MAX6956

MAX6956
MAX6956AAX+
RELIABILITY REPORT
FOR
MAX6956AAX+
PLASTIC ENCAPSULATED DEVICES
March 16, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX6956AAX+
Conclusion
The MAX6956AAX+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6956 compact, serial-interfaced LED display driver/I/O expander provide microprocessors with up to 28 ports. Each port is individually user
configurable to either a logic input, logic output, or common-anode (CA) LED constant-current segment driver. Each port configured as an LED
segment driver behaves as a digitally controlled constant-current sink, with 16 equal current steps from 1.5mA to 24mA. The LED drivers are suitable
for both discrete LEDs and CA numeric and alphanumeric LED digits. Each port configured as a general-purpose I/O (GPIO) can be either a push-pull
logic output capable of sinking 10mA and sourcing 4.5mA, or a Schmitt logic input with optional internal pullup. Seven ports feature configurable
transition detection logic, which generates an interrupt upon change of port logic level. The MAX6956 is controlled through an I²C-compatible 2-wire
serial interface, and uses four-level logic to allow 16 I²C addresses from only 2 select pins. The MAX6956AAX and MAX6956ATL have 28 ports and
are available in 36-pin SSOP and 40-pin thin QFN packages, respectively. The MAX6956AAI and MAX6956ANI have 20 ports and are available in
28-pin SSOP and 28-pin DIP packages, respectively. For an SPI-interfaced version, refer to the MAX6957 data sheet. For a lower cost pin-compatible
port expander without the constant-current LED drive capability, refer to the MAX7300 data sheet.
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MAX6956AAX+
II. Manufacturing Information
A. Description/Function:
2-Wire-Interfaced, 2.5V to 5.5V, 20-Port or 28-Port LED Display Driver and I/O
Expander
B. Process:
TSMC 0.5um, 2 Poly, 3 Metal, Silicon Gate CMOS
C. Number of Device Transistors:
D. Fabrication Location:
Taiwan
E. Assembly Location:
Carsem Malaysia, ATP Philippines
F. Date of Initial Production:
July 27, 2002
III. Packaging Information
A. Package Type:
36-pin SSOP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-3301-0020
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 3
J. Single Layer Theta Ja:
84.7°C/W
IV. Die Information
A. Dimensions:
122 X 104 mils
B. Passivation:
SiO2 (Oxide)/Si3N4 (Nitride)
C. Interconnect:
Al/Cu (0.5%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.5um
F. Minimum Metal Spacing:
0.5um
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
Silicon dioxide
I. Die Separation Method:
Wafer Saw
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MAX6956AAX+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 45 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 23.9 x 10
= 23.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maximic.com/. Current monitor data for the TSMC 0.5um Process results in a FIT Rate of 4.5 @ 25C and 77.5 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DW20-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-100 mA.
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MAX6956AAX+
Table 1
Reliability Evaluation Test Results
MAX6956AAX+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
45
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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