MAX1561

MAX1561
MAX1561ETA
Rev. B
RELIABILITY REPORT
FOR
MAX1561ETA
PLASTIC ENCAPSULATED DEVICES
January 22, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX1561 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX1561 step-up converter drives up to six white LEDs with a constant current to provide backlight in cell
phones, PDAs, and other hand-held devices. The step-up converter topology allows series connection of the white
LEDs so the LED currents are identical for uniform brightness. This configuration eliminates the need for ballast
resistors and expensive factory calibration.
The MAX1561 includes an internal, high-voltage, low-RDS(ON) N-channel MOSFET switch for high efficiency and
maximum battery life. A single Dual Mode™ input provides a simple means of brightness adjustment and on/off
control. Fast 1MHz current-mode pulse-width modulated (PWM) operation allows for small input and output
capacitors and a small inductor, while minimizing ripple on the input supply/battery. Programmable soft-start
eliminates inrush current during startup. The MAX1561 is available in a space-saving, 8-pin, 3mm x 3mm thin QFN
package with exposed paddle (EP).
B. Absolute Maximum Ratings
Item
IN to GND
PGND to GND
LX, OUT to GND
CTRL to GND
COMP, CS to GND
ILX
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
8-Pin DFN
Derates above +70°C
8-Pin Thin QFN (3mm x 3mm)
Rating
-0.3V to +6V
-0.3V to +0.3V
-0.3V to +30V
-0.3V to the lower of +6V or (VIN + 2V)
-0.3 to (VIN + 0.3V)
1A
-40°C to +85°C
+150°C
-65°C to +150°C
+300°C
1950mW
24.4mW/°C
II. Manufacturing Information
A. Description/Function:
High-Efficiency, 26V Step-Up Converter for Two to Six White LEDs
B. Process:
B8 - Standard 8 micron silicon gate CMOS
C. Number of Device Transistors:
2895
D. Fabrication Location:
California, USA
E. Assembly Location:
Thailand
F. Date of Initial Production:
December, 2002
III. Packaging Information
A. Package Type:
8-Lead DFN (3x3)
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-9000-0073
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
59 X 79 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
TiW/ AlCu/ TiWN
D. Backside Metallization:
None
E. Minimum Metal Width:
.8 microns (as drawn)
F. Minimum Metal Spacing:
.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord
(Manager, Reliability Operations)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1
=
MTTF
1.83
192 x 4389 x 48 x 2
(Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 22.62 x 10-9
λ = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec.# 06-6048) shows the static circuit used for this test. Maxim also performs 1000 hour life
test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located
on the Maxim website at http://www.maxim-ic.com .
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The PM76 die type has been found to have all pins able to withstand a transient pulse of ±800V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX1561ETA
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
77
0
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic process/package data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
Mil Std 883D
Method 3015.7
Notice 8
TERMINAL D
R = 1.5kΩ
C = 100pf
CURRENT
PROBE
(NOTE 6)
3x3x0.8 MM QFN THIN PKG.
EXPOSED PAD PKG.
ONCE PER SOCKET
ONCE PER BOARD
10 Ohms (1/4W)
+5V
0.1 uF
680 Ohms (1W)
1
OUT
2
V+
3
CTRL
4
CS
* LX
8
PGND
7
GND
6
COMP
5
+25V
10 K (1/4W)
0.1 uF
3.9 K (1/4W)
DEVICES: MAX 1561(PM76Q2)
PACKAGE: 8-QFN (3x3)
MAX. EXPECTED CURRENT = 5mA (+5V), 20mA (+25V)
DOCUMENT I.D. 06-6048
REVISION B
DRAWN BY: TEK TAN
NOTES: * LX is switching from 0V to 25V at 1Mhz, 40% Duty.
MAXIM TITLE: BI Circuit (MAX1561) PM76Z
PAGE
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