Download datasheet for 54F280/B2A by Rochester Electronics

Download datasheet for 54F280/B2A by Rochester Electronics
INCH-POUND
MIL-M-38510/349B
12 May 2004 __
SUPERSEDING
MIL-M-38510/349A
1 October 1986
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR ADVANCED SCHOTTKY TTL,
PARITY CHECKER, MONOLITHIC SILICON
Reactivated after 12 May 2004 and may be used for either new or existing design acquisition.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, Advanced Schottky TTL, parity
checker microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided
for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have
been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Circuit
Device type
01
9-bit odd/even parity generator/checker
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
A
B
C
D
X
2
GDFP5-F14 or CDFP6-F14
GDFP4-14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC2-N20
CQCC1-N20
14
14
14
14
20
20
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed
to [email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
FSC 5962
MIL-M-38510/349B
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
Input voltage range ................................................................................
Storage temperature range ....................................................................
Maximum power dissipation, per device (PD) 1/ ....................................
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, X, and 2 ...................................................................
Junction temperature (TJ) 2/ ...................................................................
-0.5 V dc to +7.0 V dc
-1.2 V dc at -18 mA to +7.0 V dc
-65° to +150°C
220 mW
+300°C
(See MIL-STD-1835)
175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
Minimum high level input voltage (VIH) ...................................................
Maximum low level input voltage (VIL) ....................................................
Case operating temperature range (TC) .................................................
4.5 V dc to 5.5 V dc
2.0 V dc
0.8 V dc
-55° to +125°C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
2
MIL-M-38510/349B
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagram. The terminal connections and logic diagram shall be as specified
on figures 1 and 2.
3.3.2 Truth table. The truth table shall be as specified on figure 3.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 11 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
3
MIL-M-38510/349B
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
Device
-55°C ≤ TC ≤ +125°C
unless otherwise specified
type
Min
01
2.5
High level output voltage
VOH
VCC = 4.5 V, VIL = 0.8 V,
Low level output voltage
VOL
VCC = 4.5 V, IOL = 20 mA,
Limits
Unit
Max
V
IOH = -1 mA, VIH = 2.0 V
01
0.5
V
01
-1.2
V
-.60
mA
VIH = 2.0 V, VIL = 0.8 V
Input clamp voltage
VI C
VCC = 4.5 V, IIN = -18 mA,
TC = +25°C
Low level input current
IIL
VCC = 5.5 V, VIN = 0.5 V
01
High level input current
IIH1
VCC = 5.5 V, VIH = 2.7 V
01
20
µA
IIH2
VCC = 5.5 V, VIH = 7.0 V
01
100
µA
IOS
VCC = 5.5 V, VOS = 0 V
01
-60
-150
mA
Output drive
IOD
VCC = 4.5 V, VIN = 5.5 V,
01
60
Supply current
ICC
VCC = 5.5 V, VIN = 0 V
01
Propagation delay time
tPLH
VCC = 5.0 V, (see figure 4)
01
01
Short circuit output
+.02
current 1/
mA
VOUT = 2.5 V
low-to-high level
input to output
Propagation delay time,
40
mA
1.0
20.0
ns
1.0
21.0
ns
CL = 50 pF ±10%,
RL = 500Ω
tPHL
high-to-low level
input to output
1/ Not more than one output should be shorted at a time.
4
MIL-M-38510/349B
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
1
1
MIL-PRF-38535
test requirements
Interim electrical parameters
Final electrical test parameters
Group A test requirements
Group B electrical test parameters
when using the method 5005 QCI option
Group C end-point electrical parameters
Group D end-point electrical parameters
1*, 2, 3, 7,
8, 9, 10, 11
1, 2, 3, 7, 8,
9, 10, 11
1, 2, 3,
9, 10, 11
1, 2, 3,
9, 10, 11
1, 2, 3
1*, 2, 3, 7, 9
1, 2, 3, 7, 8,
9, 10, 11
N/A
1, 2, 3
1, 2, 3
*PDA applies to subgroup 1.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be
as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional and positive when flowing into the referenced terminal.
5
MIL-M-38510/349B
Device type 01
Terminal
number
Cases
A, B, C, and D
Cases
X and 2
1
I6
N/C
2
I7
I6
3
NC
I7
4
I8
N/C
5
∑E
N/C
6
∑O
I8
7
GND
N/C
8
I0
∑E
9
I1
∑O
10
I2
GND
11
I3
N/C
12
I4
I0
13
I5
I1
14
VCC
I2
15
N/C
16
I3
17
N/C
18
I4
19
I5
20
VCC
FIGURE 1. Terminal connections.
6
MIL-M-38510/349B
FIGURE 2. Logic diagram.
Device type 01
Number of inputs
Output
I 0 - I 8 that are high
∑ Even
∑ Odd
0, 2, 4, 6, 8
H
L
1, 3, 5, 7, 9
L
H
H = High level
L = Low level
FIGURE 3. Truth table.
7
MIL-M-38510/349B
FIGURE 4. Switching time waveforms.
8
MIL-M-38510/349B
NOTES:
1. Input pulse has the following characteristics:
t1 = t0 ≤ 2.5 ns, PRR ≤ 1 MHz, ZOUT ≈ 50Ω.
2. CL = 50 pF ±10%, including scope probe, wiring and stray capacitance without package in test fixture.
3. RL = 500Ω ±5%.
FIGURE 4. Switching time waveforms - Continued.
9
TABLE III. Group A inspection for device type 01.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
Symbol
1
VOL
Tc = 25°C
VOH
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
3007
3007
1
2
3006
3006
3
4
0.8 V
0.8 V
-18 mA
3010
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
3009
"
"
"
"
"
"
"
"
3011
3011
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
0.0 V
"
0.0 V
"
5.5 V
0.0 V
43
44
"
"
"
"
5.5 V
0.0 V
VI C
IIH1
10
IIH2
IIL
IOS
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
I6
I7
NC
I8
∑ E
I0
I1
I2
I3
I4
I5
VCC
0.8 V
2.0 V
0.8 V
2.0 V
∑ O
20 mA
GND
0.8 V
2.0 V
0.8 V
2.0 V
0.8 V
2.0 V
0.8 V
2.0 V
0.8 V
2.0 V
0.8 V
2.0 V
0.8 V
2.0 V
4.5 V
"
∑ O
20 mA
GND
“
0.8 V
0.8 V
2.0 V
0.8 V
“
“
0.8 V
0.8 V
0.8 V
0.8 V
2.0 V
0.8 V
0.8 V
0.8 V
0.8 V
0.8 V
2.0 V
0.8 V
"
"
∑ O
2.5
"
-1 mA
∑ E
2.5
"
0.0 V
“
“
“
“
"
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
-1 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
0.5 V
0.5 V
0.5 V
-18 mA
-18 mA
-18 mA
-18 mA
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
7.0 V
7.0 V
7.0 V
7.0 V
7.0 V
0.5 V
0.5 V
0.5 V
0.5 V
0.5 V
I6
I7
I8
I0
I1
I2
I3
I4
I5
I6
I7
I8
I0
I1
I2
I3
I4
I5
I6
I7
I8
I0
I1
I2
I3
I4
I5
I6
I7
I8
I0
I1
I2
I3
I4
I5
∑ O
0.0 V
"
0.0 V
"
"
"
"
"
5.5 V
0.0 V
"
"
"
"
5.5 V
0.0 V
4.5 V
4.5 V
∑ O
ICC
3005
45
"
"
0.0 V
“
"
Same tests, terminal conditions and limits as for subgroup 1, except TC = +125°C and VIC tests are omitted.
Same tests, terminal conditions and limits as for subgroup 1, except TC = 55°C and VIC tests are omitted.
"
0.0 V
"
"
0.0 V
5.5 V
VCC
2.5 V
“
“
∑ E
∑ E
Unit
Max
0.5
0.5
∑ E
5.5 V
0.0 V
2.5 V
Limits
Min
0.0 V
"
See footnotes at end of table.
0.0 V
-18 mA
"
"
"
"
"
"
"
"
-18 mA
"
5.5 V
"
"
"
"
"
"
"
2.7 V
"
5.5 V 5/
"
"
"
"
"
"
"
7.0 V
"
"
"
"
"
"
"
"
"
0.5 V
"
5.5 V
"
0.0 V
"
Measured
terminal
0.0 V
"
IOD
2
3
1
V
"
2/
"
"
"
"
"
"
"
"
-60
-60
-1.2
"
"
"
"
"
"
"
"
20
"
"
"
"
"
"
"
"
100
"
"
"
"
"
"
"
"
2/
"
"
"
"
"
"
"
"
-150
-150
"
"
"
"
"
"
"
"
"
µA
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2/
"
"
"
"
"
"
"
"
mA
"
60
60
"
"
"
"
40
"
MIL-M-38510/349B
MIL-STD883
method
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
7
Tc = 25°C
8
9
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
I0
I1
I2
I3
I4
I5
VCC
B
"
"
"
A
"
"
"
B
"
"
"
"
"
"
"
B
B
A
A
B
B
A
"
"
B
A
B
A
A
B
B
B
A
B
A
B
A
B
A
B
"
"
"
"
"
"
"
B
"
"
"
A
"
"
"
B
"
"
"
"
"
"
"
B
B
A
A
B
B
A
"
"
"
B
B
A
B
A
B
B
A
B
A
B
A
B
A
B
"
"
"
"
"
"
"
3/
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
All
outputs
"
"
"
"
"
"
"
"
"
"
"
"
"
"
GND
I6
I7
NC
I8
∑ E
∑ O
3014
46
B
B
B
H
L
GND
"
47
"
B
A
L
H
“
"
48
"
A
B
L
H
“
"
49
"
A
A
H
L
“
"
50
A
B
B
L
H
“
"
51
"
B
A
H
L
“
"
52
"
A
B
H
L
“
"
53
"
"
A
L
H
“
"
54
B
"
B
L
H
“
"
55
"
"
"
H
L
“
"
56
"
"
"
H
L
“
"
57
"
"
"
L
H
“
"
58
"
B
"
H
L
“
"
59
"
"
"
L
H
“
"
60
"
"
"
L
H
“
"
61
"
"
"
H
L
“
Same tests, terminal conditions, and limits as for subgroup 7 except TC = +125°C and -55°C.
tPHL
3003
62
2.7 V
2.7 V
2.7 V
OUT
GND
Functional
tests
4/
Measured
terminal
Limits
Unit
Min
Max
11
IN
0.0 V
0.0 V
2.7 V
2.7 V
2.7 V
5.0 V
I0 to ∑ E
1.5
16.0
ns
Fig. 4
"
"
"
63
64
65
66
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I1 to ∑ E
“
"
"
"
“
"
"
"
“
"
"
"
"
"
"
"
67
68
69
70
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I2 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
71
72
73
74
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
75
76
77
78
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
79
80
81
82
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I2 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
83
84
85
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
2.7 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
See footnotes at end of table.
I0 to ∑ O
"
"
"
I1 to ∑ O
"
"
"
MIL-M-38510/349B
Tc = 25°C
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
9
Tc = 25°C
12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
tPHL
3003
86
I6
I7
NC
I8
∑ E
∑ O
GND
I0
I1
I2
I3
I4
I5
VCC
Min
Max
2.7 V
2.7 V
2.7 V
OUT
GND
2.7 V
2.7 V
2.7 V
IN
0.0 V
0.0 V
5.0 V
I3 to ∑ E
1.5
16.0
Fig. 4
"
"
"
87
88
89
90
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
I4 to ∑ E
“
"
"
"
“
"
"
"
“
"
"
"
"
"
"
"
91
92
93
94
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
I5 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
95
96
97
98
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
OUT
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
99
100
101
102
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
103
104
105
106
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
I5 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
107
108
109
110
"
"
"
IN
"
"
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
"
0.0 V
2.7 V
2.7 V
"
"
"
"
2.7 V
"
"
"
OUT
"
"
"
"
"
"
"
"
I6 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
111
112
113
114
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I7 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
115
116
117
118
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I8 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
119
120
121
2.7 V
0.0 V
2.7 V
0.0 V
2.7 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
See footnotes at end of table.
Measured
terminal
I3 to ∑ O
"
"
"
I4 to ∑ O
"
"
"
Limits
Unit
MIL-M-38510/349B
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
9
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
tPHL
Tc = 25°C
tPLH
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
3003
122
I6
I7
NC
I8
∑ E
∑ O
GND
I0
I1
I2
I3
I4
I5
VCC
Min
Max
IN
0.0 V
0.0 V
OUT
GND
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
5.0 V
I6 to ∑ O
1.5
16.0
Fig. 4
"
"
"
123
124
125
126
ns
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
127
128
129
130
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I8 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
131
132
133
134
2.7 V
0.0 V
2.7 V
"
0.0 V
2.7 V
"
"
"
"
"
2.7 V
"
"
"
OUT
"
"
"
"
"
"
"
IN
"
"
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I0 to ∑ E
"
"
"
"
"
"
"
15.0
"
"
"
"
"
"
"
"
135
136
137
138
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I1 to ∑ E
“
"
"
"
“
"
"
"
“
"
"
"
"
"
"
"
139
140
141
142
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I2 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
143
144
145
146
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
147
148
149
150
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
151
152
153
154
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I2 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
155
156
157
158
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
"
"
2.7 V
"
"
"
"
0.0 V
2.7 V
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
"
"
"
"
"
"
"
"
"
IN
0.0 V
0.0 V
"
"
"
"
"
"
"
I3 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
159
160
161
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
2.7 V
2.7 V
"
"
"
"
"
"
“
"
"
“
"
"
“
"
"
See footnotes at end of table.
Measured
terminal
I7 to ∑ O
"
"
"
I0 to ∑ O
"
"
"
I1 to ∑ O
"
"
"
Limits
Unit
MIL-M-38510/349B
13
1
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
9
Tc = 25°C
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
tPLH
3003
162
I6
I7
NC
I8
GND
I0
I1
I2
I3
I4
I5
VCC
Min
Max
2.7 V
2.7 V
∑ E
OUT
∑ O
2.7 V
GND
2.7 V
2.7 V
2.7 V
0.0 V
IN
0.0 V
5.0 V
I4 to ∑ E
1.5
15.0
Fig. 4
"
"
"
163
164
165
166
ns
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
I5 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
“
"
"
"
"
167
168
169
170
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
OUT
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
171
172
173
174
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
175
176
177
178
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
I5 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
179
180
181
182
"
"
"
IN
"
"
"
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
2.7 V
0.0 V
2.7 V
"
0.0 V
2.7 V
2.7 V
"
"
"
"
2.7 V
"
"
"
OUT
"
"
"
"
"
"
"
"
I6 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
183
184
185
186
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I7 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
187
188
189
190
2.7 V
0.0 V
2.7 V
0.0 V
"
"
"
0.0 V
0.0 V
2.7 V
2.7 V
IN
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I8 to ∑ E
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
191
192
193
194
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
OUT
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
195
196
197
198
"
"
"
0.0 V
2.7 V
0.0 V
2.7 V
IN
0.0 V
2.7 V
2.7 V
0.0 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
I7 to ∑ O
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
199
200
201
2.7 V
0.0 V
2.7 V
"
"
"
0.0 V
2.7 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
See footnotes at end of table.
Measured
terminal
I3 to ∑ O
"
"
"
I4 to ∑ O
"
"
"
I6 to ∑ O
"
"
"
Limits
Unit
MIL-M-38510/349B
14
1
MIL-STDSymbol
883
method
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditions (pins not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
Subgroup
9
tPLH
Tc = 25°C
10
11
Cases
A,B,C,D
Cases 1/
X, 2
Test no.
3003
202
Fig. 4
"
"
203
204
205
2.7 V
0.0 V
2.7 V
MIL-STDSymbol
883
method
1
2
3
4
5
6
7
8
9
10
11
12
13
14
2
3
4
6
8
9
10
12
13
14
16
18
19
20
I6
I7
NC
I8
∑ E
I0
I1
I2
I3
I4
I5
VCC
Min
Max
0.0 V
IN
∑ O
OUT
GND
0.0 V
GND
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
2.7 V
5.0 V
I8 to ∑ O
1.5
15.0
ns
0.0 V
2.7 V
2.7 V
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
"
1.0
1.0
"
"
"
21.0
20.0
"
"
"
"
"
tPHL
tPHL
Same tests and terminal conditions as for subgroup 9, except TC = +125°C and limits as shown.
Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
Measured
terminal
Limits
Unit
1/ For cases 2 and X, pins not referenced are N/C.
2/ IIL limits shall be as follows:
Parameters
IIL
Min/Max limits in mA for circuit
A
B
C
-.25/-.60
-.03/-.60
-.02/+.02
3/ Perform function sequence at VCC = 4.5 V and repeat at VCC = 5.5 V.
15
5/ For device type possessing NPN input structure VCC = 0.0 V.
MIL-M-38510/349B
4/ A = 4.5 V, B = 0.0 V,
H ≥ 2.5 V, L ≤ 0.5 V with high speed checker double comparator, or
H > 1.5 V, L < 1.5 V with high speed checker single comparator.
MIL-M-38510/349B
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service
or Defense Agency, or within the military service's system command. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
16
MIL-M-38510/349B
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ........................................... Ground zero voltage potential
IIN ................................................ Current flowing into an input terminal
VIN ............................................... Voltage level at an input terminal
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device
type
01
Generic-industry
type
54F280
6.8 Manufacturers' designation. Manufacturers' circuits which form a part of this specification are designated with
an "X" as shown in table IV herein.
TABLE IV. Manufacturers' designations.
Device
type
01
A
National Semiconductor/
Fairchild Semiconductor
X
Circuits
B
Motorola Inc.
X
C
Signetics
Corp.
X
D
Texas
Instruments
X
6.9 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect
to the previous issue due to the extensiveness of the changes.
Custodians:
Army - CR
Navy - EC
Air Force - 11
DLA - CC
Preparing activity:
DLA - CC
(Project 5962-2040)
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at www.dodssp.daps.mil.
17
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