datasheet for TB2959HQ by Toshiba Electronics Europe

datasheet for TB2959HQ by Toshiba Electronics Europe

TB2959HQ

Bi-CMOS Linear Integrated Circuit Silicon Monolithic

TB2959HQ

Maximum Power 47W BTL

4-ch Audio Power IC

1. Description

The TB2959HQ is a four-channel BTL power amplifier for car audio applications.

This IC has a pure complementary P-ch and N-ch DMOS output stage, offering maximum output power (P

OUT

MAX) of 47W.

It includes a standby switch, mute function and various protection features.

2. Applications

Power IC developed for car audio applications.

Weight: 7.7 g (typ.)

3. Features

High output power, low distortion, and low noise property (for details, refer to the Table 1)

Build-in AUX-IN (pin25)

Built-in various mute functions (low voltage, standby on/off)

Built-in standby switch (pin4)

Built-in mute switch (pin22)

Built-in various protection circuits (thermal shut down, over-voltage, short to GND, short to VCC, and output to output short)

Table1 typical Characteristics

(Note1,Note2)

Condition

Output power

(P

OUT

)

V

CC

= 15.2 V, JEITA max

V

CC

= 14.4 V, JEITA max

V

CC

= 14.4 V, THD

=

10%

THD = 10%

BW = 20 Hz to 20 kHz

Typ.

47

42

27

23

Total harmonic distortion

(THD)

P

OUT

= 5 W

Output noise voltage

(V

NO

) (Rg = 0 ),

Operating Supply voltage range

(V

CC

)

RL = 4

0.005

50

6 to 18

Unit

W

%

µV

V

Note1: Typical test conditions: V

CC

= 13.2 V, f = 1 kHz, R

L

= 4 , G

V

= 26 dB, Ta = 25°C; unless otherwise specified.

Note2: Rg: signal source resistance

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4. Block Diagram

TB2959HQ

Note3: Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes.In the following explanation, a "channel" is a circuit which consists of INx, OUTx (+), OUTx (-), and PW-GNDx. (x:1 to 4)

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5. Pin Configuration and Function Descriptions

5.1 Pin Configuration (top view)

TB2959HQ

AUX-IN

PW-GND4

OUT4( )

Mute

OUT4( )

Vcc

OUT3( )

PW-GND3

OUT3( )

AC-GND

IN3

IN4

Pre GND

IN2

IN1

Ripple

OUT ( )

PW-GND1

OUT1( )

Vcc2

OUT2( )

Stby

OUT2( )

PW-GND2

TAB

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5.2 Pin Function Descriptions

Pin Symbol

TAB

PW-GND2

OUT2(-)

OUT2(+)

V

CC2

OUT1(-)

OUT

Stby -IN

OUT

V

CC

-IN

OUT

PW-GND1

OUT1(+) OUT

I/O Description

TAB (Always connect with GND)

Ground for Rear Left output

Rear Left output-

Standby voltage input

Rear Left output+

Supply voltage 2

Front Left output-

Ground for Front Left output

Front Left output+

TB2959HQ

11

12

14

IN1

IN2

IN4

IN

IN

IN

Front Left input

Rear Left input

Rear Right input

16 AC-GND

18 PW-GND3

20 V

21

CC1

OUT4(+)

V

CC

-IN

OUT

IN

23 OUT4(-) OUT

24 PW-GND4

25 AUX-IN IN_Beep

Common reference voltage for all input

Ground for Front Right output

Supply voltage 1

Rear Right output+

Mute voltage input

Rear Right output-

Ground for Rear Right output

BEEP sound or voice synthesizer signal input

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6. Detailed Description

TB2959HQ

Component

Name

Recomm ended

Value

Effect (Note4)

Pin Purpose

Lower than Recommended Value Higher than Recommended Value

C1 0.22 INx(x:1 to 4) To eliminate DC

Ripple

To reduce ripple

Cut-off frequency becomes higher

Turn on/off time and turn-on diag. cycle shorter

Cut-off frequency becomes lower

Turn on/off time and turn-on diag. cycle longer

C3 0.1

V

CC1,

V

CC2

To provide sufficient oscillation margin

Reduces noise and provides sufficient oscillation margin

C4 1uF Mute

F V

CC1,

V

CC2

To reduce pop noise

High pop noise. Duration until mute function is turned on/off is short.

Low pop noise. Duration until mute function is turned on/off is long.

Power supply ripple filtering

C6

1 F

AC-GND

Ripple filter

Common reference voltage for all input

Pop noise is suppressed when C1: C6 = 1:4. (Note5)

C7

0.22

F

R1 47k

AUX-IN

Mute

To eliminate DC

To reduce pop noise

Cut-off frequency is increased in

AUX

High pop noise. Duration until mute function is turned on/off is short.

Cut-off frequency is reduced in

AUX.

Low pop noise. Duration until mute function is turned on/off is long.

Note4: When the unrecommended value is used, please examine it enough by system evaluation.

Note5: Since “AC-GND” pin is a common reference voltage for all input, this product needs to set the ratio of an input apacitance (C1) and the AC-GND capacitance (C6) to 1:4.

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TB2959HQ

7. Standby Switch

The power supply can be turned on or off via pin 4 (Stby). The threshold voltage of pin 4 is set at about 3 V

BE

(typ.). The power supply current is about 0.01

A (typ.) in the standby state.

Table1 Standby Control Voltage (V

SB

)

Stand-by Power V

SB

(V)

ON

OFF

OFF

ON

0 to 0.9

2.2 to V

CC

Check the pop levels when the time constant of pin 4 is changed.

ON

Power

OFF

4

10 k

20 k

60 k

 to Bias

3 k

Figure1 Setting Pin 4 High Turns on

Power

Benefits of the Standby Switch

(1) V

CC

can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.

(2) Since the control current is minuscule, a low-current-rated switching relay can be used.

Relay

V

CC

High-current-rated switch

Battery

V

CC

– Conventional Method –

Battery

From microcontroller

Low-current-rated switch

Battery

Standby V

CC

From microcontroller

Standby V

CC

– Using the Standby Switch –

Figure 2 Standby Switch

Battery

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TB2959HQ

8. Mute switch

The audio mute switch is enabled by setting pin 22 Low. R

1

and C

4

determine the time constant of the mute. The time constant affects pop noise generated when power or the mute is turned on or off; thus, it must be determined on a per-application basis.

The value of the external pull-up resistor is determined, based on pop noise value.

For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:

3.3 V/5 V

47 k

 

31 k

ATT – V

MUTE

20

5 V

R

1

C

4

22

1 k

Mute On/Off control

0

20

40

60

80

100

120

0

0.5

1 1.5 2 2.5

Pin 22 control voltage: V

MUTE

E

(V)

3

Figure 3 Mute Function Figure 4 Mute Attenuation

V

MUTE

(V)

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TB2959HQ

9. Mute Mode

The mute mode in this product is a mute at standby on/off, an internal mute for low voltage. If the mute is turned off before charging C1 and C4 is finished, pop noise occurs because of input offset. Set “mute-off” with sufficient margin in considering a charge time.

9.1 Low Voltage Mute

Low Voltage Mute is operated inside the IC the Ripple pin voltage becomes about under the about

5.6V.

9.2 Standby off Mute

A mute operation starts automatically inside the IC after standby-low until the Ripple pin voltage becomes about 1/2 Vcc-0.7V.

Standby Off

Standby “Hi”

Ripple pin

Voltage

1/2Vcc

1/2Vcc-0.7V

Ripple pin voltage t

Standby off

Operation period of Standby mute

Mute Off

Figure5 Standby Off Mute

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TB2959HQ

10. AUX-Input

The pin 25 is for input terminal of AUX amplifier. The total gain is 0dB by using of AUX amplifier.

Therefore, the

-COM can directly drive the AUX amplifier. BEEP sound or voice synthesizer signal can be input to pin 25 directly.

When AUX function is not used, this pin must be connected to PRE-GND (pin 13) via a capacitor.

IN microcomputer

AUX-IN

25

AUX AMP

-20dB

20dB

20dB

Figure6 AUX-Input

OUT (

)

OUT (

)

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TB2959HQ

11. Protection Functions

This product has internal protection circuits such as thermal shut down, over-voltage, out to V

CC

, out to

GND, and out to out short circuit protections.

(1) Thermal shut down

It operates when junction temperature exceeds 150°C (typ.).

When it operates, it is protected in the following order.

1. An Attenuation of an output starts first and the amount of attenuation also increases according to a temperature rising,

2. All outputs become in a mute state, when temperature continues rising in spite of output attenuation.

3. Shutdown function starts, when a temperature rise continues though all outputs are in a mute state.

In any case if temperature falls, it will return automatically.

(2) Over-voltage

It operates when voltage exceeding operating range is supplied to V

CC pin. If voltage falls, it will return automatically. When it operates, output bias is turned off and an output is intercepted.

(3) Short to V

CC

, Short to GND, Output to output short

It operates when each pin is in irregular connection. If irregular connection is canceled, it will return automatically.

Short circuit protection can operate for each channel.

When it operates, output bias of corresponding output is turned off and an output is intercepted.

Example) If channel 1 output shorts, channel 1 is protected but other channels 2 to 4 are available.

(4) Prevention of speaker damage (in case of a layer short-circuit of the speaker)

When the DC resistance between the OUT

and OUT

pins falls below 1

, the output current exceeds

4 A. At this time, the protection circuit is activated to limit the current draw into the speaker.

This feature prevents the speaker from being damaged, as follows:

< Speaker damaging scenario >

A DC current of over 4 V is applied to the speaker due to an external circuit failure (Note 6).

(Abnormal DC output offset)



The speaker impedance becomes 1

or less due to a layer short.

A current of over 4 A flows into the speaker, damaging the speaker.

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Current into the speaker

Less than 4 A

The short-circuit protection is activated

TB2959HQ

Speaker Impedance

About 1

4

Figure 7 Prevention of speaker damage

Note 6: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines.

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TB2959HQ

12. Absolute Maximum Ratings

(Ta = 25°C

unless otherwise specified

)

supply voltage (surge) supply voltage (DC) supply voltage (operation) output current (peak) power dissipation

Operating temperature range

Storage temperature

max0.2s V

CC (surge)

V

CC (DC)

50 V

25 V

V

CC (opr)

18 V

9 A

(Note7)

I

O (peak)

P

D

T opr

T stg

-40 to 85

-55 to 150

°C

°C

Note7: Package thermal resistance R th(j-t)

= 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)

The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant.

If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage, and/or degradation to any other equipment. Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions.

Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.

12.1 Power Dissipation

120

100

80

60

40

20

0

0

(1)

(3)

25 50

P

D

(max)

– Ta

(1) Infinite heat sink

R th(j-t)

= 1

C/W

(2) Heat sink (R th(HS)

= 3.5

C/W)

R th(j-t)

+ R th(HS)

= 4.5

C/W

(3) No heat sink

R th(j-a)

= 39

C/W

75

(2)

100 125

Ambient Temperature Ta (°C)

150

13. Operating Ranges

Characteristics Symbol Min Typ. Max Unit

Supply voltage

V

CC

Condition

R

L

=4

6 18 V

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TB2959HQ

14. Electrical Characteristics

Quiescent supply current

Output power

Total harmonic distortion

Voltage gain

(V

CC

= 13.2 V, f = 1 kHz, R

L

= 4

, G

V

=26dB, Ta = 25°C unless otherwise specified)

Test

Circuit

Test Condition Min Typ. Max Unit

I

CCQ

160 300 mA

P

OUT

MAX (1)

P

OUT

MAX (2)

P

OUT

(1)

P

OUT

(2)

THD

G

V

V

IN

0

V

CC

15.2 V, max POWER

V

CC

14.4 V, max POWER

V

CC

14.4 V, THD

10%

THD

P

OUT

5 W

V

OUT

0.775 Vrms

47

42

27

21 23

0.005

25 26 27

W

% dB

Channel-to-channel voltage gain

G

V

V

OUT

0.775 Vrms

1.0 0 1.0 dB

Output noise voltage

Ripple rejection ratio

Crosstalk

Output offset voltage

Input resistance

Standby current

Standby control voltage

Mute control voltage

Mute attenuation

V

NO

(1)

V

NO

(2)

R.R.

C.T.

V

OFFSET

R

IN

I

SB

V

SB

H

V

SB

L

V

M

H

V

M

L

ATT M

R g

0

, DIN45405

R g

0

, BW

20 Hz to 20 kHz f rip

100 Hz, R

V rip g

620



(Note9)

0.775 Vrms

R g

620

P

OUT

4 W

50

50 70

80

50

Vrms

dB

dB

90 0 90 mV

90

 k



Standby condition, V4

0, V22

0

POWER:

POWER:

0.01 1

2.2

0

A

V

CC

0.9

V

MUTE: 2.2

Vcc

MUTE: R

1

47 k

0

V

MUTE: ON, DIN_AUDIO

V

OUT

7.75 Vrms

Mute: OFF

85 100

dB

Upper cut-off frequency

F th

G

V

26dB, 3dB down

400

kHz

Note9: f

RIP

V

RIP

Ripple frequency

Ripple signal voltage (AC fluctuations in the power supply)

13 2011-11-08

15. Test Circuit

TB2959HQ

Components in the test circuits are only used to obtain and confirm the device characteristics.

14 2011-11-08

TB2959HQ

16. Characteristic Chart

16.1 Total Harmonic Distortion vs. Output Power

THD – P

OUT

(ch1)

100

50

VCC = 13.2 V

GV = 26dB

30

RL = 4

Filter

10

100 Hz : to 30 kHz

1 kHz : 400 Hz to 30 kHz

5

3

10 kHz : 400 Hz to

20 kHz : 400 Hz to

THD – P

OUT

(ch2)

100

50

VCC = 13.2 V

30

GV = 26dB

RL = 4

Filter

10

100 Hz : to 30 kHz

1 kHz : 400 Hz to 30 kHz

5

3

10 kHz : 400 Hz to

20 kHz : 400 Hz to

1

0.5

0.3

0.1

0.05

0.03

0.01

0.005

0.003

0.001

1

0.5

0.3

0.1

0.05

0.03

0.01

0.005

0.003

20 kHz

10 kHz

100 Hz f = 1 kHz

0.001

0.1 0.3 0.5 10

Output power P

OUT

(W)

50 100

THD – P

OUT

(ch3)

100

50

VCC = 13.2 V

GV = 26dB

30

RL = 4

Filter

10

100 Hz : to 30 kHz

1 kHz : 400 Hz to30 kHz

5

3

10 kHz : 400 Hz to

20 kHz : 400 Hz to

20 kHz

10 kHz

100 Hz f = 1 kHz

0.1

0.05

0.03

0.01

0.005

0.003

1

0.5

0.3

0.1

0.05

0.03

0.01

0.005

0.003

1

0.5

0.3

20 kHz

10 kHz

100 Hz f = 1 kHz

0.001

0.1

0.3

0.5

Output power P

OUT

(W)

THD – P

OUT

(ch4)

100

50

VCC = 13.2 V

30

GV = 26dB

RL = 4

Filter

10

100 Hz : to 30 kHz

1 kHz : 400 Hz to 30 kHz

5

3

10 kHz : 400 Hz to

20 kHz : 400 Hz to

20 kHz

10 kHz

100 Hz f = 1 kHz

Output power P

OUT

(W)

0.001

0.1

0.3

0.5

Output power P

OUT

(W)

Figure 11-1 Total Harmonic Distortion of Each Frequency (R

L

= 4

)

15 2011-11-08

TB2959HQ

0.1

0.05

0.03

1

0.5

0.3

0.01

0.005

0.003

THD – P

OUT

(ch1)

100

50

30

GV = 26dB

RL = 4

 f = 1 kHz

Filter

400 Hz to 30 kHz

10

13.2 V

5

3

VCC = 6.0 V 16.0 V

0.1

0.05

0.03

0.01

0.005

0.003

1

0.5

0.3

THD – P

OUT

(ch2)

100

50

30

GV = 26dB

RL = 4

 f = 1 kHz

Filter

400 Hz to 30 kHz

10

13.2 V

5

3

VCC = 6.0 V 16.0 V

0.1

0.05

0.03

0.01

0.005

0.003

0.001

Output power P

OUT

(W)

THD – P

OUT

(ch3)

100

50

30

GV = 26dB

RL = 4

 f = 1 kHz

Filter

400 Hz to 30 kHz

10

13.2 V

5

3

1

0.5

0.3

VCC = 6.0 V 16.0 V

0.001

0.1

0.05

0.03

0.01

0.005

0.003

0.001

0.1

0.3

0.5

Output power P

OUT

(W)

THD – P

OUT

(ch4)

100

50

30

GV = 26dB

RL = 4

 f = 1 kHz

Filter

400 Hz to 30 kHz

10

13.2 V

5

3

1

0.5

0.3

VCC = 6.0 V 16.0 V

Output power P

OUT

(W)

0.001

0.1

0.3

0.5

Output power P

OUT

(W)

Figure 11-2 Total Harmonic Distortion by Power-supply Voltage (R

L

= 4

)

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TB2959HQ

16.2 Various Frequency Characteristics

3

1

0.3

VCC = 13.2 V

RL = 4

POUT = 5 W

Filter nothing

0.1

16 V

0.03

0.01

13.2 V

8 V

THD – f

0.003

0.001

0.01 0.1

1 10

Frequency f (kHz)

100

Figure 11-3 Frequency Characteristics of Total Harmonic Distortion

28

26

24

22

20

0.01

G

V

– f

1ch to 4ch

0.1 1

VCC = 13.2 V

RL = 4

VOUT = 0.775 Vrms (0dBm)

10

Frequency f (kHz)

100

60

80

100

120

0.01

ATT

MUTE

– f

0

20

VCC = 13.2 V

RL = 4

VOUT = 7.75 Vrms (20dBm)

40

0.1

1ch~4ch

1 10

Frequency f (kHz)

Figure 11-4 Frequency Characteristics of Voltage Gain and Mute Attenuation

100

17 2011-11-08

TB2959HQ

R.R. – f (G

V

= 26dB)

0

20

VCC = 13.2 V

RL = 4

RG = 620

Vrip = 0.775 Vrms (0dBm)

GV = 26dB

40

60

2ch

1ch

4ch

3ch

80

0.01 0.1

1 10

Frequency f (kHz)

100

Figure 11-5 Frequency Characteristics of Ripple Rejection Rate

C.T. – f (ch1)

0

VCC = 13.2 V

RL = 4

 f = 1 kHz

20

VOUT = 0.775 Vrms (0dBm)

RG = 620

40

C.T. – f (ch2)

0

20

VCC = 13.2 V

RL = 4

 f = 1 kHz

VOUT = 0.775 Vrms (0dBm)

RG = 620

40

2ch

60

4ch

80

60

80

100

0.01

3ch

0.1 1 10

Frequency f (kHz)

100

100

0.01

0.1

1 10

Frequency f (kHz)

1ch

4ch

3ch

100

C.T. – f (ch3)

0

VCC = 13.2 V

RL = 4

 f = 1 kHz

20

VOUT = 0.775 Vrms (0dBm)

RG = 620

40

1ch

60

2ch

80

100

0.01 0.1 1 10

Frequency f (kHz)

4ch

100

C.T. – f (ch4)

0

20

VCC = 13.2 V

RL = 4

 f = 1 kHz

VOUT = 0.775 Vrms (0dBm)

RG = 620

40

60

1ch

80

2ch

100

0.01

0.1

1 10

Frequency f (kHz)

3ch

100

Figure 11-6 Frequency Characteristics of Cross Talk

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TB2959HQ

16.3 Output Power Characteristics to Input Voltage

P

OUT

(ch1) – V

IN

50 50

100 Hz

40 40

30

20

1 kHz f = 20 kHz 10 kHz

30

20

10

VCC = 13.2 V

RL = 4

Filter nothing

0

0 1 2 3 4 5

Input voltage V

IN (rms)

(V)

P

OUT

(ch3) – V

IN

50

100 Hz

40

1 kHz f = 20 kHz

10 kHz

P

OUT

(ch2) – V

IN

100 Hz

30

20

1 kHz f = 20 kHz 10 kHz

30

20

10

VCC = 13.2 V

RL = 4

Filter nothing

0

0 1 2 3 4 5

Input voltage V

IN (rms)

(V)

P

OUT

(ch4) – V

IN

50

100 Hz

40

1 kHz f = 20 kHz

10 kHz

10

VCC = 13.2 V

RL = 4

Filter nothing

0

0 1 2 3 4 5

Input voltage V

IN (rms)

(V)

16.4 Power Dissipation vs. Output Power

P

D

– P

OUT

(R

L

= 4

)

80 f = 1 kHz

RL = 4

4ch drive

60

10

VCC = 13.2 V

RL = 4

Filter nothing

0

0 1 2 3 4 5

Input voltage V

IN (rms)

(V)

18 V

40

20

6.0 V

0

0 5 10

Output power

P

OUT

(W)

13.2 V

25

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16.5 Other Characteristic

V

NO

– R g

150

100

VCC = 13.2 V

RL = 4

 f = 1 kHz

Filter

to 20 kHz

1ch~4ch

50

0

10 100 1 k 10 k

Signal source resistance R g

(

)

100 k

TB2959HQ

I

CCQ

– V

CC

150

100

50

250

200

VIN = 0 V

RL =

0

15

Supply voltage V

CC

(V)

25

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17. Package Dimensions

TB2959HQ

Weight: 7.7g (typ.)

About solderability, following conditions were confirmed.

(1) Use of Sn-37Pb solder Bath

 solder bath temperature = 230°C

 dipping time = 5 seconds the number of times = once use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

 solder bath temperature = 245

°C

 dipping time = 5 seconds the number of time = once use of R-type flux

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TB2959HQ

18. 4ch Power IC Evaluation Board

This drawing is a component side, and a schematic diagram of evaluation board “RP-2024 for 4ch power

IC using HZIP25-P-1.00F (SPP25), a solder side.

Note: This board can be shared with some products.

Please confirm external parts of the evaluated product beforehand when you unite the evaluation board.

Component side

Figure 18-1 Pattern of Evaluation Board (component side)

Solder side

Figure 18-2 Pattern of Evaluation Board (solder side)

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19. Attention in Use

Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.

Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components.

Installation to Heat Sink

Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks.

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RESTRICTIONS ON PRODUCT USE

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for

Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign

Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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