Littelfuse TVS Diode Array SESD Series Ultra Low Capacitance Diode Arrays Datasheet

Littelfuse TVS Diode Array SESD Series Ultra Low Capacitance Diode Arrays Datasheet
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
SESD Series Ultra Low Capacitance Diode Arrays
RoHS Pb GREEN ELV
Description
The SESD series Ultra Low Capacitance Diode Arrays
provides signal integrity-preserving unidirectional ESD
protection for the world’s most challenging high speed
serial interfaces. Compelling packaging options including
the standard 2.5mmx1.0mm layout, the SOD883, and
boardspace-friendly 0802 and 1103 DFN minimizes trace
layout complexity, saves significant PCB space. Providing
in excess of 20kV contact ESD protection (IEC61000-4-2)
while maintaining extremely low leakage and dynamic
resistance, offered in the industry’s most progressive and
soon to be popular footprints, the SESD series sets higher
standards for signal integrity and usability.
Features
Pinout
0402 DFN array
1
2
1
3.G
±20kV contact, ±20kV air
3
• Low clamping voltage
of 9.2V @ IPP=2.0A
(tP=8/20μs)
2
G
1004 DFN array
ACE-Q101 qualified)
2
• ESD, IEC61000-4-2,
4
3
1
• 0.20pF TYP capacitance
0802 DFN array
4
5
3
2
G
1
8.G
7
4
6
5
6
4
5
1
0802/1004 DFN array
0402 DFN array
3
4
G
• Applications requiring
high ESD performance in
small packages
2
3
2
• V-by-One®)
• Tablet PC and external
storage with high speed
interfaces
• C
onsumer, mobile and
portable electronics
G, 3, 8
1
• ELV Compliant
• LVDS interfaces
Functional Block Diagram
2
• DisplayPort(TM)
• Thunderbolt (Light Peak)
Bottom View
1
• AEC-Q101 qualified (1004)
Applications
• HDMI 2.0, 1.4a, 1.3
9
• Facilitates excellent signal
integrity
1103 DFN array
• USB 3.1, 3.0, 2.0
10
• Low profile DFN array
packages
5
6
1103 DFN array
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
Peak Current (tp=8/20μs)
2.0
A
Storage Temperature Range
TOP
Operating Temperature
-55 to 125
°C
°C
Storage Temperature
TSTOR
-55 to 150
Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics - (TOP=25°C)
Typ
Max
Units
Input Capacitance
Parameter
@ VR = 0V, f = 3GHz
Test Conditions
Min
0.20
0.22
pF
Breakdown Voltage
VBR @ IT=1mA
9.00
V
Reverse Working Voltage
Reverse Leakage Current
IL @ VRWM=5.0V
25
Clamping Voltage
VCL @ IPP=2.0A
9.20
ESD Withstand Voltage
IEC61000-4-2 (Contact)
±20
IEC61000-4-2 (Air)
±20
0
0
-5.0
-5.0
S21 Insertion Loss (dB)
S21 Insertion Loss (dB)
50
nA
2.0
A
kV
Insertion Loss Diagram - 1103 DFN Array
Insertion Loss Diagram
-10.0
-15.0
-20.0
-25.0
-30.0
1.E+06
V
V
tP=8/20μs
Peak Pulse Current
7.0
-10.0
-15.0
-20.0
-25.0
-30.0
1.E+07
1.E+08
Frequency (Hz)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
Frequency (Hz)
1.E+09
1.E+10
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Device IV Curve
1.0
0.8
0.6
0.4
Current (mA)
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-2
-1
0
1
2
3
4
5
6
7
8
9
10
Voltage (V)
USB3.0 Eye Diagram
5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern
Without SESD Device
With SESD Device
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Product Characteristics of 0402 DFN Package
Ramp-down Rate
6°C/second max
Lead Plating
Pre-Plated Frame
Time 25°C to peak Temperature (TP)
8 minutes Max.
Lead Material
Copper Alloy
Do not exceed
260°C
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Package Dimensions — 0402 DFN Array
Symbol
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.33
0.38
0.43
0.013
0.015
0.017
A1
0
-
0.05
0
-
0.002
A3
0.13 ref.
0.005 ref.
D
0.55
0.60
0.65
0.022
0.024
0.026
E
0.95
1.00
1.05
0.037
0.039
0.041
K
0.35
0.40
0.45
0.014
0.016
0.018
L1
0.45
0.50
0.55
0.018
0.020
0.022
L2
0.20
0.25
0.30
0.008
0.010
0.012
b
0.10
0.15
0.20
0.004
0.006
0.008
e1
0.35 BSC
0.014 BSC
e2
0.65 BSC
0.026 BSC
Symbol
Millimeters
Inches
A
0.60
0.024
B
1.00
0.039
C
0.23
0.009
0.014
D
0.35
D1
0.35
0.014
E
0.15
0.006
F
0.30
0.012
Pad Layout
Embossed Carrier Tape & Reel Specification — 0402 DFN Array
D0
T
Y
P0
P2
E1
D1
F
B0
K0
Section Y - Y
A0
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
Y
P1
W
Symbol
Millimeters
A0
0.70+/-0.05
B0
1.15+/-0.05
D0
ø 1.55 + 0.05
D1
ø 0.40 +/- 0.05
E1
1.75+/-0.10
F
3.50+/-0.05
K0
0.47+/-0.05
P0
4.00+/-0.10
P1
2.00+/-0.05
P2
2.00+/-0.05
W
8.00 +/-0.10
T
0.20+/-0.05
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Package Dimensions — 0802 DFN Array
Symbol
Millimeters
Inches
Min
Typ
Max
Min
Typ
A
0.33
0.38
0.43
0.013
0.015
0.017
A1
0
0.02
0.05
0
--
0.002
0.70
0.020
A3
D
0.127 ref
0.005 ref.
0.50
0.60
E
1.90
2.00
2.10
b
0.15
0.20
0.25
b1
0.25
0.30
0.36
L
0.25
0.30
0.36
L1
0.35
0.40
0.45
0.014
L2
0.05 BSC
Max
0.024
0.028
0.075
0.079
0.083
0.006
0.008
0.010
0.010
0.012
0.014
0.010
0.012
0.014
0.016
0.018
0.002 BSC
e
0.40 BSC
0.016 BSC
e1
0.45 BSC
0.018 BSC
e2
0.25 BSC
0.010 BSC
N
4
4
Symbol
Millimeters
Inches
A
0.60
2.00
0.30
0.30
0.30
0.10
0.15
0.40 BSC
0.45 BSC
0.024
0.079
0.012
0.012
0.012
0.004
0.006
0.016 BSC
0.018 BSC
B
C
D
E
F
F1
G
G1
Pad Layout
Embossed Carrier Tape & Reel Specification — 0802 DFN Array
D0
T
Y
P0
P2
E1
D1
F
B0
K0
Section Y - Y
A0
Y
P1
W
Symbol
Millimeters
A0
B0
D0
D1
E1
F
K0
P0
P1
P2
W
T
0.81+/-0.05
2.21+/-0.05
ø 1.50+0.10/-0
ø 0.40 min
1.75+/-0.10
3.50+/-0.05
0.46+/-0.05
4.00+/-0.10
2.00+/-0.10
2.00+/-0.05
8.00+0.30/-0.10
0.25+/-0.20
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
A1
D
LxN
8xb
5
A1
D
6
Package Dimensions — 1004 DFN Array
LxN
Symbol
4
5
4
7
Gnd 8
R1
Gnd 3
2
Pin 1 ID
Marking Location
Pin 1 ID
Marking Location
SIDE VIEW 1
TOP VIEW
SIDE VIEW 1
TOP VIEW
END VIEW 1
0.43
0.013
0.015
0.017
0.02
0.05
0
--
0.002
0.035
0.127 ref.
E
2.40
2.50
2.60
b
0.15
0.20
0.25
BOTTOM VIEW
END VIEW 2
0.043
0.094
0.098
0.102
0.006
0.008
0.010
b1
0.35
0.40
0.45
0.014
0.016
0.018
L
0.33
0.38
0.43
0.013
0.015
0.017
L1
0.00
0.10
0.15
0.000
0.004
0.006
e
0.50 BSC
e1
0.50 BSC
0.020 BSC
R
0.08 BSC
0.003 BSC
R1
0.13 BSC
0.005 BSC
N
10
2x F
10
A
0.020 BSC
2x F
2x F
AA
2x2x
F1F1
2x D1
2x D1
B B
G1
4x G
4x G
G1
4x G
D1
B
D1
B
G1
4x G
4x G
8x D
8x D
E
8x C
Pad Layout
Millimeters
Inches
A
1.20
0.047
B
2.20
0.087
C
0.50
0.020
D
0.20
0.008
D1
0.40
0.016
E
0.20
0.008
F
0.30
0.012
0.20
0.008
Alternate
G
0.50 BSC
0.020 BSC
Alternate
G1
1.00 BSC
0.039 BSC
E
E
8x C
Recommended
Symbol
F1
8x D
E
Recommended
G1
4x G
8x D
8x C
0.039
2x F
2x2xF1F1
8x C
Max
0.005 ref.
1.10
BOTTOM VIEW
(Front)
0.38
1.00
2xR
1
SIDE VIEW 2
(Front)
SIDE
VIEW 2
0.33
0.00
0.90
A3
A
A
A1
D
END VIEW 2
END VIEW 1
A
A
Typ
A3
b1 2x
N=10
2xR
e
A3
b1 2x
9
Gnd 8
Gnd 3
R1
1
e1e
Min
9
2
L1e1
2x
E
Max
N=10
E
Inches
Typ
6
L1 2x
Millimeters
Min
7
8xb
Pad Layout
Embossed Carrier Tape & Reel Specification — 1004 DFN Array
D0
T
Y
P2
P0
E1
D1
F
B0
K0
Section Y - Y
A0
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
Y
P1
W
Symbol
Millimeters
A0
B0
D0
D1
E1
F
K0
P0
P1
P2
W
T
1.20+/-0.05
2.70+/-0.05
ø 1.50+0.10/-0
ø 0.50 min
1.75+/-0.10
3.50+/-0.05
0.51+/-0.10
4.00+/-0.10
4.00+/-0.10
2.00+/-0.05
8.00+0.30/-0.10
0.25+/-0.05
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Package Dimensions — 1103 DFN Array
Symbol
Millimeters
Inches
Min
Typ
Max
Min
Typ
A
0.33
0.38
0.43
0.013
0.015
0.017
A1
0.00
0.02
0.05
0
--
0.002
0.90
0.027
A3
4
0.127 ref.
Max
0.005 ref.
D
0.70
0.80
0.031
0.035
E
2.70
2.80
2.90
0.106
0.110
0.114
b
0.15
0.20
0.25
0.006
0.008
0.010
b1
0.25
0.30
0.35
0.010
0.012
0.014
L
0.30
0.35
0.40
0.012
0.014
0.016
L1
0.50
0.55
0.60
0.019
0.021
0.024
L2
0.05 BSC
0.002 BSC
e
0.40 BSC
0.016 BSC
e1
0.45 BSC
0.018 BSC
e2
0.40 BSC
0.016 BSC
N
6
6
Pad Layout
Symbol
Millimeters
Inches
A
0.80
0.031
B
2.80
0.110
C
0.35
0.014
D
0.30
0.012
E
0.45
0.018
0.004
F
0.10
F1
0.15
0.006
G
0.40 BSC
0.016 BSC
G1
0.45 BSC
0.018 BSC
Embossed Carrier Tape & Reel Specification — 1103 DFN Array
D0
T
Y
P2
P0
E1
D1
F
B0
K0
Section Y - Y
A0
Y
P1
W
Symbol
Millimeters
A0
B0
D0
D1
E1
F
K0
P0
P1
P2
W
T
1.00+/-0.05
3.00+/-0.05
ø 1.50+0.10/-0
ø 0.50 min
1.75+/-0.10
3.50+/-0.05
0.51+/-0.05
4.00+/-0.10
4.00+/-0.10
2.00+/-0.05
8.00+0.30/-0.10
0.25+/-0.05
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
TVS Diode Arrays (SPA® Diodes)
SESD Series Enhanced ESD Diode Arrays
Part Numbering System
Part Marking System
SESD xxxx Q x U G 0020 – 090
SESD product
Package
0402
0802
1004
1103
DFN Array Package
Breakdown Voltage
090: 9.0V (TYP)
C
Input Capacitance
0020: 0.20pF (TYP)
0402
Common GND pin
Directional
U: Unidirectional
4C
No of channel
2: Two Channels
4: Four Channels
6: Six Channels
1004
MC
0802
6C
1103
Ordering Information
Part Number
Package
Marking
SESD0402Q2UG-0020-090
0402 DFN Array
I C
RF2946-000
50000
SESD0802Q4UG-0020-090
0802 DFN Array
I MC
RF3076-000
25000
SESD1004Q4UG-0020-090
1004 DFN Array
I 4C
RF3077-000
25000
SESD1103Q6UG-0020-090
1103 DFN Array
I 6C
RF3078-000
25000
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/10/15
Ordering Part Number
Reel Quantity
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