TVS Diode Arrays Lightning Surge Protection - SP03-3.3 Series

TVS Diode Arrays  Lightning Surge Protection - SP03-3.3 Series
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP03-3.3 Series
SP03-3.3 Series 3.3V 150A Diode Array
RoHS
Pb GREEN
This new broadband protection device from Littelfuse
provides overvoltage protection for applications such
as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces,
ADSL2+, and VDSL2+. This new protector combines the
TVS diode element with a diode rectifier bridge to provide
both longitudinal and differential protection in one package.
This design innovation results in a capacitive loading
characteristic that is log-linear with respect to the signal
voltage across the device. This reduces intermodulation
(IM) distortion caused by a typical solid-state protection
solution. The application schematic provides the
connection information.
Agency Approvals - Pending
Agency
Features
• SOIC-8 surface mount
package (JEDEC MS-012)
E128662
Pinout
1
8
2
7
3
6
4
5
• Low insertion loss, loglinear capacitance
• Pending UL recognized
component
• Combined longitudinal
and metallic protection
• Low clamping voltage
Applications
• T1/E1 Line cards
• 10/100/1000 BaseT
Ethernet
• T3/E3 and DS3 Interfaces
Functional Block Diagram
Pin 1 and 8
• UL 94V-0 epoxy molding
• Lightning Protection,
IEC61000-4-5, 100A
(8/20µs)
SOIC-8 (Top View)
Line in
• Clamping speed of
nanoseconds
• RoHS compliant
Agency File Number
• STS-1 Interfaces
Line out
Application Example
TeleLink (0461 1.25)
TIP
Pin 2, 3, 6,
and 7
Line out
Line in
Pin 4 and 5
Resources
1
8
2
7
3
6
4
5
to chipset
(Ethernet PHY,
T3/E3 PHY, etc.)
RING
Additional Information
Datasheet
SP03-3.3
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
This schematic shows a high-speed data interface
protection solution. The SP03-3.3 provides both metallic
(differential) and longitudinal (common mode) protection
from lightning induced surge events. Its surge rating is
compatible with the intra-building surge requirements
of Telcordia’s GR-1089-CORE, and the Basic Level
Recommendations of ITU K.20 and .21. This device
protects against both positive and negative induced surge
events. The TeleLink fuse provides overcurrent protection
for the long term 50/60 Hz power fault events.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
SP03-3.3
Description
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP03-3.3 Series
Absolute Maximum Ratings
Thermal Information
Parameter
Rating
Parameter
Units
Rating
Units
170
°C/W
Peak Pulse Current (8/20µs)
150
A
SOIC Package
Peak Pulse Power (8/20µs)
3300
W
Operating Temperature Range
–40 to 125
°C
–55 to 150
°C
IEC 61000-4-2, Direct Discharge, (Level 4)
30
kV
Storage Temperature Range
IEC 61000-4-2, Air Discharge, (Level 4)
30
kV
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
260
°C
IEC 61000-4-5 (8/20µs)
100
A
Telcordia GR 1089 (Intra-Building) (2/10µs)
100
A
ITU K.20 (5/310µs)
40
A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VRWM
-
-
-
3.3
V
Reverse Breakdown Voltage
VBR
IT= 2µA
3.3
-
-
V
Reverse Breakdown Voltage
VBR
IT= 50µA
3.3
-
-
V
Reverse Stand-Off Voltage
Reverse Leakage Current
IR
VRWM= 3.3V, T= 25°C
-
-
1
µA
Clamping Voltage, Line-Ground
VC
IPP= 50A, tp=8/20 µs
-
-
11.5
V
Clamping Voltage, Line-Ground
VC
IPP= 100A, tp=8/20 µs
-
-
15
V
Clamping Voltage, Line-Line
VC
IPP= 50A, tp=8/20 µs
-
-
13.5
V
Clamping Voltage, Line-Line
VC
IPP= 100A, tp=8/20 µs
-
-
18
V
Between I/O Pins and Ground
VR=0V, f= 1MHz
-
16
25
pF
Between I/O Pins
VR=0V, f= 1MHz
-
8
12
pF
Junction Capacitance
Cj
Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time
Figure 2: Current Derating Curve
120
Percentage of Rated Current (%IP)
Peak Pulse Current (A)
1000
100
10
1
1
10
100
Pulse decay time (µs)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
1000
100
80
60
40
20
0
0
20
40
60
80
100
Ambient Temperature (C)
120
140
160
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP03-3.3 Series
Figure 3: Pulse Waveform
Figure 4: Clamping Voltage vs. Peak Pulse Current
20
100
18
VC Clamping Voltage (V)
Percentage of IPP (%)
16
80
60
40
20
14
12
Line to Line
10
8
6
Line to Ground
4
2
0
0
0
5
10
15
20
25
30
35
0
40
10
20
30
40
50
Figure 5: Capacitance vs. Reverse Voltage
70
80
90
100
Figure 6: Forward Voltage vs. Forward Current
7
20
18
6
Line to Ground
Ground-to-Line
Forward Voltage (V)
16
Capacitance (pF)
60
IP Peak Impulse Current (A)
Time, µs
14
12
10
8
Line to Line
6
4
5
4
3
2
1
2
0
0
0
0.5
1
1.5
2
2.5
0
3
10
20
30
Reverse Voltage (V)
40
50
60
70
80
90
100
Forward Current (A)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
tS
time to peak temperature
Time
°C
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP03-3.3 Series
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package
SOIC-8
Pins
8
JEDEC
MS-012
Millimetres
LF
o
Recommended
Soldering Pad Outline
(Reference Only)
Inches
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.050
0.065
B
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
1.27 BSC
e
1.27
0.40
L
0.050 BSC
0.050
0.016
Embossed Carrier Tape & Reel Specification — SOIC Package
Millimetres
E
G= Green
Package
B = SOIC
Series
Working
Voltage
LF SP03-3.3
First Line: Part number
Second Line: Date code
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP03-3.3BTG
SOIC Tape & Reel
SP03-3.3
2500
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
0.065
0.073
5.6
0.213
0.22
2.05
0.077
0.081
D
1.5
1.6
0.059
0.063
1.50 Min
3.9
4.1
40.0 ± 0.20
0.059 Min
0.154
0.161
1.574 ± 0.008
W
11.9
12.1
0.468
0.476
P
7.9
8.1
0.311
0.319
A0
6.3
6.5
0.248
0.256
B0
5.1
5.3
0.2
0.209
K0
2
2.2
0.079
0.087
0.30 ± 0.05
0.012 ± 0.002
Product Characteristics
Part Marking System
XXXXXXXX
1.85
5.4
t
T= Tape & Reel
Max
1.65
1.95
10P0
TVS Diode Arrays
(SPA® Diodes)
Min
F
P0
SP 03 – 3.3 B T G
Max
P2
D1
Part Numbering System
Inches
Min
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
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