RL78/G1C Datasheet

RL78/G1C Datasheet
Datasheet
RL78/G1C
R01DS0348EJ0110
Rev.1.10
Nov 15, 2013
RENESAS MCU
Integrated USB Controller, True Low Power Platform (as low as 112.5 µA/MHz, and 0.61 µA for RTC + LVD),
2.4 V to 5.5 V Operation, 32 Kbyte Flash, 31 DMIPS at 24 MHz, for All USB Based Applications
1.
OUTLINE
1.1 Features
Ultra-Low Power Technology
• 2.4 V to 5.5 V operation from a single supply
• Stop (RAM retained): 0.23 µA, (LVD enabled): 0.31 µA
• Halt (RTC + LVD): 0.57 µA
• Supports snooze
• Operating: 71 µA/MHz
16-bit RL78 CPU Core
• Delivers 31 DMIPS at maximum operating frequency
of 24 MHz
• Instruction Execution: 86% of instructions can be
executed in 1 to 2 clock cycles
• CISC Architecture (Harvard) with 3-stage pipeline
• Multiply Signed & Unsigned: 16 x 16 to 32-bit result in
1 clock cycle
• MAC: 16 x 16 to 32-bit result in 2 clock cycles
• 16-bit barrel shifter for shift & rotate in 1 clock cycle
• 1-wire on-chip debug function
Code Flash Memory
• Density: 32 KB
• Block size: 1 KB
• On-chip single voltage flash memory with protection
from block erase/writing
• Self-programming with secure boot swap function
and flash shield window function
Data Flash Memory
• Data Flash with background operation
• Data flash size: 2 KB
• Erase Cycles: 1 Million (typ.)
• Erase/programming voltage: 2.4 V to 5.5 V
RAM
• 5.5 KB size options
• Supports operands or instructions
• Back-up retention in all modes
High-speed On-chip Oscillator
• 24 MHz with +/− 1% accuracy over voltage (2.4 V to
5.5 V) and temperature (−20°C to +85°C)
• Pre-configured settings: 48 MHz, 24 MHz (TYP.)
Reset and Supply Management
• Power-on reset (POR) monitor/generator
• Low voltage detection (LVD) with 9 setting options
(Interrupt and/or reset function)
USB
• Complying with USB version 2.0, incorporating
host/function controller
• Corresponding to full-speed transfer (12 Mbps) and
low-speed (1.5 Mbps)
• Complying with Battery Charging Specification
Revision 1.2
• Compliant with the 2.1A/1.0A charging mode
prescribed in the Apple Inc. MFi specification in the
Note
USB power supply component specification
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Rev.1.10
Direct Memory Access (DMA) Controller
• Up to 2 fully programmable channels
• Transfer unit: 8- or 16-bit
Multiple Communication Interfaces
2
• Up to 2 x I C master
2
• Up to 1 x I C multi-master
• Up to 2 x CSI (7-, 8-bit)
• Up to 1 x UART (7-, 8-, 9-bit)
Extended-Function Timers
• Multi-function 16-bit timer TAU: Up to 4 channels
(remote control output available)
• Real-time clock (RTC): 1 channel (full calendar and
alarm function with watch correction function)
• 12-bit interval timer: 1 channel
• 15 kHz watchdog timer: 1 channel (window function)
Rich Analog
• ADC: Up to 9 channels, 8/10-bit resolution, 2.1 µs
minimum conversion time
• Internal voltage reference (1.45 V)
• On-chip temperature sensor
Safety Features (IEC or UL 60730 compliance)
• Flash memory CRC calculation
• RAM parity error check
• RAM write protection
• SFR write protection
• Illegal memory access detection
• Clock stop/frequency detection
• ADC self-test
• I/O port read back function (echo)
General Purpose I/O
• 5 V tolerant, high-current (up to 20 mA per pin)
• Open-Drain, Internal Pull-up support
Operating Ambient Temperature
• Standard: −40°C to + 85°C
• Extended: −40°C to + 105°C
Package Type and Pin Count
• 32-pin plastic HWQFN (5 x 5)
• 32-pin plastic LQFP (7 x 7)
• 48-pin plastic LFQFP (7 x 7)
• 48-pin plastic HWQFN (7 x 7)
Note
To use the Apple Inc. battery charging mode, you must
join in Apple's Made for iPod/iPhone/iPad (MFi)
licensing program. Before requesting this specification
from Renesas Electronics, please join in the Apple's
MFi licensing program.
Page 1 of 135
RL78/G1C
1.
OUTLINE
 ROM, RAM capacities
Flash ROM
Data flash
32 KB
Note
2 KB
RAM
5.5 KB
RL78/G1C
Note
32-pin
48-pin
R5F10JBC, R5F10KBC
R5F10JGC, R5F10KGC
This is about 4.5 KB when the self-programming function is used. (For details, see CHAPTER 3 CPU
ARCHITECTURE in the RL78/G1C User’s Manual: Hardware.)
Remark
The functions mounted depend on the product. See 1.6 Outline of Functions.
1.2 List of Part Numbers
Pin count
Package
USB Function
Fields of
Part Number
Application
Note
32 pins
32-pin plastic HWQFN
Host/Function controller
(5 × 5, 0.5 mm pitch)
Function controller only
32-pin plastic LQFP
Host/Function controller
(7 × 7, 0.8 mm pitch)
Function controller only
48 pins
48-pin plastic LFQFP
Host/Function controller
(7 × 7, 0.5 mm pitch)
Function controller only
48-pin plastic HWQFN
Host/Function controller
(7 × 7, 0.5 mm pitch)
Function controller only
Note
A
R5F10JBCANA#U0, R5F10JBCANA#W0
G
R5F10JBCGNA#U0, R5F10JBCGNA#W0
A
R5F10KBCANA#U0, R5F10KBCANA#W0
G
R5F10KBCGNA#U0, R5F10KBCGNA#W0
A
R5F10JBCAFP#V0, R5F10JBCAFP#X0
G
R5F10JBCGFP#V0, R5F10JBCGFP#X0
A
R5F10KBCAFP#V0, R5F10KBCAFP#X0
G
R5F10KBCGFP#V0, R5F10KBCGFP#X0
A
R5F10JGCAFB#V0, R5F10JGCAFB#X0
G
R5F10JGCGFB#V0, R5F10JGCGFB#X0
A
R5F10KGCAFB#V0, R5F10KGCAFB#X0s
G
R5F10JGCANA#U0, R5F10JGCANA#W0
A
R5F10JGCANA#U0, R5F10JGCANA#W0
G
R5F10JGCGNA#U0, R5F10JGCGNA#W0
A
R5F10KGCANA#U0, R5F10KGCANA#W0
G
R5F10KGCGNA#U0, R5F10KGCGNA#W0
For the fields of application, refer to Figure 1-1 Part Number, Memory Size, and Package of RL78/G1C.
Caution The part number above is valid as of when this manual was issued. For the latest part number,
see the web page of the target product on the Renesas Electronics website.
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Rev.1.10
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RL78/G1C
1.
Figure 1-1.
Part No.
OUTLINE
Part Number, Memory Size, and Package of RL78/G1C
R5F10JGCAxxxFB#V0
Packing
#U0 : Tray (HWQFN)
#V0 : Tray (LQFP, LFQFP)
#W0 : Embossed Tape (HWQFN)
#X0 : Embossed Tape (LQFP, LFQFP)
Package
FP : LQFP, 0.80 mm pitch
FB : LFQFP, 0.50 mm pitch
NA : HWQFN, 0.50 mm pitch
ROM Number (Blank product is omitted)
Classification
A : Consumer use, operating ambient temperature: − 40 °C to +85 °C
G : Industrial use, operating ambient temperature: − 40 °C to +105 °C
ROM Capacity
C : 32 KB
Pin count
B : 32-pin
G : 48-pin
RL78/G1C group
10J : USB host / function controller mounted
10K : USB function controller mounted
Type of Memory
F : Flash data memory
Renesas Microcontroller
Renesas Semiconductor
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
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RL78/G1C
1.
OUTLINE
1.3 Pin Configuration (Top View)
1.3.1 32-pin products
• 32-pin plastic HWQFN (5 × 5 mm, 0.5 mm pitch)
UDP0
UDM0
UVBUS
UVDD
UDP1
UDM1
P16/TI01/TO01/INTP5/UOVRCUR1
P17/TI02/TO02/UVBUSEN1
(1) USB function: Host/Function controller (R5F10JBC)
exposed die pad
INDEX MARK
24 23 22 21 20 19 18 17
25
16
26
15
27
14
28
13
29
12
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1/UOVRCUR0
P31/TI03/TO03/INTP4/PCLBUZ0/UVBUSEN0
P62
P61/SDAA0
P60/SCLA0
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AVREFM
P20/ANI0/AVREFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
3. It is recommended to connect an exposed die pad to VSS.
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Rev.1.10
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RL78/G1C
1.
OUTLINE
UDP0
UDM0
UVBUS
UVDD
IC Note
IC Note
P16/TI01/TO01/INTP5
P17/TI02/TO02
(2) USB function: Function controller only (R5F10KBC)
exposed die pad
INDEX MARK
Note
24 23 22 21 20 19 18 17
25
16
26
15
27
14
28
13
29
12
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1
P31/TI03/TO03/INTP4/PCLBUZ0
P62
P61/SDAA0
P60/SCLA0
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AVREFM
P20/ANI0/AVREFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
IC: Internal Connection Pin. Leave open.
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
3. It is recommended to connect an exposed die pad to VSS.
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Rev.1.10
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RL78/G1C
1.
OUTLINE
• 32-pin plastic LQFP (7 × 7 mm, 0.8 mm pitch)
UDP0
UDM0
UVBUS
UVDD
UDP1
UDM1
P16/TI01/TO01/INTP5/UOVRCUR1
P17/TI02/TO02/UVBUSEN1
(1) USB function: Host/Function controller (R5F10JBC)
INDEX MARK
24 23 22 21 20 19 18 17
25
16
26
15
27
14
28
13
29
12
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1/UOVRCUR0
P31/TI03/TO03/INTP4/PCLBUZ0/UVBUSEN0
P62
P61/SDAA0
P60/SCLA0
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AVREFM
P20/ANI0/AVREFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
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Rev.1.10
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RL78/G1C
1.
OUTLINE
UDP0
UDM0
UVBUS
UVDD
IC Note
IC Note
P16/TI01/TO01/INTP5
P17/TI02/TO02
(2) USB function: Function controller only (R5F10KBC)
INDEX MARK
Note
24 23 22 21 20 19 18 17
25
16
26
15
27
14
28
13
29
12
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1
P31/TI03/TO03/INTP4/PCLBUZ0
P62
P61/SDAA0
P60/SCLA0
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AVREFM
P20/ANI0/AVREFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
IC: Internal Connection Pin Leave open.
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
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RL78/G1C
1.
OUTLINE
1.3.2 48-pin products
• 48-pin plastic LFQFP (7 × 7, 0.5 mm pitch)
P140/PCLBUZ0/INTP6
P00/TI00/(SDAA0)
P01/TO00/(SCLA0)
P130
P20/ANI0/AVREFP
P21/ANI1/AVREFM
P22/ANI2
P23/ANI3
P24/ANI4
P25/ANI5
P26/ANI6
P27/ANI7
(1) USB function: Host/Function controller (R5F10JGC)
INDEX MARK
36 35 34 33 32 31 30 29 28 27 26 25
37
24
23
38
39
22
40
21
41
20
42
19
43
18
44
17
45
16
15
46
47
14
13
48
1 2 3 4 5 6 7 8 9 10 11 12
UDP0
UDM0
UVBUS
UVDD
UDP1
UDM1
P14/UOVRCUR0
P15/PCLBUZ1/UVBUSEN0
P16/TI01/TO01/INTP5/UOVRCUR1
P17/TI02/TO02/UVBUSEN1
P51/INTP2/SO00/TxD0/TOOLTxD
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00
P60/SCLA0
P61/SDAA0
P62
P63
P31/TI03/TO03/INTP4
P75/KR5/INTP9/SCK01/SCL01
P74/KR4/INTP8/SI01/SDA01
P73/KR3/SO01
P72/KR2/(TI02)/(TO02)
P71/KR1/(TI01)/(TO01)/(INTP5)
P70/KR0
P30/INTP3/RTC1HZ/SCK00/SCL00
P120/ANI19
P41/(TI03)/(TO03)/(INTP4)/(PCLBUZ1)
P40/TOOL0
RESET
P124/XT2/EXCLKS
P123/XT1
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
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RL78/G1C
1.
OUTLINE
P140/PCLBUZ0/INTP6
P00/TI00/(SDAA0)
P01/TO00/(SCLA0)
P130
P20/ANI0/AVREFP
P21/ANI1/AVREFM
P22/ANI2
P23/ANI3
P24/ANI4
P25/ANI5
P26/ANI6
P27/ANI7
(2) USB function: Function controller only (R5F10KGC)
INDEX MARK
Note
36 35 34 33 32 31 30 29 28 27 26 25
37
24
23
38
39
22
21
40
41
20
19
42
43
18
44
17
45
16
15
46
47
14
13
48
1 2 3 4 5 6 7 8 9 10 11 12
UDP0
UDM0
UVBUS
UVDD
IC Note
IC Note
P14
P15/PCLBUZ1
P16/TI01/TO01/INTP5
P17/TI02/TO02
P51/INTP2/SO00/TxD0/TOOLTxD
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00
P60/SCLA0
P61/SDAA0
P62
P63
P31/TI03/TO03/INTP4
P75/KR5/INTP9/SCK01/SCL01
P74/KR4/INTP8/SI01/SDA01
P73/KR3/SO01
P72/KR2/(TI02)/(TO02)
P71/KR1/(TI01)/(TO01)/(INTP5)
P70/KR0
P30/INTP3/RTC1HZ/SCK00/SCL00
P120/ANI19
P41/(TI03)/(TO03)/(INTP4)/(PCLBUZ1)
P40/TOOL0
RESET
P124/XT2/EXCLKS
P123/XT1
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
IC: Internal Connection Pin Leave open.
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
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RL78/G1C
1.
OUTLINE
• 48-pin plastic WHQFN (7 × 7, 0.5 mm pitch)
P140/PCLBUZ0/INTP6
P00/TI00/(SDAA0)
P01/TO00/(SCLA0)
P130
P20/ANI0/AVREFP
P21/ANI1/AVREFM
P22/ANI2
P23/ANI3
P24/ANI4
P25/ANI5
P26/ANI6
P27/ANI7
(1) USB function: Host/Function controller (R5F10JGC)
INDEX MARK
36 35 34 33 32 31 30 29 28 27 26 25
37
24
23
38
exposed die pad
39
22
21
40
41
20
42
19
43
18
44
17
45
16
15
46
47
14
13
48
1 2 3 4 5 6 7 8 9 10 11 12
UDP0
UDM0
UVBUS
UVDD
UDP1
UDM1
P14/UOVRCUR0
P15/PCLBUZ1/UVBUSEN0
P16/TI01/TO01/INTP5/UOVRCUR1
P17/TI02/TO02/UVBUSEN1
P51/INTP2/SO00/TxD0/TOOLTxD
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00
P60/SCLA0
P61/SDAA0
P62
P63
P31/TI03/TO03/INTP4
P75/KR5/INTP9/SCK01/SCL01
P74/KR4/INTP8/SI01/SDA01
P73/KR3/SO01
P72/KR2/(TI02)/(TO02)
P71/KR1/(TI01)/(TO01)/(INTP5)
P70/KR0
P30/INTP3/RTC1HZ/SCK00/SCL00
P120/ANI19
P41/(TI03)/(TO03)/(INTP4)/(PCLBUZ1)
P40/TOOL0
RESET
P124/XT2/EXCLKS
P123/XT1
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
3. It is recommended to connect an exposed die pad to VSS.
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RL78/G1C
1.
OUTLINE
P140/PCLBUZ0/INTP6
P00/TI00/(SDAA0)
P01/TO00/(SCLA0)
P130
P20/ANI0/AVREFP
P21/ANI1/AVREFM
P22/ANI2
P23/ANI3
P24/ANI4
P25/ANI5
P26/ANI6
P27/ANI7
(2) USB function: Function controller only (R5F10KGC)
INDEX MARK
Note
36 35 34 33 32 31 30 29 28 27 26 25
37
24
23
38
exposed die pad
39
22
21
40
41
20
19
42
43
18
44
17
45
16
15
46
47
14
13
48
1 2 3 4 5 6 7 8 9 10 11 12
UDP0
UDM0
UVBUS
UVDD
IC Note
IC Note
P14
P15/PCLBUZ1
P16/TI01/TO01/INTP5
P17/TI02/TO02
P51/INTP2/SO00/TxD0/TOOLTxD
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00
P60/SCLA0
P61/SDAA0
P62
P63
P31/TI03/TO03/INTP4
P75/KR5/INTP9/SCK01/SCL01
P74/KR4/INTP8/SI01/SDA01
P73/KR3/SO01
P72/KR2/(TI02)/(TO02)
P71/KR1/(TI01)/(TO01)/(INTP5)
P70/KR0
P30/INTP3/RTC1HZ/SCK00/SCL00
P120/ANI19
P41/(TI03)/(TO03)/(INTP4)/(PCLBUZ1)
P40/TOOL0
RESET
P124/XT2/EXCLKS
P123/XT1
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
VSS
VDD
IC: Internal Connection Pin Leave open.
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF).
Remarks 1. For pin identification, see 1.4 Pin Identification.
2. Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
redirection register (PIOR). Refer to Figure 4-8. Format of Peripheral I/O Redirection Register
(PIOR) in the RL78/G1C User’s Manual: Hardware.
3. It is recommended to connect an exposed die pad to VSS.
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RL78/G1C
1.
OUTLINE
1.4 Pin Identification
ANI0 to ANI7, ANI16, ANI17, ANI19:
Analog Input
AVREFM:
Analog Reference Voltage Minus
AVREFP:
Analog Reference Voltage Plus
EXCLK:
External Clock Input (Main System Clock)
EXCLKS:
External Clock Input (Sub System Clock)
INTP0 to INTP6, INTP8, INTP9:
External Interrupt Input
KR0 to KR5:
Key Return
P00, P01:
Port 0
P14 to P17:
Port 1
P20 to P27:
Port 2
P30, P31:
Port 3
P40, P41:
Port 4
P50, P51:
Port 5
P60 to P63:
Port 6
P70 to P75:
Port 7
P120 to P124:
Port 12
P130, P137:
Port 13
P140:
Port 14
PCLBUZ0, PCLBUZ1:
Programmable Clock Output/Buzzer Output
REGC:
Regulator Capacitance
RESET:
Reset
RTC1HZ:
Real-time Clock Correction Clock (1 Hz) Output
RxD0:
Receive Data
SCK00, SCK01:
Serial Clock Input/Output
SCLA0, SCL00, SCL01:
Serial Clock Input/Output
SDAA0, SDA00, SDA01:
Serial Data Input/Output
SI00, SI01:
Serial Data Input
SO00, SO01:
Serial Data Output
TI00 to TI03:
Timer Input
TO00 to TO03:
Timer Output
TOOL0:
Data Input/Output for Tool
TOOLRxD, TOOLTxD:
Data Input/Output for External Device
TxD0:
Transmit Data
UDM0, UDM1, UDP0, UDP1:
USB Input/Output
UOVRCUR0, UOVRCUR1:
USB Input
UVBUSEN0, UVBUSEN1:
USB Output
UVDD:
USB Power Supply/USB Regulator Capacitance
UVBUS:
USB Input/USB Power Supply (USB Optional BC)
VDD:
Power Supply
VSS:
Ground
X1, X2:
Crystal Oscillator (Main System Clock)
XT1, XT2:
Crystal Oscillator (Subsystem Clock)
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1.
OUTLINE
1.5 Block Diagram
1.5.1 32-pin products
TIMER ARRAY
UNIT (4ch)
PORT 0
2
P00, P01
TI00/P00
TO00/P01
ch0
PORT 1
2
P16, P17
TI01/TO01/P16
ch1
PORT 2
5
P20 to P24
TI02/TO02/P17
ch2
PORT 3
2
P30, P31
TI03/TO03/P31
ch3
PORT 4
12-BIT INTERVAL
TIMER
P40
PORT 5
2
P50, P51
PORT 6
3
P60 to P62
PORT 7
WINDOW
WATCHDOG
TIMER
PORT 12
SERIAL ARRAY
UNIT0 (2ch)
RxD0/P50
TxD0/P51
SCK00/P30
SI00/P50
SO00/P51
SCK01/P01
SI01/P00
SO01/P120
P137
DATA FLASH MEMORY
A/D CONVERTER
5
ANI0/P20 to
ANI4/P24
3
ANI16/P01, ANI17/P00,
ANI19/P120
AVREFP/P20
AVREFM/P21
UART0
CSI00
RAM
POWER ON RESET/
VOLTAGE
DETECTOR
CSI01
SCL00/P30
SDA00/P50
IIC00
SCL01/P01
SDA01/P00
IIC01
VSS TOOLRxD/P50,
TOOLTxD/P51
POR/LVD
CONTROL
RESET CONTROL
TOOL0/P40
ON-CHIP DEBUG
SYSTEM
CONTROL
SCLA0/P60
HIGH-SPEED
ON-CHIP
OSCILLATOR
PLL
BUZZER OUTPUT
2
CLOCK OUTPUT
CONTROL
PCLBUZ0/P31,
PCLBUZ1/P70
VOLTAGE
REGULATOR
MULTIPLIER&
DIVIDER,
MULITIPLYACCUMULATOR
DIRECT MEMORY
ACCESS CONTROL
BCD
ADJUSTMENT
RESET
X1/P121
X2/EXCLK/P122
SDAA0/P61
SERIAL
INTERFACE IICA0
REGC
INTP0/P137
INTERRUPT
CONTROL
2
INTP1/P50,
INTP2/P51
2
INTP3/P30,
INTP4/P31
2
INTP8/P00,
INTP9/P01
INTP5/P16
USB
USB VOLTAGE
REGULATOR
UOVRCUR0
UVBUSEN0
UOVRCUR1
UVBUSEN1
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P121, P122
CODE FLASH MEMORY
RL78
CPU
CORE
VDD
UDP0
UDM0
UDP1
UDM1
UVBUS
P120
2
PORT 13
LOW-SPEED
ON-CHIP
OSCILLATOR
REAL-TIME
CLOCK
P70
UVDD
Rev.1.10
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RL78/G1C
1.
OUTLINE
1.5.2 48-pin products
TIMER ARRAY
UNIT (4ch)
PORT 0
2
P00, P01
TI00/P00
TO00/P01
ch0
PORT 1
4
P14 to P17
TI01/TO01/P16
ch1
PORT 2
8
P20 to P27
TI02/TO02/P17
ch2
PORT 3
2
P30, P31
TI03/TO03/P31
ch3
PORT 4
2
P40, P41
PORT 5
2
P50, P51
PORT 6
4
P60 to P63
PORT 7
6
P70 to P75
4
P121 to P124
12-BIT INTERVAL
TIMER
WINDOW
WATCHDOG
TIMER
PORT 12
LOW-SPEED
ON-CHIP
OSCILLATOR
RTC1HZ/P30
REAL-TIME
CLOCK
SERIAL ARRAY
UNIT0 (2ch)
RxD0/P50
TxD0/P51
PORT 13
P130
P137
PORT 14
P140
CODE FLASH MEMORY
RL78
CPU
CORE
DATA FLASH MEMORY
A/D CONVERTER
AVREFP/P20
AVREFM/P21
KR0/P70 to
KR5/P75
6
CSI00
RAM
POWER ON RESET/
VOLTAGE
DETECTOR
CSI01
SCL00/P30
SDA00/P50
IIC00
SCL01/P75
SDA01/P74
IIC01
VSS TOOLRxD/P50,
TOOLTxD/P51
POR/LVD
CONTROL
RESET CONTROL
TOOL0/P40
ON-CHIP DEBUG
SYSTEM
CONTROL
SCLA0/P60
HIGH-SPEED
ON-CHIP
OSCILLATOR
2
XT2/EXCLKS/P124
PCLBUZ0/P140,
PCLBUZ1/P15
VOLTAGE
REGULATOR
MULTIPLIER&
DIVIDER,
MULITIPLYACCUMULATOR
DIRECT MEMORY
ACCESS CONTROL
XT1/P123
PLL
BUZZER OUTPUT
CLOCK OUTPUT
CONTROL
RESET
X1/P121
X2/EXCLK/P122
SDAA0/P61
SERIAL
INTERFACE IICA0
REGC
INTP0/P137
INTERRUPT
CONTROL
2
INTP1/P50,
INTP2/P51
2
INTP3/P30,
INTP4/P31
INTP5/P16
INTP6/P140
BCD
ADJUSTMENT
2
INTP8/P74,
INTP9/P75
USB
USB VOLTAGE
REGULATOR
UOVRCUR0
UVBUSEN0
UOVRCUR1
UVBUSEN1
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ANI19/P120
UART0
VDD
UDP0
UDM0
UDP1
UDM1
UVBUS
ANI0/P20 to
ANI7/P27
8
KEY RETURN
SCK00/P30
SI00/P50
SO00/P51
SCK01/P75
SI01/P74
SO01/P73
P120
UVDD
Rev.1.10
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RL78/G1C
1.
OUTLINE
1.6 Outline of Functions
[32-pin, 48-pin products]
(1/2)
Item
32-pin
R5F10JBC
Code flash memory (KB)
48-pin
R5F10KBC
32 KB
R5F10JGC
R5F10KGC
32 KB
Data flash memory (KB)
2 KB
RAM (KB)
5.5 KB
2 KB
Memory space
1 MB
Main
system
clock
High-speed system
clock
X1 (crystal/ceramic) oscillation, external main system clock input (EXCLK)
1 to 20 MHz: VDD = 2.7 to 5.5 V, 1 to16 MHz: VDD = 2.4 to 5.5 V
High-speed on-chip
oscillator
1 to 24 MHz (VDD = 2.7 to 5.5 V), 1 to 16 MHz (VDD = 2.4 to 5.5 V)
PLL clock
6, 12, 24 MHz
Note 1
5.5 KB
Note 2
: VDD = 2.4 to 5.5 V
−
Subsystem clock
Note 1
XT1 (crystal) oscillation
32.768 kHz (TYP.): VDD = 2.4 to 5.5 V
Low-speed on-chip oscillator
On-chip oscillation (Watchdog timer/Real-time clock/12-bit interval timer clock)
General-purpose register
8 bits × 32 registers (8 bits × 8 registers × 4 banks)
Minimum instruction execution
time
0.04167 μs (High-speed on-chip oscillator: fHOCO = 48 MHz /fIH = 24 MHz operation)
15 kHz (TYP.): VDD = 2.4 to 5.5 V
0.04167 μs (PLL clock: fPLL = 48 MHz /fIH = 24 MHz
Note 2
operation)
0.05 μs (High-speed system clock: fMX = 20 MHz operation)
30.5 μs (Subsystem clock: fSUB = 32.768 kHz
operation)
−
Instruction set
• Data transfer (8/16 bits)
• Adder and subtractor/logical operation (8/16 bits)
• Multiplication (8 bits × 8 bits)
• Rotate, barrel shift, and bit manipulation (Set, reset, test, and Boolean operation), etc.
I/O port
22
Total
38
CMOS I/O
16 (N-ch O.D. I/O [VDD withstand voltage]: 5)
28 (N-ch O.D. I/O [VDD withstand voltage]: 6)
CMOS input
3
5
−
CMOS output
Timer
N-ch open-drain I/O
(6 V tolerance)
3
16-bit timer
4 channel
Watchdog timer
1 channel
Real-time clock (RTC)
1 channel
12-bit Interval timer (IT)
1 channel
Timer output
4 channels (PWM output: 3)
4
Note 3
−
RTC output
1
Note 4
1
• 1 Hz (subsystem clock: fSUB = 32.768 kHz)
Notes 1.
In the case of the 5.5 KB, this is about 4.5 KB when the self-programming function is used. (For details,
see CHAPTER 3 in the RL78/G1C User’s Manual: Hardware)
2. In the PLL clock 48 MHz operation, the system clock is 2/4/8 dividing ratio.
3. In 32-pin products, this channel can only be used for the constant-period interrupt function based on the
low-speed on-chip oscillator clock (fIL).
4. The number of PWM outputs varies depending on the setting of channels in use (the number of masters and
slaves). (6.9.3 Operation as multiple PWM output function in the RL78/G1C User’s Manual: Hardware)
Caution This outline describes the functions at the time when Peripheral I/O redirection register (PIOR) is set to
00H.
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1.
OUTLINE
(2/2)
Item
32-pin
R5F10JBC
Clock output/buzzer output
48-pin
R5F10KBC
2
R5F10JGC
R5F10KGC
2
• 2.93 kHz, 5.86 kHz, 11.7 kHz, 1.5 MHz, 3 MHz, 6 MHz, 12 MHz
(Main system clock: fMAIN = 24 MHz operation)
• 256 Hz, 512 Hz, 1.024 kHz, 2.048 kHz, 4.096 kHz, 8.192 kHz, 16.384 kHz, 32.768 kHz
(Subsystem clock: fSUB = 32.768 kHz operation)
8/10-bit resolution A/D converter
8 channels
Serial interface
CSI: 2 channels/UART: 1 channel/simplified I2C: 2 channels
USB
I2C bus
1 channel
Host controller
2 channels
Function controller
1 channel
Multiplier and
divider/multiply-accumulator
9 channels
−
2 channels
• Multiplier:
16 bits × 16 bits = 32 bits (Unsigned or signed)
• Divider:
32 bits ÷ 32 bits = 32 bits (Unsigned)
−
• Multiply-accumulator:16 bits × 16 bits + 32 bits = 32 bits (Unsigned or signed)
DMA controller
2 channels
Vectored
Internal
20
20
interrupt
sources
External
8
10
−
Key interrupt
6
• Reset by RESET pin
• Internal reset by watchdog timer
• Internal reset by power-on-reset
• Internal reset by voltage detector
• Internal reset by illegal instruction execution Note
Reset
• Internal reset by RAM parity error
• Internal reset by illegal-memory access
Power-on-reset circuit
• Power-on-reset:
• Power-down-reset:
Voltage detector
2.45 V to 4.06 V (9 stages)
On-chip debug function
Provided
Power supply voltage
VDD = 2.4 to 5.5 V
Operating ambient temperature
TA = −40 to +85 °C (A: Consumer applications), TA = −40 to +105°C (G: Industrial applications)
Note
1.51 V (TYP.)
1.50 V (TYP.)
The illegal instruction is generated when instruction code FFH is executed.
Reset by the illegal instruction execution not issued by emulation with the in-circuit emulator or on-chip debug
emulator.
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2.
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
This chapter describes the electrical specifications for the products "A: Consumer applications (TA = -40 to +85°C)".
The target products A: Consumer applications ; TA = -40 to +85°C
R5F10JBCANA, R5F10JBCAFP, R5F10JGCANA, R5F10JGCAFB,
R5F10KBCANA, R5F10KBCAFP, R5F10KGCANA, R5F10KGCAFB
G: Industrial applications ; when using TA = -40 to +105°C specification products
at TA = -40 to +85°C.
R5F10JBCGNA, R5F10JBCGFP, R5F10JGCGNA, R5F10JGCGFB,
R5F10KBCGNA, R5F10KBCGFP, R5F10KGCGNA, R5F10KGCGFB
Cautions 1. The RL78 microcontrollers has an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for mass
production, because the guaranteed number of rewritable times of the flash memory may be
exceeded when this function is used, and product reliability therefore cannot be guaranteed.
Renesas Electronics is not liable for problems occurring when the on-chip debug function is
used.
2. The pins mounted depend on the product. Refer to 2.1 Port Function to 2.2.1 With functions
for each product in the RL78/G1C User’s Manual: Hardware.
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
2.1 Absolute Maximum Ratings
Absolute Maximum Ratings (TA = 25°C) (1/2)
Parameter
Symbols
Supply voltage
Conditions
VDD
Ratings
Unit
−0.5 to +6.5
V
REGC pin input voltage VIREGC
REGC
−0.3 to +2.8
and −0.3 to VDD +0.3Note 1
V
UVDD pin input voltage
UVDD
−0.3 to VDD +0.3
V
Input voltage
Output voltage
VIUVDD
−0.3 to VDD +0.3
V
P60 to P63 (N-ch open-drain)
−0.3 to +6.5
V
VI3
UDP0, UDM0, UDP1, UDM1
−0.3 to +6.5
V
VI4
UVBUS
−0.3 to +6.5
VI1
P00, P01, P14 to P17, P20 to P27, P30, P31, P40,
P41, P50, P51, P70 to P75, P120 to P124, P137,
P140, EXCLK, EXCLKS, RESET
VI2
VO1
Note 2
−0.3 to VDD +0.3
P00, P01, P14 to P17, P20 to P27, P30, P31, P40,
V
Note 2
V
P41, P50, P51, P60 to P63, P70 to P75, P120,
P130, P140
Analog input voltage
VO2
UDP0, UDM0, UDP1, UDM1
VAI1
ANI16, ANI17, ANI19
−0.3 to +6.5
V
−0.3 to VDD +0.3
and −0.3 to AVREF (+) +0.3
V
Notes 2, 3
VAI2
−0.3 to VDD +0.3
and −0.3 to AVREF (+) +0.3
ANI0 to ANI7
V
Notes 2, 3
Notes 1.
Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF). This value regulates the absolute
maximum rating of the REGC pin.
Do not use this pin with voltage applied to it.
2.
Must be 6.5 V or lower.
3.
Do not exceed AV REF (+) + 0.3 V in case of A/D conversion target pin
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions
that ensure that the absolute maximum ratings are not exceeded.
Remarks 1. Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
2. AVREF (+): The + side reference voltage of the A/D converter.
This can be selected from AVREFP, the
internal reference voltage (1.45 V), and VDD.
3. VSS: Reference voltage
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Absolute Maximum Ratings (TA = 25°C) (2/2)
Parameter
Output current, high
Symbols
IOH1
Conditions
Per pin
P00, P01, P14 to P17, P30, P31,
Ratings
Unit
−40
mA
−70
mA
−100
mA
−0.5
mA
−2
mA
40
mA
70
mA
100
mA
1
mA
5
mA
−40 to +85
°C
−65 to +150
°C
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
Total of all pins
−170 mA
P00, P01, P40, P41, P120,
P130, P140
P14 to P17, P30, P31,
P50, P51, P70 to P75
IOH2
Per pin
P20 to P27
Total of all pins
Output current, low
IOL1
Per pin
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P60 to P63,
P70 to P75, P120, P130, P140
Total of all pins
170 mA
P00, P01, P40, P41, P120,
P130, P140
P14 to P17, P30, P31,
P50, P51, P60 to P63, P70 to P75
IOL2
Per pin
P20 to P27
Total of all pins
Operating ambient
temperature
TA
Storage temperature
Tstg
In normal operation mode
In flash memory programming mode
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions
that ensure that the absolute maximum ratings are not exceeded.
Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the port
pins.
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.2 Oscillator Characteristics
2.2.1 X1, XT1 oscillator characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Resonator
X1 clock oscillation
frequency (fX)Note
Ceramic resonator/
crystal resonator
XT1 clock oscillation
frequency (fXT)Note
Crystal resonator
Conditions
MIN.
TYP.
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V
1.0
20.0
MHz
2.4 V ≤ VDD < 2.7 V
1.0
16.0
MHz
35
kHz
32
32.768
Note Indicates only permissible oscillator frequency ranges. Refer to AC Characteristics for instruction execution
time. Request evaluation by the manufacturer of the oscillator circuit mounted on a board to check the
oscillator characteristics.
Caution Since the CPU is started by the high-speed on-chip oscillator clock after a reset release, check
the X1 clock oscillation stabilization time using the oscillation stabilization time counter status
register (OSTC) by the user. Determine the oscillation stabilization time of the OSTC register and
the oscillation stabilization time select register (OSTS) after sufficiently evaluating the oscillation
stabilization time with the resonator to be used.
Remark When using the X1 oscillator and XT1 oscillator, refer to 5.4 System Clock Oscillator in the RL78/G1C
User’s Manual: Hardware.
2.2.2 On-chip oscillator characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Oscillators
Parameters
High-speed on-chip oscillator
clock frequency Notes 1, 2
MAX.
Unit
1
48
MHz
−20 to +85 °C
−1.0
+1.0
%
−40 to −20 °C
−1.5
+1.5
%
fHOCO
High-speed on-chip oscillator
clock frequency accuracy
Low-speed on-chip oscillator
clock frequency
Conditions
MIN.
fIL
Low-speed on-chip oscillator
clock frequency accuracy
TYP.
15
−15
kHz
+15
%
Notes 1. High-speed on-chip oscillator frequency is selected by bits 0 to 3 of option byte (000C2H/010C2H) and
bits 0 to 2 of HOCODIV register.
2. This indicates the oscillator characteristics only. Refer to AC Characteristics for instruction execution
time.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.2.3 PLL oscillator characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Oscillators
PLL input frequency
Parameters
Note
PLL output frequency Note
fPLLIN
Conditions
High-speed system clock
MIN.
TYP.
6.00
MAX.
Unit
16.00
MHz
48.00
fPLL
MHz
Lock up time
From PLL output enable to stabilization of the
output frequency
40.00
μs
Interval time
From PLL stop to PLL re-operation setteing
Wait time
4.00
μs
Setting wait time
From after PLL input clock stabilization and PLL
1.00
μs
setting is fixed to start setting
Wait time required
Note
Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.3 DC Characteristics
2.3.1 Pin characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
IOH1
Output current,
highNote 1
Conditions
Notes 1.
TYP.
MAX.
Unit
−10.0
mA
Per pin for P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51, P70 to
P75, P120, P130, P140
2.4 V ≤ VDD ≤ 5.5 V
Total of P00, P01, P40, P41, P120,
P130, P140
(When duty ≤ 70% Note 3)
4.0 V ≤ VDD ≤ 5.5 V
−55.0
mA
2.7 V ≤ VDD < 4.0 V
−10.0
mA
2.4 V ≤ VDD < 2.7 V
−5.0
mA
4.0 V ≤ VDD ≤ 5.5 V
−80.0
mA
2.7 V ≤ VDD < 4.0 V
−19.0
mA
Total of P14 to P17, P30, P31,
P50, P51, P70 to P75
(When duty ≤ 70% Note 3)
IOH2
MIN.
Note 2
2.4 V ≤ VDD < 2.7 V
−10.0
mA
Total of all pins
(When duty ≤ 70%Note 3)
2.4 V ≤ VDD ≤ 5.5 V
−135.0
mA
Per pin for P20 to P27
2.4 V ≤ VDD ≤ 5.5 V
−0.1Note 2
mA
Total of all pins
(When duty ≤ 70%Note 3)
2.4 V ≤ VDD ≤ 5.5 V
−1.5
mA
Value of current at which the device operation is guaranteed even if the current flows from the VDD pin
to an output pin.
2.
However, do not exceed the total current value.
3.
Specification under conditions where the duty factor ≤ 70%.
The output current value that has changed to the duty factor > 70% the duty ratio can be calculated with
the following expression (when changing the duty ratio to n%).
• Total output current of pins = (IOH × 0.7)/(n × 0.01)
<Example> Where n = 80% and IOH = −10.0 mA
Total output current of pins = (−10.0 × 0.7)/(80 × 0.01) ≅ −8.7 mA
However, the current that is allowed to flow into one pin does not vary depending on the duty factor.
A current higher than the absolute maximum rating must not flow into one pin.
Caution P00, P01, P30, and P74 do not output high level in N-ch open-drain mode.
Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the port
pins.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
IOL1
Output current,
lowNote 1
Conditions
TYP.
MAX.
Unit
Note 2
mA
Per pin for P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51,
P70 to P75, P120, P130, P140
2.4V ≤ VDD ≤ 5.5 V
20.0
Per pin for P60 to P63
2.4V ≤ VDD ≤ 5.5 V
20.0 Note 2
mA
Total of P00, P01, P40, P41, P120,
P130, P140
(When duty ≤ 70% Note 3)
4.0 V ≤ VDD ≤ 5.5 V
70.0
mA
2.7 V ≤ VDD < 4.0 V
15.0
mA
2.4 V ≤ VDD < 2.7 V
9.0
mA
4.0 V ≤ VDD ≤ 5.5 V
80.0
mA
2.7 V ≤ VDD < 4.0 V
35.0
mA
2.4 V ≤ VDD < 2.7 V
20.0
mA
Total of all pins
(When duty ≤ 70% Note 3)
2.4V ≤ VDD ≤ 5.5 V
150.0
mA
Per pin for P20 to P27
2.4V ≤ VDD ≤ 5.5 V
0.4 Note 2
mA
Total of all pins
(When duty ≤ 70%Note 3)
2.4V ≤ VDD ≤ 5.5 V
5.0
mA
Total of P14 to P17, P30, P31, P50,
P51, P60 to P63, P70 to P75
(When duty ≤ 70% Note 3)
IOL2
MIN.
Notes 1. Value of current at which the device operation is guaranteed even if the current flows from an output pin
to the VSS pin.
2. However, do not exceed the total current value.
3. Specification under conditions where the duty factor ≤ 70%.
The output current value that has changed to the duty factor > 70% the duty ratio can be calculated with
the following expression (when changing the duty ratio to n%).
• Total output current of pins = (IOL × 0.7)/(n × 0.01)
<Example> Where n = 80% and IOL = 10.0 mA
Total output current of pins = (10.0 × 0.7)/(80 × 0.01) ≅ 8.7 mA
However, the current that is allowed to flow into one pin does not vary depending on the duty factor. A
current higher than the absolute maximum rating must not flow into one pin.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
R01DS0348EJ0110
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
Input voltage,
high
Input voltage,
low
Caution
Conditions
MIN.
TYP.
MAX.
Unit
VIH1
P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51, P70
to P75, P120, P140
Normal input buffer
0.8VDD
VDD
V
VIH2
P00, P01, P30, P50
TTL input buffer
4.0 V ≤ VDD ≤ 5.5 V
2.2
VDD
V
TTL input buffer
3.3 V ≤ VDD < 4.0 V
2.0
VDD
V
TTL input buffer
2.4 V ≤ VDD < 3.3 V
1.5
VDD
V
VIH3
P20 to P27
0.7VDD
VDD
V
VIH4
P60 to P63
0.7VDD
6.0
V
VIH5
P121 to P124, P137, EXCLK, EXCLKS, RESET
0.8VDD
VDD
V
VIL1
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P70 to P75,
P120, P140
Normal input buffer
0
0.2VDD
V
VIL2
P00, P01, P30, P50
TTL input buffer
4.0 V ≤ VDD ≤ 5.5 V
0
0.8
V
TTL input buffer
3.3 V ≤ VDD < 4.0 V
0
0.5
V
TTL input buffer
2.4 V ≤ VDD < 3.3 V
0
0.32
V
VIL3
P20 to P27
0
0.3VDD
V
VIL4
P60 to P63
0
0.3VDD
V
VIL5
P121 to P124, P137, EXCLK, EXCLKS, RESET
0
0.2VDD
V
The maximum value of VIH of pins P00, P01, P30, and P74 is VDD, even in the N-ch open-drain
mode.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Output voltage,
high
Output voltage,
low
Caution
Symbol
VOH1
Conditions
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
MIN.
TYP.
MAX.
Unit
4.0 V ≤ VDD ≤ 5.5 V,
IOH1 = −10.0 mA
VDD − 1.5
V
4.0 V ≤ VDD ≤ 5.5 V,
IOH1 = −3.0 mA
VDD − 0.7
V
2.7 V ≤ VDD ≤ 5.5 V,
IOH1 = −2.0 mA
VDD − 0.6
V
2.4 V ≤ VDD ≤ 5.5 V,
IOH1 = −1.5 mA
VDD − 0.5
V
VDD − 0.5
V
VOH2
P20 to P27
2.4 V ≤ VDD ≤ 5.5 V,
IOH2 = −100 μ A
VOL1
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 20.0 mA
1.3
V
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 8.5 mA
0.7
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 3.0 mA
0.6
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 1.5 mA
0.4
V
2.4 V ≤ VDD ≤ 5.5 V,
IOL1 = 0.6 mA
0.4
V
VOL2
P20 to P27
2.4 V ≤ VDD ≤ 5.5 V,
IOL2 = 400 μ A
0.4
V
VOL3
P60 to P63
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 20.0 mA
2.0
V
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 5.0 mA
0.4
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 3.0 mA
0.4
V
2.4 V ≤ VDD ≤ 5.5 V,
IOL1 = 2.0 mA
0.4
V
P00, P01, P30, and P74 do not output high level in N-ch open-drain mode.
Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Input leakage
current, high
Input leakage
current, low
On-chip pll-up
resistance
Remark
Symbol
Conditions
ILIH1
P00, P01, P14 to P17,
P20 to P27, P30, P31,
P40, P41, P50, P51, P60 to
P63, P70 to P75, P120,
P137, P140, RESET
VI = VDD
ILIH2
P121 to P124
(X1, X2, XT1, XT2, EXCLK,
EXCLKS)
VI = VDD
ILIL1
P00, P01, P14 to P17,
P20 to P27, P30, P31, P40,
P41, P50, P51, P60 to P63,
P70 to P75, P120, P137, P140,
RESET
VI = VSS
ILIL2
P121 to P124
(X1, X2, XT1, XT2, EXCLK,
EXCLKS)
VI = VSS
RU
P00, P01, P14 to P17,
P30, P31, P40, P41,
P50, P51, P70 to P75, P120,
P140
MIN.
MAX.
Unit
1
μA
In input port or
external clock
input
1
μA
In resonator
connection
10
μA
−1
μA
In input port or
external clock
input
−1
μA
In resonator
connection
−10
μA
100
kΩ
VI = VSS, In input port
10
TYP.
20
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the port
pins.
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
2.3.2 Supply current characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Supply
current
IDD1
(1/2)
Conditions
Operating
mode
Note 1
MIN.
TYP.
MAX.
Unit
HS
fHOCO = 48 MHz
(High-speed fIH = 24 MHz Note 3
main) mode
Basic
VDD = 5.0 V
operation VDD = 3.0 V
1.7
Note 6
Normal
VDD = 5.0 V
operation VDD = 3.0 V
3.7
5.5
mA
3.7
5.5
mA
2.3
3.2
mA
2.3
3.2
mA
1.6
2.0
mA
1.6
2.0
mA
1.2
1.5
mA
fHOCO = 24 MHz Note 5
fIH = 12 MHz Note 3
fHOCO = 12 MHz Note 5
fIH = 6 MHz Note 3
fHOCO = 6 MHz Note 5
fIH = 3 MHz Note 3
HS
fMX = 20 MHz Note 2,
(High-speed VDD = 5.0 V
main) mode
Note 6
fMX = 20 MHz Note 2,
VDD = 3.0 V
fMX = 10 MHz
Note 2
,
VDD = 5.0 V
fMX = 10 MHz
Note 2
,
VDD = 3.0 V
HS
(High-speed
main) mode
(PLL
operation)
Normal
VDD = 5.0 V
operation VDD = 3.0 V
Normal
VDD = 5.0 V
operation VDD = 3.0 V
Normal
VDD = 5.0 V
operation VDD = 3.0 V
mA
1.7
mA
1.2
1.5
mA
Normal
Square wave input
operation Resonator connection
3.0
4.6
mA
3.2
4.8
mA
Normal
Square wave input
operation Resonator connection
3.0
4.6
mA
3.2
4.8
mA
Normal
Square wave input
operation Resonator connection
1.9
2.7
mA
1.9
2.7
mA
Normal
Square wave input
operation Resonator connection
1.9
2.7
mA
1.9
2.7
mA
fPLL = 48 MHz,
Normal
VDD = 5.0 V
fCLK = 24 MHz Note 2 operation VDD = 3.0 V
4.0
5.9
mA
4.0
5.9
mA
fPLL = 48 MHz,
2.6
3.6
mA
2.6
3.6
mA
1.9
2.4
mA
fCLK = 12 MHz
Note 2
Normal
VDD = 5.0 V
operation VDD = 3.0 V
Note 6
fPLL = 48 MHz,
fCLK = 6 MHz Note 2
Subsystem
clock
operation
fSUB = 32.768 kHz
Note 4
Normal
VDD = 5.0 V
operation VDD = 3.0 V
1.9
2.4
mA
Normal
Resonator connection
operation Square wave input
4.1
4.9
μA
4.2
5.0
μA
Normal
Square wave input
operation Resonator connection
4.1
4.9
μA
4.2
5.0
μA
Normal
Square wave input
operation Resonator connection
4.2
5.5
μA
4.3
5.6
μA
Normal
Square wave input
operation Resonator connection
4.2
6.3
μA
4.3
6.4
μA
Normal
Square wave input
operation Resonator connection
4.8
7.7
μA
4.9
7.8
μA
TA = −40°C
fSUB = 32.768 kHz
Note 4
TA = +25°C
fSUB = 32.768 kHz
Note 4
TA = +50°C
fSUB = 32.768 kHz
Note 4
TA = +70°C
fSUB = 32.768 kHz
Note 4
TA = +85°C
(Notes and Remarks are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Notes 1. Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is
fixed to VDD, or VSS. The values below the MAX. column include the peripheral operation current.
However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and on-chip
pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1
(Ultra-low power consumption oscillation). However, not including the current flowing into the RTC, 12-bit
interval timer, and watchdog timer.
5. When Operating frequency setting of option byte = 48 MHz. When fHOCO is divided by HOCODIV. When
RDIV[1:0] = 00 (divided by 2: default).
6. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ VDD ≤ 5.5 [email protected] MHz to 24 MHz
2.4 V ≤ VDD ≤ 5.5 [email protected] MHz to 16 MHz
Remarks 1. fHOCO: High-speed on-chip oscillator clock frequency (Max. 48 MHz)
2. fIH:
Main system clock source frequency obtained by dividing the high-speed on-chip oscillator clock
by 2, 4, or 8 (Max. 24 MHz)
3. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
4. fPLL: PLL oscillation frequency
5. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
6. fCLK: CPU/peripheral hardware clock frequency
7. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C.
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Supply
current
IDD2
Note 2
(2/2)
Conditions
HALT
mode
Note 1
MIN.
TYP.
MAX.
Unit
VDD = 5.0 V
0.67
1.25
mA
VDD = 3.0 V
0.67
1.25
mA
VDD = 5.0 V
0.50
0.86
mA
VDD = 3.0 V
0.50
0.86
mA
VDD = 5.0 V
0.41
0.67
mA
VDD = 3.0 V
0.41
0.67
mA
VDD = 5.0 V
0.37
0.58
mA
VDD = 3.0 V
0.37
0.58
mA
Square wave input
0.28
1.00
mA
Resonator connection
0.45
1.17
mA
Square wave input
0.28
1.00
mA
Resonator connection
0.45
1.17
mA
Square wave input
0.19
0.60
mA
Resonator connection
0.26
0.67
mA
Square wave input
0.19
0.60
mA
VDD = 3.0 V
Resonator connection
0.26
0.67
mA
fPLL = 48 MHz,
VDD = 5.0 V
0.91
1.52
mA
VDD = 3.0 V
0.91
1.52
mA
VDD = 5.0 V
0.85
1.28
mA
VDD = 3.0 V
0.85
1.28
mA
VDD = 5.0 V
0.82
1.15
mA
fHOCO = 48 MHz
HS
(High-speed fIH = 24 MHz Note 4
main) mode
fHOCO = 24 MHz Note 7
Note 9
fIH = 12 MHz
Note 4
fHOCO = 12 MHz
fIH = 6 MHz
Note 4
fHOCO = 6 MHz
fIH = 3 MHz
Note 7
Note 7
Note 4
Note 3
,
fMX = 20 MHz
HS
(High-speed VDD = 5.0 V
main) mode
fMX = 20 MHz Note 3,
Note 9
VDD = 3.0 V
fMX = 10 MHz
Note 3
,
VDD = 5.0 V
fMX = 10 MHz
HS
Note 3
,
Note 3
(High-speed fCLK = 24 MHz
main) mode
fPLL = 48 MHz,
(PLL
fCLK = 12 MHz Note 3
operation)
Note 9
fPLL = 48 MHz,
fCLK = 6 MHz Note 3
VDD = 3.0 V
0.82
1.15
mA
Subsystem
fSUB = 32.768 kHzNote 5
Square wave input
0.25
0.57
μA
clock
operation
TA = −40°C
Resonator connection
0.44
0.76
μA
fSUB = 32.768 kHz
Square wave input
0.30
0.57
μA
TA = +25°C
Resonator connection
0.49
0.76
μA
fSUB = 32.768 kHz
Square wave input
0.33
1.17
μA
TA = +50°C
Resonator connection
0.63
1.36
μA
fSUB = 32.768 kHz
Square wave input
0.46
1.97
μA
TA = +70°C
Resonator connection
0.76
2.16
μA
fSUB = 32.768 kHzNote 5
Square wave input
0.97
3.37
μA
TA = +85°C
Resonator connection
1.16
3.56
μA
TA = −40°C
STOP
mode Note 8 TA = +25°C
0.18
0.50
μA
0.23
0.50
μA
TA = +50°C
0.26
1.10
μA
TA = +70°C
0.29
1.90
μA
TA = +85°C
0.90
3.30
μA
Note 5
Note 5
Note 5
IDD3Note 6
(Notes and Remarks are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Notes 1. Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is
fixed to VDD or VSS. The values below the MAX. column include the peripheral operation current. However,
not including the current flowing into the A/D converter, LVD circuit, USB 2.0 host/function module, I/O
port, and on-chip pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. During HALT instruction execution by flash memory.
3. When high-speed on-chip oscillator and subsystem clock are stopped.
4. When high-speed system clock and subsystem clock are stopped.
5. When high-speed on-chip oscillator and high-speed system clock are stopped. When RTCLPC = 1 and
setting ultra-low current consumption (AMPHS1 = 1). The current flowing into the RTC is included.
However, not including the current flowing into the 12-bit interval timer and watchdog timer.
6. Not including the current flowing into the RTC, 12-bit interval timer, and watchdog timer.
7. When Operating frequency setting of option byte = 48 MHz. When fHOCO is divided by HOCODIV. When
RDIV[1:0] = 00 (divided by 2: default).
8. Regarding the value for current to operate the subsystem clock in STOP mode, refer to that in HALT
mode.
9. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ VDD ≤ 5.5 [email protected] MHz to 24 MHz
2.4 V ≤ VDD ≤ 5.5 [email protected] MHz to 16 MHz
Remarks 1. fHOCO: High-speed on-chip oscillator clock frequency (Max. 48 MHz)
2. fIH:
Main system clock source frequency obtained by dividing the high-speed on-chip oscillator clock
by 2, 4, or 8 (Max. 24 MHz)
3. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
4. fPLL: PLL oscillation frequency
5. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
6. fCLK: CPU/peripheral hardware clock frequency
7. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V) (1/2)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Low-speed on-chip
oscillator operating
current
IFILNote 1
0.20
μA
RTC operating current
IRTC
0.02
μA
0.02
μA
0.22
μA
Notes 1, 2, 3
12-bit interval timer
operating current
IIT Notes 1, 2, 4
Watchdog timer
operating current
IWDT
Notes 1, 2, 5
A/D converter
operating current
IADC Notes 1, 6 When conversion
Normal mode, AVREFP = VDD = 5.0 V
at maximum speed Low voltage mode, AVREFP = VDD = 3.0 V
fIL = 15 kHz
Note 1
A/D converter reference IADREF
voltage current
1.3
1.7
mA
0.5
0.7
mA
75.0
μA
μA
Temperature sensor
operating current
ITMPS Note 1
75.0
LVD operating current
ILVD Notes 1, 7
0.08
Self-programming
operating current
IFSP Notes 1, 9
2.00
12.20
mA
2.00
12.20
mA
0.50
1.06
mA
1.20
1.62
mA
0.70
0.84
mA
Notes 1, 8
BGO operating current IBGO
SNOOZE operating
current
ISNOZ
Note 1
ADC operation
The mode is performed
Note 10
The A/D conversion operations are performed,
Low voltage mode, AVREFP = VDD = 3.0 V
CSI operation
μA
(Notes and Remarks are listed on the next page.)
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Rev.1.10
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V) (2/2)
Parameter
Symbol
USB operating current
IUSBH
Note 11
IUSBF
Note 11
ISUSP
Note 12
Conditions
MIN.
TYP.
MAX.
Unit
During USB communication operation under the following settings
and conditions (VDD = 5.0 V, TA = +25°C):
• The internal power supply for the USB is used.
• X1 oscillation frequency (fX) = 12 MHz, PLL oscillation frequency
(fPLL) = 48 MHz
• The host controller (via two ports) is set to operate in full-speed
mode with four pipes (end points) used simultaneously.
(PIPE4: Bulk OUT transfer (64 bytes), PIPE5: Bulk IN transfer (64
bytes), PIPE6: Interrupt OUT transfer, PIPE7: Interrupt IN transfer).
• The USB ports (two ports) are individually connected to a
peripheral function via a 0.5 m USB cable.
9.0
mA
During USB communication operation under the following settings
and conditions (VDD = 5.0 V, TA = +25°C):
• The internal power supply for the USB is used.
• X1 oscillation frequency (fX) = 12 MHz, PLL oscillation frequency
(fPLL) = 48 MHz
• The function controller is set to operate in full-speed mode with
four pipes (end points) used simultaneously.
(PIPE4: Bulk OUT transfer (64 bytes), PIPE5: Bulk IN transfer (64
bytes), PIPE6: Interrupt OUT transfer, PIPE7: Interrupt IN transfer).
• The USB port (one port) is connected to the host device via a
0.5 m USB cable.
2.5
mA
During suspended state under the following settings and conditions
(VDD = 5.0 V, TA = +25°C):
• The function controller is set to full-speed mode (the UDP0 pin is
pulled up).
• The internal power supply for the USB is used.
• The system is set to STOP mode (When the high-speed on-chip
oscillator, high-speed system clock, and subsystem clock are
stopped. When the watchdog timer is stopped.).
• The USB port (one port) is connected to the host device via a
0.5 m USB cable.
240
μA
(Notes and Remarks are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Notes 1. Current flowing to VDD.
2. When high speed on-chip oscillator and high-speed system clock are stopped.
3. Current flowing only to the real-time clock (RTC) (excluding the operating current of the low-speed
on-chip ocsillator and the XT1 oscillator). The supply current of the RL78 microcontrollers is the sum of
the values of either IDD1 or IDD2, and IRTC, when the real-time clock operates in operation mode or HALT
mode. When the low-speed on-chip oscillator is selected, IFIL should be added.
IDD2 subsystem clock
operation includes the operational current of the real-time clock.
4. Current flowing only to the 12-bit interval timer (excluding the operating current of the low-speed on-chip
ocsillator and the XT1 oscillator). The supply current of the RL78 microcontrollers is the sum of the
values of either IDD1 or IDD2, and IIT, when the 12-bit interval timer operates in operation mode or HALT
mode. When the low-speed on-chip oscillator is selected, IFIL should be added.
5. Current flowing only to the watchdog timer (including the operating current of the low-speed on-chip
oscillator). The supply current of the RL78 microcontrollers is the sum of IDD1, IDD2 or IDD3 and IWDT when
the watchdog timer is in operation.
6. Current flowing only to the A/D converter. The supply current of the RL78 microcontrollers is the sum of
IDD1 or IDD2 and IADC when the A/D converter operates in an operation mode or the HALT mode.
7. Current flowing only to the LVD circuit. The current value of the RL78/G1C is the sum of IDD1, IDD2 or IDD3
and ILVI when the LVD circuit operates in the Operating, HALT or STOP mode.
8. Current flowing only during data flash rewrite.
9. Current flowing only during self programming.
10. For shift time to the SNOOZE mode, see 19.3.3 SNOOZE mode in the RL78/G1C User’s Manual:
Hardware.
11. Current consumed only by the USB module and the internal power supply for the USB.
12. Includes the current supplied from the pull-up resistor of the UDP0 pin to the pull-down resistor of the
host device, in addition to the current consumed by this MCU during the suspended state.
Remarks 1. fIL:
Low-speed on-chip oscillator clock frequency
2. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
3. fCLK: CPU/peripheral hardware clock frequency
4. Temperature condition of the TYP. value is TA = 25°C
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
2.4 AC Characteristics
2.4.1 Basic operation
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
Instruction cycle (minimum
instruction execution time)
TCY
Conditions
Main
system
clock (fMAIN)
operation
MIN.
TYP.
2.7 V ≤ VDD ≤ 5.5 V 0.04167
HS
(High-speed 2.4 V ≤ VDD < 2.7 V 0.0625
main) mode
Subsystem clock (fSUB)
2.4 V ≤ VDD ≤ 5.5 V
28.5
30.5
MAX.
Unit
1
μs
1
μs
31.3
μs
1
μs
1
μs
operation
In the self
HS
2.7 V ≤ VDD ≤ 5.5 V 0.04167
programming (High-speed 2.4 V ≤ VDD < 2.7 V 0.0625
mode
main) mode
External system clock frequency
fEX
2.7 V ≤ VDD ≤ 5.5 V
1.0
20.0
MHz
2.4 V ≤ VDD < 2.7 V
1.0
16.0
MHz
32
35
kHz
fEXS
External system clock input
high-level width, low-level width
tEXH, tEXL
2.7 V ≤ VDD ≤ 5.5 V
24
2.4 V ≤ VDD < 2.7 V
tEXHS, tEXLS
TI00 to TI03 input high-level
width, low-level width
tTIH,
tTIL
TO00 to TO03 output frequency
fTO
PCLBUZ0, PCLBUZ1 output
frequency
Interrupt input high-level width,
low-level width
fPCL
tINTH,
tINTL
Key interrupt input low-level width tKR
RESET low-level width
High-speed main
mode
High-speed main
mode
ns
30
ns
13.7
μs
1/fMCK+10
ns
4.0 V ≤ VDD ≤ 5.5 V
12
MHz
2.7 V ≤ VDD < 4.0 V
8
MHz
2.4 V ≤ VDD < 2.7 V
4
MHz
4.0 V ≤ VDD ≤ 5.5 V
16
MHz
2.7 V ≤ VDD < 4.0 V
8
MHz
2.4 V ≤ VDD < 2.7 V
4
MHz
μs
INTP0 to INTP6,
INTP8, INTP9
2.4 V ≤ VDD ≤ 5.5 V
1
KR0 to KR5
2.4 V ≤ VDD ≤ 5.5 V
250
ns
10
μs
tRSL
Remark fMCK: Timer array unit operation clock frequency
(Operation clock to be set by the CKS0n bit of timer mode register 0n (TMR0n). n: Channel number (n =
0 to 3))
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Minimum Instruction Execution Time during Main System Clock Operation
TCY vs VDD (HS (high-speed main) mode)
10
1.0
Cycle time TCY [μs]
When the high-speed on-chip oscillator
clock is selected
During self programming
When high-speed system clock is selected
0.1
0.0625
0.05
0.04167
0.01
0
1.0
2.0
3.0
2.4 2.7
4.0
5.0 5.5 6.0
Supply voltage VDD [V]
AC Timing Test Points
VIH/VOH
VIL/VOL
Test points
VIH/VOH
VIL/VOL
External System Clock Timing
1/fEX/
1/fEXS
tEXL/
tEXLS
tEXH/
tEXHS
EXCLK/EXCLKS
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
TI/TO Timing
tTIH
tTIL
TI00 to TI03
1/fTO
TO00 to TO03
Interrupt Request Input Timing
tINTL
tINTH
INTP0 to INTP6, INTP8, INTP9
Key Interrupt Input Timing
tKR
KR0 to KR5
RESET Input Timing
tRSL
RESET
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
2.5 Peripheral Functions Characteristics
2.5.1 Serial array unit
(1) During communication at same potential (UART mode) (dedicated baud rate generator output)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
Transfer rate
Theoretical value of the
maximum transfer rate
fMCK = fCLK Note
MAX.
Unit
fMCK/6
bps
4.0
Mbps
Note The maximum operating frequencies of the CPU/peripheral hardware clock (fCLK) are:
HS (high-speed main) mode:
24 MHz (2.7 V ≤ VDD ≤ 5.5 V)
16 MHz (2.4 V ≤ VDD ≤ 5.5 V)
Caution Select the normal input buffer for the RxDq pin and the normal output mode for the TxDq pin by
using port input mode register g (PIMg) and port output mode register g (POMg).
UART mode connection diagram (during communication at same potential)
Rx
TxDq
User's device
RL78 microcontroller
Tx
RxDq
UART mode bit width (during communication at same potential) (reference)
1/Transfer rate
High-/Low-bit width
Baud rate error tolerance
TxDq
RxDq
Remarks 1.
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00))
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(2) During communication at same potential (CSI mode) (master mode, SCKp... internal clock output,
corresponding CSI00 only)
(TA = −40 to +85°C, 2.7 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
SCKp cycle time
tKCY1
tKCY1 ≥ 2/fCLK
SCKp high-/low-level width
tKH1,
tKL1
tSIK1
SIp setup time (to SCKp↑)
Note 1
SIp hold time (from SCKp↑)
Note 2
Delay time from SCKp↓ to
SOp output Note 3
2.7 V ≤ VDD ≤ 5.5 V
MIN.
TYP.
MAX.
Unit
83.3
ns
4.0 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 7
ns
2.7 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 10
ns
4.0 V ≤ VDD ≤ 5.5 V
23
ns
2.7 V ≤ VDD ≤ 5.5 V
33
ns
tKSI1
2.7 V ≤ VDD ≤ 5.5 V
10
tKSO1
C = 20 pFNote 3
ns
10
ns
Notes 1. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
2. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. C is the load capacitance of the SCKp and SOp output lines.
Caution Select the normal input buffer for the SIp pin and the normal output mode for the SOp pin and
SCKp pin by using port input mode register g (PIMg) and port output mode register g (POMg).
Remarks 1.
2.
This specification is valid only when CSI00’s peripheral I/O redirect function is not used.
p: CSI number (p = 00), m: Unit number (m = 0), n: Channel number (n = 0),
g: PIM and POM numbers (g = 3, 5)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00))
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(3) During communication at same potential (CSI mode) (master mode, SCKp... internal clock output)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
2.7 V ≤ VDD ≤ 5.5 V
MIN.
TYP.
MAX.
Unit
SCKp cycle time
tKCY1
tKCY1 ≥ 4/fCLK
SCKp high-/low-level width
tKH1,
tKL1
4.0 V ≤ VDD ≤ 5.5 V
2.7 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 18
ns
2.4 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 38
ns
4.0 V ≤ VDD ≤ 5.5 V
44
ns
2.7 V ≤ VDD ≤ 5.5 V
44
ns
2.4 V ≤ VDD ≤ 5.5 V
75
ns
19
ns
2.4 V ≤ VDD ≤ 5.5 V
SIp setup time (to SCKp↑)
Note 1
SIp hold time (from SCKp↑)
Note 2
Delay time from SCKp↓ to
SOp output Note 3
tSIK1
tKSI1
tKSO1
C = 30 pF
167
ns
250
ns
tKCY1/2 − 12
ns
Note 4
25
ns
Notes 1. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
2. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. C is the load capacitance of the SCKp and SOp output lines.
Caution Select the normal input buffer for the SIp pin and the normal output mode for the SOp pin and
SCKp pin by using port input mode register g (PIMg) and port output mode register g (POMg).
Remarks 1.
p: CSI number (p = 00, 01), m: Unit number (m = 0), n: Channel number (n = 0, 1),
g: PIM and POM numbers (g = 0, 3, 5, 7)
2.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00, 01))
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
(4) During communication at same potential (CSI mode) (slave mode, SCKp... external clock input)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCKp cycle time
Symbol
Note 5
tKCY2
Conditions
4.0 V ≤ VDD ≤ 5.5 V
tKH2,
tKL2
SIp setup time
(to SCKp↑) Note 1
tSIK2
SIp hold time
(from SCKp↑) Note 2
tKSI2
Delay time from SCKp↓ to
SOp output Note 3
tKSO2
TYP.
MAX.
Unit
20 MHz < fMCK
8/fMCK
ns
fMCK ≤ 20 MHz
6/fMCK
ns
16 MHz < fMCK
8/fMCK
ns
fMCK ≤ 16 MHz
6/fMCK
ns
2.4 V ≤ VDD ≤ 5.5 V
6/fMCK
and 500
ns
4.0 V ≤ VDD ≤ 5.5 V
tKCY2/2 − 7
ns
2.7 V ≤ VDD ≤ 5.5 V
tKCY2/2 − 8
ns
2.4 V ≤ VDD ≤ 5.5 V
tKCY2/2 −
18
ns
2.7 V ≤ VDD ≤ 5.5 V
1/fMCK+20
ns
2.4 V ≤ VDD ≤ 5.5 V
1/fMCK+30
ns
2.7 V ≤ VDD ≤ 5.5 V
1/fMCK+31
ns
2.4 V ≤ VDD ≤ 5.5 V
1/fMCK+31
ns
2.7 V ≤ VDD ≤ 5.5 V
SCKp high-/low-level width
MIN.
C = 30 pF
Note 4
2.7 V ≤ VDD ≤ 5.5 V
2/fMCK+44
ns
2.4 V ≤ VDD ≤ 5.5 V
2/fMCK+75
ns
Notes 1. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
2. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. C is the load capacitance of the SOp output lines.
5. Transfer rate in the SNOOZE mode: MAX. 1 Mbps
Caution Select the normal input buffer for the SIp pin and SCKp pin and the normal output mode for the
SOp pin by using port input mode register g (PIMg) and port output mode register g (POMg).
Remarks 1.
p: CSI number (p = 00, 01), m: Unit number (m = 0),
n: Channel number (n = 0, 1), g: PIM number (g = 0, 3, 5, 7)
2.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number, n:
Channel number (mn = 00, 01))
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
CSI mode connection diagram (during communication at same potential)
SCK
SCKp
RL78 microcontroller SIp
SO
User's device
SI
SOp
CSI mode serial transfer timing (during communication at same potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY1, 2
tKL1, 2
tKH1, 2
SCKp
tSIK1, 2
SIp
tKSI1, 2
Input data
tKSO1, 2
Output data
SOp
CSI mode serial transfer timing (during communication at same potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY1, 2
tKH1, 2
tKL1, 2
SCKp
tSIK1, 2
SIp
tKSI1, 2
Input data
tKSO1, 2
SOp
Remarks 1.
2.
Output data
p: CSI number (p = 00, 01)
m: Unit number, n: Channel number (mn = 00, 01)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
(5) During communication at same potential (simplified I C mode)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCLr clock frequency
Hold time when SCLr = “L”
Hold time when SCLr = “H”
Data setup time (reception)
Data hold time (transmission)
Symbol
fSCL
tLOW
tHIGH
tSU:DAT
tHD:DAT
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
Conditions
MIN.
1000 Note 1
kHz
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
400 Note 1
kHz
2.4 V ≤ VDD < 2.7 V,
Cb = 100 pF, Rb = 5 kΩ
300 Note 1
kHz
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
475
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
1150
ns
2.4 V ≤ VDD < 2.7 V,
Cb = 100 pF, Rb = 5 kΩ
1550
ns
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
475
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
1150
ns
2.4 V ≤ VDD < 2.7 V,
Cb = 100 pF, Rb = 5 kΩ
1550
ns
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK + 85
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
1/fMCK + 145
2.4 V ≤ VDD < 2.7 V,
Cb = 100 pF, Rb = 5 kΩ
1/fMCK + 230
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
305
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
0
355
ns
2.4 V ≤ VDD < 2.7 V,
Cb = 100 pF, Rb = 5 kΩ
0
405
ns
Note 2
ns
Note 2
ns
Note 2
Notes 1. The value must also be equal to or less than fMCK/4.
2. Set the fMCK value to keep the hold time of SCLr = "L" and SCLr = "H".
Caution
Select the normal input buffer and the N-ch open drain output (VDD tolerance) mode for the SDAr
pin and the normal output mode for the SCLr pin by using port input mode register g (PIMg) and
port output mode register h (POMh).
(Caution and Remarks are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
Simplified I C mode mode connection diagram (during communication at same potential)
VDD
Rb
SDA
SDAr
User's device
RL78 microcontroller
SCL
SCLr
2
Simplified I C mode serial transfer timing (during communication at same potential)
1/fSCL
tLOW
tHIGH
SCLr
SDAr
tHD:DAT
tSU:DAT
Remarks 1. Rb[Ω]:Communication line (SDAr) pull-up resistance, Cb[F]: Communication line (SDAr, SCLr) load
capacitance
2. r: IIC number (r = 00, 01), g: PIM number (g = 5), h: POM number (h = 3, 5)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number (m
= 0), n: Channel number (n = 0, 1), mn = 00, 01)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(6) Communication at different potential (2.5 V, 3 V) (UART mode) (1/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Transfer rate
Conditions
reception
MIN.
TYP.
Note 1
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V
MAX.
fMCK/6
Theoretical value of the
Unit
bps
4.0
Mbps
fMCK/6Note 1
bps
4.0
Mbps
fMCK/6Note 1
bps
4.0
Mbps
maximum transfer rate
fMCK = fCLK Note 2
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb ≤ 2.7 V
Theoretical value of the
maximum transfer rate
fMCK = fCLK Note 2
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V
Theoretical value of the
maximum transfer rate
fMCK = fCLK Note 2
Notes 1. Use it with VDD≥Vb.
2. The maximum operating frequencies of the CPU/peripheral hardware clock (fCLK) are:
HS (high-speed main) mode:
24 MHz (2.7 V ≤ VDD ≤ 5.5 V)
16 MHz (2.4 V ≤ VDD ≤ 5.5 V)
Caution
Select the TTL input buffer for the RxDq pin and the N-ch open drain output (VDD tolerance) mode
for the TxDq pin by using port input mode register g (PIMg) and port output mode register g
(POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
Remarks 1.
Vb[V]: Communication line voltage
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00)
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
(6) Communication at different potential (2.5 V, 3 V) (UART mode) (2/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
transmission 4.0 V ≤ VDD ≤ 5.5 V,
Transfer rate
2.7 V ≤ Vb ≤ 4.0 V
MAX.
Unit
Note 1
bps
2.8
Theoretical value of the
maximum transfer rate
Note 2
Mbps
Cb = 50 pF, Rb = 1.4 kΩ, Vb = 2.7 V
2.7 V ≤ VDD < 4.0 V
Note 3
2.3 V ≤ Vb ≤ 2.7 V
1.2
Theoretical value of the
maximum transfer rate
Note 4
bps
Mbps
Cb = 50 pF, Rb = 2.7 kΩ, Vb = 2.3 V
2.4 V ≤ VDD < 3.3 V
1.6 V ≤ Vb ≤ 2.0 V
Theoretical value of the
maximum transfer rate
Notes
5, 6
bps
0.43
Mbps
Note 7
Cb = 50 pF, Rb = 5.5 kΩ, Vb = 1.6 V
Notes 1.
The smaller maximum transfer rate derived by using fMCK/6 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 4.0 V ≤ VDD ≤ 5.5 V and 2.7 V ≤ Vb ≤ 4.0 V
1
Maximum transfer rate =
{−Cb × Rb × ln (1 −
2.2
Vb )} × 3
[bps]
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
2.2
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
2.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 1 above to calculate the maximum transfer rate under conditions of the customer.
3.
The smaller maximum transfer rate derived by using fMCK/6 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 2.7 V ≤ VDD < 4.0 V and 2.3 V ≤ Vb ≤ 2.7 V
1
Maximum transfer rate =
{−Cb × Rb × ln (1 −
2.0
Vb )} × 3
[bps]
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
2.0
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
4.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 3 above to calculate the maximum transfer rate under conditions of the customer.
5.
Use it with VDD ≥ Vb.
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Notes 6.
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
The smaller maximum transfer rate derived by using fMCK/6 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 2.4 V ≤ VDD < 3.3 V and 1.6 V ≤ Vb ≤ 2.0 V
1
Maximum transfer rate =
[bps]
1.5
Vb )} × 3
{−Cb × Rb × ln (1 −
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
1.5
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
7.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 6 above to calculate the maximum transfer rate under conditions of the customer.
Caution Select the TTL input buffer for the RxDq pin and the N-ch open drain output (VDD tolerance) mode
for the TxDq pin by using port input mode register g (PIMg) and port output mode register g
(POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
UART mode connection diagram (during communication at different potential)
Vb
Rb
TxDq
Rx
User's device
RL78 microcontroller
RxDq
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
UART mode bit width (during communication at different potential) (reference)
1/Transfer rate
Low-bit width
High-bit width
Baud rate error tolerance
TxDq
1/Transfer rate
High-/Low-bit width
Baud rate error tolerance
RxDq
Remarks 1.
Rb[Ω]:Communication line (TxDq) pull-up resistance, Cb[F]: Communication line (TxDq) load
capacitance, Vb[V]: Communication line voltage
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(7) Communication at different potential (2.5 V, 3 V) (CSI mode) (master mode, SCKp... internal clock output,
corresponding CSI00 only)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
SCKp cycle time
tKCY1
tKCY1 ≥ 2/fCLK
Conditions
MIN.
TYP.
MAX.
Unit
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
200
ns
2.7 V ≤ VDD < 4.0 V,
300
ns
tKCY1/2 − 50
ns
tKCY1/2 −
120
ns
tKCY1/2 − 7
ns
tKCY1/2 − 10
ns
58
ns
121
ns
10
ns
10
ns
2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
SCKp high-level width
tKH1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
SCKp low-level width
tKL1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
tSIK1
SIp setup time
(to SCKp↑) Note 1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
tKSI1
SIp hold time
(from SCKp↑) Note 1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
Delay time from SCKp↓ to
SOp output Note 1
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
60
ns
130
ns
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
tSIK1
SIp setup time
(to SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
23
ns
33
ns
10
ns
10
ns
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
tKSI1
SIp hold time
(from SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
Delay time from SCKp↑ to
SOp output Note 2
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
10
ns
10
ns
Cb = 20 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 20 pF, Rb = 2.7 kΩ
Notes 1.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.
2.
When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
(Caution and Remark are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Caution Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance) mode for
the SOp pin and SCKp pin by using port input mode register g (PIMg) and port output mode
register g (POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
Remarks 1. Rb[Ω]:Communication line (SCKp, SOp) pull-up resistance, Cb[F]: Communication line (SCKp, SOp)
load capacitance, Vb[V]: Communication line voltage
2. p: CSI number (p = 00), m: Unit number (m = 0), n: Channel number (n = 0),
g: PIM and POM number (g = 3, 5)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00)
4. This value is valid only when CSI00’s peripheral I/O redirect function is not used.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(8) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (master mode, SCKp... internal clock output)
(1/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
SCKp cycle time
tKCY1
Conditions
tKCY1 ≥ 4/fCLK 4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V,
MIN.
TYP.
MAX.
Unit
300
ns
500
ns
1150
ns
tKCY1/2 − 75
ns
tKCY1/2 −
170
ns
tKCY1/2 −
458
ns
tKCY1/2 − 12
ns
tKCY1/2 − 18
ns
tKCY1/2 − 50
ns
2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V,
2.4 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
SCKp high-level width
tKH1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
SCKp low-level width
tKL1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb
= 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
Cautions 1. Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance)
mode for the SOp pin and SCKp pin by using port input mode register g (PIMg) and port
output mode register g (POMg). For VIH and VIL, see the DC characteristics with TTL input
buffer selected.
2. Use it with VDD ≥ Vb.
(Remarks are listed two pages after the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(8) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (master mode, SCKp... internal clock output)
(2/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
tSIK1
SIp setup time
(to SCKp↑) Note 1
Conditions
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
MIN.
TYP.
MAX.
Unit
81
ns
177
ns
479
ns
19
ns
19
ns
19
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tKSI1
SIp hold time
(from SCKp↑) Note 1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
Delay time from SCKp↓ to
SOp output Note 1
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
100
ns
195
ns
483
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tSIK1
SIp setup time
(to SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
44
ns
44
ns
110
ns
19
ns
19
ns
19
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tKSI1
SIp hold time
(from SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
Delay time from SCKp↑ to
SOp output Note 2
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
25
ns
25
ns
25
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
(Notes, Cautions and Remarks are listed on the next page.)
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
Notes 1.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.
2.
When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3.
Use it with VDD ≥ Vb.
Caution
Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance) mode
for the SOp pin and SCKp pin by using port input mode register g (PIMg) and port output mode
register g (POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
CSI mode connection diagram (during communication at different potential)
<Master>
Vb
Vb
Rb
Rb
SCKp
RL78 microcontroller SIp
SOp
SCK
SO
User's device
SI
Remarks 1. Rb[Ω]: Communication line (SCKp, SOp) pull-up resistance, Cb[F]: Communication line (SCKp, SOp)
load capacitance, Vb[V]: Communication line voltage
2. p: CSI number (p = 00), m: Unit number , n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
4. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
CSI mode serial transfer timing (master mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY1
tKL1
tKH1
SCKp
tSIK1
SIp
tKSI1
Input data
tKSO1
SOp
Output data
CSI mode serial transfer timing (master mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY1
tKL1
tKH1
SCKp
tSIK1
SIp
tKSI1
Input data
tKSO1
SOp
Output data
Remarks 1. p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
2. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
(9) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (slave mode, SCKp... external clock
input)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCKp cycle time
Symbol
Note 1
tKCY2
Conditions
tKH2,
tKL2
tSIK2
SIp setup time
(to SCKp↑) Note 3
SIp hold time
(from SCKp↑) Note 4
tKSI2
Delay time from SCKp↓ to
SOp output Note 5
tKSO2
TYP.
MAX.
Unit
4.0 V ≤ VDD ≤ 5.5 V,
20 MHz < fMCK ≤ 24 MHz
12/fMCK
ns
2.7 V ≤ Vb ≤ 4.0 V
8 MHz < fMCK ≤ 20 MHz
10/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
8/fMCK
ns
fMCK ≤ 4 MHz
6/fMCK
ns
2.7 V ≤ VDD < 4.0 V,
20 MHz < fMCK ≤ 24 MHz
16/fMCK
ns
2.3 V ≤ Vb ≤ 2.7 V
16 MHz < fMCK ≤ 20 MHz
14/fMCK
ns
8 MHz < fMCK ≤ 16 MHz
12/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
8/fMCK
ns
fMCK ≤ 4 MHz
6/fMCK
ns
2.4 V ≤ VDD < 3.3 V,
20 MHz < fMCK ≤ 24 MHz
36/fMCK
ns
1.6 V ≤ Vb ≤ 2.0 V
16 MHz < fMCK ≤ 20 MHz
32/fMCK
ns
8 MHz < fMCK ≤ 16 MHz
26/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
16/fMCK
ns
Note 2
fMCK ≤ 4 MHz
SCKp high-/low-level
width
MIN.
10/fMCK
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V
tKCY2/2 −
12
ns
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
tKCY2/2 −
18
ns
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2
tKCY2/2 −
50
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V
1/fMCK +
20
ns
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
1/fMCK +
20
ns
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2
1/fMCK +
30
ns
1/fMCK + 31
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 30 pF, Rb = 5.5 kΩ
2/fMCK +
120
ns
2/fMCK +
214
ns
2/fMCK +
573
ns
Notes 1. Transfer rate in the SNOOZE mode: MAX. 1 Mbps
2. Use it with VDD ≥ Vb.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
5. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
(Caution and Remarks are listed on the next page.)
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ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
Caution Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance) mode for
the SOp pin and SCKp pin by using port input mode register g (PIMg) and port output mode
register g (POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
CSI mode connection diagram (during communication at different potential)
<Slave>
Vb
Rb
SCKp
RL78 microcontroller SIp
SOp
Remarks 1.
SCK
SO
User's device
SI
Rb[Ω]:Communication line (SOp) pull-up resistance, Cb[F]: Communication line (SOp) load
capacitance, Vb[V]: Communication line voltage
2.
p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
4.
CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
CSI mode serial transfer timing (slave mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY2
tKL2
tKH2
SCKp
tSIK2
SIp
tKSI2
Input data
tKSO2
Output data
SOp
CSI mode serial transfer timing (slave mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY2
tKL2
tKH2
SCKp
tSIK2
SIp
tKSI2
Input data
tKSO2
Output data
SOp
Remarks 1. p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00),
g: PIM and POM number (g = 0, 3, 5, 7)
2. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
R01DS0348EJ0110
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
(10) Communication at different potential (1.8 V, 2.5 V, 3 V) (simplified I C mode) (1/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCLr clock frequency
Symbol
fSCL
Conditions
MIN.
MAX.
Unit
1000 Note 1
kHz
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
1000 Note 1
kHz
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
400 Note 1
kHz
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
400 Note 1
kHz
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
300 Note 1
kHz
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
Hold time when SCLr = “L”
tLOW
4.0 V ≤ VDD ≤ 5.5 V,
475
ns
475
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
1150
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
1150
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
1550
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
245
ns
2.7 V ≤ VDD < 4.0 V,
200
ns
675
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
600
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
610
ns
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
Hold time when SCLr = “H”
tHIGH
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
(Notes, Caution and Remarks are listed on the next page.)
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Rev.1.10
Page 57 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
(10) Communication at different potential (1.8 V, 2.5 V, 3 V) (simplified I C mode) (2/2)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Data setup time (reception)
Data hold time (transmission)
Symbol
tSU:DAT
tHD:DAT
Conditions
MIN.
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK + 135
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK + 135
MAX.
Unit
ns
Note 3
ns
Note 3
4.0 V ≤ VDD ≤ 5.5 V,
1/fMCK + 190
Note 3
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
ns
2.7 V ≤ VDD < 4.0 V,
1/fMCK + 190
Note 3
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
ns
2.4 V ≤ VDD < 3.3 V,
1/fMCK + 190
Note 3
1.6 V ≤ Vb ≤ 2.0 V Notes 2,
Cb = 100 pF, Rb = 5.5 kΩ
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
305
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
305
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
0
355
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
0
355
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
0
405
ns
Notes 1. The value must also be equal to or less than fMCK/4.
2. Use it with VDD ≥ Vb.
3. Set the fMCK value to keep the hold time of SCLr = "L" and SCLr = "H".
Caution
Select the TTL input buffer and the N-ch open drain output (VDD tolerance) mode for the SDAr pin
and the N-ch open drain output (VDD tolerance) mode for the SCLr pin by using port input mode
register g (PIMg) and port output mode register g (POMg). For VIH and VIL, see the DC
characteristics with TTL input buffer selected.
(Remarks are listed on the next page.)
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Rev.1.10
Page 58 of 135
RL78/G1C
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.
2
Simplified I C mode connection diagram (during communication at different potential)
Vb
Rb
Vb
Rb
SDA
SDAr
User's device
RL78 microcontroller
SCL
SCLr
2
Simplified I C mode serial transfer timing (during communication at different potential)
1/fSCL
tLOW
tHIGH
SCLr
SDAr
tHD:DAT
tSU:DAT
Remarks 1. Rb[Ω]:Communication line (SDAr, SCLr) pull-up resistance, Cb[F]: Communication line (SDAr, SCLr)
load capacitance, Vb[V]: Communication line voltage
2. r: IIC number (r = 00), g: PIM, POM number (g = 0, 3, 5, 7)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number, n:
Channel number (mn = 00)
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.5.2 Serial interface IICA
2
(1) I C standard mode
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
HS (high-speed main) mode
MIN.
SCLA0 clock frequency
fSCL
Setup time of restart condition tSU:STA
Note 1
Hold time
tHD:STA
Hold time when SCLA0 = “L”
Hold time when SCLA0 = “H”
Data setup time (reception)
tLOW
tHIGH
tSU:DAT
Data hold time
(transmission)Note 2
tHD:DAT
Setup time of stop condition
tSU:STO
Bus-free time
Notes 1.
2.
tBUF
Unit
MAX.
Standard mode: fCLK ≥ 1 MHz 2.7 V ≤ VDD ≤ 5.5 V
0
100
kHz
2.4 V ≤ VDD ≤ 5.5 V
0
100
kHz
2.7 V ≤ VDD ≤ 5.5 V
4.7
μs
2.4 V ≤ VDD ≤ 5.5 V
4.7
μs
2.7 V ≤ VDD ≤ 5.5 V
4.0
μs
2.4 V ≤ VDD ≤ 5.5 V
4.0
μs
2.7 V ≤ VDD ≤ 5.5 V
4.7
μs
2.4 V ≤ VDD ≤ 5.5 V
4.7
μs
2.7 V ≤ VDD ≤ 5.5 V
4.0
μs
2.4 V ≤ VDD ≤ 5.5 V
4.0
μs
2.7 V ≤ VDD ≤ 5.5 V
250
μs
2.4 V ≤ VDD ≤ 5.5 V
250
μs
2.7 V ≤ VDD ≤ 5.5 V
0
3.45
μs
2.4 V ≤ VDD ≤ 5.5 V
0
3.45
μs
2.7 V ≤ VDD ≤ 5.5 V
4.0
μs
2.4 V ≤ VDD ≤ 5.5 V
4.0
μs
2.7 V ≤ VDD ≤ 5.5 V
4.7
μs
2.4 V ≤ VDD ≤ 5.5 V
4.7
μs
The first clock pulse is generated after this period when the start/restart condition is detected.
The maximum value (MAX.) of tHD:DAT is during normal transfer and a wait state is inserted in the ACK
(acknowledge) timing.
Caution The values in the above table are applied even when bit 1 (PIOR1) in the peripheral I/O redirection
register (PIOR) is 1. At this time, the pin characteristics (IOH1, IOL1, VOH1, VOL1) must satisfy the
values in the redirect destination.
Remark The maximum value of Cb (communication line capacitance) and the value of Rb (communication line
pull-up resistor) at that time in each mode are as follows.
Standard mode: Cb = 400 pF, Rb = 2.7 kΩ
R01DS0348EJ0110
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Rev.1.10
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
(2) I C fast mode
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
SCLA0 clock frequency
fSCL
Setup time of restart condition tSU:STA
Note 1
Hold time
tHD:STA
Hold time when SCLA0 = “L”
tLOW
Hold time when SCLA0 = “H”
tHIGH
Data setup time (reception)
tSU:DAT
Data hold time
(transmission)Note 2
tHD:DAT
Setup time of stop condition
tSU:STO
Bus-free time
Notes 1.
2.
tBUF
Conditions
Fast mode: fCLK ≥ 3.5 MHz
HS (high-speed main) Mode
Unit
MIN.
MAX.
2.7 V ≤ VDD ≤ 5.5 V
0
400
kHz
2.4 V ≤ VDD ≤ 5.5 V
0
400
kHz
2.7 V ≤ VDD ≤ 5.5 V
0.6
μs
2.4 V ≤ VDD ≤ 5.5 V
0.6
μs
2.7 V ≤ VDD ≤ 5.5 V
0.6
μs
2.4 V ≤ VDD ≤ 5.5 V
0.6
μs
2.7 V ≤ VDD ≤ 5.5 V
1.3
μs
2.4 V ≤ VDD ≤ 5.5 V
1.3
μs
2.7 V ≤ VDD ≤ 5.5 V
0.6
μs
2.4 V ≤ VDD ≤ 5.5 V
0.6
μs
2.7 V ≤ VDD ≤ 5.5 V
100
ns
2.4 V ≤ VDD ≤ 5.5 V
100
ns
2.7 V ≤ VDD ≤ 5.5 V
0
0.9
μs
2.4 V ≤ VDD ≤ 5.5 V
0
0.9
μs
2.7 V ≤ VDD ≤ 5.5 V
0.6
μs
2.4 V ≤ VDD ≤ 5.5 V
0.6
μs
2.7 V ≤ VDD ≤ 5.5 V
1.3
μs
2.4 V ≤ VDD ≤ 5.5 V
1.3
μs
The first clock pulse is generated after this period when the start/restart condition is detected.
The maximum value (MAX.) of tHD:DAT is during normal transfer and a wait state is inserted in the ACK
(acknowledge) timing.
Caution The values in the above table are applied even when bit 1 (PIOR1) in the peripheral I/O redirection
register (PIOR) is 1. At this time, the pin characteristics (IOH1, IOL1, VOH1, VOL1) must satisfy the
values in the redirect destination.
Remark The maximum value of Cb (communication line capacitance) and the value of Rb (communication line
pull-up resistor) at that time in each mode are as follows.
Fast mode:
R01DS0348EJ0110
Nov 15, 2013
Cb = 320 pF, Rb = 1.1 kΩ
Rev.1.10
Page 61 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2
(3) I C fast mode plus
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
SCLA0 clock frequency
fSCL
Conditions
Fast mode plus:
HS (high-speed main) Mode
2.7 V ≤ VDD ≤ 5.5 V
MIN.
MAX.
0
1000
Unit
kHz
fCLK ≥ 10 MHz
Setup time of restart condition tSU:STA
2.7 V ≤ VDD ≤ 5.5 V
0.26
μs
Hold time
tHD:STA
2.7 V ≤ VDD ≤ 5.5 V
0.26
μs
Hold time when SCLA0 = “L”
tLOW
2.7 V ≤ VDD ≤ 5.5 V
0.5
μs
Hold time when SCLA0 = “H”
tHIGH
2.7 V ≤ VDD ≤ 5.5 V
0.26
μs
Data setup time (reception)
tSU:DAT
2.7 V ≤ VDD ≤ 5.5 V
50
ns
Data hold time
(transmission)Note 2
tHD:DAT
2.7 V ≤ VDD ≤ 5.5 V
0
Setup time of stop condition
tSU:STO
2.7 V ≤ VDD ≤ 5.5 V
0.26
μs
Bus-free time
tBUF
2.7 V ≤ VDD ≤ 5.5 V
0.5
μs
Note 1
Notes 1.
2.
μs
0.45
The first clock pulse is generated after this period when the start/restart condition is detected.
The maximum value (MAX.) of tHD:DAT is during normal transfer and a wait state is inserted in the ACK
(acknowledge) timing.
Caution The values in the above table are applied even when bit 1 (PIOR1) in the peripheral I/O redirection
register (PIOR) is 1. At this time, the pin characteristics (IOH1, IOL1, VOH1, VOL1) must satisfy the
values in the redirect destination.
Remark The maximum value of Cb (communication line capacitance) and the value of Rb (communication line
pull-up resistor) at that time in each mode are as follows.
Fast mode plus: Cb = 120 pF, Rb = 1.1 kΩ
IICA serial transfer timing
tLOW
SCLA0
tHD:DAT
tHD:STA
tHIGH
tSU:STA
tHD:STA
tSU:STO
tSU:DAT
SDAA0
tLOW
Stop
condition
R01DS0348EJ0110
Nov 15, 2013
Start
condition
Rev.1.10
Restart
condition
Stop
condition
Page 62 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.5.3 USB
(1) Electrical specifications
(TA = −40 to +85°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UVDD
UVBUS
MIN.
TYP.
MAX.
Unit
UVDD input voltage
characteristic
UVDD
Symbol
VDD = 3.0 to 5.5 V, PXXCON = 1,
VDDUSEB = 0 (UVDD ≤ VDD)
Conditions
3.0
3.3
3.6
V
UVDD output voltage
characteristic
UVDD
VDD = 4.0 to 5.5 V,
PXXCON = VDDUSEB = 1
3.0
3.3
3.6
V
UVBUS input voltage
characteristic
UVBUS
Function
4.35
Note
(4.02
)
5.00
5.25
V
4.75
5.00
5.25
V
MIN.
TYP.
MAX.
Unit
Host
Note Value of instantaneous voltage
(TA = −40 to +85°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi/UDMi
pins input
characteristic
(FS/LS
receiver)
UDPi/UDMi
pins output
characteristic
(FS driver)
Symbol
Input voltage
Conditions
VIH
2.0
Difference input
sensitivity
VDI
Difference
common mode
range
VCM
Output voltage
Transi-ti Rising
on time Falling
Matching
(TFR/TFF)
0.8
| UDP voltage − UDM voltage |
0.8
2.5
V
V
IOH = −200 μA
2.8
3.6
IOL = 2.4 mA
0
0.3
V
tFR
Rising: From 10% to 90 % of
amplitude,
Falling: From 90% to 10 % of
amplitude,
CL = 50 pF
4
20
ns
4
20
ns
90
111.1
%
1.3
2.0
V
28
44
Ω
2.8
3.6
V
tFF
VFRFM
ZDRV
Output voltage
VOH
Transi-ti Rising
on time Falling
tLR
UVDD voltage = 3.3 V,
Pin voltage = 1.65 V
VOL
0
0.3
V
75
300
ns
75
300
ns
80
125
%
1.3
2.0
V
Pull-down resistor RPD
14.25
24.80
kΩ
Idle
0.9
1.575
kΩ
1.425
3.09
kΩ
tLF
VLTFM
Crossover voltage VLCRS
Note
UVBUS
V
V
VOH
Output
Impedance
Matching Note
(TFR/TFF)
UDPi/UDMi
pins pull-up,
pull-down
0.2
VOL
Crossover voltage VFCRS
UDPi/UDMi
pins output
characteristic
(LS driver)
V
VIL
Pull-up
resistor
(i = 0
only)
Rising: From 10% to 90 % of
amplitude,
Falling: From 90% to 10 % of
amplitude,
CL = 200 to 600 pF
When the host controller function is
selected: The UDMi pin (i = 0, 1) is
pulled up via 1.5 kΩ.
When the function controller
function is selected: The UDP0 and
UDM0 pins are individually pulled
down via 15 kΩ
RPUI
Recep-t RPUA
ion
UVBUS pull-down
resistor
RVBUS
UVBUS input
voltage
VIH
UVBUS voltage = 5.5 V
VIL
1000
kΩ
3.20
V
0.8
V
Note Excludes the first signal transition from the idle state.
Remark
i = 0, 1
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Timing of UDPi and UDMi
UDPi
90 %
90 %
VCRS (Crossover voltage)
10 %
10 %
UDMi
tR
tF
(2) BC standard
(TA = −40 to +85°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
USB
standard
BC1.2
Symbol
Conditions
TYP.
MAX.
Unit
UDPi sink current
IDP_SINK
25
175
μA
UDMi sink current
IDM_SINK
25
175
μA
DCD source current
IDP_SRC
7
13
μA
Dedicated charging
port resistor
RDCP_DAT
200
Ω
0.25
0.4
V
0 V < UDP/UDM voltage < 1.0 V
Data detection voltage VDAT_REF
Remark
MIN.
UDPi source voltage
VDP_SRC
Output current 250 μA
0.5
0.7
V
UDMi source voltage
VDM_SRC
Output current 250 μA
0.5
0.7
V
i = 0, 1
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Rev.1.10
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(3) BC option standard (Host)
(TA = −40 to +85°C, 4.75 V ≤ UVBUS ≤ 5.25 V, 3.0 V ≤ UVDD ≤ 3.6 V, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi output
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VDSELi
1000
VP20
38
40
42
% UVBUS
voltage
[3:0]
(UVBUS divider (i = 0, 1)
ratio)
1001
VP27
51.6
53.6
55.6
% UVBUS
1010
VP20
38
40
42
% UVBUS
• VDOUEi = 1
1100
VP33
60
66
72
% UVBUS
UDMi output VDSELi
voltage
[3:0]
(UVBUS divider (i = 0, 1)
ratio)
1000
VM20
38
40
42
% UVBUS
1001
VM20
38
40
42
% UVBUS
1010
VM27
51.6
53.6
55.6
% UVBUS
• VDOUEi = 1
1100
VM33
60
66
72
% UVBUS
1000
VHDETP_UP0
UDPi
comparing
Note 1
voltage
VDSELi
[3:0]
(i = 0, 1)
(UVBUS divider
ratio)
56.2
VHDETP_DWN0 The fall of pin voltage detection voltage
1001
VHDETP_UP1
1010
VHDETP_UP2
The rise of pin voltage detection voltage
• CUSDETEi = 1
The rise of pin voltage detection voltage
60.5
(UVBUS divider
ratio)
1000
VHDETM_UP0
The rise of pin voltage detection voltage
45.0
1001
VHDETM_UP1
The rise of pin voltage detection voltage
56.2
• VDOUEi = 1
1010
• CUSDETEi = 1
UDPi pull-up detection
1000
VHDETM_UP2
56.2
1.575
kΩ
In low-speed mode, the power supply
1.575
kΩ
RHDET_PULL
voltage range of pull-up resistors
connected to the USB function
module is between 3.0 V and 3.6 V.
1010
1000
% UVBUS
In full-speed mode, the power supply
voltage range of pull-up resistors
connected to the USB function
module is between 3.0 V and 3.6 V.
1001
UDMi sink current
Note 2
detection
60.5
% UVBUS
RHDET_PULL
Note 2
Connect detection with
the low-speed (pull-up
resistor)
29.4
% UVBUS
1010
1000
% UVBUS
45.0
1001
UDMi pull-up detection
% UVBUS
VHDETM_DWN2 The fall of pin voltage detection voltage
Note 2
Connect detection with
the full speed function
(pull-up resistor)
The rise of pin voltage detection voltage
% UVBUS
% UVBUS
29.4
VHDETM_DWN1 The fall of pin voltage detection voltage
% UVBUS
% UVBUS
29.4
VHDETM_DWN0 The fall of pin voltage detection voltage
% UVBUS
% UVBUS
56.2
VHDETP_DWN2 The fall of pin voltage detection voltage
VDSELi
[3:0]
(i = 0, 1)
% UVBUS
29.4
VHDETP_DWN1 The fall of pin voltage detection voltage
• VDOUEi = 1
UDMi
comparing
Note 1
voltage
The rise of pin voltage detection voltage
IHDET_SINK
25
μA
1001
Connect detection with
the BC1.2 portable
device (sink resistor)
1010
Notes 1. If the voltage output from UDPi or UDMi (i = 0, 1) exceeds the range of the MAX and MIN values prescribed
in this specification, DPCUSDETi (bit 8) and DMCUSDETi (bit 9) of the USBBCOPTi register are set to 1.
2. If the pull-up resistance or sink current prescribed in this specification is applied to UDPi or UDMi (i = 0,
1), DPCUSDETi (bit 8) and DMCUSDETi (bit 9) of the USBBCOPTi register are set to 1.
Remark
i = 0, 1
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(4) BC option standard (Function)
(TA = −40 to +85°C, 4.35 V ≤ UVBUS ≤ 5.25 V, 3.0 V ≤ UVDD ≤ 3.6 V, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi/UDMi
VDSELi
input
[3:0]
(i = 0)
reference
voltage
(UVBUS divider
ratio)
• VDOUEi = 0
(i = 0))
R01DS0348EJ0110
Nov 15, 2013
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
0000
VDDET0
27
32
37
% UVBUS
0001
VDDET1
29
34
39
% UVBUS
0010
VDDET2
32
37
42
% UVBUS
0011
VDDET3
35
40
45
% UVBUS
0100
VDDET4
38
43
48
% UVBUS
0101
VDDET5
41
46
51
% UVBUS
0110
VDDET6
44
49
54
% UVBUS
0111
VDDET7
47
52
57
% UVBUS
1000
VDDET8
51
56
61
% UVBUS
1001
VDDET9
55
60
65
% UVBUS
1010
VDDET10
59
64
69
% UVBUS
1011
VDDET11
63
68
73
% UVBUS
1100
VDDET12
67
72
77
% UVBUS
1101
VDDET13
71
76
81
% UVBUS
1110
VDDET14
75
80
85
% UVBUS
1111
VDDET15
79
84
89
% UVBUS
Rev.1.10
Page 66 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.6 Analog Characteristics
2.6.1 A/D converter characteristics
Classification of A/D converter characteristics
Input channel
Reference Voltage
Reference voltage (+) =
AVREFP
Reference voltage (−) =
AVREFM
ANI0 to ANI7
Refer to 2.6.1 (1).
ANI16, ANI17, ANI19
Refer to 2.6.1 (2).
Internal reference voltage
Temperature sensor output
voltage
Refer to 2.6.1 (1).
(1) When AVREF
(+)
Reference voltage (+) = VDD
Reference voltage (−) = VSS
Refer to 2.6.1 (3).
Reference voltage (+) = VBGR
Reference voltage (−) =
AVREFM
Refer to 2.6.1 (4).
−
= AVREFP/ANI0 (ADREFP1 = 0, ADREFP0 = 1), reference voltage (−) = AVREFM/ANI1
(ADREFM = 1), target pin: ANI2 to ANI7, internal reference voltage, and temperature sensor output
voltage
(TA = −40 to +85°C, 2.4 V ≤ AVREFP ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = AVREFP, Reference voltage (−)
= AVREFM = 0 V)
Parameter
Resolution
Symbol
Conditions
RES
Note 1
MIN.
TYP.
8
MAX.
Unit
10
bit
±3.5
LSB
Overall error
AINL
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
Conversion time
tCONV
10-bit resolution
Target pin: ANI2 to
ANI7
3.6 V ≤ VDD ≤ 5.5 V
2.125
39
μs
2.7 V ≤ VDD ≤ 5.5 V
3.1875
39
μs
2.4 V ≤ VDD ≤ 5.5 V
17
39
μs
2.375
39
μs
3.5625
39
μs
17
39
μs
3.6 V ≤ VDD ≤ 5.5 V
10-bit resolution
Target pin: Internal
2.7 V ≤ VDD ≤ 5.5 V
reference voltage,
2.4 V ≤ VDD ≤ 5.5 V
and temperature
sensor output voltage
(HS (high-speed
main) mode)
1.2
Zero-scale errorNotes 1, 2
EZS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±0.25
%FSR
Full-scale errorNotes 1, 2
EFS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±0.25
%FSR
Integral linearity errorNote 1
ILE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±2.5
LSB
Differential linearity error Note 1
DLE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±1.5
LSB
Analog input voltage
VAIN
ANI2 to ANI7
AVREFP
V
Internal reference voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
Temperature sensor output voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
0
VBGR
Note 4
VTMPS25 Note 4
V
V
(Notes are listed on the next page.)
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. When AVREFP < VDD, the MAX. values are as follows.
Overall error: Add ±1.0 LSB to the MAX. value when AVREFP = VDD.
Zero-scale error/Full-scale error: Add ±0.05%FSR to the MAX. value when AVREFP = VDD.
Integral linearity error/ Differential linearity error: Add ±0.5 LSB to the MAX. value when AVREFP = VDD.
4. Refer to 2.6.2 Temperature sensor/internal reference voltage characteristics.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(2) When reference voltage (+) = AVREFP/ANI0 (ADREFP1 = 0, ADREFP0 = 1), reference voltage (−) =
AVREFM/ANI1 (ADREFM = 1), target pin: ANI16, ANI17, ANI19
(TA = −40 to +85°C, 2.4 V ≤ AVREFP ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = AVREFP, Reference voltage
(−) = AVREFM = 0 V)
Parameter
Resolution
Symbol
Conditions
RES
Note 1
MIN.
TYP.
MAX.
Unit
10
bit
±5.0
LSB
2.125
39
μs
3.1875
39
μs
17
39
μs
8
2.4 V ≤ VDD ≤ 5.5 V
Overall error
AINL
10-bit resolution
AVREFP = VDD Note 3
Conversion time
tCONV
10-bit resolution
3.6 V ≤ VDD ≤ 5.5 V
Target ANI pin:
2.7 V ≤ VDD ≤ 5.5 V
ANI16, ANI17, ANI19
2.4 V ≤ VDD ≤ 5.5 V
1.2
Zero-scale errorNotes 1, 2
EZS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±0.35
%FSR
Full-scale errorNotes 1, 2
EFS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±0.35
%FSR
Integral linearity errorNote 1
ILE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±3.5
LSB
Differential linearity error Note 1
DLE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ VDD ≤ 5.5 V
±2.00
LSB
Analog input voltage
VAIN
ANI16, ANI17, ANI19
AVREFP
and VDD
V
0
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. When AVREFP < VDD, the MAX. values are as follows.
Overall error: Add ±4.0 LSB to the MAX. value when AVREFP = VDD.
Zero-scale error/Full-scale error: Add ±0.20%FSR to the MAX. value when AVREFP = VDD.
Integral linearity error/ Differential linearity error: Add ±2.0 LSB to the MAX. value when AVREFP = VDD.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(3) Reference voltage (+) = VDD (ADREFP1 = 0, ADREFP0 = 0), Reference voltage (−) = VSS (ADREFM = 0),
target ANI pin: ANI0 to ANI7, ANI16, ANI17, ANI19, internal reference voltage, and temperature sensor
output voltage
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = VDD, Reference voltage (−) = VSS)
Parameter
Symbol
Resolution
Conditions
RES
Notes 1, 2
MIN.
TYP.
8
MAX.
Unit
10
bit
Overall error
AINL
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±7.0
LSB
Conversion time
tCONV
10-bit resolution
Target ANI pin:
ANI0 to ANI7, ANI16,
ANI17, ANI19
3.6 V ≤ VDD ≤ 5.5 V
2.125
39
μs
2.7 V ≤ VDD ≤ 5.5 V
3.1875
39
μs
2.4 V ≤ VDD ≤ 5.5 V
17
39
μs
2.375
39
μs
3.5625
39
μs
17
39
μs
3.6 V ≤ VDD ≤ 5.5 V
10-bit resolution
Target ANI pin: Internal
2.7 V ≤ VDD ≤ 5.5 V
reference voltage, and
2.4 V ≤ VDD ≤ 5.5 V
temperature sensor
output voltage (HS
(high-speed main) mode)
Zero-scale errorNotes 1, 2
Notes 1, 2
Full-scale error
Note 1
Integral linearity error
Differential linearity error
Analog input voltage
Note 1
1.2
EZS
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
EFS
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
ILE
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±4.0
LSB
DLE
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±2.0
LSB
VAIN
ANI0 to ANI7, ANI16, ANI17, ANI19
VDD
V
Internal reference voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
Temperature sensor output voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
0
VBGR
Note 3
VTMPS25 Note 3
V
V
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. Refer to 2.6.2 Temperature sensor/internal reference voltage characteristics.
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
(4) When Reference voltage (+) = Internal reference voltage (ADREFP1 = 1, ADREFP0 = 0), Reference
voltage (−) = AVREFM/ANI1 (ADREFM = 1), target pin: ANI0 to ANI7, ANI16, ANI17, ANI19
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = VBGR
AVREFM
Note 4
Note 3
, Reference voltage (−) =
= 0 V, HS (high-speed main) mode)
Parameter
Symbol
Resolution
Conditions
MIN.
RES
TYP.
MAX.
8
Unit
Bit
Conversion time
tCONV
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
39
μs
Zero-scale errorNotes 1, 2
EZS
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
ILE
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±2.0
LSB
DLE
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±1.0
LSB
Integral linearity errorNote 1
Differential linearity error
Note 1
Analog input voltage
VAIN
17
0
VBGR
Note 3
V
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. Refer to 2.6.2 Temperature sensor/internal reference voltage characteristics.
4. When reference voltage (−) = VSS, the MAX. values are as follows.
Zero-scale error: Add ±0.35%FSR to the MAX. value when reference voltage (−) = AVREFM.
Integral linearity error: Add ±0.5 LSB to the MAX. value when reference voltage (−) = AVREFM.
Differential linearity error: Add ±0.2 LSB to the MAX. value when reference voltage (−) = AVREFM.
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
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2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.6.2 Temperature sensor/internal reference voltage characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, HS (high-speed main) mode)
Parameter
Symbol
Conditions
MIN.
Temperature sensor output voltage VTMPS25
Setting ADS register = 80H, TA = +25°C
Internal reference voltage
VBGR
Setting ADS register = 81H
Temperature coefficient
FVTMPS
Temperature sensor that depends on the
temperature
Operation stabilization wait time
tAMP
TYP.
MAX.
1.05
1.38
Unit
V
1.45
1.5
−3.6
V
mV/°C
μs
5
2.6.3 POR circuit characteristics
(TA = −40 to +85°C, VSS = 0 V)
Parameter
Detection voltage
Minimum pulse widthNote
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VPOR
Power supply rise time
1.47
1.51
1.55
V
VPDR
Power supply fall time
1.46
1.50
1.54
V
μs
300
TPW
Note Minimum time required for a POR reset when VDD exceeds below VPDR. This is also the minimum time
required for a POR reset from when VDD exceeds below 0.7 V to when VDD exceeds VPOR while STOP mode is
entered or the main system clock (fMAIN) is stopped through setting bit 0 (HIOSTOP) and bit 7 (MSTOP) in the
clock operation status control register (CSC).
TPW
Supply voltage (VDD)
VPOR
VPDR or 0.7 V
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.6.4 LVD circuit characteristics
LVD Detection Voltage of Reset Mode and Interrupt Mode
(TA = −40 to +85°C, VPDR ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Detection
voltage
Supply voltage level
Symbol
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
VLVD8
Minimum pulse width
tLW
Detection delay time
tLD
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
Conditions
MIN.
TYP.
MAX.
Unit
Power supply rise time
3.98
4.06
4.14
V
Power supply fall time
3.90
3.98
4.06
V
Power supply rise time
3.68
3.75
3.82
V
Power supply fall time
3.60
3.67
3.74
V
Power supply rise time
3.07
3.13
3.19
V
Power supply fall time
3.00
3.06
3.12
V
Power supply rise time
2.96
3.02
3.08
V
Power supply fall time
2.90
2.96
3.02
V
Power supply rise time
2.86
2.92
2.97
V
Power supply fall time
2.80
2.86
2.91
V
Power supply rise time
2.76
2.81
2.87
V
Power supply fall time
2.70
2.75
2.81
V
Power supply rise time
2.66
2.71
2.76
V
Power supply fall time
2.60
2.65
2.70
V
Power supply rise time
2.56
2.61
2.66
V
Power supply fall time
2.50
2.55
2.60
V
Power supply rise time
2.45
2.50
2.55
V
Power supply fall time
2.40
2.45
2.50
V
μs
300
300
μs
Page 73 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
LVD Detection Voltage of Interrupt & Reset Mode
(TA = −40 to +85°C, VPDR ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Interrupt and reset VLVDC0
mode
VLVDC1
Conditions
MIN.
TYP.
MAX.
Unit
VPOC2, VPOC1, VPOC0 = 0, 1, 0, falling reset voltage
2.40
2.45
2.50
V
LVIS1, LVIS0 = 1, 0 Rising release reset voltage
Falling interrupt voltage
VLVDC2
LVIS1, LVIS0 = 0, 1 Rising release reset voltage
Falling interrupt voltage
VLVDC3
LVIS1, LVIS0 = 0, 0 Rising release reset voltage
Falling interrupt voltage
VLVDD0
VPOC2, VPOC1, VPOC0 = 0, 1, 1, falling reset voltage
VLVDD1
LVIS1, LVIS0 = 1, 0 Rising release reset voltage
Falling interrupt voltage
VLVDD2
LVIS1, LVIS0 = 0, 1 Rising release reset voltage
Falling interrupt voltage
VLVDD3
LVIS1, LVIS0 = 0, 0 Rising release reset voltage
Falling interrupt voltage
2.56
2.61
2.66
V
2.50
2.55
2.60
V
2.66
2.71
2.76
V
2.60
2.65
2.70
V
3.68
3.75
3.82
V
3.60
3.67
3.74
V
2.70
2.75
2.81
V
2.86
2.92
2.97
V
2.80
2.86
2.91
V
2.96
3.02
3.08
V
2.90
2.96
3.02
V
3.98
4.06
4.14
V
3.90
3.98
4.06
V
2.6.5 Power supply voltage rising slope characteristics
(TA = −40 to +85°C, VSS = 0 V)
Parameter
Power supply voltage rising slope
Caution
Symbol
Conditions
MIN.
SVDD
TYP.
MAX.
Unit
54
V/ms
Make sure to keep the internal reset state by the LVD circuit or an external reset until VDD
reaches the operating voltage range shown in 2.4 AC Characteristics.
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RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.7 Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics
(TA = −40 to +85°C, VSS = 0 V)
Parameter
Data retention supply voltage
Symbol
Conditions
MIN.
TYP.
Note
1.46
VDDDR
MAX.
Unit
5.5
V
Note The value depends on the POR detection voltage. When the voltage drops, the data is retained before a
POR reset is effected, but data is not retained when a POR reset is effected.
Operation mode
STOP mode
Data retention mode
VDD
VDDDR
STOP instruction execution
Standby release signal
(interrupt request)
2.8 Flash Memory Programming Characteristics
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
CPU/peripheral hardware clock
frequency
fCLK
2.4 V ≤ VDD ≤ 5.5 V
Number of code flash rewrites
Cerwr
Retaining years: 20 years
TA = +85°C
Retaining years: 1 year
TA = +25°C
Retaining years: 5 years
TA = +85°C
100,000
Retaining years: 20 years
TA = +85°C
10,000
Number of data flash rewrites
TYP.
1
MAX.
Unit
24
MHz
1,000
Times
1,000,000
Notes 1, 2, 3
Notes 1. 1 erase + 1 write after the erase is regarded as 1 rewrite. The retaining years are until next rewrite after
the rewrite.
2. When using flash memory programmer and Renesas Electronics self programming library.
3. These specifications show the characteristics of the flash memory and the results obtained from
Renesas Electronics reliability testing.
2.9 Dedicated Flash Memory Programmer Communication (UART)
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Transfer rate
R01DS0348EJ0110
Nov 15, 2013
Symbol
Conditions
During serial programming
Rev.1.10
MIN.
115,200
TYP.
MAX.
Unit
1,000,000
bps
Page 75 of 135
RL78/G1C
2.
ELECTRICAL SPECIFICATIONS (A: TA = -40 to +85°C)
2.10 Timing Specs for Switching Flash Memory Programming Modes
(TA = −40 to +85°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
100
ms
How long from when an external
reset ends until the initial
communication settings are
specified
tSUINIT
POR and LVD reset must end before the
external reset ends.
How long from when the TOOL0
tSU
POR and LVD reset must end before the
external reset ends.
10
μs
tHD
POR and LVD reset must end before the
external reset ends.
1
ms
pin is placed at the low level until
an external reset ends
How long the TOOL0 pin must be
kept at the low level after an
external reset ends
(excluding the processing time of
the firmware to control the flash
memory)
<1>
<2>
<4>
<3>
RESET
723 μs + tHD
processing
time
00H reception
(TOOLRxD, TOOLTxD mode)
TOOL0
tSU
<1>
<2>
tSUINIT
The low level is input to the TOOL0 pin.
The external reset ends (POR and LVD reset must end before the external reset
ends.).
<3>
The TOOL0 pin is set to the high level.
<4>
Setting of the flash memory programming mode by UART reception and complete
the baud rate setting.
Remark tSUINIT: The segment shows that it is necessary to finish specifying the initial communication settings within
100 ms from when the resets end.
tSU:
How long from when the TOOL0 pin is placed at the low level until an external reset ends
tHD:
How long to keep the TOOL0 pin at the low level from when the external and internal resets end
(excluding the processing time of the firmware to control the flash memory)
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Rev.1.10
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3. ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105C)
RL78/G1C
3. ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105C)
This chapter describes the electrical specifications for the products "G: Industrial applications (TA = -40 to +105C)".
The target products G: Industrial applications ; TA = -40 to +105C
R5F10JBCGNA, R5F10JBCGFP, R5F10JGCGNA, R5F10JGCGFB,
R5F10KBCGNA, R5F10KBCGFP, R5F10KGCGNA, R5F10KGCGFB
Cautions 1. The RL78 microcontrollers has an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for mass
production, because the guaranteed number of rewritable times of the flash memory may be
exceeded when this function is used, and product reliability therefore cannot be guaranteed.
Renesas Electronics is not liable for problems occurring when the on-chip debug function is
used.
2. The pins mounted depend on the product. Refer to 2.1 Port Function to 2.2.1 With functions
for each product in the RL78/G1C User’s Manual: Hardware.
3. Please contact Renesas Electronics sales office for derating of operation under TA = +85C to
<R>
+105C. Derating is the systematic reduction of load for the sake of improved reliability.
There are following differences between the products "G: Industrial applications (TA = -40 to +105C)" and the
products “A: Consumer applications”.
Parameter
Application
A: Consumer applications
Operating ambient temperature
TA = -40 to +85C
G: Industrial applications
TA = -40 to +105C
High-speed on-chip oscillator clock
2.4 V  VDD  5.5 V
2.4 V  VDD  5.5 V
accuracy
1.0%@ TA = -20 to +85C
2.0%@ TA = +85 to +105C
1.5%@ TA = -40 to -20C
1.0%@ TA = -20 to +85C
1.5%@ TA = -40 to -20C
Serial array unit
UART
UART
CSI: fCLK/2 (supporting 16 Mbps), fCLK/4
2
IICA
CSI: fCLK/4
2
Simplified I C communication
Simplified I C communication
Normal mode
Normal mode
Fast mode
Fast mode
Fast mode plus
Remark The electrical characteristics of the products G: Industrial applications (TA = -40 to +105C) are different
from those of the products “A: Consumer applications”. For details, refer to 3.1 to 3.10.
R01DS0348EJ0110 Rev.1.10
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.1 Absolute Maximum Ratings
Absolute Maximum Ratings (TA = 25°C) (1/2)
Parameter
Symbols
Supply voltage
Conditions
VDD
Ratings
Unit
−0.5 to +6.5
V
REGC pin input voltage VIREGC
REGC
−0.3 to +2.8
and −0.3 to VDD +0.3Note 1
V
UVDD pin input voltage
UVDD
−0.3 to VDD +0.3
V
Input voltage
Output voltage
VIUVDD
−0.3 to VDD +0.3
V
P60 to P63 (N-ch open-drain)
−0.3 to +6.5
V
VI3
UDP0, UDM0, UDP1, UDM1
−0.3 to +6.5
V
VI4
UVBUS
−0.3 to +6.5
VI1
P00, P01, P14 to P17, P20 to P27, P30, P31, P40,
P41, P50, P51, P70 to P75, P120 to P124, P137,
P140, EXCLK, EXCLKS, RESET
VI2
VO1
Note 2
−0.3 to VDD +0.3
P00, P01, P14 to P17, P20 to P27, P30, P31, P40,
V
Note 2
V
P41, P50, P51, P60 to P63, P70 to P75, P120,
P130, P140
Analog input voltage
VO2
UDP0, UDM0, UDP1, UDM1
VAI1
ANI16, ANI17, ANI19
−0.3 to +6.5
V
−0.3 to VDD +0.3
and −0.3 to AVREF (+) +0.3
V
Notes 2, 3
VAI2
−0.3 to VDD +0.3
and −0.3 to AVREF (+) +0.3
ANI0 to ANI7
V
Notes 2, 3
Notes 1.
Connect the REGC pin to Vss via a capacitor (0.47 to 1 μF). This value regulates the absolute
maximum rating of the REGC pin.
Do not use this pin with voltage applied to it.
2.
Must be 6.5 V or lower.
3.
Do not exceed AV REF (+) + 0.3 V in case of A/D conversion target pin
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions
that ensure that the absolute maximum ratings are not exceeded.
Remarks 1. Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
2. AVREF (+): The + side reference voltage of the A/D converter. This can be selected from AVREFP, the
internal reference voltage (1.45 V), and VDD.
3. VSS: Reference voltage
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Absolute Maximum Ratings (TA = 25°C) (2/2)
Parameter
Output current, high
Symbols
IOH1
Conditions
Per pin
P00, P01, P14 to P17, P30, P31,
Ratings
Unit
−40
mA
−70
mA
−100
mA
−0.5
mA
−2
mA
40
mA
70
mA
100
mA
1
mA
5
mA
−40 to +105
°C
−65 to +150
°C
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
Total of all pins
−170 mA
P00, P01, P40, P41, P120,
P130, P140
P14 to P17, P30, P31,
P50, P51, P70 to P75
IOH2
Per pin
P20 to P27
Total of all pins
Output current, low
IOL1
Per pin
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P60 to P63,
P70 to P75, P120, P130, P140
Total of all pins
170 mA
P00, P01, P40, P41, P120,
P130, P140
P14 to P17, P30, P31,
P50, P51, P60 to P63, P70 to P75
IOL2
Per pin
P20 to P27
Total of all pins
<R>
Operating ambient
temperature
TA
Storage temperature
Tstg
In normal operation mode
In flash memory programming mode
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions
that ensure that the absolute maximum ratings are not exceeded.
Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the port
pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.2 Oscillator Characteristics
3.2.1 X1, XT1 oscillator characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Resonator
X1 clock oscillation
frequency (fX)Note
Ceramic resonator/
crystal resonator
XT1 clock oscillation
frequency (fXT)Note
Crystal resonator
Conditions
MIN.
TYP.
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V
1.0
20.0
MHz
2.4 V ≤ VDD < 2.7 V
1.0
16.0
MHz
35
kHz
32
32.768
Note Indicates only permissible oscillator frequency ranges. Refer to AC Characteristics for instruction execution
time. Request evaluation by the manufacturer of the oscillator circuit mounted on a board to check the
oscillator characteristics.
Caution Since the CPU is started by the high-speed on-chip oscillator clock after a reset release, check
the X1 clock oscillation stabilization time using the oscillation stabilization time counter status
register (OSTC) by the user. Determine the oscillation stabilization time of the OSTC register and
the oscillation stabilization time select register (OSTS) after sufficiently evaluating the oscillation
stabilization time with the resonator to be used.
Remark When using the X1 oscillator and XT1 oscillator, refer to 5.4 System Clock Oscillator in the RL78/G1C
User’s Manual: Hardware.
3.2.2 On-chip oscillator characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Oscillators
Parameters
High-speed on-chip oscillator
clock frequency Notes 1, 2
MAX.
Unit
1
48
MHz
−20 to +85 °C
−1.0
+1.0
%
−40 to −20 °C
−1.5
+1.5
%
+85 to +105 °C
−2.0
+2.0
%
fHOCO
High-speed on-chip oscillator
clock frequency accuracy
Low-speed on-chip oscillator
clock frequency
Conditions
MIN.
fIL
Low-speed on-chip oscillator
clock frequency accuracy
TYP.
15
−15
kHz
+15
%
Notes 1. High-speed on-chip oscillator frequency is selected by bits 0 to 3 of option byte (000C2H/010C2H) and
bits 0 to 2 of HOCODIV register.
2. This indicates the oscillator characteristics only. Refer to AC Characteristics for instruction execution
time.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.2.3 PLL oscillator characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Oscillators
PLL input frequency
Parameters
Note
PLL output frequency Note
fPLLIN
Conditions
High-speed system clock
MIN.
TYP.
6.00
MAX.
Unit
16.00
MHz
48.00
fPLL
MHz
Lock up time
From PLL output enable to stabilization of the
output frequency
40.00
μs
Interval time
From PLL stop to PLL re-operation setteing
Wait time
4.00
μs
Setting wait time
From after PLL input clock stabilization and PLL
1.00
μs
setting is fixed to start setting
Wait time required
Note
Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.3 DC Characteristics
3.3.1 Pin characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
IOH1
Output current,
highNote 1
Conditions
TYP.
MAX.
−3.0
Note 2
Unit
Per pin for P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51, P70 to
P75, P120, P130, P140
2.4 V ≤ VDD ≤ 5.5 V
Total of P00, P01, P40, P41, P120,
P130, P140
(When duty ≤ 70% Note 3)
4.0 V ≤ VDD ≤ 5.5 V
−30.0
mA
2.7 V ≤ VDD < 4.0 V
−10.0
mA
2.4 V ≤ VDD < 2.7 V
−5.0
mA
4.0 V ≤ VDD ≤ 5.5 V
−30.0
mA
2.7 V ≤ VDD < 4.0 V
−19.0
mA
Total of P14 to P17, P30, P31,
P50, P51, P70 to P75
(When duty ≤ 70% Note 3)
IOH2
MIN.
mA
2.4 V ≤ VDD < 2.7 V
−10.0
mA
Total of all pins
(When duty ≤ 70%Note 3)
2.4 V ≤ VDD ≤ 5.5 V
-60.0
mA
Per pin for P20 to P27
2.4 V ≤ VDD ≤ 5.5 V
Total of all pins
(When duty ≤ 70%Note 3)
2.4 V ≤ VDD ≤ 5.5 V
−0.1Note 2 mA
−1.5
mA
Notes 1. Value of current at which the device operation is guaranteed even if the current flows from the VDD pin to
an output pin.
2. However, do not exceed the total current value.
3. Specification under conditions where the duty factor ≤ 70%.
The output current value that has changed to the duty factor > 70% the duty ratio can be calculated with
the following expression (when changing the duty ratio to n%).
• Total output current of pins = (IOH × 0.7)/(n × 0.01)
<Example> Where n = 80% and IOH = −10.0 mA
Total output current of pins = (−10.0 × 0.7)/(80 × 0.01) ≅ −8.7 mA
However, the current that is allowed to flow into one pin does not vary depending on the duty factor.
A current higher than the absolute maximum rating must not flow into one pin.
Caution
P00, P01, P30, and P74 do not output high level in N-ch open-drain mode.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
IOL1
Output current,
lowNote 1
Conditions
Notes 1.
TYP.
MAX.
Note 2
Unit
Per pin for P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51,
P70 to P75, P120, P130, P140
2.4V ≤ VDD ≤ 5.5 V
8.5
Per pin for P60 to P63
2.4V ≤ VDD ≤ 5.5 V
15.0 Note 2
mA
Total of P00, P01, P40, P41, P120,
P130, P140
(When duty ≤ 70% Note 3)
4.0 V ≤ VDD ≤ 5.5 V
40.0
mA
2.7 V ≤ VDD < 4.0 V
15.0
mA
2.4 V ≤ VDD < 2.7 V
9.0
mA
4.0 V ≤ VDD ≤ 5.5 V
40.0
mA
2.7 V ≤ VDD < 4.0 V
35.0
mA
2.4 V ≤ VDD < 2.7 V
20.0
mA
Total of all pins
(When duty ≤ 70% Note 3)
2.4V ≤ VDD ≤ 5.5 V
80.0
mA
Per pin for P20 to P27
2.4V ≤ VDD ≤ 5.5 V
0.4 Note 2
mA
Total of all pins
(When duty ≤ 70%Note 3)
2.4V ≤ VDD ≤ 5.5 V
5.0
mA
Total of P14 to P17, P30, P31, P50,
P51, P60 to P63, P70 to P75
(When duty ≤ 70% Note 3)
IOL2
MIN.
mA
Value of current at which the device operation is guaranteed even if the current flows from an output
pin to the VSS pin.
2.
However, do not exceed the total current value.
3.
Specification under conditions where the duty factor ≤ 70%.
The output current value that has changed to the duty factor > 70% the duty ratio can be calculated
with the following expression (when changing the duty ratio to n%).
• Total output current of pins = (IOL × 0.7)/(n × 0.01)
<Example> Where n = 80% and IOL = 10.0 mA
Total output current of pins = (10.0 × 0.7)/(80 × 0.01) ≅ 8.7 mA
However, the current that is allowed to flow into one pin does not vary depending on the duty factor. A
current higher than the absolute maximum rating must not flow into one pin.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
Input voltage,
high
Input voltage,
low
Caution
Conditions
MIN.
TYP.
MAX.
Unit
VIH1
P00, P01, P14 to P17,
P30, P31, P40, P41, P50, P51, P70
to P75, P120, P140
Normal input buffer
0.8VDD
VDD
V
VIH2
P00, P01, P30, P50
TTL input buffer
4.0 V ≤ VDD ≤ 5.5 V
2.2
VDD
V
TTL input buffer
3.3 V ≤ VDD < 4.0 V
2.0
VDD
V
TTL input buffer
2.4 V ≤ VDD < 3.3 V
1.5
VDD
V
VIH3
P20 to P27
0.7VDD
VDD
V
VIH4
P60 to P63
0.7VDD
6.0
V
VIH5
P121 to P124, P137, EXCLK, EXCLKS, RESET
0.8VDD
VDD
V
VIL1
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P70 to P75,
P120, P140
Normal input buffer
0
0.2VDD
V
VIL2
P00, P01, P30, P50
TTL input buffer
4.0 V ≤ VDD ≤ 5.5 V
0
0.8
V
TTL input buffer
3.3 V ≤ VDD < 4.0 V
0
0.5
V
TTL input buffer
2.4 V ≤ VDD < 3.3 V
0
0.32
V
VIL3
P20 to P27
0
0.3VDD
V
VIL4
P60 to P63
0
0.3VDD
V
VIL5
P121 to P124, P137, EXCLK, EXCLKS, RESET
0
0.2VDD
V
The maximum value of VIH of pins P00, P01, P30, and P74 is VDD, even in the N-ch open-drain
mode.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
Output voltage,
high
VOH1
VOH2
Output voltage,
low
VOL1
Conditions
MIN.
TYP.
MAX.
Unit
4.0 V ≤ VDD ≤ 5.5 V,
IOH1 = −3.0 mA
VDD − 0.7
V
2.7 V ≤ VDD ≤ 5.5 V,
IOH1 = −2.0 mA
VDD − 0.6
V
2.4 V ≤ VDD ≤ 5.5 V,
IOH1 = −1.5 mA
VDD − 0.5
V
P20 to P27
2.4 V ≤ VDD ≤ 5.5 V,
IOH2 = −100 μ A
VDD − 0.5
V
P00, P01, P14 to P17, P30, P31,
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 8.5 mA
0.7
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 3.0 mA
0.6
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 1.5 mA
0.4
V
2.4 V ≤ VDD ≤ 5.5 V,
IOL1 = 0.6 mA
0.4
V
P00, P01, P14 to P17, P30, P31,
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
P40, P41, P50, P51, P70 to P75,
P120, P130, P140
VOL2
P20 to P27
2.4 V ≤ VDD ≤ 5.5 V,
IOL2 = 400 μ A
0.4
V
VOL3
P60 to P63
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 15.0 mA
2.0
V
4.0 V ≤ VDD ≤ 5.5 V,
IOL1 = 5.0 mA
0.4
V
2.7 V ≤ VDD ≤ 5.5 V,
IOL1 = 3.0 mA
0.4
V
2.4 V ≤ VDD ≤ 5.5 V,
IOL1 = 2.0 mA
0.4
V
Caution
P00, P01, P30, and P74 do not output high level in N-ch open-drain mode.
Remark
Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the
port pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Input leakage
current, high
Input leakage
current, low
On-chip pll-up
resistance
Symbol
Conditions
ILIH1
P00, P01, P14 to P17,
P20 to P27, P30, P31,
P40, P41, P50, P51, P60 to
P63, P70 to P75, P120,
P137, P140, RESET
VI = VDD
ILIH2
P121 to P124
(X1, X2, XT1, XT2, EXCLK,
EXCLKS)
VI = VDD
ILIL1
P00, P01, P14 to P17,
P20 to P27, P30, P31, P40,
P41, P50, P51, P60 to P63,
P70 to P75, P120, P137, P140,
RESET
VI = VSS
ILIL2
P121 to P124
(X1, X2, XT1, XT2, EXCLK,
EXCLKS)
VI = VSS
RU
P00, P01, P14 to P17,
P30, P31, P40, P41,
P50, P51, P70 to P75, P120,
P140
MIN.
MAX.
Unit
1
μA
In input port or
external clock
input
1
μA
In resonator
connection
10
μA
−1
μA
In input port or
external clock
input
−1
μA
In resonator
connection
−10
μA
100
kΩ
VI = VSS, In input port
10
TYP.
20
Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of the port
pins.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.3.2 Supply current characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Supply
current
IDD1
(1/2)
Conditions
Operating
mode
Note 1
MIN.
HS
fHOCO = 48 MHz
(High-speed fIH = 24 MHz Note 3
main)
modffe Note 6
fHOCO = 24 MHz
Note 5
fIH = 12 MHz Note 3
fHOCO = 12 MHz Note 5
fIH = 6 MHz
Note 3
Note
fHOCO = 6 MHz
5
TYP.
MAX.
Unit
Basic
VDD = 5.0 V
operation VDD = 3.0 V
1.7
Normal
VDD = 5.0 V
operation VDD = 3.0 V
3.7
5.8
mA
3.7
5.8
mA
Normal
VDD = 5.0 V
operation VDD = 3.0 V
2.3
3.4
mA
2.3
3.4
mA
1.6
2.2
mA
1.6
2.2
mA
1.2
1.6
mA
1.2
1.6
mA
Normal
Square wave input
operation Resonator connection
3.0
4.9
mA
3.2
5.0
mA
Normal
Square wave input
operation Resonator connection
3.0
4.9
mA
3.2
5.0
mA
Normal
Square wave input
operation Resonator connection
1.9
2.9
mA
1.9
2.9
mA
Normal
Square wave input
operation Resonator connection
1.9
2.9
mA
1.9
2.9
mA
Normal
VDD = 5.0 V
operation VDD = 3.0 V
Normal
VDD = 5.0 V
operation VDD = 3.0 V
mA
1.7
mA
fIH = 3 MHz Note 3
HS
fMX = 20 MHz Note 2,
(High-speed VDD = 5.0 V
main) mode
Note 6
fMX = 20 MHz Note 2,
VDD = 3.0 V
fMX = 10 MHz
Note 2
,
VDD = 5.0 V
fMX = 10 MHz
Note 2
,
VDD = 3.0 V
HS
(High-speed
main) mode
(PLL
operation)
fPLL = 48 MHz,
Normal
VDD = 5.0 V
fCLK = 24 MHz Note 2 operation VDD = 3.0 V
4.0
6.3
mA
4.0
6.3
mA
fPLL = 48 MHz,
2.6
3.9
mA
2.6
3.9
mA
1.9
2.7
mA
fCLK = 12 MHz
Note 2
Normal
VDD = 5.0 V
operation VDD = 3.0 V
Note 6
fPLL = 48 MHz,
fCLK = 6 MHz Note 2
Subsystem
clock
operation
fSUB = 32.768 kHz
Note 4
Normal
VDD = 5.0 V
operation VDD = 3.0 V
1.9
2.7
mA
Normal
Resonator connection
operation Square wave input
4.1
4.9
μA
4.2
5.0
μA
Normal
Square wave input
operation Resonator connection
4.1
4.9
μA
4.2
5.0
μA
Normal
Square wave input
operation Resonator connection
4.2
5.5
μA
4.3
5.6
μA
Normal
Square wave input
operation Resonator connection
4.2
6.3
μA
4.3
6.4
μA
Normal
Square wave input
operation Resonator connection
4.8
7.7
μA
4.9
7.8
μA
Normal
Square wave input
operation Resonator connection
6.9
19.7
μA
7.0
19.8
μA
TA = −40°C
fSUB = 32.768 kHz
Note 4
TA = +25°C
fSUB = 32.768 kHz
Note 4
TA = +50°C
fSUB = 32.768 kHz
Note 4
TA = +70°C
fSUB = 32.768 kHz
Note 4
TA = +85°C
fSUB = 32.768 kHz
Note 4
TA = +105°C
(Notes and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Notes 1. Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is
fixed to VDD, or VSS. The values below the MAX. column include the peripheral operation current.
However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and on-chip
pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1
(Ultra-low power consumption oscillation). However, not including the current flowing into the RTC, 12-bit
interval timer, and watchdog timer.
5. When Operating frequency setting of option byte = 48 MHz. When fHOCO is divided by HOCODIV. When
RDIV[1:0] = 00 (divided by 2: default).
6. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ VDD ≤ 5.5 [email protected] MHz to 24 MHz
2.4 V ≤ VDD ≤ 5.5 [email protected] MHz to 16 MHz
Remarks 1. fHOCO: High-speed on-chip oscillator clock frequency (Max. 48 MHz)
2. fIH:
Main system clock source frequency obtained by dividing the high-speed on-chip oscillator clock
by 2, 4, or 8 (Max. 24 MHz)
3. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
4. fPLL: PLL oscillation frequency
5. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
6. fCLK: CPU/peripheral hardware clock frequency
7. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Supply
current
IDD2
Note 2
(2/2)
Conditions
HALT
mode
Note 1
MIN.
fHOCO = 48 MHz
HS
(High-speed fIH = 24 MHz Note 4
main) mode
fHOCO = 24 MHz Note 7
Note 9
HS
Note 9
VDD = 5.0 V
0.67
2.25
mA
VDD = 3.0 V
0.67
2.25
mA
0.50
1.55
mA
VDD = 3.0 V
0.50
1.55
mA
fHOCO = 12 MHz Note 7
VDD = 5.0 V
0.41
1.21
mA
fIH = 6 MHz Note 4
VDD = 3.0 V
0.41
1.21
mA
fHOCO = 6 MHz Note 7
VDD = 5.0 V
0.37
1.05
mA
fIH = 3 MHz Note 4
VDD = 3.0 V
0.37
1.05
mA
fMX = 20 MHz Note 3,
Square wave input
0.28
1.90
mA
Resonator connection
0.45
2.00
mA
Square wave input
0.28
1.90
mA
VDD = 3.0 V
Resonator connection
0.45
2.00
mA
fMX = 10 MHz Note 3,
Square wave input
0.19
1.02
mA
VDD = 5.0 V
Resonator connection
0.26
1.10
mA
fMX = 10 MHz Note 3,
Square wave input
0.19
1.02
mA
VDD = 3.0 V
Resonator connection
0.26
1.10
mA
fPLL = 48 MHz,
VDD = 5.0 V
0.91
2.74
mA
VDD = 3.0 V
0.91
2.74
mA
VDD = 5.0 V
0.85
2.31
mA
VDD = 3.0 V
0.85
2.31
mA
VDD = 5.0 V
0.82
2.07
mA
VDD = 3.0 V
0.82
2.07
mA
fSUB = 32.768 kHz
Square wave input
0.25
0.57
μA
TA = −40°C
Resonator connection
0.44
0.76
μA
fCLK = 24 MHz Note 3
fPLL = 48 MHz,
fCLK = 12 MHz Note 3
fPLL = 48 MHz,
Note 5
fSUB = 32.768 kHz
Square wave input
0.30
0.57
μA
TA = +25°C
Resonator connection
0.49
0.76
μA
fSUB = 32.768 kHz
Square wave input
0.33
1.17
μA
TA = +50°C
Resonator connection
0.63
1.36
μA
fSUB = 32.768 kHz
Square wave input
0.46
1.97
μA
TA = +70°C
Resonator connection
0.76
2.16
μA
fSUB = 32.768 kHz
Square wave input
0.97
3.37
μA
TA = +85°C
Resonator connection
1.16
3.56
μA
Note 5
Note 5
Note 5
Note 5
fSUB = 32.768 kHz
Square wave input
3.01
15.37
μA
TA = +105°C
Resonator connection
3.20
15.56
μA
TA = −40°C
STOP
mode Note 8 TA = +25°C
0.18
0.50
μA
0.23
0.50
μA
TA = +50°C
0.26
1.10
μA
TA = +70°C
0.29
1.90
μA
TA = +85°C
0.90
3.30
μA
TA = +105°C
2.94
15.30
μA
Note 5
IDD3Note 6
Unit
VDD = 5.0 V
fCLK = 6 MHz Note 3
Subsystem
clock
operation
MAX.
fIH = 12 MHz Note 4
(High-speed VDD = 5.0 V
main) mode
fMX = 20 MHz Note 3,
Note 9
HS
(High-speed
main) mode
(PLL
operation)
TYP.
(Notes and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Notes 1. Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is
fixed to VDD or VSS. The values below the MAX. column include the peripheral operation current. However,
not including the current flowing into the A/D converter, LVD circuit, USB2.0 host/function module, I/O
port, and on-chip pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. During HALT instruction execution by flash memory.
3. When high-speed on-chip oscillator and subsystem clock are stopped.
4. When high-speed system clock and subsystem clock are stopped.
5. When high-speed on-chip oscillator and high-speed system clock are stopped. When RTCLPC = 1 and
setting ultra-low current consumption (AMPHS1 = 1). The current flowing into the RTC is included.
However, not including the current flowing into the 12-bit interval timer and watchdog timer.
6. Not including the current flowing into the RTC, 12-bit interval timer, and watchdog timer.
7. When Operating frequency setting of option byte = 48 MHz. When fHOCO is divided by HOCODIV. When
RDIV[1:0] = 00 (divided by 2: default).
8. Regarding the value for current to operate the subsystem clock in STOP mode, refer to that in HALT
mode.
9. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ VDD ≤ 5.5 [email protected] MHz to 24 MHz
2.4 V ≤ VDD ≤ 5.5 [email protected] MHz to 16 MHz
Remarks 1. fHOCO: High-speed on-chip oscillator clock frequency (Max. 48 MHz)
2. fIH:
Main system clock source frequency obtained by dividing the high-speed on-chip oscillator clock
by 2, 4, or 8 (Max. 24 MHz)
3. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
4. fPLL: PLL oscillation frequency
5. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
6. fCLK: CPU/peripheral hardware clock frequency
7. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V) (1/2)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Low-speed on-chip
oscillator operating
current
IFILNote 1
0.20
μA
RTC operating current
IRTC
0.02
μA
0.02
μA
0.22
μA
Notes 1, 2, 3
12-bit interval timer
operating current
IIT Notes 1, 2, 4
Watchdog timer
operating current
IWDT
Notes 1, 2, 5
A/D converter
operating current
IADC
6
Notes 1,
fIL = 15 kHz
When conversion
at maximum speed
Normal mode, AVREFP = VDD = 5.0 V
Low voltage mode, AVREFP = VDD = 3.0 V
1.3
1.8
mA
0.5
0.8
mA
Note
A/D converter reference IADREF
1
voltage current
75.0
μA
Temperature sensor
operating current
ITMPS Note 1
75.0
μA
LVD operating current
ILVD Notes 1,
0.08
μA
7
Self-programming
operating current
IFSP Notes 1,
BGO operating current
IBGO
8
SNOOZE operating
current
ISNOZ Note 1
2.00
12.30
mA
2.00
12.30
mA
9
Notes 1,
ADC operation
CSI operation
The mode is performed Note 10
0.80
1.97
mA
The A/D conversion operations are performed,
Low voltage mode, AVREFP = VDD = 3.0 V
1.20
3.00
mA
0.70
1.56
mA
(Notes and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V) (2/2)
Parameter
Symbol
USB operating current
IUSBH
Note 11
IUSBF
Note 11
ISUSP
Note 12
Conditions
MIN.
TYP.
MAX.
Unit
During USB communication operation under the following settings
and conditions (VDD = 5.0 V, TA = +25°C):
• The internal power supply for the USB is used.
• X1 oscillation frequency (fX) = 12 MHz, PLL oscillation frequency
(fPLL) = 48 MHz
• The host controller (via two ports) is set to operate in full-speed
mode with four pipes (end points) used simultaneously.
(PIPE4: Bulk OUT transfer (64 bytes), PIPE5: Bulk IN transfer (64
bytes), PIPE6: Interrupt OUT transfer, PIPE7: Interrupt IN transfer).
• The USB ports (two ports) are individually connected to a
peripheral function via a 0.5 m USB cable.
9.0
mA
During USB communication operation under the following settings
and conditions (VDD = 5.0 V, TA = +25°C):
• The internal power supply for the USB is used.
• X1 oscillation frequency (fX) = 12 MHz, PLL oscillation frequency
(fPLL) = 48 MHz
• The function controller is set to operate in full-speed mode with
four pipes (end points) used simultaneously.
(PIPE4: Bulk OUT transfer (64 bytes), PIPE5: Bulk IN transfer (64
bytes), PIPE6: Interrupt OUT transfer, PIPE7: Interrupt IN transfer).
• The USB port (one port) is connected to the host device via a
0.5 m USB cable.
2.5
mA
During suspended state under the following settings and conditions
(VDD = 5.0 V, TA = +25°C):
• The function controller is set to full-speed mode (the UDP0 pin is
pulled up).
• The internal power supply for the USB is used.
• The system is set to STOP mode (When the high-speed on-chip
oscillator, high-speed system clock, and subsystem clock are
stopped. When the watchdog timer is stopped.).
• The USB port (one port) is connected to the host device via a
0.5 m USB cable.
240
μA
(Notes and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Notes 1. Current flowing to VDD.
2. When high speed on-chip oscillator and high-speed system clock are stopped.
3. Current flowing only to the real-time clock (RTC) (excluding the operating current of the low-speed
on-chip ocsillator and the XT1 oscillator). The supply current of the RL78 microcontrollers is the sum of
the values of either IDD1 or IDD2, and IRTC, when the real-time clock operates in operation mode or HALT
mode. When the low-speed on-chip oscillator is selected, IFIL should be added. IDD2 subsystem clock
operation includes the operational current of the real-time clock.
4. Current flowing only to the 12-bit interval timer (excluding the operating current of the low-speed on-chip
ocsillator and the XT1 oscillator). The supply current of the RL78 microcontrollers is the sum of the
values of either IDD1 or IDD2, and IIT, when the 12-bit interval timer operates in operation mode or HALT
mode. When the low-speed on-chip oscillator is selected, IFIL should be added.
5. Current flowing only to the watchdog timer (including the operating current of the low-speed on-chip
oscillator). The supply current of the RL78 microcontrollers is the sum of IDD1, IDD2 or IDD3 and IWDT when
the watchdog timer is in operation.
6. Current flowing only to the A/D converter. The supply current of the RL78 microcontrollers is the sum of
IDD1 or IDD2 and IADC when the A/D converter operates in an operation mode or the HALT mode.
7. Current flowing only to the LVD circuit. The current value of the RL78/G1C is the sum of IDD1, IDD2 or IDD3
and ILVI when the LVD circuit operates in the Operating, HALT or STOP mode.
8. Current flowing only during data flash rewrite.
9. Current flowing only during self programming.
10. For shift time to the SNOOZE mode, see 19.3.3 SNOOZE mode the RL78/G1C User’s Manual:
Hardware.
11. Current consumed only by the USB module and the internal power supply for the USB.
12. Includes the current supplied from the pull-up resistor of the UDP0 pin to the pull-down resistor of the
host device, in addition to the current consumed by this MCU during the suspended state.
Remarks 1. fIL:
Low-speed on-chip oscillator clock frequency
2. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
3. fCLK: CPU/peripheral hardware clock frequency
4. Temperature condition of the TYP. value is TA = 25°C
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.4 AC Characteristics
3.4.1 Basic operation
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Items
Symbol
Instruction cycle (minimum
instruction execution time)
TCY
Conditions
Main
system
clock (fMAIN)
operation
MIN.
TYP.
2.7 V ≤ VDD ≤ 5.5 V 0.04167
HS
(High-speed 2.4 V ≤ VDD < 2.7 V 0.0625
main) mode
Subsystem clock (fSUB)
2.4 V ≤ VDD ≤ 5.5 V
28.5
30.5
MAX.
Unit
1
μs
1
μs
31.3
μs
1
μs
1
μs
operation
In the self
HS
2.7 V ≤ VDD ≤ 5.5 V 0.04167
programming (High-speed 2.4 V ≤ VDD < 2.7 V 0.0625
mode
main) mode
External system clock frequency
fEX
2.7 V ≤ VDD ≤ 5.5 V
1.0
20.0
MHz
2.4 V ≤ VDD < 2.7 V
1.0
16.0
MHz
32
35
kHz
fEXS
External system clock input
high-level width, low-level width
tEXH, tEXL
2.7 V ≤ VDD ≤ 5.5 V
24
2.4 V ≤ VDD < 2.7 V
tEXHS, tEXLS
TI00 to TI03 input high-level
width, low-level width
tTIH,
tTIL
TO00 to TO03 output frequency
fTO
PCLBUZ0, PCLBUZ1 output
frequency
Interrupt input high-level width,
low-level width
fPCL
tINTH,
tINTL
Key interrupt input low-level width tKR
RESET low-level width
High-speed main
mode
High-speed main
mode
ns
30
ns
13.7
μs
1/fMCK+10
ns
4.0 V ≤ VDD ≤ 5.5 V
12
MHz
2.7 V ≤ VDD < 4.0 V
8
MHz
2.4 V ≤ VDD < 2.7 V
4
MHz
4.0 V ≤ VDD ≤ 5.5 V
16
MHz
2.7 V ≤ VDD < 4.0 V
8
MHz
2.4 V ≤ VDD < 2.7 V
4
MHz
μs
INTP0 to INTP6,
INTP8, INTP9
2.4 V ≤ VDD ≤ 5.5 V
1
KR0 to KR5
2.4 V ≤ VDD ≤ 5.5 V
250
ns
10
μs
tRSL
Remark fMCK: Timer array unit operation clock frequency
(Operation clock to be set by the CKS0n bit of timer mode register 0n (TMR0n). n: Channel number (n =
0 to 3))
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Minimum Instruction Execution Time during Main System Clock Operation
TCY vs VDD (HS (high-speed main) mode)
10
1.0
Cycle time TCY [μs]
When the high-speed on-chip oscillator
clock is selected
During self programming
When high-speed system clock is selected
0.1
0.0625
0.05
0.04167
0.01
0
1.0
2.0
3.0
2.4 2.7
4.0
5.0 5.5 6.0
Supply voltage VDD [V]
AC Timing Test Points
VIH/VOH
VIL/VOL
Test points
VIH/VOH
VIL/VOL
External System Clock Timing
1/fEX/
1/fEXS
tEXL/
tEXLS
tEXH/
tEXHS
EXCLK/EXCLKS
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ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
TI/TO Timing
tTIH
tTIL
TI00 to TI03
1/fTO
TO00 to TO03
Interrupt Request Input Timing
tINTL
tINTH
INTP0 to INTP6, INTP8, INTP9
Key Interrupt Input Timing
tKR
KR0 to KR5
RESET Input Timing
tRSL
RESET
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.5 Peripheral Functions Characteristics
3.5.1 Serial array unit
(1) During communication at same potential (UART mode) (dedicated baud rate generator output)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
Transfer rate
Theoretical value of the
maximum transfer rate
fMCK = fCLK Note
MAX.
Unit
fMCK/12
bps
2.0
Mbps
Note The maximum operating frequencies of the CPU/peripheral hardware clock (fCLK) are:
HS (high-speed main) mode:
24 MHz (2.7 V ≤ VDD ≤ 5.5 V)
16 MHz (2.4 V ≤ VDD ≤ 5.5 V)
Caution Select the normal input buffer for the RxDq pin and the normal output mode for the TxDq pin by
using port input mode register g (PIMg) and port output mode register g (POMg).
UART mode connection diagram (during communication at same potential)
Rx
TxDq
User's device
RL78 microcontroller
Tx
RxDq
UART mode bit width (during communication at same potential) (reference)
1/Transfer rate
High-/Low-bit width
Baud rate error tolerance
TxDq
RxDq
Remarks 1.
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00))
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ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
(2) During communication at same potential (CSI mode) (master mode, SCKp... internal clock output)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
2.7 V ≤ VDD ≤ 5.5 V
MIN.
TYP.
MAX.
Unit
SCKp cycle time
tKCY1
tKCY1 ≥ 4/fCLK
SCKp high-/low-level width
tKH1,
tKL1
4.0 V ≤ VDD ≤ 5.5 V
2.7 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 36
ns
2.4 V ≤ VDD ≤ 5.5 V
tKCY1/2 − 76
ns
4.0 V ≤ VDD ≤ 5.5 V
66
ns
2.7 V ≤ VDD ≤ 5.5 V
66
ns
2.4 V ≤ VDD ≤ 5.5 V
113
ns
38
ns
2.4 V ≤ VDD ≤ 5.5 V
SIp setup time (to SCKp↑)
Note 1
SIp hold time (from SCKp↑)
Note 2
Delay time from SCKp↓ to
SOp output Note 3
tSIK1
tKSI1
tKSO1
C = 30 pF
250
ns
500
ns
tKCY1/2 − 24
ns
Note 4
50
ns
Notes 1. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
2. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. C is the load capacitance of the SCKp and SOp output lines.
Caution Select the normal input buffer for the SIp pin and the normal output mode for the SOp pin and
SCKp pin by using port input mode register g (PIMg) and port output mode register g (POMg).
Remarks 1.
p: CSI number (p = 00, 01), m: Unit number (m = 0), n: Channel number (n = 0, 1),
g: PIM and POM numbers (g = 0, 3, 5, 7)
2.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00, 01))
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(3) During communication at same potential (CSI mode) (slave mode, SCKp... external clock input)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCKp cycle time
Symbol
Note 5
tKCY2
Conditions
4.0 V ≤ VDD ≤ 5.5 V
20 MHz < fMCK
2.7 V ≤ VDD ≤ 5.5 V
fMCK ≤ 16 MHz
tKH2,
tKL2
SIp setup time
(to SCKp↑) Note 1
tSIK2
SIp hold time
(from SCKp↑) Note 2
tKSI2
Delay time from SCKp↓ to
SOp output Note 3
tKSO2
TYP.
MAX.
Unit
16/fMCK
ns
fMCK ≤ 20 MHz
12/fMCK
ns
16 MHz < fMCK
16/fMCK
ns
12/fMCK
ns
12/fMCK
and 1000
ns
4.0 V ≤ EVDD0 ≤ 5.5 V
tKCY2/2 −
14
ns
2.7 V ≤ EVDD0 ≤ 5.5 V
tKCY2/2 −
16
ns
2.4 V ≤ VDD ≤ 5.5 V
tKCY2/2 −
36
ns
2.7 V ≤ VDD ≤ 5.5 V
1/fMCK+40
ns
2.4 V ≤ VDD ≤ 5.5 V
1/fMCK+60
ns
2.7 V ≤ VDD ≤ 5.5 V
1/fMCK+62
ns
2.4 V ≤ VDD ≤ 5.5 V
1/fMCK+62
ns
2.4 V ≤ VDD ≤ 5.5 V
SCKp high-/low-level width
MIN.
C = 30 pF
Note 4
2.7 V ≤ VDD ≤ 5.5 V
2/fMCK+66
ns
2.4 V ≤ VDD ≤ 5.5 V
2/fMCK+113
ns
Notes 1. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
2. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. C is the load capacitance of the SOp output lines.
5. Transfer rate in the SNOOZE mode: MAX. 1 Mbps
Caution Select the normal input buffer for the SIp pin and SCKp pin and the normal output mode for the
SOp pin by using port input mode register g (PIMg) and port output mode register g (POMg).
Remarks 1.
p: CSI number (p = 00, 01), m: Unit number (m = 0),
n: Channel number (n = 0, 1), g: PIM number (g = 0, 3, 5, 7)
2.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number, n:
Channel number (mn = 00, 01))
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
CSI mode connection diagram (during communication at same potential)
SCK
SCKp
RL78 microcontroller SIp
SO
User's device
SI
SOp
CSI mode serial transfer timing (during communication at same potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY1, 2
tKL1, 2
tKH1, 2
SCKp
tSIK1, 2
SIp
tKSI1, 2
Input data
tKSO1, 2
Output data
SOp
CSI mode serial transfer timing (during communication at same potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY1, 2
tKH1, 2
tKL1, 2
SCKp
tSIK1, 2
SIp
tKSI1, 2
Input data
tKSO1, 2
SOp
Remarks 1.
2.
Output data
p: CSI number (p = 00, 01)
m: Unit number, n: Channel number (mn = 00, 01)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
2
(4) During communication at same potential (simplified I C mode)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCLr clock frequency
Hold time when SCLr = “L”
Hold time when SCLr = “H”
Data setup time (reception)
Data hold time (transmission)
Symbol
fSCL
tLOW
tHIGH
tSU:DAT
tHD:DAT
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
Conditions
MIN.
400 Note 1
kHz
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
100 Note 1
kHz
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
1200
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
4600
ns
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
1200
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
4600
ns
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK + 220
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
1/fMCK + 580
2.7 V ≤ VDD ≤ 5.5 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
770
ns
2.4 V ≤ VDD ≤ 5.5 V,
Cb = 100 pF, Rb = 3 kΩ
0
1420
ns
Note 2
ns
Note 2
Notes 1. The value must also be equal to or less than fMCK/4.
2. Set the fMCK value to keep the hold time of SCLr = "L" and SCLr = "H".
Caution
Select the normal input buffer and the N-ch open drain output (VDD tolerance) mode for the SDAr
pin and the normal output mode for the SCLr pin by using port input mode register g (PIMg) and
port output mode register h (POMh).
(Caution and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
2
Simplified I C mode mode connection diagram (during communication at same potential)
VDD
Rb
SDA
SDAr
User's device
RL78 microcontroller
SCL
SCLr
2
Simplified I C mode serial transfer timing (during communication at same potential)
1/fSCL
tLOW
tHIGH
SCLr
SDAr
tHD:DAT
tSU:DAT
Remarks 1. Rb[Ω]:Communication line (SDAr) pull-up resistance, Cb[F]: Communication line (SDAr, SCLr) load
capacitance
2. r: IIC number (r = 00, 01), g: PIM number (g = 5), h: POM number (h = 3, 5)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number (m
= 0), n: Channel number (n = 0, 1), mn = 00, 01)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(5) Communication at different potential (2.5 V, 3 V) (UART mode) (1/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Transfer rate
Conditions
reception
MIN.
TYP.
4.0 V ≤ VDD ≤ 5.5 V,
MAX.
Unit
fMCK/12
bps
Note 1
2.7 V ≤ Vb ≤ 4.0 V
Theoretical value of the
maximum transfer rate
fCLK = 24 MHz,
fMCK = fCLK Note 2
2.7 V ≤ VDD < 4.0 V,
2.0
Mbps
fMCK/12
bps
Note 1
2.3 V ≤ Vb ≤ 2.7 V
Theoretical value of the
maximum transfer rate
fCLK = 24 MHz,
fMCK = fCLK Note 2
2.4 V ≤ VDD < 3.3 V,
2.0
Mbps
fMCK/12
bps
Note 1
1.6 V ≤ Vb ≤ 2.0 V
Theoretical value of the
2.0
Mbps
maximum transfer rate
fCLK = 24 MHz,
fMCK = fCLK Note 2
Notes 1. Use it with VDD≥Vb.
2. The maximum operating frequencies of the CPU/peripheral hardware clock (fCLK) are:
HS (high-speed main) mode:
24 MHz (2.7 V ≤ VDD ≤ 5.5 V)
16 MHz (2.4 V ≤ VDD ≤ 5.5 V)
Caution
Select the TTL input buffer for the RxDq pin and the N-ch open drain output (VDD tolerance) mode
for the TxDq pin by using port input mode register g (PIMg) and port output mode register g
(POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected
Remarks 1.
Vb[V]: Communication line voltage
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number,
n: Channel number (mn = 00)
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ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
(5) Communication at different potential (2.5 V, 3 V) (UART mode) (2/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
transmission 4.0 V ≤ VDD ≤ 5.5 V,
Transfer rate
2.7 V ≤ Vb ≤ 4.0 V
MAX.
Unit
Note 1
bps
2.6
Theoretical value of the
maximum transfer rate
Note 2
Mbps
Cb = 50 pF, Rb = 1.4 kΩ, Vb = 2.7 V
2.7 V ≤ VDD < 4.0 V,
Note 3
2.3 V ≤ Vb ≤ 2.7 V
1.2
Theoretical value of the
maximum transfer rate
Note 4
bps
Mbps
Cb = 50 pF, Rb = 2.7 kΩ, Vb = 2.3 V
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V
Theoretical value of the
maximum transfer rate
Notes
5, 6
bps
0.43
Mbps
Note 7
Cb = 50 pF, Rb = 5.5 kΩ, Vb = 1.6 V
Notes 1.
The smaller maximum transfer rate derived by using fMCK/12 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 4.0 V ≤ VDD ≤ 5.5 V and 2.7 V ≤ Vb ≤ 4.0 V
1
Maximum transfer rate =
{−Cb × Rb × ln (1 −
2.2
Vb )} × 3
[bps]
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
2.2
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
2.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 1 above to calculate the maximum transfer rate under conditions of the customer.
3.
The smaller maximum transfer rate derived by using fMCK/12 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 2.7 V ≤ VDD < 4.0 V and 2.3 V ≤ Vb ≤ 2.7 V
1
Maximum transfer rate =
{−Cb × Rb × ln (1 −
2.0
Vb )} × 3
[bps]
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
2.0
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
4.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 3 above to calculate the maximum transfer rate under conditions of the customer.
5.
Use it with VDD ≥ Vb.
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Notes 6.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
The smaller maximum transfer rate derived by using fMCK/12 or the following expression is the valid
maximum transfer rate.
Expression for calculating the transfer rate when 2.4 V ≤ VDD < 3.3 V and 1.6 V ≤ Vb ≤ 2.0 V
1
Maximum transfer rate =
[bps]
1.5
Vb )} × 3
{−Cb × Rb × ln (1 −
1
− {−Cb × Rb × ln (1 −
Transfer rate × 2
Baud rate error (theoretical value) =
1.5
Vb )}
1
( Transfer rate ) × Number of transferred bits
× 100 [%]
* This value is the theoretical value of the relative difference between the transmission and reception sides.
7.
This value as an example is calculated when the conditions described in the “Conditions” column are
met. Refer to Note 6 above to calculate the maximum transfer rate under conditions of the customer.
Caution Select the TTL input buffer for the RxDq pin and the N-ch open drain output (VDD tolerance) mode
for the TxDq pin by using port input mode register g (PIMg) and port output mode register g
(POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected
UART mode connection diagram (during communication at different potential)
Vb
Rb
TxDq
Rx
User's device
RL78 microcontroller
RxDq
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
UART mode bit width (during communication at different potential) (reference)
1/Transfer rate
Low-bit width
High-bit width
Baud rate error tolerance
TxDq
1/Transfer rate
High-/Low-bit width
Baud rate error tolerance
RxDq
Remarks 1.
Rb[Ω]:Communication line (TxDq) pull-up resistance, Cb[F]: Communication line (TxDq) load
capacitance, Vb[V]: Communication line voltage
2.
q: UART number (q = 0), g: PIM and POM number (g = 5)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(6) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (master mode, SCKp... internal clock output)
(1/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
SCKp cycle time
tKCY1
Conditions
tKCY1 ≥ 4/fCLK 4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V,
MIN.
TYP.
MAX.
Unit
600
ns
1000
ns
2300
ns
tKCY1/2 −
150
ns
tKCY1/2 −
340
ns
tKCY1/2 −
916
ns
tKCY1/2 − 24
ns
tKCY1/2 − 36
ns
tKCY1/2 −
100
ns
2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V,
2.4 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
SCKp high-level width
tKH1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
SCKp low-level width
tKL1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb
= 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 kΩ
Cautions 1. Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance)
mode for the SOp pin and SCKp pin by using port input mode register g (PIMg) and port
output mode register g (POMg). For VIH and VIL, see the DC characteristics with TTL input
buffer selected.
2. Use it with VDD ≥ Vb.
(Remarks are listed two pages after the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(6) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (master mode, SCKp... internal clock output)
(2/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
tSIK1
SIp setup time
(to SCKp↑) Note 1
Conditions
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
MIN.
TYP.
MAX.
Unit
162
ns
354
ns
958
ns
38
ns
38
ns
38
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tKSI1
SIp hold time
(from SCKp↑) Note 1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
Delay time from SCKp↓ to
SOp output Note 1
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
200
ns
390
ns
966
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tSIK1
SIp setup time
(to SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
88
ns
88
ns
220
ns
38
ns
38
ns
38
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
tKSI1
SIp hold time
(from SCKp↓) Note 2
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
Delay time from SCKp↑ to
SOp output Note 2
tKSO1
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
50
ns
50
ns
50
ns
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 3,
Cb = 30 pF, Rb = 5.5 kΩ
(Notes, Cautions and Remarks are listed on the next page.)
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ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
Notes 1.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.
2.
When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3.
Use it with VDD ≥ Vb.
Caution
Select the TTL input buffer for the SIp pin and the N-ch open drain output (VDD tolerance) mode
for the SOp pin and SCKp pin by using port input mode register g (PIMg) and port output mode
register g (POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
CSI mode connection diagram (during communication at different potential)
<Master>
Vb
Vb
Rb
Rb
SCKp
RL78 microcontroller SIp
SOp
SCK
SO
User's device
SI
Remarks 1. Rb[Ω]:Communication line (SCKp, SOp) pull-up resistance, Cb[F]: Communication line (SCKp, SOp)
load capacitance, Vb[V]: Communication line voltage
2. p: CSI number (p = 00), m: Unit number , n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
4. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
CSI mode serial transfer timing (master mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY1
tKL1
tKH1
SCKp
tSIK1
SIp
tKSI1
Input data
tKSO1
SOp
Output data
CSI mode serial transfer timing (master mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY1
tKL1
tKH1
SCKp
tSIK1
SIp
tKSI1
Input data
tKSO1
SOp
Output data
Remarks 1. p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
2. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(7) Communication at different potential (1.8 V, 2.5 V, 3 V) (CSI mode) (slave mode, SCKp... external clock
input)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCKp cycle time
Symbol
Note 1
tKCY2
Conditions
tSIK2
SIp setup time
(to SCKp↑) Note 3
SIp hold time
(from SCKp↑) Note 4
tKSI2
Delay time from SCKp↓ to
SOp output Note 5
tKSO2
MAX.
Unit
20 MHz < fMCK ≤ 24 MHz
24/fMCK
ns
2.7 V ≤ Vb ≤ 4.0 V
8 MHz < fMCK ≤ 20 MHz
20/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
16/fMCK
ns
fMCK ≤ 4 MHz
12/fMCK
ns
2.7 V ≤ VDD < 4.0 V,
20 MHz < fMCK ≤ 24 MHz
32/fMCK
ns
2.3 V ≤ Vb ≤ 2.7 V
16 MHz < fMCK ≤ 20 MHz
28/fMCK
ns
8 MHz < fMCK ≤ 16 MHz
24/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
16/fMCK
ns
fMCK ≤ 4 MHz
12/fMCK
ns
2.4 V ≤ VDD < 3.3 V,
20 MHz < fMCK ≤ 24 MHz
72/fMCK
ns
1.6 V ≤ Vb ≤ 2.0 V
16 MHz < fMCK ≤ 20 MHz
64/fMCK
ns
8 MHz < fMCK ≤ 16 MHz
52/fMCK
ns
4 MHz < fMCK ≤ 8 MHz
32/fMCK
ns
Note
fMCK ≤ 4 MHz
tKH2,
tKL2
TYP.
4.0 V ≤ VDD ≤ 5.5 V,
2
SCKp high-/low-level
width
MIN.
20/fMCK
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V
tKCY2/2 −
24
ns
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
tKCY2/2 −
36
ns
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2
tKCY2/2 −
100
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V
1/fMCK +
40
ns
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
1/fMCK +
40
ns
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2
1/fMCK +
60
ns
1/fMCK + 62
ns
4.0 V ≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 kΩ
2.7 V ≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 kΩ
2.4 V ≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 30 pF, Rb = 5.5 kΩ
2/fMCK +
240
ns
2/fMCK +
428
ns
2/fMCK +
1146
ns
Notes 1. Transfer rate in the SNOOZE mode: MAX. 1 Mbps
2. Use it with VDD ≥ Vb.
3. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
5. When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
(Caution and Remarks are listed on the next page.)
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ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
Caution Select the TTL input buffer for the SIp pin and SCKp pin and the N-ch open drain output (VDD
tolerance) mode for the SOp pin by using port input mode register g (PIMg) and port output mode
register g (POMg). For VIH and VIL, see the DC characteristics with TTL input buffer selected.
CSI mode connection diagram (during communication at different potential)
<Slave>
Vb
Rb
SCKp
RL78 microcontroller SIp
SOp
Remarks 1.
SCK
SO
User's device
SI
Rb[Ω]:Communication line (SOp) pull-up resistance, Cb[F]: Communication line (SOp) load
capacitance, Vb[V]: Communication line voltage
2.
p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00), g: PIM and POM number (g
= 0, 3, 5, 7)
3.
fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn).
m: Unit number, n: Channel number (mn = 00))
4.
CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
CSI mode serial transfer timing (slave mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1.)
tKCY2
tKL2
tKH2
SCKp
tSIK2
SIp
tKSI2
Input data
tKSO2
Output data
SOp
CSI mode serial transfer timing (slave mode) (during communication at different potential)
(When DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.)
tKCY2
tKL2
tKH2
SCKp
tSIK2
SIp
tKSI2
Input data
tKSO2
Output data
SOp
Remarks 1. p: CSI number (p = 00), m: Unit number, n: Channel number (mn = 00),
g: PIM and POM number (g = 0, 3, 5, 7)
2. CSI01 cannot communicate at different potential. Use other CSI for communication at different
potential.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
2
(8) Communication at different potential (1.8 V, 2.5 V, 3 V) (simplified I C mode) (1/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
SCLr clock frequency
Symbol
fSCL
Conditions
MIN.
MAX.
Unit
400 Note 1
kHz
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
400 Note 1
kHz
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
100 Note 1
kHz
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
100 Note 1
kHz
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
100 Note 1
kHz
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
Hold time when SCLr = “L”
tLOW
4.0 V ≤ VDD ≤ 5.5 V,
1200
ns
1200
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
4600
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
4600
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
4650
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
620
ns
2.7 V ≤ VDD < 4.0 V,
500
ns
2700
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
2400
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
1830
ns
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
Hold time when SCLr = “H”
tHIGH
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
(Notes, Caution and Remarks are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
2
(8) Communication at different potential (1.8 V, 2.5 V, 3 V) (simplified I C mode) (2/2)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Data setup time (reception)
Data hold time (transmission)
Symbol
tSU:DAT
tHD:DAT
Conditions
MIN.
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK + 340
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
1/fMCK +
340Note 3
MAX.
Unit
ns
Note 3
ns
4.0 V ≤ VDD ≤ 5.5 V,
1/fMCK + 760
Note 3
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
ns
2.7 V ≤ VDD < 4.0 V,
1/fMCK + 760
Note 3
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
ns
2.4 V ≤ VDD < 3.3 V,
1/fMCK + 570
Note 3
1.6 V ≤ Vb ≤ 2.0 V Notes 2,
Cb = 100 pF, Rb = 5.5 kΩ
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
770
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 50 pF, Rb = 2.7 kΩ
0
770
ns
4.0 V ≤ VDD ≤ 5.5 V,
2.7 V ≤ Vb ≤ 4.0 V,
Cb = 100 pF, Rb = 2.8 kΩ
0
1420
ns
2.7 V ≤ VDD < 4.0 V,
2.3 V ≤ Vb < 2.7 V,
Cb = 100 pF, Rb = 2.7 kΩ
0
1420
ns
2.4 V ≤ VDD < 3.3 V,
1.6 V ≤ Vb ≤ 2.0 V Note 2,
Cb = 100 pF, Rb = 5.5 kΩ
0
1215
ns
Notes 1. The value must also be equal to or less than fMCK/4.
2. Use it with VDD ≥ Vb.
3. Set the fMCK value to keep the hold time of SCLr = "L" and SCLr = "H".
Caution
Select the TTL input buffer and the N-ch open drain output (VDD tolerance) mode for the SDAr pin
and the N-ch open drain output (VDD tolerance) mode for the SCLr pin by using port input mode
register g (PIMg) and port output mode register g (POMg). For VIH and VIL, see the DC
characteristics with TTL input buffer selected.
(Remarks are listed on the next page.)
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RL78/G1C
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
2
Simplified I C mode connection diagram (during communication at different potential)
Vb
Rb
Vb
Rb
SDA
SDAr
User's device
RL78 microcontroller
SCL
SCLr
2
Simplified I C mode serial transfer timing (during communication at different potential)
1/fSCL
tLOW
tHIGH
SCLr
SDAr
tHD:DAT
tSU:DAT
Remarks 1. Rb[Ω]:Communication line (SDAr, SCLr) pull-up resistance, Cb[F]: Communication line (SDAr, SCLr)
load capacitance, Vb[V]: Communication line voltage
2. r: IIC number (r = 00), g: PIM, POM number (g = 0, 3, 5, 7)
3. fMCK: Serial array unit operation clock frequency
(Operation clock to be set by the CKSmn bit of serial mode register mn (SMRmn). m: Unit number, n:
Channel number (mn = 00)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.5.2 Serial interface IICA
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
HS (high-speed main) Mode
Standard
Mode
SCLA0 clock frequency
fSCL
Unit
Fast Mode
MIN.
MAX.
MIN.
MAX.
Fast mode: fCLK ≥ 3.5 MHz
−
−
0
400
kHz
Standard mode: fCLK ≥ 1 MHz
0
100
−
−
kHz
tSU:STA
4.7
0.6
μs
Hold time
tHD:STA
4.0
0.6
μs
Hold time when SCLA0 = “L”
tLOW
4.7
1.3
μs
Hold time when SCLA0 = “H”
tHIGH
4.0
0.6
μs
Data setup time (reception)
tSU:DAT
250
100
ns
Data hold time (transmission)
tHD:DAT
0
Setup time of stop condition
tSU:STO
4.0
0.6
μs
Bus-free time
tBUF
4.7
1.3
μs
Setup time of restart condition
Note 1
Note 2
Notes 1.
2.
3.45
0
0.9
μs
The first clock pulse is generated after this period when the start/restart condition is detected.
The maximum value (MAX.) of tHD:DAT is during normal transfer and a wait state is inserted in the ACK
(acknowledge) timing.
Caution The values in the above table are applied even when bit 1 (PIOR1) in the peripheral I/O redirection
register (PIOR) is 1. At this time, the pin characteristics (IOH1, IOL1, VOH1, VOL1) must satisfy the
values in the redirect destination.
Remark The maximum value of Cb (communication line capacitance) and the value of Rb (communication line
pull-up resistor) at that time in each mode are as follows.
Standard mode: Cb = 400 pF, Rb = 2.7 kΩ
Fast mode:
Cb = 320 pF, Rb = 1.1 kΩ
IICA serial transfer timing
tLOW
SCLA0
tHD:DAT
tHD:STA
tHIGH
tSU:STA
tHD:STA
tSU:STO
tSU:DAT
SDAA0
tBUF
Stop
condition
R01DS0348EJ0110
Nov 15, 2013
Start
condition
Rev.1.10
Restart
condition
Stop
condition
Page 117 of 135
RL78/G1C
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.
3.5.3 USB
(1) Electrical specifications
(TA = −40 to +105°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UVDD
UVBUS
MIN.
TYP.
MAX.
Unit
UVDD input voltage
characteristic
UVDD
Symbol
VDD = 3.0 to 5.5 V, PXXCON = 1,
VDDUSEB = 0 (UVDD ≤ VDD)
Conditions
3.0
3.3
3.6
V
UVDD output voltage
characteristic
UVDD
VDD = 4.0 to 5.5 V,
PXXCON = VDDUSEB = 1
3.0
3.3
3.6
V
UVBUS input voltage
characteristic
UVBUS
Function
4.35
Note
(4.02
)
5.00
5.25
V
4.75
5.00
5.25
V
MIN.
TYP.
MAX.
Unit
Host
Note Value of instantaneous voltage
(TA = −40 to +105°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi/UDMi
pins input
characteristic
(FS/LS
receiver)
UDPi/UDMi
pins output
characteristic
(FS driver)
Symbol
Input voltage
Conditions
VIH
2.0
Difference input
sensitivity
VDI
Difference
common mode
range
VCM
Output voltage
Transi-ti Rising
on time Falling
Matching
(TFR/TFF)
0.8
| UDP voltage − UDM voltage |
0.8
2.5
V
V
IOH = −200 μA
2.8
3.6
IOL = 2.4 mA
0
0.3
V
tFR
Rising: From 10% to 90 % of
amplitude,
Falling: From 90% to 10 % of
amplitude,
CL = 50 pF
4
20
ns
4
20
ns
90
111.1
%
1.3
2.0
V
28
44
Ω
2.8
3.6
V
tFF
VFRFM
ZDRV
Output voltage
VOH
Transi-ti Rising
on time Falling
tLR
UVDD voltage = 3.3 V,
Pin voltage = 1.65 V
VOL
0
0.3
V
75
300
ns
75
300
ns
80
125
%
1.3
2.0
V
Pull-down resistor RPD
14.25
24.80
kΩ
Idle
0.9
1.575
kΩ
1.425
3.09
kΩ
tLF
VLTFM
Crossover voltage VLCRS
Note
UVBUS
V
VOH
Output
Impedance
Matching Note
(TFR/TFF)
UDPi/UDMi
pins pull-up,
pull-down
V
0.2
VOL
Crossover voltage VFCRS
UDPi/UDMi
pins output
characteristic
(LS driver)
V
VIL
Pull-up
resistor
(i = 0
only)
Rising: From 10% to 90 % of
amplitude,
Falling: From 90% to 10 % of
amplitude,
CL = 200 to 600 pF
When the host controller function is
selected: The UDMi pin (i = 0, 1) is
pulled up via 1.5 kΩ.
When the function controller
function is selected: The UDP0 and
UDM0 pins are individually pulled
down via 15 kΩ
RPUI
Recep-t RPUA
ion
UVBUS pull-down
resistor
RVBUS
UVBUS input
voltage
VIH
UVBUS voltage = 5.5 V
VIL
1000
kΩ
3.20
V
0.8
V
Note Excludes the first signal transition from the idle state.
Remark
i = 0, 1
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RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Timing of UDPi and UDMi
UDPi
90 %
90 %
VCRS (Crossover voltage)
10 %
10 %
UDMi
tR
tF
(2) BC standard
(TA = −40 to +105°C, 3.0 V ≤ UVDD ≤ 3.6 V, 3.0 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
USB
standard
BC1.2
Symbol
Conditions
TYP.
MAX.
Unit
UDPi sink current
IDP_SINK
25
175
μA
UDMi sink current
IDM_SINK
25
175
μA
DCD source current
IDP_SRC
7
13
μA
Dedicated charging
port resistor
RDCP_DAT
200
Ω
0.25
0.4
V
0 V < UDP/UDM voltage < 1.0 V
Data detection voltage VDAT_REF
Remark
MIN.
UDPi source voltage
VDP_SRC
Output current 250 μA
0.5
0.7
V
UDMi source voltage
VDM_SRC
Output current 250 μA
0.5
0.7
V
i = 0, 1
R01DS0348EJ0110
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Rev.1.10
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RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(3) BC option standard (Host)
(TA = −40 to +105°C, 4.75 V ≤ UVBUS ≤ 5.25 V, 3.0 V ≤ UVDD ≤ 3.6 V, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi output
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VDSELi
1000
VP20
38
40
42
% UVBUS
voltage
[3:0]
(UVBUS divider (i = 0, 1)
ratio)
1001
VP27
51.6
53.6
55.6
% UVBUS
1010
VP20
38
40
42
% UVBUS
• VDOUEi = 1
1100
VP33
60
66
72
% UVBUS
UDMi output VDSELi
voltage
[3:0]
(UVBUS divider (i = 0, 1)
ratio)
1000
VM20
38
40
42
% UVBUS
1001
VM20
38
40
42
% UVBUS
1010
VM27
51.6
53.6
55.6
% UVBUS
• VDOUEi = 1
1100
VM33
60
66
72
% UVBUS
1000
VHDETP_UP0
UDPi
comparing
Note 1
voltage
VDSELi
[3:0]
(i = 0, 1)
(UVBUS divider
ratio)
56.2
VHDETP_DWN0 The fall of pin voltage detection voltage
1001
VHDETP_UP1
1010
VHDETP_UP2
The rise of pin voltage detection voltage
• CUSDETEi = 1
The rise of pin voltage detection voltage
60.5
(UVBUS divider
ratio)
1000
VHDETM_UP0
The rise of pin voltage detection voltage
45.0
1001
VHDETM_UP1
The rise of pin voltage detection voltage
56.2
• VDOUEi = 1
1010
• CUSDETEi = 1
UDPi pull-up detection
1000
VHDETM_UP2
56.2
1.575
kΩ
In low-speed mode, the power supply
1.575
kΩ
RHDET_PULL
voltage range of pull-up resistors
connected to the USB function
module is between 3.0 V and 3.6 V.
1010
1000
% UVBUS
In full-speed mode, the power supply
voltage range of pull-up resistors
connected to the USB function
module is between 3.0 V and 3.6 V.
1001
UDMi sink current
Note 2
detection
60.5
% UVBUS
RHDET_PULL
Note 2
Connect detection with
the low-speed (pull-up
resistor)
29.4
% UVBUS
1010
1000
% UVBUS
45.0
1001
UDMi pull-up detection
% UVBUS
VHDETM_DWN2 The fall of pin voltage detection voltage
Note 2
Connect detection with
the full speed function
(pull-up resistor)
The rise of pin voltage detection voltage
% UVBUS
% UVBUS
29.4
VHDETM_DWN1 The fall of pin voltage detection voltage
% UVBUS
% UVBUS
29.4
VHDETM_DWN0 The fall of pin voltage detection voltage
% UVBUS
% UVBUS
56.2
VHDETP_DWN2 The fall of pin voltage detection voltage
VDSELi
[3:0]
(i = 0, 1)
% UVBUS
29.4
VHDETP_DWN1 The fall of pin voltage detection voltage
• VDOUEi = 1
UDMi
comparing
Note 1
voltage
The rise of pin voltage detection voltage
IHDET_SINK
25
μA
1001
Connect detection with
the BC1.2 portable
device (sink resistor)
1010
Notes 1. If the voltage output from UDPi or UDMi (i = 0, 1) exceeds the range of the MAX and MIN values prescribed
in this specification, DPCUSDETi (bit 8) and DMCUSDETi (bit 9) of the USBBCOPTi register are set to 1.
2. If the pull-up resistance or sink current prescribed in this specification is applied to UDPi or UDMi (i = 0,
1), DPCUSDETi (bit 8) and DMCUSDETi (bit 9) of the USBBCOPTi register are set to 1.
Remark
i = 0, 1
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
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RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(4) BC option standard (Function)
(TA = −40 to +105°C, 4.35 V ≤ UVBUS ≤ 5.25 V, 3.0 V ≤ UVDD ≤ 3.6 V, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
UDPi/UDMi
VDSELi
input
[3:0]
(i = 0)
reference
voltage
(UVBUS divider
ratio)
• VDOUEi = 0
(i = 0))
R01DS0348EJ0110
Nov 15, 2013
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
0000
VDDET0
27
32
37
% UVBUS
0001
VDDET1
29
34
39
% UVBUS
0010
VDDET2
32
37
42
% UVBUS
0011
VDDET3
35
40
45
% UVBUS
0100
VDDET4
38
43
48
% UVBUS
0101
VDDET5
41
46
51
% UVBUS
0110
VDDET6
44
49
54
% UVBUS
0111
VDDET7
47
52
57
% UVBUS
1000
VDDET8
51
56
61
% UVBUS
1001
VDDET9
55
60
65
% UVBUS
1010
VDDET10
59
64
69
% UVBUS
1011
VDDET11
63
68
73
% UVBUS
1100
VDDET12
67
72
77
% UVBUS
1101
VDDET13
71
76
81
% UVBUS
1110
VDDET14
75
80
85
% UVBUS
1111
VDDET15
79
84
89
% UVBUS
Rev.1.10
Page 121 of 135
RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.6 Analog Characteristics
3.6.1 A/D converter characteristics
Classification of A/D converter characteristics
Input channel
Reference Voltage
Reference voltage (+) =
AVREFP
Reference voltage (−) =
AVREFM
ANI0 to ANI7
Refer to 3.6.1 (1).
ANI16, ANI17, ANI19
Refer to 3.6.1 (2).
Internal reference voltage
Temperature sensor output
voltage
Refer to 3.6.1 (1).
(1) When AVREF
(+)
Reference voltage (+) = VBGR
Reference voltage (−) =
AVREFM
Reference voltage (+) = VDD
Reference voltage (−) = VSS
Refer to 3.6.1 (3).
Refer to 3.6.1 (4).
−
= AVREFP/ANI0 (ADREFP1 = 0, ADREFP0 = 1), reference voltage (−) = AVREFM/ANI1
(ADREFM = 1), target pin: ANI2 to ANI7, internal reference voltage, and temperature sensor output
voltage
(TA = −40 to +105°C, 2.4 V ≤ AVREFP ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = AVREFP, Reference voltage
(−) = AVREFM = 0 V)
Parameter
Resolution
Symbol
Conditions
RES
Note 1
MIN.
TYP.
8
MAX.
Unit
10
bit
±3.5
LSB
Overall error
AINL
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
Conversion time
tCONV
10-bit resolution
Target pin: ANI2 to
ANI7
3.6 V ≤ VDD ≤ 5.5 V
2.125
39
μs
2.7 V ≤ VDD ≤ 5.5 V
3.1875
39
μs
2.4 V ≤ VDD ≤ 5.5 V
17
39
μs
3.6 V ≤ VDD ≤ 5.5 V
2.375
39
μs
2.7 V ≤ VDD ≤ 5.5 V
3.5625
39
μs
2.4 V ≤ VDD ≤ 5.5 V
17
39
μs
10-bit resolution
Target pin: Internal
reference voltage,
and temperature
sensor output voltage
(HS (high-speed
main) mode)
1.2
Zero-scale errorNotes 1, 2
EZS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±0.25
%FSR
Full-scale errorNotes 1, 2
EFS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±0.25
%FSR
Integral linearity errorNote 1
ILE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±2.5
LSB
Differential linearity error Note 1
DLE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±1.5
LSB
Analog input voltage
VAIN
ANI2 to ANI7
AVREFP
V
Internal reference voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
Temperature sensor output voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
0
VBGR
Note 4
VTMPS25 Note 4
V
V
(Notes are listed on the next page.)
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. When AVREFP < VDD, the MAX. values are as follows.
Overall error: Add ±1.0 LSB to the MAX. value when AVREFP = VDD.
Zero-scale error/Full-scale error: Add ±0.05%FSR to the MAX. value when AVREFP = VDD.
Integral linearity error/ Differential linearity error: Add ±0.5 LSB to the MAX. value when AVREFP = VDD.
4. Refer to 3.6.2 Temperature sensor/internal reference voltage characteristics.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(2) When reference voltage (+) = AVREFP/ANI0 (ADREFP1 = 0, ADREFP0 = 1), reference voltage (−) =
AVREFM/ANI1 (ADREFM = 1), target pin: ANI16, ANI17, ANI19
(TA = −40 to +105°C, 2.4 V ≤ AVREFP ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = AVREFP, Reference
voltage (−) = AVREFM = 0 V)
Parameter
Resolution
Symbol
Conditions
RES
Note 1
TYP.
MAX.
Unit
10
bit
±5.0
LSB
2.125
39
μs
3.1875
39
μs
17
39
μs
8
2.4 V ≤ AVREFP ≤ 5.5 V
Overall error
AINL
10-bit resolution
AVREFP = VDD Note 3
Conversion time
tCONV
10-bit resolution
3.6 V ≤ VDD ≤ 5.5 V
Target ANI pin:
2.7 V ≤ VDD ≤ 5.5 V
ANI16, ANI17, ANI19
2.4 V ≤ VDD ≤ 5.5 V
Notes 1, 2
MIN.
1.2
Zero-scale error
EZS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±0.35
%FSR
Full-scale errorNotes 1, 2
EFS
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±0.35
%FSR
Integral linearity errorNote 1
ILE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±3.5
LSB
Differential linearity error Note 1
DLE
10-bit resolution
AVREFP = VDD Note 3
2.4 V ≤ AVREFP ≤ 5.5 V
±2.0
LSB
Analog input voltage
VAIN
ANI16, ANI17, ANI19
AVREFP
and VDD
V
0
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. When AVREFP < VDD, the MAX. values are as follows.
Overall error: Add ±4.0 LSB to the MAX. value when AVREFP = VDD.
Zero-scale error/Full-scale error: Add ±0.20%FSR to the MAX. value when AVREFP = VDD.
Integral linearity error/ Differential linearity error: Add ±2.0 LSB to the MAX. value when AVREFP = VDD.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
(3) Reference voltage (+) = VDD (ADREFP1 = 0, ADREFP0 = 0), Reference voltage (−) = VSS (ADREFM = 0),
target ANI pin: ANI0 to ANI7, ANI16, ANI17, ANI19, internal reference voltage, and temperature sensor
output voltage
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = VDD, Reference voltage (−) = VSS)
Parameter
Symbol
Resolution
Conditions
RES
Notes 1, 2
MIN.
TYP.
8
MAX.
Unit
10
bit
Overall error
AINL
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±7.0
LSB
Conversion time
tCONV
10-bit resolution
Target ANI pin:
ANI0 to ANI7, ANI16,
ANI17, ANI19
3.6 V ≤ VDD ≤ 5.5 V
2.125
39
μs
2.7 V ≤ VDD ≤ 5.5 V
3.1875
39
μs
2.4 V ≤ VDD ≤ 5.5 V
17
39
μs
2.375
39
μs
3.5625
39
μs
17
39
μs
3.6 V ≤ VDD ≤ 5.5 V
10-bit resolution
Target ANI pin: Internal
2.7 V ≤ VDD ≤ 5.5 V
reference voltage, and
2.4 V ≤ VDD ≤ 5.5 V
temperature sensor
output voltage (HS
(high-speed main) mode)
Zero-scale errorNotes 1, 2
Notes 1, 2
Full-scale error
Note 1
Integral linearity error
Differential linearity error
Analog input voltage
Note 1
1.2
EZS
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
EFS
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
ILE
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±4.0
LSB
DLE
10-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±2.0
LSB
VAIN
ANI0 to ANI7, ANI16, ANI17, ANI19
VDD
V
Internal reference voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
Temperature sensor output voltage
(2.4 V ≤ VDD ≤ 5.5 V, HS (high-speed main)
mode)
0
VBGR
Note 3
VTMPS25 Note 3
V
V
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. Refer to 3.6.2 Temperature sensor/internal reference voltage characteristics.
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3.
(4) When Reference voltage (+)
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
= Internal reference voltage (ADREFP1 = 1, ADREFP0 = 0), Reference
voltage (−) = AVREFM/ANI1 (ADREFM = 1), target pin: ANI0 to ANI7, ANI16, ANI17, ANI19
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, Reference voltage (+) = VBGR
AVREFM
Note 4
Note 3
, Reference voltage (−) =
= 0 V, HS (high-speed main) mode)
Parameter
Symbol
Resolution
Conditions
MIN.
RES
TYP.
MAX.
8
Unit
Bit
Conversion time
tCONV
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
39
μs
Zero-scale errorNotes 1, 2
EZS
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±0.60
%FSR
ILE
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±2.0
LSB
DLE
8-bit resolution
2.4 V ≤ VDD ≤ 5.5 V
±1.0
LSB
Integral linearity errorNote 1
Differential linearity error
Note 1
Analog input voltage
VAIN
17
0
VBGR
Note 3
V
Notes 1. Excludes quantization error (±1/2 LSB).
2. This value is indicated as a ratio (%FSR) to the full-scale value.
3. Refer to 3.6.2 Temperature sensor/internal reference voltage characteristics.
4. When reference voltage (−) = VSS, the MAX. values are as follows.
Zero-scale error: Add ±0.35%FSR to the MAX. value when reference voltage (−) = AVREFM.
Integral linearity error: Add ±0.5 LSB to the MAX. value when reference voltage (−) = AVREFM.
Differential linearity error: Add ±0.2 LSB to the MAX. value when reference voltage (−) = AVREFM.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.6.2 Temperature sensor/internal reference voltage characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V, HS (high-speed main) mode )
Parameter
Symbol
Conditions
MIN.
Temperature sensor output voltage VTMPS25
Setting ADS register = 80H, TA = +25°C
Internal reference voltage
VBGR
Setting ADS register = 81H
Temperature coefficient
FVTMPS
Temperature sensor that depends on the
temperature
Operation stabilization wait time
tAMP
TYP.
MAX.
1.05
1.38
Unit
V
1.45
1.5
−3.6
V
mV/°C
μs
5
3.6.3 POR circuit characteristics
(TA = −40 to +105°C, VSS = 0 V)
Parameter
Detection voltage
Minimum pulse widthNote
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VPOR
Power supply rise time
1.45
1.51
1.57
V
VPDR
Power supply fall time
1.44
1.50
1.56
V
μs
300
TPW
Note Minimum time required for a POR reset when VDD exceeds below VPDR. This is also the minimum time
required for a POR reset from when VDD exceeds below 0.7 V to when VDD exceeds VPOR while STOP mode is
entered or the main system clock (fMAIN) is stopped through setting bit 0 (HIOSTOP) and bit 7 (MSTOP) in the
clock operation status control register (CSC).
TPW
Supply voltage (VDD)
VPOR
VPDR or 0.7 V
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.6.4 LVD circuit characteristics
LVD Detection Voltage of Reset Mode and Interrupt Mode
(TA = −40 to +105°C, VPDR ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Detection
voltage
Supply voltage level
Symbol
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Minimum pulse width
tLW
Detection delay time
tLD
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
Conditions
MIN.
TYP.
MAX.
Unit
Power supply rise time
3.90
4.06
4.22
V
Power supply fall time
3.83
3.98
4.13
V
Power supply rise time
3.60
3.75
3.90
V
Power supply fall time
3.53
3.67
3.81
V
Power supply rise time
3.01
3.13
3.25
V
Power supply fall time
2.94
3.06
3.18
V
Power supply rise time
2.90
3.02
3.14
V
Power supply fall time
2.85
2.96
3.07
V
Power supply rise time
2.81
2.92
3.03
V
Power supply fall time
2.75
2.86
2.97
V
Power supply rise time
2.70
2.81
2.92
V
Power supply fall time
2.64
2.75
2.86
V
Power supply rise time
2.61
2.71
2.81
V
Power supply fall time
2.55
2.65
2.75
V
Power supply rise time
2.51
2.61
2.71
V
Power supply fall time
2.45
2.55
2.65
V
μs
300
300
μs
Page 128 of 135
RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
LVD Detection Voltage of Interrupt & Reset Mode
(TA = −40 to +105°C, VPDR ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Interrupt and reset VLVDD0
mode
VLVDD1
Conditions
MIN.
TYP.
MAX.
Unit
VPOC2, VPOC1, VPOC0 = 0, 1, 1, falling reset voltage
2.64
2.75
2.86
V
2.81
2.92
3.03
V
2.75
2.86
2.97
V
2.90
3.02
3.14
V
2.85
2.96
3.07
V
3.90
4.06
4.22
V
3.83
3.98
4.13
V
LVIS1, LVIS0 = 1, 0 Rising release reset voltage
Falling interrupt voltage
VLVDD2
LVIS1, LVIS0 = 0, 1 Rising release reset voltage
Falling interrupt voltage
VLVDD3
LVIS1, LVIS0 = 0, 0 Rising release reset voltage
Falling interrupt voltage
3.6.5 Power supply voltage rising slope characteristics
(TA = −40 to +105°C, VSS = 0 V)
Parameter
Power supply voltage rising slope
Caution
Symbol
Conditions
MIN.
SVDD
TYP.
MAX.
Unit
54
V/ms
Make sure to keep the internal reset state by the LVD circuit or an external reset until VDD
reaches the operating voltage range shown in 3.4 AC Characteristics.
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3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.7 Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics
(TA = −40 to +105°C, VSS = 0 V)
Parameter
Data retention supply voltage
Symbol
Conditions
MIN.
TYP.
Note
1.44
VDDDR
MAX.
Unit
5.5
V
Note The value depends on the POR detection voltage. When the voltage drops, the data is retained before a
POR reset is effected, but data is not retained when a POR reset is effected.
Operation mode
STOP mode
Data retention mode
VDD
VDDDR
STOP instruction execution
Standby release signal
(interrupt request)
3.8 Flash Memory Programming Characteristics
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
CPU/peripheral hardware clock
frequency
fCLK
2.4 V ≤ VDD ≤ 5.5 V
Number of code flash rewrites
Cerwr
Retaining years: 20 years
TA = +85°C
Retaining years: 1 year
TA = +25°C
Retaining years: 5 years
TA = +85°C
100,000
Retaining years: 20 years
TA = +85°C
10,000
Number of data flash rewrites
TYP.
1
MAX.
Unit
24
MHz
1,000
Times
1,000,000
Notes 1, 2, 3
Notes 1. 1 erase + 1 write after the erase is regarded as 1 rewrite. The retaining years are until next rewrite after
the rewrite.
2. When using flash memory programmer and Renesas Electronics self programming library.
3. These specifications show the characteristics of the flash memory and the results obtained from
Renesas Electronics reliability testing.
3.9 Dedicated Flash Memory Programmer Communication (UART)
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Transfer rate
R01DS0348EJ0110
Nov 15, 2013
Symbol
Conditions
During serial programming
Rev.1.10
MIN.
115,200
TYP.
MAX.
Unit
1,000,000
bps
Page 130 of 135
RL78/G1C
3.
ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
3.10 Timing Specs for Switching Flash Memory Programming Modes
(TA = −40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
100
ms
How long from when an external
reset ends until the initial
communication settings are
specified
tSUINIT
POR and LVD reset must end before the
external reset ends.
How long from when the TOOL0
tSU
POR and LVD reset must end before the
external reset ends.
10
μs
tHD
POR and LVD reset must end before the
external reset ends.
1
ms
pin is placed at the low level until
an external reset ends
How long the TOOL0 pin must be
kept at the low level after an
external reset ends
(excluding the processing time of
the firmware to control the flash
memory)
<1>
<2>
<4>
<3>
RESET
723 μs + tHD
processing
time
00H reception
(TOOLRxD, TOOLTxD mode)
TOOL0
tSU
<1>
<2>
tSUINIT
The low level is input to the TOOL0 pin.
The external reset ends (POR and LVD reset must end before the external reset
ends.).
<3>
The TOOL0 pin is set to the high level.
<4>
Setting of the flash memory programming mode by UART reception and complete
the baud rate setting.
Remark tSUINIT: The segment shows that it is necessary to finish specifying the initial communication settings within
100 ms from when the resets end.
tSU:
How long from when the TOOL0 pin is placed at the low level until an external reset ends
tHD:
How long to keep the TOOL0 pin at the low level from when the external and internal resets end
(excluding the processing time of the firmware to control the flash memory)
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RL78/G1C
4.
4.
PACKAGE
PACKAGE
DRAWINGS
DRAWINGS
4.1 32-pin Products
R5F10JBCAFP, R5F10KBCAFP
R5F10JBCGFP, R5F10KBCGFP
JEITA Package Code
RENESAS Code
Previous Code
MASS (TYP.) [g]
P-LQFP32-7x7-0.80
PLQP0032GB-A
P32GA-80-GBT-1
0.2
HD
2
D
17
16
24
25
detail of lead end
1
E
c
HE
θ
32
8
1
L
9
e
(UNIT:mm)
3
b
x
M
A
A2
ITEM
D
DIMENSIONS
7.00±0.10
E
7.00±0.10
HD
9.00±0.20
HE
9.00±0.20
A
1.70 MAX.
A1
0.10±0.10
A2
y
A1
1.40
b
0.37±0.05
c
0.145 ±0.055
L
0.50±0.20
θ
0° to 8°
e
0.80
1.Dimensions “ 1” and “ 2” do not include mold flash.
x
0.20
2.Dimension “ 3” does not include trim offset.
y
0.10
NOTE
R01DS0348EJ0110
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Rev.1.10
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RL78/G1C
4.
PACKAGE
DRAWINGS
R5F10JBCANA, R5F10KBCANA
R5F10JBCGNA, R5F10KBCGNA
JEITA Package Code
RENESAS Code
Previous Code
MASS (TYP.) [g]
P-HWQFN32-5x5-0.50
PWQN0032KB-A
P32K8-50-3B4-3
0.06
D
DETAIL OF A PART
E
S
A
A
S
y
S
(UNIT:mm)
ITEM
D2
A
EXPOSED DIE PAD
1
9
32
D
5.00 ± 0.05
E
5.00 ± 0.05
A
e
0.75 ± 0.05
+
0.25 − 0.05
0.07
0.50
Lp
0.40 ± 0.10
b
8
B
DIMENSIONS
x
0.05
y
0.05
E2
ITEM
25
16
17
24
Lp
EXPOSED
DIE PAD
VARIATIONS
D2
E2
MIN NOM MAX MIN NOM MAX
A 3.45 3.50 3.55 3.45 3.50 3.55
e
b
x
M
S AB
2012 Renesas Electronics Corporation. All rights reserved.
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
Page 133 of 135
RL78/G1C
4.
PACKAGE
DRAWINGS
4.2 48-pin products
R5F10JGCAFB, R5F10KGCAFB
R5F10JGCGFB, R5F10KGCGFB
JEITA Package Code
RENESAS Code
Previous Code
MASS (TYP.) [g]
P-LFQFP48-7x7-0.50
PLQP0048KF-A
P48GA-50-8EU-1
0.16
HD
D
detail of lead end
36
25
37
A3
24
c
θ
E
L
Lp
HE
L1
(UNIT:mm)
13
48
12
1
ZE
e
ZD
b
x
M
S
A
ITEM
D
DIMENSIONS
7.00±0.20
E
7.00±0.20
HD
9.00±0.20
HE
9.00±0.20
A
1.60 MAX.
A1
0.10±0.05
A2
1.40±0.05
A3
b
A2
c
L
S
y
S
NOTE
Each lead centerline is located within 0.08 mm of
its true position at maximum material condition.
A1
0.25
0.22±0.05
0.145 +0.055
−0.045
0.50
Lp
0.60±0.15
L1
θ
1.00±0.20
3° +5°
−3°
e
0.50
x
0.08
y
0.08
ZD
0.75
ZE
0.75
2012 Renesas Electronics Corporation. All rights reserved.
R01DS0348EJ0110
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Rev.1.10
Page 134 of 135
RL78/G1C
4.
PACKAGE
DRAWINGS
R5F10JGCANA, R5F10KGCANA
R5F10JGCGNA, R5F10KGCGNA
JEITA Package Code
RENESAS Code
Previous Code
MASS (TYP.) [g]
P-HWQFN48-7x7-0.50
PWQN0048KB-A
P48K8-50-5B4-4
0.13
D
DETAIL OF
E
S
A
PART
A
A
S
y
(UNIT:mm )
S
ITEM
D2
A
EXPOSED DIE PAD
1
12
D
7.00 ± 0.05
E
7.00 ± 0.05
A
0.75 ± 0.05
b
+
0.25 − 0.05
0.07
e
13
48
DIMENSIONS
Lp
0.50
0.40 ± 0.10
x
0.05
y
0.05
B
E2
ITEM
37
24
36
25
Lp
EXPOSED
DIE PAD
VARIATIONS
D2
E2
MIN NOM MAX MIN NOM MAX
A 5.45 5.50 5.55 5.45 5.50 5.55
e
b
x
M
S AB
2012 Renesas Electronics Corporation. All rights reserved.
R01DS0348EJ0110
Nov 15, 2013
Rev.1.10
Page 135 of 135
Revision History
RL78/G1C Data Sheet
Description
Rev.
Date
Page
0.01
Sep 20, 2012
-
1.00
Aug 08, 2013
Throughout
Summary
First Edition issued
Deletion of the bar over SCK and SCKxx
Renaming of fEXT to fEXS
Renaming of interval timer (unit) to 12-bit interval timer
Addition of products for G: Industrial applications (TA = -40 to +105 °C )
1
Change of 1.1 Features
2
Change of 1.2 List of Part Numbers
3
Modification of Figure 1-1. Part Number, Memory Size, and Package of RL78/G1C
4, 5
15, 16
17 to 76
Addition of a whole chapter
77 to 131
Addition of a whole chapter
132
1.10
Nov 15, 2013
Addition of remark to 1.3 Pin Configuration (Top View)
Change of 1.6 Outline of Functions
Addition of products for G: Industrial applications (TA = -40 to +105 °C )
77
Caution 3 added.
79
Note for operating ambient temperature in 3.1 Absolute Maximum Ratings deleted.
SuperFlash is a registered trademark of Silicon Storage Technology, Inc. in several countries including the United
States and Japan.
Caution: This product uses SuperFlash® technology licensed from Silicon Storage Technology, Inc.
All trademarks and registered trademarks are the property of their respective owners.
C-1
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a
reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If
an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended
to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors should be grounded. The operator should be grounded using a wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken
for PW boards with mounted semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS
device. Immediately after the power source is turned ON, devices with reset functions have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A
device is not initialized until the reset signal is received. A reset operation must be executed immediately
after power-on for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately
for each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply
while the device is not powered. The current injection that results from input of such a signal or I/O pull-up
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements. Input of signals during the power off state must be judged
separately for each device and according to related specifications governing the device.
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
2.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
3.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or
5.
Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on
third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.
the product's quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; and industrial robots etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc.
Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical
implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it
in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses
incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics.
6.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
9.
Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or
regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the
development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and
regulations and follow the procedures required by such laws and regulations.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the
contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics
products.
11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
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Tel: +1-408-588-6000, Fax: +1-408-588-6130
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Tel: +65-6213-0200, Fax: +65-6213-0300
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Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
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Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2013 Renesas Electronics Corporation. All rights reserved.
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