MAX3110E

MAX3110E
MAX3110ECWI+
RELIABILITY REPORT
FOR
MAX3110ECWI+
PLASTIC ENCAPSULATED DEVICES
April 1, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX3110ECWI+
Conclusion
The MAX3110ECWI+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3110E/MAX3111E combine a full-featured universal asynchronous receiver/transmitter (UART) with ±15kV ESD-protected RS-232
transceivers and integrated charge-pump capacitors into a single 28-pin package for use in space-, cost-, and power-constrained applications. The
MAX3110E/MAX3111E also feature an SPI™/QSPI™/MICROWIRE™-compatible serial interface to save additional board space and microcontroller
(µC) I/O pins.
A proprietary low-dropout output stage enables the 2-driver/2-receiver interface to deliver true RS-232 performance down to VCC = +3V (+4.5V for
MAX3110E) while consuming only 600µA. The receivers remain active in a hardware/software-invoked shutdown, allowing external devices to be
monitored while consuming only 10µA. Each device is guaranteed to operate at up to 230kbps while maintaining true EIA/TIA-232 output voltage
levels..
The MAX3110E/MAX3111E's UART includes a crystal oscillator and baud-rate generator with software-programmable divider ratios for all common
baud rates from 300baud to 230kbaud. The UART features an 8-word-deep receive FIFO that minimizes processor overhead and provides a flexible
interrupt with four maskable sources. Two control lines (one input and one output) are included for hardware handshaking..
The UART and RS-232 functions can be used together or independently since the two functions share only supply and ground connections (the
MAX3110E/ MAX3111E are hardware- and software-compatible with the MAX3100 and MAX3222E).
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MAX3110ECWI+
II. Manufacturing Information
A. Description/Function:
SPI/MICROWIRE-Compatible UART and ±15kV ESD-Protected RS-232
Transceivers with Internal Capacitors
B. Process:
S3 & S12
C. Number of Device Transistors:
D. Fabrication Location:
California
E. Assembly Location:
ATP Philippines
F. Date of Initial Production:
Pre 1997
III. Packaging Information
A. Package Type:
28-pin SOIC (W)
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Hybrid
E. Bondwire:
hybrid (hybrid mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
80°C/W
K. Single Layer Theta Jc:
18°C/W
L. Multi Layer Theta Ja:
59°C/W
M. Multi Layer Theta Jc:
18°C/W
IV. Die Information
A. Dimensions:
N/A mils
B. Passivation:
SiO2/Si3N4
C. Interconnect:
Al/Cu (0.5%)
D. Backside Metallization:
none
E. Minimum Metal Width:
N/A
F. Minimum Metal Spacing:
N/A
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Saw
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MAX3110ECWI+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
follows:
=
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
1
MTTF
=
1.83
192 x 4340 x 80 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 13.4 x 10
= 13.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S3 Process results in a FIT Rate of 3.6 @ 25C and 66.0 @ 55C (0.8 eV, 60% UCL)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S12 Process results in a FIT Rate of 0.09 @ 25C and 1.48 @ 55C, data limited (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The RS80-RS80W die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per Mil-Std
883 Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX3110ECWI+
Table 1
Reliability Evaluation Test Results
MAX3110ECWI+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
80
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85 T
=
a
85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
-65°C/150°C
Temperature
1000 Cycles
Cycle
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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