elektronik_pic16c712_716 369 KB

elektronik_pic16c712_716 369 KB
PIC16C712/716
PIC16C712/716 Rev. A Silicon/Data Sheet Errata
The PIC16C712/716 parts you have received conform
functionally to the Device Data Sheet (DS41106A),
except for the anomalies described below.
Note:
The problem here will be addressed in future revisions
of the PIC16C712/716 silicon.
1.
The TCCP bit of the TRISCCP register
functions as described in Figure 7-2 of the
Device Data Sheet, when using the
MPLAB® ICE 2000 in-circuit emulator
Module: CCP
Work around
When using the PIC16C712/716 in the Compare
or PWM mode, the TCCP bit of the TRISCCP
register will not tristate the output on pin RB3, as
described in Figure 7-2 of the Device Data Sheet.
The TCCP bit of the TRISCCP register has no
effect on the output of pin RB3.
There is no way to tristate the output on pin RB3 in
the Compare or PWM mode. However, there are
steps you can do in firmware to stop the RB3 pin
from changing and leave it in a known state.
Examples are shown below.
EXAMPLE 1:
(Assumes that the T2CON and CCP1CON values are determined at assembly time and remain fixed.)
Software License Agreement
The software supplied herewith by Microchip Technology Incorporated (the “Company”) is intended and supplied to you, the Company’s customer, for use solely and exclusively with products manufactured by the Company.
The software is owned by the Company and/or its supplier, and is protected under applicable copyright laws. All rights are reserved.
Any use in violation of the foregoing restrictions may subject the user to criminal sanctions under applicable laws, as well as to civil
liability for the breach of the terms and conditions of this license.
THIS SOFTWARE IS PROVIDED IN AN “AS IS” CONDITION. NO WARRANTIES, WHETHER EXPRESS, IMPLIED OR STATUTORY, INCLUDING, BUT NOT LIMITED TO, IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE APPLY TO THIS SOFTWARE. THE COMPANY SHALL NOT, IN ANY CIRCUMSTANCES, BE LIABLE FOR
SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, FOR ANY REASON WHATSOEVER.
Code Example 1A:
;***********************************************************************
;
Call these routines to turn the PWM off or on and ensure a Zero output on RB3
;
when PWM is off.
;
;
PWMreset - Clear T2CON Disabling Timer2 and Clearing Timer 2 Prescaler,
;
then fill the TMR2 register with the CCPR1H value. This will cause
;
a Reset or Zero value on RB3.
;
;
;
;
PWMrestart - Restore the T2CON register with the appropriate value for your
system needs. IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE
THE CORRECT VALUE FOR T2CON.
Assembly Code To Stop PWM Once Started:
PWMreset
bcf
clrf
movf
movwf
return
STATUS,RP0
T2CON
CCPR1H,W
TMR2
 2003 Microchip Technology Inc.
;
;
;
;
Select Bank 0
Clear T2CON, Timer2-Disable & Pre/Post Scalers = 1
Load CCPR1H value in Write register
Move CCPR1H value into TMR2 to cause Reset of RB3 pin
DS80072D-page 1
PIC16C712/716
Assembly Code To Start PWM Once Stopped:
PWMrestart
bcf
movlw
movwf
return
STATUS,RP0
T2CONVAL
T2CON
;
;
;
;
Select Bank 0
Load T2CON value in ‘w’ register - USER RESPONSIBLE FOR
SUPPLYING THE CORRECT T2CON VALUE.
Initialize T2CON enabling scalers and Timer2
Code Example 1B:
;***********************************************************************
;
;
Call these routines to turn the CCP Mode off or on and ensure RB3 is a known
Input or Output value when CCP Mode is off.
;
;
;
;
;
;
CCPstop - First sets RB3 to an Input or an Output. If RB3 is an Output then it’s state is made
either High or Low. The CCP is then Disabled.
CCPstart - Enable CCP Mode. IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE THE CORRECT
VALUE FOR CCP1CON.
Assembly Code To Stop CCP Mode Once Started:
CCPstop
bsf
bcf
STATUS,RP0
TRISB,3
bcf
bcf
STATUS,RP0
PORTB,3
movlw
movwf
return
0x30
CCP1CON
;
;
;
;
;
;
;
;
;
Select Bank 1
RB3 as an Output - set bit TRISB, 3 when RB3
as an Input is desired.
Select Bank 0
RB3 as a Low Level Output - Set bit TRISB,3 for
RB3 to be a High Level
Output.
Load CCP1CON value in Working register
Turn Off CCP1CON all Modes
Assembly Code To Start CCP Mode Once Stopped:
CCPstart
bcf
movlw
movwf
return
DS80072D-page 2
STATUS,RP0
CCP1CONVAL
CCP1CON
;
;
;
;
Select Bank 0
Load CCP1CON value in Working register.
THE USER IS RESPONSIBLE FOR SUPPLYING THE CORRECT CCP1CON VALUE.
Initialize CCP1CON for desired Mode of operation.
 2003 Microchip Technology Inc.
PIC16C712/716
EXAMPLE 2:
(Assumes that the T2CON and CCP1CON values may change during program execution. One SRAM location is used
for temporary storage of T2CON or CCP2CON.)
Code Example 2A:
;***********************************************************************
;
Call these routines to turn the PWM off or on and ensure a Zero output on RB3
;
when PWM is off.
;
;
PWMreset - Saves T2CON value in RAM location. IT IS THE RESPONSIBILITY OF THE USER TO SUPPLY
;
RAM MEMORY SPACE TO SAVE THE T2CON VALUE.
;
Clears T2CON register Disabling Timer2 and clearing Timer2 Prescaler.
;
The TMR2 register is then filled with the CCPR1H value. This causes a Reset
;
or Zero value on RB3.
;
;
PWMrestart - Enable Timer2
Assembly Code To Stop PWM Once Started:
T2CONSAV equ
0x??
; USER RESPONSIBLE FOR SUPPLYING RAM MEMORY SPACE
; TO SAVE T2CON VALUE.
PWMreset
bcf
movf
movwf
clrf
movf
movwf
return
STATUS,RP0
T2CON,W
T2CONSAV
T2CON
CCPR1H,W
TMR2
;
;
;
;
;
;
Select Bank 0
Move T2CON Value to ‘w’ register
Save T2CON register value
Clear T2CON, Timer2-Disable & Pre/Post Scalers=1
Load CCPR1H value in Write register
Move CCPR1H value into TMR2 to cause Reset of RB3 pin
Assembly Code To Start PWM Once Stopped:
PWMrestart
bcf
movf
movwf
return
STATUS,RP0
T2CONSAV,W
T2CON
 2003 Microchip Technology Inc.
; Select Bank 0
; Move T2CONSAV Value to ‘w’ register
; Restore T2CON register value
DS80072D-page 3
PIC16C712/716
Code Example 2B:
;***********************************************************************
;
;
Call these routines to turn the CCP Mode off or on and ensure RB3 is a known
Input or Output value when CCP Mode is off.
;
;
;
;
;
;
CCPstop - First sets RB3 to an Input or an Output. If RB3 is an Output then it’s state
is made either High or Low. The CCP is then Disabled.
CCPstart - Enable CCP Mode. IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE THE CORRECT
VALUE FOR CCP1CON.
Assembly Code To Stop CCP Mode Once Started:
CCP1CONSAV equ 0X??
CCPstop
bsf
bcf
STATUS,RP0
TRISB,3
bcf
bcf
STATUS,RP0
PORTB,3
movf
movwf
movlw
movwf
return
CCP1CON,W
CCP1CONSAV
0x30
CCP1CON
; USER IS RESPONSIBLE FOR SUPPLYING RAM MEMORY SPACE
; TO SAVE CCP2CON VALUE.
;
;
;
;
;
;
;
;
;
;
;
Select Bank 1
RB3 as an Output - set bit TRISB, 3 when RB3
as an Input is desired.
Select Bank 0
RB3 as a Low Level Output - set bit PORTB,3
for RB3 to be a High Level
Output.
Move CCP1CON to ‘W’ register
Save CCP1CON register value
Load CCP1CON value in Working register
Turn Off CCP1CON all Modes
Assembly Code To Start CCP Mode Once Stopped:
CCPstart
bcf
movf
movwf
return
DS80072D-page 4
STATUS,RP0
CCP1CONSAV,W
CCP1CON
; Select Bank 0
; Move CCP1CONSAV value to ‘W’ register
; Restore CCP1CON to desired Mode of operation.
 2003 Microchip Technology Inc.
PIC16C712/716
2.
Module: Timer1
When Timer1 is configured to operate as an
asynchronous counter, care must be taken that
there is no incoming pulse while the module is
being turned off. If an incoming pulse arrives while
Timer1 is being turned off (i.e., TMR1ON transitions from 1 to 0), the value of registers TMR1L
and TMR1H will be unpredictable.
Work around
This solution involves changing Timer1 from
Asynchronous to Synchronous mode before turning off Timer1. No additional resources are
required for this solution.
Timer1 synchronization will start, effectively stopping Timer1, one Q period after the Synchronous
mode is enabled, or one Q period later than would
have been realized by simply clearing the
TMR1ON bit. One additional count, in excess of
the counts accrued during this extra Q period, may
be accumulated before the TMR1ON bit is eventually cleared in the next instruction. The occurrence
of this additional count is dependent on the phase
relationship between OSC1, or the internal system
clock, and T1CKI.
Code Example:
**************************************************************************************
;
Call this routine to stop Timer1 asynchronous counting
;
;
Timer1 is stopped after the timer is changed to synchronous mode
;
The captured timer value resides in TMR1H and TMR1L at the completion of this
;
routine.
TMR1Capture
; entry point
bcf
T1CON,NOT_T1SYNC
; set for synchronous mode
bcf
T1CON,TMR1ON
; stop timer
bsf
T1CON,NOT_T1SYNC
; restore asynchronous mode
return
 2003 Microchip Technology Inc.
; return to calling routine
DS80072D-page 5
PIC16C712/716
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (DS41106A), the following
clarifications and corrections should be noted.
1.
The following register and bit names need the
following corrections:
Page
2.
Where
Occurrence
Data Sheet Name
Correct Name
10
Figure 2-3, Address 0Fh
1
TRM1H
TMR1H
10
Figure 2-3, Address 11h
1
TRM2
TMR2
41
Table 7-2, Address 07h, bit 0
1
TT1CK
DT1CK
44
Table 7-5, Control Bits column
4
TR1SCCP
TRISCCP
Figure 3-4, page 24, of the Device Data Sheet
should show the following block diagram for
RB1/T1OSO/T1CK1:
FIGURE 3-4:
BLOCK DIAGRAM OF RB1/T1OSO/T1CKI PIN
RBPU(1)
T1OSCEN
T1CS
TMR1CS
1
Data Bus
RD
DATACCP
0
DATACCP<0>
D
WR
DATACCP
CK
VDD
Q
Weak
P Pull-up
Q
TRISCCP<0>
D
WR
TRISCCP
CK
1
Q
WR
PORTB
CK
RB1/T1OSO/T1CKI
0
Q
PORTB<1>
D
VDD
1
Q
VSS
0
Q
TRISB<1>
D
WR TRISB
CK
Q
Q
T1OSCEN
TMR1CS
1
TTL Buffer
RD PORTB
0
T1CLKIN
ST
Buffer
Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>).
DS80072D-page 6
 2003 Microchip Technology Inc.
PIC16C712/716
3.
Figure 12-1, page 76, of the Device Data Sheet
should show the following valid region of
operation:
FIGURE 12-5:
PIC16C712/716 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.5
2.0
0
4
20
10
40
30
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
4.
Parameter No. D001, page 77, of the Device
Data Sheet should show the following values:
12.1
DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended)
PIC16C712/716-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Param
No.
D001
D001A
Sym
VDD
Characteristic
Supply Voltage
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0°C ≤ TA ≤ +70°C for commercial
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Min
Typ†
Max
Unit
s
4.0
4.5
—
—
—
5.5
5.5
5.5
V
V
V
VBOR*
 2003 Microchip Technology Inc.
Conditions
XT, RC and LP osc mode
HS osc mode
BOR enabled(7)
DS80072D-page 7
PIC16C712/716
5.
Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
α
1
E
A2
A
L
c
A1
B1
β
p
B
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
18
.100
.155
.130
MAX
MILLIMETERS
NOM
18
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
22.61
22.80
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.890
.898
.905
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
eB
Overall Row Spacing
§
.310
.370
.430
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
DS80072D-page 8
MAX
4.32
3.68
8.26
6.60
22.99
3.43
0.38
1.78
0.56
10.92
15
15
 2003 Microchip Technology Inc.
PIC16C712/716
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
p
E1
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.093
.088
.004
.394
.291
.446
.010
.016
0
.009
.014
0
0
A1
INCHES*
NOM
18
.050
.099
.091
.008
.407
.295
.454
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.462
.029
.050
8
.012
.020
15
15
MILLIMETERS
NOM
18
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
11.33
11.53
0.25
0.50
0.41
0.84
0
4
0.23
0.27
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
11.73
0.74
1.27
8
0.30
0.51
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
 2003 Microchip Technology Inc.
DS80072D-page 9
PIC16C712/716
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
E1
D
W2
2
n
1
W1
E
A2
A
c
L
A1
eB
B1
p
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
§
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
DS80072D-page 10
A
A2
A1
E
E1
D
L
c
B1
B
eB
W1
W2
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
18
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.021
.425
.150
.210
MILLIMETERS
NOM
18
2.54
4.32
4.64
3.94
4.06
0.38
0.57
7.62
7.94
7.24
7.37
22.35
22.86
3.18
3.49
0.20
0.25
1.27
1.40
0.41
0.47
8.76
9.78
3.30
3.56
4.83
5.08
MIN
MAX
4.95
4.19
0.76
8.26
7.49
23.37
3.81
0.30
1.52
0.53
10.80
3.81
5.33
 2003 Microchip Technology Inc.
PIC16C712/716
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E
E1
p
D
B
2
1
n
α
c
A2
A
φ
L
A1
β
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
c
φ
B
α
β
MIN
.068
.064
.002
.299
.201
.278
.022
.004
0
.010
0
0
INCHES*
NOM
20
.026
.073
.068
.006
.309
.207
.284
.030
.007
4
.013
5
5
MAX
.078
.072
.010
.322
.212
.289
.037
.010
8
.015
10
10
MILLIMETERS
NOM
20
0.65
1.73
1.85
1.63
1.73
0.05
0.15
7.59
7.85
5.11
5.25
7.06
7.20
0.56
0.75
0.10
0.18
0.00
101.60
0.25
0.32
0
5
0
5
MIN
MAX
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
203.20
0.38
10
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
 2003 Microchip Technology Inc.
DS80072D-page 11
PIC16C712/716
APPENDIX A:
REVISION HISTORY
Rev. A Document (6/2000)
First revision of this document.
Rev. B Document (4/2001)
Added issue 1 (CCP), page 1, and issue 2 (Timer1),
page 5.
Rev. C Document (1/2002)
Under Clarifications/Corrections to the Data Sheet,
Item 5 (SSOP), on page 8 was added.
Rev. D Document (3/2003)
Under Clarifications/Corrections to the Data Sheet,
Item 5, Packaging: correct package data was added.
DS80072D-page 12
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications. No
representation or warranty is given and no liability is assumed by
Microchip Technology Incorporated with respect to the accuracy
or use of such information, or infringement of patents or other
intellectual property rights arising from such use or otherwise.
Use of Microchip’s products as critical components in life
support systems is not authorized except with express written
approval by Microchip. No licenses are conveyed, implicitly or
otherwise, under any intellectual property rights.
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The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
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Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are registered
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Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
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microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
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Serialized Quick Turn Programming (SQTP) is a service mark of
Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc.
DS80072D - page 13
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307
China - Beijing
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Chicago
China - Chengdu
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
Boston
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
Phoenix
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/25/03
DS80072D-page 14
 2003 Microchip Technology Inc.
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