3.0Cu0.5

EnviroMark™ 808

Wate r-Soluble Stencil Printing

Sn96.5Ag3.0Cu0.5

Kester EM828 provides excellent printability, activity, cleanability and low-voiding behavior. EM828 is very robust and can tolerate a wide variety of printing and reflow conditions. EM828 is a “state of the art” water-soluable lead-free paste that combines superior activity, cleanability and low-voiding.

EM808 is first to market with a water-soluable lead-free paste that combines superior activity, cleanability and low-voiding. Kester EM808 provides excellent printability, activity, cleanability and low-voiding behavior. EM808 is very robust and can tolerate a wide variety of printing and reflow conditions.

Cleanable in warm water

89.5%, -325/+500 (Type 3)

IPC/J-STD-004B Flux Designator ORH1

500g jar; 600 or1400g cartridges

Cleanable in warm water

89.5%, -325/+500 (Type 3)

IPC/J-STD-004B Flux Designator ORH1

500g jar; 600 or1400g cartridges

Kester Part #

7032130810

7032130811

7006050810

7006050811

7004030810

7004030811

7003060810

7003060811

Description

NXG1 No-Clean, Type 3, 88.5% metalsl

NXG1 No-Clean, Type 3, 88.5% metalsl

EM907 No-Clean, Type 3, 88.5% meta

EM907 No-Clean, Type 3, 88.5% metal

EM828 Water-Soluble, Type 3, 89.5% metal

EM828 Water-Soluble, Type 3, 89.5% metal

EM808 Water-Soluble, Type 3, 89.5% metal

EM808 Water-Soluble, Type 3, 89.5% metal

Alloy

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Packaging

500g jar

600g cartridge

500g jar

600g cartridge

500g jar

600g cartridge

500g jar

600g cartridge

Solder Paste for Tin-lead

No-Clean

Water-Soluble

Formula Type

Easy Profile 256HA

Easy Profile

®

256

Solder Paste for Stencil Printing Applications

HydroMark 531

Alloy

Pro duct

Characteristics

Sn63Pb37 Sn62Pb36Ag2

High activity no-clean paste specifically engineered to provide excellent solderability to lead free component and board finishes.

Consistent print volume regardless of process parameters and 0201 application capable. Wide reflow process window.

Compatible with enclosed print head systems.

Sn63Pb37 Sn62Pb36Ag2

Standard no-clean paste for a wide variety of reflow profiles and printing conditions. Industry standard formula that performs well in a variety of applications. Compatible with enclosed print head systems.

Sn63Pb37 Sn62Pb36Ag2

This highly-active, anti-slump paste is produced consistently so that every batch results in high yield manufacturing. HydroMark 531 also offers extremely robust printing, even with idle time up to 1 hour and print speeds of up to 6 in/sec. This very active formula is effective on a wide variety of metallizations, including palladium. Compatible with enclosed print head systems.

Sn63Pb37

R562

Sn62Pb36Ag2

Designed for maximum environmental robustness and minimal void production, R562 has a stencil life of over 8 hours and may be used in a wide range of humidities (10 - 85% RH). Compatible with enclosed print head systems.

Residue

Removal

Not normally required.

Not normally required.

Use de-ionized or soft tap water at

120-140°F.

Use de-ionized or soft tap water at

120-140°F.

Product

Characteristics

Residue

Removal

Compliant

Specifications

Powder

Mesh Size

Metal %

Suggested

Packaging Style

Compliant

Specifications

Powder

Mesh Size

Metal %

Suggested

Packaging Style

Formula Type

Alloy

Telcordia Issue 1GR-78-CORE,

IPC/J-STD-004B

Classification ROL0

Telcordia Issue 1GR-78-CORE,

IPC/J-STD-004B

Classification ROL0

IPC/J-STD-004B

Classification ORM0

IPC/J-STD-004B

Classification ORH0

-325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3)

90%

500g jar,

600 or 1400g cartridges

90%

500g jar,

600 or 1400g cartridges

90%

500g jar,

600 or 1400g cartridges

Solder Paste for Syringe Dispensing Applications

R276

Sn63Pb37

Provides optimal performance in all types of dispensing applications. R276 is packaged void-free to ensure consistent dispensing in high speed automated processes.

Exhibits excellent dispensing characteristics with a wide range of needle diameters.

R500

Sn63Pb37

90%

500g jar,

600 or1400g cartridges

The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics.

Not normally required.

Telcordia Issue 1GR-78-CORE,

IPC/J-STD-004B Classification ROL0

Use de-ionized or soft tap water at

49-60°C (120-140°F).

IPC/J-STD-004B

Classification ORH0

-325/+500 (Type 3)

87%

35g and 100g syringes

-325/+500 (Type 3)

86%

35g and 100g syringes

*For lead based products, Kester produces solder powder in compliance to J-STD-006B for alloy purity and particle size distribution.

Solder Paste for Tin-lead

Kester Part #

7002020510

7002020310

7002020511

7002020311

7001020510

7001020310

7001020511

7001020311

7010020510

7010020310

7010020511

7010020311

7021020510

7021020310

7021020511

7021020311

7016070520

7016070504

7017080520

7017080504

Description

Easy Profile

®

256HA No-Clean, Type 3, 90% metal

Easy Profile

®

256HA No-Clean, Type 3, 90% metal

Easy Profile

®

256HA No-Clean, Type 3, 90% metal

Easy Profile

®

256HA No-Clean, Type 3, 90% metal

Easy Profile

®

256 No-Clean, Type 3, 90% metal

Easy Profile

®

256 No-Clean, Type 3, 90% metal

Easy Profile

®

256 No-Clean, Type 3, 90% metal

Easy Profile

®

256 No-Clean, Type 3, 90% metal

HydroMark 531 Water Soluble, Type 3, 90% metal

HydroMark 531 Water Soluble, Type 3, 90% metal

HydroMark 531 Water Soluble, Type 3, 90% metal

HydroMark 531 Water Soluble, Type 3, 90% metal

R562 Water Soluble, Type 3, 90% metal

R562 Water Soluble, Type 3, 90% metal

R562 Water Soluble, Type 3, 90% metal

R562 Water Soluble, Type 3, 90% metal

R276 No-Clean, Type 3, 87% metal

R276 No-Clean, Type 3, 87% metal

R500 Water Soluble, Type 3, 86% metal

R500 Water Soluble, Type 3, 86% metal

Alloy

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn62Pb36Ag2

Sn63Pb37

Sn63Pb37

Sn63Pb37

Sn63Pb37

Packaging

500g jar

500g jar

600g cartridge

600g cartridge

500g jar

500g jar

600g cartridge

600g cartridge

500g jar

500g jar

600g cartridge

600g cartridge

500g jar

500g jar

600g cartridge

600g cartridge

35g syringe

100g syringe

35g syringe

100g syringe

Fluxes for Lead-Free

Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output.

*Formula

Application

Halide Content %

Specific Gravity

Solids %

Compliant

985M

No-Clean

Spray or Wave Fluxer

Halide - free

0.805

3.6

IPC/J-STD-004B

Flux Designator ROL0

959T

No-Clean

Spray or Foam

Halide - free

0.794

2.9

IPC/J-STD-004B

Flux Designator

2220-VF VOC-Free

Water-Soluble

Spray, Wave or Foam

1.6

1.055

7

IPC/J-STD-004B

Flux Designator ORH1

2235

Water-Soluble

Spray or Foam

1.6

0.856

11

IPC/J-STD-004B

Flux Designator

Kester Part #

63-0004-0985

64-0004-0985

65-0004-0985

63-0020-0959

64-0020-0959

65-0020-0959

63-0056-2220

64-0056-2220

65-0056-2220

63-0000-2235

64-0000-2235

65-0000-2235

Description

985M No-Clean

985M No-Clean

985M No-Clean

959T No-Clean

959T No-Clean

959T No-Clean

2220-VF VOC-Free Water-Soluble

2220-VF VOC-Free Water-Soluble

2220-VF VOC-Free Water-Soluble

2235 Water-Soluble

2235 Water-Soluble

2235 Water-Soluble

*

These products are designed specifically for high performance lead-free applications.

Packaging

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

No-Clean Fluxes

Formula

Flux Type

Percent Solids

VOCs (g/liter)

Specific Gravity

Product

Characteristics

Compliant

Specifications

Residue Removal

(not normally required)

Thinner

Flux Test Kit

985M

Low Solids

No-Clean

3.6

776

0.805

Designed for the wave soldering applications and gives excellent hole fill on thick board assemblies.

Telcordia Issue 1

GR-78-CORE &

IPC/J-STD-004B

Flux designator ROL0

Wash with Kester's

#5768 Bio-Kleen

® saponifier at 2% concentration.

4662

PS-20 or PS-22

Alcohol Based

959T

Low Solids

No-Clean

2.9

770

0.794

Designed for the wave soldering of conventional and SMT board assemblies.

Developed to minimize the formation of micro-solderballs.

Telcordia Issue 1

GR-78-CORE &

IPC/J-STD-004B

Flux designator ORL0

Wash with Kester's

#5768 Bio-Kleen

® saponifier at 2% concentration.

4662

PS-20 or PS-22

No-Clean Fluxes

951

Rosin-Free

Low Solids, No-Clean

2.0

792

0.813

Very low solids, rosin free, foam and spray application flux.

Practically no residue after the soldering process.

Telcordia Issue 1

GR-78-CORE &

IPC/J-STD-004B

Flux designator ORL0

Wash with Kester's

#5768 Bio-Kleen

® saponifier at 2% concentration.

110

PS-22

979

VOC-Free

No-Clean

4.2

0

1.015

Developed to reduce bottomside micro-solder balling and bridging on glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consistent hole-fill.

Telcordia Issue 1

GR-78-CORE &

IPC/J-STD-004B

Flux designator ORL0

Wash with hot de-ionized water at 49-60°C (140-160°F) or use

1% solution of Kester's #5768

Bio-Kleen ®

De-ionized Water

PS-20 or PS-22

VOC-Free

977

VOC-Free

No-Clean

3.25

0

1.012

971M

VOC-Free

No-Clean

2.8

0

1.007

Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a larger process window and can survive the longer dwell times in extremely turbulent chip waves.

Designed for spray applications.

Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminates the need for a flux thinner.

Telcordia Issue 1

GR-78-CORE &

IPC/J-STD-004B

Flux designator ORL0

Wash with hot de-ionized water at

49-60°C (140-160°F) or use 1% solution of Kester's #5768 Bio-Kleen saponifier in water.

De-ionized Water

PS-20 or PS-22

®

Telcordia Issue 1

GR-78-CORE &

ANSI/J-STD-004B

Flux designator ORL0

Wash with hot de-ionized water at 49-60°C (140-

160°F) or use 1% solution of Kester's #5768 Bio-

Kleen ®

De-ionized Water

PS-20

Kester Part #

63-0000-0951

64-0000-0951

65-0000-0951

63-0004-0985

64-0004-0985

65-0004-0985

63-0020-0959

64-0020-0959

65-0020-0959

63-0004-0971

64-0004-0971

65-0004-0971

63-0000-0977

64-0000-0977

65-0000-0977

63-0000-0979

64-0000-0979

65-0000-0979

Description

951 No-Clean

951 No-Clean

951 No-Clean

985M No-Clean

985M No-Clean

985M No-Clean

Packaging

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

959T No-Clean

959T No-Clean

959T No-Clean

1 gallon

5 gallon

53 gallon drum

971M VOC-Free No-Clean 1 gallon

971M VOC-Free No-Clean 5 gallon

971M VOC-Free No-Clean 53 gallon drum

977 VOC-Free No-Clean

977 VOC-Free No-Clean

977 VOC-Free No-Clean

979 VOC-Free No-Clean

979 VOC-Free No-Clean

979 VOC-Free No-Clean

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

Water-Soluble Fluxes

Formula

Flux Type

Percent Solids

VOCs (g/liter)

Specific Gravity

Percent Halides

Product

Characteristics

Compliant

Specifications

Residue Removal

Thinner

2331-ZX

Neutral pH

Organic Water-Soluble

33

729

0.899 ± 0.005

2.2

Original pH neutral organic flux for automated wave and drag soldering processes.

IPC/J-STD-004

Flux designator ORH1

Residue removal is required. Use soft or de-ionized water at temperatures of

49-66°C (120-150°F).

4662

Water-Soluble Fluxes

2235

Organic

Water-Soluble

11

763

0.856 ± 0.005

1.5

Highly active flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads.

IPC/J-STD-004

Flux designator ORH1

Residue removal is required. Use soft or de-ionized water at temperatures of

49-66°C (120-150°F).

4662

2120

Organic

Water-Soluble

24

670

0.862 ± 0.005

Halide-Free

Highly active, organic flux designed for automated wave soldering applications. This halide-free formula produces bright, shiny joints and high ionic cleanliness after water cleaning

IPC/J-STD-004

Flux designator ORH0

Residue removal is required. Use soft or de-ionized water at temperatures of 49-66°C

(120-150°F).

4662

Kester Part #

63-0097-2331

64-0097-2331

65-0097-2331

63-0000-2235

64-0000-2235

65-0000-2235

63-0000-2120

64-0000-2120

65-0000-2120

Description

2331-ZX Water-Soluble

2331-ZX Water-Soluble

2331-ZX Water-Soluble

2235 Water-Soluble

2235 Water-Soluble

2235 Water-Soluble

2120 Water-Soluble

2120 Water-Soluble

2120 Water-Soluble

Packaging

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

Rosin Fluxes

Formula

Flux Type

Percent Solids

Specific Gravity

Rosin Based Fluxes

186

Rosin Mildly Activated

(RMA)

36

1544

Activated Rosin

(RA)

50

0.879 ± 0.005

0.929 ± 0.005

Percent Halides

Product

Characteristics

Compliant

Specifications

Residue Removal

Thinner

0.02

0.44

Designed for high thermal stability and superior solderability.

Kester's active, Non-corrosive rosin type flux. Used on surfaces that are more difficult to solder.

IPC/J-STD-004

Flux designator ROL0

Residue is non-corrosive, but may be removed with solvent or with Kester’s

5768 Bio-Kleen

® saponifier at 7-10% solution in de-ionized or soft water at temperatures of 49-60°C (120-

IPC/J-STD-004

Flux designator ROM1

Residue is non-corrosive, but may be removed with solvent or with Kester’s 5768 Bio-Kleen ® saponifier at 7-10% solution in de-ionized or soft water at temperatures of 49-60°C

(120-140°)F.

120 104

Kester Part #

63-0000-0186

64-0000-0186

65-0000-0186

63-0000-1544

64-0000-1544

65-0000-1544

Description

186 RMA

186 RMA

186 RMA

1544 RA

1544 RA

1544 RA

Packaging

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

Kester Flux-Pen

®

The Kester Flux-Pen

® is a unique tool for rework and touch-up soldering. It allows controlled application of flux, eliminating the mess from flux bottles. Flux-Pens are ideally suited for typical hand-soldering applications. The five available formulas are listed below.

Kester Part #

83-1004-0985

83-1000-0951

83-1018-0186

83-1000-0186

83-1097-2331

53-0000-0225

Description

985M Low Solids No-Clean (20 pens/carton)

951 Low Solids No-Clean (20 pens/carton)

186-18 RMA No-Clean (20 pens/carton)

186 RMA No-Clean (20 pens/carton)

2331-ZX Neutral pH Water-Soluble (20pens/carton)

Flux-Pen ® Replacement Tips (25 tips/bag)

Kester Lead-Free

Solder Wires for

Lead-Free Assembly

Formula

Halide Percentage

Flux Content

Availability

Compliant

Specifications

275 48

No-Clean

< 0.05%

Activated Rosin

1.0%

See

Below

Telcordia Issue 1

GR-78-CORE & IPC/J-STD-004

Flux designator ROL0

66 core

(3.3%)

IPC/J-STD-004

Flux Designator ROM1

331

Water-Soluble

1.25%

66 core

(3.3%)

IPC/J-STD-004

Flux designator ORH1

Part #

24-9574-7610

24-9574-7619

24-9574-7618

24-9574-7613

24-9574-7615

“275” No-Clean Core 1 lb. with K100LD

Alloy Diameter

K100LD

K100LD

.020

.025

K100LD

K100LD

K100LD

.031

.050

.062

Core Size

66

66

66

66

66

Part #

24-9574-1401

24-9574-1406

24-9574-1402

24-9574-1404

24-9574-1400

"48" Activated Rosin 1 lb. with K100LD

Alloy Diameter

K100LD

K100LD

.020

.025

K100LD

K100LD

K100LD

.031

.050

.062

Part #

24-9574-6401

“331” Water-Soluble Core 1 lb. with K100LD

Alloy Diameter

K100LD .020

24-9574-6417

24-9574-6403

K100LD

K100LD

.025

.031

24-9574-6409

24-9574-6411

K100LD

K100LD

.050

.062

Core Size

66

66

66

66

66

Core Size

66

66

66

66

66

Part #

24-7068-7603

24-7068-7617

24-7068-7601

24-7068-7606

24-7068-7607

“275” No-Clean Core 1 lb. with SAC305

Alloy

Sn96.5Ag3.0Cu0.5

Diameter

.020

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

.025

.031

.050

.062

Core Size

58

58

58

58

58

Part #

24-7068-1401

24-7068-1406

24-7068-1402

24-7068-1404

24-7068-1400

"48" Activated Rosin 1 lb. with SAC305

Alloy

Sn96.5Ag3.0Cu0.5

Diameter

.020

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

.025

.031

.050

.062

Core Size

66

66

66

66

66

Part #

24-7068-6401

“331” Water-Soluble Core 1 lb. with SAC305

Alloy Diameter

Sn96.5Ag3.0Cu0.5 .020

24-7068-6417

24-7068-6403

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

.025

.031

24-7068-6409

24-7068-6411

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.0Cu0.5

.050

.062

Core Size

66

66

66

66

66

Solder Wire

"245" No-Clean

"245" is a halide-free; rosin based no-clean core flux that provides excellent wetting combined with optimal reliability and cosmetics. "245" is compliant to Bellcore GR-78-CORE and is classified as ROL0 per J-STD-004B.

Part #

24-6337-8806

24-6337-8807

Sn63Pb37

24-6337-8834

“245” No-Clean Core 1 lb.

Alloy

Sn63Pb37

Sn63Pb37

Diameter

.015

.020

.020

24-6337-8809

24-6337-8800

24-6337-8801

Sn63Pb37

Sn63Pb37

Sn63Pb37

24-6337-8802

Sn63Pb37

.025

.031

.031

.031

24-6337-8813

Sn63Pb37

24-6337-8814

Sn63Pb37

24-6337-8817

Sn63Pb37

.040

.050

.062

"331" Water Soluble

"331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from

"331" must be removed. "331" is classified as ORH1 per J-STD-004B.

“331” Water-Soluble Core 1 lb.

Part # Alloy

24-6337-6422

Sn63Pb37

Diameter

.015

24-6337-6401

Sn63Pb37

24-6337-6417

Sn63Pb37

24-6337-6403

Sn63Pb37

24-6337-6411

Sn63Pb37

.020

.025

.031

.062

Core Size

66

66

66

66

66

"285" RMA

Core Size

50

50

58

50

50

58

66

50

50

50

"285" is an RMA based core flux that provides wetting action comparable to that of typical RA fluxes. Although

"285" is an RMA-based material, the residues are noncorrosive if not cleaned. "285" is categorized as ROL0 per J-STD-004B.

Part #

24-6337-9703

24-6337-9702

Sn63Pb37

24-6337-9718

“285” RMA Core 1 lb.

Alloy

Sn63Pb37

Sn63Pb37

Diameter

.015

.020

.025

24-6337-9710

Sn63Pb37

24-6337-9713

Sn63Pb37

.031

.031

Core Size

66

66

66

66

58

"275" No-Clean

"275" provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as

ROL0 per J-STD-004B.

Part #

“275” No-Clean Core 1 lb.

Alloy

24-6337-7604

Sn63Pb37

24-6337-7602

Sn63Pb37

Diameter

.015

.020

24-6337-7616

Sn63Pb37

24-6337-7600

Sn63Pb37

24-6337-7612

Sn63Pb37

.025

.031

.050

24-6337-7614

Sn63Pb37 .062

Core Size

50

50

50

50

50

50

Kester Solid Wire

Kester's solid wire solder, without flux core, is manufactured using virgin metals and strict quality control standards. Conforming to IPC/J-STD-006B

Part #

16-6337-0062

16-6337-0125

16-6040-0062

16-6040-0125

Solid Wire 5 lbs.

Alloy

Sn63Pb37

Sn63Pb37

Sn60Pb40

Sn60Pb40

Diameter

.062

.125

.062

.125

Kester “44”

®

Rosin “44” ® is a high activity RA core flux designed for excellent instant wetting action, even on Nickel surfaces.

Although “44”

® is a RA-based material, the residues are non-corrosive if not cleaned. Per J-STD-004B, “44” classified as ROM1 flux.

® is

Part #

24-6337-0007

24-6337-0010

Sn63Pb37

24-6337-0018

“44”

®

RA Core 1 lb.

Alloy

Sn63Pb37

Sn63Pb37

Diameter

.015

.020

.025

24-6337-0027

24-6337-0039

24-6337-0053

Sn63Pb37

Sn63Pb37

Sn63Pb37

24-6337-0061

Sn63Pb37

24-6040-0010

Sn60Pb40

.031

.040

.050

.062

.020

24-6040-0018

Sn60Pb40

24-6040-0027

Sn60Pb40

24-6040-0039

Sn60Pb40

24-6040-0053

Sn60Pb40

24-6040-0061

Sn60Pb40

24-6040-0066

Sn60Pb40

.025

.031

.040

.050

.062

.093

66

66

66

66

66

66

Core Size

66

66

66

66

66

66

66

66

Part #

Solid Wire 1 lb.

Alloy

14-6337-0015

Sn63Pb37

14-6337-0031

Sn63Pb37

14-6337-0062

Sn63Pb37

14-6337-0125

Sn63Pb37

14-6040-0062

Sn60Pb40

14-6040-0125

Sn60Pb40

Diameter

.015

.031

.062

.125

.062

.125

Ultrapure

®

K100LD Lead-Free Solder Bar

K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering, selective soldering, and tip tinning operations. K100LD has the Lowest Copper Dissolution amongst all common solder alloys, including SN63, SAC305, and other lead-free options.

Kester K100LD provides the lowest cost for wave soldering operations. It also provides solder joints with no shrinkage effects, excellent through-hole penetration and topside fillet, and provides a low dross rate.

Kester Part #

04-9574-0050

04-7068-0000

Alloy

K100LD

Sn96.5Ag3.0Cu0.5

Each Bar

1 2/3 lbs.

1 2/3 lbs.

Sold As

25 lbs.

25 lbs.

*Alloys

K100LD

Sn96.5Ag3.0Cu0.5

Sn96.5Ag3.5

Common Lead-Free Alloys

Melt Temperature

~227°C/441°F

217°C/423°F

221°C/430°F

Application

Wave/Hand Soldering

SMT/Hand/Wave

SMT/Hand Soldering

* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of lead-free alloys as specified by individual requirements.

.

Bar Solder

Kester ULTRAPURE

®

Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure

® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure

® far exceeds the requirements of ASTM B32, and IPC/J-STD-006A.

Kester Part # Alloy

04-6337-0050

Sn63Pb37

04-6040-0050

Sn60Pb40

Each Bar

1 2/3 lbs.

1 2/3 lbs.

Sold As

25 lbs.

25 lbs.

Kester Ultra Low Dross

This bar solder is manufactured using the Ultrapure

® process and containing the same metal purity as Kester Ultrapure

®

. Kester Ultra Low Dross is formulated with a special low dross additive that dramatically decreases dross formation on the solder pot.

Kester Part # Alloy

04-6337-0030

Sn63Pb37

Each Bar

1 2/3 lbs.

Sold As

25 lbs.

Kester Solder Analysis Program

Kester's Solder Analysis Program is a prepaid method for rapid response solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements.

Option C: This option includes monitoring tin, antimony, copper, gold, lead, cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel.

Kester Part #

53-0000-0041

Description

Option C

Kester Flo-Bar

Flo-Bar is an extruded 8.5 or 10 lb. bar manufactured specifically for situations where a larger size is more conveniently managed on certain automatic solder feeding systems. Flo-Bar is available in Ultrapure ® grade solder.

and Ultra Low Dross

Kester Part # Alloy

07-6337-1950

Ultrapure

®

Sn63Pb37

Each Bar

8.5 lbs.

07-6337-0050

Ultrapure ® Sn63Pb37 10 lbs.

07-6337-1930 Ultra Low Dross Sn63Pb37 8.5 lbs.

07-6337-0030 Ultra Low Dross Sn63Pb37 10 lbs.

Sold As

42.5 lbs.

50 lbs.

42.5 lbs.

50 lbs.

#5744 Solder Saver

®

A chloride-free, inorganic white powder formulated to remove dross, which is the oxide of solder, from still solder pots and wave soldering machines. It does not decompose to sticky residues that are harder to remove than the original dross. The product is low fuming and is stable at molten solder temperatures.

Kester Part # Description

56-0005-5744 5744 Solder Saver 5 lb.

56-0025-5744 5744 Solder Saver 25 lb.

Additional Flux Materials

Kester Rework Fluxes

Kester's two rework formulas are specifically formulated for PCB rework operations. Kester's No-Clean RF-741 and Water Soluble RF-771 rework fluxes are all that's needed to handle any surface mount or through-hole rework applications. Available only in 30 gram syringe packaging.

Kester Flux Thinners

Selecting the correct thinner for reducing solids or replacing evaporated solvent will result in maximum efficiency of the flux. To select a thinner, find the flux you are using from the chart below:

Thinner

104

110

120

4662

Use with Soldering Flux

1544 Activated Rosin Flux

951 No-Clean Flux

186 Series Rosin Mildly Activated Flux

2331-ZX Organic Water-Soluble Flux

2235 Organic Water-Soluble Flux

2120 Organic Water-Soluble Flux

959 No-Clean Flux

958 No-Clean Flux

Kester Flux Test Kits

Control of the flux concentration in the flux becomes more critical when using a low solids flux. The accuracy problems encountered with automatic specific gravity controllers in conjunction with low-solids "no-clean" fluxes make the flux kit a better alternative for process control. Good control is necessary to assure a consistent amount of flux is applied to the circuit boards, consistent soldering results are obtained, and the least amount of flux residue remains after soldering. Kester PS-20 and PS-22 flux kits provide a simple method for process control.

Kester Part #

57-0000-5025

55-0000-0225

Description

RF-741 No-Clean

RF-771 Water-Soluble

Kester Part #

63-0000-0104

65-0000-0104

63-0000-0110

64-0000-0110

65-0000-0110

63-0000-0120

64-0000-0120

65-0000-0120

63-0000-4662

64-0000-4662

65-0000-4662

Description

104 Flux Thinner

104 Flux Thinner

110 Flux Thinner

110 Flux Thinner

110 Flux Thinner

120 Flux Thinner

120 Flux Thinner

120 Flux Thinner

4662 Flux Thinner

4662 Flux Thinner

4662 Flux Thinner

Packaging

1 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

1 gallon

5 gallon

53 gallon drum

Packaging

30g syringe

30g syringe

Flux Test Kit

PS-20

PS-22

Use With Soldering Flux

959 No-Clean Flux

959T No-Clean Flux

958 No-Clean Flux

979 VOC-Free No-Clean Flux

977 VOC-Free No-Clean Flux

971M VOC-Free No-Clean Flux

951No-Clean Flux

959 No-Clean Flux

979 VOC-Free No-Clean Flux

977 VOC-Free No-Clean Flux

Kester Part #

53-0000-0200

53-0000-0220

Description

PS-20 Flux Test Kit

PS-22 Flux Test Kit

Tacky Soldering Fluxes

Kester Tacky Soldering Fluxes

Kester's TSFs are the industry standard for attachment of spheres to BGA and

µBGA packages. The TSFs are also used in electronics assembly operations to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable of being screen and stencil printed, dot dispensed, or thin film transfer processed.

TSF-6592LV Lead-Free No-Clean

(For Screen Printing/Stencil Printing/Pin Transfer)

TSF-6592LV is compatible with lead and lead-free solder alloys such as SnAg,

SnCu, SnAgCu, SnAgBi, and can be reflowed in nitrogen or air with peak temperatures up to 270ºC. The residues are clear, non-conductive, and non-corrosive.

Kester Part #

300303

300304

300305

Description

TSF-6592LV No-Clean

TSF-6592LV No-Clean

TSF-6592LV No-Clean

Packaging

30g syringe

100g jar

150g cartridge

TSF-6502 No-Clean

(Lower Viscosity for Screen

Printing/Thin Film Deposition)

TSF-6502 is a no-clean tacky soldering flux formula designed for

BGA/CSP/PGA screen printing, sphere/pin processing or for repair and reballing/repinning. It possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of the TSF-6502 will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. TSF-6502 is designed for a wide range of temperature and humid conditions.

Kester Part #

300103

300104

300105

Description

TSF-6502 No-Clean

TSF-6502 No-Clean

TSF-6502 No-Clean

Packaging

30g syringe

100g jar

150g cartridge

TSF-6852 Lead-Free Water Soluble

(For Screen or Stencil Printing)

TSF-6850 is an aggressive synthetic flux with residues that are easily and completely cleaned with water temperatures ranging from 20-65ºC yielding bright, shiny joints. TSF-6852 is a drop-in solution for solder alloys that will have a liquidus up to 300ºC. TSF-6852 also has a 6 month shelf life when stored between 0-25ºC (refrigerated or room temperature).

Kester Part #

300203

300204

300206

Description

TSF-6852 Water-Soluble

TSF-6852 Water-Soluble

TSF-6852 Water-Soluble

Packaging

30g syringe

100g jar

165g cartridge

Solder Masks and Solderforms

®

TC-533 Peelable Solder Mask

This is a high-temperature flexible solder masking compound specially formulated of natural latex rubber. It is extremely versatile as it can be used as a temporary solder mask, conformal coating maskant, and a potting compound mold seal.

TC-527 Hi-Temp Flexible Solder Mask

TC-527 is a high-temperature flexible solder masking compound formulated of natural latex rubber to protect delicate components. The latex is heat stable and tacky enough to be applied to those areas of circuit boards that require masking during a wave soldering process. Can be applied by automatic dip, brush or flow methods, direct from applicator bottle or by automated dispensing machines. It can easily be peeled away without leaving a residue.

Kester Part #

53-4000-0533

53-4001-0533

53-4003-0533

53-4000-0527

53-4001-0527

53-4003-0527

Description

TC-533

TC-533

TC-533

TC-527

TC-527

TC-527

Packaging

½ pint

1 pint

1 gallon

½ pint

1 pint

1 gallon

Solderform ®

Ribbons

Cut-Offs

Washers

Discs

Pellets

Stampings

Width

Thickness

Width

Thickness

Length

Outside Diameter

Inside Diameter

Thickness

Outside Diameter

Thickness

Diameter

Length

Description

Minimum (mm)

0.50 ± 0.13

0.0762 ± 0.03

Maximum (mm)

76.20 ± 0.75

3.18 ± 0.13

0.50 ± 0.13

0.0762 ± 0.03

0.762 ± 0.25

0.889 ± 0.05

0.38 ± 0.05

0.0762 ± 0.03

0.41 ± 0.05

0.0762 ± 0.03

76.20 ± 0.75

3.18 ± 0.13

500 ± 1.25

63.5 ± 0.13

58.42 ± 0.13

6.35 ± 0.25

65 ± 0.05

6.35 ± 0.25

0.254 ± 0.03

0.50 ± 0.13

12.7 ± 0.13

152.4 ± 0.76

Stampings use special dies that are customer specific and require a customer’s engineering drawing and specification.

Kester Solderforms

®

Kester Solderforms ® are stamped, extruded, compacted or formed pieces of pure soft solder alloys manufactured with strict known tolerances to customer specifications.

Kester also creates other preforms such as collars, ribbon forms, rings, and wireforms.

Solderforms ® may be produced as flux cored, solid metal, and with or without a flux coating.

Fluxes available are no-clean, water soluble, RMA, and

RA chemistries. External dyes are also available for identification or to aid in determining the solder melt point.

Technical Data

Category

1

2

If trying to solder to this metal surface:

Platinum, Gold, Copper, Tin,

Solder, Silver

Nickel, Cadmium, Brass,

Lead, Bronze, Rhodium,

Beryllium Copper, Palladium,

Immersion Tin, Immersion Silver

Table 1

Metal Solderability Chart

Solder Paste and

Tacky Soldering Fluxes

All products can solder these metal surfaces.

EniviroMark™ 907, EnviroMark™ 828

Easy Profile ® 256 & 256HA

HydroMark 531, TSF 6592LV,

TSF 6800 Series

Base metal must be plated.

Liquid Fluxes and

Flux-Pen

®

Formulas

All products can solder these metal surfaces.

186, 1544, 2120,

2331-ZX, 2235, 2224-25,

2222, 2220-VF

Cored Wire

All products can solder these metal surfaces.

44, 48, 331, OR-421

3

4

Nickel-Iron, Kovar

Zinc, Mild Steel, Chromium,

Inconel, Monel, Stainless Steel

Base metal must be plated.

2222, 2220-VF

Call Kester's Customer Service

Department

48, 331, OR-421

EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of the products listed in Category 2, 3, or 4 since Beryllium Copper requires more active products than Tin.

EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, you could use any of Kester's products (Category 1, 2, 3, or 4).

48

WEIGHTS AND MEASURES

COMMON CONVERSIONS

To Change

Gallons (US)

Quarts (liquid)

Pounds (avdp.)

To

Liters

Liters

Grams

Multiply By:

3.7853

0.9463

453.592

Pounds (avdp.) Kilograms

Pounds (avdp.) Ounce (troy)

0.4536

14.5833

Ounces (avdp.) Grams 28.3495

Celsius = 5/9 (F-32) Fahrenheit = 9/5 (C) + 32

FORMULA FOR ADDING TIN TO

TIN-LEAD SOLDER POTS

Tin can be added to solder to replace tin lost by oxidation. The pot temperature should be at least 460°F. Tin bars should be added slowly and the solder should be mixed well.

T =

W(A - B)

(100 - A)

EXAMPLE

900 (63 - 61.6) 1260 34 lbs. of

(100 - 63) 37 Tin to add

T = Pounds of Tin to add W = Pounds of solder on pot

A = Percentage of Tin desired B = Percentage of Tin in pot

Please visit www.kester.com and click on Lead-Free Solutions™ for a worksheet to balance Lead-Free alloy systems.

800 West Thorndale Avenue

Itasca, IL 60143-1341

Phone: (+1) 630-616-4000

Fax: (+1) 630-616-4044

Email: [email protected]

Customer Service

Phone: 800-2-KESTER

Fax: (+1) 630-616-4044

Zum Plom 5

08541 Neuensalz

Germany

Phone: (+49) 3741 4233-0

Fax: (+49) 3741 4233-111

Email: [email protected]

500 Chai Chee Lane

Singapore 4690224

Phone: (+65) 6 449-1133

Fax: (+65) 6 242-9036

Email: [email protected]

Mexico

Carretera Internacional Km. 6.5

Esquina Boulevard del Castillo

Parque Industrial

Nogales, Son. 84000

Mexico

For customer service call the

Global Headquarters facility

Taiwan

4th Floor, No. 128

Lane 235

Pao-Chiao Road

Hsien-Tien City

Taipei Hsien, Taiwan

Tel: (+886) 2-8912-1066

Fax: (+886) 2-8912-1072

Email: [email protected]

J

OHOR

B

AHRU

, M

ALAYSIA

PLO 113, Fasa 3

Kawasan Perindustria Senai

81400 Senai, Johor, Malaysia

Tel: (+60) 7-598-4113

Fax: (+60) 7-598-3103

Japan

20-11 YokoKawa 2-Chome,

Sumida-ku

Tokyo 130, Japan

Tel: (+81) 3-3624-5351

Fax (+81) 3-3626-6253

Email: [email protected]

Kester Vision Statement

Smart Products.

Great Service.

No Boundaries.

Kester will be the leading global supplier of high performance interconnecting materials and related services for the electronic assembly and component assembly markets.

To achieve this we will focus on customer-driven innovation and exceptional service worldwide.

Revised 3.31.10

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