datasheet for 54LS42/BEA by Rochester Electronics

datasheet for 54LS42/BEA by Rochester Electronics
INCH-POUND
MIL-M-38510/307D
12 March 2003 __
SUPERSEDING
MIL-M-38510/307C
5 November 1987
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR LOW-POWER SCHOTTKY TTL,
DECODERS, MONOLITHIC SILICON
Inactive for new design after 18 April 1997.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, low-power Schottky TTL,
decoder microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided
for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have
been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part number. The part number shall be in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types shall be as follows:
Device type
01
02
03
04
Circuit
Single 3 to 8 line decoder
Dual 2 to 4 line decoder
BCD-to-decimal decoder
BCD-to-seven segment decoder/driver
(15-volt, open collector output)
1.2.2 Device class. The device class shall be the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines shall be as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
X
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC2-N20
CQCC1-N20
Terminals
16
16
20
20
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN:
DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization
Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5962
MIL-M-38510/307D
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
Input voltage range ................................................................................
Storage temperature range ....................................................................
Maximum power dissipation (PD) 1/
Device type 01 .................................................................................
Device type 02 ..................................................................................
Device type 03 and 04 ......................................................................
Output voltage (off state) (device type 04) .............................................
Output current (device type 04) ..............................................................
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC):
Cases E, F, X, and 2 .............................................................................
Junction temperature (TJ) 2/...................................................................
-0.5 V dc to 7.0 V dc
-1.5 V dc at -18 mA to 5.5 V dc
-65° to +150°C
55 mW dc
60.5 mW dc
71.5 mW dc
15 V dc
12 mA dc
300°C
(See MIL-STD-1835)
175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) .............................................................................. 4.5 V dc minimum to 5.5 V dc
maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc
Maximum low level input voltage (VIL) .................................................... 0.7 V dc
Case operating temperature range (TC) ................................................. -55° to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the
issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited
in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
MIL-STD-1835
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Unless otherwise indicated, copies of the above specifications and standards are available from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in
screening conditions in accordance with MIL-PRF-38535.
2
MIL-M-38510/307D
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3.2 Truth tables. The truth tables shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 11 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.
3
MIL-M-38510/307D
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TC ≤ +125°C
unless otherwise specified
VIL = 0.7 V
IOH = -50 µA
VCC = 4.5 V
VIH = 2.0 V
IOH = -400 µA
High level output voltage
VOH1
High level output voltage
VOH2
Low level output voltage
at BI/RBO
Low level output voltage
VOL1
IOL = 1.6 mA
VOL2
IOL = 1/
Input clamp voltage
VIC
Maximum collector
cut-off current
Low level input current
at A, B, C, D, G
ICEX
IIN = -18 mA,
TC = +25°C
VOH = 15 V
Low level input current
at LT and RBI
Low level input current
at BI/RBO
High level input
current
Short circuit output
current
Supply current
Limits
Min
Max
Unit
04
2.4
V
01, 02,
03
04
2.5
V
01, 02,
03, 04
All
04
0.40
V
0.40
V
-1.5
V
250
µA
IIL2
01
02, 03
04
04
-.001
-.03
-.10
-.11
-.38
-.40
-.34
-.36
mA
IIL3
04
-.36
-1.37
mA
IIL1
VCC = 5.5 V
VIN = 0.4 V
Device
types
mA
IIH1
VIN = 2.7 V
All
20
µA
IIH2
VIN = 7.0 V
All
100
µA
IOS
VIH = 5.5 V 2/
VIL = GND
mA
-6
-15
RL = 665Ω ±10%
01, 03
02
01
02
03, 04
04
5
-130
-100
10
11
13
158
RL = 2.0 kΩ ±10%
01, 02
5
38
ns
03
5
45
ns
01
5
35
ns
02
5
44
ICC
Propagation delay time,
tPLH1
low to high level
Propagation delay time,
tPLH2
low to high level
through 2 levels of logic
(binary select to output)
Propagation delay time,
tPLH2
low to high level
through 2 levels of logic
(A, B, C, or D to output)
Propagation delay time,
tPLH3
low to high level
through 2 levels of logic
(enable to output)
See footnotes at end of table.
VCC = 5.0 V
CL = 50 pF ±10%
4
mA
ns
MIL-M-38510/307D
TABLE I. Electrical performance characteristics - Continued.
Test
Propagation delay time,
low to high level
through 3 levels of logic
(binary select to output)
Propagation delay time,
low to high level
through 3 levels of logic
(A, B, C, or D to output)
Propagation delay time,
low to high level
through 3 levels of logic
(enable to output)
Propagation delay time,
high to low level
Propagation delay time,
high to low level
through 2 levels of logic
(binary select to output)
Propagation delay time,
high to low level
through 2 levels of logic
(A, B, C, or D to output)
Propagation delay time,
high to low level
through 2 levels of logic
(enable to output)
Propagation delay time,
high to low level
through 3 levels of logic
(binary select to output)
Propagation delay time,
high to low level
through 3 levels of logic
(A, B, C, or D to output)
Propagation delay time,
high to low level
through 3 levels of logic
(enable to output)
Symbol
tPLH4
Conditions
-55°C ≤ TC ≤ +125°C
unless otherwise specified
VCC = 5.0 V
RL = 2.0 kΩ ±10%
CL = 50 pF ±10%
Device
types
Limits
Min
Max
Unit
01
5
48
ns
02
5
51
tPLH4
03
5
53
ns
tPLH5
01
5
47
ns
tPHL1
RL = 665Ω ±10%
04
5
158
ns
tPHL2
RL = 2.0 kΩ ±10%
01
5
69
ns
02
5
57
tPHL2
03
5
45
ns
tPHL3
01, 02
5
56
ns
tPHL4
01
5
81
ns
02
5
65
tPHL4
03
5
53
ns
tPHL5
01
5
65
ns
1/ IOL = 4 mA for device types 01, 02, and 03; IOL = 12 mA for device type 04.
2/ Not more than one output should be shorted at one time.
5
MIL-M-38510/307D
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
1
1
MIL-PRF-38535
test requirements
Interim electrical parameters
Final electrical test parameters
Group A test requirements
Group C end-point electrical parameters
Group D end-point electrical parameters
1*, 2, 3, 7, 9,
10, 11
1, 2, 3, 7, 8,
9, 10, 11
1, 2, 3, 7, 8
9, 10, 11
1, 2, 3
1*, 2, 3, 7, 9,
10, 11
1, 2, 3, 7, 8,
9, 10, 11
1, 2, 3
1, 2, 3
*PDA applies to subgroup 1.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be
as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional and positive when flowing into the referenced terminal.
6
MIL-M-38510/307D
Pin number
Device type 01
Pin
number
X, 2
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
NC
A
B
C
G2A
NC
G2B
G1
Y7
GND
NC
Y6
Y5
Y4
Y3
NC
Y2
Y1
Y0
VCC
A
B
C
G2A
G2B
G1
Y7
GND
Y6
Y5
Y4
Y3
Y2
Y1
Y0
VCC
Pin number
Pin number
Device type 02
Device type 03
Cases
X, 2
E, F
X, 2
E, F
NC
1G
1A
1B
1Y0
NC
1Y1
1Y2
1Y3
GND
NC
2Y3
2Y2
2Y1
2Y0
NC
2B
2A
2G
VCC
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
2Y3
2Y2
2Y1
2Y0
2B
2A
2G
VCC
NC
0
1
2
3
NC
4
5
6
GND
NC
7
8
9
D
NC
C
B
A
VCC
FIGURE 1. Terminal connections.
7
0
1
2
3
4
5
6
GND
7
8
9
D
C
B
A
VCC
Pin number
Device type 04
X, 2
E, F
NC
B
C
LT
BI/RBO
NC
RBI
D
A
GND
NC
e
d
c
b
NC
a
g
f
VCC
B
C
LT
BI/RBO
RBI
D
A
GND
e
d
c
b
a
g
f
VCC
MIL-M-38510/307D
DEVICE TYPE 01
OUTPUTS
INPUTS
ENABLE
SELECT
G1
G2*
C
B
A
Y0
Y1
Y2
Y3
Y4
Y5
X
H
X
X
X
H
H
H
H
H
H
H
H
L
X
X
X
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
H
H
L
H
H
H
H
H
H
H
L
L
H
L
H
H
L
H
H
H
H
H
H
L
L
H
H
H
H
H
L
H
H
H
H
H
L
H
L
L
H
H
H
H
L
H
H
H
H
L
H
L
H
H
H
H
H
H
L
H
H
H
L
H
H
L
H
H
H
H
H
H
L
H
H
L
H
H
H
H
H
H
H
H
H
H
L
*G2 = G2A + G2B
H = high level, L = low level, X = irrelevant.
DEVICE TYPE 02
OUTPUTS
INPUTS
ENABLE
G
SELECT
B
A
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
H = high level, L = low level, X = irrelevant.
FIGURE 2. Truth tables.
8
Y6
Y7
MIL-M-38510/307D
DEVICE TYPE 03
INPUTS
OUTPUTS
D
C
B
A
0
1
L
L
L
L
L
L
L
L
H
L
L
H
L
H
L
L
H
L
L
H
H
L
2
3
4
5
6
7
8
9
L
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
L
H
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
L
L
L
H
H
H
H
H
H
H
H
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
L
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
FIGURE 2. Truth tables - Continued.
9
MIL-M-38510/307D
DEVICE TYPE 04
DECIMAL
OR
INPUTS
OUTPUTS
FUNCTION
LT
RBI
D
C
B
A
BI/RB0
a
b
c
d
e
f
g
NOTE
0
H
H
L
L
L
L
H
L
L
L
L
L
L
H
1
1
H
X
L
L
L
H
H
H
L
L
H
H
H
H
1
2
H
X
L
L
H
L
H
L
L
H
L
L
H
L
3
H
X
L
L
H
H
H
L
L
L
L
H
H
L
4
H
X
L
H
L
L
H
H
L
L
H
H
L
L
5
H
X
L
H
L
H
H
L
H
L
L
H
L
L
6
H
X
L
H
H
L
H
H
H
L
L
L
L
L
7
H
X
L
H
H
H
H
L
L
L
H
H
H
H
8
H
X
H
L
L
L
H
L
L
L
L
L
L
L
9
H
X
H
L
L
H
H
L
L
L
H
H
L
L
10
H
X
H
L
H
L
H
H
H
H
L
L
H
L
11
H
X
H
L
H
H
H
H
H
L
L
H
H
L
12
H
X
H
H
L
L
H
H
L
H
H
H
L
L
13
H
X
H
H
L
H
H
L
H
H
L
H
L
L
14
H
X
H
H
H
L
H
H
H
H
L
L
L
L
15
H
X
H
H
H
H
H
H
H
H
H
H
H
H
BI
X
X
X
X
X
X
L
H
H
H
H
H
H
H
2
RBI
H
L
L
L
L
L
L
H
H
H
H
H
H
H
3
LT
L
X
X
X
X
X
H
L
L
L
L
L
L
L
4
NOTES:
1. BI/RBO is wire-OR logic serving as blanking input (BI) and/or ripple-blanking output (RBO). The blanking
input must be open or held at a high logic level when output functions 0 through 15 are desired and rippleblanking input (RBI) must be held open or at a high logic level during the decimal 0 input, X = input may be
high or low.
2. When a low logic level is applied to the blanking input (forced condition) all segment outputs go to a high logic
level regardless of the state of any other input condition.
3. When ripple-blanking input (RBI) is at a low logic level, lamp test input is at high logic level and A = B = C = D
= low logic level, all segment outputs go to a high logic level and the ripple-blanking output goes to a low logic
level (response condition).
4. When blanking input/ripple-blanking output is open or held at a high logic level, and a low logic level is
applied to lamp-test input, all segment outputs go to a low logic level.
FIGURE 2. Truth tables - Continued.
10
MIL-M-38510/307D
NOTES:
1. The pulse generator has the following characteristics: t1 ≤ 15 ns, t0 ≤ 6 ns, PRR ≤ 1 MHz.
2. CL includes probe and jig capacitance.
3. Input - output waveform combination in accordance with the truth tables (see figure 2).
4. All diodes are 1N3064, or equivalent.
FIGURE 3. Switching times for device types 01, 02, and 03.
11
MIL-M-38510/307D
NOTES:
1. Pulse generator characteristics: PRR ≤ 1.0 MHz, t1 ≤ 15 ns, t0 ≤ 6 ns, and Zout ≈ 50Ω.
2. CL includes probe and jig capacitance.
3. Input - output waveform combination in accordance with the truth tables (see figure 2).
FIGURE 4. Switching test circuit and waveforms for device type 04.
12
TABLE III. Group A inspection for device type 01. 1/
Subgroup
1
Tc = 25°C
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Y6
Y5
Y4
Y3
Y2
Y1
Y0
-.4 mA
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
A
B
C
G2A
G2B
G1
Y7
1
0.7 V
2
"
3
"
4
"
5
"
6
"
7
"
8
"
-.4 mA
VOL2
9
0.7 V
0.7 V
0.7 V
0.7 V
0.7 V
2.0 V
10
2.0 V
0.7 V
"
"
"
"
11
0.7 V
2.0 V
"
"
"
"
12
2.0 V
2.0 V
"
"
"
"
13
0.7 V
0.7 V
2.0 V
"
"
"
14
2.0 V
0.7 V
"
"
"
"
15
0.7 V
2.0 V
"
"
"
"
16
2.0 V
2.0 V
"
"
"
"
4 mA
VIC
17
-18 mA
18
-18 mA
19
-18 mA
20
-18 mA
21
-18 mA
22
-18 mA
IIL1
3009
23
0.4 V
"
24
0.4 V
"
25
0.4 V
"
26
0.4 V
"
27
0.4 V
"
28
0.4 V
IIH1
3010
29
2.7 V
"
30
2.7 V
"
31
2.7 V
"
32
2.7 V
"
33
2.7 V
"
34
2.7 V
IIH2
3010
35
7.0 V
"
36
7.0 V
"
37
7.0 V
"
38
7.0 V
"
39
7.0 V
"
40
7.0 V
IOS
3011
41
5.5 V
5.5 V
"
42
"
"
"
43
"
"
"
44
"
"
"
45
"
"
"
46
"
"
"
47
"
"
"
48
"
"
GND
ICC
3005
49
GND
GND
5.5 V
Same tests, terminal conditions and limits as subgroup 1, except TC = +125°C and VIC tests omitted.
Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests omitted.
VOH2
3006
"
"
"
"
"
"
"
3007
"
"
"
"
"
"
"
See footnotes at end of device type 01.
-.4 mA
-.4 mA
-.4 mA
-.4 mA
-.4 mA
-.4 mA
4 mA
4 mA
4 mA
4 mA
4 mA
4 mA
4 mA
GND
GND
GND
GND
GND
GND
GND
Measured
terminal
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
A
B
C
G2A
G2B
G1
A
B
C
G2A
G2B
G1
A
B
C
G2A
G2B
G1
A
B
C
G2A
G2B
G1
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
VCC
Limits
Min
2.5
"
"
"
"
"
"
"
2/
"
"
"
"
"
-15
"
"
"
"
"
"
"
Unit
Max
0.4
"
"
"
"
"
"
"
-1.5
"
"
"
"
"
2/
"
"
"
"
"
20
"
"
"
"
"
100
"
"
"
"
"
-100
"
"
"
"
"
"
"
10.0
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2/
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
MIL-M-38510/307D
13
2
3
Symbol
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 01 - Continued. 1/
Subgroup
Symbol
7 3/
Truth
Tc = 25°C table
tests
8 3/
14
tPLH3
tPHL3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
G1
A
"
"
"
"
"
B
"
"
A
"
"
"
"
"
"
"
Y7
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Y6
H
"
"
"
"
"
"
"
"
"
"
"
"
"
"
L
H
Y5
H
"
"
"
"
"
"
"
"
"
"
"
"
"
L
H
H
Y4
H
"
"
"
"
"
"
"
"
"
"
"
"
L
H
"
"
Y3
H
"
"
"
"
"
"
"
"
"
"
"
L
H
"
"
"
Y2
H
"
"
"
"
"
"
"
"
"
"
L
H
"
"
"
"
Y1
H
"
"
"
"
"
"
"
"
"
L
H
"
"
"
"
"
Y0
H
"
"
"
"
"
"
"
"
L
H
"
"
"
"
"
"
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
3014
3003
Fig. 3
"
"
"
"
"
"
"
"
"
"
3003
Fig. 3
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
A
B
C
G2A
G2B
50
A
A
A
A
A
51
B
A
"
"
"
52
"
B
"
"
"
53
"
"
B
"
"
54
"
"
"
B
A
55
"
"
"
A
B
56
"
"
"
A
B
57
"
"
"
B
A
58
"
"
"
"
B
59
"
"
"
"
"
60
A
"
"
"
"
61
B
A
"
"
"
62
A
A
"
"
"
63
B
B
A
"
"
64
A
B
"
"
"
65
B
A
"
"
"
66
A
A
"
"
"
67
thru
Same tests as subgroup 7, except TC = +125°C
83
84
thru
Same tests as subgroup 7, except TC = -55°C
100
101 & 102
IN
GND
GND
GND
GND
103 & 104
"
5.0 V
GND
"
"
105 & 106
"
GND
5.0 V
"
"
107 & 108
"
5.0 V
5.0 V
"
"
109 & 110 GND
IN
GND
"
"
111 & 112 5.0 V
"
GND
"
"
113 & 114 GND
"
5.0 V
"
"
115 & 116 5.0 V
"
5.0 V
"
"
117 & 118 GND
GND
IN
"
"
119 & 120 5.0 V
GND
"
"
"
121 & 122 GND
5.0 V
"
"
"
123 & 124 5.0 V
5.0 V
"
"
"
125 &126
GND
GND
GND
IN
"
127 & 128 5.0 V
GND
"
"
"
129 & 130 GND
5.0 V
"
"
"
131 & 132 5.0 V
5.0 V
"
"
"
133 & 134 GND
GND
5.0 V
"
"
135 & 136 5.0 V
GND
"
"
"
137 & 138 GND
5.0 V
"
"
"
139 & 140 5.0 V
5.0 V
"
"
"
141 & 142 GND
GND
GND
GND
IN
143 & 144 5.0 V
GND
"
"
"
145 & 146 GND
5.0 V
"
"
"
147 & 148 5.0 V
5.0 V
"
"
"
149 & 150 GND
GND
5.0 V
"
"
151 & 152 5.0 V
GND
"
"
"
153 & 154 GND
5.0 V
"
"
"
155 & 156 5.0 V
5.0 V
"
"
"
See footnotes at end of device types 01.
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
OUT
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Measured
terminal
Limits
Min
Unit
Max
3/
A to Y0
A to Y2
A to Y4
A to Y6
B to Y0
B to Y1
B to Y4
B to Y5
C to Y0
C to Y1
C to Y2
C to Y3
G2A to Y0
G2A to Y1
G2A to Y2
G2A to Y3
G2A to Y4
G2A to Y5
G2A to Y6
G2A to Y7
G2B to Y0
G2B to Y1
G2B to Y2
G2B to Y3
G2B to Y4
G2B to Y5
G2B to Y6
G2B to Y7
5
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
25/46
"
"
"
"
"
"
"
"
"
"
"
23/37
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
9
Tc = 25°C
Truth
table
test
Truth
table
test
tPLH2
tPHL2
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 01 - Continued. 1/
Subgroup
9
Tc = 25°C
15
10
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Measured
terminal
Test no.
A
B
C
G2A
G2B
G1
Y7
GND
Y6
Y5
Y4
Y3
Y2
Y1
Y0
VCC
3003
157 &158
IN
GND
GND
GND
GND
5.0 V
GND
OUT
5.0 V
A to Y1
Fig. 3
159 & 160
"
5.0 V
GND
"
"
"
"
OUT
"
A to Y3
"
161 & 162
"
GND
5.0 V
"
"
"
"
OUT
"
A to Y5
"
163 & 164
"
5.0 V
5.0 V
"
"
"
OUT
"
"
A to Y7
"
165 & 166 GND
IN
GND
"
"
"
"
OUT
"
B to Y2
"
167 & 168 5.0 V
"
GND
"
"
"
"
OUT
"
B to Y3
"
169 & 170 GND
"
5.0 V
"
"
"
"
OUT
"
B to Y6
"
171 & 172 5.0 V
"
5.0 V
"
"
"
OUT
"
"
B to Y7
"
173 & 174 GND
GND
IN
"
"
"
"
OUT
"
C to Y4
"
175 & 176 5.0 V
GND
"
"
"
"
"
OUT
"
C to Y5
"
177 & 178 GND
5.0 V
"
"
"
"
"
OUT
"
C to Y6
"
179 & 180 5.0 V
5.0 V
"
"
"
"
OUT
"
"
C to Y7
tPLH5
3003
181 & 182 GND
GND
GND
"
"
IN
"
OUT
"
G1 to Y0
tPHL5
Fig. 3
183 & 184 5.0 V
GND
"
"
"
"
"
OUT
"
G1 to Y1
"
185 & 186 GND
5.0 V
"
"
"
"
"
OUT
"
G1 to Y2
"
187 & 188 5.0 V
5.0 V
"
"
"
"
"
OUT
"
G1 to Y3
"
189 & 190 GND
GND
5.0 V
"
"
"
"
OUT
"
G1 to Y4
"
191 & 192 5.0 V
GND
"
"
"
"
"
OUT
"
G1 to Y5
"
193 & 194 GND
5.0 V
"
"
"
"
"
OUT
"
G1 to Y6
"
195 & 196 5.0 V
5.0 V
"
"
"
"
OUT
"
"
G1 to Y7
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and for following limits: tPLH2 = 5 to 38 ns; tPHL2 = 5 to 69 ns; tPLH3 = 5 to 35 ns; tPHL3 = 5 to 56 ns; tPLH4 = 5 to 48 ns; tPHL4 = 5 to 81 ns;
tPLH5 = 5 to 47 ns; tPHL5 = 5 to 65 ns.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
tPLH4
tPHL4
1/ Pins not designated are high ≥ 2.0 V; low ≤ 0.7 V; or open. Case X and 2 pins not referenced are NC.
2/ IIL1 limits are as follows:
IIL1
A
-.001/-.150
except
-.11/-.35
for tests
26, 27, 28
Min/Max limits (mA) for circuits
B
C, E, F
D
-.030/-.300
-.12/-.36
-.10/-.34
3/ A = 2.5 V and B = 0.4 V; H ≥ 1.5 V; L ≤ 1.5 V.
G
-.15/-.38
Limits
Min
5
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Max
32/54
"
"
"
"
"
"
"
"
"
"
"
31/43
"
"
"
"
"
"
"
Unit
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
11
Symbol
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 02. 1/
Subgroup
1
Tc = 25°C
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2Y3
2Y2
2Y1
2Y0
2B
2A
2G
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
1
2.0 V
-.4 mA
2
"
-.4 mA
3
"
-.4 mA
4
"
-.4 mA
5
6
7
8
VOL2
9
0.7 V
2.0 V
2.0 V
4 mA
10
"
0.7 V
2.0 V
4 mA
11
"
2.0 V
0.7 V
4 mA
12
"
0.7 V
0.7 V
4 mA
13
14
15
16
VIC
17
-18 mA
18
-18 mA
19
-18 mA
20
21
22
IIL1
3009
23
0.4 V
"
24
0.4 V
"
25
0.4 V
"
26
"
27
"
28
IIH1
3010
29
2.7 V
"
30
2.7 V
"
31
2.7 V
"
32
"
33
"
34
IIH2
3010
35
7.0 V
"
36
7.0 V
"
37
7.0 V
"
38
"
39
"
40
IOS
3011
41
5.5 V
GND
"
42
"
GND
"
43
"
GND
"
44
"
GND
"
45
"
46
"
47
"
48
ICC
3005
49
GND
5.5 V
5.5 V
Same tests, terminal conditions and limits as subgroup 1, except TC = +125°C and VIC tests omitted.
Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests omitted.
VOH2
3006
"
"
"
"
"
"
"
3007
"
"
"
"
"
"
"
See footnotes at end of device type 02.
-.4 mA
2.0 V
"
"
"
-.4 mA
-.4 mA
-.4 mA
4 mA
4 mA
4 mA
4 mA
2.0 V
2.0 V
0.7 V
0.7 V
2.0 V
0.7 V
2.0 V
0.7 V
0.7 V
"
"
"
-18 mA
-18 mA
-18 mA
0.4 V
0.4 V
0.4 V
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
GND
GND
GND
GND
5.5 V
5.5 V
5.5 V
"
"
"
GND
Measured
terminal
1Y3
1Y2
1Y1
1Y0
2Y3
2Y2
2Y1
2Y0
1Y3
1Y2
1Y1
1Y0
2Y3
2Y2
2Y1
2Y0
1G
1A
1B
2B
2A
2G
1G
1A
1B
2B
2A
2G
1G
1A
1B
2B
2A
2G
1G
1A
1B
2B
2A
2G
1Y0
1Y1
1Y2
1Y3
2Y3
2Y2
2Y1
2Y0
VCC
Limits
Min
2.5
"
"
"
"
"
"
"
2/
"
"
"
"
"
-15
"
"
"
"
"
"
"
Unit
Max
0.4
"
"
"
"
"
"
"
-1.5
"
"
"
"
"
2/
"
"
"
"
"
20
"
"
"
"
"
100
"
"
"
"
"
-100
"
"
"
"
"
"
"
11.0
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
mA
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
MIL-M-38510/307D
16
2
3
Symbol
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 02 - Continued. 1/
Subgroup
Symbol
Cases
E, F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MIL-STD883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Measured
terminal
3014
"
"
"
"
"
"
"
3014
17
1/ Pins not designated are high ≥ 2.0 V; low ≤ 0.7 V; or open. Case X and 2 pins not referenced are NC.
2/ IIL1 limits are as follows:
IIL1
A, C, E, F
-.012/-.36
Min/Max limits (mA) for circuits
B
D
G
-.03/-.300
-.10/-.34
-.15/-.38
3/ H ≥ 1.5 V; L ≤ 1.5 V; A = 2.5 V; B = 0.4 V.
Min
Unit
Max
3/
5
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
29/37
"
"
"
25/38
"
"
"
29/37
"
"
"
25/38
"
"
"
34/43
"
"
"
"
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
Test no.
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
2Y3
3Y2
2Y1
2Y0
2B
2A
2G
VCC
50
A
A
A
H
H
H
H
GND
H
H
H
H
A
A
A
5.0 V
51
"
B
A
"
"
"
"
"
"
"
"
"
A
B
"
"
52
"
A
B
"
"
"
"
"
"
"
"
"
B
A
"
"
53
"
B
"
"
"
"
"
"
"
"
"
"
"
B
"
"
54
B
B
"
L
"
"
"
"
"
"
"
L
"
B
B
"
55
"
A
"
H
L
"
"
"
"
"
L
H
"
A
"
"
56
"
B
A
"
H
L
"
"
"
L
H
"
A
B
"
"
57
"
A
A
"
H
H
L
"
L
H
H
"
A
A
"
"
8 3/
Truth
58
table
thru
Same tests as subgroup 7, except TC = +125°C
test
65
Truth
3014
66
Same tests as subgroup 7, except TC = -55°C
table
thru
test
73
9
tPLH3
3003
74 & 75
IN
GND
GND
OUT
GND
5.0 V
1G to 1Y0
Fig. 3
76 & 77
"
5.0 V
GND
OUT
"
"
1G to 1Y1
Tc = 25°C tPHL3
"
78 & 79
"
GND
5.0 V
OUT
"
"
1G to 1Y2
"
80 & 81
"
5.0 V
5.0 V
OUT
"
"
1G to 1Y3
tPLH2
"
82 & 83
GND
IN
GND
OUT
"
"
1A to 1Y0
tPHL2
"
84 & 85
"
IN
5.0 V
OUT
"
"
1A to 1Y2
"
86 & 87
"
GND
IN
OUT
"
"
1B to 1Y0
"
88 & 89
"
5.0 V
IN
OUT
"
"
1B to 1Y1
tPLH3
"
90 & 91
"
OUT
GND
GND
IN
"
2G to 2Y0
tPHL3
"
92 & 93
"
OUT
GND
5.0 V
"
"
2G to 2Y1
"
94 & 95
"
OUT
5.0 V
GND
"
"
2G to 2Y2
"
96 & 97
"
OUT
5.0 V
5.0 V
"
2G to 2Y3
tPLH3
"
98 & 99
"
OUT
GND
IN
GND
"
2A to 2Y0
tPHL3
"
100 & 101
"
OUT
5.0 V
IN
"
"
2A to 2Y2
"
102 & 103
"
OUT
IN
GND
"
"
2B to 2Y0
"
104 & 105
"
OUT
IN
5.0 V
"
"
2B to 2Y1
tPLH4
"
106 & 107 GND
IN
GND
OUT
"
"
1A to 1Y1
tPHL4
"
108 & 109
"
IN
5.0 V
OUT
"
"
1A to 1Y3
"
110 & 111
"
GND
IN
OUT
"
"
1B to 1Y2
"
112 & 113
"
5.0 V
IN
OUT
"
"
1B to 1Y3
"
114 & 115
"
OUT
GND
IN
GND
"
2A to 2Y1
"
116 & 117
"
OUT
5.0 V
IN
"
"
2A to 2Y3
"
118 & 119
"
OUT
IN
GND
"
"
2B to 2Y2
"
120 & 121
"
OUT
IN
5.0 V
"
"
2B to 2Y3
10
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and for following limits: tPLH2 = 5 to 38 ns; tPHL2 = 5 to 57 ns; tPLH3 = 5 to 44 ns; tPHL3 = 5 to 56 ns; tPLH4 = 5 to 51 ns; tPHL4 = 5 to 65 ns.
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C
7 3/
Truth
Tc = 25°C table
tests
Limits
TABLE III. Group A inspection for device type 03. 1/
Subgroup
1
Tc = 25°C
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
7
8
9
D
2.0 V
"
"
"
"
"
"
"
"
"
0.7 V
"
"
"
"
"
"
"
2.0 V
2.0 V
C
2.0 V
"
"
"
"
"
"
"
"
"
0.7 V
"
"
"
2.0 V
"
"
"
0.7 V
0.7 V
B
2.0 V
"
"
"
"
"
"
"
"
"
0.7 V
0.7 V
2.0 V
2.0 V
0.7 V
0.7 V
2.0 V
2.0 V
0.7 V
0.7 V
A
2.0 V
"
"
"
"
"
"
"
"
"
0.7 V
2.0 V
0.7 V
2.0 V
0.7 V
2.0 V
0.7 V
2.0 V
0.7 V
2.0 V
-18 mA
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
0
1
2
3
4
5
6
1
-.4 mA
2
-.4 mA
3
-.4 mA
4
-.4 mA
5
-.4 mA
6
-.4 mA
7
-.4 mA
8
9
10
VOL2
11
4 mA
12
4 mA
13
4 mA
14
4 mA
15
4 mA
16
4 mA
17
4 mA
18
19
20
VIC
21
22
23
24
IIH1
3010
25
"
26
"
27
"
28
IIH2
3010
29
"
30
"
31
"
32
IIL1 2/
3009
33
"
34
"
35
"
36
IOS 3/
3011
37
GND
"
38
GND
"
39
GND
"
40
GND
"
41
GND
"
42
GND
"
43
GND
"
44
"
45
"
46
ICC
3005
47
Same tests, terminal conditions and limits as subgroup 1, except TC = +125°C and VIC tests omitted.
Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests omitted.
VOH2
3006
"
"
"
"
"
"
"
"
"
3007
"
"
"
"
"
"
"
"
"
See footnotes at end of device type 03.
-.4 mA
-.4 mA
-.4 mA
4 mA
4 mA
4 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
7.0 V
0.4 V
0.4 V
0.4 V
GND
GND
GND
0.4 V
5.5 V
"
"
"
"
"
"
"
"
"
GND
5.5 V
"
"
"
"
"
"
"
"
"
GND
5.5 V
"
"
"
"
"
"
"
"
"
GND
5.5 V
"
"
"
"
"
"
"
"
"
GND
Measured
terminal
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
A
B
C
D
A
B
C
D
A
B
C
D
A
B
C
D
0
1
2
3
4
5
6
7
8
9
VCC
Limits
Min
2.5
"
"
"
"
"
"
"
"
"
2/
"
"
"
-15
"
"
"
"
"
"
"
"
"
Unit
Max
0.4
"
"
"
"
"
"
"
"
"
-1.5
"
"
"
20
"
"
"
100
"
"
"
2/
"
"
"
-100
"
"
"
"
"
"
"
"
"
13
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
18
2
3
Symbol
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 03 - Continued. 1/
Subgroup
Symbol
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
IN
IN
5.0 V
GND
IN
GND
5.0 V
GND
5.0 V
GND
5.0 V
GND
5.0 V
5.0 V
GND
5.0 V
GND
5.0 V
GND
5.0 V
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
1/ Pins not designated are high ≥ 2.0 V; low ≤ 0.7 V; or open. Case X and 2 pins not referenced are NC.
2/ IIL1 limits are as follows:
IIL1
A
-.12/-.36
B
-.030/-.300
3/ For circuit C, limits are: -15 to -130 mA.
4/ H ≥ 1.5 V; L ≤ 1.5 V; A = 2.5 V; B = 0.4 V.
C
-.12/-.36
D
-.12/-.36
Min/Max limits (mA) for circuits
E
F
G
-.12/-.36
-.12/-.36
-.16/-.40
Measured
terminal
Limits
Min
Unit
Max
4/
B to 2
A to 1
A to 7
B to 1
B to 4
A to 0
C to 2
C to 3
C to 8
C to 9
C to 4
C to 5
C to 6
C to 7
D to 3
D to 4
D to 5
D to 6
D to 7
D to 8
D to 9
5
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
35
"
"
30
"
"
"
"
"
"
35
"
"
"
30
"
"
"
"
35
35
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
2
Test no.
0
1
2
3
4
5
6
GND
7
8
9
D
C
B
48
L
H
H
H
H
H
H
GND
H
H
H
B
B
B
49
H
L
H
"
"
"
"
"
"
"
"
"
"
B
50
"
H
L
"
"
"
"
"
"
"
"
"
"
A
51
"
"
H
L
"
"
"
"
"
"
"
"
"
A
52
"
"
"
H
L
"
"
"
"
"
"
"
A
B
53
"
"
"
"
H
L
"
"
"
"
"
"
"
B
54
"
"
"
"
"
H
L
"
"
"
"
"
"
A
55
"
"
"
"
"
"
H
"
L
"
"
"
"
A
56
"
"
"
"
"
"
"
"
H
L
"
A
B
B
57
"
"
"
"
"
"
"
"
"
H
L
"
"
B
58
"
"
"
"
"
"
"
"
"
"
H
"
"
A
59
"
"
"
"
"
"
"
"
"
"
"
"
"
A
60
"
"
"
"
"
"
"
"
"
"
"
"
A
B
61
"
"
"
"
"
"
"
"
"
"
"
"
"
B
62
"
"
"
"
"
"
"
"
"
"
"
"
"
A
63
"
"
"
"
"
"
"
"
"
"
"
"
"
A
8 4/
Truth
64
table
thru
Same tests as subgroup 7, except TC = +125°C
test
79
Truth
3014
80
table
thru
Same tests as subgroup 7, except TC = -55°C
test
95
9
tPLH4
3003
96 & 97
OUT
GND
GND
GND
IN
Fig. 3
98 & 99
OUT
"
"
GND
GND
Tc = 25°C tPHL4
"
100 & 101
"
OUT
"
5.0 V
5.0 V
tPLH2
"
102 &103
OUT
"
"
GND
IN
tPHL2
"
104 & 105
OUT
"
"
5.0 V
IN
"
106 & 107
OUT
"
"
GND
GND
"
108 & 109
OUT
"
"
IN
5.0 V
"
110 & 111
OUT
"
"
"
5.0 V
"
112 & 113
"
OUT
5.0 V
"
GND
"
114 & 115
"
OUT
5.0 V
"
"
tPLH4
"
116 & 117
OUT
"
GND
"
"
tPHL4
"
118 & 119
OUT
"
"
"
"
"
120 & 121
OUT
"
"
"
5.0 V
"
122 & 123
"
OUT
"
"
"
tPLH2
"
124 & 125
OUT
"
IN
GND
"
tPHL2
"
126 & 127
OUT
"
"
5.0 V
GND
"
128 & 129
OUT
"
"
"
GND
"
130 & 131
OUT
"
"
"
5.0 V
"
132 & 133
"
OUT
"
"
5.0 V
tPLH4
"
134 & 135
"
OUT
"
GND
GND
tPHL4
"
136 & 137
"
OUT
"
GND
GND
10
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and for following limits: tPLH2 = 5 to 45 ns; tPHL2 = 5 to 45 ns; tPLH4 = 5 to 53 ns; tPHL4 = 5 to 53 ns.
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C
7 4/
Truth
Tc = 25°C table
tests
19
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 04. 1/
Subgroup
1
Tc = 25°C
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
e
12 mA
d
c
b
a
g
f
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
B
C
LT
RBO
RBI
D
A
1
X
X
0.7 V
X
X
X
2
"
"
"
"
"
"
3
"
"
"
"
"
"
4
"
"
"
"
"
"
5
"
"
"
"
"
"
6
"
"
"
"
"
"
7
"
"
"
"
"
"
VOL1
8
0.7 V
0.7 V
2.0 V
1.6 mA
0.7 V
0.7 V
0.7 V
ICEX
9
"
"
"
"
"
"
10
"
"
"
"
"
"
11
"
"
"
"
"
"
12
"
"
"
"
"
"
13
"
"
"
"
"
"
14
"
"
"
"
"
"
15
"
"
"
"
"
"
VOH1
3007
16
0.7 V
0.7 V
2.0 V
2.0 V
0.7 V
0.7 V
-50 µA
VIC
17
-18 mA
18
-18 mA
19
-18 mA
20
-18 mA
21
-18 mA
22
-18 mA
IIL1
3009
23
0.4 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
"
24
5.5 V
0.4 V
"
"
5.5 V
"
"
25
"
5.5 V
"
"
0.4 V
"
"
26
"
"
"
"
5.5 V
0.4 V
IIL2
3009
27
"
"
0.4 V
"
"
5.5 V
"
28
"
"
5.5 V
0.4 V
"
"
IIL3
3009
29
"
"
5.5 V
0.4 V
5.5 V
"
"
IIH1
3010
30
2.7 V
GND
GND
GND
GND
GND
"
31
GND
2.7 V
GND
"
"
"
"
32
"
GND
2.7 V
"
"
"
"
33
"
"
GND
2.7 V
"
"
"
34
"
"
"
GND
2.7 V
"
"
35
"
"
"
"
GND
2.7 V
IIH2
3010
36
7.0 V
"
"
"
"
GND
"
37
GND
7.0 V
"
"
"
"
"
38
"
GND
7.0 V
"
"
"
"
39
"
"
GND
7.0 V
"
"
"
40
"
"
"
GND
7.0 V
"
"
41
"
"
"
GND
GND
7.0 V
ICC
3005
42
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
Same tests, terminal conditions and limits as subgroup 1, except TC = +125°C and VIC tests omitted.
Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests omitted.
VOL2
3006
"
"
"
"
"
"
3006
See footnotes at end of device type 04.
12 mA
12 mA
12 mA
12 mA
12 mA
12 mA
15 V
15 V
15 V
15 V
15 V
15 V
15 V
Measured
terminal
Limits
Min
e
d
c
b
a
g
f
RBO
e
d
c
b
a
g
f
RBO
B
C
LT
RBI
D
A
B
C
D
A
LT
RBI
RBO
B
C
LT
RBI
D
A
B
C
LT
RBI
D
A
VCC
Unit
Max
0.4
"
"
"
"
"
"
"
250
"
"
"
"
"
"
2.4
-.10
2/
"
"
-1.5
"
"
"
"
"
-.34
"
"
"
2/
"
"
20
"
"
"
"
100
"
"
"
"
"
13
V
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
V
"
"
"
"
"
"
mA
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
mA
MIL-M-38510/307D
20
2
3
Symbol
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 04 - Continued. 1/
Subgroup
Symbol
7
Truth
Tc = 25°C table
3/, 4/
tests
8
3/, 4/
21
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
D
B
"
"
"
"
"
"
"
A
"
"
"
"
"
"
"
X
B
X
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
X
B
X
GND
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
e
L
H
L
H
"
"
L
H
L
H
L
H
"
"
L
H
"
"
L
d
L
H
L
L
H
L
L
H
L
H
L
L
H
L
L
H
"
"
L
c
L
L
H
L
"
"
"
"
"
"
H
L
H
"
"
"
"
"
L
b
L
"
"
"
"
H
H
L
"
"
H
H
L
H
"
"
"
"
L
a
L
H
L
L
H
L
H
L
"
"
H
"
"
L
H
"
"
"
L
g
H
H
L
"
"
"
"
H
L
"
"
"
"
"
"
H
"
"
L
f
L
H
"
"
L
"
"
H
L
L
H
H
L
"
"
H
"
"
L
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
5.0 V
GND
"
"
"
"
"
"
"
"
"
5.0 V
5.0 V
GND
5.0 V
GND
GND
5.0 V
GND
5.0 V
GND
"
"
"
"
"
5.0 V
GND
5.0 V
GND
5.0 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
5.0 V
GND
GND
5.0 V
5.0 V
GND
5.0 V
GND
GND
5.0 V
GND
"
"
"
"
5.0 V
GND
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3014
3014
3003
Fig. 4
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Test no.
B
C
LT
RBO
RBI
43
B
B
A
A
A
44
B
"
"
"
X
45
A
"
"
"
"
46
A
"
"
"
"
47
B
A
"
"
"
48
B
"
"
"
"
49
A
"
"
"
"
50
A
"
"
"
"
51
B
B
"
"
"
52
B
"
"
"
"
53
A
"
"
"
"
54
A
"
"
"
"
55
B
A
"
"
"
56
B
"
"
"
"
57
A
"
"
"
"
58
A
"
"
"
"
59
X
X
X
B
"
60
B
B
5.0 V
L
B
61
X
X
B
A
X
62
Same tests as subgroup 7, except TC = +125°C
thru
80
81
Same tests as subgroup 7, except TC = -55°C
thru
99
100 & 101 GND
GND
5.0 V
5.0 V
102 &103
GND
5.0 V
"
"
104 & 105 5.0 V
"
"
"
106 & 107 GND
"
"
"
108 & 109 5.0 V
"
"
"
110 & 111 5.0 V
GND
"
"
112 & 113 GND
GND
"
"
114 & 115 GND
5.0 V
"
"
116 & 117 5.0 V
5.0 V
"
"
118 & 119 GND
GND
"
"
120 & 121 5.0 V
"
"
"
122 & 123 GND
"
"
"
124 & 125 5.0 V
5.0 V
"
"
126 & 127 5.0 V
5.0 V
"
"
128 & 129 GND
GND
"
OUT
GND
130 & 131
IN
"
"
5.0 V
132 & 133
"
"
"
"
134 & 135
"
5.0 V
"
"
136 & 137
"
GND
"
"
138 & 139
"
5.0 V
"
"
140 & 141
"
GND
"
"
142 & 143
"
"
"
"
144 & 145
"
"
"
"
146 & 147
"
5.0 V
"
"
148 & 149
"
"
"
"
150 & 151
"
"
"
"
152 & 153
"
GND
"
"
154 & 155
"
"
"
"
156 & 157
"
"
"
"
158 & 159 GND
IN
"
"
160 & 161 5.0 V
"
"
"
162 & 163 GND
"
"
"
See footnotes at end of device type 04.
OUT
"
"
OUT
OUT
OUT
OUT
"
"
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
"
"
"
OUT
OUT
OUT
OUT
OUT
"
"
OUT
OUT
OUT
OUT
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
Measured
terminal
Limits
Min
Unit
Max
5/
A to a
A to a
A to a
A to b
A to b
A to c
A to d
A to d
A to d
A to e
A to e
A to f
A to f
A to g
A to RBO
B to a
B to a
B to b
B to b
B to b
B to b
B to c
B to d
B to d
B to e
B to f
B to f
B to f
B to g
C to a
C to b
C to c
5
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
105
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
9
Tc = 25°C
Truth
table
test
Truth
table
test
tPLH1
tPHL1
Cases
E, F
1
MIL-STD-
TABLE III. Group A inspection for device type 04 - Continued. 1/
Subgroup
9
Tc = 25°C
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
883
method
Cases 1/
2, X
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
b
a
g
f
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
Test no.
B
C
LT
RBO
RBI
D
A
GND
e
d
c
3003
164 & 165 GND
IN
5.0 V
5.0 V
GND
GND
GND
OUT
Fig. 4
166 & 167
"
"
"
"
GND
"
"
OUT
"
168 & 169 5.0 V
"
"
"
5.0 V
"
"
"
170 & 171 GND
GND
IN
"
GND
5.0 V
"
"
172 &173
5.0 V
5.0 V
"
"
IN
5.0 V
"
"
174 & 175 GND
5.0 V
"
"
"
GND
"
OUT
"
176 & 177
"
GND
"
"
"
"
"
"
178 & 179
"
"
"
GND
GND
"
"
"
180 & 181
"
"
"
OUT
GND
"
"
"
"
182 & 183
"
"
5.0 V
IN
5.0 V
"
"
"
"
184 & 185
"
"
"
IN
"
"
"
"
186 & 187
"
"
"
OUT
"
"
"
"
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and for following limits: tPLH1 = 5 to 158 ns; tPHL1 = 5 to 158 ns.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C
tPLH1
tPHL1
1/ Pins not designated are high ≥ 2.0 V; low ≤ 0.7 V; or open. Case X and 2 pins not referenced are NC.
2/ Test limits shall be as follows:
Min/Max limits (mA) for circuits
Test
IIL2
IIL3
A
-.12/-.36
-.36/-1.08
E
-.11/-.35
-.36/-.1.37
G
-.12/-.36
-.36/-1.08
3/ X = Input may be high level or low level.
4/ A pullup resistor of 665Ω to 2 kΩ shall be connected between each output and VCC.
5/ H ≥ 1.5 V; L ≤ 1.5 V; A = 2.5 V; B = 0.4 V.
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Measured
terminal
C to d
C to e
C to f
C to f
D to a
D to c
D to g
LT to a
LT to RBO
RBO to a
RBI to a
RBI to RBO
Limits
Min
5
"
"
"
"
"
"
"
"
"
"
"
Unit
Max
105
"
"
"
"
"
"
"
"
"
"
"
ns
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/307D
10
11
Symbol
Cases
E, F
1
MIL-STD-
22
MIL-M-38510/307D
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these
personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military
Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is
available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM
products, or by contacting the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
Complete part number (see 1.2).
c.
Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
j.
Requirements for "JAN" marking.
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
23
MIL-M-38510/307D
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ...........................................
VIN ...............................................
VIC ...............................................
RBI .............................................
RBO ............................................
BI ................................................
Ground zero voltage potential.
Voltage level at an input terminal.
Input clamp voltage.
Ripple blanking input.
Ripple blanking output.
Blanking input.
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer length leads and lead forming shall not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation
to case size. The presence of this information shall not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device
type
Generic-industry
type
01
02
03
04
54LS138
54LS139
54LS42
54LS47
6.8 Manufacturers' designation. Manufacturers' circuits, which form a part of this specification, are designated as
shown in table IV herein.
TABLE IV. Manufacturer's designator.
Device
type
A
Texas Instruments Inc.
01
02
03
04
B
Signetics
Corporation
X
X
X
X
X
X
X
C
Raytheon
Company
X
X
D
E
Fairchild
Motorola
Semiconduct
Inc
or
X
X
X
X
X
X
X
F
Advanced Micro
Devices
X
X
G
National
Semiconductor
Corp
X
X
X
X
6.9 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the
previous issue due to the extensiveness of the changes.
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
(Project 5962-1955)
Review activities:
Army - HD, MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
24
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