NAND Flash Memory for Embedded Brief

NAND Flash Memory for Embedded Brief
Spansion ® NAND Flash Memory
for Embedded
SLC NAND Flash Memory from
the Embedded Market Leader
Spansion® NAND products complement the parallel and serial
NOR offerings from Spansion for embedded applications. Spansion
will apply its stringent process for qualification, testing, extended
temperature support and packaging to its line of SLC NAND products.
key features
suitable applications
1 Gb – 8 Gb
Automotive
4xnm/3xnm SLC Floating-gate
NAND
Consumer
3V/1.8V Power Supply
Industrial
Networking
x8 and x16
1-bit ECC recommended (4x nm)
4-bit ECC recommended (3x nm)
Spansion’s high performance and high reliability SLC NAND product
portfolio will be available in 1 Gb, 2 Gb, 4 Gb and 8Gb (DDP)
densities. These products will work with systems that support
1-bit ECC for 4xnm NAND and 4-bit ECC for 3xnm NAND. All of
Spansion’s NAND products will be backed by Spansion’s world-class
customer support and commitment for longevity of supply. The
Spansion Product Selector Guide contains the latest information for
available product configurations.
100,000 cycles (typical)
Industry-standard 48-pin TSOP
package, Industry-standard 63-ball
BGA package
Industrial temperature range
-40°C to +85°C
Complementary drivers and
Spansion FFS Flash File System
spansion nand – distinguished for embedded
spansion nand flash
>High performance memory solution
• Single level cell (SLC)
>Lower density targeting
Embedded
VS.
commodity nand flash
>Low cost memory solution
• 2-bit Multi-level cell (MLC)
• 3-bit level cell NAND (TLC)
Higher density
>
>Faster SLC NAND
• 0.2ms program time
•25 µs random read time
>Slower MLC / TLC NAND
• >2 ms program time
•>70 µs random read time
>Highly reliable
• 100K cycles write
>Less reliable
• 500-10K cycles write
>Strong quality
• <<500 customer defects per million
>Diminishing quality
• >1000 customer defects per million
Extended -40° to +85°C temperature
>
At least 5 years support
>
>
>
0° to 70°C temperature
<2 years support
datasheet summary
>Density
• 1 Gbit / 2 Gbit / 4 Gbit
>Additional Features
• 2 Gbit and 4 Gbit part support dual plane program and
erase commands
• Supports single and multi-plane copy back program
• Supports cache read
>Architecture
• Input / Output Bus Width: 8-bits / 16-bits
• Page Size:
• x8 = 2112 (2048 + 64) bytes; 64 bytes is spare area
• x16 = 1056 (1024 + 32 words); 32 words is spare area
• Block Size: 64 Pages
• x8 = 64 Pages or (128k + 4k) bytes
• x16 = (64k + 2k spare) words
• Plane Size
• 1 Gbit / 2 Gbit – 1024 Blocks per Plane or (128M + 4M) bytes
• 4 Gbit – 2048 Blocks per Plane or (256M + 8M) bytes
• x8 (256M + 8M) bytes
• x16 (128M + 4M) words
>Electronic Signature
• Manufacture ID: 01h
>Page Read / Program
• Random access: 25µs (Max.)
• Sequential access: 25 ns (Max.) / 45 ns (1.8V)
• Program time / Multiplane Program Time:
• 3V = 200 µs (Typ.)
• 1.8V = 250 µs (Typ.)
>Block Erase / Multiple Block Erase
• Block erase time: 3.5 ms (Typ.)
>Device Size
• 1 Gbit: 1 Plane per Device or 128 Mbyte
• 2 Gbit: 2 Planes per Device or 256 Mbyte
• 4 Gbit: 2 Planes per Device or 512 Mbyte
>Reliability
• 100,000 Program / Erase cycles (Typ.)
(with 1bit / 512 + 16 Byte ECC) (For 4x nm)
(with 4bit/512 + 16 Byte ECC) (For 3xnm)
• 10 Year Data retention (Typ.)
>NAND Flash Interface
• Open NAND Flash Interface (ONFI) 1.0 compliant
• Address, Data and Commands multiplexed
>Package Options
• Lead / Halogen Free
• 48-Pin TSOP 12 x 20 x 1.2 mm
• 63-Ball BGA 9 x 11 x 1 mm
>Supply Voltage
• 3.3V device: Vcc = 2.7V ~ 3.6V
• 1.8V device: Vcc = 1.7V ~ 1.95V
>Security
• One Time Programmable (OTP) area
• Serial number (unique ID)
• Hardware program / erase disabled during power transition
ordering part number guide
Density
01G = 1Gb 02G = 2Gb
04G = 4Gb 08G = 8Gb
Family
Family
S34ML (3V)
S34MS (1.8V)
Density
Bus Width
00 = x8 single die
01 = x8 dual die
04 = x16 single die
05 = x16 dual die
Technology
Process Technology
1 = 4x 2 = 3x 3 = 2x
Material Set
F = Lead Free
H = Lead Free/Low Halogen (BGA)
Bus Width
Package
Package
T = TSOP B = BGA
Material Set
Model Number
00 = Standard/ONFI (x8)
01 = ONFI (x16)
Temp
Temperature Grade
I = Industrial Temp (-40°C to +85°C)
B = Auto GT (-40°C to +105°C)
V = Auto (-40°C to +105°C)
Spansion: 915 DeGuigne Drive, PO Box 3453, Sunnyvale, CA 94088-3453 USA
+1 (408) 962-2500 | 1 866 SPANSION | www.spansion.com
© 2013 Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™ and combinations thereof, are trademarks
and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for
informational purposes only and may be trademarks of their respective owners.
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twitter: @Spansion, @SpansionService, @SpansionAuto
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Model Number
Packing Type
Packaging Type
0 = Tray
3 = 13” Tape and Reel
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