datasheet for 54121/BCA by Rochester Electronics

datasheet for 54121/BCA by Rochester Electronics
INCH-POUND
MIL-M-38510/12J
22 February 2005
SUPERSEDING
MIL-M-38510/12H
16 December 2003
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, MONOSTABLE MULTIVIBRATORS, MONOLITHIC SILICON
This specification is approved for use by all Departments and Agencies of the Department of Defense.
Inactive for new design as of September 07, 1995.
The requirement for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, bipolar, TTL, monostable
multivibrators microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are
provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have
been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
01
02
03
04
05
06
Circuit
Single monostable multivibrator, with Schmitt trigger input
Single retriggerable monostable multivibrator with clear
Dual retriggerable monostable multivibrator with clear
One shot multivibrator
Dual one shot multivibrator
Single monostable multivibrator, with Schmitt trigger input 1/
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outline. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
A 2/
B 2/
C
D
E
F
Descriptive designator
GDFP5-F14 or CDFP6-F14
GDFP4-14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
Terminals
14
14
14
14
16
16
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Dual in line
Flat pack
______
1/ For device type 06, the tP(OUT)1 maximum test limit under TABLE I and TABLE III is 168 ns at -55°C, 125°C.
2/ Inactive package case outline. Acceptable only for use in equipment designed or redesigned on or before
29 November 1986.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or email
[email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5962
MIL-M-38510/12J
1.3 Absolute maximum ratings.
Supply voltage range .......................................................................
Input voltage range ..........................................................................
Storage temperature range ..............................................................
Maximum power dissipation (PD) per multivibrator:
Device types 01 and 06 ................................................................
Device type 02 ..............................................................................
Device type 03 ..............................................................................
Device type 04 ..............................................................................
Device type 05 ..............................................................................
Lead temperature (soldering, 10 seconds) ......................................
Junction temperature (TJ) ................................................................
Thermal resistance, junction-to-case ( JC):
Cases A, B, C, D, E, and F ...........................................................
-0.5 V dc to +7.0 V dc
-1.5 V dc at -12 mA to +5.5 V dc
-65°C to +150°C
200 mW 3/
170 mW 3/
190 mW 3/
138 mW 3/
143 mW 3/
+300°C.
+175°C 4/
See MIL-STD-1835
1.4 Recommended operating conditions.
Supply voltage (VCC) .......................................................................
Minimum high-level input voltage (VIH) ............................................
Maximum low-level input voltage (VIL) .............................................
Normalized fanout (each output) :
Device types 01 and 06 ................................................................
Device types 02 and 03 (low level logic) ......................................
Device types 02 and 03 (high level logic) .....................................
Device type 04 (low level logic) ....................................................
Device type 04 (high level logic) ...................................................
Device type 05 (low level logic) ....................................................
Device type 05 (high level logic) ...................................................
Input pulse rise/fall time, device types 01 and 06:
Schmitt input (B) ...........................................................................
Positive gains threshold voltage (VT+) .........................................
Negative gains threshold voltage (VT-) .........................................
Logic inputs (A1, A2) ....................................................................
Input data setup time (tSETUP):
Device types 01 and 06 ................................................................
Device types 02, 03, 04, and 05 ...................................................
Input data hold time (tHOLD):
Device types 01 and 06 ................................................................
Device types 02, 03, 04, and 05 ...................................................
External timing resistance:
Device types 01 and 06 ................................................................
Device types 02, 03, 04 and 05 ....................................................
Case operating temperature range (TC) ..........................................
4.5 V dc minimum to 5.5 V dc maximum
2.4 V dc
0.4 V dc
10 maximum 5/
10 maximum 5/
20 maximum 5/
6 maximum 5/
12 maximum 5/
8 maximum 5/
16 maximum 5/
1 V/s maximum
2.0 V maximum
0.8 V maximum
1 V/µs maximum
60 ns minimum
40 ns minimum
0 ns minimum
40 ns minimum
30 kΩ maximum
5 kΩ minimum to 25 kΩ maximum
-55°C to +125°C
______
3/ Must withstand the added PD due to short circuit test (e.g., IOS).
4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in
screening conditions in accordance with MIL-PRF-38535.
5/ The device shall fanout in both high and low levels to the specified number of data inputs of the same
device type as that being tested.
2
MIL-M-38510/12J
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those
cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
- Test Method Standard for Microelectronics.
- Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein the text of this document shall takes precedence. Nothing in this document, however, supersedes applicable
laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagrams and terminal connections. The logic diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Truth tables. The truth tables shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3
MIL-M-38510/12J
TABLE I. Electrical performance characteristics.
Conditions
Test
Symbol
High-level output
VOH
voltage
Low-level output
voltage
Input clamp voltage
VOL
VIC
Limits
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Device
type
Min
VCC = 4.5 V, IOH = -0.4 mA
01, 06
2.4
VCC = 4.5 V, IOH = -0.8 mA
02, 03 1/
2.4
VCC = 4.5 V, IOH = -0.72 mA
04
2.4
VCC = 4.5 V, IOH = -0.96 mA
05
2.4
Max
Units
V
V
VCC = 4.5 V, IOL = 10 mA
01, 02, 1/
03, 06
04
VCC = 4.5 V, IOL = 10 mA
05
0.4
VCC = 4.5 V, IIN = -12 mA,
All
-1.5
V
VCC = 4.5 V, IOL = 16 mA
0.4
0.4
TC = +25°C
Low-level input
current at A1 or A2
Low-level input
current at B
Low level input
current at data inputs
Low level input
current at clear input
Low level input
current at data inputs
Low level input
current at data and
clear inputs
High level input
IIL1
VCC = 5.5 V, VIN = 0.4 V
01, 06
-0.7
-1.6
mA
IIL2
VCC = 5.5 V, VIN = 0.4 V
01, 06
-1.4
-3.2
mA
IIL1
VCC = 5.5 V, VIN = 0.4 V
02, 03
-0.7
-1.6
mA
IIL2
VCC = 5.5 V, VIN = 0.4 V
02, 03
-1.4
-3.2
mA
IIL
VCC = 5.5 V, VIN = 0.4 V
04
-0.7
-1.6
mA
IIL
VCC = 5.5 V, VIN = 0.4 V
05
-0.7
-1.6
mA
IIH1
VCC = 5.5 V, VIN = 2.4 V
01, 06
40
µA
IIH2
VCC = 5.5 V, VIN = 5.5 V
IIH3
VCC = 5.5 V, VIN = 2.4 V
current at B
IIH4
VCC = 5.5 V, VIN = 5.5 V
High level input
IIH1
VCC = 5.5 V, VIN = 2.4 V
IIH2
VCC = 5.5 V, VIN = 5.5 V
IIH3
VCC = 5.5 V, VIN = 2.4 V
IIH4
VCC = 5.5 V, VIN = 5.5 V
IIH1
VCC = 5.5 V, VIN = 2.4 V
IIH2
VCC = 5.5 V, VIN = 5.5 V
IIH1
VCC = 5.5 V, VIN = 2.4 V
IIH2
VCC = 5.5 V, VIN = 5.5 V
current at A1 or A2
High level input
current at data input
High level input
current at clear input
High level input
current at data inputs
High level input
current at data and
clear inputs
See footnotes at end of table.
4
100
01, 06
80
µA
200
02, 03
40
µA
100
02, 03
80
µA
200
04
40
µA
100
05
40
100
µA
MIL-M-38510/12J
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Short circuit output
Device
type
VCC = 5.5 V, VIN = 0 V 1/ 2/
01, 06
-20
-55
mA
-10
-10
-10
VCC = 5.5 V 3/
02, 03
04
05
01, 06
-40
-40
-40
25
mA
VCC = 5.5 V 4/
02
03
04
05
01, 06
28
66
25
52
40
mA
VCC = 5.0 V, CL = 50 pF ±10%,
02
03
01, 06
15
28
66
75
ns
01, 06
20
87
ns
tPLH2
01, 06
25
93
ns
tPHL2
01, 06
30
106
ns
01
70
150
ns
06
70
168
ns
IOS
current
Supply current
ICC1
(quiescent)
Supply current
ICC2
(triggered)
Propagation delay time
to high level (B input
to Q output)
tPLH1
Propagation delay time
to low level (B input to
tPHL1
Q output)
Propagation delay time
Limits
Min
Max
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Symbol
Units
CX = 80 pF ±10%,
RL = 390 Ω ±5%,
figure 4 (device type 01)
to high level (A1 or
A2 inputs to Q output)
Propagation delay time
to high level (A1 or
A2 inputs to Q
output)
Pulse width obtained
with internal timing
resistor
tP(OUT)1
VCC = 5.0 V, CL = 50 pF ±10%,
CX = 80 pF ±10%,
RL = 390 Ω ±5%,
RX = open (figure 5),
pin 9 connected to VCC
tP(OUT)1
VCC = 5.0 V, CL = 50 pF ±10%,
CX = 80 pF ±10%,
RL = 390 Ω ±5%,
RX = open (figure 5),
pin 9 connected to VCC
See footnotes at end of table.
5
MIL-M-38510/12J
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Pulse width obtained
with internal timing
resistor
Limits
Min
Max
Symbol
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Device
type
tP(OUT)2
VCC = 5.0 V, CL = 50 pF ±10%,
01, 06
20
50
ms
01, 06
600
825
ns
5.5
8
02, 03
7
48
ns
02, 03
7
41
ns
tPHL1
02, 03
7
56
ns
tPHL2
02, 03
7
51
ns
02,03
7
39
ns
02,03
7
56
ns
Units
CX = 15 pF ±10%,
RL = 390 Ω ±5%,
RX = open,
pin 9 connected to VCC,
see figure 5
Pulse width obtained
with external timing
resistor
tP(OUT)3
VCC = 5.0 V, CL = 50 pF ±10%,
CX = 100 pF ±10%,
RX = 10 kΩ ±5%,
pin 9 open, figure 5
tP(OUT)4
VCC = 5.0 V, CL = 50 pF ±10%,
CX = 1,000 pF ±10%,
RX = 10 kΩ ±5%,
pin 9 open, figure 5
Propagation delay time
tPLH1
VCC = 5.0 V, CL = 50 pF ±10%,
to high level (A1 or A2
CX = 1,000 pF ±10%,
inputs to Q output)
RX = 10 kΩ ±5%,
Propagation delay time
to high level (B1 or B2
inputs to Q output)
Propagation delay time
tPLH2
RL = 390 Ω ±5%,
figure 6 (device type 02),
figure 7 (device type 03)
to low level (A1 or A2
inputs to Q output)
Propagation delay time
to low level (B1 or B2
inputs to Q output)
Propagation delay
time to low level
(clear input to Q
tPHL3
CX = 1,000 pF ±10%,
output)
Propagation delay
VCC = 5.0 V, CL = 50 pF ±10%,
RX = 10 kΩ ±5%,
tPLH3
time to high level
(clear input to Q
output)
RL = 390 Ω ±5%,
figure 6 (device type 02),
figure 7 (device type 03)
See footnotes at end of table.
6
MIL-M-38510/12J
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Minimum pulse
width of Q output
pulse
Symbol
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Device
type
Limits
Min
Max
Units
02,03
75
5/
02,03
105
VCC = 5.0 V, CL = 50 pF ±10%,
02,03
2.60
4.15
µs
04
7
48
ns
04
7
41
ns
tPHL1
04
7
56
ns
tPHL2
04
7
51
ns
tW(MIN)
VCC = 5.0 V, CL = 50 pF ±10%,
ns
CX = 0, RX = 5 kΩ ±5%,
RL = 390 Ω ±5%,
figure 6 (device type 02),
figure 7 (device type 03)
VCC = 5.0 V,
CL = 50 pF ±10%,
CX = 15 pF, RX = 5 kΩ ±5%,
RL = 390 Ω ±5%,
figure 6 (device type 02),
figure 7 (device type 03)
Width of Q output
pulse
tW
CX = 1,000 pF ±10%,
RX = 10 kΩ ±5%,
RL = 390 Ω ±5%,
figure 6 (device type 02),
figure 7 (device type 03)
Propagation delay
time to high level
tPLH1
CX = open,
RX = 5 kΩ ±5%,
(A1 or A2 inputs
to Q output)
Propagation delay
time to high level
(B1 or B2 inputs
to Q output)
Propagation delay
time to high level
VCC = 5.0 V, CL = 50 pF ±10%,
tPLH2
RL = 390 Ω ±5%,
figure 8 (device type 04)
(A1 or A2 inputs
to Q output)
Propagation delay
time to high level
(B1 or B2 inputs
to Q output)
See footnotes at end of table.
7
MIL-M-38510/12J
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Minimum pulse
width of Q output
pulse
Limits
Symbol
-55°C ≤ TC ≤ +125°C
unless otherwise specified
tW(MIN)
VCC = 5.0 V, CL = 50 pF ±10%,
Device
type
Min
Max
Units
04
25
95
ns
25
125
04
2.60
4.10
µs
05
7
54
ns
05
7
51
ns
tPHL1
05
7
61
ns
tPHL2
05
7
58
ns
tPHL3
05
7
39
ns
tPLH3
05
7
56
ns
CX = 0, RX = 5 kΩ ±5%,
RL = 390 Ω ±5%,
figure 8 (device type 04)
VCC = 5.0 V,
5/
CL = 50 pF ±10%,
CX = 15 pF max, RX = 5 kΩ ±5%,
RL = 390 Ω ±5%,
figure 8 (device type 04)
Width of Q output
pulse
tW
VCC = 5.0 V, CL = 50 pF ±10%,
CX = 1,000 pF ±10%,
RL = 390 Ω ±5%,
RX = 10 kΩ ±5%,
figure 8 (device type 04)
Propagation delay
time to high level
(A input to Q output)
tPLH1
Propagation delay
time to high level
tPLH2
(B input to Q output)
Propagation delay
time to low level
(A input to Q output)
Propagation delay
time to low level
(B input to Q output)
Propagation delay
time to low level
(clear input to Q
output)
Propagation delay
time to high level
(clear input to Q
output)
VCC = 5.0 V, CL = 50 pF ±10%,
CX = open, RX = 10 kΩ ±5%,
RL = 390 Ω ±5%,
figure 9 (device type 05)
See footnote at end of table.
8
MIL-M-38510/12J
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Minimum pulse
width of Q output
pulse
Limits
Symbol
-55°C ≤ TC ≤ +125°C
unless otherwise specified
tW(MIN)
VCC = 5.0 V, CL = 50 pF ±10%,
Device
type
Min
Max
Units
05
35
108
ns
05
35
140
05
2.60
3.91
CX = 0, RX = 10 kΩ ±5%,
RL = 390 Ω ±5%,
figure 9 (device type 05)
VCC = 5.0 V,
5/
CL = 50 pF ±10%,
CX = 15 pF max, RX = 10 kΩ ±5%,
RL = 390 Ω ±5%,
figure 9 (device type 05)
Width of Q output
pulse
tW
VCC = 5.0 V, CL = 50 pF ±10%,
s
CX = 1,000 pF ±10%,
RL = 390 Ω ±5%,
RX = 10 kΩ ±5%,
figure 9 (device type 05)
1/
Ground CX to measure VOH at Q, VOL at Q ,or IOS at Q. CX is open to measure VOH at Q , VOL at Q,
or IOS at Q . (Device types 02 and 03).
2/
Not more than one output should be shorted at a time.
3/
For device types 02 and 03: ICC is measured (after clearing) with 2.4 V applied to all clear and A inputs,
B inputs grounded, all outputs open, CX = 0.02 µF and RX = 25 kΩ. RI of device type 02 is open.
4/
For device types 02 and 03: ICC is measured in the triggered state with 2.4 V applied to all clear and B inputs,
A inputs grounded, all outputs open, CX = 0.02 µF and RX = 25 kΩ. RI of device type 02 is open.
5/
15 pF load is for automatic test equipment only, which includes probe and jig capacitance.
3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 3 (see MIL-PRF-38535, appendix A).
9
MIL-M-38510/12J
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
MIL-PRF-38535
test requirements
Interim electrical parameters
1
1
Final electrical test parameters
1*, 2, 3,
7, 9, 10, 11
1, 2, 3, 7, 8,
9, 10, 11
1,2,3,
9,10,11
1,2,3,
9,10,11
1, 2, 3
1*, 2, 3,
7, 9
1, 2, 3, 7,
8, 9, 10, 11
Group A test requirements
Group B electrical test parameters when
using the method 5005 QCI option
Group C end-point electrical
parameters
Group D end-point electrical
parameters
N/A
1, 2, 3
1, 2, 3
*PDA applies to subgroup 1.
4. VERIFICATION.
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or
as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not
effect the form, fit, or function as function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior
to qualification and quality conformance inspection. The following additional criteria shall apply:
a.
The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified
in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be
maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c.
Additional screening for space level product shall be as specified in MIL-PRF-38535.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
10
MIL-M-38510/12J
NOTES (Device types 01 and 06):
1. The use internal timing resistor (2 kΩ nominal) connect pin 9 (RI) to pin 14 (VCC).
2. To obtain a variable pulse width, connect external variable resistor between pins 9 (RI) and 14 (VCC).
No external current limiting is required.
3. External timing capacitor may be connected between pins 10 (positive) (CX) and 11 (RX / CX).
NOTE (device types 02 and 03):
An external timing capacitor may be connected between CX and RX / CX (positive).
Figure 1. Logic diagrams and terminal connections (top view).
11
MIL-M-38510/12J
NOTE (device types 04 and 05):
An external timing capacitor (CX) and an external timing resistor (RX) are required between Cext and
Rext / Cext to determine output pulse duration and accuracy.
Figure 1. Logic diagrams and terminal connections (top views) – Continued.
12
MIL-M-38510/12J
DEVICE TYPES 01 and 06
INPUTS
OUTPUTS
OUTPUTS
Q
Q
A1
A2
B
Q
Q
Clear
H
X
H
L
X
L
L
H
H
L
X
X
H
X
H
X
X
X
X
L
L
H
H
L
L
X
X
↓
↑
L
H
X
X
X
X
X
X
L
X
X
L
L
L
H
H
L
↑
H
X
H
L
L
X
X
H
H
H
L
H
H
H
L
X
↑
H
↓
↑
X
H
H
X
L
H
L
H
H
X
L
L
L
H
H
X
L
↑
H
↑
H
H
L
H
H
H
↓
H
↑
H
H
H
L
L
H
H
H
H
↓
↓
↓
H
H
H
H
H
X
H
↓
↓
X
↑
H
↑
↑
↓
H
↑
↓
L
L
H
Clear
L
X
X
H
H
↑
A1
DEVICE TYPE 02
INPUTS
A2
B1
B2
↑
H
H
DEVICE TYPE 03
INPUTS
OUTPUTS
A
B
Q
Q
X
X
L
H
H
X
L
H
X
L
L
H
L
↑
H
↑
L
H
NOTE:
H = High level (steady state), L = low level (steady state), ↑ = transition from low to high level,
= one high level pulse,
= one low level pulse,
↓ = transition from high to low level,
X = irrelevant (any input, including transitions).
FIGURE 2. Truth tables.
13
MIL-M-38510/12J
DEVICE TYPE 04
INPUTS
A1
H
X
A2
H
X
B1
X
L
B2
X
X
X
L
L
X
X
X
X
H
L
H
H
L
X
X
X
X
L
L
L
↑
H
H
H
↓
↓
H
↓
↓
↑
H
H
↑
H
H
H
↑
H
H
H
H
OUTPUTS
Q
Q
DEVICE TYPE 05
INPUTS
OUTPUTS
CLEAR
A
B
Q
Q
H
H
L
H
X
H
L
L
H
H
H
↑
L
H
L
L
X
↑
L
NOTE:
H = High level (steady state), L = low level (steady state), ↑ = transition from low to high level,
↓ = transition from high to low level,
= one high level pulse,
= one low level pulse,
X = irrelevant (any input, including transitions).
FIGURE 2. Truth tables – Continued.
14
L
H
MIL-M-38510/12J
Description of device types 01, 02, and 06
These monostables are designed to provide the system designer with complete flexibility in controlling the pulse
width, either to lengthen the pulse by retriggering, or to shorten by clearing. Device types 01, 02 and 06 have an
internal timing resistor which allows the circuit to be operated with only an external capacitor, if so desired.
Applications requiring more precise pulse widths and not requiring the clear feature can best be satisfied with
device types 01 and 06.
The output pulse is primarily a function of the external capacitor and resistor.
For CX > 1,000 pF, the output pulse width (tW) is defined as:
tW (device type 01) = RX CX Ln2
tW (device type 02) = 0.32 RX CX (1 + (0.7/RX))
where
RX is in kΩ (either internal or external timing resistor)
CX is in pF
tW is in ns
For pulse widths when CX ≤ 1,000 pF, the following circuit for timing component connections is recommended.
These circuits are fully compatible with most TTL or DTL families. Inputs are diode-clamped to minimize reflections
due to transmission-line effects, which simplifies design. Typical power dissipation per one shot is 115 milliwatts;
typical average propagation delay time to the Q output is 21 nanoseconds.
FIGURE 3. Device descriptions.
15
MIL-M-38510/12J
Description of device types 01 and 06 –Continued.
NOTE: See 1.4 for maximum external timing resistance values.
FIGURE 3. Device descriptions – Continued.
16
MIL-M-38510/12J
B.
Description of device types 01 and 06 –Continued.
FIGURE 3. Device descriptions – Continued.
17
MIL-M-38510/12J
Description of device types 02 and 03
These values of resistance exceed the maximums recommended for use over the full temperature range.
FIGURE 3. Device descriptions – Continued.
18
MIL-M-38510/12J
Description of device types 02 and 03
To prevent reverse voltage across CX, it is recommended that the following circuit be employed when using
electrolytic capacitors and in applications utilizing the clear functions.
This circuit is also recommended for CX > 1,000 pF.
In all applications using the diode, the pulse width is:
tW = 0.28 RX CX (1 + (0.7/RX))
where
RX is in kΩ
CX is in pF
tW is in ns
FIGURE 3. Device descriptions – Continued.
19
MIL-M-38510/12J
Description of device types 02 and 03
These monolithic TTL retriggerable monostable multivibrators feature d-c triggering from gated low-level-active (A)
and high-level-active (B) inputs, and also provide overriding direct clear inputs. Complementary outputs are
provided. The retrigger capability simplies the generation of output pulses of extremely long duration. By triggering
the input before the output pulse is terminated, the output pulse may be extended. The overriding clear capability
permits any output pulse to be terminated at a predetermined time independently of the timing components R and C.
Waveforms below illustrates triggering the one-shot with the high-level-active (B) inputs.
NOTE: Retrigger pulse must not start before 0.22 CX (in picofarads) nanoseconds after previous trigger pulse.
FIGURE 3. Device descriptions – Continued.
20
MIL-M-38510/12J
Description of device type 04
These retriggerable monostables multivibrator provides an output pulse whose duration and accuracy is a function of
external timing components. It is designed to allow a choice of triggering either the leading or trailing edge of the
pulse, thus providing the system designer with complete flexibility in controlling the pulse width.
The output pulse width is primarily a function of the external capacitor and external resistor.
For CX ≥ 1,000 pF, the output pulse width (tW) is defined as:
tW = 0.32 RX CX (1 + (0.7/RX))
where
RX is in kΩ (see note 3)
CX is in pF (see note 2)
tW is in ns
For pulse widths when CX < 1,000 pF, the following circuit for timing component connections is recommended.
Circuit A. This circuit is for use with low leakage electrolytic capacitors. This configuration can be used predictability
only if the forward capacitor leakage at 5.0 volts is less than 3 µA, and the reverse capacitor leakage at 1.0 volt is
less than 5 µA over the operational temperature range, and note 1 below is satisfied.
Circuit B. This circuit is for use with high reverse leakage current electrolytic capacitors. The diode in this
configuration prevents high reverse leakage currents through the capacitor by preventing a reverse voltage across
the capacitor.
tW ≈ 0.3 RX
Any silicon switching diode such as 1N3064, etc.
R < 0.6 RX (maximum) (see recommended operating conditions for RX maximum).
FIGURE 3. Device descriptions – Continued.
21
MIL-M-38510/12J
Description of device type 04 - Continued
Circuit C. This circuit is used to obtain extended pulse width. This configuration obtains extended pulse widths,
because of the larger timing resistor allowed by Beta multiplication.
Electrolytics with high ( > 5 µA ) reverse leakage currents can be used.
R < RX (0.7) (hFEQ1) or < 2.5 MΩ whichever is lesser.
RX (minimum) < RY < (maximum) (5 ≤ RY ≤ 10 kΩ is recommended).
Q1: NPN silicon transistor with hFE requirements of above equations, such as 2N5961 or 2N5962.
tW ≈ 0.3 RCX.
NOTES:
1. CX may vary from 0 to any necessary value available. If however, the capacitor has leakage approaching
3.0 µA or if stray capacitance from either terminal to ground is more than 50 pF, the timing equations may
not represent the pulse with obtained.
2. Configuration B and C are not recommended with retriggerable operation.
3. RX may vary from 5.0 to 25 kΩ
FIGURE 3. Device descriptions – Continued.
22
MIL-M-38510/12J
Description of device type 04
FIGURE 3. Device descriptions – Continued.
23
MIL-M-38510/12J
Description of device types 04 and 05
These monolithic TTL retriggerable monostable multivibrators feature d-c triggering from gated low-level-active (A)
and high-level-active (B) inputs, and also provide overriding direct clear inputs. Complementary outputs are
provided. The retrigger capability simplies the generation of output pulses of extremely long duration. By triggering
the input before the output pulse is terminated, the output pulse may be extended. For device type 05, the overriding
clear permits any output pulse to be terminated at a predetermined time independently of the timing components
R and C.
Waveforms below illustrates triggering the one-shot with the high-level-active (B) inputs.
TYPICAL INPUT / OUTPUT PULSES
NOTE: Retrigger pulse must not start before 0.3 CX nanoseconds after previous trigger pulse.
FIGURE 3. Device descriptions – Continued.
24
MIL-M-38510/12J
Description of device type 05
This dual retriggerable, resettlable monostables multivibrator provides an output pulse whose duration and accuracy
is a function of external timing components. It is designed to allow a choice of triggering either the leading or trailing
edge of the pulse, thus providing the system designer with complete flexibility in controlling the pulse width.
The output pulse width is primarily a function of the external capacitor and external resistor.
For CX ≥ 1,000 pF, the output pulse width (tW) is defined as:
tW = 0.31 RX CX (1 + (1/RX))
where
RX is in kΩ (see note 3)
CX is in pF (see note 2)
tW is in ns
For pulse widths when CX < 1,000 pF, the following circuit for timing component connections is recommended.
Circuit A. This circuit is for use with low leakage electrolytic capacitors. This configuration can be used predictability
only if the forward capacitor leakage at 5.0 volts is less than 3 µA, and the reverse capacitor leakage at 1.0 volt is
less than 5 µA over the operational temperature range, and note 1 below is satisfied.
Circuit B. This circuit is for use with high reverse leakage current electrolytic capacitors. The diode in this
configuration prevents high reverse leakage currents through the capacitor by preventing a reverse voltage across
the capacitor.
tW = 0.3 RX
Any silicon switching diode such as 1N3064, etc.
R < 0.6 RX (maximum) (see recommended operating conditions for RX maximum).
FIGURE 3. Device descriptions – Continued.
25
MIL-M-38510/12J
Description of device type 05 - Continued
Circuit C. This circuit is used to obtain extended pulse widths. This configuration obtains extended pulse widths,
because of the larger timing resistor allowed by Beta multiplication.
Electrolytics with high inverse leakage currents can be used.
R < RX (0.7) (hFEQ1) or < 2.5 MΩ whichever is lesser.
RX (minimum) < RY < (maximum) (5 ≤ RY ≤ 10 kΩ is recommended).
Q1: NPN silicon transistor with hFE requirements of above equations, such as 2N5961 or 2N5962.
tW ≈ 0.3 RCX.
NOTES:
1. CX may vary from 0 to any necessary value available. If however, the capacitor has leakage approaching
3.0 µA or if stray capacitance from either terminal to ground is more than 50 pF, the timing equations may
not represent the pulse width obtained.
2. Configuration B and C are not recommended with retriggerable operation.
3. RX may vary from 5.0 to 25 kΩ
FIGURE 3. Device descriptions – Continued.
26
MIL-M-38510/12J
Description of device type 05
OUTPUT PULSE WIDTH VERSUS TIMING RESISTANCE AND CAPACITANCE
FIGURE 3. Device descriptions – Continued.
27
MIL-M-38510/12J
NOTES:
1. The pulse generator has the following characteristics: Vgen = 3.0 V, tTHL ≤ 10 ns, tTLH < 10 ns,
tSETUP = 60 ns, PRR ≤ 1 MHz, and ZOUT ≈ 50 Ω.
2. All diodes are 1N3064 or equivalent.
3. CL = 50 pF minimum including probe and jig capacitance.
4. RL = 390 Ω ±5 %.
5. VCC = 5.0 V minimum.
6. See table III for RX and CX values.
FIGURE 4. Switching test circuit for tPHL and tPLH of device types 01 and 06.
28
MIL-M-38510/12J
NOTES:
1. The pulse generator has the following characteristics: Vgen = 3.0 V, tTHL ≤ 10 ns, tTLH < 10 ns,
tSETUP = 60 ns, ZOUT ≈ 50 Ω, and PRR is as follows:
2.
3.
4.
TEST
tP(out) 1 and tP(out) 2
PRR
1 MHz
tP(out) 3
500 kHz
tP(out) 4
20 kHz
VCC = 5.0 V minimum, RL = 390 Ω ±5 %, CL = 50 pF minimum including probe and jig capacitance.
See table III for RX and CX values.
All diodes are 1N3064 or equivalent.
FIGURE 5. Switching test circuit for tSETUP and tP(out) of device types 01 and 06.
29
MIL-M-38510/12J
NOTES:
1. Unless otherwise specified in the notes with individual waveforms, all pulse generators shall have the
following characteristics: tTLH ≤ 10 ns, tTHL < 10 ns, VIH = 3.0 V minimum, VIL = 0 V and ZOUT ≈ 50 Ω.
2. CL = 50 pF minimum including probe and jig capacitance.
3. All diodes are 1N3064 or equivalent.
4. RL = 390 Ω ±5 %.
5. See table III for RX and CX values.
FIGURE 6. Switching test circuit and waveforms for device type 02.
30
MIL-M-38510/12J
A1 INPUT to Q and Q OUTPUTS (tPLH1, tPHL1) (tW min)
NOTES:
1. A1 input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. A2, B1, B2, and clear = 5.0 V.
B1 INPUT to Q and Q OUTPUTS (tPLH2, tPHL2) (tW)
NOTES:
1. B1 input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns, tHOLD = 40 ns.
2. A1, A2 = GND, B2, clear = 5.0 V.
FIGURE 6. Switching test circuit and waveforms for device type 02 – Continued.
31
MIL-M-38510/12J
CLEAR to Q and Q OUTPUTS (tPLH3 and tPHL3)
NOTES:
1. A1 input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. Clear input characteristics: PRR ≤ 1 MHz, tSETUP = 100 ns.
3. A2, B1, B2 = 5.0 V.
FIGURE 6. Switching test circuit and waveforms for device type 02 – Continued.
32
MIL-M-38510/12J
NOTES:
1. Unless otherwise specified in the notes with individual waveforms, all pulse generators shall have the
following characteristics: tTLH ≤ 10 ns, tTHL ≤ 10 ns, VIH = 3.0 V minimum, VIL = 0 V and ZOUT ≈ 50 Ω.
2. CL = 50 pF minimum including probe and jig capacitance.
3. All diodes are 1N3064 or equivalent.
4. RL = 390 Ω ±5 %.
5. See table III for RX and CX values.
FIGURE 7. Switching test circuit and waveforms for device type 03.
33
MIL-M-38510/12J
A INPUT to Q and Q OUTPUTS (tPLH1, tPHL1) (tW min)
NOTES:
1. A input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. B and clear = 5.0 V.
B INPUT to Q and Q OUTPUTS (tPLH2, tPHL2) (tW)
NOTES:
1. B input characteristics: PRR ≤ 285 kHz, tSETUP = 40 ns, tHOLD = 40 ns.
2. A = GND, clear = 5.0 V.
FIGURE 7. Switching test circuit and waveforms for device type 03 – Continued.
34
MIL-M-38510/12J
CLEAR to Q and Q OUTPUTS (tPLH3 and tPHL3)
NOTES:
1. A1 input characteristics: PRR ≤ 285 kHz, tSETUP = 40 ns.
2. Clear input characteristics: PRR ≤ 285 kHz, tSETUP = 100 ns.
3. B = 5.0 V.
FIGURE 7. Switching test circuit and waveforms for device type 03 – Continued.
35
MIL-M-38510/12J
NOTES:
1. Unless otherwise specified in the notes with individual waveforms, all pulse generators shall have the
following characteristics: tTLH ≤ 10 ns, tTHL < 10 ns, VIH = 3.0 V minimum, VIL = 0 V and ZOUT ≈ 50 Ω.
2. CL = 50 pF minimum including probe and jig capacitance.
3. All diodes are 1N3064 or equivalent.
4. RL = 390 Ω ±5 %.
5. See table III for RX and CX values.
FIGURE 8. Switching test circuit and waveforms for device type 04.
36
MIL-M-38510/12J
A1 INPUT to Q and Q OUTPUTS (tPLH1, tPHL1) (tW) (tW min)
NOTES:
1. A1 input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. A2, B1, and B2 = 5.0 V.
3. tW and tW (min)
B1 INPUT to Q and Q OUTPUTS (tPLH2, tPHL2)
NOTES:
1. B1 input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns, tHOLD = 40 ns.
2. A1, A2 = GND, B2 = 5.0 V.
FIGURE 8. Switching test circuit and waveforms for device type 04 – Continued.
37
MIL-M-38510/12J
NOTES:
1. Unless otherwise specified in the notes with individual waveforms, all pulse generators shall have the
following characteristics: tTLH ≤ 10 ns, tTHL < 10 ns, VIH = 3.0 V minimum, VIL = 0 V and ZOUT ≈ 50 Ω.
2. CL = 50 pF minimum including probe and jig capacitance.
3. All diodes are 1N3064 or equivalent.
4. RL = 390 Ω ±5 %.
5. See table III for RX and CX values.
FIGURE 9. Switching test circuit and waveforms for device type 05.
38
MIL-M-38510/12J
A INPUT to Q and Q OUTPUTS (tPLH1, tPHL1) (tW) (tW min)
NOTES:
1. A input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. B = GND, and clear = 5.0 V.
3. tW and tW (min)
B INPUT to Q and Q OUTPUTS (tPLH2, tPHL2)
NOTES:
1. B input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns, tHOLD = 40 ns.
2. A and clear = 5.0 V.
FIGURE 9. Switching test circuit and waveforms for device type 05 – Continued.
39
MIL-M-38510/12J
CLEAR to Q and Q OUTPUTS (tPLH3 and tPHL3)
NOTES:
1. A input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
2. Clear input characteristics: PRR ≤ 1 MHz, tSETUP = 40 ns.
3. B = GND
FIGURE 9. Switching test circuit and waveforms for device type 05 – Continued.
40
TABLE III. Group A inspection for device types 01 and 06.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup
1
2
3
4
5
6
7
8
9
10
11
12
13
Q
NC
A1
A2
B
Q
GND
NC
RI
CX
RXCX
NC
NC
0.8 V
2.0 V
0.8 V
“
16 mA
16 mA
0.8 V
“
GND
“
4.5 V
GND
-.4 mA
“
0.8 V
“
“
4.5 V
“
-12 mA
2.0 V
“
0.4 V
5.5 V
GND
5.5 V
0.4 V
GND
0.4 V
“
“
“
“
“
“
“
GND
3009
3009
3009
4
5
6
7
8
9
10
IIH3
3010
“
“
“
“
11
12
13
14
15
2.4 V
GND
5.5 V
GND
5.5 V
GND
2.4 V
GND
5.5 V
5.5 V
2.4 V
“
“
“
“
“
IIH4
“
16
5.5 V
5.5 V
5.5 V
“
4.5 V
IOS
“
3011
“
17
18
GND
“
GND
“
“
“
GND
5.5 V
VOL
Tc =+25°C
VOH
MILSTD-883
method
Cases
A,B,C,D
Test no.
3007 1/
3007
1
2
3006 1/
3
“
VIC
IIL1
IIL2
IIH1
IIH2
-.4 mA
-12 mA
-12 mA
41
GND
GND
GND
3005
19
“
“
“
“
ICC1
“
20
“
“
“
“
ICC2
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C, and VI C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and VI C tests are omitted.
7
Truth
3014
21
H
A
A
2/
L
GND
“
“
“
22
“
“
A
5/
Tc =+25°C table
test
“
23
“
“
B
5/
“
“
“
24
“
B
A
5/
“
“
14/
“
25
“
B
2/
B
“
“
“
26
“
2/
B
“
“
“
“
27
“
A
2/
“
“
“
“
28
“
2/
A
“
“
“
“
29
“
2/
2/
“
“
“
“
30
“
A
2/
A
“
“
“
31
“
2/
A
“
“
“
“
32
“
2/
2/
“
“
“
“
33
7/
B
A
2/
8/
“
“
34
“
A
B
2/
“
“
“
35
“
A
5/
A
“
“
“
36
“
5/
A
“
“
“
“
37
“
5/
5/
“
“
“
8
Repeat subgroup 7 at TC = +125°C and TC = -55°C. 14/
See footnotes at end of device type 01
14
VCC
4.5 V
“
GND
Measured
terminal
“
Min
Q
Q
4.5 V
“
“
“
“
5.5 V
“
5.5 V
Q
Q
A1
A2
B
A1
A2
B
4.5 V
“
“
“
“
“
A1
A2
A1
A2
B
GND
GND
5.5 V
GND
GND
3/
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
4/
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
GND
4/
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
Limits
“
B
“
“
Q
Q
“
“
VCC
“
5.0 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
6/
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
Max
0.4
0.4
2.4
-20
-20
V
“
“
2.4
-0.6
-0.6
-1.4
Unit
-1.5
“
“
-1.6
-1.6
-3.2
“
“
“
“
mA
“
mA
40
“
100
“
80
µA
“
“
“
“
200
“
-55
-55
mA
“
25
40
“
“
MIL-M-38510/12J
1
Symbol
TABLE III. Group A inspection for device types 01 and 06 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup
9
Tc = +25°C
Symbol
MILCases
STD-883 A,B,C,D
method Test no.
tPLH1
3003
38
tPHL1
(Fig. 4)
39
tPLH2
“
40
tPHL2
“
41
2
Q
NC
OUT
OUT
3
4
A1
A2
5
6
7
8
9
10
11
12
13
NC
NC
NC
14
B
Q
GND
R1
CX
RXCX
GND
IN
OUT
GND
3/
9/
9/
5.0 V
GND
IN
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
5.0 V
IN
5.0 V
5.0 V
IN
5.0 V
OUT
Measured
terminal
VCC
B to Q
B to Q
A2 to Q
A2 to Q
Limits
Unit
Min
15
Max
59
20
69
“
25
74
“
30
84
“
ns
3003
42
GND
GND
IN
OUT
“
“
“
“
“
Q
70
150
“
tP(OUT)2
(Fig. 5)
43
“
“
“
“
“
“
10/
10/
“
Q
20
50
“
tP(OUT)3
“
44
“
“
“
“
“
11/
11/ 13/
“
Q
600
825
“
tP(OUT)4
“
45
“
“
“
“
“
12/
12/ 13/
“
Q
5.5
8
µs
“
“
“
“
3/
9/
9/
“
B to Q
ns
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
tPLH1
3003
46
Tc = +125°C
tPHL1
(Fig. 4)
47
tPLH2
“
48
tPHL2
“
49
tP(OUT)1
3003
tP(OUT)2
(Fig. 5)
tP(OUT)3
“
OUT
30
106
“
“
IN
5.0 V
50
GND
GND
IN
OUT
“
“
“
“
“
Q
70
150 15/
51
“
“
“
“
“
“
10/
10/
“
Q
20
50
“
52
“
“
“
“
“
11/
11/ 13/
“
Q
600
825
“
“
“
12/
12/ 13/
“
Q
5.5
8
µs
42
For circuit D, test numbers 2 and 4, terminal A2 shall be 0.8 V shall be 2.0 V.
In transition from low level to high level.
R1 connected to VCC.
“
5.0 V
2/
RXCX and CX are open.
93
5.0 V
1/
4/
“
25
IN
“
53
“
“
“
tP(OUT)4
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
3/
B to Q
75
87
5.0 V
OUT
OUT
15
20
5/
In transition from high level to low level.
6/
Output voltages fro subgroups 7 and 8: H ≥ 1.5 V, L ≤ 1.5 V.
7/
One low logic level pulse.
8/
One high logic level pulse.
9/
CX connected to RXCX through an 80 pF capacitor.
10/ CX connected to RXCX through an 25 pF capacitor which includes stray, probe, and jig capacitor.
11/ CX connected to RXCX through an 100 pF capacitor.
12/ CX connected to RXCX through an 1,000 pF capacitor.
13/ RXCX connected to VCC through a 10 kΩ resistor.
14/ A = 2.0 V and B = 0.8 V for subgroup 7. A = 2.4 V and B = 0.4 V for subgroup 8.
15/ For device type 06 only, tP(OUT)1 maximum test limit under TABLE I and TABLE III is 168 ns at -55°C and +125°C.
A2 to Q
A2 to Q
MIL-M-38510/12J
tP(OUT)1
10
11
1
TABLE III. Group A inspection for device type 02.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup
Symbol
MILSTD-883
method
Cases
A,B,C,D
Test no.
1
VOL
3007
“
1
2
3006
“
Tc =+25°C
VOH
IIL1
5
6
B1
B2
Clear
Q
GND
0.8 V
2.0 V
0.8 V
“
2.0 V
“
16 mA
GND
“
3
4
0.8 V
2.0 V
“
“
“
“
“
“
-.8 mA
-.8 mA
-12 mA
“
“
“
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
IIL2
IIH1
IIH2
“
IIH3
IIH4
IOS
“
“
“
3011
“
3009
3009
3010
2
3
A1
A2
7
8
9
10
11
12
13
Q
RI
NC
CX
NC
RXCX
16 mA
4.5 V
GND
GND
4.5 V
14
VCC
4.5 V
“
GND
GND
Measured
terminal
“
“
Min
Q
Q
Q
“
“
“
“
“
5.5 V
“
“
“
5.5 V
“
“
“
“
“
“
“
Q
A1
A2
B1
B2
Clear
A1
A2
B1
B2
Clear
A1
A2
B1
B2
A1
A2
B1
Unit
Limits
Max
0.4
0.4
2.4
2.4
V
“
“
“
43
2.4 V
GND
5.5 V
“
“
GND
5.5 V
5.5 V
0.4 V
GND
“
“
“
2.4 V
5.5 V
5.5 V
GND
5.5 V
“
5.5 V
GND
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
22
“
“
GND
5.5 V
GND
“
“
B2
“
“
“
23
24
25
26
“
“
GND
“
“
GND
GND
5.5 V
GND
“
GND
“
2.4 V
5.5 V
“
“
“
“
“
“
“
“
“
“
Clear
Clear
Q
80
200
-40
-40
“
“
mA
“
“
“
VCC
“
28
28
“
“
5.0 V
“
“
“
“
“
“
“
“
“
“
“
“
6/
“
“
“
“
“
“
“
“
“
“
“
“
-12 mA
-12 mA
-12 mA
-12 mA
0.4 V
5.5 V
0.4 V
5.5 V
5.5 V
2.4 V
GND
5.5 V
0.4 V
5.5 V
GND
2.4 V
5.5 V
5.5 V
0.4 V
GND
GND
GND
GND
3005
27
5.5 V
5.5 V
GND
“
“
“
ICC1
“
28
GND
GND
5.5 V
5.5 V
“
“
ICC2
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C, and VI C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and VI C tests are omitted.
7
Truth
3014
29
GND
H
GND
L
2/
5.0 V
“
“
“
“
30
5.0 V
5.0 V
2/
Tc =+25°C table
test
“
31
“
“
5.0 V
2/
“
“
“
“
“
32
“
“
2/
5.0 V
“
“
“
“
“
33
GND
3/
5.0 V
“
“
“
“
“
“
34
3/
GND
5.0 V
“
“
“
“
“
“
35
GND
2/
“
“
4/
“
5/
“
36
GND
5.0 V
2/
“
“
“
“
“
37
GND
2/
5.0 V
“
“
“
“
“
38
GND
5.0 V
2/
“
“
“
“
“
39
5.0 V
3/
“
5.0 V
“
“
“
“
“
40
3/
5.0 V
“
“
“
“
“
“
“
41
3/
3/
“
“
“
“
“
“
8
Repeat subgroup 7 at TC = +125°C and TC = -55°C.
See footnotes at end of device type 02.
GND
5.5 V
5.5 V
GND
GND
0.8 V
1/
“
“
“
“
“
“
“
“
“
“
“
“
Q
-0.7
-0.7
-0.7
-0.7
-1.4
-10
-10
-1.5
“
“
“
“
-1.6
-1.6
-1.6
-1.6
-3.2
40
“
“
“
100
“
“
“
“
“
“
“
mA
“
“
“
mA
µA
“
“
“
“
“
MIL-M-38510/12J
4
VIC
1
TABLE III. Group A inspection for device type 02 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup
Symbol
A1
A2
9
tPLH1
3003
42
IN
5.0 V
tPLH2
(Fig. 6)
43
OUT
GND
tPLH3
“
44
9/
tPHL1
“
45
IN
tPHL2
“
46
OUT
tPHL3
“
47
9/
tW(MIN)
11/
“
48
IN
tW(MIN)
12/
“
49
IN
Tc = +25°C
MILCases
STD-883 A,B,C,D
method Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
B1
B2
Clear
Q
5.0 V
5.0 V
5.0 V
IN
“
5.0 V
“
5.0 V
5.0 V
“
IN
OUT
5.0 V
5.0 V
“
5.0 V
OUT
GND
IN
“
5.0 V
OUT
5.0 V
5.0 V
“
IN
“
GND
Q
RI
NC
CX
NC
RXCX
VCC
GND
OUT
7/
7/ 8/
5.0 V
A1 to Q
7
37
ns
OUT
“
“
“
B1 to Q
7
32
“
“
“
“
“
7
43
“
“
“
“
“
7
43
ns
OUT
“
“
“
40
“
“
“
B1 to Q
Clear to Q
7
“
7
30
“
“
“
5.0 V
“
“
“
1/
“
Q
65
“
“
“
“
“
“
“
10/
10/ 1/
“
Q
95
“
“
14
Measured
terminal
Limits
Min
Clear to Q
A1 to Q
Unit
Max
50
GND
GND
IN
“
“
“
“
7/
7/ 8/
“
Q
3.08
4.0
µs
3003
51
IN
5.0 V
5.0 V
5.0 V
“
GND
“
7/
7/ 8/
5.0 V
A1 to Q
7
48
ns
Tc = +125°C
tPLH2
(Fig. 6)
52
GND
GND
IN
“
“
“
“
“
“
“
B1 to Q
7
41
“
tPLH3
“
53
9/
5.0 V
5.0 V
“
IN
OUT
“
“
“
“
“
7
56
“
tPHL1
“
54
IN
5.0 V
5.0 V
“
5.0 V
OUT
“
“
“
“
7
56
“
tPHL2
“
55
GND
GND
IN
“
5.0 V
OUT
“
“
“
51
“
tPHL3
56
9/
5.0 V
5.0 V
“
IN
“
OUT
“
“
“
B1 to Q
Clear to Q
7
“
7
39
“
tW(MIN)
11/
“
57
IN
“
“
“
5.0 V
“
“
1/
“
Q
75
“
tW(MIN)
12/
“
58
IN
“
“
“
“
“
“
10/
10/ 1/
“
Q
105
“
“
“
7/
7/ 8/
“
Q
4.15
µs
11
“
59
GND
GND
IN
“
“
tW
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
1/
RXCX connected to VCC through a 5 kΩ resistor.
2/
In transition from low level to high level.
3/
In transition from high level to low level
4/
One low logic level pulse.
5/
One high logic level pulse
6/
Output voltages fro subgroups 7 and 8: H > 1.5 V, L < 1.5 V.
7/
CX connected to RXCX through an 1,000 pF capacitor.
8/
RXCX connected to VCC through a 10 kΩ resistor.
9/
Device must be triggered before tPHL3 can be measured (see figure 6).
“
Clear to Q
A1 to Q
2.60
10/ CX connected to RXCX through an 15 pF capacitor which includes stray, probe, and jig capacitor.
11/ This test shall be performed for bench setup only. For class B devices only, this test does not have to be performed at final electricals for subgroup 9. For Group A, subgroup 9 and Group C, subgroups 10 and 11,
sample size for these tests shall be 15 devices.
12/ This test shall be performed with automatic test equipment only or bench setup. For class B devices only, this test does not have to be performed at final electricals for subgroup 9. For Group A, subgroup 9 and
Group C, subgroups 10 and 11, sample size for these tests shall be 15 devices.
MIL-M-38510/12J
“
tPLH1
44
tW
10
TABLE III. Group A inspection for device type 03.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
1
VO L
Tc =
+25°C
VOH
Case
E, F
Test no.
3007
“
1
2
“
“
3
4
3006
5
2.0 V
0.8 V
GND
“
“
6
7
0.8 V
2.0 V
2.0 V
“
3009
“
“
“
“
“
3010
“
“
“
“
“
“
“
“
“
“
“
3011
“
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
“
“
35
36
VI C
IIL1
45
IIL2
II H 1
II H 2
II H 3
II H4
IOS
ICC1
ICC2
Same
Same
Truth
table
test
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A1
B1
Clear 1
Q1
Q2
CX2
RXCX2
GND
A2
B2
Clear 2
Q2
Q1
CX1
RXCX1
VCC
2.0 V
0.8 V
0.8 V
2.0 V
GND
2.0 V
1/
16 mA
4.5 V
“
GND
“
16 mA
1/
2/
-.8 mA
-.8 mA
2/
-12 mA
-12 mA
GND
2.4 V
5.5 V
5.5 V
5.5 V
5.5 V
2.4 V
5.5 V
5.5 V
0.4 V
GND
GND
5.5 V
GND
2.4 V
5.5 V
GND
5.5 V
GND
GND
4/
GND
5.5 V
GND
GND
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
-12 mA
0.4 V
2/
2.0 V
0.8 V
0.8 V
2.0 V
GND
2.0 V
“
“
16 mA
GND
1/
0.4 V
GND
“
“
16 mA
2/
1/
“
“
1/
-.8 mA
2.0 V
0.8 V
GND
0.8 V
2.0 V
2.0 V
2/
“
“
-.8 mA
-12 mA
-12 mA
-12 mA
0.4 V
GND
0.4 V
5.5 V
GND
5.5 V
0.4 V
2.4 V
5.5 V
2.4 V
GND
5.5 V
5.5 V
5.5 V
GND
5.5 V
GND
2.4 V
5.5 V
GND
5.5 V
GND
2/
1/
GND
GND
4/
GND
5.5 V
GND
3005
37
2.4 V
GND
2.4 V
1/
“
2.4 V
GND
2.4 V
3005
38
2.4 V
GND
2.4 V
2/
“
2.4 V
GND
2.4 V
2
Same tests, terminal conditions and limits as for subgroup 1, except 1, except TC = +125°C and VIC tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except 1, except TC = -55°C and VIC tests are omitted.
7
3014
39
GND
H
L
1/
GND
GND
“
40
5.0 v
4/
5.0 V
H
L
“
“
5.0 V
4/
5.0 V
Tc =
“
41
5/
GND
“
H
L
“
“
5/
GND
“
“
6/
8/
“
“
GND
4/
“
“
42
GND
4/
+25°C
“
43
5/
5.0 V
“
6/
8/
“
“
5/
5.0
“
See footnotes at end of table.
“
“
“
“
“
“
“
5.5 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
GND
L
L
L
8/
8/
Limits
Min
Q1
Q1
Q2
Q2
Q1
Q1
Q2
Q2
A1
B1
Clear 1
A2
B2
Clear 2
A1
B1
A2
B2
Clear 1
Clear 2
A1
B1
A2
B2
A1
B1
A2
B2
Clear 1
Clear 2
Clear 1
Clear 2
Q1
Q1
Q2
1/
“
“
Q2
VCC
VCC
1/
“
“
“
“
5.0 V
“
“
“
“
7/
“
“
“
“
2/
H
H
H
6/
6/
4.5 V
Measured
terminal
Unit
Max
0.4
“
V
“
“
“
“
“
2.4
“
“
“
“
“
“
-10
“
-1.5
“
“
“
“
“
-1.6
“
“
“
3/
“
40
“
“
“
100
“
“
“
80
80
200
200
-40
“
“
“
“
“
“
“
“
mA
“
“
“
“
“
µA
“
“
“
“
“
“
“
“
“
“
“
mA
“
“
“
“
“
“
“
66
66
“
“
“
“
“
“
-0.7
“
“
“
3/
MIL-M-38510/12J
MIL-STD883
method
TABLE III. Group A inspection for device type 03 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
8
9
Tc =
+25°C
MIL-STD883
method
Case
E, F
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A1
B1
Clear 1
Q1
Q2
CX2
RXCX2
GND
A2
B2
Clear 2
Q2
Q1
CX1
RXCX1
VCC
OUT
9/
9/ 10/
OUT
9/
9/ 10/
IN
5.0 V
5.0 V
OUT
9/
9/ 10/
OUT
9/
9/ 10/
GND
IN
5.0 V
9/
9/ 10/
5.0 V
“
“
“
“
“
Repeat subgroup 7 at TC = +125°C and TC = -55°C.
tPLH1
3003
44
IN
5.0 V
“
(Fig. 7)
45
tPLH2
“
46
GND
IN
“
“
47
tPLH3
“
48
11/
5.0 V
“
“
5.0 V
5.0 V
IN
OUT
49
9/
9/ 10/
GND
“
“
“
“
“
11/
5.0 V
IN
OUT
Measured
terminal
Limits
Unit
Min
Max
A1 to Q1
A2 to Q2
B1 to Q1
B2 to Q2
Clear 1
7
7
7
7
7
37
37
32
32
44
ns
“
“
“
“
to Q 1
Clear 2
7
44
“
7
44
ns
7
44
“
7
40
“
7
40
“
7
32
“
to Q 2
Tc =
+125°C
“
50
“
“
51
IN
tPHL2
“
52
“
“
53
tPHL3
“
54
“
“
55
tW(MIN)
13/
“
tW(MIN)
14/
“
tW
“
tPLH1
“
tPLH2
“
tPLH3
“
56
IN
5.0 V
5.0 V
“
57
58
IN
5.0 V
5.0 V
“
“
“
“
“
“
“
59
60
61
62
63
64
65
66
GND
IN
5.0 V
IN
5.0 V
5.0 V
“
“
67
GND
11/
5.0 V
IN
5.0 V
5.0 V
5.0 V
OUT
“
9/
9/ 10/
“
9/
9/ 10/
“
OUT
IN
5.0 V
9/
9/ 10/
1/
12/
1/
OUT
9/
9/ 10/
OUT
9/
9/ 10/
OUT
9/
9/ 10/
5.0 V
IN
OUT
GND
IN
5.0 V
OUT
“
5.0 V
OUT
9/
9/ 10/
IN
“
“
“
“
“
“
“
“
IN
“
9/
5.0 V
5.0 V
5.0 V
IN
5.0 V
5.0 V
GND
IN
5.0 V
IN
A1 to Q 1
A2 to Q 2
B1 to Q 1
1/
“
B2 to Q 2
Clear 1
to Q1
Clear 2
to Q2
Q1
9/ 10/
“
“
7
32
“
35
65
“
OUT
12/
1/
“
Q2
Q1
35
35
65
95
“
“
OUT
9/
9/ 10/
9/
9/ 10/
OUT
9/
9/ 10/
9/
9/ 10/
Q2
Q1
Q2
A1 to Q1
A2 to Q2
B1 to Q1
B2 to Q2
Clear 1
35
3.10
3.10
7
7
7
7
7
95
3.80
3.80
48
48
41
41
56
“
µs
OUT
“
“
5.0 V
“
“
“
“
“
to Q 1
Clear 2
7
56
“
7
56
ns
7
56
“
7
51
“
7
51
“
7
39
“
7
39
“
5.0 V
IN
5.0 V
“
5.0 V
GND
11/
9/ 10/
IN
OUT
“
“
“
“
OUT
11/
9/ 10/
“
9/
“
OUT
11/
5.0 V
“
OUT
IN
5.0 V
“
OUT
GND
9/
IN
OUT
ns
“
“
“
“
to Q 2
tPHL1
“
68
“
“
69
tPHL2
“
70
“
“
71
tPHL3
“
72
“
“
73
See footnotes at end of table.
IN
5.0 V
5.0 V
OUT
GND
IN
5.0 V
OUT
“
9/
11/
5.0 V
9/ 10/
“
IN
5.0 V
5.0 V
9/ 10/
“
9/
9/ 10/
“
IN
GND
IN
5.0 V
11/
5.0 V
IN
“
OUT
9/ 10/
“
9/
9/ 10/
“
OUT
“
“
9/
9/
OUT
“
OUT
9/
9/ 10/
“
“
A1 to Q 1
A2 to Q 2
B1 to Q 1
B2 to Q 2
Clear 1
to Q1
Clear 2
to Q2
MIL-M-38510/12J
46
10
tPHL1
TABLE III. Group A inspection for device type 03 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
10
Tc =
+125°C
11
Case
E, F
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A1
B1
Clear 1
Q1
Q2
CX2
RXCX2
GND
A2
B2
Clear 2
Q2
Q1
CX1
RXCX1
VCC
1/
5.0 V
tW(MIN)
3003
74
IN
5.0 V
5.0 V
13/
(Fig. 7)
tW(MIN)
“
75
OUT
13/
“
76
IN
5.0 V
5.0 V
tW(MIN)
14/
tW(MIN)
“
77
OUT
14/
“
78
GND
IN
5.0 V
tW
“
“
79
OUT
Same tests, terminal conditions and limits as subgroup 10, except TC = -55°C.
GND
1/
“
OUT
IN
5.0 V
5.0 V
“
OUT
11/
1/
“
IN
5.0 V
5.0 V
9/
9/ 10/
“
“
GND
IN
5.0 V
OUT
11/
9/
1/
9/ 10/
Measured
terminal
Limits
Unit
Min
Max
Q1
35
75
ns
“
Q2
35
75
“
“
Q1
35
105
“
“
Q2
35
105
“
“
“
Q1
Q2
2.60
2.60
4.15
4.15
µs
“
RXCX connected to VCC through a 5 kΩ resistor.
CX connected to GND or 0.8 V.
For schematic circuits A, B, and C, the minimum and maximum limits shall be –1.4 mA and –0.2 mA, respectively. For schematic circuit D, the minimum and maximum limits shall be –0.7 mA and –1.4 mA, respectively.
In transition from low level to high level.
In transition from high level to low level.
One low logic level pulse. At manufacturer’s option, this may be verified in subgroups 9, 10, 11.
Output voltages for subgroups 7 and 8: H > 1.5 V, L > 1.5 V.
One high logic level pulse. At manufacturer’s option, this may be verified in subgroups 9, 10, 11.
CX connected to RXCX through a 1,000 pF capacitor.
RXCX connected to VCC through a 10 kΩ resistor.
Device must be triggered before tPLH3 and tPHL3 can be measured (see figure 7).
CX connected to RXCX through a 15 pF capacitor which includes stray, probe, and jig capacitance.
This test shall be performed for bench setup only.
This test shall be performed for automatic test equipment only.
MIL-M-38510/12J
47
1/
2/
3/
4/
5/
6/
7/
8/
9/
10/
11/
12/
13/
14/
MIL-STD883
method
TABLE III. Group A inspection for device type 04.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Symbol
MILSTD-883
method
Cases
A,B,C,D
Test no.
1
VOL
3007
“
1
2
3006
“
3
4
-12 mA
3009
“
“
“
3010
“
“
“
“
“
“
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
“
20
IOS
3011
21
“
“
3005
22
23
Tc =+25°C
VOH
VIC
IIL1
IIH1
IIH2
1
2
3
4
5
6
A1
A2
7
8
9
10
11
12
13
B1
B2
NC
Q
0.8 V
2.0 V
0.8 V
2.0 V
GND
Q
NC
NC
CX
NC
RXCX
VCC
10 mA
10 mA
GND
“
1/
1/
4.5 V
“
0.8 V
2.0 V
2.0 V
0.8 V
-.72 mA
“
“
-.72 mA
1/
1/
“
“
48
2.4 V
GND
5.5 V
“
5.5 V
GND
5.5 V
5.5 V
0.4 V
GND
GND
“
2.4 V
5.5 V
5.5 V
GND
5.5 V
“
5.5 V
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
GND
5.5 V
“
GND
5.5 V
5.5 V
“
5.5 V
GND
5.5 V
-12 mA
-12 mA
-12 mA
0.4 V
5.5 V
0.4 V
5.5 V
5.5 V
0.4 V
2.4 V
GND
GND
2.4 V
GND
GND
“
“
“
GND
GND
GND
ICC
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C, and VI C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and VI C tests are omitted.
7
Truth
3014
24
5.0 V
5.0 V
H
GND
L
“
25
GND
“
“
“
Tc =+25°C table
test
“
26
GND
“
“
“
“
27
GND
5.0 V
5.0 V
“
“
“
“
28
GND
5.0 V
5.0 V
“
“
“
“
29
GND
3/
5.0 V
4/
“
5/
“
30
GND
5.0 V
3/
“
“
“
“
31
GND
3/
5.0 V
“
“
“
“
32
GND
5.0 V
3/
“
“
“
“
33
5.0 V
7/
5.0 V
“
“
“
“
34
7/
5.0 V
5.0 V
“
“
“
“
35
7/
7/
5.0 V
“
“
“
8
Repeat subgroup 7 at TC = +125°C and TC = -55°C.
9
3003
36
IN
5.0 V
5.0 V
5.0 V
GND
OUT
tPLH1
(Fig. 8)
37
GND
GND
IN
“
“
OUT
Tc =+25°C tPLH2
“
38
IN
5.0
V
5.0
V
“
OUT
“
tPHL1
tPHL2
“
39
See footnotes at end of device type 04.
GND
GND
IN
“
OUT
GND
“
GND
14
Measured
terminal
Min
Q
Q
Q
“
“
“
“
5.5 V
“
“
“
“
“
“
“
“
“
“
Q
A1
A2
B1
B2
A1
A2
B1
B2
A1
A2
B1
B2
A1
A2
B1
“
B2
1/
“
1/
1/
“
“
Q
Q
VCC
2/
“
“
“
“
“
“
“
“
“
“
“
5.0 V
“
“
“
“
“
“
“
“
“
“
“
6/
“
“
“
“
“
“
“
“
“
“
“
2/
“
“
5.0 V
“
“
A1 to Q
B1 to Q
“
“
A1 to Q
B1 to Q
Unit
Limits
Max
0.4
0.4
2.4
2.4
-0.7
-0.7
-0.7
-0.7
V
“
“
“
-1.5
“
“
“
-1.6
-1.6
-1.6
-1.6
40
“
“
“
100
“
“
“
“
“
“
mA
“
“
“
µA
“
“
“
“
“
“
“
“
-10
-40
mA
-10
-40
25
“
“
7
7
7
37
32
44
ns
“
“
7
40
“
MIL-M-38510/12J
Subgroup
TABLE III. Group A inspection for device type 04 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup
Symbol
9
tW(MIN)
Tc =+25°C
8/
tW(MIN)
9/
MILSTD-883
method
Cases
A,B,C,D
Test no.
3003
(Fig. 8)
“
Unit
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A1
A2
B1
B2
NC
Q
GND
Q
NC
NC
CX
NC
RXCX
VCC
40
IN
5.0 V
5.0 V
5.0 V
GND
OUT
2/
5.0 V
Q
Min
25
Max
75
ns
41
IN
“
“
“
“
“
10/
2/
“
Q
25
105
“
11/
Measured
terminal
Limits
tW
“
42
7/
“
“
“
“
“
1/ 11/
“
Q
3.08
3.76
µs
10
tPLH1
“
43
IN
5.0 V
5.0 V
“
“
“
2/
“
A1 to Q
7
48
ns
Tc =
tPLH2
“
44
GND
GND
IN
“
“
“
“
“
B1 to Q
7
41
“
tPHL1
“
45
IN
GND
IN
“
OUT
“
“
7
56
“
OUT
“
“
7
51
“
“
“
Q
25
95
“
+125°C
1/
tPHL2
“
46
GND
GND
IN
“
tW(MIN)
8/
“
47
IN
5.0 V
5.0 V
“
“
OUT
tW(MIN)
9/
“
48
IN
“
“
“
“
“
10/
“
“
Q
25
125
“
“
“
11/
11/ 1/
“
Q
2.60
4.10
µs
“
49
7/
“
“
“
tW
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
RXCX connected to VCC through a 10 kΩ resistor.
2/
RXCX connected to VCC through a 5 kΩ resistor.
3/
In transition from low level to high level.
4/
One low logic level pulse.
5/
One high logic level pulse
6/
Output voltages for subgroups 7 and 8: H > 1.5 V, L < 1.5 V.
7/
In transition from high level to low level.
8/ This test shall be performed for bench setup only.
9/
This test shall be performed for automatic test equipment only.
10/ CX connected to RXCX through an 15 pF capacitor which includes stray, probe, and jig capacitor.
11/ CX connected to RXCX through an 1,000 pF capacitor.
“
A1 to Q
B1 to Q
MIL-M-38510/12J
49
11
“
TABLE III. Group A inspection for device type 05.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
1
VO L
Tc =
+25°C
VOH
Case
E, F
Test no.
3007
“
1
2
“
“
3
4
3006
“
5
6
“
“
7
8
3009
“
“
“
“
“
3010
“
“
“
“
“
“
“
“
“
“
“
3011
“
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
“
“
35
36
VI C
IIL
50
II H 1
II H 2
IOS
1
CX1
2
3
RXCX1 Clear 1
0.9 V
0.8 V
2.0 V
4
5
6
7
8
9
10
11
12
B1
A1
Q1
Q1
GND
Q2
Q2
A2
B2
GND
1/
10 mA
GND
“
10 mA
“
“
0.9 V
2.0 V
0.8 V
GND
1/
-.96 mA
-.96 mA
-12 mA
-12 mA
0.4 V
0.4 V
0.4 V
2.4 V
2.4 V
2.4 V
5.5 V
5.5 V
5.5 V
0.9 V
2.0 V
0.8 V
GND
1/
0.5 V
0.5 V
14
Clear 2 RXCX2
15
16
CX2
VCC
4.5 V
“
10 mA
10 mA
1/
GND
0.8 V
2.0 V
“
“
0.9 V
“
“
“
“
-12 mA
13
“
“
-.96 mA
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
1/
GND
-.96 mA
2.0 V
0.8 V
0.9 V
“
“
“
“
“
“
“
“
5.5 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
6.0 V
“
-12 mA
-12 mA
-12 mA
0.4 V
0.4 V
0.4 V
2.4 V
2.4 V
2.4 V
5.5 V
5.5 V
5.5 V
0.5 V
1/
GND
0.5 V
ICC
3005
37
GND GND
GND
GND
“
ICC
3005
38
“
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = +125° C, and VI C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and VI C tests are omitted.
7
Truth
3014
39
2/
GND
L
H
GND
H
table
“
40
“
5.0 V
3/
GND
L
H
“
H
Tc =
test
“
41
“
“
5.0 V
1/
L
H
“
H
5.0 V
4/
5/
“
5/
“
42
“
“
3/
+25°C
“
43
“
“
GND
1/
4/
5/
“
5/
See footnotes at end of table.
L
L
L
4/
4/
GND
GND
GND
1/
5.0 V
1/
3/
5.0 V
3/
GND
2.0 V
0.8 V
0.9 V
GND
GND
5.0 V
“
“
“
2/
“
“
“
“
“
“
GND
Measured
terminal
Limits
Min
Q1
Q1
Q2
Q2
Q1
Q1
Q2
Q2
Clear 1
B1
A1
Clear 2
B2
A2
Clear 1
B1
A1
Clear 2
B2
A2
Clear 1
B1
A1
Clear 2
B2
A2
Clear 1
B1
A1
Clear 2
B1
A1
Q1
Q1
Q2
5.5 V
5.5 V
Q2
VCC
VCC
5.0 V
“
“
“
“
6/
“
“
“
“
Unit
Max
0.4
“
V
“
“
“
“
“
2.4
“
“
“
“
“
“
“
-10
“
-1.5
“
“
“
“
“
-1.6
“
“
“
“
“
40
“
“
“
“
“
100
“
“
“
“
“
-40
“
“
“
“
“
“
“
mA
“
“
“
“
“
µA
“
“
“
“
“
“
“
“
“
“
“
mA
“
“
“
“
“
“
“
52
52
“
“
-0.7
“
“
“
“
“
MIL-M-38510/12J
MIL-STD883
method
TABLE III. Group A inspection for device type 05 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
8
9
Tc =
+25°C
MIL-STD883
method
Case
E, F
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CX1
RXCX1
Clear 1
B1
A1
Q1
Q1
GND
Q2
Q2
A2
B2
Clear 2
RXCX2
CX2
VCC
5.0 V
GND
IN
OUT
OUT
IN
GND
5.0 V
2/
OUT
5.0 V
IN
5.0 V
2/
OUT
GND
“
“
“
“
7/
GND
IN
2/
Repeat subgroup 7 at TC = +125°C and TC = -55°C.
tPLH1
3003
44
2/
“
(Fig. 7)
45
tPLH2
“
46
2/
“
“
47
tPLH3
“
48
2/
“
“
5.0 V
IN
5.0 V
IN
GND
7/
OUT
49
“
OUT
Measured
terminal
Limits
Unit
Min
Max
5.0 V
“
“
“
“
A1 to Q1
A2 to Q2
B1 to Q1
B2 to Q2
Clear 1
7
7
7
7
7
40
40
37
37
44
ns
“
“
“
“
“
to Q 1
Clear 2
7
44
“
7
48
ns
7
48
“
7
46
“
7
46
“
7
32
“
to Q 2
Tc =
+125°C
“
50
“
“
51
tPHL2
“
52
“
“
53
tPHL3
“
54
“
“
55
tW(MIN)
8/
“
tW(MIN)
9/
“
tW
“
tPLH1
“
tPLH2
“
tPLH3
“
56
“
57
58
“
“
“
“
“
“
“
59
60
61
62
63
64
65
66
“
“
67
2/
5.0 V
GND
IN
OUT
“
“
2/
5.0 V
IN
5.0 V
2/
IN
GND
7/
OUT
2/
5.0 V
GND
IN
OUT
“
2/
5.0 V
GND
IN
OUT
“
“
11/ 12/
5.0 V
GND
1/
OUT
2/
5.0 V
GND
IN
OUT
2/
5.0 V
IN
5.0 V
2/
IN
GND
7/
5.0 V
2/
“
OUT
5.0 V
IN
5.0 V
2/
“
“
“
OUT
OUT
OUT
OUT
“
“
“
“
“
“
“
“
“
7/
GND
IN
2/
“
“
OUT
11/
GND
“
“
10/
IN
“
“
OUT
“
OUT
IN
IN
GND
GND
5.0 V
5.0 V
2/
2/
OUT
1/
GND
5.0 V
11/ 12/
OUT
IN
GND
5.0 V
2/
OUT
5.0 V
IN
5.0 V
2/
7/
GND
IN
2/
OUT
10/
11/
A1 to Q 1
A2 to Q 2
B1 to Q 1
B2 to Q 2
Clear 1
to Q1
Clear 2
to Q2
Q1
7
32
“
35
98
“
“
“
“
“
“
“
“
“
“
“
Q2
Q1
35
35
98
128
“
“
Q2
Q1
Q2
A1 to Q1
A2 to Q2
B1 to Q1
B2 to Q2
Clear 1
35
2.60
2.60
7
7
7
7
7
128
3.76
3.76
54
54
51
51
56
“
µs
“
to Q 1
Clear 2
7
56
“
7
61
ns
7
61
“
7
58
“
7
58
“
7
39
“
7
39
“
ns
“
“
“
“
to Q 2
tPHL1
“
68
“
“
69
tPHL2
“
70
“
“
71
tPHL3
“
72
“
“
“
See footnotes at end of table.
73
2/
5.0 V
GND
IN
OUT
“
“
2/
5.0 V
IN
5.0 V
2/
IN
GND
1/
OUT
IN
GND
5.0 V
2/
“
“
OUT
“
OUT
“
OUT
5.0 V
IN
5.0 V
2/
“
“
“
“
“
OUT
1/
GND
IN
2/
“
A1 to Q 1
A2 to Q 2
B1 to Q 1
B2 to Q 2
Clear 1
to Q1
Clear 2
to Q2
MIL-M-38510/12J
51
10
tPHL1
TABLE III. Group A inspection for device type 05 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.4 V, low ≤ 0.4 V, or open)
Subgroup Symbol
10
Tc =
+125°C
11
Case
E, F
Test no.
3003
(Fig. 7)
“
74
75
“
76
“
77
“
“
78
79
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CX1
RXCX1
Clear 1
B1
A1
Q1
Q1
GND
Q2
Q2
A2
B2
Clear 2
RXCX2
CX2
VCC
2/
5.0 V
GND
IN
OUT
GND
“
10/
11/
2/
11/ 12/
5.0 V
5.0 V
GND
GND
IN
1/
OUT
OUT
OUT
IN
GND
5.0 V
9/
“
Measured
terminal
Limits
Unit
Min
Max
5.0 V
Q1
35
108
ns
“
Q2
35
108
“
“
Q1
35
140
“
“
OUT
IN
GND
5.0 V
2/
10/
“
Q2
35
140
“
“
“
OUT
1/
GND
5.0 V
11/ 12/
11/
“
“
Q1
Q2
2.60
2.60
3.91
3.91
µs
“
Same tests, terminal conditions and limits as subgroup 10, except TC = -55°C, and tW max limit = 4.10 µs.
52
In transition from high level to low level.
RXCX connected to VCC through a 5 kΩ resistor.
In transition from low level to high level.
One high logic level pulse.
One low logic level pulse.
Output voltages for subgroups 7 and 8: H > 1.5 V, L > 1.5 V.
Device must be triggered before tPLH3 and tPHL3 can be measured (see figure 9).
This test shall be performed for bench setup only.
This test shall be performed for automatic test equipment only.
CX connected to RXCX through a 15 pF capacitor which includes stray, probe, and jig capacitance.
CX connected to RXCX through a 1,000 pF capacitor.
RXCX connected to VCC through a 10 kΩ resistor.
MIL-M-38510/12J
1/
2/
3/
4/
5/
6/
7/
8/
9/
10/
11/
12/
tW(MIN)
8/
tW(MIN)
8/
tW(MIN)
9/
tW(MIN)
9/
tW
“
MIL-STD883
method
MIL-M-38510/12J
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, and 6 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a.
End point electrical parameters shall be as specified in table II herein.
b.
The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall
be maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request.
The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with
the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical
parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows.
4.5.1 Voltage and current. All voltage values given are referenced to the microcircuit ground terminals. Currents given are
conventional current and positive when flowing into the referenced terminal.
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need
to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by
the Inventory Control Point's packaging activity within the Military Service, or Defense Agency, or within the military service’s
system command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
53
MIL-M-38510/12J
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and
logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to acquiring activity in addition to
notification of the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003),
corrective action and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not
affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by
or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in
this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this
specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid
adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are
urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43218-3990.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-STD-1331, and as follows:
GND -------- Ground zero voltage potential.
IIN ---------- Current flowing into an input terminal
VIN --------- Voltage level at an input terminal
VIC --------- Input clamp voltage
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified, microcircuits
acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4).
Longer length leads and lead forming should not affect the part number.
54
MIL-M-38510/12J
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered
by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have
equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M38510 device types and may have slight physical variations in relation to case size. The presence of this information should not
be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of
MIL-PRF-38535.
Military device type
01
02
03
04
05
06
Generic-industry type
54121
54122
54123
9601
9602
54121 1/
1/ For device type 06, the tP(OUT)1 maximum test limit under TABLE I and TABLE III is 168 ns at
-55°C and +125°C.
6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the
previous issue, due to the extensiveness of the changes.
Custodians:
Army – CR
Navy - EC
Air Force - 11
DLA – CC
Preparing activity:
DLA - CC
Project 5962-2092
Review activities:
Army - MI, SM
Navy - AS, CG, SH, TD
Air Force – 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and
responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at
http://assist.daps.dla.mil.
55
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