Mr27v6402g

Mr27v6402g
FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G
4M–Word × 16–Bit or 8M–Word × 8–Bit
Issue Date: Mar. 12, 2002
P2ROM
FEATURES
PIN CONFIGURATION (TOP VIEW)
·4,194,304-word × 16-bit/8,388,608-word × 8-bit electrically
switchable configuration
· +3.0 V to 3.6 V power supply
· Access time
80 ns MAX
· Operating current
30 mA MAX
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27V6402G-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27V6402G-xxxTP
44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K)
· MR27V6402G-xxxTN
48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-K)
A21
1
44
A20
A18
A17
2
43
A19
3
42
A7
4
41
A8
A9
A6
5
40
A10
A5
A4
6
39
7
38
A11
A12
A3
8
37
A13
A2 9
A1 10
36
35
A14
A15
A0 11
34
A16
13
BYTE#
32 VSS
14
31
15
30
D8 16
D1 17
28
CE#
VSS
OE#
D0
12
33
D15/A–1
D7
29 D14
D6
D13
26 D5
D9 18
D2 19
D10 20
27
D3 21
D11 22
24
D12
D4
23 VCC
25
44SOP,
44TSOP(Type-II)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
· Short lead time, since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
· No additional programming charge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask ROM and some FLASH
products.
A15
A14
1
48
2
47
A13
A12
A11
A10
A9
A8
A19
A20
NC
NC
A21
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
VSS
CE#
A0
48TSOP(Type-I)
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
CE
OE
BYTE#
Row Decoder
OE#
Memory Cell Matrix
4M × 16-Bit or 8M × 8-Bit
Column Decoder
Address Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
CE#
Multiplexer
Output Buffer
D0
D2
D1
D4
D3
D6
D5
D8
D7
D10
D9
D12
D11
D14
D13
D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
Functions
D15 / A–1
Data output / Address input
A0 to A21
Address inputs
D0 to D14
Data outputs
CE#
Chip enable input
OE#
Output enable input
BYTE#
Word / Byte select input
VCC
Power supply voltage
VSS
Ground
NC
No connect
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
FUNCTION TABLE
Mode
CE#
OE#
BYTE#
Read (16-Bit)
L
L
H
Read (8-Bit)
L
L
Output disable
L
H
Standby
H
∗
VCC
D0 to D7
D8 to D14
D15/A–1
DOUT
L
DOUT
H
Hi–Z
Hi–Z
3.3 V
L
L/H
H
∗
Hi–Z
L
∗
∗: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Operating temperature under bias
Condition
Ta
Storage temperature
VI
relative to VSS
Output voltage
VO
Power supply voltage
VCC
Power dissipation per package
PD
Unit
0 to 70
°C
–55 to 125
°C
–0.5 to VCC+0.5
V
–0.5 to VCC+0.5
V
–0.5 to 5
V
1.0
W
—
Tstg
Input voltage
Value
—
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Symbol
VCC power supply voltage
Condition
Min.
Typ.
Max.
Unit
3.0
—
3.6
V
2.2
—
VCC+0.5∗
V
–0.5∗∗
—
0.6
V
VCC
Input “H” level
VIH
Input “L” level
VIL
VCC = 3.0 to 3.6 V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Symbol
Input
CIN1
BYTE#
CIN2
Output
COUT
Condition
VI = 0 V
VO = 0 V
Min.
Typ.
Max.
—
—
8
—
—
200
—
—
10
Unit
pF
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Input leakage current
Parameter
ILI
VI = 0 to VCC
—
—
10
µA
Output leakage current
ILO
VO = 0 to VCC
—
—
10
µA
VCC power supply current
ICCSC
CE# = VCC
—
—
10
µA
(Standby)
ICCST
CE# = VIH
—
—
1
mA
VCC power supply current
ICCA1
CE# = VIL
—
—
30
mA
ICCA2
OE# = VIH
(Read)
tc = 100 ns
—
—
20
mA
Input “H” level
VIH
—
tc = 200 ns
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
—
–0.5∗∗
—
0.6
V
Output “H” level
VOH
IOH = –2 mA
2.4
—
—
V
Output “L” level
VOL
IOL = 4 mA
—
—
0.4
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
Parameter
Symbol
Address cycle time
Condition
Min.
Max.
Unit
tC
—
80
—
ns
Address access time
tACC
CE# = OE# = VIL
—
80
ns
CE# access time
tCE
OE# = VIL
—
80
ns
OE# access time
Output disable time
Output hold time
tOE
CE #= VIL
—
30
ns
tCHZ
OE# = VIL
0
30
ns
tOHZ
CE# = VIL
0
25
ns
tOH
CE #= OE# = VIL
0
—
ns
Measurement conditions
Input signal level -------------------------------- 0 V/3 V
Input timing reference level ------------------ 1/2Vcc
Output load--------------------------------------- 50 pF
Output timing reference level ---------------- 1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
TIMING CHART (READ CYCLE)
16-Bit Read Mode (BYTE# = VIH)
tC
tC
A0 to A21
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D15
Valid Data
Hi-Z
Valid Data
Hi-Z
8-Bit Read Mode (BYTE# = VIL)
tC
tC
A-1 to A21
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D7
Hi-Z
Valid Data
Valid Data
Hi-Z
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
PACKAGE DIMENSIONS
(Unit: mm)
SOP44-P-600-1.27-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
2.10 TYP.
4/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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OKI Semiconductor
MR27V6402G/P2ROM
(Unit: mm)
TSOP(2)44-P-400-0.80-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.54 TYP.
3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.55 TYP.
1/Dec. 2, 1999
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
REVISION HISTORY
Document
No.
FEDR27V6402G-02-01
Page
Date
Previous
Edition
Current
Edition
Oct. 2001
–
–
Jan. 2002
5
5
Description
Final edition 1
Changed tC, tACC, tCE to 80ns
FEDR27V6402G-02-02
Changed ICCA to 30mA
Changed tOE to 30ns
FEDR27V6402G-02-03
Feb. 8, 2002
5
5
Changed ICCSC to 10uA
1-3
FEDR27V6402G-02-04
Mar. 12, 2002
1-4, 7
4
Changed the form
Added ICCA2 at tC = 200ns
Change the symbol, ICCA to ICCA1
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FEDR27V6402G-02-04
OKI Semiconductor
MR27V6402G/P2ROM
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2002 Oki Electric Industry Co., Ltd.
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