Data Sheet HFBR-53A3VEMZ/HFBR-53A3VFMZ for Fibre Channel

Data Sheet HFBR-53A3VEMZ/HFBR-53A3VFMZ for Fibre Channel
HFBR-53A3VEMZ/HFBR-53A3VFMZ
RoHS Compliant 3.3 V 1 x 9 Fiber Optic Transceivers
for Fibre Channel
Data Sheet
Description
The HFBR-53A3VEMZ/VFMZ
transceivers from Avago
Technologies allow the system
designer to implement a range of
solutions for multimode Fibre
Channel applications.
Receiver Section
The receiver of the
HFBR-53A3VEMZ/VFMZ includes
a GaAs PIN photo-diode mounted
together with a custom, silicon
bipolar transimpedance
preamplifier IC in an OSA. This
OSA is mated to a custom silicon
The overall Avago transceiver prod- bipolar circuit that provides postuct consists of three sections: the
amplification and quantization.
transmitter and receiver optical
subassemblies, an electrical
The post-amplifier also includes a
subassembly, and the package
Signal Detect circuit which prohousing which incorporates a
vides a TTL logic-high output
duplex SC connector receptacle.
upon detection of a usable input
optical signal level. The high
Transmitter Section
speed output lines are internally
ac-coupled.
The transmitter section of the
HFBR-53A3VEMZ/VFMZ consists of
an 850 nm Vertical Cavity Surface
Emitting Laser (VCSEL) in an
Optical Subassembly (OSA), which
mates to the fiber cable. The OSA
is driven by a custom, silicon
bipolar IC which converts
differential PECL compatible logic
signals into an analog laser diode
drive current. The high speed
output lines are internally accoupled and differentially terminate
with a 100 Ω resistor.
Features
• Fully RoHS compliant
• Compliant with ANSI X3.297-1996
Fibre Channel Physical Interface
FC-PH-2 revision 7.4 proposed
specification for 100-M5-SN-I and
100-M6-SN-I signal interfaces
• Performance
HFBR-53A3VEMZ/VFMZ:
300 m links in 62.5/125 µm MMF
cables500 m links in 50/125 µm MMF
cables
• Wave solder and aqueous wash
process compatible
• Industry standard mezzanine height
1 x 9 package style with integral
duplex SC connector
• IEC 60825-1 Class 1/CDRH Class I
laser eye safe
• Single +3.3 V power supply operation
with PECL compatible logic
interfaces and TTL Signal Detect
Applications
• Mass storage systems I/O
• Computer systems I/O
• High-speed peripheral interface
• High-speed switching systems
• Computer systems I/O
• Host adapter I/O
• RAID cabinets
Related Products
• Versions of this transceiver module
also available for +5 V operation
(AFBR-53D3Z)
Package and Handling Instructions
Flammability
The HFBR-53A3VEMZ/VFMZ
transceiver housing is made of
high strength, heat resistant,
chemically resistant, and UL
94V-0 flame retardant plastic.
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also, Avago
does not recommend the use of
cleaners that use halogenated
hydrocarbons because of their
potential environmental harm.
Recommended Solder and Wash
Process
The HFBR-53A3VEMZ/VFMZ is
compatible with industrystandard wave or hand solder
processes.
Regulatory Compliance
(See the Regulatory Compliance
Table for transceiver
performance)
The overall equipment design will
determine the certification level.
The transceiver performance is
offered as a figure of merit to
assist the designer in considering
their use in equipment designs.
Process Plug
This transceiver is supplied with
a process plug (HFBR-5000) for
protection of the optical ports
within the duplex SC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping,
and storage. It is made of a hightemperature, molded sealing
material that can withstand 80°C
and a rinse pressure of 110 lbs
per square inch.
Recommended Solder Fluxes
Solder fluxes used with the
HFBR-53A3VEMZ/VFMZ should
be water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/Degrading
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane.
Other: soap solution, naphtha.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
2
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal ESD
handling precautions for ESD
sensitive devices. These precautions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas. The transceiver performance has been shown to provide
adequate performance in typical
industry production
environments.
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the transceiver parts.
To the extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet. The transceiver
performance is more robust than
typical industry equipment
requirements of today.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Avago will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 4) for more details.
Immunity
Equipment utilizing these
transceivers will be subject to
radio-frequency electromagnetic
fields in some environments.
These transceivers have good
immunity to such fields due to
their shielded design.
Eye Safety
These laser-based transceivers
are classified as AEL Class I (U.S.
21 CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH. They
are also eye safe under normal
operating conditions and under
all reasonably forseeable single
fault conditions per EN60825-1.
Avago has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and EN
60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to
maximum volts transmitter VCC.
CAUTION:
There are no user serviceable parts
nor any maintenance required for
the HFBR-53A3VEMZ/VFMZ. All
adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of the
HFBR-53A3VEMZ/VFMZ will
result in voided product warranty.
It may also result in improper
operation of the HFBR53A3VEMZ/VFMZ circuitry, and
possible overstress of the laser
source. Device degradation or
product failure may result.
Regulatory Compliance
Feature
Electrostatic Discharge
(ESD) to the
Electrical Pins
Electrostatic Discharge
(ESD) to the
Duplex SC Receptacle
Electromagnetic
Interference (EMI)
Connection of the
HFBR-53A3VEMZ/VFMZ to a
nonapproved optical source,
operating above the recommended absolute maximum
conditions or operating the
HFBR-53A3VEMZ/VFMZ in a
manner inconsistent with its
design and function may result in
hazardous radiation exposure and
may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product under
the provisions of U.S. 21 CFR
(Subchapter J).
Test Method
MIL-STD-883C
Method 3015.4
Performance
Class 1 (>1500 V)
Variation of IEC 801-2
Typically withstand at least 15 kV without
damage when the duplex SC connector
receptacle is contacted by a Human Body
Model probe.
Margins are dependent on customer board and
chassis designs.
Immunity
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class I
Variation of IEC 801-3
Laser Eye Safety
and Equipment Type
Testing
US 21 CFR, Subchapter J
per Paragraphs 1002.10
and 1002.12
Component
Recognition
3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied
to the transceiver without a chassis enclosure.
AEL Class I, FDA/CDRH
HFBR-53A3V*MZ Accession #2071022
EN 60825-1: 1994 + A11:1996
EN 60825-2: 1994 + A1
EN 60950: 1992 + A1 + A2 + A3
+A4 + A11
AEL Class 1, TUV Rheinland of North America
HFBR-53A3V*MZ:
Certificate #R9771018.5
Protection Class III
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
UL File E173874
APPLICATION SUPPORT
Optical Power Budget and Link
Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiberoptic link is determined by the
difference between the minimum
transmitter output optical power
(dBm avg) and the lowest
receiver sensitivity (dBm avg).
This OPB provides the necessary
optical signal range to establish a
working fiber-optic link. The OPB
is allocated for the fiber-optic
cable length and the corresponding link penalties. For
proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
Data Line Interconnections
Avago’s HFBR-53A3VEMZ/VFMZ
fiber-optic transceiver is designed
for compatible PECL signals. The
transmitter inputs are internally
ac-coupled to the laser driver
circuit from the transmitter input
pins (pins 7, 8). The transmitter
driver circuit for the laser light
source is an ac-coupled circuit.
This circuit regulates the output
optical power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is reasonably
balanced in duty factor. If the
data duty factor has long, continuous state times (low or high
data duty factor), then the output
optical power will gradually
change its average output optical
power level to its pre-set value.
4
The receiver section is internally
ac-coupled between the preamplifier and the post-amplifier
stages. The actual Data and Databar outputs of the post-amplifier
are ac-coupled to their respective
output pins (pins 2, 3). Signal
Detect is a single-ended, TTL
output signal that is dc-coupled
to pin 4 of the module. Signal
Detect should not be ac-coupled
externally to the follow-on
circuits because of its infrequent
state changes.
Caution should be taken to
account for the proper interconnection between the supporting
Physical Layer integrated circuits
and this HFBR-53A3VEMZ/VFMZ
transceiver. Figure 3 illustrates a
recommended interface circuit
for interconnecting to a dc PECL
compatible fiber-optic
transceiver.
Eye Safety Circuit
For an optical transmitter device
to be eye-safe in the event of a
single fault failure, the transmitter must either maintain normal,
eye-safe operation or be disabled.
In the HFBR-53A3VEMZ/VFMZ
there are three key elements to
the laser driver safety circuitry: a
monitor diode, a window detector
circuit, and direct control of the
laser bias. The window detection
circuit monitors the average
optical power using the monitor
diode. If a fault occurs such that
the transmitter DC regulation
circuit cannot maintain the preset
bias conditions for the laser
emitter within ± 20%, the
transmitter will automatically be
disabled. Once this has occurred,
only an electrical power reset will
allow an attempted turn-on of the
transmitter.
Signal Detect
The Signal Detect circuit provides
a TTL low output signal when the
optical link is broken or when the
transmitter is off. The Signal
Detect threshold is set to
transition from a high to low state
between the minimum receiver
input optional power and –30 dBm
avg. input optical power
indicating a definite optical fault
(e.g., unplugged connector for the
receiver or transmitter, broken
fiber, or failed far-end transmitter
or data source). A Signal Detect
indicating a working link is
functional when receiving
encoded 8B/10B characters. The
Signal Detect does not detect
receiver data error or error-rate.
Data errors are determined by
signal processing following the
transceiver.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard; and
more importantly, it reduces the
possibility of interference to
neighboring equipment. The EMI
performance of an enclosure
using these transceivers is
dependent on the chassis design.
Avago encourages using standard
RF suppression practices and
avoiding poorly EMI-sealed
enclosures.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each
parameter in isolation, all other parameters having values within the recommended operating conditions. It should not
be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure
to the absolute maximum ratings for extended periods can adversely affect device reliability.
Parameter
Symbol
Min.
Storage Temperature
Supply Voltage
Transmitter Differential Input Voltage
Relative Humidity
TTL Signal Detect Output Current – Low
TTL Signal Detect Output Current – High
TS
VCC
VD
RH
IOLMAX
IOHMAX
–40
–0.5
Typ.
5
–5.0
Max.
Unit
+100
5.0
2.2
95
˚C
V
V
%
mA
mA
4.0
Reference
1
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Case Temperature
Supply Voltage
Power Supply Rejection
Transmitter Differential Input Voltage
Received Data Output Load
TTL Signal Detect Output Current – Low
TTL Signal Detect Output Current – High
Symbol
TA
TC
VCC
PSR
VD
RDL
IOL
IOH
Min.
0
0
3.14
Typ.
Max.
+70
+80
3.47
100
0.4
1.6
50
1.0
–400
Unit
˚C
˚C
V
mVP–P
V
Ω
mA
µA
Reference
Unit
˚C/s
˚C/s
Reference
2
3
Process Compatibility
Parameter
Hand Lead Soldering Temperature/Time
Wave Soldering and Aqueous Wash
Symbol
TSOLD/tSOLD
TSOLD/tSOLD
Min.
Typ.
Max.
+260/10
+260/10
4
Notes:
1. The transceiver is Class 1 eye safe up to VCC = 5.0 V.
2. Case temperature measurement referenced to the metal housing.
3. Tested with a 100 mVP–P sinusoidal signal in the frequency range from 10 Hz to 2 MHz on the VCC supply with the recommended power supply
filter (with C8) in place. Typically less than a 1 dB change in sensitivity is experienced.
4. Aqueous wash pressure < 110 psi.
5
HFBR-53A3VEMZ/VFMZ, 850 nm VCSEL
Transmitter Electrical Characteristics
(TA = 0˚C to +70˚C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Symbol
ICCT
Power Dissipation
Laser Reset Voltage
PDIST
VCCT–reset
Min.
Typ.
55
Max.
75
Unit
mA
0.18
2.5
0.26
2.0
W
V
Reference
1
Receiver Electrical Characteristics
(TA = 0˚C to +70˚C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage – Peak to Peak
Differential
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage – Low
Signal Detect Output Voltage – High
Signal Detect Assert Time
Signal Detect Deassert Time
Symbol
ICCR
PDISR
VOPP
tr
tf
VOL
VOH
tSDA
tSDD
Min.
0.4
Typ.
80
0.26
Max.
135
0.47
1.20
Unit
mA
W
V
0.40
0.40
0.6
ns
ns
V
V
µs
µs
2.2
100
350
Reference
2
3
3
4
4
Notes:
1. The Laser Reset Voltage is the voltage level below which the VCCT voltage must be lowered to cause the laser driver circuit to reset from an
electrical/optical shutdown condition to a proper electrical/optical operating condition. The maximum value corresponds to the worst-case
highest VCC voltage necessary to cause a reset condition to occur. The laser safety shutdown circuit will operate properly with transmitter VCC
levels of 2.5 Vdc ≤ VCC ≤ 5.0 Vdc.
2. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.
3. These are 20-80% values.
4. Under recommended operating conditions.
6
HFBR-53A3VEMZ/VFMZ, 850 nm VCSEL
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Output Optical Power
50/125 µm, NA = 0.20 Fiber
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
Optical Extinction Ratio
Center Wavelength
Spectral Width – rms
Optical Rise/Fall Time
RIN12
Deterministic Transmitter Jitter
Symbol
POUT
Min.
–10
POUT
–10
λC
σ
tr/tf
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Symbol
Input Optical Power
PIN
Operating Center Wavelength
λC
Return Loss
Signal Detect – Asserted
PA
Signal Detect – Deasserted
PD
Signal Detect – Hysteresis
PA – PD
9
830
Min.
–16
770
12
Typ.
850
Typ.
Max.
–4
Unit
dBm avg.
–4
dBm avg.
860
0.85
0.45
–116
188
dB
nm
nm rms
ns
dB/Hz
ps
Max.
0
860
–17
–30
1.5
Unit
dBm avg.
nm
dB
dBm avg.
dBm avg.
dB
Reference
1
2, 3, Figure 1
Reference
4
5
Notes:
1. Optical Extinction Ratio is defined as the ratio of the average optical power of the transmitter in the high (“1”) state to the low (“0”) state.
This Optical Extinction Ratio is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg).
2. These are 20-80% values and include the effect of a fourth order filter.
3. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time, fall time, pulse
overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity.
4. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
5. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
7
Table 1. Pinout Table
Pin
Symbol
Functional Description
Mounting Pins
The mounting pins are provided for transceiver mechanical attachment to the circuit board. They
are embedded in the nonconductive plastic housing and are not connected to the transceiver
internal circuit, nor is there a guaranteed connection to the metallized housing in the EM and FM
versions. They should be soldered into plated-through holes on the printed circuit board.
1
VEER
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. (For HFBR-53A5VM, VEER = VEET)
2
RD+
Receiver Data Out
AC coupled – PECL compatible.
3
RD–
Receiver Data Out Bar
AC coupled – PECL compatible.
4
SD
Signal Detect
Signal Detect is a single-ended TTL output. If Signal Detect output is not used, leave it
open-circuited.
Normal optical input levels to the receiver result in a logic “1” output, VOH, asserted.
Low input optical levels to the receiver result in a fault condition indicated by a logic “0” output
VOL, deasserted.
5
VCCR
Receiver Power Supply
Provide +3.3 Vdc via the recommended receiver power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCR pin.
6
VCCT
Transmitter Power Supply
Provide +3.3 Vdc via the recommended transmitter power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCT pin.
7
TD–
Transmitter Data In-Bar
AC coupled – PECL compatible. Internally terminated differentially with 100 Ω.
8
TD+
Transmitter Data In
AC coupled – PECL compatible. Internally terminated differentially with 100 Ω.
9
VEET
Transmitter Signal Ground
Directly connect this pin to the transmitter signal ground plane.
NORMALIZED AMPLITUDE
1 = VEER
2 = RD+
1.3
RX
3 = RD-
1.0
4 = SD
0.8
5 = VCCR
6 = VCCT
0.5
7 = TD0.2
8 = TD+
0
-0.2
9 = VEET
0
0.15
0.375
0.625
0.85
Figure 1. Transmitter optical eye diagram mask.
TX
NIC
TOP VIEW
1.0
NORMALIZED TIME
8
NIC
NIC = NO INTERNAL CONNECTION (MOUNTING PINS)
Figure 2. Pin-out.
3.3 Vdc
+
LASER
DRIVER
CIRCUIT
9
8
50 Ω
VCC2 VEE2
TD+
TD- 7
50 Ω
TD-
VEET
TD+
PECL
INPUT
VCCT
R13
150
L2
6
HFBR-53A3VEMZ/VFMZ
FIBER-OPTIC
TRANSCEIVER
0.1
µF
1 µH
C2
0.1 µF
VCCR 5
C1
SIGNAL
DETECT
CIRCUIT
+ C8
10 µF*
HDMP-1636A/-1646A
SERIAL/DE-SERIALIZER
(SERDES - 10 BIT
TRANSCEIVER)
3.3 V
0.1
µF
SD 4
TO SIGNAL DETECT (SD)
INPUT AT UPPER-LEVEL-IC
RD- 3
50 Ω
RDR14
POSTAMPLIFIER
100
50 Ω
RD+ 2
1
V
PARALLEL
TO SERIAL
CIRCUIT
10
µF
C3
1 µH
CLOCK
SYNTHESIS
CIRCUIT
R12
150
+ C4
L1
0.1
µF
PREAMPLIFIER
OUTPUT
DRIVER
100 Ω
GND
EER
INPUT
BUFFER
RD+
CLOCK
RECOVERY
CIRCUIT
SERIAL TO
PARALLEL
CIRCUIT
SEE HDMP-1636A/-1646A DATA SHEET FOR
DETAILS ABOUT THIS TRANSCEIVER IC.
NOTES:
USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE.
USE 50 Ω MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS.
LOCATE 50 Ω TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.
Figure 3. Recommended HFBR-53A3VEMZ/VFMZ fiber-optic transceiver and HDMP-1636A/1646A SERDES integrated circuit transceiver interface
and power supply filter circuits.
(2X) ø
20.32
0.800
1.9 ± 0.1
0.075 ± 0.004
Ø0.000 M A
(9X) ø
20.32
0.800
0.8 ± 0.1
0.032 ± 0.004
Ø0.000 M A
(8X) 2.54
0.100
TOP VIEW
Figure 4. Recommended board layout hole pattern.
9
–A–
A
KEY:
YYWW = DATE CODE
FOR MULTIMODE MODULE:
XXXX-XXXX = HFBR-53xx
ZZZZ = 850 nm
XXXX-XXXX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
TX
29.6 UNCOMPRESSED
(1.16)
39.6
(1.56) MAX.
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
A
25.4
(1.00)MAX.
12.7
(0.50)
12.7
(0.50)
SLOT WIDTH
+0.1
0.25 -0.05
+0.004
0.010 -0.002
(
2.09 UNCOMPRESSED
(0.08)
10.2 MAX.
(0.40)
)
9.8 MAX.
(0.386)
1.3
(0.05)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X ∅
+0.010
0.018 -0.002
(
20.32
23.8
(0.937) (0.800)
2X ∅
20.32
(0.80)
15.8 ± 0.15
(0.622 ± 0.006)
)
8X 2.54
(0.100)
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 5. Package outline for HFBR-53A3VEMZ.
10
2.0 ± 0.1
(0.079 ± 0.004)
2X ∅
+0.25
1.27 -0.05
+0.010
0.050 -0.002
(
20.32
(0.800)
)
A
1.014
0.8
2x (0.032)
0.8
2x (0.032)
+ 0.5
10.9 – 0.25
+ 0.02
0.43 – 0.01
(
9.4
(0.374)
5.35
(0.25)
MODULE
PROTRUSION
PCB BOTTOM VIEW
Figure 6. Suggested module positioning and panel cut-out for HFBR-53A3VEMZ.
11
27.4 ± 0.50
(1.08 ± 0.02)
)
A
KEY:
YYWW = DATE CODE
FOR MULTIMODE MODULE:
XXXX-XXXX = HFBR-53xx
ZZZZ = 850 nm
XXXX-XXXX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
TX
39.6
(1.56) MAX.
12.7
(0.50)
4.7
(0.185)
1.01
(0.40)
AREA
RESERVED
FOR
PROCESS
PLUG
A
25.4
(1.00)MAX.
25.8 MAX.
(1.02)
(
+0.1
0.25 -0.05
+0.004
0.010 -0.002
(
20.32
23.8
(0.937) (0.800)
2x ∅
20.32
(0.800)
22.0
(0.87)
15.8 ± 0.15
(0.622 ± 0.006)
)
8x 2.54
(0.100)
2x ∅
(
AREA
RESERVED
FOR
PROCESS
PLUG
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 7. Package outline for HFBR-53A3VFMZ.
12
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
14.4
(0.57)
9.8 MAX.
(0.386)
+0.25
0.46 -0.05
9x ∅
+0.010
0.018 -0.002
SLOT DEPTH 2.2
(0.09)
12.7
(0.50)
10.2 MAX.
(0.40)
)
3.3 ± 0.38
(0.130 ± 0.015)
29.7
(1.17)
+0.25
1.27 -0.05
+0.010
0.050 -0.002
20.32
(0.800)
)
A
DIMENSION SHOWN FOR MOUNTING MODULE
1.98 FLUSH TO PANEL. THICKER PANEL WILL
(0.078) RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.27 OPTIONAL SEPTUM
(0.05)
30.2
(1.19)
0.36
(0.014)
10.82
(0.426)
1.82
(0.072)
13.82
(0.544)
26.4
(1.04)
BOTTOM SIDE OF PCB
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8. Suggested module positioning and panel cut-out for HFBR-53A3VFMZ.
Ordering Information
850 nm VCSEL
HFBR-53A3VEMZ
HFBR-53A3VFMZ
13
KEEP OUT ZONE
(SX – Short Wavelength Laser)
Extended shield, metal housing.
Flush shield, metal housing.
14.73
(0.58)
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-4731EN January 19, 2006
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