MAX6002

MAX6002
MAX6002EUR
Rev. A
RELIABILITY REPORT
FOR
MAX6002EUR
PLASTIC ENCAPSULATED DEVICES
February 19, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX6002 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX6002 SOT23, low-cost series voltage reference meets the cost advantage of shunt references and offers
the power-saving advantage of series references, which traditionally cost more. Unlike conventional shunt-mode (twoterminal) references that must be biased at the load current and require an external resistor, this device eliminates
the need for an external resistor and offers a supply current that is virtually independent of the supply voltage.
This micropower, low-dropout, low-cost device is ideal for high-volume, cost-sensitive 3V and 5V battery- operated
systems with wide variations in supply voltage that require very low power dissipation. Additionally, this device is
internally compensated and does not require an external compensation capacitor, saving valuable board area in
space-critical applications.
B. Absolute Maximum Ratings
Item
Voltages Referenced to GND
IN
OUT
Output Short Circuit to GND or IN (VIN < 6V)
Output Short Circuit to GND or IN (VIN ³ 6V)
Operating Temperature Range
Storage Temperature Range
Lead Temperature (soldering, 10sec)
Continuous Power Dissipation (TA = +70°C)
3-Pin SOT23
Derates above +70°C
3-Pin SOT23
Rating
-0.3V to +13.5V
-0.3V to (VIN + 0.3V)
Continuous
60sec
-40°C to +85°C
-65°C to +150°C
+300°C
320mW
4.0mW/°C
II. Manufacturing Information
A. Description/Function:
Low-Cost, Low-Power, Low-Dropout, SOT23-3 Voltage Reference
B. Process:
S12 (SG1.2) - Standard 1.2 micron silicon gate CMOS
C. Number of Device Transistors:
70
D. Fabrication Location:
California or Oregon, USA
E. Assembly Location:
Malaysia
F. Date of Initial Production:
October, 1998
III. Packaging Information
A. Package Type:
3-Lead SOT23
B. Lead Frame:
Alloy 42 or Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-0901-0151
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard JESD22-A112:
Level 1
IV. Die Information
A. Dimensions:
44 x 31 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Copper/Si
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord
(Reliability Lab Manager)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 240 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 4.52 x 10-9
λ = 4.52 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec. # 06-5630) shows the static circuit used for this test. Maxim also performs 1000 hour
life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The RF23-7 die type has been found to have all pins able to withstand a transient pulse of ±2500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX6002EUR
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
179
0
Moisture Testing
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
77
0
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
77
Mechanical Stress
Temperature
Cycle
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic Package/Process Data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
Mil Std 883D
Method 3015.7
Notice 8
TERMINAL D
R = 1.5kΩ
Ω
C = 100pf
CURRENT
PROBE
(NOTE 6)
ONCE PER SOCKET
ONCE PER BOARD
5K OHMS
35 uA
+ 10 VOLTS
1
0.1 uF
3
2
3 PIN
SOT
DEVICES: MAX 6012 / 6021 / 6025 / 6030 / 6041 / 6050/6018DRAWN BY: CHRIS JAMBARO
6061/6062/6063/6064/6065/6066/6067/6068
NOTES: + 5.5v for the MAX6018 only
MAX. EXPECTED CURRENT = 35 uA
Max current is 125uA and +10v for MAX6061-6068
DOCUMENT I.D. 06-5630
REVISION C
MAXIM TITLE: BI Circuit
(MAX6012/6021/6025/6030/6041/6050/6018/6061/6062/6063/6064/6065/6066/6067/606
8)
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