Download datasheet for 54L02/BCA by Rochester Electronics

Download datasheet for 54L02/BCA by Rochester Electronics
INCH-POUND
MIL-M-38510/27B
18 April 2008
_
SUPERSEDING
MIL-M-38510/27(USAF)
21 August 1972
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, TTL, LOW POWER,
MULTIPLE NOR GATES, MONOLITHIC SILICON
Inactive for new design after 6 October 1995.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic, silicon, TTL, low power, positive NOR
logic gating microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are
provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M38510 have been superseded by MIL-PRF-38535, (see 6.4).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
01
Circuit
Quadruple, 2-input positive NOR gate
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
A
B
C
D
GDFP5-F14 or CDFP6-F14
GDFP4-F14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
14
14
14
14
Flat pack
Flat pack
Dual-in-line
Flat pack
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to
[email protected] Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5962
MIL-M-38510/27B
1.3 Absolute maximum ratings.
Supply voltage range .....................................................................
Input voltage range ........................................................................
Storage temperature range ...........................................................
Maximum power dissipation, PD 1/ ................................................
Lead temperature (soldering 10 seconds) .....................................
Thermal resistance, junction-to-case (θJC) ...................................
Junction temperature (TJ ) ............................................................
0 V dc to 7.0 V dc
0 V dc to 5.5 V dc
-65°C to +150°C
4.2 mW dc
300°C
(See MIL-STD-1835)
175°C
1.4 Recommended operating conditions.
Supply voltage ...............................................................................
Minimum high level input voltage ..................................................
Maximum low level input voltage ...................................................
Normalized fanout (each output) 2/ ..............................................
Case operating temperature range (TC) .......................................
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.7 V dc
10 maximum
-55°C to 125°C
2. APPLICABLE DOCUMENT
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration.
2/ Device will fanout in both high and low levels to the specified number of inputs of the same device type
as that being tested.
2
MIL-M-38510/27B
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Truth table and logic equation. The truth table and logic equation shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. Case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 15 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.3 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
3
MIL-M-38510/27B
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
Limits
Units
Min
Max
High level output voltage (except
open collector output circuits)
VOH
VCC = 4.5 V, VIN = 0.7 V
IOH = -100 μA 1/
2.4
---
V
Low level output voltage
VOL
VCC = 4.5 V, IOL = 2 mA
VIN = 2.0 V for all inputs of gate
under test 2/
---
0.3
V
High level input current
IIH1
VCC = 5.5 V, VIN = 2.4 V 2/
---
10
μA
High level input current
IIH2
VCC = 5.5 V, VIN = 5.5 V 2/
---
100
μA
Low level input current
IIL
VCC = 5.5 V, VIN = 0.3 V 1/
-60
-180
μA
Short circuit output current
IOS
VCC = 5.5 V 1/ 3/
-3
-15
mA
High level supply current per gate
ICCH
VCC = 5.5 V 2/
VIN = 0 V
---
0.4
mA
Low level supply current per gate
ICCL
VCC = 5.5 V 1/
VIN = 5.5 V
---
0.65
mA
Propagation delay time,
high to low level
tPHL
Propagation delay time,
low to high level
tPLH
VCC = 5.0 V
CL = 50 pF
RL = 4 kΩ
1/ All unspecified inputs at 5.5 volts.
2/ All unspecified inputs grounded.
3/ Not more than one output should be shorted at one time.
4
3
99
ns
3
90
ns
MIL-M-38510/27B
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Devices
Class B
Devices
1
1
1*, 2, 3, 9,
1*, 2, 3, 9
1, 2, 3,
9, 10, 11
1, 2, 3, 9,
Group B electrical test parameters
when using the method 5005 QCI option
1, 2, 3
N/A
Groups C end point electrical parameters
1, 2, 3
1, 2, 3
Additional electrical subgroups for
group C periodic inspections
None
10, 11
Group D end point electrical parameters
1, 2, 3
1, 2, 3
MIL-PRF-38535
Test requirement
Interim electrical parameters
Final electrical test parameters
Group A test requirements
*PDA applies to subgroup 1.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, 6, 7 and 8, shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End point electrical parameters shall be as specified in table II herein.
b. Subgroups 3 and 4 shall be added to the group C inspection requirements for class B devices and shall
consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A. The sample size
series number shall be 5 (45 devices accept on 0).
c. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit
shall be maintained under document control by the device manufacturer's Technology Review Board (TRB)
in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
5
MIL-M-38510/27B
Figure 1. Logic diagram and terminal connections.
Truth table (each gate)
Inputs
Output
A
B
Y
H
X
L
X
H
L
L
L
H
Positive logic: Y = A + B
Figure 2. Truth table and logic equation.
6
MIL-M-38510/27B
NOTES:
1/ The generator has the following characteristics: Vgen = 3.0 V, tTLH = tTHL ≤ 25 ns, tP = 1.0 μs,
PRR ≤ 500 kHz and ZOUT ≈ 50 Ω.
2/ All diodes are 1N3064 or equivalent.
3/ CL includes probe and jig capacitance.
4/ Each gate tested separately.
FIGURE 3. Switching time test circuit.
7
TABLE III. Group A inspection for device type 01.
Terminal conditions (pins not designated are open)
Subgroup Symbol
6
7
8
9
10
11
12
13
14
5
2A
GND
“
2.0V
GND
“
“
“
“
5.5V
0.7V
5.5V
5.5V
6
2B
GND
“
“
2.0V
GND
“
“
“
5.5V
0.7V
5.5V
5.5V
10
3Y
8
3A
GND
“
“
“
2.0V
GND
“
“
5.5V
“
0.7V
5.5V
9
3B
GND
“
“
“
“
2.0V
GND
GND
5.5V
“
0.7V
5.5V
11
4A
GND
“
“
“
“
“
2.0V
GND
5.5V
“
“
0.7V
12
4B
GND
“
“
“
“
“
“
2.0V
5.5V
“
“
0.7V
13
4Y
GND
GND
7
GND
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
2.0mA
2.0mA
-100μA
GND
GND
“
2.4V
GND
“
“
“
“
“
“
5.5V
GND
“
“
“
“
5.5V
“
0.3V
5.5V
“
“
“
“
GND
5.5V
GND
“
“
2.4V
GND
“
“
“
“
“
“
5.5V
GND
“
“
“
5.5V
“
“
0.3V
5.5V
“
“
“
GND
GND
GND
GND
GND
“
“
“
2.4V
GND
“
“
“
“
“
“
5.5V
GND
“
“
5.5V
“
“
“
0.3V
5.5V
“
“
GND
5.5V
GND
“
“
“
“
2.4V
GND
“
“
“
“
“
“
5.5v
GND
“
5.5V
“
“
“
“
0.3V
5.5V
“
GND
GND
GND
GND
“
“
“
“
“
2.4V
GND
“
“
“
“
“
“
5.5V
GND
5.5V
“
“
“
“
“
0.3V
5.5V
GND
5.5V
GND
GND
“
“
“
“
“
“
2.4V
GND
“
“
“
“
“
“
5.5V
“
“
“
“
“
“
“
0.3V
GND
GND
2.0mA
2.0mA
-100μA
GND
Meas.
terminal
Test limits
Min
1Y
1Y
2Y
2Y
3Y
3Y
4Y
4Y
1Y
2Y
3Y
4Y
1Y
2Y
3Y
4Y
1A
1B
2A
2B
3A
3B
4A
4B
1A
1B
2A
2B
3A
3B
4A
4B
1A
1B
2A
2B
3A
3B
4A
4B
VCC
VCC
2.4
“
“
“
-3.0
“
“
“
-0.06
“
“
“
“
“
“
“
Max
Unit
0.3
“
“
“
“
“
“
“
V
“
“
“
“
“
“
“
“
“
“
“
mA
“
“
“
μA
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
mA
“
“
“
“
“
“
“
mA
mA
-15
“
“
“
10
“
“
“
“
“
“
“
100
“
“
“
“
“
“
“
-0.18
“
“
“
“
“
“
“
1.6
2.6
MIL-M-38510/27B
8
MILCase
1
2
3
4
5
STDA,B,D
883
Case C
2
3
1
14
4
method Test No.
2Y
1A
1B
1Y
VCC
1
VOL
3007
1
2.0V
GND
2.0mA
4.5V
“
“
2
GND
2.0V
2.0mA
“
TC = 25°C
“
“
3
“
GND
“
2.0mA
“
“
“
4
“
“
“
2.0mA
“
“
“
5
“
“
“
“
“
“
6
“
“
“
“
“
“
7
“
“
“
“
“
“
8
“
“
“
“
VOH
3006
9
0.7V
0.7V
“
-100μA
“
“
10
5.5V
5.5V
“
-100μA
“
“
11
“
“
“
“
“
12
“
“
“
IOS
3011
13
GND
GND
GND
5.5V
“
“
14
“
GND
“
“
15
“
“
“
16
“
IIH1
3010
17
2.4V
GND
“
“
“
18
GND
2.4V
“
“
“
19
“
GND
“
“
“
20
“
“
“
“
“
21
“
“
“
“
“
22
“
“
“
“
“
23
“
“
“
“
“
24
“
“
“
IIH2
“
25
5.5V
“
“
“
“
26
GND
5.5V
“
“
“
27
“
GND
“
“
“
28
“
“
“
“
“
29
“
“
“
“
“
30
“
“
“
“
“
“
31
“
“
“
“
32
“
“
“
IIL
3009
33
0.3V
5.5V
“
“
“
34
5.5V
0.3V
“
“
“
35
“
5.5V
“
“
“
36
“
“
“
“
“
37
“
“
“
“
“
38
“
“
“
“
“
39
“
“
“
“
“
40
“
“
“
ICCH
3005
41
GND
GND
“
ICCL
3005
42
5.5V
GND
“
2
Same tests, terminal conditions and limits as subgroup 1, except TC = 125°C
3
Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated are open)
Subgroup Symbol
7
8
9
10
11
12
13
14
6
2B
10
3Y
8
3A
9
3B
7
GND
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
11
4A
12
4B
13
4Y
GND
OUT
IN
GND
GND
OUT
IN
GND
GND
OUT
IN
GND
GND
OUT
IN
GND
IN
GND
OUT
IN
GND
OUT
IN
GND
OUT
IN
GND
OUT
Meas.
terminal
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
Test limits
Min
Max
Unit
3
“
“
“
3
“
“
“
3
“
“
“
3
“
“
“
66
“
“
“
60
“
“
“
99
“
“
“
90
“
“
“
ns
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
9
MIL-M-38510/27B
MILCase
1
2
3
4
5
6
STDA,B,D
883
Case C
2
3
1
14
4
5
method Test No.
1A
1B
1Y
VCC
2Y
2A
9
tPHL
3003
43
IN
GND
OUT
5.0V
“
(Fig. 3)
44
“
OUT
IN
TC = 25°C
“
“
45
“
“
“
“
46
“
“
“
“
tPHL
47
IN
GND
OUT
“
“
“
“
48
“
OUT
IN
“
“
“
49
“
“
“
“
50
“
10
tPLH
“
51
IN
GND
OUT
“
“
“
52
“
OUT
IN
TC=125°C
“
“
53
“
“
“
“
54
“
“
“
“
tPLH
55
IN
GND
OUT
“
“
“
“
56
“
OUT
IN
“
“
“
57
“
“
“
“
58
“
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
MIL-M-38510/27B
4.5 Methods inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional current and positive when flowing into the referenced terminal.
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense
Agency, or within the military service's system command. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but it is not mandatory)
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing
equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
b.
c.
d.
e.
f.
g.
h.
i.
j.
Title, number, and date of the specification.
PIN and compliance identifier, if applicable (see 1.2).
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
Requirement for certificate of compliance, if applicable.
Requirements for notification of change of product or process to acquiring activity in addition to
notification to the qualifying activity, if applicable.
Requirements for failure analysis (including required test condition of method 5003), corrective action
and reporting of results, if applicable.
Requirements for product assurance options.
Requirements for carriers, special lead lengths or lead forming, if applicable. These requirements shall
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
Requirements for "JAN" marking.
Packaging requirements (see 5.1).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199. An online listing of products qualified to this
specification may be found in the Qualified Products Database (QPD) at http://assist.daps.dla.mil.
6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
10
MIL-M-38510/27B
6.5 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535 and MIL-HDBK-1331, and as follows:
GND ................................................. Electrical ground (common terminal)
VIN .................................................... Voltage level at an input terminal
IIN ...................................................... Current flowing into an input terminal
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer lead lengths and lead forming shall not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Device type
01
Commercial type
54L02
6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect
to the previous issue due to the extensiveness of the changes.
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
(Project 5962-2008-003)
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://assist.daps.dla.mil.
11
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