Embedded Overview
NVDIMM, Flash/SSD
& DRAM Solutions
For embedded, enterprise & industrial
applications
Viking Technology Overview
Viking SSD Advantages
Viking Technology is a USA-based company and a global solutions provider of: NVDIMM,
Enterprise, Industrial and Client
DRAM and SSD technologies. With a global footprint, Viking Technology’s headquarter,
manufacturing, and R&D is located in Southern California with sales and engineering
‣ Enterprise provides data protection during power fail events
locations throughout US, Europe, China, Japan, and Singapore.
‣ Industrial SSD for I-Temp and extreme environments
Viking Technology has over 25 years of DRAM/Flash design & manufacturing expertise and
‣ Client is “good enough” performance where cost is main priority
continues to innovative in memory solutions, with visionary focus in NVDIMM, subsystems
and high density Stacking technologies.
Multi-vendor flash & controllers for best fit solutions
Viking Technology is part of the Sanmina family, a fortune 500 company with over 75 facilities
‣ Controllers: Samsung, Sandforce, Phison, SMI, Hyperstone
in 25 countries. Sanmina is a global, leading-edge technology, engineering, manufacturing
‣ NAND: SLC & MLC from Toshiba, Micron, Samsung, Spansion, Hynix
and service solutions company. NASDAQ: SANM.
Locked BOM with formal PCN for complete disclosure
In-house Sustaining Qualification & Validation
‣ Key strategic advantage for OEM customers
‣ Relieves burden on customer engineering resources
Advanced Capabilities
‣ Enhanced & customized testing
‣ Environmental stress screening
‣ Locked BOM
‣ Long-term supply support
Product Overview
NVDIMM
SSD/FLASH
DRAM
‣ Non-Volatile Memory
Technology – Storage
Class Modules
‣ Extensive embedded flash
solutions: eUSB, Discrete Flash
Card, US, SATA, PCIe
‣ Full DRAM technology portfolio
from DDR4 – Legacy DDR1
‣ DDR4 NVDIMM-N,
NVDIMM-F, NVDIMM-P
‣ SLC, MLC, eMLC NAND support
‣ Energy Sub-System
Customization
‣ iTemp, Ruggedization,
Customization
‣ Enterprise / Client – Grade SSD
‣ Standard Form Factors, small
form-factor, and Specialty
module support
‣ Thermal and electrical stress
optimization
‣ High Density, iTemp, Lock BOM
Custom labels and packaging
‣ Including options for conformal coating
Global FAE support
NVDIMM
Viking’s (NVDIMM) DDR4 Non-Volatile DIMM, delivers both performance and reliability
to enterprise applications. This non-volatile memory module has been designed to be
integrated into Intel’s new NVDIMM enabled servers via DDR4 DIMM sockets and designed
to preserve critical data in the event of a power or system failure. Viking’s NVDIMM enables
the host system to recover from a failure event with simplicity and ease.
NVDIMM Energy Sub-System (ESS)
The NVDIMM is a DDR4 Non-Volatile DIMM enabled by an energy subsystem (ESS) which
provides enough power to the module in an event of power-loss to safely store all mission
critical data. These ESS come in a variety of standard form factors, PCIe, FanBay and
SuperCaps without casing. Viking Technology has the ability to customize ESS to fit within
any customer server/storage appliance. Form factors can vary from PCIe cards, 2.5” drive
bays, fan bays and other customized form factors.
PART NUMBER
PRODUCT
VRA7EA4B5F08
DDR3 4GB NVDIMM
VRA7EA8B5F16
DDR3 8GB NVDIMM
VRA9MR8B2H16
DDR4 8GB NVDIMM
VRA9MRAB2H32
DDR4 16GB NVDIMM
VRCP050FH30B1
ESS Fan Bay, Caseless
VRCP050FH30F1
ESS Fan Bay, with Case
VRCP100FH30B1
ESS Fan Bay, Caseless
VRCP100FH30F1
ESS Fan Bay, with Case
VRCP038FS60P1
ESS PCIe Single Channel
VRCP038FS60P2
ESS PCIe Dual Channel
VRNH090FH61C1N
ESS Matchbox
DEVELOPMENT PLATFORM
PRODUCT
ADKHIF2A828H
DDR4 ADK - 2x8GB, 1xESS
ADKX102H848H
DDR4 ADK - 4x8GB, 2xESS
*Part numbers above are common orderable parts. For extended ranges and capacities, please contact your local
Viking representative or regional Viking sales.
‣ Non-Volatile DDR4 Memory
‣ JEDEC Standard DDR4 Interface
‣ Storage Class - Persistent Memory
‣ Customizable Energy Sub-System
‣ 100% Data Security
‣ 10 Year Data Retention
‣ Unlimited Write Endurance
‣ End-to-End RAS Coverage
PART NUMBER - SPECIFICATIONS & SUPPORT
FUNCTIONAL SPECIFICATIONS
DIMENSIONS
Host initiated health monitoring
Form factor
DDR4 (288-Pin DIMM)
Designs charging up to 12V
Dimensions (mm)
133.35 (L) x 3.95 (W) x 31.25 (H)
Fully charged in 3 minutes
LED for ESS status
2.5 inch & 1.8 inch SSD
Markets Served
Data Center | HDD | Video | Telecom | Aerospace | Servers | Storage
Engineered for the highest levels of performance and reliability, Viking Technology SSDs
feature a 6Gb SATA interface and an advanced parallel NAND channel architecture that
delivers best-in-class performance for I/O intensive applications.
Viking SSDs feature unparalleled write amplification efficiency for unprecedented endurance.
Coupled with patented error detection/correction capabilities and protection against
normally catastrophic flash failures, Viking SSD’s architecture enables MLC flash technology
for enterprise, embedded and military applications.
Viking 2.5in & 1.8in SSDs deliver the highest levels of quality, environmental ruggedness and
endurance. Offering the OEM a complete solution: package and firmware customization,
insulation against single NAND supply issues, locked BOM, and dedicated technology
partner resources sets Viking Technology apart from the competition.
FORM FACTOR INTERFACE
TEMP
NAND CAPACITY
PART NUMBER
CONTROLLER
1.8” x 5mm
SATA 6GB
(0 to +70’c)
MLC
960
VRFS11960GTCZMTL
Phison S10
1.8” x 5mm
SATA 6GB
(0 to +70’c)
MLC
480
VRFS11480GTCVMTL
Phison S10
1.8” x 5mm
SATA 6GB
(0 to +70’c)
MLC
120
VRFS11120GTCBMTL
Phison S10
1.8” x 5mm
SATA 6GB
(0 to +70’c)
SLC
60
VRFS11060GTCSSTH
Phison S10
2.5” x 15mm
PCIe NVMe
(0 to +70’c)
MLC
1600
VSFN221T60UCCMSC
Samsung
2.5” x 15mm
PCIe NVMe
(0 to +70’c)
MLC
800
VSFN22800GUCZMSC
Samsung
2.5” x 15mm
PCIe NVMe
(0 to +70’c)
MLC
480
VSFN22480GUCAMSC
Samsung
2.5” x 15mm
PCIe NVMe
(0 to +70’c)
MLC
960
VSFN22960GUCZMSC
Samsung
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
3840
VSFS223T84LCCMSC
Samsung
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
1920
VSFS221T92LCCMSC
Samsung
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
960
VPFS22960GTCZMTL
Phison S10
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
960
VSFS22960GLCZMSC
Samsung
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
480
VPFS22480GTCAMTL
Phison S10
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
480
VSFS22480GLCZMSC
Samsung
2.5” x 7mm
SATA 6GB
(0 to +70’c)
MLC
240
VPFS22240GTCBMTL
Phison S10
*Part numbers above are common orderable parts. For extended ranges and capacities, please contact your local
Viking representative or regional Viking sales.
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
1.8 in
SATA
SLC/MLC
Phison/Samsung
60GB/1TB
Up to 100K IOPS Random
2.5 in (7mm)
SATA
SLC/MLC
Phison/Samsung/
Sandforce
480GB to 4TB
Up to 100K IOPS Random
2.5 in (7mm)
PCIe NVMe
MLC/3D NAND
Phison/Samsung
Up to 4TB
Up to 300K IOPS Random
‣ Samsung Controller & V-NAND PFail, Data
path protection, Encryption, Max write performance
‣ Phison PCIe gen 3 NVMe
‣ Phison S9 for Client, Read intensive,
Low cost solution
‣ SLC (100,000 P/E): Toshiba 24nm
‣ Phison S10
‣ MLC (3,000 P/E): Micron 16nm, Toshiba 15nm
‣ Advanced SSD-specific SMART command
support
M.2 SSD
Markets Served
Intel “Grantley” Servers | POS | Cache | Industrial | Mobile |
Digital Signage | Boot Device
Viking Technology’s M.2 Solid State Drive (SSD) is a high-performance, high-capacity flash
solution optimized for the embedded and server market. The M.2 SSD is a caseless drive
with either a SATA or PCIe/NVMe connector, delivering high-bandwidth READs and WRITEs
at a fraction the size of a standard 2.5 inch SSD. The thin form factor comes in variety of sizes
best fit to the customer’s system requirements.
The M.2 SSD deliver outstanding performance in a small, industry standard form factor and
features intelligent flash management techniques to optimize endurance and wear-leveling.
FORM FACTOR INTERFACE
TEMP
NAND CAPACITY
PART NUMBER
CONTROLLER
M.2 NVMe (110mm)
PCIe NVMe
(0 to +70’c)
MLC
960
VSFNP7960GUCCMSC
Samsung
M.2 SATA (42MM)
SATA 6GB
(0 to +70’c)
MLC
128
VPFEM6128GSCAMMC
Phison S9
M.2 SATA (42MM)
SATA 6GB
(0 to +70’c)
MLC
32
VRFEM6032GSCBMMC
Phison S9
M.2 SATA (42MM)
SATA 6GB
(0 to +70’c)
SLC
32
VRFEM6032GSCSSTH
Phison S9
M.2 SATA (60MM)
SATA 6GB
(0 to +70’c)
MLC
128
VRFEM4128GSCTMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
128
VPFEM4128GSCBMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
64
VRFEM4064GSCYMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
64
VPFEM4064GSCDMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
32
VRFEM4032GSCWMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
32
VPFEM4032GSCDMTL
Phison S9
M.2 NVMe (110mm)
SATA 6GB
(0 to +70’c)
MLC
32
VRFEM4032GSCSSTH
Phison S9
M.2 SATA (80MM)
SATA 6GB
(0 to +70’c)
MLC
480
VPFEM5480GTCZMTL
Phison S10
M.2 SATA (80MM)
SATA 6GB
(0 to +70’c)
MLC
256
VPFEM5256GSCAMTL
Phison S9
M.2 SATA (80MM)
SATA 6GB
(0 to +70’c)
MLC
240
VPFEM5240GTCAMTL
Phison S10
M.2 SATA (80MM)
SATA 6GB
(0 to +70’c)
MLC
120
VPFEM5120GTCBMTL
Phison S10
M.2 SATA (80MM)
SATA 6GB
(0 to +70’c)
MLC
32
VPFEM5032GSCWMTL
Phison S9
*Part numbers above are common orderable parts. For extended ranges and capacities, please contact your local
Viking representative or regional Viking sales.
‣ Client and Enterprise controller options
‣ Low capacity form factor 22mm x 42mm
‣ Samsung Controller and V-NAND
‣ High capacity form factor 22mm x 110mm
‣ Toshiba 15nm MLC
‣ Form factor options 22mm x 42, 60, 80,
110mm
‣ Micron 16nm MLC
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
M.2
SATA
MLC
Phison
Up to 1TB
Up to 100K IOPS Random
M.2
PCIe Gen 3 NVMe
MLC
Samsung, Phison
Up to 1TB
Up to 300K IOPS Random
SlimSATA & mSATA SSDs
Markets Served
Servers | Cache | Data Acceleration | Factory Automation | Boot Device
Medical Equipment
SlimSATA & mSATA SSD are solid state drive solutions ideal for space-constrained embedded
server & storage systems, telecommunications, automotive, gaming and many industrial
applications. Both solutions deliver outstanding performance in a small, industry standard
form factor and features intelligent flash management techniques to optimize endurance
and wear-leveling.
FORM FACTOR INTERFACE
‣ Advanced SSD-specific SMART attribute
support
‣ Hardware 256-bit AES encryption for secure
data protection
‣ Intelligent write management,
Optimized endurance
NAND CAPACITY
PART NUMBER
CONTROLLER
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
512
VPFEM1512GTCZMTL
Phison S10
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
256
VPFEM1256GSCAMTL
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
256
VPFEM1256GTCAMTL
Phison S10
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
128
VRFEM1128GSCBMMC
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
128
VPFEM1128GTCBMTL
Phison S10
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
64
VPFEM1064GSCDMTL
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
64
VPFEM1064GTCBMTL
Phison S10
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
SLC
64
VRFEM1064GSCSSTH
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
MLC
32
VPFEM1032GSCDMTL
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
SLC
32
VRFEM1032GSCRSTH
Phison S9
SlimSATA (MO-297)
SATA 6GB
(-40 to +85 ºC)
SLC
32
VRFEM1032GSIRSTH
Phison S9
SlimSATA (MO-297)
SATA 6GB
(0 to +70’c)
SLC
14
VRFEM1016GSCQSTH
Phison S9
SlimSATA (MO-297)
SATA 6GB
(-40 to +85 ºC)
SLC
14
VRFEM1016GSIQSTH
Phison S9
PART NUMBER
CONTROLLER
FORM FACTOR INTERFACE
‣ Phison S10 with Power Fail and Data path
protection
TEMP
TEMP
NAND CAPACITY
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
480
VPFEM2480GTCZMTL
Phison S10
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
256
VPFEM2256GSCAMTL
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
240
VPFEM2240GTCAMTL
Phison S10
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
128
VPFEM2128GSCBMTL
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
SLC
128
VRFEM2128GSCUSTH
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
120
VPFEM2120GTCBMTL
Phison S10
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
64
VPFEM2064GSCDMTL
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
SLC
64
VRFEM2064GSCSSTH
Phison S9
mSATA (MO-300)
SATA 6GB
(-40 to +85 ºC)
SLC
64
VRFEM2064GSISSTH
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
32
VPFEM2032GSCDMTL
Phison S9
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
SLC
32
VRFEM2032GSCRSTH
Phison S9
mSATA (MO-300)
SATA 6GB
(-40 to +85 ºC)
SLC
32
VRFEM2032GSIRSTH
Phison S9
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
SlimSATA
SATA (MO-297)
SLC/MLC
Phison
Up to 480GB
Up to 100K IOPS Random
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
MLC
32
VPFEM2032GTCDMTLN1
Phison S10
SlimSATA
SATA (MO-297)
SLC/MLC
Sandforce
Up to 240GB
Up to 60K IOPS Random
mSATA (MO-300)
SATA 6GB
(0 to +70’c)
SLC
14
VRFEM2016GSCRSTH
Phison S9
mSATA
SATA (MO-300)
SLC/MLC
Phison
Up to 480GB
Up to 100K IOPS Random
mSATA (MO-300)
SATA 6GB
(-40 to +85 ºC)
SLC
14
VRFEM2016GSIRSTH
Phison S9
mSATA
SATA (MO-300)
SLC/MLC
Sandforce
Up to 240GB
Up to 60K IOPS Random
*Part numbers above are common orderable parts. For extended ranges and capacities, please contact your local Viking representative or regional
Viking sales.
eUSB
Markets Served
IP Routing | Switches | Servers | Cache | Data Acceleration |
Factory Automation | Medical Equipment | Boot Device | Data Logging
The embedded USB (eUSB) module from Viking Technology provides a rugged, reliable and
cost effective non-volatile memory solution to OEM customers in the Networking, Embedded
and Industrial markets. eUSB modules are secure pluggable USB 2.0 devices with built-in
ECC and global wear-leveling for exceptional reliability and product lifetime.
The eUSB module is part of an entire family of industrial-grade embedded flash solutions
from Viking designed to provide the right mix of capacity and performance and do so without
compromise.
Viking eUSB modules are available in capacities to 64GB and deliver performance up to 35
MB/s. Available in both industry standard and low profile versions, as well as 3.3V and 5V
operation, Viking eUSB modules have the flexibility to meet a wide range of applications.
FORM FACTOR INTERFACE
TEMP
NAND CAPACITY
PART NUMBER
CONTROLLER
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
30
VRFDUC3030GACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
30
VRFDUC3030GAISTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
16
VRFDUC3016GACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
16
VRFDUC3016GAISTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
8
VRFDUC38192ACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
8
VRFDUC38192AISTH
Hyperstone U8
PART NUMBER
CONTROLLER
FORM FACTOR INTERFACE
TEMP
NAND CAPACITY
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
30
VRFDUC3030GACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
30
VRFDUC3030GAISTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
16
VRFDUC3016GACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
16
VRFDUC3016GAISTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(0 to +70’c)
SLC
8
VRFDUC38192ACSTH
Hyperstone U8
eUSB Std Profile
USB 2.0
(-40 to +85 ºC)
SLC
8
VRFDUC38192AISTH
Hyperstone U8
*Part numbers above are common orderable parts. For extended ranges and capacities, please contact your local
Viking representative or regional Viking sales.
eUSB
eUSB eMMC
‣ Reduced size eUSB
‣ Cost effectiveness utilizing eMMC Flash
‣ Optimized for space constraint routers/
switches
‣ Low-cost endurance alternative to SLC NAND
‣ Available in iTemp & cTemp configurations
‣ Screw mountable for ruggedization
‣ ECC and Data Management
‣ Highest endurance
‣ Extremely low cost alternative
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
eUSB
USB
SLC/MLC
SMI 3252/Hyperstone U8
Up to 64GB
20MB/s (W) - 34MB/s (R)
eUSB (short)
USB
SLC/MLC
SMI 3252/Hyperstone U8
Up to 16GB
20MB/s (W) - 34MB/s (R)
eUSB eMMC
USB
eMMC
Microchip
Up to 16GB
20MB/s (W) - 34MB/s (R)
USB Thumbdrive
Discrete Flash Card (DFC)
Viking Technology’s USB ThumbDrive is built for embedded and industrial removal storage.
The USB ThumbDrive is a USB2.0/3.0 storage solution that is a universal embedded
drive built to support a wide breadth of requirements and needs within embedded and
industrial storage environments. With removable capabilities and standard USB2.0/3.0 highperformance interface, the USB ThumbDrive is ideal for boot, image, and other storage
usage that require removable capabilities.
DFC (Discrete Flash Card) is a case-less, connector-less compact flash card with a BGA
footprint for directly soldering to PCBs. These rugged, board-mounted SSD’s are designed
for harsh environments and to eliminate overall system cost and potential reliability issues
associated with removable Compact Flash cards.
DFC is a SWaP (Size, Weight and Power) optimized design tailored for the harsh environmental
demands of military applications. Ideal for storing OS software or microcode, Viking DFC is
also well-suited for embedded real time processing or for mobile low power applications.
DFC
‣ Optimized for space constraint routers/
switches
‣ Available in iTemp & cTemp configurations
‣ Superior wear leveling
‣ Power fail management
‣ Firmware stored redundantly
‣ Read disturb management
‣ Optimized for space constraint routers/
switches
‣ ECC and Data Management
‣ Available in iTemp & cTemp configurations
‣ USB Hyperstone U8
‣ Highest endurance
‣ Extremely low cost alternative
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
FORM FACTOR
INTERFACE
NAND
CONTROLLER
CAPACITY
PERFORMANCE
USB Thumbdrive
USB
SLC/MLC
Hyperstone
Up to 128GB
25MB/s (W) - 35MB/s (R)
DFC
PATA
SLC/MLC
SMI 3252/Hyperstone U8
Up to 8GB
20MB/s (W) - 20MB/s (R)
Markets Served
Markets Served
IP Routing | Switches | Servers | Cache | Data Acceleration |
Factory Automation | Medical Equipment | Boot Device | Data Logging
IP Routing | Switches | Servers | Cache | Data Acceleration |
Factory Automation | Medical Equipment | Boot Device | Data Logging
DRAM (DDR4, DDR3, DDR2, DDR1)
From enterprise to embedded to network infrastructure, OEMs from around the world
trust in Viking Technology’s DRAM modules and technology. Viking has more than just a
long history of supporting OEMs with edging lead DRAM technology but also provides
its customers with legacy support. With the industry’s broadest offering of standard DRAM
modules, specialty modules, and small form factor modules, Viking is not only a provider
of high-quality memory but a partner in DRAM technology. Trusted for over 20 years in the
DRAM market.
RDIMM/UDIMM
MINI RDIMM/UDIMM
Markets Served
Servers & Storage Enterprise | Switches | Data Acceleration | In-Memory
Databases | Caching
FORM FACTOR
DDR4
DDR3
DDR2
DDR1
LRDIMM
Up to 64GB
Up to 32GB
RDIMM
Up to 64GB
Up to 32GB
Up to 16GB
Up to 4GB
UDIMM
Up to 16GB
Up to 16GB
Up to 8GB
Up to 2GB
VLP RDIMM
Up to 32GB
Up to 16GB
Up to 8GB
Up to 4GB
VLP UDIMM
Up to 16GB
Up to 8GB
Up to 4GB
Up to 1GB
Up to 16GB
Up to 8GB
ULP RDIMM
MiniRDIMM
Up to 16GB
Up to 16GB
Up to 8GB
Up to 1GB
MiniUDIMM
Up to 16GB
Up to 16GB
Up to 4GB
Up to 1GB
VLP MiniRDIMM
Up to 8GB
Up to 8GB
Up to 4GB
NA
Up to 8GB
Up to 4GB
NA
VLP MiniUDIMM
LRDIMM
ULP MINI RDIMM/UDIMM
ULP MiniRDIMM
Up to 8GB
Up to 8GB
NA
ULP MiniUDIMM
Up to 8GB
Up to 8GB
NA
SORDIMM
Up to 16GB
Up to 16GB
Up to 4GB
Up to1GB
SOUDIMM
Up to 16GB
Up to 8GB
Up to 4GB
Up to1GB
SOCDIMM
NA
NA
Up to 4GB
Up to1GB
VLP SORDIMM
Up to 8GB
Up to 8GB
*Viking also offers customizable modules such as heat sensitive, extended temperature and special form factors.
SORDIMM/SOUDIMM
VLP RDIMM/UDIMM
ULP RDIMM/UDIMM
VLP SORDIMM/SOUDIMM
DRAM Stacked
Viking’s Stacking Cell Technology is designed to enable businesses to utilize high-density
DRAM and memory modules across all business applications. Designing the highest density
memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These
multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at
test. Stacking Cell Technology mitigates this approach by coupling off-the-shelf DRAM chips
in an innovative board stacking solution. This technology advancement allows for ultimate
flexibility of configuration, lower cost of device, and most importantly vendor agnostic.
Stacking Technology
By coupling DRAM chips with board stacking capabilities, Stacking Cell Technology offers
high-density memory modules or individual high-density “stacking cells”. Parallel cells
enable embedded systems providers to utilize high-density onboard DRAM at a very cost
effective price. With parallel cell technology in mind, system manufacturers can design for
future DRAM growth and densities.
‣ Industrial temperature
‣ Cost effective
‣ Vendor neutral DRAM
‣ Zero compound yield loss during stacking
process
‣ JEDEC electrical & mechanical standards
‣ Multiple Voltage options: 1.25V, 1.35V, 1.5V,
1.8V, 2.5V, 3.3V, 5V
‣ Lower cost per bit
‣ Flexibility in configuration
Global Locations
US Headquarters
Europe
Asia Pacific
Japan
20091 Ellipse
Foothill Ranch, CA 92610
Toll Free: +1 800 338 2361
Main: +1 949 643 7255
Fax: +1 949 643 7250
Lerchenstrasse 1
D-91710 Gunzenhausen
Germany
Phone: +49 2921 981 6463
No 2 Chai Chee Drive
Singapore, 109840
Phone: +65 6839 8008
Shinagawa Grand Central Tower 6F
2-16-4 Konan, Minato-ku,
Tokyo 108-0075, Japan
Phone: +81-3-6863-5351
For sales information, email us at sales@vikingtechnology.com
www.vikingtechnology.com
Copyright © 2016 Viking Technology, all rights reserved.
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