MAX4370

MAX4370
MAX4370ESA
Rev. A
RELIABILITY REPORT
FOR
MAX4370ESA
PLASTIC ENCAPSULATED DEVICES
January 27, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX4370 successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX4370 is a circuit-breaker IC designed to offer protection in hot-swap applications using Maxim's
DualSpeed/BiLevel™ detection. This controller, designed to reside either on the backplane or on the removable card,
is used to protect a system from start-up damage when a card or board is inserted into a rack with the main system
power supply turned on. The card's discharged filter capacitors provide a low impedance that can momentarily cause
the main power supply to collapse. The MAX4370 prevents this start-up condition by providing inrush current
regulation during a programmable start-up period, allowing the system to stabilize safely. In addition, two on-chip
comparators provide DualSpeed/BiLevel short-circuit protection and overcurrent protection during normal operation.
The MAX4370 provides protection for a +3V to +12V single supply. An internal charge pump generates the controlled
gate drive for an external N-channel MOSFET power switch. The MAX4370 latches the switch off after a fault
condition until an external reset signal clears the device. Other features include a status pin to indicate a fault
condition, an adjustable overcurrent response time, and a power-on reset comparator.
The MAX4370 is specified for the extended-industrial temperature range (-40°C to +85°C) and is available in an 8-pin
SO package.
B. Absolute Maximum Ratings
Item
Vin to GND
STAT to GND
GATE to Gnd
ON to GND (Note 1)
CSPD to GND
VSEN, CTIM to GND
Current into ON
Current inot any other Pin
Storage Temp.
Lead Temp. (10 sec.)
Continous Power Dissipation (TA = +700C)
8-Lead SO
Derates above +70°C
8-Lead SO
Rating
+15V
-0.3V t0 +14V
-0.3V to (VIN + 8.5V)
-1V to +14V
-0.3V to the lower of (VIN + 0.3V) or +12V
-0.3V to (VIN + 0.3V)
+/-2mA
+/-50mA
-65°C to +150°C
+300°C
471mW
5.9mW/°C
II. Manufacturing Information
A. Description/Function:
Current-Regulating Hot-Swap Controller with DualSpeed/BiLevel Fault Protection
B. Process:
S3 (SG3) Standard 3 micron silicon gate CMOS
C. Number of Device Transistors:
1792
D. Fabrication Location:
Oregon or California, USA
E. Assembly Location:
Phillipines or Thailand
F. Date of Initial Production:
April, 1999
III. Packaging Information
A. Package Type:
8-Lead NSO
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled epoxy
E. Bondwire:
Gold (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-3001-0143
H. Flammability Rating:
Class UL94-V0
I.
Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
87 x 145 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
3 microns (as drawn)
F. Minimum Metal Spacing:
3 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
Jim Pedicord
(Reliability Lab Manager)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening
(Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 80 x 2
Thermal acceleration factor assuming a 0.8eV activation energy
λ = 13.57 x 10-9
λ= 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following
Burn-In Schematic (Spec. # 06-5452) shows the static circuit used for this test. Maxim also performs 1000 hour
life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new
design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard
85°C/85%RH or HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The OP54 die type has been found to have all pins able to withstand a transient pulse of ±2500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA and/or ±20V.
Table 1
Reliability Evaluation Test Results
MAX4370ESA
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
80
9
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
2340
18
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
DC Parameters
(generic test vehicle)
77
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the uMax package.
Note 2: Generic process/package data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
R = 1.5kΩ
Ω
C = 100pf
CURRENT
PROBE
(NOTE 6)
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