Download datasheet for 54F00/BCA by Rochester Electronics

Download datasheet for 54F00/BCA by Rochester Electronics
INCH-POUND
MIL-M-38510/330C
25 November 2003
SUPERSEDING
MIL-M-38510/330B
5 April 1983
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR ADVANCED SCHOTTKY TTL,
NAND GATES, MONOLITHIC SILICON
Reactivated after 25 November 2003 and may be used for either new or existing design acquisition.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, Advanced Schottky TTL,
positive NAND logic gate microcircuits. Two product assurance classes and a choice of case outlines and lead
finishes are provided for each type and are reflected in the complete part number. For this product, the requirements
of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN should be in accordance with MIL-PRF-38535, and as specified
herein.
1.2.1 Device types. The device types should be as follows:
Device type
01
02
03
04
Circuit
Quadruple, 2-input positive NAND gate
Hex, 1-input inverter gate
Triple, 3-input positive NAND gate
Dual, 4-input positive NAND gate
1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
A
B
C
D
X
2
GDFP5-F14 or CDFP6-F14
GDFP4-14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC2-N20
CQCC1-N20
14
14
14
14
20
20
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed
to [email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
FSC 5962
MIL-M-38510/330C
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
Input voltage range ................................................................................
Storage temperature range ....................................................................
Maximum power dissipation, (PD) 1/
Device type 01 .................................................................................
Device type 02 .................................................................................
Device type 03 .................................................................................
Device type 04 .................................................................................
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, X, and 2 ...................................................................
Junction temperature (TJ) 2/ ...................................................................
-0.5 V to +7.0 V
-1.2 V at -18 mA to +7.0 V
-65° to +150°C
56 mW
84 mW
42 mW
28 mW
+300°C
(See MIL-STD-1835)
175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
Minimum high level input voltage (VIH) ...................................................
Maximum low level input voltage (VIL) ....................................................
Normalized fanout (each output) 3/
Low logic level ..................................................................................
High logic level .................................................................................
Case operating temperature range (TC) .................................................
4.5 V minimum to 5.5 V maximum
2.0 V
0.8 V
33 maximum
50 maximum
-55° to +125°C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.)
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ Device will fanout in both high and low levels to the specified number of data inputs on the same device
type as that being tested.
2
MIL-M-38510/330C
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as
specified on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 8 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
3
MIL-M-38510/330C
TABLE I. Electrical performance characteristics.
Test
High level output voltage
Symbol
VOH
Conditions
Device
-55°C ≤ TC ≤ +125°C
types
Min
All
2.5
VCC = 4.5 V, VIL = 0.8 V,
Limits
Unit
Max
V
IOH = -1.0 mA
Low level output voltage
VOL
VCC = 4.5 V, IOL = 20 mA,
All
0.5
V
All
-1.2
V
VIH = 2.0 V
Input clamp voltage
VI C
High level input current
IIH1
VCC = 5.5 V, VIN = 2.7 V
All
20
µA
IIH2
VCC = 5.5 V, VIN = 7.0 V
All
100
µA
Low level input current
IIL
VCC = 5.5 V, VIN = 0.5 V
All
0
Short circuit output
IOS
VCC = 5.5 V
All
-60
IOD
VCC = 4.5 V, VIN = 0.0 V,
01, 03,
60
VCC = 4.5 V, IIN = -18 mA,
TC = +25°C
-.60
-150
mA
mA
current 1/
Output drive
VOUT = 2.5 V
04
02
High level supply current
Low level supply current
Propagation delay time,
ICCH
ICCL
tPHL
high-to-low level
Propagation delay time
low-to-high level
mA
VCC = 5.5 V
VCC = 5.5 V
VCC = 5.0 V, CL = 50 pF ± 10%,
50
01
2.8
02
4.2
03
2.1
04
1.4
01
10.2
02
15.3
03
7.7
04
5.1
mA
mA
All
1.5
6.5
ns
All
2.0
7.0
ns
RL = 500Ω ± 5%
tPLH
VCC = 5.0 V, CL = 50 pF ± 10%,
RL = 500Ω ± 5%
1/ Not more than one output should be shorted at a time.
4
MIL-M-38510/330C
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
1
1
MIL-PRF-38535
test requirements
Interim electrical parameters
Final electrical test parameters
Group A test requirements
Group B electrical test parameters
when using the method 5005 QCI option
Group C end-point electrical parameters
Group D end-point electrical parameters
1*, 2, 3,
9, 10, 11
1, 2, 3,
9, 10, 11
1, 2, 3,
9, 10, 11
1, 2, 3,
9, 10, 11
1, 2, 3
1*, 2, 3, 9
1, 2, 3,
9, 10, 11
N/A
1, 2, 3
1, 2, 3
*PDA applies to subgroup 1.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be
as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional and positive when flowing into the referenced terminal.
5
MIL-M-38510/330C
FIGURE 1. Terminal connections and logic diagrams.
6
MIL-M-38510/330C
FIGURE 1. Terminal connections and logic diagrams - Continued.
7
MIL-M-38510/330C
FIGURE 1. Terminal connections and logic diagrams - Continued.
8
MIL-M-38510/330C
Device type 01
Device type 02
Truth table (each gate)
Truth table (each gate)
Inputs
A
B
Output
Input
Output
Y
A
Y
L
L
H
L
H
H
L
H
H
L
L
H
H
H
H
L
Positive logic: Y = A
Positive logic: Y = AB
Device type 03
Device type 04
Truth table (each gate)
Inputs
Truth table (each gate)
Output
Inputs
Output
A
B
C
Y
A
B
C
D
Y
L
L
L
H
L
L
L
L
H
H
L
L
H
H
L
L
L
H
L
H
L
H
L
H
L
L
H
H
H
L
H
H
H
L
L
H
L
L
H
H
L
L
H
L
H
H
L
H
H
H
L
H
L
H
L
H
H
H
L
H
H
L
H
H
H
H
L
H
H
H
L
H
L
L
L
H
H
H
L
L
H
H
Positive logic: Y = ABC
L
H
L
H
H
H
H
L
H
H
L
L
H
H
H
H
L
H
H
H
L
H
H
H
H
H
H
H
H
L
Positive logic: Y = ABCD
FIGURE 2. Truth tables and logic equations.
9
MIL-M-38510/330C
NOTES:
1. The pulse generator has the following characteristics:
tr = tf ≤ 2.5 ns, PRR = 1 MHz, and ZOUT ≅ 50Ω.
2. Inputs not under test are at 2.7 V or GND as specified in table III.
3. CL = 50 pF ±10%, including scope probe, wiring, and stray capacitance, without package in test fixture.
4. Voltage measurements are to be made with respect to network ground terminal.
5. RL = 500Ω ±5 %.
FIGURE 3. Switching time test circuit (all device types).
10
TABLE III. Group A inspection for device type 01.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
Symbol
1
Tc = 25°C
VOH
VOL
MIL-STD883
method
3006
"
"
"
"
"
"
"
3007
"
"
"
VIC
11
IIH2
IIL
IOS
3010
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3009
"
"
"
"
"
"
"
3011
"
"
"
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
1A
5.5 V
0.8 V
1B
0.8 V
5.5 V
1Y
-1 mA
-1 mA
2A
2B
2Y
GND
GND
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
3Y
3A
3B
4Y
4A
4B
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
0.8 V
2.0 V
2.0 V
0.8 V
5.5 V
-1 mA
-1 mA
20 mA
2.0 V
2.0 V
20 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
GND
GND
2.7 V
2.7 V
GND
7.0 V
GND
GND
7.0 V
7.0 V
GND
0.5 V
5.5 V
See footnotes at end of device type 01
GND
7.0 V
5.5 V
0.5 V
0.5 V
5.5 V
GND
GND
2.7 V
GND
5.5 V
0.5 V
0.0 V
GND
GND
0.0 V
-1 mA
-1 mA
5.5 V
0.8 V
0.8 V
5.5 V
-1 mA
-1 mA
20 mA
2.0 V
5.5 V
0.8 V
0.8 V
5.5 V
2.0 V
20 mA
2.0 V
2.0 V
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
GND
7.0 V
GND
0.5 V
5.5 V
0.0 V
GND
GND
2.7 V
2.7 V
GND
GND
2.7 V
7.0 V
GND
GND
7.0 V
GND
7.0 V
5.5 V
0.5 V
0.5 V
5.5 V
5.5 V
0.5 V
GND
GND
GND
0.0 V
Measured
terminal
1Y
1Y
2Y
2Y
3Y
3Y
4Y
4Y
1Y
2Y
3Y
4Y
1A
1B
2A
2B
3A
3B
4A
4B
1A
1B
2A
2B
3A
3B
4A
4B
1A
1B
2A
2B
3A
3B
4A
4B
1A
1B
2A
2B
3A
3B
4A
4B
1Y
2Y
3Y
4Y
Limits
Min
2.5
"
"
"
"
"
"
"
2/
"
"
"
"
"
"
"
-60
"
"
"
Unit
Max
0.5
"
"
"
-1.2
"
"
"
"
"
"
"
20
"
"
"
"
"
"
"
100
"
"
"
"
"
"
"
2/
"
"
"
"
"
"
"
-150
"
"
"
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/330C
IIH1
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
1
Tc = 25°C
2
3
9
Tc = 25°C
11
Cases
A,B,C,D
1
2
3
4
5
6
7
8
Cases 1/
2
3
4
6
8
9
10
12
X, 2
Test no.
1A
1B
1Y
2A
2B
2Y
GND
3Y
IOD
49
5.5 V
5.5 V
2.5 V
GND
50
5.5 V
5.5 V
2.5 V
“
51
“
2.5 V
52
“
ICCH
3005
53
GND
GND
GND
GND
“
ICCL
3005
54
5.5 V
5.5 V
5.5 V
5.5 V
“
Same tests, terminal conditions and limits as for subgroup 1, except TC = +125°C and VIC tests are omitted.
Same tests, terminal conditions and limits as for subgroup 1, except TC = 55°C and VIC tests are omitted.
tPHL
3003
55
IN
2.7 V
OUT
GND
Fig. 3
56
2.7 V
IN
OUT
“
"
57
IN
2.7 V
OUT
"
"
58
2.7 V
IN
OUT
"
"
59
"
OUT
"
60
"
OUT
"
61
"
"
62
"
tPLH
"
63
IN
2.7 V
OUT
“
"
64
2.7 V
IN
OUT
"
"
65
IN
2.7 V
OUT
"
"
66
2.7 V
IN
OUT
"
"
67
"
OUT
"
68
"
OUT
"
69
"
"
70
“
tPHL
"
71-78
Same tests and terminal conditions as for subgroup 9, except TC = +125°C
tPLH
"
79-86
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
1/ Pins not referenced (i.e., 1, 5, 7, 11, 15, and 17) are N/C.
2/ IIL limits shall be as follows:
Parameters
IIL
A
-.25/-.60
Min/Max limits in mA for circuit
B
C
D
-.03/-.06
-.03/-.60
0/-.30
9
10
11
12
13
14
13
14
16
18
19
20
3A
3B
4Y
4A
4B
VCC
4.5 V
"
"
"
5.5 V
5.5 V
1Y
2Y
3Y
4Y
VCC
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
1A to 1Y
1B to 1Y
2A to 2Y
2B to 2Y
3A to 3Y
3B to 3Y
4A to 4Y
4B to 4Y
1A to 1Y
1B to 1Y
2A to 2Y
2B to 2Y
3A to 3Y
3B to 3Y
4A to 4Y
4B to 4Y
5.5 V
5.5 V
GND
5.5 V
GND
5.5 V
2.5 V
IN
2.7 V
IN
2.7 V
5.5 V
GND
5.5 V
5.5 V
GND
5.5 V
2.7 V
IN
OUT
OUT
IN
2.7 V
2.7 V
IN
OUT
OUT
IN
2.7 V
2.7 V
IN
2.7 V
IN
Measured
terminal
Limits
Min
60
"
"
"
Unit
Max
2.8
10.2
mA
"
"
"
"
"
1.5
“
"
"
"
"
"
"
2.4
"
"
"
"
"
"
“
1.5
4.3
“
"
"
"
"
"
"
5.0
"
"
"
"
"
"
"
6.5
ns
“
"
"
"
"
"
"
“
"
"
"
"
"
"
“
"
2.0
7.0
"
MIL-M-38510/330C
12
10
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 02.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
Symbol
1
Tc = 25°C
VOH
VOL
MIL-STD883
method
3006
"
"
"
"
"
3007
"
"
"
"
"
VIC
IIH2
13
IIL
IOS
3010
"
"
"
"
"
"
"
"
"
"
"
3009
"
"
"
"
"
3011
"
"
"
"
"
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
1A
0.8 V
1Y
-1 mA
2A
2Y
3A
3Y
GND
GND
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
4Y
4A
5Y
5A
6Y
6A
VCC
4.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
5.5 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.8 V
-1 mA
0.8 V
2.0 V
-1 mA
20 mA
2.0 V
20 mA
2.0 V
20 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
0.5 V
0.5 V
0.5 V
GND
See footnotes at end of device type 02
0.0 V
GND
0.0 V
GND
0.0 V
-1 mA
0.8 V
-1 mA
0.8 V
-1 mA
20 mA
0.8 V
2.0 V
20 mA
2.0 V
20 mA
2.0 V
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
0.5 V
0.5 V
0.5 V
0.0 V
GND
0.0 V
GND
0.0 V
GND
Measured
terminal
1Y
2Y
3Y
4Y
5Y
6Y
1Y
2Y
3Y
4Y
5Y
6Y
1A
2A
3A
4A
5A
6A
1A
2A
3A
4A
5A
6A
1A
2A
3A
4A
5A
6A
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
Limits
Min
2.5
"
"
"
"
"
2/
"
"
"
"
"
-60
"
"
"
"
"
Unit
Max
0.5
"
"
"
"
"
-1.2
"
"
"
"
"
20
"
"
"
"
"
100
"
"
"
"
"
2/
"
"
"
"
"
-150
"
"
"
"
"
V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
mA
"
"
"
"
"
"
"
"
"
"
"
MIL-M-38510/330C
IIH1
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
TABLE III. Group A inspection for device type 02 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
1
Tc = 25°C
2
3
9
Tc = 25°C
11
Cases
A,B,C,D
1
2
3
4
5
6
7
8
Cases 1/
2
3
4
6
8
9
10
12
X, 2
Test no.
1A
1Y
2A
2Y
3A
3Y
GND
4Y
IOD
43
5.5 V
2.5 V
GND
44
5.5 V
2.5 V
“
45
5.5 V
2.5 V
“
46
"
2.5 V
47
"
48
“
ICCH
3005
49
GND
GND
GND
“
ICCL
3005
50
5.5 V
5.5 V
5.5 V
“
Same tests, terminal conditions and limits as for subgroup 1, except TC = +125°C and VIC tests are omitted.
Same tests, terminal conditions and limits as for subgroup 1, except TC = 55°C and VIC tests are omitted.
tPHL
3003
51
IN
OUT
GND
Fig. 3
52
IN
OUT
“
"
53
IN
OUT
"
"
54
"
OUT
"
55
"
"
56
"
tPLH
"
57
IN
OUT
"
"
58
IN
OUT
"
"
59
IN
OUT
“
"
60
"
OUT
"
61
"
"
62
"
tPHL
"
63-68
Same tests and terminal conditions as for subgroup 9, except TC = +125°C
tPLH
"
69-74
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
1/ Pins not referenced (i.e., 1, 5, 7, 11, 15, and 17) are N/C.
2/ IIL limits shall be as follows:
Parameters
IIL
A
-.25/-.60
Min/Max limits in mA for circuit
B
C
D
-.03/-.06
-.03/-.60
0/-.30
9
10
11
12
13
14
13
14
16
18
19
20
4A
5Y
5A
6Y
6A
VCC
4.5 V
"
"
"
"
"
5.5 V
5.5 V
1Y
2Y
3Y
4Y
5Y
6Y
VCC
VCC
5.0 V
"
"
"
"
"
"
"
"
"
"
"
1A to 1Y
2A to 2Y
3A to 3Y
4A to AY
5A to 5Y
6A to 6Y
1A to1Y
2A to 2Y
3A to 3Y
4A to 4Y
5A to 5Y
6A to 6Y
5.5 V
2.5 V
5.5 V
2.5 V
GND
5.5 V
GND
5.5 V
5.5 V
GND
5.5 V
IN
OUT
IN
OUT
IN
OUT
IN
IN
OUT
IN
Measured
terminal
Limits
Min
60
"
"
"
"
"
Unit
Max
4.2
15.3
mA
"
"
"
"
"
"
"
1.5
“
"
"
"
"
2.4
"
"
"
"
"
1.5
4.3
“
"
"
"
"
5.0
"
"
"
"
"
6.5
ns
“
"
"
"
"
"
"
“
"
"
"
"
2.0
7.0
"
MIL-M-38510/330C
14
10
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 03.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
Symbol
1
Tc = 25°C
VOH
VOL
MIL-STD883
method
3006
"
"
"
"
"
"
"
"
3007
"
"
VI C
15
II H 2
II L 1
3010
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3009
"
"
"
"
"
"
"
"
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
1A
0.8 V
5.5 V
5.5 V
1B
5.5 V
0.8 V
5.5 V
2A
2B
2C
2Y
GND
GND
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
3Y
3A
3B
3C
1Y
-1 mA
"
"
1C
5.5 V
5.5 V
0.8 V
20 mA
2.0 V
VCC
4.5 V
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
"
5.5 V
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
"
“
“
“
0.8 V
5.5 V
5.5 V
2.0 V
5.5 V
0.8 V
5.5 V
5.5 V
5.5 V
0.8 V
2.0 V
2.0 V
2.0 V
2.0 V
-18 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
GND
GND
GND
2.7 V
GND
2.7 V
GND
GND
7.0 V
GND
GND
See footnotes at end of device type 03.
GND
2.7 V
GND
GND
GND
2.7 V
GND
7.0 V
GND
7.0 V
GND
GND
0.5 V
5.5 V
5.5 V
-1 mA
"
"
GND
7.0 V
GND
GND
GND
7.0 V
5.5 V
0.5 V
5.5 V
0.5 V
5.5 V
5.5 V
5.5 V
0.5 V
5.5 V
5.5 V
5.5 V
0.5 V
20 mA
-1 mA
"
"
20 mA
0.8 V
5.5 V
5.5 V
2.0 V
5.5 V
0.8 V
5.5 V
2.0 V
5.5 V
5.5 V
0.8 V
2.0 V
-18 mA
-18 mA
-18 mA
-18 mA
GND
GND
2.7 V
2.7 V
GND
GND
GND
2.7 V
GND
GND
GND
2.7 V
GND
GND
7.0 V
7.0 V
GND
GND
GND
7.0 V
GND
GND
GND
7.0 V
5.5 V
5.5 V
0.5 V
0.5 V
5.5 V
5.5 V
5.5 V
0.5 V
5.5 V
5.5 V
5.5 V
0.5 V
Measured
terminal
1Y
1Y
1Y
2Y
2Y
2Y
3Y
3Y
3Y
1Y
2Y
3Y
1A
1B
2A
2B
2C
3A
3B
3C
1C
1A
1B
1C
2A
2B
2C
3A
3B
3C
1A
1B
1C
2A
2B
2C
3A
3B
3C
1A
1B
1C
2A
2B
2C
3A
3B
3C
Limits
Min
2.5
"
"
"
"
"
"
"
"
2/
“
“
“
“
"
"
"
"
Unit
Max
0.5
"
"
-1.2
“
“
“
“
“
"
“
"
20
“
“
“
“
“
“
"
“
100
“
“
“
“
“
"
"
"
2/
“
“
“
“
"
“
“
“
V
"
“
“
“
“
“
"
“
"
“
“
"
“
“
“
“
“
"
“
"
µA
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
“
“
mA
“
“
“
“
"
“
“
“
MIL-M-38510/330C
II H 1
Cases
A,B,C,D
Case 1/
X, 2
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
TABLE III. Group A inspection for device type 03 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
MIL-STDSymbol
883
method
Cases
A,B,C,D
1
2
3
4
5
6
7
8
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
1/ Pins not referenced (i.e., 1, 5, 7, 11, 15, and 17) are NC.
2/ IIL limits shall be as follows:
Parameters
IIL 1
A
-.25/-.60
Min/Max limits in mA for circuit
B
C
D
-.03/-.06
-.03/-.60
0/-.30
10
11
12
13
14
13
14
16
18
19
20
3A
3B
3C
1Y
0.0 V
1C
GND
2.5 V
5.5 V
VCC
5.5 V
“
“
4.5 V
“
“
5.5 V
5.5 V
1Y
2Y
3Y
1Y
2Y
3Y
VC C
VC C
5.0 V
“
“
“
“
“
“
"
“
"
“
“
“
“
“
“
"
“
1A to 1Y
1B to 1Y
1C to 1Y
2A to 2Y
2B to 2Y
2C to 2Y
3A to 3Y
3B to 3Y
3C to 3Y
1A to 1Y
1B to 1Y
1C to 1Y
2A to 2Y
2B to 2Y
2C to 2Y
3A to 3Y
3B to 3Y
3C to 3Y
GND
5.5 V
GND
5.5 V
IN
2.7 V
2.7 V
IN
2.7 V
2.7 V
GND
5.5 V
GND
5.5 V
2.7 V
IN
2.7 V
2.7 V
IN
2.7 V
GND
5.5 V
GND
5.5 V
GND
5.5 V
OUT
"
"
2.7 V
2.7 V
IN
OUT
"
"
2.7 V
2.7 V
IN
2.7 V
2.7 V
IN
2.7 V
2.7 V
IN
Measured
terminal
Limits
Min
-60
"
"
60
"
"
Max
-150
“
“
Unit
2.1
7.7
mA
“
“
"
“
“
"
"
1.5
“
“
“
“
“
“
"
“
2.4
“
“
“
“
“
“
"
“
1.5
4.3
“
“
“
“
“
“
"
“
5.0
“
“
“
“
“
“
"
“
6.5
ns
“
“
“
“
“
“
"
“
"
“
“
“
“
“
“
"
“
"
2.0
7.0
"
MIL-M-38510/330C
16
Case 1/
2
3
4
6
8
9
10
12
X, 2
Test no.
1A
1B
2A
2B
2C
2Y
GND
3Y
1
IOS
3011
49
GND
GND
GND
"
50
GND
GND
GND
0.0 V
“
Tc = 25°C
"
51
“
0.0 V
IOD
52
5.5 V
5.5 V
“
53
5.5 V
5.5 V
5.5 V
2.5 V
“
54
“
2.5 V
IC C H
3005
55
GND
GND
GND
GND
GND
"
IC C L
3005
56
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
"
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C, and V I C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and V I C tests are omitted.
9
tPHL
3003
57
IN
2.7 V
GND
Fig. 3
58
2.7 V
IN
“
Tc = 25°C
"
59
2.7 V
2.7 V
“
"
60
IN
2.7 V
2.7 V
OUT
“
"
61
2.7 V
IN
2.7 V
"
“
"
62
2.7 V
2.7 V
IN
"
“
"
63
“
OUT
"
64
"
"
"
65
“
"
tPLH
"
66
IN
2.7 V
GND
"
67
2.7 V
IN
“
"
68
2.7 V
2.7 V
“
"
69
IN
2.7 V
2.7 V
OUT
“
"
70
2.7 V
IN
2.7 V
"
“
"
71
2.7 V
2.7 V
IN
"
“
"
72
“
OUT
"
73
"
"
"
74
“
"
10
tPHL
"
75-83
Same tests and terminal conditions as for subgroup 9, except TC = 125°C
tPLH
"
84-92
9
TABLE III. Group A inspection for device type 04.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
Symbol
1
Tc = 25°C
VOH
VOL
MIL-STD883
method
3006
"
"
"
"
"
"
"
3007
3007
VI C
II H 1
II L
IOS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
1A
0.8 V
5.5 V
"
"
1B
5.5 V
0.8 V
5.5 V
5.5 V
NC
1C
5.5 V
5.5 V
0.8 V
5.5 V
1D
5.5 V
"
"
0.8 V
1Y
-1 mA
"
"
"
GND
GND
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
2Y
2A
2B
NC
2C
2D
VCC
4.5 V
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
“
5.5 V
“
"
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
“
“
“
“
“
“
“
2.0 V
2.0 V
2.0 V
2.0 V
20 mA
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
GND
"
"
7.0 V
GND
"
"
0.5 V
5.5 V
"
"
GND
See footnotes at end of device type 04.
GND
2.7 V
GND
GND
GND
7.0 V
GND
GND
5.5 V
0.5 V
5.5 V
5.5 V
GND
GND
GND
2.7 V
GND
GND
GND
7.0 V
GND
5.5 V
5.5 V
0.5 V
5.5 V
GND
GND
"
"
2.7 V
GND
"
"
7.0 V
5.5 V
"
"
0.5 V
GND
0.0 V
-1 mA
"
"
"
0.8 V
5.5 V
"
"
5.5 V
0.8 V
5.5 V
5.5 V
5.5 V
5.5 V
0.8 V
5.5 V
5.5 V
"
"
0.8 V
20 mA
2.0 V
2.0 V
2.0 V
2.0 V
-18 mA
-18 mA
-18 mA
-18 mA
0.0 V
2.7 V
GND
"
"
GND
2.7 V
GND
GND
GND
GND
2.7 V
GND
GND
"
"
2.7 V
7.0 V
GND
"
"
GND
7.0 V
GND
GND
GND
GND
7.0 V
GND
GND
"
"
7.0 V
0.5 V
5.5 V
"
"
5.5 V
0.5 V
5.5 V
5.5 V
5.5 V
5.5 V
0.5 V
5.5 V
5.5 V
"
"
0.5 V
GND
GND
GND
GND
Measured
terminal
1Y
1Y
1Y
1Y
2Y
2Y
2Y
2Y
1Y
2Y
1A
1B
1C
1D
2A
2B
2C
2D
1A
1B
1C
1D
2A
2B
2C
2D
1A
1B
1C
1D
2A
2B
2C
2D
1A
1B
1C
1D
2A
2B
2C
2D
1Y
2Y
Limits
Min
2.5
"
"
"
"
"
"
"
2/
"
"
"
"
"
“
“
-60
-60
Unit
Max
0.5
0.5
-1.2
"
"
“
“
“
“
“
20
“
"
"
“
“
“
“
100
“
"
“
"
“
“
“
2/
“
"
"
"
"
“
“
-150
-150
V
"
“
“
“
“
“
"
“
"
“
“
"
“
“
“
“
“
µA
“
"
"
“
“
“
“
“
“
“
“
“
“
“
“
mA
“
"
“
“
"
“
“
“
“
MIL-M-38510/330C
17
II H 2
3010
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3009
"
"
"
"
"
"
"
3011
3011
Cases
A,B,C,D
Case 1/
X, 2
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
TABLE III. Group A inspection for device type 04 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
MIL-STDSymbol
883
method
Cases
A,B,C,D
1
2
3
4
5
6
7
8
11
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
1/ Pins not referenced (i.e., 1, 5, 7, 11, 15, and 17) are NC.
2/ IIL limits shall be as follows:
Parameters
IIL 1
A
-.25/-.60
Min/Max limits in mA for circuit
B
C
D
-.03/-.06
-.03/-.60
0/-.30
10
11
12
13
14
13
14
16
18
19
20
2A
2B
NC
2C
2D
VCC
4.5 V
4.5 V
5.5 V
5.5 V
1Y
2Y
VC C
VC C
5.0 V
“
“
“
“
“
“
"
“
"
“
“
“
“
“
“
1A to 1Y
1B to 1Y
1C to 1Y
1D to 1Y
2A to 2Y
2B to 2Y
2C to 2Y
2D to 2Y
1A to 1Y
1B to 1Y
1C to 1Y
1D to 1Y
2A to 2Y
2B to 2Y
2C to 2Y
2D to 2Y
5.5 V
GND
5.5 V
5.5 V
GND
5.5 V
5.5 V
GND
5.5 V
5.5 V
GND
5.5 V
IN
2.7 V
"
"
2.7 V
IN
2.7 V
2.7 V
2.7 V
2.7 V
IN
2.7 V
2.7 V
"
"
IN
IN
2.7 V
"
"
2.7 V
IN
2.7 V
2.7 V
2.7 V
2.7 V
IN
2.7 V
2.7 V
"
"
IN
Measured
terminal
Limits
Min
60
60
Unit
Max
1.4
5.1
mA
“
"
"
1.5
“
“
“
“
“
“
"
2.4
"
“
“
“
“
“
“
1.5
4.3
“
“
“
“
“
“
"
5.0
"
“
“
“
“
“
“
6.5
ns
“
“
“
“
“
“
"
“
"
“
“
“
“
“
“
"
2.0
7.0
"
MIL-M-38510/330C
18
Case 1/
2
3
4
6
8
9
10
12
X, 2
Test no.
1A
1B
NC
1C
1D
1Y
GND
2Y
1
IOD
45
5.5 V
5.5 V
5.5 V
5.5 V
2.5 V
“
46
“
2.5 V
Tc = 25°C
IC C H
3005
47
GND
GND
GND
GND
"
IC C L
3005
48
5.5 V
5.5 V
5.5 V
5.5 V
"
2
Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C, and V I C tests are omitted.
3
Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C, and V I C tests are omitted.
9
tPHL
3003
49
IN
2.7 V
2.7 V
2.7 V
OUT
GND
Fig. 3
50
2.7 V
IN
2.7 V
"
"
“
Tc = 25°C
"
51
"
2.7 V
IN
"
"
“
"
52
"
2.7 V
2.7 V
IN
"
“
"
53
“
OUT
"
54
“
"
"
55
“
"
"
56
"
"
tPLH
"
57
IN
2.7 V
2.7 V
2.7 V
OUT
“
"
58
2.7 V
IN
2.7 V
"
"
"
"
59
"
2.7 V
IN
"
"
“
"
60
"
2.7 V
2.7 V
IN
"
“
"
61
“
OUT
"
62
“
"
"
63
“
"
"
64
“
"
10
tPHL
"
65-72
Same tests and terminal conditions as for subgroup 9, except TC = 125°C
tPLH
"
73-80
9
MIL-M-38510/330C
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service
or Defense Agency, or within the military service's system command. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
19
MIL-M-38510/330C
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ........................................... Ground zero voltage potential
IIN ................................................ Current flowing into an input terminal
VIN ............................................... Voltage level at an input terminal
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.3). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device
type
Generic-industry
type
01
02
03
04
54F00
54F04
54F10
54F20
6.8 Manufacturers' designation. Manufacturers' circuits which form a part of this specification are designated with
an "X" as shown in table IV herein.
TABLE IV. Manufacturers' designations.
Device
type
01
02
03
04
Circuit A
National
Semi/
Fairchild
X
X
X
X
Manufacturer's designation
Circuit B
Circuit C
Circuit D
Motorola
Signetics
Texas
Inc.
Corp.
Instruments
X
X
X
X
20
X
X
X
X
MIL-M-38510/330C
6.9 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the
previous issue due to the extensiveness of the changes.
CONCLUDING MATERIAL
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
(Project 5962-2000)
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at www.dodssp.daps.mil.
21
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