MAX3840

MAX3840
MAX3840
RELIABILITY REPORT
FOR
MAX3840ETJ+
PLASTIC ENCAPSULATED DEVICES
October 1, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX3840
Conclusion
The MAX3840ETJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3840 is a dual 2 x 2 asynchronous crosspoint switch for SDH/SONET DWDM and other high-speed data switching applications where serial
data stream loop-through and protection channel switching are required. It is ideal for OC-48 systems with forward error correction. A high-bandwidth,
fully differential signal path minimizes jitter accumulation, crosstalk, and signal skew. Each 2 x 2 crosspoint switch can fan out and/or multiplex up to
2.7Gbps data and 2.7GHz clock signals. All inputs and outputs are current mode logic (CML) compatible and easily adaptable to interface with an
AC-coupled LVPECL signal. When not used, each CML output stage can be powered down with an enable control to conserve power. The typical
power consumption is 460mW with all outputs enabled. The MAX3840 is compatible with the MAX3876 2.5Gbps clock and data recovery (CDR)
circuit. The MAX3840 is available in a 32-pin exposed-pad QFN package (5mm x 5mm footprint) and operates from a +3.3V supply over a
temperature range of -40°C to +85°C.
Maxim Integrated Products. All rights reserved.
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MAX3840
II. Manufacturing Information
A. Description/Function:
+3.3V, 2.7Gbps Dual 2 x 2 Crosspoint Switch
B. Process:
G4
C. Number of Device Transistors:
1200
D. Fabrication Location:
Oregon
E. Assembly Location:
Thailand, China
F. Date of Initial Production:
October 22, 2000
III. Packaging Information
A. Package Type:
32-pin TQFN 5x5
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1.2 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-1540
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
47°C/W
K. Single Layer Theta Jc:
1.7°C/W
L. Multi Layer Theta Ja:
29°C/W
M. Multi Layer Theta Jc:
2.7°C/W
IV. Die Information
A. Dimensions:
64 X 70 mils
B. Passivation:
Si3N4
C. Interconnect:
Au
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn) Metal 1, 2 & 3 5.6 microns (as
drawn) Metal 4
F. Minimum Metal Spacing:
1.6 microns (as drawn) Metal 1, 2 & 3, 4.2 microns (as
drawn) Metal 4
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX3840
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 150°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
= 10.6 x 10
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 45 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 10.6 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the G4 Process results in a FIT Rate of 0.02 @ 25C and 0.37 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The HF82 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250mA.
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MAX3840
Table 1
Reliability Evaluation Test Results
MAX3840ETJ+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 150°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
45
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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