Package Migration 3V FG MirrorBit AN

Package Migration 3V FG MirrorBit AN
Package Migration Between 3.0V
Floating Gate and MirrorBit® Flash
Devices
Application Note
1. Introduction
This application note illustrates migration options between 3V single bit Floating Gate and 3V MirrorBit®
devices. Each drawing shows at least one migration path. A “migration path” is a logical progression from one
density to another within a group of devices sharing a common voltage range, architecture, bus width. All
drawings show the top view of packages.
Publication Number Package_Migration_3V_FG_MirrorBit_AN
Revision 01
Issue Date March 14, 2011
A pplication
Note
2. 48-Pin TSOP: 3.0 Volt x8/x16 or x16-Only Devices
3V
Standard
3V
Sim R/W
3V
MirrorBit
S29GL064N (06, 07, V6, V7)
S29AL032D (03, 04)
S29JL064J
S29GL064N (03, 04)
S29JL032J
S29GL032N (03, 04)
S29AL016J
A15
A14
A13
A12
A11
A10
A9
A8
A21
A20
WE#
RESET#
ACC
WP#
A19
A18
A17
A7
A6
A5
A4
A3
A2
A1
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
NC
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A15
A14
A13
A12
A11
A10
A9
A8
NC
WE#
RESET#
NC
WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48-Pin
TSOP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
A16
VIO
VSS
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
S29AL016J A19
S29AL008J NC
Note:
The S29GL064N Models 06, 07, V6, and V7 are x16-bit only devices.
2
Package_Migration_3V_FG_MirrorBit_AN_01
March 14, 2011
App l ic atio n
3.
No t e
56-Pin TSOP: 3.0 Volt x8/x16 Devices
3V
MirrorBit
S29GL01P
S29GL512P
S29GL256P
S29GL128P
S29GL064N (01, 02, V1, V2)
S29GL032N (01, 02, V1, V2)
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
NC
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
NC
NC
NC
NC
A15
A15
A14
A14
A13
A13
A12
A12
A11
A11
A10
A10
A9
A9
A8
A8
A19
A19
A20
A20
WE#
WE#
RESET#
RESET#
A21
NC
WP#/ACC WP#/ACC
RY/BY#
RY/BY#
A18
A18
A17
A17
A7
A7
A6
A6
A5
A5
A4
A4
A3
A3
A2
A2
A1
A1
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56-Pin TSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48-Pin
TSOP
(Note)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
NC
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
A24
NC
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
A24
A25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
Note:
1. Only S29GL032N and S29GL064N Models 03 and 04 are offered in 48-pin TSOP packages.
March 14, 2011
Package_Migration_3V_FG_MirrorBit_AN_01
3
A pplication
4.
Note
64-Ball Fortified BGA: 3.0 Volt x8/x16 Devices
Top view shown, with balls facing down.
64-ball Grid Array
A
B
C
B
8
C
D
D
E
E
6
5
4
3
G
G
H
H
6
NC
7
F
F
NC
VSS
5
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
A9
A8
A10
A11
D7
D14
D13
D6
WE#
RST
A19
D5
D12
VCC
D4
RY/BY#
ACC/WP#
A18
D2
D10
D11
D3
A7
A17
A6
A5
D0
D8
D9
D1
A3
A4
A2
A1
A0
CE#
OE#
VSS
NC
NC
NC
4
3
2
1
2
1
NC
3V
Standard
3V
MirrorBit
S29AL016J
4
NC
B8
B1
C8
C5
D8
D4
F1
F8
G8
Package
Body
NC
NC
NC
NC
NC
NC
NC
NC
NC
9 x 9 mm
9 x 9 mm
S29GL032N
NC
NC
NC
NC
VIO
A20
VIO
NC
NC
S29GL064N
NC
NC
NC
A21
VIO
A20
VIO
NC
NC
9 x 9 mm
S29GL128P
A22
NC
NC
A21
VIO
A20
VIO
NC
NC
13 x 11 mm
S29GL256P
A22
NC
A23
A21
VIO
A20
VIO
NC
NC
13 x 11 mm
S29GL512P
A22
NC
A23
A21
VIO
A20
VIO
A24
NC
13 x 11 mm
S29GL01GP
A22
NC
A23
A21
VIO
A20
VIO
A24
A25
13 x 11 mm
S70GL02GP
A22
A26
A23
A21
VIO
A20
VIO
A24
A25
13 x 11 mm
Package_Migration_3V_FG_MirrorBit_AN_01
March 14, 2011
App l ic atio n
5.
No t e
48-Ball FBGA: 3.0 Volt x8/x16 or x16-Only Devices
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch.
48-ball Grid Array
A
B
C
D
E
F
G
H
6
VSS
A13
A12
A14
A15
A16
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
WE#
RESET#
DQ5
DQ12
VCC
DQ4
DQ2
DQ10
DQ11
DQ3
5
4
3
RY/BY#
2
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A3
A4
A2
A1
A0
CE#
OE#
VSS
1
B3
C3
C4
D4
D3
F6
G6
Package
Body
S29AL008J
WP #
A18
NC
NC
NC
BYTE#
DQ15/A-1
8.15 x
6.15 mm
S29AL016J
WP#
A18
NC
A19
NC
BYTE#
DQ15/A-1
8.15 x
6.15 mm
WP#/
ACC
A18
NC
A19
A20
BYTE#
DQ15/A-1
8.15 x
6.15 mm
WP#/
ACC
A18
NC
A19
A20
NC
DQ15
8.15 x
6.15 mm
WP#/
ACC
A18
A21
A19
A20
BYTE#
DQ15/A-1
8.15 x
6.15 mm
WP#/
ACC
A18
A21
A19
A20
NC
DQ15
8.15 x
6.15 mm
3V Standard 3V Sim R/W
A29AL032D
(1)
S29JL032J
3V MirrorBit
S29GL032N
S29PL032J
(2)
S29JL064J
S29PL064J
(2)
S29GL064N
Notes:
1. S29AL032D Model 03, 04 with Package Body is 10 x 6 mm.
2. S29PL032J and S29PL064J are x16-bit only devices.
March 14, 2011
Package_Migration_3V_FG_MirrorBit_AN_01
5
A pplication
Note
6. Revision History
Section
Description
Revision 01 (March 14, 2011)
Initial release
6
Package_Migration_3V_FG_MirrorBit_AN_01
March 14, 2011
App l ic atio n
No t e
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2011 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™ and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used
are for informational purposes only and may be trademarks of their respective owners.
March 14, 2011
Package_Migration_3V_FG_MirrorBit_AN_01
7
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