12c5xx

12c5xx
PIC12C5XX
8-Pin, 8-Bit CMOS Microcontrollers
Devices included in this Data Sheet:
Peripheral Features:
• PIC12C508 • PIC12C508A
• PIC12C509 • PIC12C509A
• PIC12CR509A
• PIC12CE518
• PIC12CE519
PIC12C508
512 x 12
25
• 8-bit real time clock/counter (TMR0) with 8-bit
programmable prescaler
• Power-On Reset (POR)
• Device Reset Timer (DRT)
• Watchdog Timer (WDT) with its own on-chip RC
oscillator for reliable operation
• Programmable code-protection
• 1,000,000 erase/write cycle EEPROM data
memory
• EEPROM data retention > 40 years
• Power saving SLEEP mode
• Wake-up from SLEEP on pin change
• Internal weak pull-ups on I/O pins
• Internal pull-up on MCLR pin
• Selectable oscillator options:
- INTRC: Internal 4 MHz RC oscillator
- EXTRC: External low-cost RC oscillator
- XT:
Standard crystal/resonator
- LP:
Power saving, low frequency crystal
PIC12C508A
512 x 12
25
CMOS Technology:
PIC12C509
1024 x 12
41
PIC12C509A
1024 x 12
41
PIC12CE518
512 x 12
25
16
PIC12CE519
1024 x 12
41
16
Note: Throughout this data sheet PIC12C5XX
refers to the PIC12C508, PIC12C509,
PIC12C508A, PIC12C509A,
PIC12CR509A, PIC12CE518 and
PIC12CE519. PIC12CE5XX refers to
PIC12CE518 and PIC12CE519.
High-Performance RISC CPU:
• Only 33 single word instructions to learn
• All instructions are single cycle (1 µs) except for
program branches which are two-cycle
• Operating speed: DC - 4 MHz clock input
DC - 1 µs instruction cycle
Memory
Device
PIC12CR509A
EPROM
Program
ROM
Program
1024 x 12
•
•
•
•
•
RAM
Data
EEPROM
Data
41
12-bit wide instructions
8-bit wide data path
Seven special function hardware registers
Two-level deep hardware stack
Direct, indirect and relative addressing modes for
data and instructions
• Internal 4 MHz RC oscillator with programmable
calibration
• In-circuit serial programming
 1999 Microchip Technology Inc.
• Low power, high speed CMOS EPROM/ROM
technology
• Fully static design
• Wide operating voltage range
• Wide temperature range:
- Commercial: 0°C to +70°C
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
• Low power consumption
- < 2 mA @ 5V, 4 MHz
- 15 µA typical @ 3V, 32 KHz
- < 1 µA typical standby current
DS40139E-page 1
PIC12C5XX
Pin Diagram - PIC12C508/509
PDIP, 208 mil SOIC, Windowed Ceramic Side Brazed
1
2
GP4/OSC2
GP3/MCLR/VPP
3
PIC12C508
PIC12C509
VDD
GP5/OSC1/CLKIN
4
8
VSS
7
GP0
6
GP1
5
GP2/T0CKI
Pin Diagram - PIC12C508A/509A,
PIC12CE518/519
PDIP, 150 & 208 mil SOIC, Windowed CERDIP
1
2
GP4/OSC2
GP3/MCLR/VPP
3
4
PIC12C508A
PIC12C509A
PIC12CE518
PIC12CE519
VDD
GP5/OSC1/CLKIN
8
VSS
7
GP0
6
GP1
5
GP2/T0CKI
8
VSS
7
GP0
6
GP1
5
GP2/T0CKI
Pin Diagram - PIC12CR509A
PDIP, 150 & 208 mil SOIC
1
2
GP4/OSC2
GP3/MCLR/VPP
3
4
PIC12CR509A
VDD
GP5/OSC1/CLKIN
Device Differences
Device
Voltage
Range
Oscillator
Oscillator
Calibration2
(Bits)
Process
Technology
(Microns)
PIC12C508A
3.0-5.5
See Note 1
6
0.7
PIC12LC508A
2.5-5.5
See Note 1
6
0.7
PIC12C508
2.5-5.5
See Note 1
4
0.9
PIC12C509A
3.0-5.5
See Note 1
6
0.7
PIC12LC509A
2.5-5.5
See Note 1
6
0.7
PIC12C509
2.5-5.5
See Note 1
4
0.9
PIC12CR509A
2.5-5.5
See Note 1
6
0.7
PIC12CE518
3.0-5.5
-
6
0.7
PIC12LCE518
2.5-5.5
-
6
0.7
PIC12CE519
3.0-5.5
-
6
0.7
PIC12LCE519
2.5-5.5
-
6
0.7
Note 1: If you change from the PIC12C50X to the PIC12C50XA or to the PIC12CR50XA, please verify
oscillator characteristics in your application.
Note 2: See Section 7.2.5 for OSCCAL implementation differences.
DS40139E-page 2
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE OF CONTENTS
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
General Description............................................................................................................................................... 4
PIC12C5XX Device Varieties ................................................................................................................................ 7
Architectural Overview........................................................................................................................................... 9
Memory Organization .......................................................................................................................................... 13
I/O Port ................................................................................................................................................................ 21
Timer0 Module and TMR0 Register .................................................................................................................... 25
EEPROM Peripheral Operation........................................................................................................................... 29
Special Features of the CPU ............................................................................................................................... 35
Instruction Set Summary ..................................................................................................................................... 47
Development Support.......................................................................................................................................... 59
Electrical Characteristics - PIC12C508/PIC12C509............................................................................................ 65
DC and AC Characteristics - PIC12C508/PIC12C509 ........................................................................................ 75
Electrical Characteristics PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A/PIC12CR509A/
PIC12CE518/PIC12CE519/
PIC12LCE518/PIC12LCE519/PIC12LCR509A ................................................................................................... 79
14.0 DC and AC Characteristics
PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A/PIC12CE518/PIC12CE519/PIC12CR509A/
PIC12LCE518/PIC12LCE519/ PIC12LCR509A .................................................................................................. 93
15.0 Packaging Information......................................................................................................................................... 99
Index ........................................................................................................................................................................... 105
PIC12C5XX Product Identification System ................................................................................................................ 109
Sales and Support: ..................................................................................................................................................... 109
To Our Valued Customers
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner
of any page. The last character of the literature number is the version number. e.g., DS30000A is version A of document DS30000.
Errata
An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended workarounds. As device/documentation issues become known to us, we will publish an errata sheet. The
errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
• The Microchip Corporate Literature Center; U.S. FAX: (602) 786-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet
(include literature number) you are using.
Corrections to this Data Sheet
We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time
to ensure that this document is correct. However, we realize that we may have missed a few things. If you find any
information that is missing or appears in error, please:
• Fill out and mail in the reader response form in the back of this data sheet.
• E-mail us at [email protected]
We appreciate your assistance in making this a better document.
 1999 Microchip Technology Inc.
DS40139E-page 3
PIC12C5XX
1.0
GENERAL DESCRIPTION
The PIC12C5XX from Microchip Technology is a family of low-cost, high performance, 8-bit, fully static,
EEPROM/EPROM/ROM-based CMOS microcontrollers. It employs a RISC architecture with only 33 single word/single cycle instructions. All instructions are
single cycle (1 µs) except for program branches
which take two cycles. The PIC12C5XX delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide
instructions are highly symmetrical resulting in 2:1
code compression over other 8-bit microcontrollers in
its class. The easy to use and easy to remember
instruction set reduces development time significantly.
The PIC12C5XX products are equipped with special
features that reduce system cost and power requirements. The Power-On Reset (POR) and Device Reset
Timer (DRT) eliminate the need for external reset circuitry. There are four oscillator configurations to choose
from, including INTRC internal oscillator mode and the
power-saving LP (Low Power) oscillator mode. Power
saving SLEEP mode, Watchdog Timer and code
protection features also improve system cost, power
and reliability.
1.1
Applications
The PIC12C5XX series fits perfectly in applications
ranging from personal care appliances and security
systems to low-power remote transmitters/receivers.
The EPROM technology makes customizing application programs (transmitter codes, appliance settings,
receiver frequencies, etc.) extremely fast and convenient, while the EEPROM data memory technology
allows for the changing of calibration factors and security codes. The small footprint packages, for through
hole or surface mounting, make this microcontroller
series perfect for applications with space limitations.
Low-cost, low-power, high performance, ease of use
and I/O flexibility make the PIC12C5XX series very versatile even in areas where no microcontroller use has
been considered before (e.g., timer functions, replacement of “glue” logic and PLD’s in larger systems, coprocessor applications).
The PIC12C5XX are available in the cost-effective
One-Time-Programmable (OTP) versions which are
suitable for production in any volume. The customer
can take full advantage of Microchip’s price leadership
in OTP microcontrollers while benefiting from the OTP’s
flexibility.
The PIC12C5XX products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a ‘C’ compiler, fuzzy logic support tools,
a low-cost development programmer, and a full featured programmer. All the tools are supported on IBM
PC and compatible machines.
DS40139E-page 4
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 1-1:
PIC12CXXX & PIC12CEXXX FAMILY OF DEVICES
PIC12C508(A) PIC12C509(A) PIC12CR509A PIC12CE518 PIC12CE519 PIC12C671 PIC12C672 PIC12CE673 PIC12CE674
Clock
Memory
Peripherals
Features
Maximum
Frequency
of Operation
(MHz)
4
4
4
4
4
10
10
10
10
EPROM
Program
Memory
512 x 12
1024 x 12
1024 x 12
(ROM)
512 x 12
1024 x 12
1024 x 14
2048 x 14
1024 x 14
2048 x 14
RAM Data
Memory
(bytes)
25
41
41
25
41
128
128
128
128
EEPROM
Data Memory
(bytes)
—
—
—
16
16
—
—
16
16
Timer
Module(s)
TMR0
TMR0
TMR0
TMR0
TMR0
TMR0
TMR0
TMR0
TMR0
A/D Converter (8-bit)
Channels
—
—
—
—
—
4
4
4
4
Wake-up
from SLEEP
on pin
change
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Interrupt
Sources
—
—
—
4
4
4
4
I/O Pins
5
5
5
5
5
5
5
5
5
Input Pins
1
1
1
1
1
1
1
1
1
Internal
Pull-ups
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
In-Circuit
Serial
Programming
Yes
Yes
—
Yes
Yes
Yes
Yes
Yes
Yes
Number of
Instructions
33
33
33
33
33
35
35
35
35
Packages
8-pin DIP,
JW, SOIC
8-pin DIP,
JW, SOIC
8-pin DIP,
SOIC
8-pin DIP,
JW, SOIC
8-pin DIP,
JW, SOIC
8-pin DIP,
JW, SOIC
8-pin DIP,
JW, SOIC
8-pin DIP,
JW
8-pin DIP,
JW
All PIC12CXXX & PIC12CEXXX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O
current capability.
All PIC12CXXX & PIC12CEXXX devices use serial programming with data pin GP0 and clock pin GP1.
 1999 Microchip Technology Inc.
DS40139E-page 5
PIC12C5XX
NOTES:
DS40139E-page 6
 1999 Microchip Technology Inc.
PIC12C5XX
2.0
PIC12C5XX DEVICE VARIETIES
A variety of packaging options are available.
Depending
on
application
and
production
requirements, the proper device option can be
selected using the information in this section. When
placing orders, please use the PIC12C5XX Product
Identification System at the back of this data sheet to
specify the correct part number.
2.1
UV Erasable Devices
The UV erasable version, offered in ceramic side
brazed package, is optimal for prototype development
and pilot programs.
The UV erasable version can be erased and
reprogrammed to any of the configuration modes.
Note:
Please note that erasing the device will
also erase the pre-programmed internal
calibration value for the internal oscillator.
The calibration value must be saved prior
to erasing the part.
Microchip’s PICSTART PLUS and PRO MATE programmers all support programming of the PIC12C5XX.
Third party programmers also are available; refer to the
Microchip Third Party Guide for a list of sources.
2.2
One-Time-Programmable (OTP)
Devices
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates or small volume applications.
2.3
Quick-Turnaround-Production (QTP)
Devices
Microchip offers a QTP Programming Service for
factory production orders. This service is made
available for users who choose not to program a
medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to
the OTP devices but with all EPROM locations and fuse
options already programmed by the factory. Certain
code and prototype verification procedures do apply
before production shipments are available. Please contact your local Microchip Technology sales office for
more details.
2.4
Serialized Quick-Turnaround
Production (SQTPSM) Devices
Microchip offers a unique programming service where
a few user-defined locations in each device are
programmed with different serial numbers. The serial
numbers may be random, pseudo-random or
sequential.
Serial programming allows each device to have a
unique number which can serve as an entry-code,
password or ID number.
2.5
Read Only Memory (ROM) Device
Microchip offers masked ROM to give the customer a
low cost option for high volume, mature products.
The OTP devices, packaged in plastic packages permit
the user to program them once. In addition to the
program memory, the configuration bits must also be
programmed.
 1999 Microchip Technology Inc.
DS40139E-page 7
PIC12C5XX
NOTES:
DS40139E-page 8
 1999 Microchip Technology Inc.
PIC12C5XX
3.0
ARCHITECTURAL OVERVIEW
The high performance of the PIC12C5XX family can
be attributed to a number of architectural features
commonly found in RISC microprocessors. To begin
with, the PIC12C5XX uses a Harvard architecture in
which program and data are accessed on separate
buses. This improves bandwidth over traditional von
Neumann architecture where program and data are
fetched on the same bus. Separating program and
data memory further allows instructions to be sized
differently than the 8-bit wide data word. Instruction
opcodes are 12-bits wide making it possible to have all
single word instructions. A 12-bit wide program
memory access bus fetches a 12-bit instruction in a
single cycle. A two-stage pipeline overlaps fetch and
execution of instructions. Consequently, all instructions
(33) execute in a single cycle (1µs @ 4MHz) except for
program branches.
The table below lists program memory (EPROM), data
memory (RAM), ROM memory, and non-volatile
(EEPROM) for each device.
EPROM
Program
ROM
Program
RAM
Data
PIC12C508
512 x 12
25
PIC12C509
1024 x 12
41
PIC12C508A
512 x 12
25
PIC12C509A
1024 x 12
41
PIC12CR509A
1024 x 12
The ALU is 8-bits wide and capable of addition,
subtraction, shift and logical operations. Unless
otherwise mentioned, arithmetic operations are two's
complement in nature. In two-operand instructions,
typically one operand is the W (working) register. The
other operand is either a file register or an immediate
constant. In single operand instructions, the operand is
either the W register or a file register.
The W register is an 8-bit working register used for
ALU operations. It is not an addressable register.
Depending on the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC),
and Zero (Z) bits in the STATUS register. The C and
DC bits operate as a borrow and digit borrow out bit,
respectively, in subtraction. See the SUBWF and ADDWF
instructions for examples.
A simplified block diagram is shown in Figure 3-1, with
the corresponding device pins described in Table 3-1.
Memory
Device
The PIC12C5XX device contains an 8-bit ALU and
working register. The ALU is a general purpose
arithmetic unit. It performs arithmetic and Boolean
functions between data in the working register and any
register file.
EEPROM
Data
41
PIC12CE518
512 x 12
25 x 8
16 x 8
PIC12CE519
1024 x 12
41 x 8
16 x 8
The PIC12C5XX can directly or indirectly address its
register files and data memory. All special function
registers including the program counter are mapped in
the data memory. The PIC12C5XX has a highly
orthogonal (symmetrical) instruction set that makes it
possible to carry out any operation on any register
using any addressing mode. This symmetrical nature
and lack of ‘special optimal situations’ make
programming with the PIC12C5XX simple yet efficient.
In addition, the learning curve is reduced significantly.
 1999 Microchip Technology Inc.
DS40139E-page 9
PIC12C5XX
PIC12C5XX BLOCK DIAGRAM
12
GP0
GP1
GP2/T0CKI
GP3/MCLR/VPP
GP4/OSC2
GP5/OSC1/CLKIN
RAM
25 x 8 or
41 x 8
File
Registers
STACK1
STACK2
12
RAM Addr
9
Addr MUX
Instruction reg
Direct Addr
5
5-7
Indirect
Addr
FSR reg
STATUS reg
8
3
OSC1/CLKIN
OSC2
Timing
Generation
Internal RC
OSC
Power-on
Reset
Watchdog
Timer
16 X 8
EEPROM
Data
Memory
PIC12CE5XX
Only
MUX
Device Reset
Timer
Instruction
Decode &
Control
GPIO
SDA
Program
Bus
8
Data Bus
Program Counter
ROM/EPROM
512 x 12 or
1024 x 12
Program
Memory
SCL
FIGURE 3-1:
ALU
8
W reg
Timer0
MCLR
VDD, VSS
DS40139E-page 10
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 3-1:
PIC12C5XX PINOUT DESCRIPTION
DIP
Pin #
SOIC
Pin #
I/O/P
Type
GP0
7
7
I/O
TTL/ST Bi-directional I/O port/ serial programming data. Can
be software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. This buffer is a
Schmitt Trigger input when used in serial programming
mode.
GP1
6
6
I/O
TTL/ST Bi-directional I/O port/ serial programming clock. Can
be software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. This buffer is a
Schmitt Trigger input when used in serial programming
mode.
Name
Buffer
Type
ST
Description
GP2/T0CKI
5
5
I/O
GP3/MCLR/VPP
4
4
I
Bi-directional I/O port. Can be configured as T0CKI.
GP4/OSC2
3
3
I/O
GP5/OSC1/CLKIN
2
2
I/O
VDD
1
1
P
—
Positive supply for logic and I/O pins
VSS
8
8
P
—
Ground reference for logic and I/O pins
TTL/ST Input port/master clear (reset) input/programming voltage input. When configured as MCLR, this pin is an
active low reset to the device. Voltage on MCLR/VPP
must not exceed VDD during normal device operation
or the device will enter programming mode. Can be
software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. Weak pull-up
always on if configured as MCLR. ST when in MCLR
mode.
TTL
Bi-directional I/O port/oscillator crystal output. Connections to crystal or resonator in crystal oscillator
mode (XT and LP modes only, GPIO in other modes).
TTL/ST Bidirectional IO port/oscillator crystal input/external
clock source input (GPIO in Internal RC mode only,
OSC1 in all other oscillator modes). TTL input when
GPIO, ST input in external RC oscillator mode.
Legend: I = input, O = output, I/O = input/output, P = power, — = not used, TTL = TTL input,
ST = Schmitt Trigger input
 1999 Microchip Technology Inc.
DS40139E-page 11
PIC12C5XX
3.1
Clocking Scheme/Instruction Cycle
3.2
The clock input (OSC1/CLKIN pin) is internally divided
by four to generate four non-overlapping quadrature
clocks namely Q1, Q2, Q3 and Q4. Internally, the
program counter is incremented every Q1, and the
instruction is fetched from program memory and
latched into instruction register in Q4. It is decoded
and executed during the following Q1 through Q4. The
clocks and instruction execution flow is shown in
Figure 3-2 and Example 3-1.
Instruction Flow/Pipelining
An Instruction Cycle consists of four Q cycles (Q1, Q2,
Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the program counter to change (e.g., GOTO)
then two cycles are required to complete the
instruction (Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is
latched into the Instruction Register (IR) in cycle Q1.
This instruction is then decoded and executed during
the Q2, Q3, and Q4 cycles. Data memory is read
during Q2 (operand read) and written during Q4
(destination write).
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
Q1
Q2
Q3
Q4
Q2
Q1
Q3
Q4
Q1
Q2
Q3
Q4
OSC1
Q1
Q2
Internal
phase
clock
Q3
Q4
PC
PC
PC+1
Fetch INST (PC)
Execute INST (PC-1)
EXAMPLE 3-1:
PC+2
Fetch INST (PC+1)
Execute INST (PC)
Fetch INST (PC+2)
Execute INST (PC+1)
INSTRUCTION PIPELINE FLOW
1. MOVLW 03H
2. MOVWF GPIO
3. CALL
SUB_1
4. BSF
GPIO, BIT1
Fetch 1
Execute 1
Fetch 2
Execute 2
Fetch 3
Execute 3
Fetch 4
Flush
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
DS40139E-page 12
 1999 Microchip Technology Inc.
PIC12C5XX
MEMORY ORGANIZATION
PIC12C5XX memory is organized into program memory and data memory. For devices with more than 512
bytes of program memory, a paging scheme is used.
Program memory pages are accessed using one STATUS register bit. For the PIC12C509, PIC12C509A,
PICCR509A and PIC12CE519 with a data memory
register file of more than 32 registers, a banking
scheme is used. Data memory banks are accessed
using the File Select Register (FSR).
4.1
FIGURE 4-1:
PROGRAM MEMORY MAP
AND STACK
PC<11:0>
12
CALL, RETLW
Stack Level 1
Stack Level 2
Reset Vector (note 1)
0000h
Program Memory Organization
The PIC12C5XX devices have a 12-bit Program
Counter (PC) capable of addressing a 2K x 12
program memory space.
Only the first 512 x 12 (0000h-01FFh) for the
PIC12C508, PIC12C508A and PIC12CE518 and 1K x
12 (0000h-03FFh) for the PIC12C509, PIC12C509A,
PIC12CR509A, and PIC12CE519 are physically
implemented. Refer to Figure 4-1. Accessing a
location above these boundaries will cause a wraparound within the first 512 x 12 space (PIC12C508,
PIC12C508A and PIC12CE518) or 1K x 12 space
(PIC12C509, PIC12C509A, PIC12CR509A and
PIC12CE519). The effective reset vector is at 000h,
(see Figure 4-1). Location 01FFh (PIC12C508,
PIC12C508A and PIC12CE518) or location 03FFh
(PIC12C509, PIC12C509A, PIC12CR509A and
PIC12CE519) contains the internal clock oscillator
calibration value. This value should never be
overwritten.
 1999 Microchip Technology Inc.
On-chip Program
Memory
User Memory
Space
4.0
512 Word
01FFh
0200h
On-chip Program
Memory
1024 Word
03FFh
0400h
7FFh
Note 1: Address 0000h becomes the
effective reset vector. Location
01FFh (PIC12C508, PIC12C508A,
PIC12CE518) or location 03FFh
(PIC12C509, PIC12C509A,
PIC12CR509A, PIC12CE519) contains the MOVLW XX INTERNAL RC
oscillator calibration value.
DS40139E-page 13
PIC12C5XX
4.2
Data Memory Organization
FIGURE 4-2:
Data memory is composed of registers, or bytes of
RAM. Therefore, data memory for a device is specified
by its register file. The register file is divided into two
functional groups: special function registers and
general purpose registers.
PIC12C508, PIC12C508A AND
PIC12CE518 REGISTER FILE
MAP
File Address
00h
INDF (1)
The special function registers include the TMR0
register, the Program Counter (PC), the Status
Register, the I/O registers (ports), and the File Select
Register (FSR). In addition, special purpose registers
are used to control the I/O port configuration and
prescaler options.
01h
TMR0
The general purpose registers are used for data and
control information under command of the instructions.
02h
PCL
03h
STATUS
04h
FSR
05h
OSCCAL
06h
GPIO
07h
For the PIC12C508, PIC12C508A and PIC12CE518,
the register file is composed of 7 special function
registers and 25 general purpose registers (Figure 42).
General
Purpose
Registers
For the PIC12C509, PIC12C509A, PIC12CR509A,
and PIC12CE519 the register file is composed of 7
special function registers, 25 general purpose
registers, and 16 general purpose registers that may
be addressed using a banking scheme (Figure 4-3).
4.2.1
1Fh
Note
GENERAL PURPOSE REGISTER FILE
1:
Not a physical register. See Section 4.8
The general purpose register file is accessed either
directly or indirectly through the file select register FSR
(Section 4.8).
FIGURE 4-3:
PIC12C509, PIC12C509A, PIC12CR509A AND PIC12CE519 REGISTER FILE MAP
FSR<6:5>
00
01
File Address
00h
INDF(1)
01h
TMR0
02h
PCL
03h
STATUS
04h
FSR
05h
OSCCAL
06h
GPIO
20h
Addresses map
back to
addresses
in Bank 0.
07h
General
Purpose
Registers
2Fh
0Fh
30h
10h
General
Purpose
Registers
3Fh
1Fh
Bank 0
Note 1:
DS40139E-page 14
General
Purpose
Registers
Bank 1
Not a physical register. See Section 4.8
 1999 Microchip Technology Inc.
PIC12C5XX
4.2.2
The special registers can be classified into two sets.
The special function registers associated with the
“core” functions are described in this section. Those
related to the operation of the peripheral features are
described in the section for each peripheral feature.
SPECIAL FUNCTION REGISTERS
The Special Function Registers (SFRs) are registers
used by the CPU and peripheral functions to control
the operation of the device (Table 4-1).
TABLE 4-1:
Address
SPECIAL FUNCTION REGISTER (SFR) SUMMARY
Name
Bit 7
Bit 6
—
—
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-On
Reset
Value on
All Other
Resets(2)
--11 1111
--11 1111
OPTION
Contains control bits to configure Timer0, Timer0/WDT
prescaler, wake-up on change, and weak pull-ups
1111 1111
1111 1111
00h
INDF
Uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
uuuu uuuu
01h
TMR0
8-bit real-time clock/counter
xxxx xxxx
uuuu uuuu
02h(1)
PCL
Low order 8 bits of PC
1111 1111
1111 1111
03h
STATUS
0001 1xxx
q00q quuu(3)
04h
FSR
(PIC12C508/
PIC12C508A/
PIC12C518)
Indirect data memory address pointer
111x xxxx
111u uuuu
04h
FSR
(PIC12C509/
PIC12C509A/
PIC12CR509A/
PIC12CE519) Indirect data memory address pointer
110x xxxx
11uu uuuu
05h
OSCCAL
(PIC12C508/
PIC12C509)
CAL3
CAL2
CAL1
CAL0
—
—
—
—
0111 ----
uuuu ----
05h
OSCCAL
(PIC12C508A/
PIC12C509A/
PIC12CE518/
PIC12CE519/
PIC12CR509A)
CAL5
CAL4
CAL3
CAL2
CAL1
CAL0
—
—
1000 00--
uuuu uu--
06h
GPIO
(PIC12C508/
PIC12C509/
PIC12C508A/
PIC12C509A/
PIC12CR509A)
—
—
GP5
GP4
GP3
GP2
GP1
GP0
--xx xxxx
--uu uuuu
06h
GPIO
(PIC12CE518/
PIC12CE519)
SCL
SDA
GP5
GP4
GP3
GP2
GP1
GP0
11xx xxxx
11uu uuuu
N/A
N/A
TRIS
GPWUF
—
PA0
TO
PD
Z
DC
C
Legend: Shaded boxes = unimplemented or unused, — = unimplemented, read as ’0’ (if applicable)
x = unknown, u = unchanged, q = see the tables in Section 8.7 for possible values.
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6
for an explanation of how to access these bits.
2: Other (non power-up) resets include external reset through MCLR, watchdog timer and wake-up on pin change reset.
3: If reset was due to wake-up on pin change then bit 7 = 1. All other resets will cause bit 7 = 0.
 1999 Microchip Technology Inc.
DS40139E-page 15
PIC12C5XX
4.3
STATUS Register
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu (where u = unchanged).
This register contains the arithmetic status of the ALU,
the RESET status, and the page preselect bit for
program memories larger than 512 words.
It is recommended, therefore, that only BCF, BSF and
MOVWF instructions be used to alter the STATUS
register because these instructions do not affect the Z,
DC or C bits from the STATUS register. For other
instructions, which do affect STATUS bits, see
Instruction Set Summary.
The STATUS register can be the destination for any
instruction, as with any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to
the device logic. Furthermore, the TO and PD bits are
not writable. Therefore, the result of an instruction with
the STATUS register as destination may be different
than intended.
FIGURE 4-4:
R/W-0
GPWUF
bit7
STATUS REGISTER (ADDRESS:03h)
R/W-0
—
R/W-0
PA0
R-1
TO
R-1
PD
R/W-x
Z
R/W-x
DC
6
5
4
3
2
1
R/W-x
C
bit0
R = Readable bit
W = Writable bit
- n = Value at POR reset
bit 7:
GPWUF: GPIO reset bit
1 = Reset due to wake-up from SLEEP on pin change
0 = After power up or other reset
bit 6:
Unimplemented
bit 5:
PA0: Program page preselect bits
1 = Page 1 (200h - 3FFh) - PIC12C509, PIC12C509A, PIC12CR509A and PIC12CE519
0 = Page 0 (000h - 1FFh) - PIC12C5XX
Each page is 512 bytes.
Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program
page preselect is not recommended since this may affect upward compatibility with future products.
bit 4:
TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3:
PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2:
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1:
DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions)
ADDWF
1 = A carry from the 4th low order bit of the result occurred
0 = A carry from the 4th low order bit of the result did not occur
SUBWF
1 = A borrow from the 4th low order bit of the result did not occur
0 = A borrow from the 4th low order bit of the result occurred
bit 0:
C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions)
ADDWF
SUBWF
1 = A carry occurred
1 = A borrow did not occur
0 = A carry did not occur
0 = A borrow occurred
DS40139E-page 16
RRF or RLF
Load bit with LSB or MSB, respectively
 1999 Microchip Technology Inc.
PIC12C5XX
4.4
OPTION Register
Note:
If TRIS bit is set to ‘0’, the wake-up on
change and pull-up functions are disabled
for that pin; i.e., note that TRIS overrides
OPTION control of GPPU and GPWU.
Note:
If the T0CS bit is set to ‘1’, GP2 is forced to
be an input even if TRIS GP2 = ‘0’.
The OPTION register is a 8-bit wide, write-only
register which contains various control bits to
configure the Timer0/WDT prescaler and Timer0.
By executing the OPTION instruction, the contents of
the W register will be transferred to the OPTION
register. A RESET sets the OPTION<7:0> bits.
FIGURE 4-5:
OPTION REGISTER
W-1
W-1
W-1
W-1
W-1
W-1
W-1
W-1
GPWU
GPPU
T0CS
T0SE
PSA
PS2
PS1
PS0
6
5
4
3
2
1
bit7
bit 7:
GPWU: Enable wake-up on pin change (GP0, GP1, GP3)
1 = Disabled
0 = Enabled
bit 6:
GPPU: Enable weak pull-ups (GP0, GP1, GP3)
1 = Disabled
0 = Enabled
bit 5:
T0CS: Timer0 clock source select bit
1 = Transition on T0CKI pin
0 = Transition on internal instruction cycle clock, Fosc/4
bit 4:
T0SE: Timer0 source edge select bit
1 = Increment on high to low transition on the T0CKI pin
0 = Increment on low to high transition on the T0CKI pin
bit 3:
PSA: Prescaler assignment bit
1 = Prescaler assigned to the WDT
0 = Prescaler assigned to Timer0
bit 2-0:
PS2:PS0: Prescaler rate select bits
Bit Value
Timer0 Rate
WDT Rate
000
001
010
011
100
101
110
111
1:2
1:4
1:8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1:1
1:2
1:4
1:8
1 : 16
1 : 32
1 : 64
1 : 128
 1999 Microchip Technology Inc.
bit0
W = Writable bit
U = Unimplemented bit
- n = Value at POR reset
Reference Table 4-1 for
other resets.
DS40139E-page 17
PIC12C5XX
4.5
OSCCAL Register
The Oscillator Calibration (OSCCAL) register is used to
calibrate the internal 4 MHz oscillator. It contains four to
six bits for calibration. Increasing the cal value
increases the frequency. See Section 7.2.5 for more
information on the internal oscillator.
FIGURE 4-6:
OSCCAL REGISTER (ADDRESS 05h) FOR PIC12C508 AND PIC12C509
R/W-0
R/W-1
R/W-1
R/W-1
R/W-0
R/W-0
U-0
U-0
CAL3
CAL2
CAL1
CAL0
—
—
—
—
bit7
bit0
R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7-4: CAL<3:0>: Calibration
bit 3-0: Unimplemented: Read as ’0’
FIGURE 4-7:
OSCCAL REGISTER (ADDRESS 05h) FOR PIC12C508A/C509A/CR509A/12CE518/
12CE519
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
CAL5
CAL4
CAL3
CAL2
CAL1
CAL0
—
—
bit7
bit0
R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7-2: CAL<5:0>: Calibration
bit 1-0: Unimplemented: Read as ’0’
DS40139E-page 18
 1999 Microchip Technology Inc.
PIC12C5XX
4.6
Program Counter
4.6.1
EFFECTS OF RESET
As a program instruction is executed, the Program
Counter (PC) will contain the address of the next
program instruction to be executed. The PC value is
increased by one every instruction cycle, unless an
instruction changes the PC.
The Program Counter is set upon a RESET, which
means that the PC addresses the last location in the
last page i.e., the oscillator calibration instruction. After
executing MOVLW XX, the PC will roll over to location
00h, and begin executing user code.
For a GOTO instruction, bits 8:0 of the PC are provided
by the GOTO instruction word. The PC Latch (PCL) is
mapped to PC<7:0>. Bit 5 of the STATUS register
provides page information to bit 9 of the PC (Figure 48).
The STATUS register page preselect bits are cleared
upon a RESET, which means that page 0 is preselected.
For a CALL instruction, or any instruction where the
PCL is the destination, bits 7:0 of the PC again are
provided by the instruction word. However, PC<8>
does not come from the instruction word, but is always
cleared (Figure 4-8).
Instructions where the PCL is the destination, or
Modify PCL instructions, include MOVWF PC, ADDWF
PC, and BSF PC,5.
Note:
Because PC<8> is cleared in the CALL
instruction, or any Modify PCL instruction,
all subroutine calls or computed jumps are
limited to the first 256 locations of any program memory page (512 words long).
FIGURE 4-8:
LOADING OF PC
BRANCH INSTRUCTIONS PIC12C5XX
GOTO Instruction
11 10
9
8
7
0
PC
Instruction Word
0
CALL or Modify PCL Instruction
8
7
PIC12C5XX devices have a 12-bit wide L.I.F.O.
hardware push/pop stack.
A CALL instruction will push the current value of stack
1 into stack 2 and then push the current program
counter value, incremented by one, into stack level 1. If
more than two sequential CALL’s are executed, only
the most recent two return addresses are stored.
A RETLW instruction will pop the contents of stack level
1 into the program counter and then copy stack level 2
contents into level 1. If more than two sequential
RETLW’s are executed, the stack will be filled with the
address previously stored in level 2. Note that the
W register will be loaded with the literal value specified
in the instruction. This is particularly useful for the
implementation of data look-up tables within the
program memory.
Note 2: There are no instructions mnemonics
called PUSH or POP. These are actions
that occur from the execution of the CALL
and RETLW instructions.
STATUS
9
Stack
Note 1: There are no STATUS bits to indicate
stack overflows or stack underflow conditions.
PA0
11 10
4.7
Upon any reset, the contents of the stack remain
unchanged, however the program counter (PCL) will
also be reset to 0.
PCL
7
Therefore, upon a RESET, a GOTO instruction will
automatically cause the program to jump to page 0
until the value of the page bits is altered.
0
PC
PCL
Instruction Word
Reset to ‘0’
PA0
7
0
STATUS
 1999 Microchip Technology Inc.
DS40139E-page 19
PIC12C5XX
4.8
Indirect Data Addressing; INDF and
FSR Registers
EXAMPLE 4-2:
The INDF register is not a physical register.
Addressing INDF actually addresses the register
whose address is contained in the FSR register (FSR
is a pointer). This is indirect addressing.
EXAMPLE 4-1:
INDIRECT ADDRESSING
0x10
FSR
INDF
FSR,F
FSR,4
NEXT
;initialize pointer
; to RAM
;clear INDF register
;inc pointer
;all done?
;NO, clear next
CONTINUE
•
•
•
•
Register file 07 contains the value 10h
Register file 08 contains the value 0Ah
Load the value 07 into the FSR register
A read of the INDF register will return the value
of 10h
• Increment the value of the FSR register by one
(FSR = 08)
• A read of the INDR register now will return the
value of 0Ah.
:
;YES, continue
The FSR is a 5-bit wide register. It is used in
conjunction with the INDF register to indirectly address
the data memory area.
The FSR<4:0> bits are used to select data memory
addresses 00h to 1Fh.
Reading INDF itself indirectly (FSR = 0) will produce
00h. Writing to the INDF register indirectly results in a
no-operation (although STATUS bits may be affected).
A simple program to clear RAM locations 10h-1Fh
using indirect addressing is shown in Example 4-2.
FIGURE 4-9:
NEXT
movlw
movwf
clrf
incf
btfsc
goto
HOW TO CLEAR RAM
USING INDIRECT
ADDRESSING
PIC12C508/PIC12C508A/PIC12CE518:
Does not
use banking. FSR<7:5> are unimplemented and read
as '1's.
PIC12C509/PIC12C509A/PIC12CR509A/
PIC12CE519: Uses FSR<5>. Selects between bank 0
and bank 1. FSR<7:6> is unimplemented, read as '1’ .
DIRECT/INDIRECT ADDRESSING
Direct Addressing
(FSR)
6 5
4
bank select
location select
Indirect Addressing
(opcode)
0
6
5
4
bank
00
(FSR)
0
location select
01
00h
Addresses
map back to
addresses
in Bank 0.
Data
Memory(1)
0Fh
10h
1Fh
Bank 0
3Fh
Bank 1(2)
Note 1: For register map detail see Section 4.2.
Note 2: PIC12C509, PIC12C509A, PIC12CR509A, PIC12CE519.
DS40139E-page 20
 1999 Microchip Technology Inc.
PIC12C5XX
5.0
I/O PORT
As with any other register, the I/O register can be
written and read under program control. However, read
instructions (e.g., MOVF GPIO,W) always read the I/O
pins independent of the pin’s input/output modes. On
RESET, all I/O ports are defined as input (inputs are at
hi-impedance) since the I/O control registers are all
set. See Section 7.0 for SCL and SDA description for
PIC12CE5XX.
5.1
GPIO
GPIO is an 8-bit I/O register. Only the low order 6 bits
are used (GP5:GP0). Bits 7 and 6 are unimplemented
and read as '0's. Please note that GP3 is an input only
pin. The configuration word can set several I/O’s to
alternate functions. When acting as alternate functions
the pins will read as ‘0’ during port read. Pins GP0,
GP1, and GP3 can be configured with weak pull-ups
and also with wake-up on change. The wake-up on
change and weak pull-up functions are not pin
selectable. If pin 4 is configured as MCLR, weak pullup is always on and wake-up on change for this pin is
not enabled.
5.2
TRIS Register
The output driver control register is loaded with the
contents of the W register by executing the TRIS f
instruction. A '1' from a TRIS register bit puts the
corresponding output driver in a hi-impedance mode.
A '0' puts the contents of the output data latch on the
selected pins, enabling the output buffer. The
exceptions are GP3 which is input only and GP2 which
may be controlled by the option register, see Figure 45.
Note:
A read of the ports reads the pins, not the
output data latches. That is, if an output
driver on a pin is enabled and driven high,
but the external system is holding it low, a
read of the port will indicate that the pin is
low.
The TRIS registers are “write-only” and are set (output
drivers disabled) upon RESET.
 1999 Microchip Technology Inc.
5.3
I/O Interfacing
The equivalent circuit for an I/O port pin is shown in
Figure 5-1. All port pins, except GP3 which is input
only, may be used for both input and output operations.
For input operations these ports are non-latching. Any
input must be present until read by an input instruction
(e.g., MOVF GPIO,W). The outputs are latched and
remain unchanged until the output latch is rewritten. To
use a port pin as output, the corresponding direction
control bit in TRIS must be cleared (= 0). For use as an
input, the corresponding TRIS bit must be set. Any I/O
pin (except GP3) can be programmed individually as
input or output.
FIGURE 5-1:
EQUIVALENT CIRCUIT
FOR A SINGLE I/O PIN
Data
Bus
D
WR
Port
W
Reg
Q
Data
Latch
CK
VDD
Q
P
N
D
Q
TRIS
Latch
TRIS ‘f’
CK
Reset
I/O
pin(1,3)
VSS
Q
(2)
RD Port
Note 1: I/O pins have protection diodes to VDD
and VSS.
Note 2: See Table 3-1 for buffer type.
Note 3: See Section 7.0 for SCL and SDA
description for PIC12CE5XX
DS40139E-page 21
PIC12C5XX
TABLE 5-1:
Address
N/A
N/A
SUMMARY OF PORT REGISTERS
Name
TRIS
OPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-On
Reset
Value on
All Other Resets
—
—
--11 1111
--11 1111
GPWU
GPPU
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
1111 1111
GPWUF
—
PAO
TO
PD
Z
DC
C
0001 1xxx
q00q quuu(1)
03H
STATUS
06h
GPIO
(PIC12C508/
PIC12C509/
PIC12C508A/
PIC12C509A/
PIC12CR509A)
—
—
GP5
GP4
GP3
GP2
GP1
GP0
--xx xxxx
--uu uuuu
06h
GPIO
(PIC12CE518/
PIC12CE519)
SCL
SDA
GP5
GP4
GP3
GP2
GP1
GP0
11xx xxxx
11uu uuuu
Legend: Shaded cells not used by Port Registers, read as ‘0’, — = unimplemented, read as '0', x = unknown, u = unchanged,
q = see tables in Section 8.7 for possible values.
Note 1: If reset was due to wake-up on change, then bit 7 = 1. All other resets will cause bit 7 = 0.
5.4
I/O Programming Considerations
5.4.1
BI-DIRECTIONAL I/O PORTS
Some instructions operate internally as read followed
by write operations. The BCF and BSF instructions, for
example, read the entire port into the CPU, execute
the bit operation and re-write the result. Caution must
be used when these instructions are applied to a port
where one or more pins are used as input/outputs. For
example, a BSF operation on bit5 of GPIO will cause
all eight bits of GPIO to be read into the CPU, bit5 to
be set and the GPIO value to be written to the output
latches. If another bit of GPIO is used as a bidirectional I/O pin (say bit0) and it is defined as an
input at this time, the input signal present on the pin
itself would be read into the CPU and rewritten to the
data latch of this particular pin, overwriting the
previous content. As long as the pin stays in the input
mode, no problem occurs. However, if bit0 is switched
into output mode later on, the content of the data latch
may now be unknown.
Example 5-1 shows the effect of two sequential readmodify-write instructions (e.g., BCF, BSF, etc.) on an
I/O port.
A pin actively outputting a high or a low should not be
driven from external devices at the same time in order
to change the level on this pin (“wired-or”, “wiredand”). The resulting high output currents may damage
the chip.
DS40139E-page 22
EXAMPLE 5-1:
READ-MODIFY-WRITE
INSTRUCTIONS ON AN
I/O PORT
;Initial GPIO Settings
; GPIO<5:3> Inputs
; GPIO<2:0> Outputs
;
;
GPIO latch GPIO pins
;
---------- ---------BCF
GPIO, 5
;--01 -ppp
--11 pppp
BCF
GPIO, 4
;--10 -ppp
--11 pppp
MOVLW 007h
;
TRIS GPIO
;--10 -ppp
--11 pppp
;
;Note that the user may have expected the pin
;values to be --00 pppp. The 2nd BCF caused
;GP5 to be latched as the pin value (High).
5.4.2
SUCCESSIVE OPERATIONS ON I/O
PORTS
The actual write to an I/O port happens at the end of
an instruction cycle, whereas for reading, the data
must be valid at the beginning of the instruction cycle
(Figure 5-2). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instructions should
allow the pin voltage to stabilize (load dependent)
before the next instruction, which causes that file to be
read into the CPU, is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 5-2:
SUCCESSIVE I/O OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
Instruction
fetched
MOVWF GPIO
PC + 1
MOVF GPIO,W
Q1 Q2 Q3 Q4
PC + 2
PC + 3
This example shows a write to GPIO followed
by a read from GPIO.
NOP
NOP
Data setup time = (0.25 TCY – TPD)
where: TCY = instruction cycle.
GP5:GP0
TPD = propagation delay
Port pin
written here
Instruction
executed
MOVWF GPIO
(Write to
GPIO)
 1999 Microchip Technology Inc.
Port pin
sampled here
MOVF GPIO,W
(Read
GPIO)
Therefore, at higher clock frequencies, a
write followed by a read may be problematic.
NOP
DS40139E-page 23
PIC12C5XX
NOTES:
DS40139E-page 24
 1999 Microchip Technology Inc.
PIC12C5XX
6.0
TIMER0 MODULE AND
TMR0 REGISTER
Counter mode is selected by setting the T0CS bit
(OPTION<5>). In this mode, Timer0 will increment
either on every rising or falling edge of pin T0CKI. The
T0SE bit (OPTION<4>) determines the source edge.
Clearing the T0SE bit selects the rising edge.
Restrictions on the external clock input are discussed
in detail in Section 6.1.
The Timer0 module has the following features:
• 8-bit timer/counter register, TMR0
- Readable and writable
• 8-bit software programmable prescaler
• Internal or external clock select
- Edge select for external clock
Figure 6-1 is a simplified block diagram of the Timer0
module.
Timer mode is selected by clearing the T0CS bit
(OPTION<5>). In timer mode, the Timer0 module will
increment every instruction cycle (without prescaler). If
TMR0 register is written, the increment is inhibited for
the following two instruction cycles (Figure 6-2 and
Figure 6-3). The user can work around this by writing
an adjusted value to the TMR0 register.
FIGURE 6-1:
The prescaler may be used by either the Timer0
module or the Watchdog Timer, but not both. The
prescaler assignment is controlled in software by the
control bit PSA (OPTION<3>). Clearing the PSA bit
will assign the prescaler to Timer0. The prescaler is
not readable or writable. When the prescaler is
assigned to the Timer0 module, prescale values of 1:2,
1:4,..., 1:256 are selectable. Section 6.2 details the
operation of the prescaler.
A summary of registers associated with the Timer0
module is found in Table 6-1.
TIMER0 BLOCK DIAGRAM
Data bus
GP2/T0CKI
Pin
FOSC/4
0
PSout
1
1
Programmable
Prescaler(2)
0
T0SE
8
Sync with
Internal
Clocks
TMR0 reg
PSout
(2 TCY delay) Sync
3
T0CS(1)
PS2, PS1, PS0(1)
PSA(1)
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register.
2: The prescaler is shared with the Watchdog Timer (Figure 6-5).
 1999 Microchip Technology Inc.
DS40139E-page 25
PIC12C5XX
FIGURE 6-2:
TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
PC-1
Instruction
Fetch
T0
Timer0
PC
PC+1
T0+1
T0+2
PC+4
PC+5
MOVF TMR0,W
NT0
Write TMR0
executed
Read TMR0
reads NT0
NT0+1
Read TMR0
reads NT0
PC+6
MOVF TMR0,W
NT0+2
Read TMR0
reads NT0 + 1
Read TMR0
reads NT0
Read TMR0
reads NT0 + 2
TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
PC-1
Instruction
Fetch
PC
PC+1
MOVWF TMR0
MOVF TMR0,W
PC+3
PC+4
PC+5
MOVF TMR0,W
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
PC+6
MOVF TMR0,W
NT0+1
NT0
Instruction
Execute
TABLE 6-1:
PC+2
MOVF TMR0,W MOVF TMR0,W
T0+1
T0
Timer0
Address
PC+3
MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Instruction
Executed
FIGURE 6-3:
PC+2
MOVWF TMR0
Read TMR0
reads NT0
Read TMR0
reads NT0
T0
Read TMR0
reads NT0 + 1
REGISTERS ASSOCIATED WITH TIMER0
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-On
Reset
Value on
All Other
Resets
01h
TMR0
Timer0 - 8-bit real-time clock/counter
xxxx xxxx
uuuu uuuu
N/A
OPTION
GPWU
GPPU
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
1111 1111
N/A
TRIS
—
—
GP5
GP4
GP3
GP2
GP1
GP0
--11 1111 --11 1111
Legend: Shaded cells not used by Timer0, - = unimplemented, x = unknown, u = unchanged,
DS40139E-page 26
 1999 Microchip Technology Inc.
PIC12C5XX
6.1
Using Timer0 with an External Clock
When a prescaler is used, the external clock input is
divided by the asynchronous ripple counter-type
prescaler so that the prescaler output is symmetrical.
For the external clock to meet the sampling
requirement, the ripple counter must be taken into
account. Therefore, it is necessary for T0CKI to have a
period of at least 4TOSC (and a small RC delay of
40 ns) divided by the prescaler value. The only
requirement on T0CKI high and low time is that they
do not violate the minimum pulse width requirement of
10 ns. Refer to parameters 40, 41 and 42 in the
electrical specification of the desired device.
When an external clock input is used for Timer0, it
must meet certain requirements. The external clock
requirement is due to internal phase clock (TOSC)
synchronization. Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
6.1.1
EXTERNAL CLOCK SYNCHRONIZATION
When no prescaler is used, the external clock input is
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks
(Figure 6-4). Therefore, it is necessary for T0CKI to be
high for at least 2TOSC (and a small RC delay of 20 ns)
and low for at least 2TOSC (and a small RC delay of
20 ns). Refer to the electrical specification of the
desired device.
6.1.2
TIMER0 INCREMENT DELAY
Since the prescaler output is synchronized with the
internal clocks, there is a small delay from the time the
external clock edge occurs to the time the Timer0
module is actually incremented. Figure 6-4 shows the
delay from the external clock edge to the timer
incrementing.
6.1.3
OPTION REGISTER EFFECT ON GP2 TRIS
If the option register is set to read TIMER0 from the pin,
the port is forced to an input regardless of the TRIS register setting.
FIGURE 6-4:
TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
External Clock Input or
Prescaler Output (2)
Q1 Q2 Q3 Q4
Small pulse
misses sampling
(1)
External Clock/Prescaler
Output After Sampling
(3)
Increment Timer0 (Q4)
Timer0
T0
T0 + 1
T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ± 4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.
 1999 Microchip Technology Inc.
DS40139E-page 27
PIC12C5XX
6.2
Prescaler
EXAMPLE 6-1:
An 8-bit counter is available as a prescaler for the
Timer0 module, or as a postscaler for the Watchdog
Timer (WDT), respectively (Section 8.6). For simplicity,
this counter is being referred to as “prescaler”
throughout this data sheet. Note that the prescaler
may be used by either the Timer0 module or the WDT,
but not both. Thus, a prescaler assignment for the
Timer0 module means that there is no prescaler for
the WDT, and vice-versa.
1.CLRWDT
2.CLRF
TMR0
3.MOVLW '00xx1111’b
4.OPTION
;Clear WDT
;Clear TMR0 & Prescaler
;These 3 lines (5, 6, 7)
; are required only if
; desired
5.CLRWDT
;PS<2:0> are 000 or 001
6.MOVLW '00xx1xxx’b ;Set Postscaler to
7.OPTION
; desired WDT rate
To change prescaler from the WDT to the Timer0
module, use the sequence shown in Example 6-2. This
sequence must be used even if the WDT is disabled. A
CLRWDT instruction should be executed before
switching the prescaler.
The PSA and PS2:PS0 bits (OPTION<3:0>)
determine prescaler assignment and prescale ratio.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g., CLRF 1,
MOVWF 1, BSF 1,x, etc.) will clear the prescaler.
When assigned to WDT, a CLRWDT instruction will
clear the prescaler along with the WDT. The prescaler
is neither readable nor writable. On a RESET, the
prescaler contains all '0's.
6.2.1
EXAMPLE 6-2:
CHANGING PRESCALER
(WDT→TIMER0)
CLRWDT
MOVLW
'xxxx0xxx'
SWITCHING PRESCALER ASSIGNMENT
;Clear WDT and
;prescaler
;Select TMR0, new
;prescale value and
;clock source
OPTION
The prescaler assignment is fully under software control
(i.e., it can be changed “on the fly” during program
execution). To avoid an unintended device RESET, the
following instruction sequence (Example 6-1) must be
executed when changing the prescaler assignment from
Timer0 to the WDT.
FIGURE 6-5:
CHANGING PRESCALER
(TIMER0→WDT)
BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
TCY ( = Fosc/4)
Data Bus
0
GP2/T0CKI
Pin
1
8
M
U
X
1
M
U
X
0
T0SE
T0CS
0
Watchdog
Timer
1
M
U
X
Sync
2
Cycles
TMR0 reg
PSA
8-bit Prescaler
8
8 - to - 1MUX
PS2:PS0
PSA
WDT Enable bit
1
0
MUX
PSA
WDT
Time-Out
Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.
DS40139E-page 28
 1999 Microchip Technology Inc.
PIC12C5XX
7.0
EEPROM PERIPHERAL
OPERATION
This section applies
PIC12CE519 only.
to
PIC12CE518
and
The PIC12CE518 and PIC12CE519 each have 16
bytes of EEPROM data memory. The EEPROM memory has an endurance of 1,000,000 erase/write cycles
and a data retention of greater than 40 years. The
EEPROM data memory supports a bi-directional 2-wire
bus and data transmission protocol. These two-wires
are serial data (SDA) and serial clock (SCL), that are
mapped to bit6 and bit7, respectively, of the GPIO register (SFR 06h). Unlike the GP0-GP5 that are connected to the I/O pins, SDA and SCL are only
connected to the internal EEPROM peripheral. For
most applications, all that is required is calls to the following functions:
; Byte_Write: Byte write routine
;
Inputs: EEPROM Address
EEADDR
;
EEPROM Data
EEDATA
;
Outputs:
Return 01 in W if OK, else
return 00 in W
;
; Read_Current: Read EEPROM at address
currently held by EE device.
;
Inputs: NONE
;
Outputs:
EEPROM Data
EEDATA
;
Return 01 in W if OK, else
return 00 in W
;
; Read_Random: Read EEPROM byte at supplied
address
;
Inputs: EEPROM Address
EEADDR
;
Outputs:
EEPROM Data
EEDATA
;
Return 01 in W if OK,
else return 00 in W
The code for these functions is available on our website
www.microchip.com. The code will be accessed by
either including the source code FL51XINC.ASM or by
linking FLASH5IX.ASM.
Namely, to avoid code overhead in modifying the TRIS
register, both SDA and SCL are always outputs. To
read data from the EEPROM peripheral requires outputting a ‘1’ on SDA placing it in high-Z state, where
only the internal 100K pull-up is active on the SDA line.
SDA:
Built-in 100K (typical) pull-up to VDD
Open-drain (pull-down only)
Always an output
Outputs a ‘1’ on reset
SCL:
Full CMOS output
Always an output
Outputs a ‘1’ on reset
The following example requires:
• Code Space: 77 words
• RAM Space: 5 bytes (4 are overlayable)
• Stack Levels:1 (The call to the function itself. The
functions do not call any lower level functions.)
• Timing:
- WRITE_BYTE takes 328 cycles
- READ_CURRENT takes 212 cycles
- READ_RANDOM takes 416 cycles.
• IO Pins: 0 (No external IO pins are used)
This code must reside in the lower half of a page. The
code achieves it’s small size without additional calls
through the use of a sequencing table. The table is a
list of procedures that must be called in order. The
table uses an ADDWF PCL,F instruction, effectively a
computed goto, to sequence to the next procedure.
However the ADDWF PCL,F instruction yields an 8 bit
address, forcing the code to reside in the first 256
addresses of a page.
It is very important to check the return codes when
using these calls, and retry the operation if unsuccessful. Unsuccessful return codes occur when the EE data
memory is busy with the previous write, which can take
up to 4 mS.
7.0.1
SERIAL DATA
SDA is a bi-directional pin used to transfer addresses
and data into and data out of the device.
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the START and STOP conditions.
The EEPROM interface is a 2-wire bus protocol consisting of data (SDA) and a clock (SCL). Although
these lines are mapped into the GPIO register, they are
not accessible as external pins; only to the internal
EEPROM peripheral. SDA and SCL operation is also
slightly different than GPO-GP5 as listed below.
 1999 Microchip Technology Inc.
DS40139E-page 29
PIC12C5XX
Figure 7-1: Block diagram of GPIO6 (SDA line)
VDD
reset
To 24L00 SDA
Pad
D
databus
write
GPIO
ck
EN
Q
Output Latch
Q
D
Schmitt Trigger
EN
ck
Input Latch
ltchpin
Read
GPIO
Figure 7-2: Block diagram of GPIO7 (SCL line)
VDD
To 24LC00 SCL
Pad
D
databus
write
GPIO
ck
Q
EN
Q
D
Schmitt Trigger
EN
ck
Read
GPIO
DS40139E-page 30
ltchpin
 1999 Microchip Technology Inc.
PIC12C5XX
7.0.2
SERIAL CLOCK
This SCL input is used to synchronize the data transfer
from and to the device.
7.1
BUS CHARACTERISTICS
The following bus protocol is to be used with the
EEPROM data memory.
• Data transfer may be initiated only when the bus
is not busy.
During data transfer, the data line must remain stable
whenever the clock line is HIGH. Changes in the data
line while the clock line is HIGH will be interpreted as a
START or STOP condition.
Accordingly, the following bus conditions have been
defined (Figure 7-3).
7.1.1
BUS NOT BUSY (A)
Both data and clock lines remain HIGH.
7.1.2
START DATA TRANSFER (B)
A HIGH to LOW transition of the SDA line while the
clock (SCL) is HIGH determines a START condition. All
commands must be preceded by a START condition.
7.1.3
STOP DATA TRANSFER (C)
A LOW to HIGH transition of the SDA line while the
clock (SCL) is HIGH determines a STOP condition. All
operations must be ended with a STOP condition.
 1999 Microchip Technology Inc.
7.1.4
DATA VALID (D)
The state of the data line represents valid data when,
after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal.
The data on the line must be changed during the LOW
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a START condition
and terminated with a STOP condition. The number of
the data bytes transferred between the START and
STOP conditions is determined by the master device
and is theoretically unlimited.
7.1.5
ACKNOWLEDGE
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this acknowledge bit.
Note:
Acknowledge bits are not generated if an
internal programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable LOW during the HIGH
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an acknowledge bit on the last
byte that has been clocked out of the slave. In this case,
the slave must leave the data line HIGH to enable the
master to generate the STOP condition (Figure 7-4).
DS40139E-page 31
PIC12C5XX
FIGURE 7-3:
SCL
(A)
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(C)
(D)
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
(C)
(A)
SDA
FIGURE 7-4:
STOP
CONDITION
DATA
ALLOWED
TO CHANGE
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
SCL
2
SDA
3
4
5
6
7
8
9
1
Device Addressing
After generating a START condition, the bus master
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of operation is to be performed. The slave address consists of
a 4-bit device code (1010) followed by three don’t care
bits.
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is
selected, and when set to a zero a write operation is
selected. (Figure 7-5). The bus is monitored for its corresponding slave address all the time. It generates an
acknowledge bit if the slave address was true and it is
not in a programming mode.
DS40139E-page 32
3
Data from transmitter
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
7.2
2
FIGURE 7-5:
CONTROL BYTE FORMAT
Read/Write Bit
Don’t Care
Bits
Device Select
Bits
S
1
0
1
0
X
X
X R/W ACK
Slave Address
Start Bit
Acknowledge Bit
 1999 Microchip Technology Inc.
PIC12C5XX
7.3
WRITE OPERATIONS
7.4
7.3.1
BYTE WRITE
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the stop condition for a write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can
be initiated immediately. This involves the master sending a start condition followed by the control byte for a
write command (R/W = 0). If the device is still busy with
the write cycle, then no ACK will be returned. If no ACK
is returned, then the start bit and control byte must be
re-sent. If the cycle is complete, then the device will
return the ACK and the master can then proceed with
the next read or write command. See Figure 7-6 for
flow diagram.
Following the start signal from the master, the device
code (4 bits), the don’t care bits (3 bits), and the R/W
bit (which is a logic low) are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will follow
after it has generated an acknowledge bit during the
ninth clock cycle. Therefore, the next byte transmitted
by the master is the word address and will be written
into the address pointer. Only the lower four address
bits are used by the device, and the upper four bits are
don’t cares. The address byte is acknowledgeable and
the master device will then transmit the data word to be
written into the addressed memory location. The memory acknowledges again and the master generates a
stop condition. This initiates the internal write cycle,
and during this time will not generate acknowledge signals (Figure 7-7). After a byte write command, the internal address counter will not be incremented and will
point to the same address location that was just written.
If a stop bit is transmitted to the device at any point in
the write command sequence before the entire
sequence is complete, then the command will abort
and no data will be written. If more than 8 data bits are
transmitted before the stop bit is sent, then the device
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a stop bit is sent before a
full eight data bits have been transmitted, then the write
command will abort and no data will be written. The
EEPROM memory employs a VCC threshold detector
circuit which disables the internal erase/write logic if the
VCC is below minimum VDD.
ACKNOWLEDGE POLLING
FIGURE 7-6:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Byte write operations must be preceded and immediately followed by a bus not busy bus cycle where both
SDA and SCL are held high.
Did Device
Acknowledge
(ACK = 0)?
NO
YES
Next
Operation
FIGURE 7-7:
BYTE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
CONTROL
BYTE
1
0
1
0
BUS ACTIVITY
X
X
WORD
ADDRESS
X
X
0
A
C
K
X
X
S
T
O
P
DATA
P
X
A
C
K
A
C
K
X = Don’t Care Bit
 1999 Microchip Technology Inc.
DS40139E-page 33
PIC12C5XX
7.5
READ OPERATIONS
device as part of a write operation. After the word
address is sent, the master generates a start condition
following the acknowledge. This terminates the write
operation, but not before the internal address pointer is
set. Then the master issues the control byte again but
with the R/W bit set to a one. It will then issue an
acknowledge and transmits the eight bit data word. The
master will not acknowledge the transfer but does generate a stop condition and the device discontinues
transmission (Figure 7-9). After this command, the
internal address counter will point to the address location following the one that was just read.
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read,
and sequential read.
7.5.1
CURRENT ADDRESS READ
It contains an address counter that maintains the
address of the last word accessed, internally incremented by one. Therefore, if the previous read access
was to address n, the next current address read operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the device issues an acknowledge and transmits the
eight bit data word. The master will not acknowledge
the transfer but does generate a stop condition and the
device discontinues transmission (Figure 7-8).
7.5.2
7.5.3
Sequential reads are initiated in the same way as a random read except that after the device transmits the first
data byte, the master issues an acknowledge as
opposed to a stop condition in a random read. This
directs the device to transmit the next sequentially
addressed 8-bit word (Figure 7-10).
RANDOM READ
To provide sequential reads, it contains an internal
address pointer which is incremented by one at the
completion of each read operation. This address
pointer allows the entire memory contents to be serially
read during one operation.
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
FIGURE 7-8:
SEQUENTIAL READ
CURRENT ADDRESS READ
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S 1 0 1 0 X XX 1
S
T
O
P
CONTROL
BYTE
P
A
C
K
BUS ACTIVITY
N
O
A
C
K
DATA
X = Don’t Care Bit
FIGURE 7-9:
RANDOM READ
BUS ACTIVITY
MASTER
S
T
A
R
T
CONTROL
BYTE
X X X X
S 1 0 1 0 X X X 0
SDA LINE
S
T
O
P
CONTROL
BYTE
P
S 1 0 1 0 X X X 1
A
C
K
A
C
K
BUS ACTIVITY
S
T
A
R
T
WORD
ADDRESS (n)
A
C
K
DATA (n)
N
O
A
C
K
X = Don’t Care Bit
FIGURE 7-10: SEQUENTIAL READ
BUS ACTIVITY
MASTER
CONTROL
BYTE
DATA n
DATA n + 1
DATA n + 2
S
T
O
P
DATA n + X
P
SDA LINE
BUS ACTIVITY
DS40139E-page 34
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
 1999 Microchip Technology Inc.
PIC12C5XX
8.0
SPECIAL FEATURES OF THE
CPU
The PIC12C5XX has a Watchdog Timer which can be
shut off only through configuration bit WDTE. It runs
off of its own RC oscillator for added reliability. If using
XT or LP selectable oscillator options, there is always
an 18 ms (nominal) delay provided by the Device
Reset Timer (DRT), intended to keep the chip in reset
until the crystal oscillator is stable. If using INTRC or
EXTRC there is an 18 ms delay only on VDD power-up.
With this timer on-chip, most applications need no
external reset circuitry.
What sets a microcontroller apart from other
processors are special circuits to deal with the needs
of real-time applications. The PIC12C5XX family of
microcontrollers has a host of such features intended
to maximize system reliability, minimize cost through
elimination of external components, provide power
saving operating modes and offer code protection.
These features are:
The SLEEP mode is designed to offer a very low
current power-down mode. The user can wake-up
from SLEEP through a change on input pins or
through a Watchdog Timer time-out. Several oscillator
options are also made available to allow the part to fit
the application, including an internal 4 MHz oscillator.
The EXTRC oscillator option saves system cost while
the LP crystal option saves power. A set of
configuration bits are used to select various options.
• Oscillator selection
• Reset
- Power-On Reset (POR)
- Device Reset Timer (DRT)
- Wake-up from SLEEP on pin change
• Watchdog Timer (WDT)
• SLEEP
• Code protection
• ID locations
• In-circuit Serial Programming
FIGURE 8-1:
8.1
Configuration Bits
The PIC12C5XX configuration word consists of 12
bits. Configuration bits can be programmed to select
various device configurations. Two bits are for the
selection of the oscillator type, one bit is the Watchdog
Timer enable bit, and one bit is the MCLR enable bit.
CONFIGURATION WORD FOR PIC12C5XX
—
—
—
—
—
—
—
MCLRE
CP
bit11
10
9
8
7
6
5
4
3
WDTE FOSC1 FOSC0
2
1
bit0
Register:
Address(1):
CONFIG
FFFh
bit 11-5: Unimplemented
bit 4:
MCLRE: MCLR enable bit.
1 = MCLR pin enabled
0 = MCLR tied to VDD, (Internally)
bit 3:
CP: Code protection bit.
1 = Code protection off
0 = Code protection on
bit 2:
WDTE: Watchdog timer enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0:
FOSC1:FOSC0: Oscillator selection bits
11 = EXTRC - external RC oscillator
10 = INTRC - internal RC oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Refer to the PIC12C5XX Programming Specifications to determine how to access the
configuration word. This register is not user addressable during device operation.
 1999 Microchip Technology Inc.
DS40139E-page 35
PIC12C5XX
8.2
Oscillator Configurations
8.2.1
OSCILLATOR TYPES
TABLE 8-1:
The PIC12C5XX can be operated in four different
oscillator modes. The user can program two
configuration bits (FOSC1:FOSC0) to select one of
these four modes:
•
•
•
•
LP:
XT:
INTRC:
EXTRC:
8.2.2
Low Power Crystal
Crystal/Resonator
Internal 4 MHz Oscillator
External Resistor/Capacitor
Osc
Type
CRYSTAL OPERATION (OR
CERAMIC RESONATOR) (XT
OR LP OSC
CONFIGURATION)
C1(1)
OSC1
Cap. Range
C1
Cap. Range
C2
XT
4.0 MHz
30 pF
30 pF
These values are for design guidance only. Since
each resonator has its own characteristics, the user
should consult the resonator manufacturer for
appropriate values of external components.
CRYSTAL OSCILLATOR / CERAMIC
RESONATORS
FIGURE 8-2:
Resonator
Freq
TABLE 8-2:
In XT or LP modes, a crystal or ceramic resonator is
connected to the GP5/OSC1/CLKIN and GP4/OSC2
pins to establish oscillation (Figure 8-2). The
PIC12C5XX oscillator design requires the use of a
parallel cut crystal. Use of a series cut crystal may give
a frequency out of the crystal manufacturers
specifications. When in XT or LP modes, the device
can have an external clock source drive the GP5/
OSC1/CLKIN pin (Figure 8-3).
CAPACITOR SELECTION
FOR CERAMIC RESONATORS
- PIC12C5XX
Osc
Type
CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR PIC12C5XX
Resonator
Freq
Cap.Range
C1
Cap. Range
C2
32 kHz(1)
15 pF
15 pF
200 kHz
47-68 pF
47-68 pF
1 MHz
15 pF
15 pF
4 MHz
15 pF
15 pF
Note 1: For VDD > 4.5V, C1 = C2 ≈ 30 pF is
recommended.
These values are for design guidance only. Rs may
be required to avoid overdriving crystals with low
drive level specification. Since each crystal has its
own characteristics, the user should consult the crystal manufacturer for appropriate values of external
components.
LP
XT
PIC12C5XX
SLEEP
XTAL
(2)
RF(3)
OSC2
To internal
logic
RS
C2(1)
Note 1: See Capacitor Selection tables for
recommended values of C1 and C2.
2: A series resistor (RS) may be required for
AT strip cut crystals.
3: RF approximate value = 10 MΩ.
FIGURE 8-3:
EXTERNAL CLOCK INPUT
OPERATION (XT OR LP OSC
CONFIGURATION)
OSC1
PIC12C5XX
Clock from
ext. system
Open
DS40139E-page 36
OSC2
 1999 Microchip Technology Inc.
PIC12C5XX
8.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator or a simple oscillator
circuit with TTL gates can be used as an external
crystal oscillator circuit. Prepackaged oscillators
provide a wide operating range and better stability. A
well-designed crystal oscillator will provide good
performance with TTL gates. Two types of crystal
oscillator circuits can be used: one with parallel
resonance, or one with series resonance.
Figure 8-4 shows implementation of a parallel
resonant oscillator circuit. The circuit is designed to
use the fundamental frequency of the crystal. The
74AS04 inverter performs the 180-degree phase shift
that a parallel oscillator requires. The 4.7 kΩ resistor
provides the negative feedback for stability. The 10 kΩ
potentiometers bias the 74AS04 in the linear region.
This circuit could be used for external oscillator
designs.
FIGURE 8-4:
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
+5V
To Other
Devices
10k
74AS04
4.7k
74AS04
PIC12C5XX
CLKIN
10k
XTAL
10k
20 pF
20 pF
Figure 8-5 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator
circuit. The 330 Ω resistors provide the negative
feedback to bias the inverters in their linear region.
FIGURE 8-5:
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
330
To Other
Devices
PIC12C5XX
330
74AS04
74AS04
74AS04
8.2.4
EXTERNAL RC OSCILLATOR
For timing insensitive applications, the RC device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (Rext) and capacitor (Cext) values, and the
operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
process parameter variation. Furthermore, the
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low Cext values. The user also needs to
take into account variation due to tolerance of external
R and C components used.
Figure 8-6 shows how the R/C combination is
connected to the PIC12C5XX. For Rext values below
2.2 kΩ, the oscillator operation may become unstable,
or stop completely. For very high Rext values
(e.g., 1 MΩ) the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend keeping
Rext between 3 kΩ and 100 kΩ.
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or
package lead frame capacitance.
The Electrical Specifications sections show RC
frequency variation from part to part due to normal
process variation. The variation is larger for larger R
(since leakage current variation will affect RC
frequency more for large R) and for smaller C (since
variation of input capacitance will affect RC frequency
more).
Also, see the Electrical Specifications sections for
variation of oscillator frequency due to VDD for given
Rext/Cext values as well as frequency variation due to
operating temperature for given R, C, and VDD values.
FIGURE 8-6:
EXTERNAL RC OSCILLATOR
MODE
VDD
Rext
OSC1
Cext
Internal
clock
N
PIC12C5XX
VSS
CLKIN
0.1 µF
XTAL
 1999 Microchip Technology Inc.
DS40139E-page 37
PIC12C5XX
8.2.5
INTERNAL 4 MHz RC OSCILLATOR
The internal RC oscillator provides a fixed 4 MHz (nominal) system clock at VDD = 5V and 25°C, see “Electrical Specifications” section for information on variation
over voltage and temperature.
In addition, a calibration instruction is programmed into
the top of memory which contains the calibration value
for the internal RC oscillator. This location is never code
protected regardless of the code protect settings. This
value is programmed as a MOVLW XX instruction where
XX is the calibration value, and is placed at the reset
vector. This will load the W register with the calibration
value upon reset and the PC will then roll over to the
users program at address 0x000. The user then has the
option of writing the value to the OSCCAL Register
(05h) or ignoring it.
Some registers are not reset in any way; they are
unknown on POR and unchanged in any other reset.
Most other registers are reset to “reset state” on poweron reset (POR), MCLR, WDT or wake-up on pin
change reset during normal operation. They are not
affected by a WDT reset during SLEEP or MCLR reset
during SLEEP, since these resets are viewed as
resumption of normal operation. The exceptions to this
are TO, PD, and GPWUF bits. They are set or cleared
differently in different reset situations. These bits are
used in software to determine the nature of reset. See
Table 8-3 for a full description of reset states of all
registers.
OSCCAL, when written to with the calibration value, will
“trim” the internal oscillator to remove process variation
from the oscillator frequency. .
Note:
Please note that erasing the device will
also erase the pre-programmed internal
calibration value for the internal oscillator.
The calibration value must be read prior to
erasing the part. so it can be reprogrammed correctly later.
For the PIC12C508A, PIC12C509A, PIC12CE518,
PIC12CE519, and PIC12CR509A, bits <7:2>, CAL5CAL0 are used for calibration. Adjusting CAL5-0 from
000000 to 111111 yields a higher clock speed. Note
that bits 1 and 0 of OSCCAL are unimplemented and
should be written as 0 when modifying OSCCAL for
compatibility with future devices.
For the PIC12C508 and PIC12C509, the upper 4 bits of
the register are used. Writing a larger value in this location yields a higher clock speed.
8.3
RESET
The device differentiates between various kinds of
reset:
a) Power on reset (POR)
b) MCLR reset during normal operation
c) MCLR reset during SLEEP
d) WDT time-out reset during normal operation
e) WDT time-out reset during SLEEP
f) Wake-up from SLEEP on pin change
DS40139E-page 38
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 8-3:
RESET CONDITIONS FOR REGISTERS
Address
Power-on Reset
MCLR Reset
WDT time-out
Wake-up on Pin Change
W (PIC12C508/509)
—
qqqq xxxx (1)
qqqq uuuu (1)
W (PIC12C508A/509A/
PIC12CE518/519/
PIC12CE509A)
—
qqqq qqxx (1)
qqqq qquu (1)
INDF
00h
xxxx xxxx
uuuu uuuu
TMR0
01h
xxxx xxxx
uuuu uuuu
PC
02h
1111 1111
STATUS
03h
0001 1xxx
1111 1111
q00q quuu (2,3)
FSR (PIC12C508/
PIC12C508A/
PIC12CE518)
04h
111x xxxx
111u uuuu
FSR (PIC12C509/
PIC12C509A/
PIC12CE519/
PIC12CR509A)
04h
110x xxxx
11uu uuuu
OSCCAL
(PIC12C508/509)
05h
0111 ----
uuuu ----
OSCCAL
(PIC12C508A/509A/
PIC12CE518/512/
PIC12CR509A)
05h
1000 00--
uuuu uu--
GPIO
(PIC12C508/PIC12C509/
PIC12C508A/
PIC12C509A/
PIC12CR509A)
06h
--xx xxxx
--uu uuuu
GPIO
(PIC12CE518/
PIC12CE519)
06h
Register
OPTION
TRIS
Legend:
Note 1:
Note 2:
Note 3:
11xx xxxx
11uu uuuu
—
1111 1111
1111 1111
—
--11 1111
--11 1111
u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory.
See Table 8-7 for reset value for specific conditions
If reset was due to wake-up on pin change, then bit 7 = 1. All other resets will cause bit 7 = 0.
TABLE 8-4:
RESET CONDITION FOR SPECIAL REGISTERS
STATUS Addr: 03h
PCL Addr: 02h
Power on reset
0001 1xxx
1111 1111
MCLR reset during normal operation
000u uuuu
1111 1111
MCLR reset during SLEEP
0001 0uuu
1111 1111
WDT reset during SLEEP
0000 0uuu
1111 1111
WDT reset normal operation
0000 uuuu
1111 1111
Wake-up from SLEEP on pin change
1001 0uuu
1111 1111
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’.
 1999 Microchip Technology Inc.
DS40139E-page 39
PIC12C5XX
8.3.1
MCLR ENABLE
This configuration bit when unprogrammed (left in the
‘1’ state) enables the external MCLR function. When
programmed, the MCLR function is tied to the internal
VDD, and the pin is assigned to be a GPIO. See
Figure 8-7. When pin GP3/MCLR/VPP is configured as
MCLR, the internal pull-up is always on.
FIGURE 8-7:
MCLR SELECT
MCLRE
WEAK
PULL-UP
GP3/MCLR/V PP
8.4
INTERNAL MCLR
Power-On Reset (POR)
The PIC12C5XX family incorporates on-chip PowerOn Reset (POR) circuitry which provides an internal
chip reset for most power-up situations.
The on-chip POR circuit holds the chip in reset until
VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program
the GP3/MCLR/VPP pin as MCLR and tie through a
resistor to VDD or program the pin as GP3. An internal
weak pull-up resistor is implemented using a transistor.
Refer to Table 11-1 for the pull-up resistor ranges. This
will eliminate external RC components usually needed
to create a Power-on Reset. A maximum rise time for
VDD is specified. See Electrical Specifications for
details.
The Power-On Reset circuit and the Device Reset
Timer (Section 8.5) circuit are closely related. On
power-up, the reset latch is set and the DRT is reset.
The DRT timer begins counting once it detects MCLR
to be high. After the time-out period, which is typically
18 ms, it will reset the reset latch and thus end the onchip reset signal.
A power-up example where MCLR is held low is
shown in Figure 8-9. VDD is allowed to rise and
stabilize before bringing MCLR high. The chip will
actually come out of reset TDRT msec after MCLR
goes high.
In Figure 8-10, the on-chip Power-On Reset feature is
being used (MCLR and VDD are tied together or the
pin is programmed to be GP3.). The VDD is stable
before the start-up timer times out and there is no
problem in getting a proper reset. However, Figure 811 depicts a problem situation where VDD rises too
slowly. The time between when the DRT senses that
MCLR is high and when MCLR (and VDD) actually
reach their full value, is too long. In this situation, when
the start-up timer times out, VDD has not reached the
VDD (min) value and the chip is, therefore, not
guaranteed to function correctly. For such situations,
we recommend that external RC circuits be used to
achieve longer POR delay times (Figure 8-10).
Note:
When the device starts normal operation
(exits the reset condition), device operating
parameters (voltage, frequency, temperature, etc.) must be meet to ensure operation. If these conditions are not met, the
device must be held in reset until the operating conditions are met.
For additional information refer to Application Notes
“Power-Up Considerations” - AN522 and “Power-up
Trouble Shooting” - AN607.
When the device starts normal operation (exits the
reset condition), device operating parameters (voltage,
frequency, temperature, ...) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating parameters are
met.
A simplified block diagram of the on-chip Power-On
Reset circuit is shown in Figure 8-8.
DS40139E-page 40
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 8-8:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up
Detect
POR (Power-On Reset)
VDD
Pin Change
Wake-up on
pin change
SLEEP
GP3/MCLR/VPP
WDT Time-out
MCLRE
RESET
8-bit Asynch
On-Chip
DRT OSC
S
Q
R
Q
Ripple Counter
(Start-Up Timer)
CHIP RESET
FIGURE 8-9:
TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW)
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 8-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
 1999 Microchip Technology Inc.
DS40139E-page 41
PIC12C5XX
FIGURE 8-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In
this example, the chip will reset properly if, and only if, V1 ≥ VDD min.
8.5
Device Reset Timer (DRT)
In the PIC12C5XX, DRT runs from RESET and varies
based on oscillator selection (see Table 8-5.)
The DRT operates on an internal RC oscillator. The
processor is kept in RESET as long as the DRT is
active. The DRT delay allows VDD to rise above VDD
min., and for the oscillator to stabilize.
Oscillator circuits based on crystals or ceramic
resonators require a certain time after power-up to
establish a stable oscillation. The on-chip DRT keeps
the device in a RESET condition for approximately 18
ms after MCLR has reached a logic high (VIHMCLR)
level. Thus, programming GP3/MCLR/VPP as MCLR
and using an external RC network connected to the
MCLR input is not required in most cases, allowing for
savings in cost-sensitive and/or space restricted
applications, as well as allowing the use of the GP3/
MCLR/VPP pin as a general purpose input.
The Device Reset time delay will vary from chip to chip
due to VDD, temperature, and process variation. See
AC parameters for details.
The DRT will also be triggered upon a Watchdog
Timer time-out. This is particularly important for
applications using the WDT to wake from SLEEP
mode automatically.
DS40139E-page 42
8.6
Watchdog Timer (WDT)
The Watchdog Timer (WDT) is a free running on-chip
RC oscillator which does not require any external
components. This RC oscillator is separate from the
external RC oscillator of the GP5/OSC1/CLKIN pin
and the internal 4 MHz oscillator. That means that the
WDT will run even if the main processor clock has
been stopped, for example, by execution of a SLEEP
instruction. During normal operation or SLEEP, a WDT
reset or wake-up reset generates a device RESET.
The TO bit (STATUS<4>) will be cleared upon a
Watchdog Timer reset.
The WDT can be permanently disabled by
programming the configuration bit WDTE as a ’0’
(Section 8.1). Refer to the PIC12C5XX Programming
Specifications to determine how to access the
configuration word.
TABLE 8-5:
Oscillator
Configuration
DRT (DEVICE RESET TIMER
PERIOD)
POR Reset
Subsequent
Resets
IntRC &
ExtRC
18 ms (typical)
300 µs (typical)
XT & LP
18 ms (typical)
18 ms (typical)
 1999 Microchip Technology Inc.
PIC12C5XX
8.6.1
WDT PERIOD
8.6.2
The WDT has a nominal time-out period of 18 ms,
(with no prescaler). If a longer time-out period is
desired, a prescaler with a division ratio of up to 1:128
can be assigned to the WDT (under software control)
by writing to the OPTION register. Thus, a time-out
period of a nominal 2.3 seconds can be realized.
These periods vary with temperature, VDD and part-topart process variations (see DC specs).
WDT PROGRAMMING CONSIDERATIONS
The CLRWDT instruction clears the WDT and the
postscaler, if assigned to the WDT, and prevents it
from timing out and generating a device RESET.
The SLEEP instruction resets the WDT and the
postscaler, if assigned to the WDT. This gives the
maximum SLEEP time before a WDT wake-up reset.
Under worst case conditions (VDD = Min., Temperature
= Max., max. WDT prescaler), it may take several
seconds before a WDT time-out occurs.
FIGURE 8-12: WATCHDOG TIMER BLOCK DIAGRAM
From Timer0 Clock Source
(Figure 8-5)
0
1
Watchdog
Timer
M
Postscaler
Postscaler
U
X
8 - to - 1 MUX
PS2:PS0
PSA
WDT Enable
Configuration Bit
To Timer0 (Figure 8-4)
1
0
PSA
MUX
Note: T0CS, T0SE, PSA, PS2:PS0
are bits in the OPTION register.
WDT
Time-out
TABLE 8-6:
Address
N/A
SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Name
OPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-On
Reset
GPWU
GPPU
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
Value on
All Other
Resets
1111 1111
Legend: Shaded boxes = Not used by Watchdog Timer, — = unimplemented, read as ’0’, u = unchanged
 1999 Microchip Technology Inc.
DS40139E-page 43
PIC12C5XX
8.7
Time-Out Sequence, Power Down,
and Wake-up from SLEEP Status Bits
(TO/PD/GPWUF)
FIGURE 8-14: BROWN-OUT PROTECTION
CIRCUIT 2
VDD
The TO, PD, and GPWUF bits in the STATUS register
can be tested to determine if a RESET condition has
been caused by a power-up condition, a MCLR or
Watchdog Timer (WDT) reset.
R1
TABLE 8-7:
R2
TO
PD
0
0
0
VDD
Q1
MCLR
TO/PD/GPWUF STATUS
AFTER RESET
GPWUF
40k* PIC12C5XX
RESET caused by
WDT wake-up from
SLEEP
0
0
u WDT time-out (not from
SLEEP)
0
1
0 MCLR wake-up from
SLEEP
0
1
1 Power-up
0
u
u MCLR not during SLEEP
1
1
0 Wake-up from SLEEP on
pin change
Legend: u = unchanged
Note 1: The TO, PD, and GPWUF bits maintain
their status (u) until a reset occurs. A lowpulse on the MCLR input does not change
the TO, PD, and GPWUF status bits.
8.8
VDD
Reset on Brown-Out
This brown-out circuit is less expensive, although
less accurate. Transistor Q1 turns off when VDD
is below a certain level such that:
VDD •
To reset PIC12C5XX devices when a brown-out
occurs, external brown-out protection circuits may be
built, as shown in Figure 8-13 , Figure 8-14 and
Figure 8-15
FIGURE 8-13: BROWN-OUT PROTECTION
CIRCUIT 1
VDD
= 0.7V
*Refer to Figure 8-7 and Table 11-1 for internal
weak pull-up on MCLR.
FIGURE 8-15: BROWN-OUT PROTECTION
CIRCUIT 3
VDD
MCP809
A brown-out is a condition where device power (VDD)
dips below its minimum value, but not to zero, and then
recovers. The device should be reset in the event of a
brown-out.
R1
R1 + R2
Vss
bypass
capacitor
VDD
VDD
RST
MCLR
PIC12C5XX
This brown-out protection circuit employs
Microchip Technology’s MCP809 microcontroller
supervisor. The MCP8XX and MCP1XX family of
supervisors provide push-pull and open collector
outputs with both high and low active reset pins.
There are 7 different trip point selections to
accomodate 5V and 3V systems.
VDD
VDD
33k
10k
Q1
MCLR
40k* PIC12C5XX
This circuit will activate reset when VDD goes below
Vz + 0.7V (where Vz = Zener voltage).
*Refer to Figure 8-7 and Table 11-1 for internal
weak pull-up on MCLR.
DS40139E-page 44
 1999 Microchip Technology Inc.
PIC12C5XX
8.9
Power-Down Mode (SLEEP)
A device may be powered down (SLEEP) and later
powered up (Wake-up from SLEEP).
8.9.1
SLEEP
The Power-Down mode is entered by executing a
SLEEP instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the TO bit (STATUS<4>) is set, the PD
bit (STATUS<3>) is cleared and the oscillator driver is
turned off. The I/O ports maintain the status they had
before the SLEEP instruction was executed (driving
high, driving low, or hi-impedance).
It should be noted that a RESET generated by a WDT
time-out does not drive the MCLR pin low.
For lowest current consumption while powered down,
the T0CKI input should be at VDD or VSS and the GP3/
MCLR/VPP pin must be at a logic high level (VIHMC) if
MCLR is enabled.
8.9.2
WAKE-UP FROM SLEEP
8.10
Program Verification/Code Protection
If the code protection bit has not been programmed,
the on-chip program memory can be read out for
verification purposes.
The first 64 locations can be read by the PIC12C5XX
regardless of the code protection bit setting.
The last memory location cannot be read if code protection is enabled on the PIC12C508/509.
The last memory location can be read regardless of the
code protection bit setting on the PIC12C508A/509A/
CR509A/CE518/CE519.
8.11
ID Locations
Four memory locations are designated as ID locations
where the user can store checksum or other codeidentification numbers. These locations are not
accessible during normal execution but are readable
and writable during program/verify.
Use only the lower 4 bits of the ID locations and
always program the upper 8 bits as ’0’s.
The device can wake-up from SLEEP through one of
the following events:
1.
2.
3.
An external reset input on GP3/MCLR/VPP pin,
when configured as MCLR.
A Watchdog Timer time-out reset (if WDT was
enabled).
A change on input pin GP0, GP1, or GP3/
MCLR/VPP when wake-up on change is
enabled.
These events cause a device reset. The TO, PD, and
GPWUF bits can be used to determine the cause of
device reset. The TO bit is cleared if a WDT time-out
occurred (and caused wake-up). The PD bit, which is
set on power-up, is cleared when SLEEP is invoked.
The GPWUF bit indicates a change in state while in
SLEEP at pins GP0, GP1, or GP3 (since the last time
there was a file or bit operation on GP port).
Caution: Right before entering SLEEP, read the
input pins. When in SLEEP, wake up
occurs when the values at the pins change
from the state they were in at the last
reading. If a wake-up on change occurs
and the pins are not read before
reentering SLEEP, a wake up will occur
immediately even if no pins change while
in SLEEP mode.
The WDT is cleared when the device wakes from
sleep, regardless of the wake-up source.
 1999 Microchip Technology Inc.
DS40139E-page 45
PIC12C5XX
8.12
In-Circuit Serial Programming
The PIC12C5XX microcontrollers with EPROM program memory can be serially programmed while in the
end application circuit. This is simply done with two
lines for clock and data, and three other lines for power,
ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed
devices, and then program the microcontroller just
before shipping the product. This also allows the most
recent firmware or a custom firmware to be programmed.
The device is placed into a program/verify mode by
holding the GP1 and GP0 pins low while raising the
MCLR (VPP) pin from VIL to VIHH (see programming
specification). GP1 becomes the programming clock
and GP0 becomes the programming data. Both GP1
and GP0 are Schmitt Trigger inputs in this mode.
After reset, a 6-bit command is then supplied to the
device. Depending on the command, 14-bits of program data are then supplied to or from the device,
depending if the command was a load or a read. For
complete details of serial programming, please refer to
the PIC12C5XX Programming Specifications.
FIGURE 8-16: TYPICAL IN-CIRCUIT SERIAL
PROGRAMMING
CONNECTION
External
Connector
Signals
To Normal
Connections
PIC12C5XX
+5V
VDD
0V
VSS
VPP
MCLR/VPP
CLK
GP1
Data I/O
GP0
VDD
To Normal
Connections
A typical in-circuit serial programming connection is
shown in Figure 8-16.
DS40139E-page 46
 1999 Microchip Technology Inc.
PIC12C5XX
9.0
INSTRUCTION SET SUMMARY
Each PIC12C5XX instruction is a 12-bit word divided
into an OPCODE, which specifies the instruction type,
and one or more operands which further specify the
operation of the instruction. The PIC12C5XX
instruction set summary in Table 9-2 groups the
instructions into byte-oriented, bit-oriented, and literal
and control operations. Table 9-1 shows the opcode
field descriptions.
For byte-oriented instructions, ’f’ represents a file
register designator and ’d’ represents a destination
designator. The file register designator is used to
specify which one of the 32 file registers is to be used
by the instruction.
The destination designator specifies where the result
of the operation is to be placed. If ’d’ is ’0’, the result is
placed in the W register. If ’d’ is ’1’, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, ’b’ represents a bit field
designator which selects the number of the bit affected
by the operation, while ’f’ represents the number of the
file in which the bit is located.
For literal and control operations, ’k’ represents an
8 or 9-bit constant or literal value.
TABLE 9-1:
OPCODE FIELD
DESCRIPTIONS
Field
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don’t care location (= 0 or 1)
The assembler will generate code with x = 0. It is
the recommended form of use for compatibility
with all Microchip software tools.
d
Destination select;
d = 0 (store result in W)
d = 1 (store result in file register ’f’)
Default is d = 1
label
Label name
TOS
Top of Stack
PC
Program Counter
WDT
Watchdog Timer Counter
TO
Time-Out bit
PD
Power-Down bit
[ ]
Options
Contents
→
Assigned to
<>
Register bit field
italics
0xhhh
where ’h’ signifies a hexadecimal digit.
FIGURE 9-1:
GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file register operations
11
6
OPCODE
5
d
4
0
f (FILE #)
d = 0 for destination W
d = 1 for destination f
f = 5-bit file register address
Bit-oriented file register operations
11
OPCODE
8 7
5 4
b (BIT #)
f (FILE #)
0
b = 3-bit bit address
f = 5-bit file register address
Literal and control operations (except GOTO)
11
8
7
OPCODE
0
k (literal)
k = 8-bit immediate value
Literal and control operations - GOTO instruction
11
9
8
OPCODE
0
k (literal)
k = 9-bit immediate value
Destination, either the W register or the specified
register file location
( )
∈
Figure 9-1 shows the three general formats that the
instructions can have. All examples in the figure use the
following format to represent a hexadecimal number:
Description
f
dest
All instructions are executed within a single instruction
cycle, unless a conditional test is true or the program
counter is changed as a result of an instruction. In this
case, the execution takes two instruction cycles. One
instruction cycle consists of four oscillator periods.
Thus, for an oscillator frequency of 4 MHz, the normal
instruction execution time is 1 µs. If a conditional test is
true or the program counter is changed as a result of
an instruction, the instruction execution time is 2 µs.
In the set of
User defined term (font is courier)
 1999 Microchip Technology Inc.
DS40139E-page 47
PIC12C5XX
TABLE 9-2:
INSTRUCTION SET SUMMARY
Mnemonic,
Operands
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f,d
f,d
f
–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
12-Bit Opcode
Description
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate left f through Carry
Rotate right f through Carry
Subtract W from f
Swap f
Exclusive OR W with f
LSb
Status
Affected Notes
Cycles
MSb
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
0001
0001
0000
0000
0010
0000
0010
0010
0011
0001
0010
0000
0000
0011
0011
0000
0011
0001
11df
01df
011f
0100
01df
11df
11df
10df
11df
00df
00df
001f
0000
01df
00df
10df
10df
10df
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C,DC,Z
Z
Z
Z
Z
Z
None
Z
None
Z
Z
None
None
C
C
C,DC,Z
None
Z
1,2,4
2,4
4
1
1
1 (2)
1 (2)
0100
0101
0110
0111
bbbf
bbbf
bbbf
bbbf
ffff
ffff
ffff
ffff
None
None
None
None
2,4
2,4
1
2
1
2
1
1
1
2
1
1
1
1110
1001
0000
101k
1101
1100
0000
1000
0000
0000
1111
kkkk
kkkk
0000
kkkk
kkkk
kkkk
0000
kkkk
0000
0000
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
0010
kkkk
0011
0fff
kkkk
Z
None
TO, PD
None
Z
None
None
None
TO, PD
None
Z
2,4
2,4
2,4
2,4
2,4
2,4
1,4
2,4
2,4
1,2,4
2,4
2,4
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
LITERAL AND CONTROL OPERATIONS
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
OPTION
RETLW
SLEEP
TRIS
XORLW
k
k
k
k
k
k
–
k
–
f
k
AND literal with W
Call subroutine
Clear Watchdog Timer
Unconditional branch
Inclusive OR Literal with W
Move Literal to W
Load OPTION register
Return, place Literal in W
Go into standby mode
Load TRIS register
Exclusive OR Literal to W
1
3
Note 1: The 9th bit of the program counter will be forced to a ’0’ by any instruction that writes to the PC except for GOTO.
(Section 4.6)
2: When an I/O register is modified as a function of itself (e.g. MOVF GPIO, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is ’1’ for a pin configured as input and is driven
low by an external device, the data will be written back with a ’0’.
3: The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tristate latches of
GPIO. A ’1’ forces the pin to a hi-impedance state and disables the output buffers.
4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
(if assigned to TMR0).
DS40139E-page 48
 1999 Microchip Technology Inc.
PIC12C5XX
ADDWF
Add W and f
Syntax:
[ label ] ADDWF
Operands:
Operation:
ANDWF
[ label ] ANDWF
0 ≤ f ≤ 31
d ∈ [0,1]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
(W) + (f) → (dest)
Operation:
(W) .AND. (f) → (dest)
Status Affected: C, DC, Z
Encoding:
0001
Description:
AND W with f
Syntax:
f,d
f,d
Status Affected: Z
11df
ffff
Encoding:
0001
01df
ffff
Add the contents of the W register and
register ’f’. If ’d’ is 0 the result is stored
in the W register. If ’d’ is ’1’ the result is
stored back in register ’f’.
Description:
The contents of the W register are
AND’ed with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
'1' the result is stored back in register 'f'.
Words:
1
Words:
1
Cycles:
1
Cycles:
1
Example:
ADDWF
Example:
ANDWF
FSR, 0
Before Instruction
W
=
FSR =
FSR,
0x17
0xC2
W =
FSR =
0x17
0xC2
After Instruction
After Instruction
W
=
FSR =
W
=
FSR =
0xD9
0xC2
ANDLW
And literal with W
Syntax:
[ label ] ANDLW
BCF
Operands:
0 ≤ k ≤ 255
Operation:
(W).AND. (k) → (W)
0x17
0x02
Bit Clear f
Syntax:
[ label ] BCF
Operands:
0 ≤ f ≤ 31
0≤b≤7
Status Affected: Z
Operation:
0 → (f<b>)
Encoding:
Status Affected: None
1110
Description:
kkkk
1
Cycles:
1
Example:
ANDLW
0x5F
Before Instruction
W
=
0xA3
After Instruction
W
k
kkkk
The contents of the W register are
AND’ed with the eight-bit literal 'k'. The
result is placed in the W register.
Words:
=
1
Before Instruction
Encoding:
0100
bbbf
f,b
ffff
Description:
Bit 'b' in register 'f' is cleared.
Words:
1
Cycles:
1
Example:
BCF
FLAG_REG,
7
Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47
0x03
 1999 Microchip Technology Inc.
DS40139E-page 49
PIC12C5XX
BSF
Bit Set f
Syntax:
[ label ] BSF
BTFSS
Operands:
Operation:
Bit Test f, Skip if Set
Syntax:
[ label ] BTFSS f,b
0 ≤ f ≤ 31
0≤b≤7
Operands:
0 ≤ f ≤ 31
0≤b<7
1 → (f<b>)
Operation:
skip if (f<b>) = 1
f,b
Status Affected: None
Encoding:
Status Affected: None
0101
bbbf
ffff
Description:
Bit ’b’ in register ’f’ is set.
Words:
1
Cycles:
1
Example:
BSF
FLAG_REG,
Encoding:
Description:
7
FLAG_REG = 0x0A
Words:
FLAG_REG = 0x8A
1(2)
Example:
HERE
FALSE
TRUE
Bit Test f, Skip if Clear
Syntax:
[ label ] BTFSC f,b
Operands:
0 ≤ f ≤ 31
0≤b≤7
Before Instruction
skip if (f<b>) = 0
After Instruction
Encoding:
Description:
bbbf
0110
•
•
PC
Status Affected: None
ffff
If bit ’b’ in register ’f’ is 0 then the next
instruction is skipped.
ffff
1
Cycles:
BTFSC
Operation:
bbbf
If bit ’b’ is ’1’, then the next instruction
fetched during the current instruction
execution, is discarded and an NOP is
executed instead, making this a 2 cycle
instruction.
Before Instruction
After Instruction
0111
If bit ’b’ in register ’f’ is ’1’ then the next
instruction is skipped.
If FLAG<1>
PC
if FLAG<1>
PC
BTFSS
GOTO
•
FLAG,1
PROCESS_CODE
=
address (HERE)
=
=
=
=
0,
address (FALSE);
1,
address (TRUE)
If bit ’b’ is 0 then the next instruction
fetched during the current instruction
execution is discarded, and an NOP is
executed instead, making this a 2 cycle
instruction.
Words:
1
Cycles:
1(2)
Example:
HERE
FALSE
TRUE
BTFSC
GOTO
FLAG,1
PROCESS_CODE
•
•
•
Before Instruction
PC
=
address (HERE)
=
=
=
=
0,
address (TRUE);
1,
address(FALSE)
After Instruction
if FLAG<1>
PC
if FLAG<1>
PC
DS40139E-page 50
 1999 Microchip Technology Inc.
PIC12C5XX
CALL
Subroutine Call
CLRW
Syntax:
[ label ] CALL k
Syntax:
[ label ] CLRW
Operands:
0 ≤ k ≤ 255
Operands:
None
Operation:
(PC) + 1→ Top of Stack;
k → PC<7:0>;
(STATUS<6:5>) → PC<10:9>;
0 → PC<8>
Operation:
00h → (W);
1→Z
Status Affected: None
Encoding:
Description:
1001
kkkk
kkkk
Subroutine call. First, return address
(PC+1) is pushed onto the stack. The
eight bit immediate address is loaded
into PC bits <7:0>. The upper bits
PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is
a two cycle instruction.
1
Cycles:
2
Example:
HERE
CALL
address (THERE)
address (HERE + 1)
[ label ] CLRF
Operands:
0 ≤ f ≤ 31
Operation:
00h → (f);
1→Z
1
Example:
CLRW
Before Instruction
W
=
0x5A
0000
f
1
Example:
011f
FLAG_REG
Before Instruction
FLAG_REG
=
0x5A
=
=
0x00
1
After Instruction
FLAG_REG
Z
Clear Watchdog Timer
[ label ] CLRWDT
Operands:
None
Operation:
00h → WDT;
0 → WDT prescaler (if assigned);
1 → TO;
1 → PD
Encoding:
1
CLRF
0x00
1
Status Affected: TO, PD
 1999 Microchip Technology Inc.
0000
0000
0100
Description:
The CLRWDT instruction resets the
WDT. It also resets the prescaler, if the
prescaler is assigned to the WDT and
not Timer0. Status bits TO and PD are
set.
Words:
1
ffff
The contents of register ’f’ are cleared
and the Z bit is set.
Cycles:
=
=
Syntax:
Status Affected: Z
Words:
0000
1
Cycles:
Clear f
Encoding:
0100
Words:
CLRWDT
address (HERE)
Syntax:
Description:
0000
The W register is cleared. Zero bit (Z)
is set.
THERE
After Instruction
CLRF
Encoding:
Description:
W
Z
Before Instruction
PC =
TOS =
Status Affected: Z
After Instruction
Words:
PC =
Clear W
Cycles:
1
Example:
CLRWDT
Before Instruction
WDT counter =
?
After Instruction
WDT counter
WDT prescale
TO
PD
=
=
=
=
0x00
0
1
1
DS40139E-page 51
PIC12C5XX
COMF
Complement f
Syntax:
[ label ] COMF
Operands:
Operation:
DECFSZ
[ label ] DECFSZ f,d
0 ≤ f ≤ 31
d ∈ [0,1]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
(f) → (dest)
Operation:
(f) – 1 → d;
Encoding:
0010
01df
ffff
Description:
The contents of register ’f’ are complemented. If ’d’ is 0 the result is stored in
the W register. If ’d’ is 1 the result is
stored back in register ’f’.
Words:
1
Cycles:
1
Example:
COMF
Words:
0x13
=
=
Description:
REG1,0
After Instruction
REG1
W
Encoding:
Decrement f
Syntax:
[ label ] DECF f,d
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
1(2)
Example:
HERE
(f) – 1 → (dest)
Words:
PC
CNT
if CNT
PC
if CNT
PC
11df
1
1
Example:
DECF
Before Instruction
CNT
Z
=
=
=
=
=
address (HERE)
CNT,
=
=
=
≠
=
CNT - 1;
0,
address (CONTINUE);
0,
address (HERE+1)
GOTO
Unconditional Branch
Syntax:
[ label ]
Operands:
0 ≤ k ≤ 511
Operation:
k → PC<8:0>;
STATUS<6:5> → PC<10:9>
1
GOTO k
Status Affected: None
0x01
0
After Instruction
CNT
Z
CNT, 1
LOOP
ffff
Decrement register ’f’. If ’d’ is 0 the
result is stored in the W register. If ’d’ is
1 the result is stored back in register ’f’.
Cycles:
DECFSZ
GOTO
CONTINUE •
•
•
Before Instruction
Status Affected: Z
0000
ffff
After Instruction
Operands:
Encoding:
11df
1
Cycles:
0x13
0xEC
DECF
Description:
0010
The contents of register ’f’ are decremented. If ’d’ is 0 the result is placed in
the W register. If ’d’ is 1 the result is
placed back in register ’f’.
If the result is 0, the next instruction,
which is already fetched, is discarded
and an NOP is executed instead making it a two cycle instruction.
Before Instruction
=
skip if result = 0
Status Affected: None
Status Affected: Z
REG1
Decrement f, Skip if 0
Syntax:
f,d
Encoding:
101k
kkkk
kkkk
Description:
GOTO is an unconditional branch. The
9-bit immediate value is loaded into PC
bits <8:0>. The upper bits of PC are
loaded from STATUS<6:5>. GOTO is a
two cycle instruction.
Words:
1
0x00
1
Cycles:
2
Example:
GOTO THERE
After Instruction
PC =
DS40139E-page 52
address (THERE)
 1999 Microchip Technology Inc.
PIC12C5XX
INCF
Increment f
IORLW
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operands:
0 ≤ k ≤ 255
Operation:
(f) + 1 → (dest)
(W) .OR. (k) → (W)
Operation:
INCF f,d
Description:
Words:
Encoding:
0010
10df
ffff
The contents of register ’f’ are incremented. If ’d’ is 0 the result is placed in
the W register. If ’d’ is 1 the result is
placed back in register ’f’.
1
Cycles:
1
Example:
INCF
CNT,
=
=
1101
kkkk
kkkk
Description:
The contents of the W register are
OR’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words:
1
Cycles:
1
Example:
IORLW
0x35
Before Instruction
1
W
Before Instruction
CNT
Z
IORLW k
Status Affected: Z
Status Affected: Z
Encoding:
Inclusive OR literal with W
=
0x9A
After Instruction
0xFF
0
W
Z
=
=
0xBF
0
After Instruction
CNT
Z
INCFSZ
=
=
0x00
1
IORWF
Increment f, Skip if 0
Inclusive OR W with f
Syntax:
[ label ]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
(W).OR. (f) → (dest)
Syntax:
[ label ]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
(f) + 1 → (dest), skip if result = 0
Encoding:
Operation:
INCFSZ f,d
Encoding:
0011
f,d
Status Affected: Z
Status Affected: None
Description:
IORWF
11df
If the result is 0, then the next instruction, which is already fetched, is discarded and an NOP is executed
instead making it a two cycle instruction.
00df
ffff
Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words:
1
ffff
The contents of register ’f’ are incremented. If ’d’ is 0 the result is placed in
the W register. If ’d’ is 1 the result is
placed back in register ’f’.
0001
Description:
Cycles:
1
Example:
IORWF
RESULT, 0
Before Instruction
RESULT =
W
=
0x13
0x91
After Instruction
Words:
1
Cycles:
1(2)
Example:
HERE
INCFSZ
GOTO
CONTINUE •
•
•
CNT,
LOOP
1
RESULT =
W
=
Z
=
0x13
0x93
0
Before Instruction
PC
=
address (HERE)
After Instruction
CNT
if CNT
PC
if CNT
PC
=
=
=
≠
=
CNT + 1;
0,
address (CONTINUE);
0,
address (HERE +1)
 1999 Microchip Technology Inc.
DS40139E-page 53
PIC12C5XX
MOVF
Move f
Syntax:
[ label ]
MOVWF
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
(f) → (dest)
MOVF f,d
0010
Description:
[ label ]
Operands:
0 ≤ f ≤ 31
Operation:
(W) → (f)
Encoding:
00df
ffff
The contents of register ’f’ is moved to
destination ’d’. If ’d’ is 0, destination is
the W register. If ’d’ is 1, the destination
is file register ’f’. ’d’ is 1 is useful to test
a file register since status flag Z is
affected.
1
Cycles:
1
Example:
0000
001f
MOVF
Move data from the W register to register 'f'.
Words:
1
Cycles:
1
Example:
MOVWF
TEMP_REG
W
FSR,
TEMP_REG
=
=
0xFF
0x4F
=
=
0x4F
0x4F
After Instruction
0
TEMP_REG
W
value in FSR register
NOP
No Operation
MOVLW
Move Literal to W
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
None
Operands:
0 ≤ k ≤ 255
Operation:
No operation
Operation:
k → (W)
Status Affected: None
MOVLW k
Encoding:
Status Affected: None
Encoding:
1100
Description:
kkkk
kkkk
The eight bit literal ’k’ is loaded into the
W register. The don’t cares will assemble as 0s.
Words:
ffff
Description:
After Instruction
=
f
Before Instruction
Words:
W
MOVWF
Status Affected: None
Status Affected: Z
Encoding:
Move W to f
Syntax:
1
Cycles:
1
Example:
MOVLW
0000
NOP
0000
Description:
No operation.
Words:
1
Cycles:
1
Example:
NOP
0000
0x5A
After Instruction
W
=
DS40139E-page 54
0x5A
 1999 Microchip Technology Inc.
PIC12C5XX
OPTION
Load OPTION Register
RLF
Syntax:
[ label ]
Syntax:
[ label ] RLF
Operands:
None
Operands:
Operation:
(W) → OPTION
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
See description below
OPTION
Status Affected: None
Encoding:
0000
Description:
0000
0010
The content of the W register is loaded
into the OPTION register.
Words:
1
Cycles:
1
Example
Rotate Left f through Carry
Status Affected: C
Encoding:
Description:
OPTION
0011
W
=
Words:
0x07
RETLW
Return with Literal in W
Syntax:
[ label ]
Operands:
0 ≤ k ≤ 255
Operation:
k → (W);
TOS → PC
1000
Description:
1
Example:
RLF
REG1
C
REG1
W
C
1
Cycles:
2
Example:
CALL TABLE ;W contains
;table offset
;value.
•
;W now has table
•
;value.
•
ADDWF PC
;W = offset
RETLW k1
;Begin table
RETLW k2
;
•
•
•
RETLW kn
; End of table
W
=
0x07
After Instruction
W
=
value of k8
1110 0110
0
=
=
=
1110 0110
1100 1100
1
kkkk
Words:
Before Instruction
=
=
After Instruction
The W register is loaded with the eight
bit literal ’k’. The program counter is
loaded from the top of the stack (the
return address). This is a two cycle
instruction.
TABLE
REG1,0
Before Instruction
RETLW k
kkkk
1
Cycles:
Status Affected: None
Encoding:
ffff
register ’f’
C
0x07
OPTION =
01df
The contents of register ’f’ are rotated
one bit to the left through the Carry
Flag. If ’d’ is 0 the result is placed in the
W register. If ’d’ is 1 the result is stored
back in register ’f’.
Before Instruction
After Instruction
f,d
RRF
Rotate Right f through Carry
Syntax:
[ label ]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
See description below
RRF f,d
Status Affected: C
Encoding:
Description:
0011
C
Words:
00df
ffff
The contents of register ’f’ are rotated
one bit to the right through the Carry
Flag. If ’d’ is 0 the result is placed in the
W register. If ’d’ is 1 the result is placed
back in register ’f’.
register ’f’
1
Cycles:
1
Example:
RRF
REG1,0
Before Instruction
REG1
C
=
=
1110 0110
0
After Instruction
REG1
W
C
 1999 Microchip Technology Inc.
=
=
=
1110 0110
0111 0011
0
DS40139E-page 55
PIC12C5XX
SLEEP
Enter SLEEP Mode
SUBWF
Subtract W from f
Syntax:
[label]
Syntax:
[label]
Operands:
None
Operands:
Operation:
00h → WDT;
0 → WDT prescaler;
1 → TO;
0 → PD
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
(f) – (W) → (dest)
SLEEP
Status Affected: TO, PD, GPWUF
Status Affected: C, DC, Z
Encoding:
0000
10df
ffff
Description:
Subtract (2’s complement method) the
W register from register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
GPWUF is unaffected.
Words:
1
The WDT and its prescaler are
cleared.
Cycles:
1
Example 1:
SUBWF
Encoding:
Description:
SUBWF f,d
0000
0000
0011
Time-out status bit (TO) is set. The
power down status bit (PD) is cleared.
The processor is put into SLEEP mode
with the oscillator stopped. See section on SLEEP for more details.
Words:
1
Cycles:
1
Example:
SLEEP
REG1, 1
Before Instruction
REG1
W
C
=
=
=
3
2
?
After Instruction
REG1
W
C
=
=
=
1
2
1
; result is positive
Example 2:
Before Instruction
REG1
W
C
=
=
=
2
2
?
After Instruction
REG1
W
C
=
=
=
0
2
1
; result is zero
Example 3:
Before Instruction
REG1
W
C
=
=
=
1
2
?
After Instruction
REG1
W
C
DS40139E-page 56
=
=
=
FF
2
0
; result is negative
 1999 Microchip Technology Inc.
PIC12C5XX
SWAPF
Swap Nibbles in f
XORLW
Exclusive OR literal with W
Syntax:
[ label ] SWAPF f,d
Syntax:
[label]
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operands:
0 ≤ k ≤ 255
(f<3:0>) → (dest<7:4>);
(f<7:4>) → (dest<3:0>)
Operation:
Operation:
(W) .XOR. k → (W)
Status Affected: Z
Encoding:
Status Affected: None
XORLW k
1111
kkkk
kkkk
Description:
The upper and lower nibbles of register
’f’ are exchanged. If ’d’ is 0 the result is
placed in W register. If ’d’ is 1 the result
is placed in register ’f’.
The contents of the W register are
XOR’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words:
1
Cycles:
1
Words:
1
Example:
XORLW
Cycles:
1
Example
SWAPF
Encoding:
0011
Description:
10df
ffff
REG1,
W
0
=
=
0xB5
After Instruction
Before Instruction
REG1
0xAF
Before Instruction
W
0xA5
=
0x1A
After Instruction
REG1
W
=
=
0xA5
0X5A
XORWF
Exclusive OR W with f
Syntax:
[ label ] XORWF
Operands:
0 ≤ f ≤ 31
d ∈ [0,1]
Operation:
(W) .XOR. (f) → (dest)
TRIS
Load TRIS Register
Syntax:
[ label ] TRIS
Operands:
f=6
Status Affected: Z
Operation:
(W) → TRIS register f
Encoding:
f
Status Affected: None
Encoding:
0000
Description:
0000
0001
Exclusive OR the contents of the W
register with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
1
0fff
TRIS register ’f’ (f = 6) is loaded with the
contents of the W register
1
Words:
Cycles:
1
Cycles:
1
Example
XORWF
TRIS
GPIO
Before Instruction
W
=
TRIS
=
REG,1
Before Instruction
0XA5
After Instruction
Note:
ffff
Description:
Words:
Example
10df
f,d
0XA5
f = 6 for PIC12C5XX only.
 1999 Microchip Technology Inc.
REG
W
=
=
0xAF
0xB5
After Instruction
REG
W
=
=
0x1A
0xB5
DS40139E-page 57
PIC12C5XX
NOTES:
DS40139E-page 58
 1999 Microchip Technology Inc.
PIC12C5XX
10.0
DEVELOPMENT SUPPORT
10.1
Development Tools
The PICmicro microcontrollers are supported with a
full range of hardware and software development tools:
• MPLAB™-ICE Real-Time In-Circuit Emulator
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX
In-Circuit Emulator
• PRO MATE II Universal Programmer
• PICSTART Plus Entry-Level Prototype
Programmer
• SIMICE
• PICDEM-1 Low-Cost Demonstration Board
• PICDEM-2 Low-Cost Demonstration Board
• PICDEM-3 Low-Cost Demonstration Board
• MPASM Assembler
• MPLAB SIM Software Simulator
• MPLAB-C17 (C Compiler)
• Fuzzy Logic Development System
(fuzzyTECH−MP)
• KEELOQ® Evaluation Kits and Programmer
10.2
MPLAB-ICE: High Performance
Universal In-Circuit Emulator with
MPLAB IDE
The MPLAB-ICE Universal In-Circuit Emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for
PICmicro microcontrollers (MCUs). MPLAB-ICE is
supplied with the MPLAB Integrated Development
Environment (IDE), which allows editing, “make” and
download, and source debugging from a single environment.
Interchangeable processor modules allow the system
to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB-ICE
allows expansion to support all new Microchip microcontrollers.
The MPLAB-ICE Emulator System has been designed
as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher)
machine platform and Microsoft Windows 3.x or
Windows 95 environment were chosen to best make
these features available to you, the end user.
10.3
ICEPIC: Low-Cost PICmicro
In-Circuit Emulator
ICEPIC is a low-cost in-circuit emulator solution for the
Microchip PIC12CXXX, PIC16C5X and PIC16CXXX
families of 8-bit OTP microcontrollers.
ICEPIC is designed to operate on PC-compatible
machines ranging from 386 through Pentium based
machines under Windows 3.x, Windows 95, or Windows NT environment. ICEPIC features real time, nonintrusive emulation.
10.4
PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone
mode as well as PC-hosted mode. PRO MATE II is CE
compliant.
The PRO MATE II has programmable VDD and VPP
supplies which allows it to verify programmed memory
at VDD min and VDD max for maximum reliability. It has
an LCD display for displaying error messages, keys to
enter commands and a modular detachable socket
assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program
PIC12CXXX,
PIC14C000,
PIC16C5X,
PIC16CXXX and PIC17CXX devices. It can also set
configuration and code-protect bits in this mode.
10.5
PICSTART Plus Entry Level
Development System
The PICSTART programmer is an easy-to-use, lowcost prototype programmer. It connects to the PC via
one of the COM (RS-232) ports. MPLAB Integrated
Development Environment software makes using the
programmer simple and efficient. PICSTART Plus is not
recommended for production programming.
PICSTART Plus supports all PIC12CXXX, PIC14C000,
PIC16C5X, PIC16CXXX and PIC17CXX devices with
up to 40 pins. Larger pin count devices such as the
PIC16C923, PIC16C924 and PIC17C756 may be supported with an adapter socket. PICSTART Plus is CE
compliant.
MPLAB-ICE
is
available
in
two
versions.
MPLAB-ICE 1000 is a basic, low-cost emulator system
with simple trace capabilities. It shares processor modules with the MPLAB-ICE 2000. This is a full-featured
emulator system with enhanced trace, trigger, and data
monitoring features. Both systems will operate across
the entire operating speed range of the PICmicro
MCU.
 1999 Microchip Technology Inc.
DS40139E-page 59
PIC12C5XX
10.6
SIMICE Entry-Level Hardware
Simulator
SIMICE is an entry-level hardware development system designed to operate in a PC-based environment
with Microchip’s simulator MPLAB™-SIM. Both SIMICE and MPLAB-SIM run under Microchip Technology’s MPLAB Integrated Development Environment
(IDE) software. Specifically, SIMICE provides hardware
simulation for Microchip’s PIC12C5XX, PIC12CE5XX,
and PIC16C5X families of PICmicro 8-bit microcontrollers. SIMICE works in conjunction with MPLAB-SIM
to provide non-real-time I/O port emulation. SIMICE
enables a developer to run simulator code for driving
the target system. In addition, the target system can
provide input to the simulator code. This capability
allows for simple and interactive debugging without
having to manually generate MPLAB-SIM stimulus
files. SIMICE is a valuable debugging tool for entrylevel system development.
10.7
PICDEM-1 Low-Cost PICmicro
Demonstration Board
The PICDEM-1 is a simple board which demonstrates
the capabilities of several of Microchip’s microcontrollers. The microcontrollers supported are: PIC16C5X
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X,
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and
PIC17C44. All necessary hardware and software is
included to run basic demo programs. The users can
program the sample microcontrollers provided with
the PICDEM-1 board, on a PRO MATE II or
PICSTART-Plus programmer, and easily test firmware. The user can also connect the PICDEM-1
board to the MPLAB-ICE emulator and download the
firmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller
socket(s). Some of the features include an RS-232
interface, a potentiometer for simulated analog input,
push-button switches and eight LEDs connected to
PORTB.
DS40139E-page 60
10.8
PICDEM-2 Low-Cost PIC16CXX
Demonstration Board
The PICDEM-2 is a simple demonstration board that
supports the PIC16C62, PIC16C64, PIC16C65,
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to
run the basic demonstration programs. The user
can program the sample microcontrollers provided
with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-Plus, and easily test firmware.
The MPLAB-ICE emulator may also be used with the
PICDEM-2 board to test firmware. Additional prototype
area has been provided to the user for adding additional hardware and connecting it to the microcontroller
socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate
usage of the I2C bus and separate headers for connection to an LCD module and a keypad.
10.9
PICDEM-3 Low-Cost PIC16CXXX
Demonstration Board
The PICDEM-3 is a simple demonstration board that
supports the PIC16C923 and PIC16C924 in the PLCC
package. It will also support future 44-pin PLCC
microcontrollers with a LCD Module. All the necessary hardware and software is included to run the
basic demonstration programs. The user can program the sample microcontrollers provided with
the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and
easily test firmware. The MPLAB-ICE emulator may
also be used with the PICDEM-3 board to test firmware. Additional prototype area has been provided to
the user for adding hardware and connecting it to the
microcontroller socket(s). Some of the features include
an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and
separate headers for connection to an external LCD
module and a keypad. Also provided on the PICDEM-3
board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature
and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for
showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals.
 1999 Microchip Technology Inc.
PIC12C5XX
10.10
MPLAB Integrated Development
Environment Software
The MPLAB IDE Software brings an ease of software
development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application
which contains:
• A full featured editor
• Three operating modes
- editor
- emulator
- simulator
• A project manager
• Customizable tool bar and key mapping
• A status bar with project information
• Extensive on-line help
10.12
Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code
development in a PC host environment. It allows the
user to simulate the PICmicro series microcontrollers
on an instruction level. On any given instruction, the
user may examine or modify any of the data areas or
provide external stimulus to any of the pins. The input/
output radix can be set by the user and the execution
can be performed in; single step, execute until break, or
in a trace mode.
MPLAB-SIM fully supports symbolic debugging using
MPLAB-C17 and MPASM. The Software Simulator
offers the low cost flexibility to develop and debug code
outside of the laboratory environment making it an
excellent multi-project software development tool.
MPLAB allows you to:
10.13
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download
to PICmicro tools (automatically updates all
project information)
• Debug using:
- source files
- absolute listing file
The MPLAB-C17 Code Development System is a
complete ANSI ‘C’ compiler and integrated development environment for Microchip’s PIC17CXXX family of
microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with
other compilers.
The ability to use MPLAB with Microchip’s simulator
allows a consistent platform and the ability to easily
switch from the low cost simulator to the full featured
emulator with minimal retraining due to development
tools.
10.11
Assembler (MPASM)
The MPASM Universal Macro Assembler is a PChosted symbolic assembler. It supports all microcontroller series including the PIC12C5XX, PIC14000,
PIC16C5X, PIC16CXXX, and PIC17CXX families.
MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats.
It generates various object code formats to support
Microchip's development tools as well as third party
programmers.
MPASM allows full symbolic debugging from MPLABICE, Microchip’s Universal Emulator System.
MPASM has the following features to assist in developing software for specific use applications.
• Provides translation of Assembler source code to
object code for all Microchip microcontrollers.
• Macro assembly capability.
• Produces all the files (Object, Listing, Symbol, and
special) required for symbolic debug with
Microchip’s emulator systems.
• Supports Hex (default), Decimal and Octal source
and listing formats.
MPLAB-C17 Compiler
For easier source level debugging, the compiler provides symbol information that is compatible with the
MPLAB IDE memory display.
10.14
Fuzzy Logic Development System
(fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version,
MP Explorer, for designers to gain a comprehensive
working knowledge of fuzzy logic system design; and a
full-featured version, fuzzyTECH-MP, Edition for implementing more complex systems.
Both versions include Microchip’s fuzzyLAB demonstration board for hands-on experience with fuzzy logic
systems implementation.
10.15
SEEVAL Evaluation and
Programming System
The SEEVAL SEEPROM Designer’s Kit supports all
Microchip 2-wire and 3-wire Serial EEPROMs. The kit
includes everything necessary to read, write, erase or
program special features of any Microchip SEEPROM
product including Smart Serials and secure serials.
The Total Endurance Disk is included to aid in tradeoff analysis and reliability calculations. The total kit can
significantly reduce time-to-market and result in an
optimized system.
MPASM provides a rich directive language to support
programming of the PICmicro. Directives are helpful
in making the development of your assemble source
code shorter and more maintainable.
 1999 Microchip Technology Inc.
DS40139E-page 61
PIC12C5XX
10.16
KEELOQ Evaluation and
Programming Tools
KEELOQ evaluation and programming tools support
Microchips HCS Secure Data Products. The HCS evaluation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a programming interface to program test transmitters.
DS40139E-page 62
 1999 Microchip Technology Inc.
 1999 Microchip Technology Inc.
Emulator Products
Software Tools
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
á
KEELOQ
Transponder Kit
á
KEELOQ®
Evaluation Kit
PICDEM-3
á
PICDEM-2
á
PICDEM-1
á
PICDEM-14A
á
á
SIMICE
HCS200
HCS300
HCS301
á
SEEVAL
Designers Kit
á
á
KEELOQ
Programmer
24CXX
25CXX
93CXX
á
PRO MATE II
Universal
Programmer
á
PICSTARTPlus
Low-Cost
Universal Dev. Kit
á
Total Endurance
Software Model
PIC17C7XX
á
fuzzyTECH-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool
MPLAB C17*
Compiler
MPLAB
Integrated
Development
Environment
ICEPIC Low-Cost
In-Circuit Emulator
MPLAB™-ICE
PIC16C8X PIC16C9XX PIC17C4X
á
PIC14000
á
Programmers
TABLE 10-1:
Demo Boards
PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX
á
PIC12C5XX
PIC12C5XX
DEVELOPMENT TOOLS FROM MICROCHIP
DS40139E-page 63
PIC12C5XX
NOTES:
DS40139E-page 64
 1999 Microchip Technology Inc.
PIC12C5XX
11.0
ELECTRICAL CHARACTERISTICS - PIC12C508/PIC12C509
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
Storage Temperature ............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS .................................................................................................................0 to +7.5 V
Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V
Voltage on all other pins with respect to VSS ............................................................................... –0.6 V to (VDD + 0.6 V)
Total Power Dissipation(1) ....................................................................................................................................700 mW
Max. Current out of VSS pin ..................................................................................................................................200 mA
Max. Current into VDD pin .....................................................................................................................................150 mA
Input Clamp Current, IIK (VI < 0 or VI > VDD).................................................................................................................... ±20 mA
Output Clamp Current, IOK (VO < 0 or VO > VDD)............................................................................................................. ±20 mA
Max. Output Current sunk by any I/O pin................................................................................................................25 mA
Max. Output Current sourced by any I/O pin...........................................................................................................25 mA
Max. Output Current sourced by I/O port (GPIO) .................................................................................................100 mA
Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA
Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
†
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
 1999 Microchip Technology Inc.
DS40139E-page 65
PIC12C5XX
11.1
DC CHARACTERISTICS:
PIC12C508/509 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
Power Supply Pins
Parm
No.
Characteristic
Sym
Min
2.5
Typ(1)
Max
Units
5.5
V
5.5
Conditions
D001
Supply Voltage
VDD
V
FOSC = DC to 4 MHz (Commercial/
Industrial)
FOSC = DC to 4 MHz (Extended)
D002
RAM Data Retention
VDR
1.5*
V
Device in SLEEP mode
VSS
V
See section on Power-on Reset for details
V/ms
See section on Power-on Reset for details
XT and EXTRC options (4)
FOSC = 4 MHz, VDD = 5.5V
INTRC Option
FOSC = 4 MHz, VDD = 5.5V
LP OPTION, Commercial Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
LP OPTION, Industrial Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
LP OPTION, Extended Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
3.0
Voltage(2)
D003
VDD Start Voltage to
ensure Power-on Reset
VPOR
D004
VDD Rise Rate to ensure
Power-on Reset
SVDD 0.05
*
Supply Current(3)
—
.78
2.4
mA
D010C
—
1.1
2.4
mA
D010A
—
10
27
µA
—
14
35
µA
—
14
35
µA
IPD
—
—
—
0.25
0.25
2
4
5
18
µA
µA
µA
VDD = 3.0V, Commercial WDT disabled
VDD = 3.0V, Industrial WDT disabled
VDD = 3.0V, Extended WDT disabled
∆IWDT
—
—
—
3.75
3.75
3.75
8
9
14
µA
µA
µA
VDD = 3.0V, Commercial
VDD = 3.0V, Industrial
VDD = 3.0V, Extended
D010
IDD
Power-Down Current (5)
D020
D021
D021B
D022
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as
bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an
impact on the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current
is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or
VSS.
DS40139E-page 66
 1999 Microchip Technology Inc.
PIC12C5XX
11.2
DC CHARACTERISTICS:
PIC12C508/509 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Param
No.
Characteristic
Input Low Voltage
I/O ports
with TTL buffer
D030
D031
D032
D033
Standard Operating Conditions (unless otherwise specified)
Operating temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating voltage VDD range as described in DC spec Section 11.1 and
Section 11.2.
Sym
Min
Typ† Max Units
Conditions
D040
D040A
OSC1 (EXTRC) (1)
OSC1 (in XT and LP)
Input High Voltage
I/O ports
with TTL buffer
V
V
V
V
VSS
-
0.3VDD
V
Note1
VSS
with Schmitt Trigger buffer
MCLR, GP2/T0CKI (in EXTRC mode)
D033
0.8V
0.15VDD
0.15VDD
0.15VDD
0.15VDD
4.5 < VDD ≤ 5.5V
otherwise
VSS
VSS
VSS
-
VIL
2.0V
0.25VDD + 0.8V
0.85VDD
0.85VDD
0.7VDD
0.85VDD
50
250
IPUR
VDD
VDD
V
V
4.5 ≤ VDD ≤ 5.5V
otherwise
VDD
VDD
VDD
VDD
400
V
V
V
V
µA
For entire VDD range
-1
0.5
+1
µA
Vss ≤ VPIN ≤ VDD,
Pin at hi-impedance
VPIN = VSS + 0.25V(2)
VPIN = VDD
Vss ≤ VPIN ≤ VDD,
XT and LP options
VIH
VSS
D041
D042
D042A
D043
D070
with Schmitt Trigger buffer
MCLR/GP2/T0CKI
OSC1 (XT and LP)
OSC1 (in EXTRC mode)
GPIO weak pull-up current
D060
Input Leakage Current (2, 3)
I/O ports
D061
MCLR, GP2/T0CKI
20
130
0.5
250
+5
µA
µA
D063
OSC1
-3
0.5
+3
µA
D080
Output Low Voltage
I/O ports/CLKOUT
Output High Voltage
VOL
-
-
0.6
V
IOL = 8.7 mA, VDD = 4.5V
VOH
VDD - 0.7
-
-
V
IOH = -5.4 mA, VDD = 4.5V
COSC2
-
-
15
pF
In XT and LP modes when
external clock is used to drive
OSC1.
D090
I/O ports/CLKOUT (3)
Capacitive Loading Specs on
Output Pins
OSC2 pin
D100
IIL
Note1
VDD = 5V, VPIN = VSS
For VDD ≤5.5V
50
pF
All I/O pins
CIO
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that
the PIC12C5XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as coming out of the pin.
D101
†
 1999 Microchip Technology Inc.
DS40139E-page 67
PIC12C5XX
TABLE 11-1:
VDD (Volts)
PULL-UP RESISTOR RANGES - PIC12C508/C509
Temperature (°C)
Min
Typ
Max
Units
42K
48K
49K
55K
17K
20K
22K
24K
63K
63K
63K
63K
20K
23K
25K
28K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
346K
414K
457K
504K
292K
341K
371K
407K
417K
532K
532K
593K
360K
437K
448K
500K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
GP0/GP1
2.5
5.5
–40
25
85
125
–40
25
85
125
38K
42K
42K
50K
15K
18K
19K
22K
–40
25
85
125
–40
25
85
125
285K
343K
368K
431K
247K
288K
306K
351K
GP3
2.5
5.5
*
These parameters are characterized but not tested.
DS40139E-page 68
 1999 Microchip Technology Inc.
PIC12C5XX
11.3
Timing Parameter Symbology and Load Conditions - PIC12C508/C509
The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F
Frequency
T
Time
MCLR
Lowercase subscripts (pp) and their meanings:
pp
2
to
mc
ck
CLKOUT
osc
oscillator
cy
cycle time
os
OSC1
drt
device reset timer
t0
T0CKI
io
I/O port
wdt
watchdog timer
Period
Uppercase letters and their meanings:
S
F
Fall
P
H
High
R
Rise
I
Invalid (Hi-impedance)
V
Valid
L
Low
Z
Hi-impedance
FIGURE 11-1: LOAD CONDITIONS - PIC12C508/C509
Pin
CL = 50 pF for all pins except OSC2
CL
VSS
 1999 Microchip Technology Inc.
15 pF for OSC2 in XT or LP
modes when external clock
is used to drive OSC1
DS40139E-page 69
PIC12C5XX
11.4
Timing Diagrams and Specifications
FIGURE 11-2: EXTERNAL CLOCK TIMING - PIC12C508/C509
Q4
Q1
Q3
Q2
Q4
Q1
OSC1
1
3
3
4
4
2
TABLE 11-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508/C509
AC Characteristics
Parameter
No.
Sym
FOSC
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial),
–40°C ≤ TA ≤ +85°C (industrial),
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 11.1
Characteristic
TOSC
3
4
Tcy
DC
—
4
DC
—
200
Max
Units
Conditions
MHz XT osc mode
kHz
LP osc mode
(2)
(2)
External CLKIN Period
Oscillator Period(2)
2
Typ(1)
External CLKIN Frequency(2)
Oscillator Frequency
1
Min
Instruction Cycle Time(3)
TosL, TosH Clock in (OSC1) Low or High Time
TosR, TosF Clock in (OSC1) Rise or Fall Time
0.1
—
4
DC
—
200
MHz XT osc mode
kHz
250
—
—
ns
250
—
—
ns
XT osc mode
5
—
—
ms
LP osc mode
250
—
—
ns
EXTRC osc mode
250
—
10,000
ns
XT osc mode
5
—
—
ms
LP osc mode
—
4/FOSC
—
—
50*
—
—
ns
2*
—
—
ms
LP oscillator
—
—
25*
ns
XT oscillator
—
—
50*
ns
LP oscillator
LP osc mode
EXTRC osc mode
XT oscillator
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable
oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS40139E-page 70
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 11-3:
CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508/C509
AC Characteristics
Parameter
No.
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial),
–40°C ≤ TA ≤ +85°C (industrial),
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 10.1
Min*
Typ(1)
Internal Calibrated RC Frequency
3.58
4.00
4.32
MHz VDD = 5.0V
Internal Calibrated RC Frequency
3.50
—
4.26
MHz VDD = 2.5V
Sym
Characteristic
Max* Units
Conditions
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
FIGURE 11-3:
I/O TIMING - PIC12C508/C509
Q1
Q4
Q2
Q3
OSC1
I/O Pin
(input)
17
I/O Pin
(output)
19
18
New Value
Old Value
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
 1999 Microchip Technology Inc.
DS40139E-page 71
PIC12C5XX
TABLE 11-4:
TIMING REQUIREMENTS - PIC12C508/C509
AC Characteristics
Parameter
No.
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 11.1
Sym
Characteristic
(3)
Min
Typ(1)
Max
Units
17
TosH2ioV
OSC1↑ (Q1 cycle) to Port out valid
—
—
100*
ns
18
TosH2ioI
OSC1↑ (Q2 cycle) to Port input invalid
(I/O in hold time)
TBD
—
—
ns
19
TioV2osH
Port input valid to OSC1↑
(I/O in setup time)
TBD
—
—
ns
20
TioR
Port output rise time(2, 3)
—
10
25**
ns
21
TioF
—
10
25**
ns
Port output fall
time(2, 3)
* These parameters are characterized but not tested.
** These parameters are design targets and are not tested. No characterization data available at this time.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
2: Measurements are taken in EXTRC mode.
3: See Figure 11-1 for loading conditions.
FIGURE 11-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC12C508/C509
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Timeout
(Note 2)
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
2: Runs in MCLR or WDT reset only in XT and LP modes.
DS40139E-page 72
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 11-5:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508/C509
AC Characteristics Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 11.1
Parameter
No.
Sym
Characteristic
30
TmcL
MCLR Pulse Width (low)
2000*
—
—
ns
VDD = 5 V
31
Twdt
Watchdog Timer Time-out Period
(No Prescaler)
9*
18*
30*
ms
VDD = 5 V (Commercial)
32
TDRT
Device Reset Timer Period(2)
9*
18*
30*
ms
VDD = 5 V (Commercial)
34
TioZ
I/O Hi-impedance from MCLR Low
—
—
2000*
ns
Min
Typ(1)
Max
Units
Conditions
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 2: See Table 11-6.
TABLE 11-6:
DRT (DEVICE RESET TIMER PERIOD - PIC12C508/C509)
Oscillator Configuration
POR Reset
Subsequent Resets
IntRC & ExtRC
18 ms (typical)
300 µs (typical)
XT & LP
18 ms (typical)
18 ms (typical)
 1999 Microchip Technology Inc.
DS40139E-page 73
PIC12C5XX
FIGURE 11-5: TIMER0 CLOCK TIMINGS - PIC12C508/C509
T0CKI
40
41
42
TABLE 11-7:
TIMER0 CLOCK REQUIREMENTS - PIC12C508/C509
AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 11.1.
Parameter
Sym Characteristic
No.
40
Min
Tt0H T0CKI High Pulse Width - No Prescaler
- With Prescaler
41
Tt0L
T0CKI Low Pulse Width - No Prescaler
- With Prescaler
42
Tt0P T0CKI Period
Typ(1) Max Units Conditions
0.5 TCY + 20*
—
—
ns
10*
—
—
ns
0.5 TCY + 20*
—
—
ns
10*
—
—
ns
20 or TCY + 40*
N
—
—
ns
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DS40139E-page 74
 1999 Microchip Technology Inc.
PIC12C5XX
12.0
DC AND AC CHARACTERISTICS - PIC12C508/PIC12C509
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables
the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information
only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 12-1: CALIBRATED INTERNAL RC
FREQUENCY RANGE VS.
TEMPERATURE (VDD = 2.5V)
FIGURE 12-2: CALIBRATED INTERNAL RC
FREQUENCY RANGE VS.
TEMPERATURE (VDD = 5.0V)
4.50
4.50
4.40
4.40
4.30
4.30
4.10
Max.
4.00
3.90
4.20
4.10
Max.
4.00
3.90
3.80
3.80
3.70
Min.
3.70
3.60
3.50
-40
Frequency (MHz)
Frequency (MHz)
4.20
Min.
25
85
Temperature (Deg.C)
 1999 Microchip Technology Inc.
125
3.60
3.50
-40
25
85
Temperature (Deg.C)
125
DS40139E-page 75
PIC12C5XX
TABLE 12-1:
DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25°C
Oscillator
Frequency
VDD = 2.5V
External RC
4 MHz
250 µA*
Internal RC
4 MHz
420 µA
XT
4 MHz
251 µA
LP
32 KHz
15 µA
*Does not include current through external R&C.
FIGURE 12-3: WDT TIMER TIME-OUT
PERIOD VS. VDD
VDD = 5.5V
780 µA*
1.1 mA
780 µA
37 µA
FIGURE 12-4: SHORT DRT PERIOD VS. VDD
1000
50
900
45
800
40
700
WDT period (µs)
WDT period (mS)
35
30
Max +125°C
25
600
500
Max +125°C
Max +85°C
Max +85°C
400
20
Typ +25°C
300
Typ +25°C
15
200
10
MIn –40°C
MIn –40°C
100
2
5
2
3
4
5
6
7
3
4
5
6
7
VDD (Volts)
VDD (Volts)
DS40139E-page 76
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 12-5: IOH vs. VOH, VDD = 2.5 V
FIGURE 12-7: IOL vs. VOL, VDD = 2.5 V
25
0
-1
20
Max –40°C
15
-3
IOL (mA)
IOH (mA)
-2
-4
Min +
-5
-6
Typ +25°C
10
125 °C
Min +85°C
85°C
Min +
Min +125°C
5
Typ +25°C
C
Max –40°
-7
500m
1.0
1.5
2.0
2.5
0
VOH (Volts)
0
250.0m
500.0m
1.0
VOL (Volts)
FIGURE 12-6: IOH vs. VOH, VDD = 5.5 V
FIGURE 12-8: IOL vs. VOL, VDD = 5.5 V
0
50
-5
Max –40°C
40
30
+1
25
°C
Min +85°C
20
C
Min +125°C
10
M
ax
-25
–4
0°
Ty
p
+2
M
5°
C
in
+8
in
M
C
-20
Typ +25°C
IOL (mA)
-15
5°
IOH (mA)
-10
-30
3.5
4.0
4.5
VOH (Volts)
5.0
5.5
0
250.0m
500.0m
750.0m
1.0
VOL (Volts)
 1999 Microchip Technology Inc.
DS40139E-page 77
PIC12C5XX
NOTES:
DS40139E-page 78
 1999 Microchip Technology Inc.
PIC12C5XX
13.0
ELECTRICAL CHARACTERISTICS - PIC12C508A/PIC12C509A/
PIC12LC508A/PIC12LC509A/PIC12CR509A/PIC12CE518/PIC12CE519/
PIC12LCE518/PIC12LCE519/PIC12LCR509A
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
Storage Temperature ............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS .................................................................................................................0 to +7.0 V
Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V
Voltage on all other pins with respect to VSS ............................................................................... –0.3 V to (VDD + 0.3 V)
Total Power Dissipation(1) ....................................................................................................................................700 mW
Max. Current out of VSS pin ..................................................................................................................................200 mA
Max. Current into VDD pin .....................................................................................................................................150 mA
Input Clamp Current, IIK (VI < 0 or VI > VDD).................................................................................................................... ±20 mA
Output Clamp Current, IOK (VO < 0 or VO > VDD)............................................................................................................. ±20 mA
Max. Output Current sunk by any I/O pin................................................................................................................25 mA
Max. Output Current sourced by any I/O pin...........................................................................................................25 mA
Max. Output Current sourced by I/O port (GPIO) .................................................................................................100 mA
Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA
Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
†
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
 1999 Microchip Technology Inc.
DS40139E-page 79
PIC12C5XX
13.1
DC CHARACTERISTICS:
PIC12C508A/509A (Commercial, Industrial, Extended)
PIC12CE518/519 (Commercial, Industrial, Extended)
PIC12CR509A (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
Power Supply Pins
Parm
No.
Characteristic
Sym
Min
3.0
Typ(1)
Max
Units
Conditions
5.5
V
FOSC = DC to 4 MHz (Commercial/
Industrial, Extended)
D001
Supply Voltage
VDD
D002
RAM Data Retention
Voltage(2)
VDR
1.5*
V
Device in SLEEP mode
D003
VDD Start Voltage to ensure
Power-on Reset
VPOR
VSS
V
See section on Power-on Reset for details
D004
VDD Rise Rate to ensure
Power-on Reset
SVDD
0.05*
V/ms
See section on Power-on Reset for details
D010
Supply Current(3)
IDD
—
0.8
1.4
mA
D010C
—
0.8
1.4
mA
D010A
—
19
27
µA
—
19
35
µA
—
30
55
µA
XT and EXTRC options (Note 4)
FOSC = 4 MHz, VDD = 5.5V
INTRC Option
FOSC = 4 MHz, VDD = 5.5V
LP OPTION, Commercial Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
LP OPTION, Industrial Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
LP OPTION, Extended Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
IPD
—
—
—
0.25
0.25
2
4
5
12
µA
µA
µA
VDD = 3.0V, Commercial WDT disabled
VDD = 3.0V, Industrial WDT disabled
VDD = 3.0V, Extended WDT disabled
∆IWDT
—
—
—
2.2
2.2
4
5
6
11
µA
µA
µA
VDD = 3.0V, Commercial
VDD = 3.0V, Industrial
VDD = 3.0V, Extended
∆IEE
—
0.1
0.2
mA
FOSC = 4 MHz, Vdd = 5.5V,
SCL = 400kHz
D020
Power-Down Current (5)
D021
D021B
D022
Power-Down Current
Supply Current (3)
During read/write to
EEPROM peripheral
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the
current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
DS40139E-page 80
 1999 Microchip Technology Inc.
PIC12C5XX
13.2
DC CHARACTERISTICS:
PIC12LC508A/509A (Commercial, Industrial)
PIC12LCE518/519 (Commercial, Industrial)
PIC12LCR509A (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
DC Characteristics
Power Supply Pins
Parm
No.
Characteristic
Sym
Min Typ(1) Max Units
2.5
D001
Supply Voltage
VDD
D002
RAM Data Retention
Voltage(2)
VDR
D003
VDD Start Voltage to ensure
Power-on Reset
VPOR
D004
VDD Rise Rate to ensure
Power-on Reset
SVDD 0.05*
D010
Supply Current(3)
V
FOSC = DC to 4 MHz (Commercial/
Industrial)
1.5*
V
Device in SLEEP mode
VSS
V
See section on Power-on Reset for details
V/ms
See section on Power-on Reset for details
XT and EXTRC options (Note 4)
FOSC = 4 MHz, VDD = 2.5V
INTRC Option
FOSC = 4 MHz, VDD = 2.5V
LP OPTION, Commercial Temperature
FOSC = 32 kHz, VDD = 2.5V, WDT disabled
LP OPTION, Industrial Temperature
FOSC = 32 kHz, VDD = 2.5V, WDT disabled
—
0.4
0.8
mA
D010C
—
0.4
0.8
mA
D010A
—
15
23
µA
—
15
31
µA
—
—
0.2
0.2
3
4
µA
µA
VDD = 2.5V, Commercial
VDD = 2.5V, Industrial
—
2.0
2.0
4
5
mA
mA
VDD = 2.5V, Commercial
VDD = 2.5V, Industrial
D020
Power-Down Current (5)
D021
D021B
IDD
5.5
Conditions
IPD
∆IWDT
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as
bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an
impact on the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current
is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or
VSS.
 1999 Microchip Technology Inc.
DS40139E-page 81
PIC12C5XX
13.3
DC CHARACTERISTICS:
DC CHARACTERISTICS
Param
No.
Characteristic
Input Low Voltage
I/O ports
with TTL buffer
D030
D031
D032
D033
D033
with Schmitt Trigger buffer
MCLR, GP2/T0CKI (in EXTRC mode)
OSC1 (in EXTRC mode)
OSC1 (in XT and LP)
Input High Voltage
I/O ports
with TTL buffer
D040
D040A
D041
D042
D042A
D043
D070
D060
with Schmitt Trigger buffer
MCLR, GP2/T0CKI
OSC1 (XT and LP)
OSC1 (in EXTRC mode)
GPIO weak pull-up current (Note 4)
MCLR pull-up current
Input Leakage Current (Notes 2, 3)
I/O ports
D061
D063
T0CKI
OSC1
D080
Output Low Voltage
I/O ports
PIC12C508A/509A (Commercial, Industrial, Extended)
PIC12C518/519 (Commercial, Industrial, Extended)
PIC12CR509A (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified)
Operating temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating voltage VDD range as described in DC spec Section 13.1 and
Section 13.2.
Sym
Min
Typ† Max Units
Conditions
VIL
VSS
VSS
VSS
VSS
VSS
VSS
VIH
IPUR
-
Output High Voltage
I/O ports (Note 3)
D100
D101
All I/O pins
†
Note 1:
2:
3:
4:
V
V
V
V
V
Note 1
Note 1
VDD
V
4.5V ≤ VDD ≤ 5.5V
VDD
VDD
VDD
VDD
VDD
400
30
V
V
V
V
V
µA
µA
otherwise
For entire VDD range
-
+1
µA
-
-
+5
+5
µA
µA
-
-
0.6
V
-
-
0.6
V
VDD - 0.7
-
-
V
VDD - 0.7
-
-
V
COSC2
-
-
15
pF
CIO
-
-
50
pF
VOL
VOH
D090A
Capacitive Loading Specs on
Output Pins
OSC2 pin
0.25VDD +
0.8V
2.0V
0.8VDD
0.8VDD
0.7VDD
0.9VDD
30
250
-
For 4.5V ≤ VDD ≤ 5.5V
otherwise
0.8V
0.15VDD
0.2VDD
0.2VDD
0.2VDD
0.3VDD
-
IIL
D080A
D090
-
Note 1
VDD = 5V, VPIN = VSS
VDD = 5V, VPIN = VSS
Vss ≤ VPIN ≤ VDD, Pin at hiimpedance
Vss ≤ VPIN ≤ VDD
Vss ≤ VPIN ≤ VDD, XT and LP osc
configuration
IOL = 8.5 mA, VDD = 4.5V,
–40°C to +85°C
IOL = 7.0 mA, VDD = 4.5V,
–40°C to +125°C
IOH = -3.0 mA, VDD = 4.5V,
–40°C to +85°C
IOH = -2.5 mA, VDD = 4.5V,
–40°C to +125°C
In XT and LP modes when external clock is used to drive OSC1.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC12C5XX be driven with external clock in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
Negative current is defined as coming out of the pin.
This spec. applies when GP3/MCLR is configured as MCLR. The leakage current of the MCLR circuit is higher than the
standard I/O logic.
DS40139E-page 82
 1999 Microchip Technology Inc.
PIC12C5XX
13.4
DC CHARACTERISTICS:
DC CHARACTERISTICS
Param
No.
Characteristic
Input Low Voltage
I/O ports
with TTL buffer
D030
D031
D032
D033
D033
with Schmitt Trigger buffer
MCLR, GP2/T0CKI (in EXTRC mode)
OSC1 (in EXTRC mode)
OSC1 (in XT and LP)
Input High Voltage
I/O ports
with TTL buffer
D040
D040A
D041
D042
D042A
D043
D070
D060
with Schmitt Trigger buffer
MCLR, GP2/T0CKI
OSC1 (XT and LP)
OSC1 (in EXTRC mode)
GPIO weak pull-up current (Note 4)
MCLR pull-up current
Input Leakage Current (Notes 2, 3)
I/O ports
D061
D063
T0CKI
OSC1
D080
Output Low Voltage
I/O ports
PIC12LC508A/509A (Commercial, Industrial)
PIC12LC518/519 (Commercial, Industrial)
PIC12LCR509A (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified)
Operating temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating voltage VDD range as described in DC spec Section 13.1 and
Section 13.2.
Sym
Min
Typ† Max
Units
Conditions
VIL
VSS
VSS
VSS
VSS
VSS
VSS
VIH
IPUR
IIL
VOL
D080A
Output High Voltage
I/O ports (Note 3)
D090
VOH
D090A
Capacitive Loading Specs on
Output Pins
OSC2 pin
D100
D101
All I/O pins
†
Note 1:
2:
3:
4:
COSC
2
CIO
-
0.25VDD + 0.8V
2.0V
0.8VDD
0.8VDD
0.7VDD
0.9VDD
30
250
-
0.8V
0.15VDD
0.2VDD
0.2VDD
0.2VDD
0.3VDD
V
V
V
V
V
V
For 4.5V ≤ VDD ≤ 5.5V
otherwise
VDD
V
4.5V ≤ VDD ≤ 5.5V
VDD
VDD
VDD
VDD
VDD
400
30
V
V
V
V
V
µA
µA
otherwise
For entire VDD range
Vss ≤ VPIN ≤ VDD, Pin at hi-impedance
Vss ≤ VPIN ≤ VDD
Vss ≤ VPIN ≤ VDD, XT and LP osc
configuration
-
-
+1
µA
-
-
+5
+5
µA
µA
-
-
0.6
V
-
-
0.6
V
VDD - 0.7
-
-
V
VDD - 0.7
-
-
V
-
-
15
pF
-
-
50
pF
Note 1
Note 1
Note 1
VDD = 5V, VPIN = VSS
VDD = 5V, VPIN = VSS
IOL = 8.5 mA, VDD = 4.5V,
–40°C to +85°C
IOL = 7.0 mA, VDD = 4.5V,
–40°C to +125°C
IOH = -3.0 mA, VDD = 4.5V,
–40°C to +85°C
IOH = -2.5 mA, VDD = 4.5V,
–40°C to +125°C
In XT and LP modes when external clock is used to drive OSC1.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC12C5XX be driven with external clock in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
Negative current is defined as coming out of the pin.
This spec. applies when GP3/MCLR is configured as MCLR. The leakage current of the MCLR circuit is higher than the
standard I/O logic.
 1999 Microchip Technology Inc.
DS40139E-page 83
PIC12C5XX
TABLE 13-1:
VDD (Volts)
PULL-UP RESISTOR RANGES* - PIC12C508A, PIC12C509A, PIC12CR509A,
PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
Temperature (°C)
Min
Typ
Max
Units
42K
48K
49K
55K
17K
20K
22K
24K
63K
63K
63K
63K
20K
23K
25K
28K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
346K
414K
457K
504K
292K
341K
371K
407K
417K
532K
532K
593K
360K
437K
448K
500K
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
GP0/GP1
2.5
5.5
–40
25
85
125
–40
25
85
125
38K
42K
42K
50K
15K
18K
19K
22K
–40
25
85
125
–40
25
85
125
285K
343K
368K
431K
247K
288K
306K
351K
GP3
2.5
5.5
*
These parameters are characterized but not tested.
DS40139E-page 84
 1999 Microchip Technology Inc.
PIC12C5XX
13.5
Timing Parameter Symbology and Load Conditions - PIC12C508A, PIC12C509A,
PIC12CR509A, PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F
Frequency
T
Time
MCLR
Lowercase subscripts (pp) and their meanings:
pp
2
to
mc
ck
CLKOUT
osc
oscillator
cy
cycle time
os
OSC1
drt
device reset timer
t0
T0CKI
io
I/O port
wdt
watchdog timer
Period
Uppercase letters and their meanings:
S
F
Fall
P
H
High
R
Rise
I
Invalid (Hi-impedance)
V
Valid
L
Low
Z
Hi-impedance
FIGURE 13-1: LOAD CONDITIONS - PIC12C508A/C509A, PIC12CE518/519, PIC12LC508A/509A,
PIC12LCE518/519, PIC12LCR509A
Pin
CL = 50 pF for all pins except OSC2
CL
VSS
 1999 Microchip Technology Inc.
15 pF for OSC2 in XT, HS or LP
modes when external clock
is used to drive OSC1
DS40139E-page 85
PIC12C5XX
13.6
Timing Diagrams and Specifications
FIGURE 13-2: EXTERNAL CLOCK TIMING - PIC12C508A, PIC12C509A, PIC12CR509A,
PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
Q4
Q1
Q3
Q2
Q4
Q1
OSC1
1
3
3
4
4
2
TABLE 13-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508A, PIC12C509A,
PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
AC Characteristics
Parameter
No.
Sym
FOSC
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial),
–40°C ≤ TA ≤ +85°C (industrial),
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 13.1
Characteristic
TOSC
2
4
Tcy
DC
DC
Max
Units
Conditions
—
4
MHz
XT osc mode
—
200
kHz
LP osc mode
DC
—
4
MHz
EXTRC osc mode
0.1
—
4
MHz
XT osc mode
DC
—
200
kHz
LP osc mode
External CLKIN Period(2)
Oscillator Period(2)
3
Typ(1)
External CLKIN Frequency(2)
Oscillator Frequency(2)
1
Min
Instruction Cycle Time(3)
TosL, TosH Clock in (OSC1) Low or High Time
TosR, TosF Clock in (OSC1) Rise or Fall Time
250
—
—
ns
XT osc mode
5
—
—
ms
LP osc mode
250
—
—
ns
EXTRC osc mode
250
—
10,000
ns
XT osc mode
5
—
—
ms
LP osc mode
—
4/FOSC
—
—
50*
—
—
ns
2*
—
—
ms
LP oscillator
—
—
25*
ns
XT oscillator
—
—
50*
ns
LP oscillator
XT oscillator
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable
oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS40139E-page 86
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 13-3:
CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508A, PIC12C509A,
PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
AC Characteristics
Parameter
No.
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial),
–40°C ≤ TA ≤ +85°C (industrial),
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 10.1
Min*
Typ(1)
Internal Calibrated RC Frequency
3.65
4.00
4.28
MHz VDD = 5.0V
Internal Calibrated RC Frequency
3.55
—
4.31
MHz VDD = 2.5V
Sym
Characteristic
Max* Units
Conditions
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
 1999 Microchip Technology Inc.
DS40139E-page 87
PIC12C5XX
FIGURE 13-3:
I/O TIMING - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A,
PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
Q1
Q4
Q2
Q3
OSC1
I/O Pin
(input)
17
I/O Pin
(output)
18
19
New Value
Old Value
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 13-4:
TIMING REQUIREMENTS - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519,
PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
AC Characteristics
Parameter
No.
Sym
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 13.1
Characteristic
Min
Typ(1)
Max
Units
—
—
100*
ns
17
TosH2ioV
OSC1↑ (Q1 cycle) to Port out valid
18
TosH2ioI
OSC1↑ (Q2 cycle) to Port input invalid
(I/O in hold time)
TBD
—
—
ns
19
TioV2osH
Port input valid to OSC1↑
(I/O in setup time)
TBD
—
—
ns
20
TioR
Port output rise time(2, 3)
—
10
25**
ns
21
TioF
—
10
25**
ns
(3)
Port output fall time
(2, 3)
* These parameters are characterized but not tested.
** These parameters are design targets and are not tested. No characterization data available at this time.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
2: Measurements are taken in EXTRC mode.
3: See Figure 13-1 for loading conditions.
DS40139E-page 88
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 13-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A,
PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Timeout
(Note 2)
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
2: Runs in MCLR or WDT reset only in XT and LP modes.
TABLE 13-5:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508A,
PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A,
PIC12LCR509A, PIC12LCE518 and PIC12LCE519
AC Characteristics Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 13.1
Parameter
No.
Sym
Characteristic
30
TmcL
MCLR Pulse Width (low)
31
Twdt
Watchdog Timer Time-out Period
(No Prescaler)
32
TDRT
34
TioZ
Min
Typ(1)
Max
Units
Conditions
2000*
—
—
ns
VDD = 5 V
9*
18*
30*
ms
VDD = 5 V (Commercial)
Device Reset Timer Period(2)
9*
18*
30*
ms
VDD = 5 V (Commercial)
I/O Hi-impedance from MCLR Low
—
—
2000*
ns
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 2: See Table 13-6.
 1999 Microchip Technology Inc.
DS40139E-page 89
PIC12C5XX
TABLE 13-6:
DRT (DEVICE RESET TIMER PERIOD) - PIC12C508A, PIC12C509A, PIC12CE518,
PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and
PIC12LCE519
Oscillator Configuration
IntRC & ExtRC
POR Reset
Subsequent Resets
(1)
300 µs (typical)(1)
(1)
18 ms (typical)(1)
18 ms (typical)
XT & LP
18 ms (typical)
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
FIGURE 13-5: TIMER0 CLOCK TIMINGS - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519,
PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
T0CKI
40
41
42
TABLE 13-7:
TIMER0 CLOCK REQUIREMENTS - PIC12C508A, PIC12C509A, PIC12CE518,
PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and
PIC12LCE519
AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 13.1.
Parameter
Sym Characteristic
No.
Min
40
Tt0H T0CKI High Pulse Width - No Prescaler
41
Tt0L
- With Prescaler
T0CKI Low Pulse Width - No Prescaler
- With Prescaler
42
Tt0P T0CKI Period
Typ(1) Max Units Conditions
0.5 TCY + 20*
—
—
ns
ns
10*
—
—
0.5 TCY + 20*
—
—
ns
10*
—
—
ns
20 or TCY + 40*
N
—
—
ns
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DS40139E-page 90
 1999 Microchip Technology Inc.
PIC12C5XX
TABLE 13-8:
EEPROM MEMORY BUS TIMING REQUIREMENTS - PIC12CE5XX ONLY.
AC Characteristics
Parameter
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0°C ≤ TA ≤ +70°C, Vcc = 3.0V to 5.5V (commercial)
–40°C ≤ TA ≤ +85°C, Vcc = 3.0V to 5.5V (industrial)
–40°C ≤ TA ≤ +125°C, Vcc = 4.5V to 5.5V (extended)
Operating Voltage VDD range is described in Section 13.1
Symbol
Min
Max
Units
Clock frequency
FCLK
—
—
—
100
100
400
kHz
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock high time
THIGH
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock low time
TLOW
4700
4700
1300
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
TR
—
—
—
1000
1000
300
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time
(Note 1)
Conditions
TF
—
300
ns
(Note 1)
START condition hold time
THD:STA
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
START condition setup time
TSU:STA
4700
4700
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time
Data input hold time
THD:DAT
0
—
ns
(Note 2)
Data input setup time
TSU:DAT
250
250
100
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
STOP condition setup time
TSU:STO
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
TAA
—
—
—
3500
3500
900
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must
be free before a new transmission can start
TBUF
4700
4700
1300
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
3.0V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Output fall time from VIH
minimum to VIL maximum
TOF
20+0.1
CB
250
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression
(SDA and SCL pins)
TSP
—
50
ns
(Notes 1, 3)
Write cycle time
TWC
Output valid from clock
(Note 2)
Endurance
—
4
ms
1M
—
cycles
25°C, VCC = 5.0V, Block Mode (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on Microchip’s website.
 1999 Microchip Technology Inc.
DS40139E-page 91
PIC12C5XX
NOTES:
DS40139E-page 92
 1999 Microchip Technology Inc.
PIC12C5XX
14.0
DC AND AC CHARACTERISTICS - PIC12C508A/PIC12C509A/
PIC12LC508A/PIC12LC509A, PIC12CE518/PIC12CE519/PIC12CR509A/
PIC12LCE518/PIC12LCE519/ PIC12LCR509A
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables
the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information
only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 14-1: CALIBRATED INTERNAL RC
FREQUENCY RANGE VS.
TEMPERATURE (VDD = 5.0V)
(INTERNAL RC IS
CALIBRATED TO 25°C, 5.0V)
4.50
4.50
4.40
4.40
4.30
4.30
4.20
4.10
4.00
3.90
4.10
4.00
3.90
3.80
3.80
Min.
3.70
3.70
3.60
3.60
3.50
-40
Max.
4.20
Max.
Frequency (MHz)
Frequency (MHz)
FIGURE 14-2: CALIBRATED INTERNAL RC
FREQUENCY RANGE VS.
TEMPERATURE (VDD = 2.5V)
(INTERNAL RC IS
CALIBRATED TO 25°C, 5.0V)
0
25
85
Temperature (Deg.C)
 1999 Microchip Technology Inc.
125
3.50
-40
Min.
0
25
85
125
Temperature (Deg.C)
DS40139E-page 93
PIC12C5XX
TABLE 14-1:
DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25°C
Oscillator
Frequency
VDD =3.0V
External RC
4 MHz
240 µA*
Internal RC
4 MHz
320 µA
XT
4 MHz
300 µA
LP
32 KHz
19 µA
*Does not include current through external R&C.
800 µA*
800 µA
800 µA
50 µA
FIGURE 14-4: TYPICAL IDD VS. FREQUENCY
(WDT DIS, 25°C, VDD = 5.5V)
600
600
550
550
500
500
450
450
400
400
350
350
IDD (µA)
IDD (µA)
FIGURE 14-3: TYPICAL IDD VS. VDD
(WDT DIS, 25°C, FREQUENCY
= 4MHZ)
VDD = 5.5V
300
300
250
250
200
200
150
150
100
100
0
0
2.5
3.0
4.5
VDD (Volts)
DS40139E-page 94
5.0
5.5
0
.5
1.0
1.5
2.0
2.5
3.0
3.5 4.0
Frequency (MHz)
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 14-7: IOH vs. VOH, VDD = 2.5 V
FIGURE 14-5: WDT TIMER TIME-OUT
PERIOD vs. VDD
55
-0
50
-1
-2
45
-3
-4
35
Max +125°C
IOH (mA)
WDT period (µS)
40
30
Min +125°C
Min +85°C
-5
-6
Typ +25°C
Max +85°C
-7
25
-8
20
Typ +25°C
-9
15
Max -40°C
-10
MIn –40°C
.5 .75 1.0 1.25 1.5 1.75 2.0 2.25 2.5
10
0
2.5
3.5
4.5
5.5
VOH (Volts)
6.5
VDD (Volts)
FIGURE 14-6: SHORT DRT PERIOD VS. VDD
FIGURE 14-8: IOH vs. VOH, VDD = 3.5 V
950
0
850
-5
IOH (mA)
750
WDT period (µs)
650
Min +125°C
-10
Min +85°C
550
Max +125°C
450
-15
Max +85°C
Typ +25°C
Max -40°C
-20
350
Typ +25°C
-25
250
1.5
2.0
2.5
3.0
3.5
MIn –40°C
VOH (Volts)
150
0
0
2.5
3.5
4.5
5.5
6.5
VDD (Volts)
 1999 Microchip Technology Inc.
DS40139E-page 95
PIC12C5XX
FIGURE 14-9: IOL vs. VOL, VDD = 2.5 V
FIGURE 14-11: IOH vs. VOH, VDD = 5.5 V
35
0
-5
30
Max -40°C
-10
25
20
Typ +25°C
IOH (mA)
IOL (mA)
-15
15
Mi
n+
C
5°
12
°C
85
n+
Mi
°C
25
p+
Ty
-20
-25
10
–4
0°
C
Min +85°C
M
ax
-30
Min +125°C
5
-35
-40
0
0
0.25
0.5
0.75
3.5
1.0
4.0
4.5
5.0
5.5
VOH (Volts)
VOL (Volts)
FIGURE 14-12: IOL vs. VOL, VDD = 5.5 V
FIGURE 14-10: IOL vs. VOL, VDD = 3.5 V
45
55
Max -40°C
Max -40°C
50
40
45
35
40
30
35
25
Typ +25°C
IOL (mA)
IOL (mA)
Typ +25°C
20
30
25
Min +85°C
20
15
Min +85°C
15
Min +125°C
10
Min +125°C
10
0
0
0
0.25
0.5
VOL (Volts)
DS40139E-page 96
0.75
1.0
0
0.25
0.5
0.75
1.0
VOL (Volts)
 1999 Microchip Technology Inc.
PIC12C5XX
FIGURE 14-13: TYPICAL IPD VS. VDD,
WATCHDOG DISABLED (25°C)
1.8
250
1.6
VTH (Volts)
260
240
Ipd (nA)
FIGURE 14-14: VTH (INPUT THRESHOLD
VOLTAGE) OF GPIO PINS
VS. VDD
Max (-40 to 125)
1.4
230
1.2
220
1.0
210
0.8
Typ (25)
Min (-40 to 125)
200
2.5
0.6
3.0
3.5
4.5
VDD (Volts)
5.0
5.5
0
2.5
3.5
4.5
5.5
VDD (Volts)
 1999 Microchip Technology Inc.
DS40139E-page 97
PIC12C5XX
FIGURE 14-15: VIL, VIH OF NMCLR, AND T0CKI VS. VDD
3.5
Vih Max (-40 to 125)
VIH Typ (25)
VIH Min (-40 to 125)
VIL, VIH (Volts)
3.0
2.5
2.0
VIL Max (-40 to 125)
1.5
VIL Typ (25)
VIL Min (-40 to 125)
1.0
0.5
2.5
3.5
4.5
5.5
VDD (Volts)
DS40139E-page 98
 1999 Microchip Technology Inc.
PIC12C5XX
15.0
PACKAGING INFORMATION
15.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXCDE
AABB
12C508A
04I/PSAZ
9825
8-Lead SOIC (150 mil)
XXXXXXX
9825
8-Lead SOIC (208 mil)
XXXXXXX
XXXXXXX
AABBCDE
Example
12C508A
04I/SM
9824SAZ
8-Lead Windowed Ceramic Side Brazed (300 mil)
Example
JW
XXX
12C508A
XXXXXX
Legend: MM...M
XX...X
AA
BB
C
D
E
*
Example
C508A
AABB
Note:
Example
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
 1999 Microchip Technology Inc.
DS40139E-page 99
PIC12C5XX
Package Type:
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
E
D
2
1
n
α
E1
A
A1
R
L
c
A2
β
B1
p
eB
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
B
INCHES*
NOM
0.300
8
0.100
0.018
0.014
0.060
0.055
0.005
0.000
0.012
0.006
0.150
0.140
0.080
0.060
0.020
0.005
0.130
0.120
0.370
0.355
0.250
0.245
0.280
0.267
0.310
0.342
5
10
5
10
MIN
n
p
B
B1†
R
c
A
A1
A2
L
D‡
E‡
E1
eB
α
β
MAX
0.022
0.065
0.010
0.015
0.160
0.100
0.035
0.140
0.385
0.260
0.292
0.380
15
15
MILLIMETERS
NOM
MAX
7.62
8
2.54
0.36
0.56
0.46
1.40
1.65
1.52
0.00
0.25
0.13
0.20
0.29
0.38
3.81
3.56
4.06
2.03
1.52
2.54
0.51
0.13
0.89
3.30
3.05
3.56
9.40
9.02
9.78
6.35
6.22
6.60
7.10
6.78
7.42
7.87
8.67
9.65
5
10
15
5
10
15
MIN
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS40139E-page 100
 1999 Microchip Technology Inc.
PIC12C5XX
Package Type:
K04-057 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil
E1
E
p
D
2
B
n
1
α
X
45 °
L
R2
c
A
φ
R1
β
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Chamfer Distance
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
L1
A2
INCHES*
NOM
0.050
8
0.054
0.061
0.027
0.035
0.004
0.007
0.189
0.193
0.150
0.154
0.229
0.237
0.010
0.015
0.005
0.005
0.005
0.005
0.011
0.016
0
4
0.000
0.005
0.008
0.009
0.014
0.017
0
12
0
12
MIN
p
n
A
A1
A2
D‡
E‡
E1
X
R1
R2
L
φ
L1
c
B†
α
β
A1
MAX
0.069
0.044
0.010
0.196
0.157
0.244
0.020
0.010
0.010
0.021
8
0.010
0.010
0.020
15
15
MILLIMETERS
NOM
MAX
1.27
8
1.37
1.56
1.75
0.69
0.90
1.11
0.10
0.18
0.25
4.80
4.89
4.98
3.90
3.99
3.81
5.82
6.01
6.20
0.25
0.38
0.51
0.13
0.13
0.25
0.13
0.13
0.25
0.28
0.41
0.53
0
4
8
0.00
0.13
0.25
0.19
0.22
0.25
0.36
0.43
0.51
0
12
15
0
12
15
MIN
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
 1999 Microchip Technology Inc.
DS40139E-page 101
PIC12C5XX
Package Type:
K04-056 8-Lead Plastic Small Outline (SM) – Medium, 208 mil
E1
E
p
D
2
n
1
B
α
L
R2
c
A
φ
R1
L1
β
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
INCHES*
NOM
0.050
8
0.070
0.074
0.037
0.042
0.005
0.002
0.200
0.205
0.203
0.208
0.300
0.313
0.005
0.005
0.005
0.005
0.011
0.016
0
4
0.010
0.015
0.008
0.009
0.014
0.017
0
12
0
12
MIN
p
n
A
A1
A2
D‡
E‡
E1
R1
R2
L
φ
L1
c
B†
α
β
A1
A2
MAX
0.079
0.048
0.009
0.210
0.213
0.325
0.010
0.010
0.021
8
0.020
0.010
0.020
15
15
MILLIMETERS
NOM
MAX
1.27
8
1.78
1.89
2.00
0.94
1.08
1.21
0.14
0.22
0.05
5.08
5.21
5.33
5.16
5.28
5.41
7.62
7.94
8.26
0.13
0.13
0.25
0.13
0.25
0.13
0.28
0.41
0.53
0
4
8
0.38
0.51
0.25
0.19
0.22
0.25
0.36
0.43
0.51
0
12
15
0
12
15
MIN
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS40139E-page 102
 1999 Microchip Technology Inc.
PIC12C5XX
Package Type:
K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E
W
T
D
2
n
1
U
A
A1
L
A2
c
B1
p
eB
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Lead Thickness
Top to Seating Plane
Top of Body to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Package Width
Overall Row Spacing
Window Diameter
Lid Length
Lid Width
B
MIN
n
p
B
B1
c
A
A1
A2
L
D
E
eB
W
T
U
0.098
0.016
0.050
0.008
0.145
0.103
0.025
0.130
0.510
0.280
0.310
0.161
0.440
0.260
INCHES*
NOM
0.300
8
0.100
0.018
0.055
0.010
0.165
0.123
0.035
0.140
0.520
0.290
0.338
0.166
0.450
0.270
MAX
0.102
0.020
0.060
0.012
0.185
0.143
0.045
0.150
0.530
0.300
0.365
0.171
0.460
0.280
MILLIMETERS
NOM
MAX
7.62
8
2.49
2.54
2.59
0.41
0.46
0.51
1.27
1.40
1.52
0.20
0.25
0.30
3.68
4.19
4.70
2.62
3.12
3.63
0.64
0.89
1.14
3.30
3.56
3.81
12.95
13.21
13.46
7.11
7.37
7.62
7.87
9.27
8.57
4.34
4.09
4.22
11.18
11.43
11.68
6.60
6.86
7.11
MIN
* Controlling Parameter.
 1999 Microchip Technology Inc.
DS40139E-page 103
PIC12C5XX
NOTES:
DS40139E-page 104
 1999 Microchip Technology Inc.
PIC12C5XX
INDEX
A
ALU ....................................................................................... 9
Applications........................................................................... 4
Architectural Overview .......................................................... 9
Assembler
MPASM Assembler..................................................... 61
B
Block Diagram
On-Chip Reset Circuit ................................................. 41
Timer0......................................................................... 25
TMR0/WDT Prescaler................................................. 28
Watchdog Timer.......................................................... 43
Brown-Out Protection Circuit .............................................. 44
O
OPTION Register................................................................ 17
OSC selection..................................................................... 35
OSCCAL Register............................................................... 18
Oscillator Configurations..................................................... 36
Oscillator Types
HS............................................................................... 36
LP ............................................................................... 36
RC .............................................................................. 36
XT ............................................................................... 36
P
CAL0 bit .............................................................................. 18
CAL1 bit .............................................................................. 18
CAL2 bit .............................................................................. 18
CAL3 bit .............................................................................. 18
CALFST bit ......................................................................... 18
CALSLW bit ........................................................................ 18
Carry ..................................................................................... 9
Clocking Scheme ................................................................ 12
Code Protection ............................................................ 35, 45
Configuration Bits................................................................ 35
Configuration Word ............................................................. 35
Package Marking Information............................................. 99
Packaging Information........................................................ 99
PICDEM-1 Low-Cost PICmicro Demo Board ..................... 60
PICDEM-2 Low-Cost PIC16CXX Demo Board................... 60
PICDEM-3 Low-Cost PIC16CXXX Demo Board ................ 60
PICSTART Plus Entry Level Development System ......... 59
POR
Device Reset Timer (DRT) ................................... 35, 42
PD............................................................................... 44
Power-On Reset (POR).............................................. 35
TO............................................................................... 44
PORTA ............................................................................... 21
Power-Down Mode ............................................................. 45
Prescaler ............................................................................ 28
PRO MATE II Universal Programmer .............................. 59
Program Counter ................................................................ 19
D
Q
DC and AC Characteristics ........................................... 75, 93
Development Support ......................................................... 59
Development Tools ............................................................. 59
Device Varieties .................................................................... 7
Digit Carry ............................................................................. 9
Q cycles.............................................................................. 12
C
E
EEPROM Peripheral Operation .......................................... 29
Errata .................................................................................... 3
F
Family of Devices.................................................................. 5
Features ................................................................................ 1
FSR ..................................................................................... 20
Fuzzy Logic Dev. System (fuzzyTECH-MP) .................... 61
I
I/O Interfacing ..................................................................... 21
I/O Ports .............................................................................. 21
I/O Programming Considerations........................................ 22
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............ 59
ID Locations .................................................................. 35, 45
INDF.................................................................................... 20
Indirect Data Addressing..................................................... 20
Instruction Cycle ................................................................. 12
Instruction Flow/Pipelining .................................................. 12
Instruction Set Summary..................................................... 48
K
KeeLoq Evaluation and Programming Tools.................... 62
L
Loading of PC ..................................................................... 19
M
Memory Organization.......................................................... 13
Data Memory .............................................................. 14
Program Memory ........................................................ 13
MPLAB Integrated Development Environment Software .... 61
R
RC Oscillator....................................................................... 37
Read Modify Write .............................................................. 22
Register File Map................................................................ 14
Registers
Special Function ......................................................... 15
Reset .................................................................................. 35
Reset on Brown-Out ........................................................... 44
S
SEEVAL Evaluation and Programming System .............. 61
SLEEP .......................................................................... 35, 45
Software Simulator (MPLAB-SIM) ...................................... 61
Special Features of the CPU .............................................. 35
Special Function Registers................................................. 15
Stack................................................................................... 19
STATUS ............................................................................... 9
STATUS Register ............................................................... 16
T
Timer0
Switching Prescaler Assignment ................................ 28
Timer0 ........................................................................ 25
Timer0 (TMR0) Module .............................................. 25
TMR0 with External Clock .......................................... 27
Timing Diagrams and Specifications ............................ 70, 86
Timing Parameter Symbology and Load Conditions .... 69, 85
TRIS Registers ................................................................... 21
W
Wake-up from SLEEP......................................................... 45
Watchdog Timer (WDT)................................................ 35, 42
Period ......................................................................... 43
Programming Considerations ..................................... 43
WWW, On-Line Support ....................................................... 3
Z
Zero bit ................................................................................. 9
 1999 Microchip Technology Inc.
DS40139E-page 105
PIC12C5XX
DS40139E-page 106
 1999 Microchip Technology Inc.
PIC12C5XX
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.
Connecting to the Microchip Internet Web Site
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip’s development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-602-786-7302 for the rest of the world.
981103
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User’s Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems, technical information and more
• Listing of seminars and events
 1999 Microchip Technology Inc.
Trademarks: The Microchip name, logo, PIC, PICmicro,
PICSTART, PICMASTER and PRO MATE are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries. FlexROM, MPLAB and fuzzyLAB are trademarks and SQTP is a service mark of Microchip in the U.S.A.
All other trademarks mentioned herein are the property of
their respective companies.
DS40139E-page 107
PIC12C5XX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: PIC12C5XX
Y
N
Literature Number: DS40139E
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
DS40139E-page 108
 1999 Microchip Technology Inc.
PIC12C5XX
PIC12C5XX Product Identification System
Examples
PART NO. -XX X /XX XXX
Pattern:
Special Requirements
Package:
SN
SM
P
JW
=
=
=
=
Temperature
Range:
I
E
= 0°C to +70°C
= -40°C to +85°C
= -40°C to +125°C
Frequency
Range:
04
= 4 MHz
Device
PIC12C508
PIC12C509
PIC12C508T (Tape & reel for SOIC only)
PIC12C509T (Tape & reel for SOIC only)
PIC12C508A
PIC12C509A
PIC12C508AT (Tape & reel for SOIC only)
PIC12C509AT (Tape & reel for SOIC only)
PIC12LC508A
PIC12LC509A
PIC12LC508AT (Tape & reel for SOIC only)
PIC12LC509AT (Tape & reel for SOIC only)
PIC12CR509A
PIC12CR509AT (Tape & reel for SOIC only)
PIC12LCR509A
PIC12LCR509AT (Tape & reel for SOIC only)
PIC12CE518
PIC12CE518T (Tape & reel for SOIC only)
PIC12CE519
PIC12CE519T (Tape & reel for SOIC only)
PIC12LCE518
PIC12LCE518T (Tape & reel for SOIC only)
PIC12LCE519
PIC12LCE519T (Tape & reel for SOIC only)
a)
150 mil SOIC
208 mil SOIC
300 mil PDIP
300 mil Windowed Ceramic Side Brazed b)
c)
PIC12C508A-04/P
Commercial Temp.,
PDIP Package, 4 MHz,
normal VDD limits
PIC12C508A-04I/SM
Industrial Temp., SOIC
package, 4 MHz, normal
VDD limits
PIC12C509-04I/P
Industrial Temp.,
PDIP package, 4 MHz,
normal VDD limits
Please contact your local sales office for exact ordering procedures.
Sales and Support:
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 1999 Microchip Technology Inc.
DS40139E-page 109
PIC12C5XX
NOTES:
DS40139E-page 110
 1999 Microchip Technology Inc.
PIC12C5XX
NOTES:
 1999 Microchip Technology Inc.
DS40139E-page 111
WORLDWIDE SALES AND SERVICE
AMERICAS
AMERICAS (continued)
Corporate Office
Toronto
Singapore
Microchip Technology Inc.
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-786-7200 Fax: 480-786-7277
Technical Support: 480-786-7627
Web Address: http://www.microchip.com
Microchip Technology Inc.
5925 Airport Road, Suite 200
Mississauga, Ontario L4V 1W1, Canada
Tel: 905-405-6279 Fax: 905-405-6253
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore 188980
Tel: 65-334-8870 Fax: 65-334-8850
Atlanta
Microchip Asia Pacific
Unit 2101, Tower 2
Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2-401-1200 Fax: 852-2-401-3431
Microchip Technology Inc.
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
Microchip Technology Inc.
5 Mount Royal Avenue
Marlborough, MA 01752
Tel: 508-480-9990 Fax: 508-480-8575
Chicago
Microchip Technology Inc.
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
Microchip Technology Inc.
4570 Westgrove Drive, Suite 160
Addison, TX 75248
Tel: 972-818-7423 Fax: 972-818-2924
Dayton
Microchip Technology Inc.
Two Prestige Place, Suite 150
Miamisburg, OH 45342
Tel: 937-291-1654 Fax: 937-291-9175
Detroit
Microchip Technology Inc.
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Los Angeles
Microchip Technology Inc.
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
New York
Microchip Technology Inc.
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
ASIA/PACIFIC
Hong Kong
ASIA/PACIFIC (continued)
Taiwan, R.O.C
Microchip Technology Taiwan
10F-1C 207
Tung Hua North Road
Taipei, Taiwan, ROC
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Beijing
United Kingdom
Microchip Technology, Beijing
Unit 915, 6 Chaoyangmen Bei Dajie
Dong Erhuan Road, Dongcheng District
New China Hong Kong Manhattan Building
Beijing 100027 PRC
Tel: 86-10-85282100 Fax: 86-10-85282104
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5858 Fax: 44-118 921-5835
India
Denmark
Microchip Technology Inc.
India Liaison Office
No. 6, Legacy, Convent Road
Bangalore 560 025, India
Tel: 91-80-229-0061 Fax: 91-80-229-0062
Microchip Technology Denmark ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
Japan
France
Microchip Technology Intl. Inc.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa 222-0033 Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Arizona Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Korea
Germany
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Arizona Microchip Technology GmbH
Gustav-Heinemann-Ring 125
D-81739 München, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Shanghai
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology
RM 406 Shanghai Golden Bridge Bldg.
2077 Yan’an Road West, Hong Qiao District
Shanghai, PRC 200335
Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
Italy
11/15/99
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.
All rights reserved. © 1999 Microchip Technology Incorporated. Printed in the USA. 11/99
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed
by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products
as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip
logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
 1999 Microchip Technology Inc.
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement