datasheet for 54F163/B2A by Rochester Electronics

datasheet for 54F163/B2A by Rochester Electronics
INCH-POUND
MIL-M-38510/343B
7 April 2004
__
SUPERSEDING
MIL-M-38510/343A
21 September 1989
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL,
BINARY COUNTERS, MONOLITHIC SILICON
Reactivated after 7 April 2004 and may be used for either new or existing design acquisition.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, advanced Schottky TTL, binary
counter microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided
for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have
been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Circuit
Device type
01
02
03
04
Synchronous 4 - bit binary counter (asynchronous master reset)
Synchronous 4 - bit binary counter (synchronous reset)
Synchronous 4 - bit up/down binary counter (with mode control)
Synchronous 4 - bit up/down binary counter
(asynchronous master reset)
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
X
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC2-N20
20
CQCC1-N20
20
Terminals
Package style
16
Dual-in-line
16
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed
to [email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
FSC 5962
MIL-M-38510/343B
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
Input voltage range ................................................................................
Storage temperature range ....................................................................
Maximum power dissipation, per device (PD) 1/
Device types 01, 02, 03, 04 ..............................................................
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC): .............................................
Junction temperature (TJ) 2/ ...................................................................
-0.5 V dc to +7.0 V dc
-1.2 V dc at -18 mA to +7.0 V dc
-65° to +150°C
303 mW
+300°C
(See MIL-STD-1835)
175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) .............................................................................. 4.5 V dc minimum to
5.5 V dc maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc
Maximum low level input voltage (VIL) .................................................... 0.8 V dc
Normalized fanout (each output) 3/
Low logic level .................................................................................. 33 maximum
High logic level ................................................................................. 50 maximum
Case operating temperature range (TC) ................................................. -55° to +125°C
Width of clock pulse, high ( PE = High)
Device types 01, 02 .......................................................................... 9.0 ns minimum
Width of clock pulse, high ( PE = Low)
Device types 01, 02 .......................................................................... 7.0 ns minimum
Width of clock pulse, low ( PE = High)
Device types 01, 02 .......................................................................... 8.0 ns minimum
Width of clock pulse, low ( PE = Low)
Device types 01, 02 .......................................................................... 9.0 ns minimum
Width of master reset pulse, low ( MR = low)
Device type 01 ................................................................................. 9.5 ns minimum
Width of PL pulse low:
Device type 03 .................................................................................
Device type 04 .................................................................................
Width of clock pulse low:
Device type 03 .................................................................................
Width of CPU or CPD pulse low
Device type 04 .................................................................................
Width of master reset pulse, high ( MR = high)
Device type 04 .................................................................................
Width of CPU or CPD pulse, low (change of direction)
Device type 04 .................................................................................
Setup time Pn high to clock pulse
Device types 01, 02 ..........................................................................
Setup time Pn low to clock pulse
Device types 01, 02 ..........................................................................
8.5 ns minimum
7.5 ns minimum
7.0 ns minimum
7.0 ns minimum
6.0 ns minimum
12.0 ns minimum
5.5 ns minimum
5.5 ns minimum
Setup time PE or SR high to clock pulse
Device types 01, 02 .......................................................................... 13.5 ns minimum
Setup time PE or SR low to clock pulse
Device types 01, 02 .......................................................................... 10.5 ns minimum
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ The device shall fanout in both high and low levels to the specified number of inputs of the same device
type as that being tested.
2
MIL-M-38510/343B
Setup time CEP or CET high to clock pulse
Device types 01, 02 .......................................................................... 13.0 ns minimum
Setup time CEP or CET low to clock pulse
Device types 01, 02 .......................................................................... 7.5 ns minimum
Setup time U / D high to clock pulse
Device type 03 ................................................................................. 12.0 ns minimum
Setup time U / D low to clock pulse
Device type 03 ................................................................................. 12.0 ns minimum
Setup time Pn high to PL
Device types 03, 04 .......................................................................... 6.0 ns minimum
Setup time Pn low to PL
Device types 03, 04 .......................................................................... 6.0 ns minimum
Setup time CE low to clock pulse
Device type 03 ................................................................................. 10.5 ns minimum
Hold time Pn high to clock pulse
Device types 01, 02 .......................................................................... 2.5 ns minimum
Hold time Pn low to clock pulse
Device types 01, 02 .......................................................................... 2.5 ns minimum
Hold time PE or SR high to clock pulse
Device types 01, 02 .......................................................................... 2.0 ns minimum
Hold time PE or SR low to clock pulse
Device types 01, 02 .......................................................................... 0.0 ns minimum
Hold time CEP or CET high to clock pulse
Device types 01, 02 .......................................................................... 2.0 ns minimum
Hold time CEP or CET low to clock pulse
Device types 01, 02 .......................................................................... 2.0 ns minimum
Hold time Pn low to PL
Device types 03, 04 .......................................................................... 2.0 ns minimum
Hold time U / D high to clock pulse
Device type 03 ................................................................................. 0.0 ns minimum
Hold time U / D low to clock pulse
Device type 03 ................................................................................. 0.0 ns minimum
Hold time CE low to clock pulse
Device type 03 ................................................................................. 0.0 ns minimum
Recovery time master reset to clock pulse
Device type 01 ................................................................................. 6.0 ns minimum
Recovery time PL to clock pulse
Device type 03 ................................................................................. 7.5 ns minimum
Recovery time master reset to CPU or CPD
Device type 04 ................................................................................. 4.5 ns minimum
Recovery time PL to CPU or CPD
Device type 04 ................................................................................. 8.0 ns minimum
3
MIL-M-38510/343B
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figures 1.
3.3.2 Logic diagram. The logic diagram shall be as specified on figure 2.
3.3.3 Truth table. The truth table shall be as specified on figure 3.
3.3.4 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
4
MIL-M-38510/343B
3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 12 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 shall be omitted.
c. Subgroups 7 and 8 shall verify the truth tables herein.
5
MIL-M-38510/343B
TABLE I. Electrical performance characteristics.
Test
High level output voltage
Symbol
VOH
Conditions
Device
-55°C ≤ TC ≤ +125°C
type
VCC = 4.5 V, VIL = 0.8 V,
All
Limits
Min
Unit
Max
2.5
V
IOH = -1.0 mA, VIH = 2.0 V
Low level output voltage
VOL
VCC = 4.5 V, IOL = 20 mA,
Input clamp voltage
VI C
VCC = 4.5 V, IIN = -18 mA,
All
0.5
V
All
-1.2
V
40
µA
VIH = 2.0 V, VIL = 0.8 V
TC = 25°C
High level input current
Low level input current
IIH1
VCC = 5.5 V, VIN = 2.7 V
01, 02
03, 04
20
IIH2
VCC = 5.5 V, VIN = 7.0 V
All
100
IIL1
VCC = 5.5 V, VIL = 0.5 V
01, 02
03, 04
IIL2
VCC = 5.5 V, VIL = 0.5 V
01, 02
03, 04
-0.0
-.03
-0.0
-.09
-0.6
µA
mA
-0.6
-1.2
mA
-1.8
Short circuit output current 1/
IOS
VCC = 5.5 V, VOS = 0.0 V
All
Supply current
ICC
VCC = 5.5 V
All
Maximum count frequency
fMAX
VCC = 5.0 V
All
Propagation delay time,
tPLH1
VCC = 5.0 V, CL = 50 pF ± 10%,
03
3.0
9.5
ns
CP to Qn
-60
-150
mA
55
mA
70
MHz
See figure 4
CP to Qn
tPHL1
03
5.0
13.5
ns
CPU, CPD to Qn
tPLH1
04
3.0
10.0
ns
CPU, CPD to Qn
tPHL1
04
5.5
14.0
ns
CP to Qn, PE = (high)
tPLH1
01, 02
2.0
9.0
ns
CP to Qn, PE = (high)
tPHL1
01, 02
3.5
11.5
ns
CP to TC
tPLH2
03
5.0
16.5
ns
CP to TC
tPHL2
03
4.5
13.5
ns
CPU to TCU
tPLH2
04
2.5
10.5
ns
CPU to TCU
tPHL2
04
3.0
9.5
ns
1/ Not more than one output should be shorted at a time.
6
MIL-M-38510/343B
TABLE I. Electrical performance characteristics.
Test
Propagation delay time,
Symbol
tPLH3
Conditions
Device
-55°C ≤ TC ≤ +125°C
type
VCC = 5.0 V, CL = 50 pF ± 10%,
Limits
Unit
Min
Max
04
4.0
13.5
ns
See figure 4
PL to Qn
PL to Qn
tPHL3
04
5.0
15.0
ns
CPD to TCD
tPLH4
04
2.5
10.5
ns
CPD to TCD
tPHL4
04
3.0
9.5
ns
CP to Qn, PE = (low)
tPLH2
01, 02
2.0
10.0
ns
CP to Qn, PE = (low)
tPHL2
01, 02
3.0
10.0
ns
CP to RC
tPLH3
03
3.0
11.5
ns
CP to RC
tPHL3
03
3.0
12.5
ns
CP to TC
tPLH3
01, 02
4.5
16.5
ns
CP to TC
tPHL3
01, 02
4.0
18.5
ns
Pn to Qn
tPLH4
03
2.0
9.0
ns
Pn to Qn
tPHL4
03
6.0
16.0
ns
Pn to Qn
tPLH5
04
1.5
8.5
ns
Pn to Qn
tPHL5
04
6.0
16.5
ns
CET to TC
tPLH4
01, 02
2.5
9.0
ns
CET to TC
tPHL4
01, 02
2.5
9.0
ns
CE to RC
tPLH5
03
3.0
9.0
ns
CE to RC
tPHL5
03
3.0
9.0
ns
MR to Qn
tPHL5
01
5.5
14.0
ns
MR to TC
tPHL6
01
4.5
14.0
ns
PL to Qn
tPLH6
03
5.0
13.0
ns
PL to Qn
tPHL6
03
5.5
14.5
ns
7
MIL-M-38510/343B
TABLE I. Electrical performance characteristics.
Test
Propagation delay time,
Symbol
tPLH6
Conditions
Device
-55°C ≤ TC ≤ +125°C
type
VCC = 5.0 V, CL = 50 pF ± 10%,
Limits
Unit
Min
Max
04
5.0
15.0
ns
See figure 4
MR to TCU
MR to TCD
tPHL6
04
5.0
16.0
ns
U / D to RC
tPLH7
03
7.0
22.5
ns
U / D to RC
tPHL7
03
5.5
14.0
ns
MR to Qn
tPHL11
04
5.0
16.0
ns
U / D to TC
tPLH8
03
4.0
13.5
ns
U / D to TC
tPHL8
03
4.0
12.5
ns
PL to TCU
tPLH7
04
6.0
18.5
ns
PL to TCU
tPHL7
04
6.0
17.5
ns
PL to TCD
tPLH8
04
6.0
18.5
ns
PL to TCD
tPHL8
04
6.0
17.5
ns
Pn to TCU
tPLH9
04
5.0
16.5
ns
Pn to TCU
tPHL9
04
4.5
16.5
ns
Pn to TCD
tPLH10
04
5.0
16.5
ns
Pn to TCD
tPHL10
04
4.5
16.5
ns
MR to Qn
tPHL11
04
5.0
16.0
ns
8
MIL-M-38510/343B
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
1
1
MIL-PRF-38535
test requirements
Interim electrical parameters
Final electrical test parameters
Group A test requirements
Group B electrical test parameters
when using the method 5005 QCI option
Group C end-point electrical parameters
Group D end-point electrical parameters
1*, 2, 3, 7,
9, 10, 11
1, 2, 3, 7,
8, 9, 10, 11
1, 2, 3, 7,
8, 9, 10, 11
1, 2, 3, 7,
8, 9, 10, 11
1, 2, 3
1*, 2, 3, 7, 9
1, 2, 3, 7,
8, 9, 10, 11
N/A
1, 2, 3
1, 2, 3
*PDA applies to subgroup 1.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be
as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional and positive when flowing into the referenced terminal.
9
MIL-M-38510/343B
Device type 01
Device type 2
Device type 03
Device type 04
Terminal
number
Case
E and F
Case
X and 2
Case
E and F
Case
X and 2
Case
E and F
Case
X and 2
Case
E and F
Case
X and 2
1
MR
NC
SR
NC
P1
NC
P1
NC
2
CP
MR
CP
SR
Q1
P1
Q1
P1
3
P0
CP
P0
CP
Q0
Q1
Q0
Q1
4
P1
P0
P1
P0
CE
Q0
CPD
Q0
5
P2
P1
P2
P1
U/D
CE
CPU
CPD
6
P3
NC
P3
NC
Q2
NC
Q2
NC
7
CEP
P2
CEP
P2
Q3
U/D
Q3
CPU
8
GND
P3
GND
P3
GND
Q2
GND
Q2
9
PE
CEP
PE
CEP
P3
Q3
P3
Q3
10
CET
GND
CET
GND
P2
GND
P2
GND
11
Q3
NC
Q3
NC
PL
NC
PL
NC
12
Q2
PE
Q2
PE
TC
P3
TCU
P3
13
Q1
CET
Q1
CET
RC
P2
TCD
P2
14
Q0
Q3
Q0
Q3
CP
PL
MR
PL
15
TC
Q2
TC
Q2
P0
TC
P0
TCU
16
VCC
NC
VCC
NC
VCC
NC
VCC
NC
17
Q1
Q1
RC
TCD
18
Q0
Q0
CP
MR
19
TC
TC
P0
P0
20
VCC
VCC
VCC
VCC
FIGURE 1. Terminal connections.
10
MIL-M-38510/343B
Device types 01 and 02
FIGURE 2. Logic diagram.
11
MIL-M-38510/343B
Device type 03
FIGURE 2. Logic diagram - Continued.
12
MIL-M-38510/343B
FIGURE 2. Logic diagram - Continued.
13
MIL-M-38510/343B
Device types 01 and 02
Mode select table
* SR
PE
CET
CEP
L
H
H
H
H
X
L
H
H
H
X
X
H
L
X
X
X
H
X
L
Action on the rising clock
edge ( )
Reset (clear)
Load (Pn - Qn)
Count (increment)
No change (hold)
No change (hold)
* For F163A only
H = High voltage level
L = Low voltage level
X = Immaterial
Device type 03
Mode select table
RC truth table
Inputs
PL
CE
U/D
H
H
L
H
L
L
X
H
L
H
X
X
CP
Mode
X
X
Count up
Count down
Preset (asyn)
No change (hold)
CE
Inputs
TC*
CP
Output
RC
L
H
X
H
X
L
X
X
H
H
*TC is generated internally
H = High voltage level
L = Low voltage level
X = Immaterial
= Transition from low to high level
= One low level pulse
Device type 04
Function table
MR
H
L
L
L
L
PL
X
L
H
H
H
CPU
CPD
X
X
H
X
X
H
H
H
H = High voltage level
L = Low voltage level
X = Immaterial
= Transition from low to high level
FIGURE 3. Truth table.
14
Mode
Reset (asyn)
Preset (asyn)
No change
Count up
Count down
MIL-M-38510/343B
NOTES:
1. T1 = T0 ≤ 2.5 ns, PRR ≤ 1 MHz, ZOUT ≈ 50Ω.
2. Inputs not under test should be biased per table III.
3. CL = 50 pF ±10% including scope probe, wiring, and stray capacitance without package in test fixture.
4. R1 = 499Ω ±5%.
5. Voltage measurements are to be made with respect to network ground terminal.
FIGURE 4. Switching time waveform.
15
MIL-M-38510/343B
VOLTAGE WAVEFORMS
FIGURE 4. Switching time test circuit and waveforms for device types 01 and 02 - Continued.
16
MIL-M-38510/343B
NOTE: The data pulse generator has the following characteristics: Vgen = 3.0 V, tr ≤ 2.5 ns, tf ≤ 2.5 ns, tDATA = 8.0
ns, tSETUP = 5.5 ns, tHOLD = 2.5 ns, tP(CLOCK) = 7.0 ns.
FIGURE 4. Switching time test circuit and waveforms for device types 01 and 02 - Continued.
17
MIL-M-38510/343B
FIGURE 4. Switching time test circuit and waveforms for device type 01 - Continued.
18
MIL-M-38510/343B
FIGURE 4. Switching time test circuit and waveforms for device type 03 - Continued.
19
MIL-M-38510/343B
FIGURE 4. Switching time waveforms - Continued.
20
MIL-M-38510/343B
FIGURE 4. Switching time test circuit and waveforms for device type 04 - Continued.
21
MIL-M-38510/343B
FIGURE 4. Switching time test circuit and waveforms for device type 04 - Continued.
22
MIL-M-38510/343B
FIGURE 4. Switching time waveforms - Continued.
23
TABLE III. Group A inspection for device type 01.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
CP
P0
P1
P2
PE
0.8 V
"
"
"
0.0 V
"
"
"
"
"
CET
Q3
Q2
Q1
Q0
TC
5.5 V
"
"
"
2.0 V
5.5 V
"
"
"
0.8 V
-1.0 mA
Test no.
1
Tc = 25°C
VOH
1
2
3
4
5
6
7
8
9
10
11
"
"
"
"
"
"
"
12
13
14
15
16
17
18
"
3010
19
20
"
"
"
"
"
"
"
21
22
23
24
25
26
27
"
"
28
29
"
"
"
"
"
"
"
30
31
32
33
34
35
36
IIL1
"
3009
37
38
IIL2
"
"
"
"
"
"
"
39
40
41
42
43
44
45
"
46 4/
VOL
VI C
IIH1
24
IIH2
MR
2/
"
"
"
"
5.5 V
"
"
"
"
-18 mA
2/
"
"
"
"
"
"
"
"
"
P3
CEP
GND
2.0 V
5.5 V
"
"
"
"
"
"
"
"
"
GND
"
"
"
"
"
"
"
"
"
"
2.0 V
2.0 V
2.0 V
5.5 V
5.5 V
5.5 V
5.5 V
0.8 V
0.8 V
0.8 V
0.8 V
5.5 V
5.5 V
5.5 V
5.5 V
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
"
"
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
"
"
"
"
"
"
"
"
"
0.5 V
0.5 V
-1.0 mA
-1.0 mA
20 mA
20 mA
20 mA
20 mA
20 mA
-18 mA
0.0 V
2.7 V
0.0V
0.0 V
0.0 V
2.7 V
0.0 V
7.0 V
0.0 V
0.0 V
0.0 V
7.0 V
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.5 V
5.5 V
"
"
"
"
"
"
"
0.0 V
"
"
"
5.5 V
0.5 V
5.5 V
5.5 V
"
"
"
"
"
"
"
5.5 V
"
5.5 V
0.5 V
"
0.5 V
0.5 V
0.5 V
0.5 V
See footnotes at end of table III.
"
"
"
"
"
"
"
-1.0 mA
"
"
"
"
"
"
"
-18 mA
"
"
2.7 V
5.5 V
"
"
"
"
"
"
"
-1.0 mA
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
Limits
Min
Q3
Q2
Q1
Q0
TC
Q3
Q2
Q1
Q0
TC
0.5
"
"
"
"
-1.2
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
40
"
µA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
100
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3/
"
3/
"
mA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
PE
CET
MR
CP
P0
P1
P2
P3
CEP
PE
CET
MR
CP
P0
P1
P2
P3
CEP
PE
CET
PE
CET
Max
2.5
"
"
"
"
MR
CP
P0
P1
P2
P3
CEP
MR
CP
P0
P1
P2
P3
CEP
Unit
MIL-M-38510/343B
3006
"
"
"
"
3007
"
"
"
"
3022
Measured
terminal
TABLE III. Group A inspection for device type 01 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
PE
0.0 V
"
"
"
"
5.5 V
CET
Q3
Q2
Q1
Q0
TC
5.5 V
"
"
"
"
"
0.0 V
IOS
25
See footnotes at end of table III.
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
A
"
"
"
"
0.0 V
0.0 V
0.0 V
0.0 V
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
"
"
L
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
L
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
L
"
"
L
"
"
"
H
"
"
"
L
"
"
"
H
"
"
"
"
"
"
L
"
"
"
H
"
"
"
L
"
"
"
H
"
"
"
"
"
"
"
"
"
L
"
"
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
"
"
"
"
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
"
"
"
"
"
"
"
L
"
"
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
L
"
"
"
"
H
H
L
"
"
VCC
5.5 V
"
"
"
"
"
Q3
Q2
Q1
Q0
TC
VCC
6/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Limits
Min
Max
-60
"
"
"
"
-150
"
"
"
"
55
Unit
mA
"
"
"
"
"
MIL-M-38510/343B
CP
P0
P1
P2
P3
CEP
GND
Test no.
MR
3011
47
2/
2/
5.5 V
5.5 V
GND
"
48
"
"
5.5 V
"
"
"
49
"
"
5.5 V
"
"
"
50
"
"
5.5 V
"
"
"
51
"
"
5.5 V
5.5 V
5.5 V
5.5 V
"
"
I CC1
3005
52
5.5 V
5.5 V
0.0 V
0.0 V
0.0 V
0.0 V
"
"
2
Same tests, terminal conditions, and limits as subgroup 1, except TC = +125°C and VI C tests are omitted.
3
Same tests, terminal conditions, and limits as subgroup 1, except TC = -55°C and VI C tests are omitted.
7
Func3014
53
B
B
B
B
B
B
B
GND
"
54
A
B
"
"
"
"
A
"
Tc = 25°C tional
test
"
55
"
A
"
"
"
"
"
"
6/
"
56
"
B
"
"
"
"
"
"
"
57
"
A
"
"
"
"
"
"
"
58
"
B
"
"
"
"
"
"
"
59
"
A
"
"
"
"
"
"
"
60
"
B
"
"
"
"
"
"
"
61
"
A
"
"
"
"
"
"
"
62
"
B
"
"
"
"
"
"
"
63
"
A
"
"
"
"
"
"
"
64
"
B
"
"
"
"
"
"
"
65
"
A
"
"
"
"
"
"
"
66
"
B
"
"
"
"
"
"
"
67
"
A
"
"
"
"
"
"
"
68
"
A
"
"
"
"
B
"
"
69
"
B
"
"
"
"
"
"
"
70
"
A
"
"
"
"
"
"
"
71
"
B
"
"
"
"
A
"
"
72
"
A
"
"
"
"
"
"
"
73
"
B
"
"
"
"
"
"
"
74
"
A
"
"
"
"
"
"
"
75
"
B
"
"
"
"
"
"
"
76
"
A
"
"
"
"
"
"
"
77
"
B
"
"
"
"
"
"
"
78
"
A
"
"
"
"
"
"
"
79
"
B
"
"
"
"
"
"
"
80
"
A
"
"
"
"
"
"
"
81
"
B
"
"
"
"
"
"
"
82
"
A
"
"
"
"
"
"
"
83
"
B
"
"
"
"
"
"
"
84
"
A
"
"
"
"
"
"
"
85
"
B
"
"
"
"
"
"
"
86
"
A
"
"
"
"
"
"
"
87
"
B
"
"
"
"
"
"
"
88
"
B
"
"
"
"
"
"
"
89
"
A
"
"
"
"
"
"
"
90
"
B
"
"
"
"
"
"
"
91
"
A
"
"
"
"
"
"
"
92
"
B
"
"
"
"
"
"
"
93
"
B
"
"
"
"
"
"
"
94
"
A
"
"
"
"
"
"
"
95
"
A
"
"
"
"
"
"
"
96
"
B
A
A
A
A
"
"
1
Tc = 25°C
Measured
terminal
TABLE III. Group A inspection for device type 01 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
P1
P2
P3
CEP
GND
Q3
Q2
Q1
Q0
TC
VCC
A
"
"
"
"
B
B
A
A
A
"
"
"
"
B
B
A
A
A
A
"
"
"
B
B
A
A
GND
"
"
"
"
"
"
"
"
PE
B
"
"
"
"
"
"
"
"
CET
A
"
"
"
"
B
B
A
A
A
"
"
"
"
"
"
"
"
H
H
L
L
H
H
L
L
H
H
H
L
L
H
H
L
L
H
H
H
L
L
H
H
L
L
H
H
H
L
L
H
H
L
L
H
H
H
L
L
H
H
L
L
H
6/
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
2.7 V
2.7 V
0.0 V
0.0 V
0.0 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
IN
IN
2.7 V
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Q0
Q1
Q2
Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to TC
CP to TC
CET to TC
CET to TC
"
"
"
"
"
"
"
"
2.7 V
"
"
"
"
2.7 V
"
"
"
"
CP
P0
Test no.
MR
3014
97
A
A
A
"
98
"
B
"
"
99
B
"
"
"
100
A
"
"
"
101
"
A
"
"
102
"
B
B
"
103
"
A
B
"
104
"
B
A
"
105
"
A
A
8
Repeat subgroup 7 tests, at Tc = 125°C and TC = -55°C.
9
fMAX
3003
106
2.7 V
IN
Fig. 4
107
"
"
TC = 25°C 7/ 9/
"
108
"
"
"
109
"
"
tPLH1
"
110 8/
"
"
"
111 "
"
"
"
112 "
"
"
"
113 "
"
"
tPHL1
"
114 "
"
"
"
115 "
"
"
"
116 "
"
"
"
117 "
"
"
tPLH2
"
118 "
"
"
"
119 "
"
"
"
120 "
"
"
"
121 "
"
"
tPHL2
"
122 "
"
"
"
123 "
"
"
"
124 "
"
"
"
125 "
"
"
tPLH3
"
126
2.7 V
IN
2.7 V
tPHL3
"
127
"
IN
"
tPLH4
"
128
"
0.0 V
"
tPHL4
"
129
"
2.7 V
"
tPHL5
"
130
IN
0.0 V
"
7
FuncTc = 25°C tional
test
3/
26
tPHL6
10
11
"
131
"
"
"
132
"
"
"
133
"
"
"
134
"
"
2.7 V
"
"
"
2.7 V
"
"
"
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and use limits from table I.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
See footnotes at end of table III.
.
2.7 V
"
"
"
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
"
"
"
OUT
OUT
"
OUT
"
OUT
"
OUT
"
Measured
terminal
Limits
Min
MR to Q0
MR to Q1
MR to Q2
MR to Q3
MR to TC
Unit
Max
90
"
"
"
2.0
"
"
"
3.5
"
"
"
2.5
"
"
"
4.0
"
"
"
4.5
4.0
2.5
2.5
5.5
7.5
"
"
"
10.0
"
"
"
8.5
"
"
"
"
"
"
"
14.0
16.0
7.5
7.5
12.0
MHz
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
4.5
11.5
"
MIL-M-38510/343B
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 02.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
CP
P0
P1
P2
P3
CET
Q3
Q2
Q1
Q0
TC
2/
"
"
"
"
"
"
"
"
"
2.0 V
Test no.
1
Tc = 25°C
VOH
VOL
VI C
27
IIH2
IIL1
IIL2
1
2
3
4
5
6
7
8
9
10
11
2.0 V
5.5 V
"
"
"
"
"
"
"
"
-18 mA
"
"
"
"
"
"
"
12
13
14
15
16
17
18
"
3010
19
20
"
"
"
"
"
"
"
21
22
23
24
25
26
27
2.7 V
"
"
28
29
2/
"
"
"
"
"
"
"
30
31
32
33
34
35
36
7.0 V
"
3009
"
"
"
"
"
"
37
38
39
40
41
42
43
44
2/
0.5 V
"
45
"
46 4/
CEP
GND
0.8 V
GND
"
"
"
"
"
"
"
"
"
"
2.0 V
2.0 V
5.5 V
0.8 V
5.5 V
5.5 V
2.0 V
5.5 V
0.8 V
0.8 V
5.5 V
5.5 V
5.5 V
0.8 V
5.5 V
5.5 V
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
0.0 V
0.0 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
0.0 V
0.0 V
See footnotes at end of table III.
5.5 V
5.5 V
20 mA
20 mA
20 mA
0.8 V
20 mA
"
"
"
"
"
"
"
-18 mA
0.0 V
2.7 V
0.0V
0.0 V
0.0 V
2.7 V
0.0 V
7.0 V
0.0 V
0.0 V
0.0 V
7.0 V
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.5 V
5.5 V
5.5 V
5.5 V
5.5 V
"
0.5 V
5.5 V
"
5.5 V
"
2/
0.5 V
"
0.5 V
5.5 V
-1.0 mA
20 mA
0.0 V
"
"
"
5.5 V
5.5 V
0.5 V
5.5 V
"
"
"
"
"
"
"
-1.0 mA
-1.0 mA
2.0 V
"
"
"
"
"
"
"
"
0.5 V
2/
"
"
-1.0 mA
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.5 V
0.5 V
"
"
"
"
"
"
"
-1.0 mA
-18 mA
"
"
2.7 V
5.5 V
"
"
"
"
"
"
"
PE
0.8 V
"
"
"
0.0 V
"
"
"
"
"
Limits
Min
Q3
Q2
Q1
Q0
TC
Q3
Q2
Q1
Q0
TC
0.5
"
"
"
"
-1.2
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
40
"
µA
20
"
"
"
"
"
40
"
"
"
"
"
"
"
40
100
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3/
"
"
"
"
"
"
"
3/
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
"
PE
CET
SR
CP
P0
P1
P2
P3
CEP
PE
CET
SR
CP
P0
P1
P2
P3
CEP
SR
PE
CET
Max
2.5
"
"
"
"
SR
CP
P0
P1
P2
P3
CEP
PE
CET
CP
P0
P1
P2
P3
CEP
Unit
MIL-M-38510/343B
IIH1
SR
3006
"
"
"
"
3007
"
"
"
"
3022
Measured
terminal
TABLE III. Group A inspection for device type 02 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
CP
P0
P1
P2
P3
CEP
GND
CET
Q3
Q2
Q1
Q0
TC
Test no.
1
Tc = 25°C
SR
IOS
See footnotes at end of table III.
PE
0.0 V
"
"
"
"
5.5 V
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
0.0 V
0.0 V
0.0 V
0.0 V
5.5 V
5.5 V
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
A
"
"
"
"
0.0 V
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
"
"
L
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
L
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
L
"
"
L
"
"
"
H
"
"
"
L
"
"
"
H
"
"
"
"
"
"
L
"
"
"
H
"
"
"
L
"
"
"
H
"
"
"
"
"
"
"
"
"
L
"
"
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
"
"
"
"
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
"
"
"
"
"
"
"
L
"
"
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
L
"
"
"
"
H
H
L
"
"
VCC
5.5 V
"
"
"
"
"
Q3
Q2
Q1
Q0
TC
VCC
6/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Limits
Min
Max
-60
"
"
"
"
-150
"
"
"
"
55
Unit
mA
"
"
"
"
"
MIL-M-38510/343B
28
3011
47
5.5 V
2/
5.5 V
GND
"
48
"
"
5.5 V
"
"
49
"
"
5.5 V
"
"
50
"
"
5.5 V
"
"
51
"
"
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
"
I CC
3005
52
5.5 V
5.5 V
0.0 V
0.0 V
0.0 V
0.0 V
5.5 V
"
2
Same tests, terminal conditions, and limits as subgroup 1, except TC = +125°C and VI C tests are omitted.
3
Same tests, terminal conditions, and limits as subgroup 1, except TC = -55°C and VI C tests are omitted.
7
Func3014
53
B
2/
B
B
B
B
B
GND
"
54
A
B
"
"
"
"
A
"
Tc = 25°C tional
test
"
55
"
A
"
"
"
"
"
"
5/
"
56
"
B
"
"
"
"
"
"
"
57
"
A
"
"
"
"
"
"
"
58
"
B
"
"
"
"
"
"
"
59
"
A
"
"
"
"
"
"
"
60
"
B
"
"
"
"
"
"
"
61
"
A
"
"
"
"
"
"
"
62
"
B
"
"
"
"
"
"
"
63
"
A
"
"
"
"
"
"
"
64
"
B
"
"
"
"
"
"
"
65
"
A
"
"
"
"
"
"
"
66
"
B
"
"
"
"
"
"
"
67
"
A
"
"
"
"
"
"
"
68
"
A
"
"
"
"
B
"
"
69
"
B
"
"
"
"
"
"
"
70
"
A
"
"
"
"
"
"
"
71
"
B
"
"
"
"
A
"
"
72
"
A
"
"
"
"
"
"
"
73
"
B
"
"
"
"
"
"
"
74
"
A
"
"
"
"
"
"
"
75
"
B
"
"
"
"
"
"
"
76
"
A
"
"
"
"
"
"
"
77
"
B
"
"
"
"
"
"
"
78
"
A
"
"
"
"
"
"
"
79
"
B
"
"
"
"
"
"
"
80
"
A
"
"
"
"
"
"
"
81
"
B
"
"
"
"
"
"
"
82
"
A
"
"
"
"
"
"
"
83
"
B
"
"
"
"
"
"
"
84
"
A
"
"
"
"
"
"
"
85
"
B
"
"
"
"
"
"
"
86
"
A
"
"
"
"
"
"
"
87
"
B
"
"
"
"
"
"
"
88
"
B
"
"
"
"
"
"
"
89
"
A
"
"
"
"
"
"
"
90
"
B
"
"
"
"
"
"
"
91
"
A
"
"
"
"
"
"
"
92
"
B
"
"
"
"
"
"
"
93
"
B
"
"
"
"
"
"
"
94
"
A
"
"
"
"
"
"
"
95
"
A
"
"
"
"
"
"
"
96
"
B
A
A
A
A
"
"
Measured
terminal
TABLE III. Group A inspection for device type 02 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STDSubgroup Symbol
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
CP
P0
P1
P2
P3
CEP
7
FuncTc = 25°C tional
test
3014
"
"
Test no.
SR
See footnotes at end of table III.
CET
Q3
Q2
Q1
Q0
TC
VCC
GND
"
"
"
"
"
"
"
"
"
GND
B
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
H
"
"
L
L
H
H
L
L
H
H
"
"
L
L
H
H
L
L
H
H
"
"
L
L
H
H
L
L
H
H
"
"
L
L
H
H
L
L
H
H
"
"
L
L
H
H
L
L
H
6/
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
2/
2.7 V
0.0 V
0.0 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
2.7 V
2.7 V
IN
IN
OUT
"
"
"
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Q0
Q1
Q2
Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to TC
CP to TC
CET to TC
CET to TC
PE
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Limits
Min
90
"
"
"
2.0
"
"
"
3.5
"
"
"
2.5
"
"
"
4.0
"
"
"
4.5
5.0
2.5
2.5
Unit
Max
7.5
"
"
"
10.0
"
"
"
8.5
"
"
"
"
"
"
"
14.0
16.0
7.5
7.5
MHz
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/343B
29
97
A
A
A
A
A
A
A
98
A
B
"
"
"
"
A
99
B
B
"
"
"
"
"
100
B
A
"
"
"
"
"
5/
"
101
A
B
"
"
"
"
"
"
102
"
A
"
"
"
"
"
"
103
"
B
B
B
B
B
B
"
104
"
A
B
B
B
B
B
"
105
"
B
A
A
A
A
A
"
106
"
A
A
A
A
A
A
8
Repeat subgroup 7 tests, at Tc = 125°C and TC = -55°C.
9
fMAX
3003
107
2.7 V
IN
2.7 V
Fig. 4
108
"
"
"
TC = 25°C 7/ 9/
"
109
"
"
"
"
110
"
"
"
tPLH1
"
111 8/
2/
"
"
"
112 "
"
"
"
"
113 "
"
"
"
"
114 "
"
"
"
tPHL1
"
115 "
"
"
"
"
116 "
"
"
"
"
117 "
"
"
"
"
118 "
"
"
"
tPLH2
"
119
2.7 V
"
"
"
120
"
"
"
"
121
"
"
"
"
122
"
"
"
tPHL2
"
123
"
"
"
"
124
"
"
"
"
125
"
"
"
"
126
"
"
"
tPLH3
"
127
2.7 V
IN
2/
2.7 V
2.7 V
2.7 V
"
tPHL3
"
128
"
IN
2.7 V
"
"
"
"
tPLH4
"
129
"
0.0 V
"
"
"
"
"
tPHL4
"
130
"
0.0 V
"
"
"
"
"
10
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and use limits from table I.
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
Measured
terminal
TABLE III. Group A inspection for device type 03.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
1
Tc = 25°C
VOH
VOL
VI C
30
IIH2
IIL1
IIL2
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Q0
CE
U/ D
Q2
Q3
GND
P3
P2
CP
P0
Test no.
P1
Q1
3006
"
"
"
"
"
1
2
3
4
5
6
2.0 V
-1.0 mA
3007
"
"
"
"
"
7
8
9
10
11
12
3022
"
13
14
"
15
"
"
"
16
17
18
"
"
"
"
"
3010
"
19
20
21
22
"
"
"
"
"
23
"
"
"
24
25
26
"
"
"
"
"
"
"
27
28
29
30
"
"
"
"
"
31
"
"
"
32
33
34
"
"
"
"
"
3009
"
35
36
37
38
"
"
"
"
"
"
"
39
40
41
"
"
"
"
"
"
42
43
44
"
"
"
-1.0 mA
2.0 V
2.0 V
0.8 V
20 mA
20 mA
2.0 V
2.0 V
2.0 V
"
"
"
0.8 V
0.8 V
2.0 V
"
"
"
"
0.8 V
0.8 V
0.8 V
GND
"
"
"
"
"
2.0 V
0.8 V
"
"
"
"
"
"
-1.0 mA
-1.0 mA
20 mA
20 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
0.5 V
See footnotes at end of table III.
2.0 V
2.0 V
0.8 V
0.8 V
2.0 V
2.0 V
2.0 V
2.0 V
"
"
"
"
"
"
TC
RC
2.0 V
-1.0 mA
-1.0 mA
2.0 V
2.0 V
2.0 V
2.0 V
0.8 V
20 mA
20 mA
0.8 V
0.8 V
2.0 V
2.0 V
"
"
-18 mA
0.5 V
0.5 V
2.0 V
2.0 V
"
"
PL
0.8 V
"
"
"
"
"
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
-18 mA
"
"
"
-18 mA
-18 mA
-18 mA
-18 mA
5.5 V
"
"
"
5.5 V
"
"
2.7 V
2.7 V
5.5 V
5.5 V
2.7 V
"
"
"
2.7 V
5.5 V
5.5 V
2.7 V
"
"
"
"
"
"
7.0 V
7.0 V
5.5 V
5.5 V
7.0 V
"
"
"
7.0 V
5.5 V
0.0 V
0.5 V
0.5 V
7.0 V
0.0 V
0.0 V
0.5 V
0.0 V
"
"
"
"
"
"
"
0.5 V
0.5 V
Measured
terminal
"
"
"
Limits
Min
Q1
Q0
Q2
Q3
TC
RC
Q1
Q0
Q2
Q3
TC
"
"
"
"
"
"
-1.2
"
"
"
"
"
"
"
"
"
"
"
"
"
20
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
100
"
"
"
"
"
"
"
"
"
"
"
"
"
3/
"
"
"
3/
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
U/ D
P3
P2
PL
CP
P0
P1
CE
U/ D
P3
P2
PL
CP
P0
P1
CE
U/ D
P3
P2
PL
CP
P0
CE
V
"
"
"
"
"
0.5
"
"
"
"
"
CE
U/ D
P3
P2
Max
2.5
"
"
"
"
"
RC
P1
PL
CP
P0
P1
Unit
MIL-M-38510/343B
IIH1
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 03 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
1
Tc = 25°C
IOS
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Q0
CE
U/ D
Q2
Q3
GND
P3
P2
CP
P0
VCC
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
"
"
"
"
"
0.0 V
0.0 V
"
RC
VCC
A
"
"
"
"
2/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
A
2/
"
"
"
"
B
B
A
B
A
2/
"
"
"
"
"
"
"
"
"
"
"
"
A
B
B
A
A
B
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
B
6/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3011
"
"
"
"
"
Test no.
P1
Q1
45
46
47
48
49
50
5.5 V
0.0 V
0.0 V
5.5 V
5.5 V
5.5 V
"
"
"
0.0 V
0.0 V
0.0 V
0.0 V
0.0 V
0.0 V
GND
"
"
"
"
"
I CC
3005
51
0.0 V
0.0 V
0.0 V
"
2
Same tests, terminal conditions, and limits as subgroup 1, except TC = +125°C and VI C tests are omitted.
3
Same tests, terminal conditions, and limits as subgroup 1, except TC = -55°C and VI C tests are omitted.
7
Func3014
52
B
L
L
B
B
L
L
GND
"
53
A
H
H
"
"
H
H
"
Tc = 25°C tional
test
"
54
A
H
H
"
"
H
H
"
5/
"
55
B
L
L
"
"
L
L
"
"
56
B
"
L
"
"
"
"
"
"
57
A
"
H
"
"
"
"
"
"
58
"
H
L
"
"
"
"
"
"
59
"
H
H
"
"
"
"
"
"
60
"
L
L
"
"
H
"
"
"
61
"
L
H
"
"
"
"
"
"
62
"
H
L
"
"
"
"
"
"
63
"
H
H
"
"
"
"
"
"
64
"
L
L
"
"
L
H
"
"
65
"
L
H
"
"
"
"
"
"
66
"
H
L
"
"
"
"
"
"
67
"
H
H
"
"
"
"
"
"
68
"
L
L
"
"
H
"
"
"
69
"
L
H
"
"
"
"
"
"
70
"
H
L
"
"
"
"
"
"
71
"
"
H
"
"
"
"
"
"
72
"
"
H
"
"
"
"
"
"
73
"
L
L
"
"
L
L
"
"
74
"
L
H
"
"
"
"
"
"
75
"
H
L
"
"
"
"
"
"
76
"
H
L
A
"
"
"
"
"
77
"
L
H
B
A
"
"
"
"
78
"
"
L
"
"
"
"
"
"
79
"
"
"
"
"
"
"
"
"
80
"
"
"
A
"
"
"
"
"
81
"
"
"
A
"
"
"
"
"
82
"
"
"
B
"
"
"
"
"
83
"
H
H
"
"
H
H
"
"
84
"
H
L
"
"
"
"
"
"
85
"
L
H
"
"
"
"
"
"
86
"
L
L
"
"
"
"
"
"
87
"
H
H
"
"
L
"
"
"
88
"
H
L
"
"
"
"
"
"
89
"
L
H
"
"
"
"
"
"
90
"
L
L
"
"
"
"
"
"
91
"
H
H
"
"
H
L
"
"
92
"
H
L
"
"
"
"
"
"
93
"
L
H
"
"
"
"
"
"
94
"
L
L
"
"
"
"
"
"
95
"
H
H
"
"
L
"
"
"
96
"
H
L
"
"
"
"
"
"
97
B
L
"
"
B
"
"
"
"
98
B
L
"
"
B
"
"
"
8
Repeat subgroup 7 at TC = 125°C and TC = -55°C.
See footnotes at end of table III.
PL
5.5 V
"
"
5.5 V
5.5 V
0.0 V
"
"
"
"
"
0.0 V
0.0 V
0.0 V
5.5 V
B
A
A
B
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
B
B
A
A
B
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
B
B
B
A
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
B
TC
RC
0.0 V
0.0 V
L
H
H
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
H
L
"
"
"
"
H
"
"
"
"
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
H
"
"
"
"
"
L
H
H
L
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Measured
terminal
Q1
Q0
Q2
Q3
TC
Limits
Unit
Min
Max
-60
"
"
"
"
"
-150
"
"
"
"
"
mA
"
"
"
"
"
55
"
MIL-M-38510/343B
31
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 03 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
9
TC = 25°C
fMAX
7/
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Test no.
P1
Q1
Q2
Q3
GND
P3
P2
CP
P0
tPLH2
tPHL2
tPLH3
3003
Fig. 4
"
"
"
"
"
"
"
"
"
"
"
"
"
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
tPHL3
"
tPLH4
Q0
CE
U/ D
GND
"
"
"
PL
2.7 V
"
"
2.7 V
"
"
114
"
"
"
"
"
tPLH5
"
"
"
"
"
"
"
"
"
115
116
117
118
119
120
121
122
123
"
IN
2.7 V
"
"
IN
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
IN
2.7 V
"
"
IN
2.7 V
"
"
IN
2.7 V
"
"
IN
2.7 V
"
"
"
"
"
"
"
"
"
"
tPHL5
"
124
"
"
"
"
"
tPLH6
"
125
"
"
126
2/
"
127
"
tPHL4
32
tPHL6
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
2.7 V
"
"
"
"
"
"
"
IN
2.7 V
"
"
"
"
"
"
"
OUT
OUT
OUT
OUT
IN
OUT
TC
RC
OUT
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
OUT
OUT
2.7 V
"
"
"
"
"
"
"
2.7 V
2.7 V
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
IN
2.7 V
"
"
IN
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
"
2.7 V
2.7 V
"
"
"
IN
2.7 V
2/
"
"
"
"
"
"
"
"
2.7 V
"
2.7 V
"
"
"
"
2/
"
"
"
"
128
"
"
"
"
2/
2.7 V
"
"
"
"
"
129
"
"
"
"
2.7 V
"
"
"
0.0 V
"
"
130
0.0 V
"
"
"
"
"
"
"
2.7 V
"
"
"
0.0 V
"
"
"
"
"
0.0 V
2.7 V
"
"
"
"
OUT
OUT
OUT
OUT
OUT
OUT
"
131
2.7 V
"
"
"
132
2.7 V
"
"
tPLH7
"
133
IN
"
2/
OUT
"
tPHL7
"
134
"
"
"
OUT
"
tPLH8
"
135
"
"
"
OUT
"
tPHL8
"
136
"
"
"
OUT
"
OUT
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and use limits from table I.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
See footnotes at end of table III.
Measured
terminal
Limits
Min
Q0
Q1
Q2
Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to Q0
CP to Q1
CP to Q2
CP to Q3
CP to TC
CP to TC
CP to RC
CP to RC
P0 to Q0
P1 to Q1
P2 to Q2
P3 to Q3
P0 to Q0
P1 to Q1
P2 to Q2
P3 to Q3
CE to RC
CE to RC
PL to Q0
PL to Q1
PL to Q2
PL to Q3
PL to Q0
PL to Q1
PL to Q2
PL to Q3
U / D to RC
U / D to RC
U / D to TC
U / D to TC
Unit
Max
90
"
"
"
3.0
"
"
"
5.0
"
"
"
6.0
5.0
3.0
7.5
"
"
"
11.0
"
"
"
13.0
11.0
7.5
MHz
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
7.0
"
"
"
"
"
6.0
"
"
"
3.0
7.0
"
"
"
13.0
"
"
"
7.0
"
"
"
"
"
"
"
"
"
3.0
7.0
"
5.0
11.0
"
"
"
"
"
"
"
"
"
"
5.5
12.0
"
"
"
"
"
"
"
"
"
"
7.0
18.0
"
5.5
12.0
"
4.0
10.0
"
4.0
10.0
"
MIL-M-38510/343B
2.7 V
"
"
2.7 V
"
"
"
2/
"
"
"
"
"
"
"
"
"
"
tPHL1
OUT
GND
"
"
"
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
tPLH1
10
11
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 04.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
1
Tc = 25°C
VOH
VOL
VI C
33
IIH2
IIL1
IIL2
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Q0
CPD
CPU
Q2
Q3
GND
P3
P2
PL
TCU
TCD
MR
P0
Test no.
P1
Q1
3006
"
"
"
"
1
2
3
4
5
2.0 V
-1.0 mA
5.5 V
5.5 V
"
6
0.0 V
2.0 V
3007
"
"
"
"
7
8
9
10
11
0.8 V
5.5 V
"
12
0.0 V
3022
"
"
"
"
"
13
14
15
16
17
18
-18 mA
"
"
3010
"
"
"
"
"
19
20
21
22
23
24
25
26
"
"
"
"
"
"
"
"
27
28
29
30
31
32
33
34
"
"
3009
"
"
"
35
36
37
38
39
40
"
"
"
"
41
42
43
44
2.0 V
GND
"
"
"
"
2.0 V
5.5 V
5.5 V
0.8 V
"
"
"
"
5.5 V
"
0.0 V
0.0 V
"
0.8 V
5.5 V
0.8 V
"
"
"
"
"
0.8 V
5.5 V
5.5 V
"
"
"
"
"
0.8 V
5.5 V
"
0.0 V
0.0 V
"
-1.0 mA
-1.0 mA
-1.0 mA
20 mA
20 mA
20 mA
20 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.5 V
See footnotes at end of table III.
"
"
"
"
"
"
0.5 V
5.5 V
5.5 V
0.5 V
"
"
"
"
2.0 V
0.8 V
"
"
"
"
-1.0 mA
-1.0 mA
"
0.0 V
"
"
"
0.8 V
20 mA
20 mA
0.0 V
5.5 V
0.0 V
"
5.5 V
"
"
"
"
"
0.0 V
"
0.8 V
"
"
"
"
"
"
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
0.5 V
0.5 V
0.0 V
"
"
0.5 V
0.0 V
VCC
4.5 V
"
"
"
"
2.0 V
0.0 V
"
"
0.5 V
0.0 V
0.5 V
Measured
terminal
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Limits
Min
Q1
Q0
Q2
Q3
TCU
TCD
Q1
Q0
Q2
Q3
V
"
"
"
"
"
TCU
"
0.5
"
"
"
"
"
"
"
"
"
"
"
-1.2
"
"
"
"
"
"
"
"
"
"
"
"
"
20
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
100
"
"
"
"
"
"
"
"
"
"
"
"
"
3/
"
"
"
"
"
3/
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
PL
MR
P0
P1
CPD
CPU
P3
P2
PL
MR
P0
P1
CPD
CPU
P3
P2
PL
MR
P0
CPD
CPU
Max
2.5
"
"
"
"
TCD
P1
CPD
CPU
P3
P2
PL
MR
P0
P1
P3
P2
Unit
MIL-M-38510/343B
IIH1
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 04 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
1
Tc = 25°C
IOS
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Q0
CPD
CPU
Q2
Q3
GND
P3
P2
PL
TCU
TCD
MR
P0
Test no.
P1
Q1
3011
"
"
"
"
45
46
47
48
49
5.5 V
0.0 V
"
50
0.0 V
0.0 V
0.0 V
0.0 V
5.5 V
5.5 V
GND
"
"
"
"
5.5 V
5.5 V
"
See footnotes at end of table III.
0.0 V
0.0 V
"
5.5 V
5.5 V
"
A
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
B
A
A
B
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
0.0 V
0.0 V
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
H
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
H
H
VCC
5.5 V
5.5 V
"
"
"
"
"
0.0 V
"
"
5.5 V
"
TCD
VCC
A
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
"
"
"
"
"
A
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
6/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
Q1
Q0
Q2
Q3
TCU
Limits
Unit
Min
Max
-60
"
"
"
"
-150
"
"
"
"
mA
"
"
"
"
"
"
55
"
"
MIL-M-38510/343B
34
I CC
3005
51
5.5 V
5.5 V
5.5 V
"
2
Same tests, terminal conditions, and limits as subgroup 1, except TC = +125°C and VI C tests are omitted.
3
Same tests, terminal conditions, and limits as subgroup 1, except TC = -55°C and VI C tests are omitted.
7
Func3014
52
A
L
L
A
A
L
L
GND
"
53
"
H
H
"
"
H
H
"
Tc = 25°C tional
test
"
54
"
"
"
"
"
"
"
"
5/
"
55
B
"
"
"
"
"
"
"
"
56
"
L
L
"
"
L
L
"
"
57
"
"
"
"
"
"
"
"
"
58
"
"
"
"
B
"
"
"
"
59
"
"
H
"
A
"
"
"
"
60
"
"
H
"
B
"
"
"
"
61
"
H
L
"
A
L
L
"
"
62
"
"
L
"
B
"
"
"
"
63
"
"
H
"
A
"
"
"
"
64
"
"
H
"
B
"
"
"
"
65
"
L
L
"
A
H
"
"
"
66
"
"
L
"
B
"
"
"
"
67
"
"
H
"
A
"
"
"
"
68
"
"
H
"
B
"
"
"
"
69
"
H
L
"
A
"
"
"
"
70
"
"
L
"
B
"
"
"
"
71
"
"
H
"
A
"
"
"
"
72
"
"
H
"
B
"
"
"
"
73
"
L
L
"
A
L
H
"
"
74
A
"
L
"
B
"
"
"
"
75
"
"
H
"
A
"
"
"
"
76
"
"
H
"
B
"
"
"
"
77
"
H
L
"
A
"
"
"
"
78
"
"
L
"
B
"
"
"
"
79
"
"
H
"
A
"
"
"
"
80
"
"
H
"
B
"
"
"
"
81
"
L
L
"
A
H
"
"
"
82
"
"
L
"
B
"
"
"
"
83
"
"
H
"
A
"
"
"
"
84
"
"
H
"
B
"
"
"
"
85
"
H
L
"
A
"
"
"
"
86
"
"
L
"
B
"
"
"
"
87
"
"
H
"
A
"
"
"
"
88
"
"
H
"
B
"
"
"
"
89
"
L
L
"
A
L
L
"
"
90
"
L
L
B
"
L
L
"
"
91
"
H
H
A
"
H
H
"
"
92
"
H
H
B
"
H
H
"
5.5 V
0.0 V
"
"
"
"
Measured
terminal
TABLE III. Group A inspection for device type 04 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Test no.
P1
Q1
Q0
CPD
CPU
Q2
Q3
GND
P3
P2
PL
TCU
TCD
MR
P0
VCC
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
L
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
L
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
L
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
"
"
"
"
B
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
6/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
2.7 V
"
"
"
IN
"
"
"
IN
"
"
"
2.7 V
"
"
"
IN
"
"
"
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
CPU to Q0
CPU to Q1
CPU to Q2
CPU to Q3
CPD to Q0
CPD to Q1
CPD to Q2
CPD to Q3
CPU to Q0
CPU to Q1
CPU to Q2
CPU to Q3
CPD to Q0
CPD to Q1
CPD to Q2
CPD to Q3
CPU to Q0
CPU to Q1
CPU to Q2
CPU to Q3
CPD to Q0
CPD to Q1
CPD to Q2
CPD to Q3
7
FuncTc = 25°C tional
5/
See footnotes at end of table III.
OUT
OUT
OUT
OUT
OUT
IN
"
"
"
2.7 V
"
"
"
IN
"
"
"
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
IN
"
"
"
2.7 V
"
"
"
OUT
OUT
OUT
OUT
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
0.0 V
"
"
0.0 V
0.0 V
"
"
"
"
0.0 V
0.0 V
0.0 V
2.7 V
"
"
"
"
"
"
"
2/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
0.0 V
"
"
"
0.0 V
"
"
Limits
Min
Unit
Max
MIL-M-38510/343B
35
8
9
TC = 25°C
3014
93
A
H
"
94
"
H
"
95
"
L
"
96
"
"
"
97
"
"
"
98
"
"
"
99
"
H
"
100
"
"
"
101
"
"
"
102
"
"
"
103
"
L
"
104
"
"
"
105
"
"
"
106
B
"
"
107
"
H
"
108
"
"
"
109
"
"
"
110
"
"
"
111
"
L
"
112
"
"
"
113
"
"
"
114
B
"
"
115
"
H
"
116
"
"
"
117
"
"
"
118
"
"
"
119
"
L
"
120
"
"
"
121
"
"
Repeat subgroup 7 at TC = 125°C and TC = -55°C.
fMAX
3003
122
7/ 9/
Fig. 4
123
OUT
"
124
"
125
"
126
"
127
OUT
"
128
"
129
tPLH1
"
130
0.0 V
"
131
0.0 V
OUT
"
132
"
133
"
134
"
135
0.0 V
OUT
"
136
"
"
137
"
tPHL1
"
138
0.0 V
"
139
0.0 V
OUT
"
140
"
141
"
142
0.0 V
"
143
OUT
"
144
0.0 V
"
145
0.0 V
Measured
terminal
90
"
"
"
"
"
"
"
3.5
"
"
"
"
"
"
"
5.5
"
"
"
"
"
"
"
8.5
"
"
"
"
"
"
"
12.5
"
"
"
"
"
"
"
MHz
"
"
"
"
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
TABLE III. Group A inspection for device type 04 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Test no.
P1
Q1
Q0
CPD
CPU
Q2
Q3
GND
P3
P2
TCD
MR
P0
PL
TCU
IN
GND
2/
OUT
0.0 V
2.7 V
IN
"
"
OUT
0.0 V
0.0 V
0.0 V
"
0.0 V
0.0 V
"
"
"
"
0.0 V
"
"
"
151
"
"
"
"
152
"
"
"
153
"
"
154
"
tPLH4
9
tPLH2
3003
146
TC = 25°C
tPHL2
Fig. 4
147
tPLH3
"
148
0.0 V
"
149
2.7 V
"
150
"
9.0
ns
3.5
8.0
"
5.0
11.0
"
"
"
"
"
"
"
"
"
"
5.5
13.0
"
"
"
"
"
"
"
"
"
"
2.5
9.0
"
3.0
8.0
"
2.0
"
"
"
6.0
"
"
"
5.0
7.0
"
"
"
14.5
"
"
"
13.5
"
"
"
"
"
"
"
"
"
5.0
14.5
"
6.0
15.5
"
"
15.5
"
"
14.5
"
"
14.5
"
5.5
14.5
"
"
"
"
"
"
"
"
"
"
4.5
14.0
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
0.0 V
"
"
2.7 V
"
"
"
"
2.7 V
0.0 V
"
"
"
"
"
0.0 V
"
"
0.0 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
155
"
"
"
"
"
"
"
"
"
"
"
156
"
IN
"
"
"
2/
OUT
"
"
"
tPHL4
"
157
"
IN
"
"
"
2/
OUT
"
tPLH5
tPLH6
"
"
"
"
"
"
"
"
"
158
159
160
161
162
163
164
165
166
tPHL6
"
167
tPLH7
"
168
tPLH8
"
169
0.0 V
tPHL7
"
170
2.7 V
tPHL8
"
171
0.0 V
tPLH9
"
172
"
173
"
tPHL5
tPHL9
OUT
OUT
OUT
OUT
OUT
OUT
0.0 V
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
"
"
"
0.0 V
2.7 V
"
2/
0.0 V
"
IN
"
"
0.0 V
"
"
2.7 V
"
0.0 V
"
0.0 V
"
"
174
"
"
"
175
"
"
"
176
"
"
177
"
"
IN
OUT
OUT
IN
0.0 V
OUT
OUT
OUT
OUT
OUT
"
"
"
"
"
"
"
"
"
IN
IN
IN
IN
OUT
OUT
OUT
IN
IN
IN
0.0 V
"
0.0 V
OUT
"
"
OUT
"
"
OUT
"
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
178
"
"
"
"
"
"
179
"
"
"
"
"
"
See footnotes at end of table III.
IN
IN
IN
IN
"
"
"
"
"
"
"
"
"
"
0.0 V
IN
0.0 V
"
"
"
"
"
"
"
"
IN
0.0 V
IN
0.0 V
0.0 V
"
"
"
"
"
"
"
2/
"
OUT
IN
"
CPU to TCU
CPU to TCU
PL to Q0
PL to Q1
PL to Q2
PL to Q3
PL to Q0
PL to Q1
PL to Q2
PL to Q3
CPD to TCD
CPD to TCD
P0 to Q0
P1 to Q1
P2 to Q2
P3 to Q3
P0 to Q0
P1 to Q1
P2 to Q2
P3 to Q3
MR to TCU
MR to TCD
PL to TCU
PL to TCD
PL to TCU
PL to TCD
P0 to TCU
P1 to TCU
P2 to TCU
P3 to TCU
P0 to TCU
P1 to TCU
P2 to TCU
P3 to TCU
MIL-M-38510/343B
Max
4.0
2.7 V
tPHL3
36
Min
IN
OUT
Unit
VCC
"
OUT
Limits
5.0 V
0.0 V
OUT
Measured
terminal
TABLE III. Group A inspection for device type 04 - Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V; low ≤ 0.8 V; or open).
Subgroup Symbol
9
tPLH10
TC = 25°C
tPHL10
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases
2, X 1/
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Q1
Q0
Q2
Q3
PL
TCU
Limits
Unit
Test no.
P1
CPD
CPU
GND
P3
P2
MR
P0
VCC
Min
Max
3003
180
0.0 V
0.0 V
2.7 V
GND
0.0 V
0.0 V
0.0 V
OUT
0.0 V
IN
5.0 V
5.5
14.5
ns
"
181
IN
"
"
"
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
182
0.0 V
"
"
"
"
IN
"
"
"
"
"
"
"
"
"
183
"
"
"
"
IN
0.0 V
"
"
"
"
"
"
"
"
"
184
"
"
"
"
0.0 V
"
"
"
"
IN
"
4.5
14.0
"
"
185
IN
"
"
"
"
"
"
"
"
0.0 V
"
"
"
"
"
186
0.0 V
"
"
"
"
IN
"
"
"
"
"
"
"
"
"
187
"
"
"
"
IN
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
"
"
2.7 V
"
"
2.7 V
0.0 V
2/
"
"
"
IN
"
"
"
2.7 V
0.0 V
"
"
"
"
"
"
5.0
"
"
"
14.5
"
"
"
"
"
"
"
tPHL11
10
11
Measured
terminal
"
188
"
OUT
"
0.0 V
"
189
2.7 V
OUT
"
"
"
190
0.0 V
"
"
OUT
"
191
0.0 V
"
"
OUT
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and use limits from table I.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
TCD
P0 to TCD
P1 to TCD
P2 to TCD
P3 to TCD
P0 to TCD
P1 to TCD
P2 to TCD
P3 to TCD
MR to Q0
MR to Q1
MR to Q2
MR to Q3
2/ Apply one pulse prior to measurement.
37
3.0 V min/5.5 V max
3.0 V min/5.5 V max
0V
0V
3/ For device type 02, Circuit A, the IIL1 minimum and maximum test limits of measured terminal SR , shall be the same as those listed for the IIL2 test, Circuit A, herein.
Parameter
IIL1
IIL2
IIL2
Device
All
01, 02
03, 04
Circuit
A
-.25/-0.6
-.50/-1.2
-.75/-1.8
Circuit
B
-.03/-0.6
-.06/-1.2
-.09/-1.8
Circuit
C
-.25/-0.6
-.50/-1.2
-.50/-1.8
Circuit
D
0/-0.6
0/-0.6
4/ For types 01 and 02, set outputs to 15th count (P0, P1, P2, P3 = 1), prior to measurement.
5/ H ≥ 1.5 V, L ≤ 1.5 V, A = 3.0 V minimum; B = 0.0 V or GND.
6/ Perform function sequence at VCC = 4.5 V and repeat at VCC = 5.5 V.
7/ The fMAX minimum limit specified is the frequency of the input pulse. The output frequency shall be one-half of the input frequency.
8/ For types 01 and 02, increment such that measurement of the specified output can occur on the next applied CP.
9/ fMAX shall be measured only under the conditions of initial qualification and after process or design changes which may affect this parameter. For all other conditions, fMAX shall be
guaranteed, if not tested, to the limits specified in table III, herein.
MIL-M-38510/343B
1/ For cases X and 2, pins not referenced are NC.
MIL-M-38510/343B
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service
or Defense Agency, or within the military service's system command. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
38
MIL-M-38510/343B
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ........................................... Ground zero voltage potential
VIN ............................................... Voltage level at an input terminal
IIN ............................................... Current flowing into an input terminal
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device
type
Generic-industry
type
01
02
03
04
54F161A
54F163A
54F191
54F193
6.8 Manufacturers' designation. Manufacturers' circuits which form a part of this specification are designated with
an "X" as shown in table IV herein.
TABLE IV. Manufacturers' designations.
Device
type
01
02
03
04
A
National Semiconductor
B
Motorola Inc.
X
X
X
X
C
Signetics
Corp.
X
X
D
Texas
Instruments
X
X
6.9 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect
to the previous issue due to the extensiveness of the changes.
39
MIL-M-38510/343B
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
(Project 5962-2026)
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at www.dodssp.daps.mil.
40
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