Download datasheet for ISZ-500 by InvenSense Inc.

Download datasheet for ISZ-500 by InvenSense Inc.
InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
PS-ISZ-0500B-00-06
Release Date: 05/20/10
ISZ-500 Single-Axis Z-Gyro
Product Specification
A printed copy of this document is
NOT UNDER REVISION CONTROL
unless it is dated and stamped in red ink as,
“REVISION CONTROLLED COPY.”
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
TABLE OF CONTENTS
1. REVISION HISTORY ...................................................................................................................................4
2. PURPOSE AND SCOPE .............................................................................................................................5
3. PRODUCT OVERVIEW ...............................................................................................................................5
4. FEATURES ..................................................................................................................................................5
5. FUNCTIONAL BLOCK DIAGRAM ..............................................................................................................6
6. FUNCTIONAL DESCRIPTION ....................................................................................................................6
6.1
OVERVIEW ..........................................................................................................................................6
6.2
RATE SENSOR .....................................................................................................................................6
6.3
OSCILLATOR CIRCUIT ...........................................................................................................................6
6.4
AMPLITUDE CONTROL ..........................................................................................................................6
6.5
CORIOLIS SENSE .................................................................................................................................7
6.6
DEMODULATOR....................................................................................................................................7
6.7
LOW-PASS FILTER ...............................................................................................................................7
6.8
AUTO ZERO .........................................................................................................................................7
6.9
TEMPERATURE SENSOR .......................................................................................................................7
6.10
CHARGE PUMP ....................................................................................................................................7
6.11
MEMORY TRIM .....................................................................................................................................7
6.12
SCALE FACTOR ...................................................................................................................................7
6.13
REFERENCE VOLTAGE .........................................................................................................................7
6.14
ANALOG OUTPUTS ...............................................................................................................................7
7. SPECIFICATION..........................................................................................................................................8
7.1
SPECIFIED PARAMETERS ......................................................................................................................8
7.2
SPECIFIED PARAMETERS, CONTINUED...................................................................................................9
7.3
RECOMMENDED OPERATING CONDITIONS .............................................................................................9
7.4
ABSOLUTE MAXIMUM RATINGS .............................................................................................................9
7.5
REFERENCE CIRCUIT .........................................................................................................................10
8. APPLICATION INFORMATION ................................................................................................................11
8.1
PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................11
8.2
DESIGN CONSIDERATIONS..................................................................................................................12
8.2.1
POWER SUPPLY REJECTION RATIO.....................................................................................................12
8.2.2
POWER SUPPLY FILTERING ................................................................................................................12
8.2.3
AMPLITUDE CONTROL ........................................................................................................................12
8.2.4
TEMPERATURE SENSOR .....................................................................................................................12
8.2.5
INTERNAL LOW-PASS FILTER ..............................................................................................................12
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ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
8.2.6
EXTERNAL LOW-PASS CIRCUITRY.......................................................................................................13
8.2.7
GYRO OUTPUTS ................................................................................................................................13
8.2.8
AUTO ZERO .......................................................................................................................................13
8.2.9
HIGH IMPEDANCE NODES ...................................................................................................................14
8.2.10
CHARGE PUMP ..............................................................................................................................14
8.2.11
PROPER INTERFACE CLEANING ......................................................................................................14
8.2.12
ACOUSTIC NOISE SENSITIVITY .......................................................................................................14
8.2.13
ELECTROSTATIC DISCHARGE SENSITIVITY ......................................................................................14
9. ASSEMBLY ...............................................................................................................................................15
9.1
PACKAGE DIMENSIONS ......................................................................................................................15
9.2
PACKAGE MARKING SPECIFICATION ....................................................................................................16
9.3
TAPE & REEL SPECIFICATION .............................................................................................................16
9.4
LABEL ...............................................................................................................................................18
9.5
PACKING ...........................................................................................................................................18
9.6
TRACE ROUTING ................................................................................................................................19
9.7
SOLDERING EXPOSED DIE PAD ..........................................................................................................19
9.8
COMPONENT PLACEMENT ..................................................................................................................19
9.9
AGC NODE .......................................................................................................................................19
9.10
MEMS HANDLING INSTRUCTIONS .......................................................................................................19
9.11
GYROSCOPE SURFACE MOUNT GUIDELINES .......................................................................................19
9.12
PCB MOUNTING AND CROSS-AXIS SENSITIVITY ..................................................................................19
9.13
REFLOW SPECIFICATION ....................................................................................................................21
9.14
STORAGE SPECIFICATIONS.................................................................................................................22
10. RELIABILITY .............................................................................................................................................22
10.1
QUALIFICATION TEST POLICY .............................................................................................................22
10.2
QUALIFICATION TEST PLAN ................................................................................................................22
11. ENVIRONMENTAL COMPLIANCE...........................................................................................................23
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ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
1. Revision History
Revision Date
Revision
10/28/08
01
Initial Release
02/04/09
02
Updated to highlight capability of 2nd
stage analog output, enhanced
performance of AZ, and added
functionality of VREF output. Necessary
changes were made to electrical
specifications, pin out, functional block
diagram, reference circuit, package
diagram, and design considerations
section to describe these changes.
07/08/09
03
Reversed orientation of positive Z-axis
rotation; removed package landing
diagram; new solder reflow
specifications; updated environmental
compliance section; updated qualification
test policy; moved disclaimer to end of
document and changed wording; various
other figure and wording changes.
03/23/10
04
Reversed orientation of positive Z-axis
rotation.
05/11/10
05
Removed confidentiality mark
05/20/10
06
Updated AutoZero section to include pin
connection recommendation when AZ
function not used.
4 of 24
Description
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
2. Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and hardware
design related information relating to the ISZ-500 gyroscope.
Electrical characteristics in this preliminary document are based upon simulation results and limited
characterization data of advanced samples only. Specifications are subject to change without notice. Final
specifications will be updated based upon characterization of final silicon.
3. Product Overview
The ISZ-500 is a state-of-the-art single-axis Z-gyroscope designed specifically for complex motion sensing in
3D-input devices and gaming controllers. The ISZ-500 gyroscope utilizes state-of-the-art MEMS fabrication
with wafer-scale integration technology. This technology combines completed MEMS wafers and completed
CMOS electronic wafers together using a patented and proprietary wafer-scale bonding process that
simultaneously provides electrical connections and hermetically sealed enclosures. This unique and novel
fabrication technique is the key enabling technology that allows for the design and manufacture of high
performance, integrated MEMS gyroscopes in a very small and economical package. Integration at the
wafer-level minimizes parasitic capacitances, allowing for improved signal-to-noise over a discrete solution.
With the addition of the new patent-pending Auto Zero feature for minimizing bias drift over temperature, the
ISZ-500 offers unparalleled gyroscope performance in 3D-input and gaming applications.
4. Features
By integrating the control electronics with the sensor elements at the wafer level, the ISZ-500 gyroscope
supports a rich feature set including:
 Z-axis (yaw rate) gyro on a single chip
 Two separate analog outputs for standard and high sensitivity:
500°/s full scale range
Z-Out Pin:
2.0mV/°/s sensitivity
Z4.5Out Pin:
110°/s full scale range
9.1mV/°/s sensitivity
 Integrated amplifiers and low-pass filter
 Auto-Zero function
 On-chip temperature sensor
 High vibration rejection over a wide frequency range
 High cross-axis isolation by proprietary MEMS design
 3V single-supply operation
 Hermetically sealed for temperature and humidity resistance
 10,000 g shock tolerant
 Smallest single axis gyro package at 4 x 5 x 1.2mm
 RoHS and Green Compliant
5 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
5. Functional Block Diagram
VDD
ISZ-500
Oscillator
Coriolis
Sense
24 AZ
Output Gain
Demodulator
Z-Rate
Sensor
ZAGC 15
300k
Gain
Low-Pass
Filter
+
14 Z4.5OUT
Z4.5IN
16
Auto Zero
Temperature
Sensor
Charge Pump
Regulator
23
12
PTATS
CPOUT
Memory
Trim
Reference
Z-OUT
20
Optional
External
Filters
22
VREF
Figure 1
6. Functional Description
6.1
Overview
The ISZ-500 gyroscope consists of a dual-mass, vibratory MEMS gyroscope. The gyroscope measures
rotation rate about the Z-axis, the axis normal to the surface of the package.
The gyroscope‟s proof-masses are electrostatically oscillated at resonance. An internal automatic gain
control circuit precisely controls the oscillation of the proof masses. When the sensor is rotated about the Zaxis, the Coriolis Effect causes a vibration that can be detected by a capacitive pickoff. The resulting signal is
amplified, demodulated, and filtered to produce an analog voltage that is proportional to the angular rate.
6.2
Rate Sensor
The mechanical structure for detecting angular rate about the Z-axis is fabricated using InvenSense‟s
proprietary bulk silicon technology. The structure is covered and hermetically sealed at the wafer level. The
cover shields the gyro from electromagnetic and radio frequency interferences (EMI/RFI). The dual-mass
design inherently rejects any signal caused by linear acceleration.
6.3
Oscillator Circuit
The oscillator circuit generates electrostatic forces to vibrate the structure at resonance. The circuit detects
the vibration by measuring the capacitance between the oscillating structure and a fixed electrode. The
oscillator circuit switches in quadrature phase with the capacitance measurement in order to vibrate at
resonance.
6.4
Amplitude Control
The scale factor of the gyroscope depends on the amplitude of the mechanical motion and the trim setting of
the internal programmable gain stages. The oscillation circuit precisely controls the amplitude to maintain
constant sensitivity over the operating temperature range.
6 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
6.5
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Coriolis Sense
Rotating the sensor about the Z-axis results in a Coriolis force on the Z-rate sensor. The Coriolis force
causes the mechanical structure to vibrate in-plane. The resulting vibration is detected by measuring the
capacitance change between the mechanical structure and fixed electrodes. This signal is converted to a
voltage waveform by means of low-noise charge integrating amplifier and amplification stages.
6.6
Demodulator
The output of the Coriolis sense is an amplitude modulated waveform. The amplitude corresponds to the
rotation rate, and the carrier frequency is the mechanical drive frequency. The synchronous demodulator
converts the Coriolis sense waveform to the low-frequency, angular rate signal.
6.7
Low-Pass Filter
After the demodulation stage, there is a low-pass filter. This filter attenuates noise and high frequency
artifacts before final amplification.
6.8
Auto Zero
The Auto Zero function is used to reduce DC offset caused by bias drift. The implementation of this function
will vary by application requirement. Pin 24 (AZ) is used to set the Auto Zero function, resetting the bias to
approximately VREF.
6.9
Temperature Sensor
A built-in Proportional-To-Absolute-Temperature (PTAT) sensor provides temperature information on Pin 23.
6.10 Charge Pump
The on-chip charge pump generates the voltage required to oscillate the mechanical structure.
6.11 Memory Trim
The on-chip memory is used to select the gyro‟s sensitivity, calibrate the sensitivity, null DC offsets and
select the low-pass filter option
6.12 Scale Factor
The Rate-Out of the gyro is not ratiometric to the supply voltage. The scale factor is calibrated at the factory
and is nominally independent of supply voltage.
6.13 Reference Voltage
The gyro includes a bandgap reference circuit. The output voltage is typically 1.35V and is nominally
independent of temperature. The zero-rate signal is nominally equal to the reference value.
6.14 Analog Outputs
The ISZ-500 gyro has two Z-outputs (Z-OUT and Z4.5OUT), with scale factors and full-scale sensitivities that
vary by a factor of 4.5, as detailed in Section 8.2.7.
Having two sensitivities and two full-scale ranges for the one axis allows the end user to have one output that
can be used for faster motions (over a full scale range of ±500º/sec), and a second output that can be used
for slower motions (over a full scale range of ±110º/sec). Thus a lower-resolution analog-to-digital converter
(ADC) may be used to digitize the motion, with the gain of 4.5 in the Z4.5OUT output effectively giving the
user additional two-plus bits of resolution.
7 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
7. Specification
7.1
Specified Parameters
All parameters specified are @ VDD = 3.0 V and TA = 25°C. External LPF @ 2kHz.
PARAMETER
SENSITIVITY
Full-Scale Range
CONDITIONS
MIN
TYP
MAX
UNITS
At Z-OUT
At Z4.5OUT
±500
±110
Sensitivity
At Z-OUT
At Z4.5OUT
2.0
9.1
mV/°/s
mV/°/s
Initial Calibration Tolerance
Calibration Drift Over Specified
Temperature
Nonlinearity
Cross-axis Sensitivity
At Z-OUT
At Z-OUT
±6
±10
%
%
At Z-OUT, Best Fit Straight Line
0.5
±1
% of FS
%
REFERENCE
Voltage (VREF)
Tolerance
Load Drive
Capacitive Load Drive
Power Supply Rejection
Reference Drift Over Specified
Temperature
ZERO-RATE OUTPUT (ZRO)
Static Output (Bias)
Initial Calibration Tolerance
1.35
±50
100
100
1
±5
Load directly connected to VREF
VDD= 2.7V to 3.3V
Factory Set
Power Supply Sensitivity
Relative to VREF
±20
Without Auto Zero
±250
@ 50 Hz
Internal LPF -90°
10Hz
OUTPUT DRIVE CAPABILITY
Output Voltage Swing
Capacitive Load Drive
Output Impedance
POWER ON-TIME
Zero-Rate Output
AUTO ZERO CONTROL
AZ Logic High
AZ Logic Low
Auto Zero Pulse Duration
Offset Settle Time After Auto Zero
26
Bandwidth 1Hz to 1kHz, At Z-OUT
Load = 100k
V
mV
±50
mV
10
°/sec/V
140
-4.5
MECHANICAL FREQUENCY
Z-Axis Resonant Frequency
NOISE PERFORMANCE
Total RMS Noise
V
mV
µA
pF
mV/V
mV
1.35
With Auto Zero
ZRO Drift Over Specified
Temperature
FREQUENCY RESPONSE
High Frequency Cutoff
LPF Phase Delay
°/s
°/s
to VDD/2
30
Hz
°
34
0.5
0.05
mV rms
VDD-0.05
V
pF
200
ms
100
200
Settling to ±3°/s
50
Rising Input
Falling Input
1.9
0.9
2
1500
7
8 of 24
kHz
V
V
µsec
msec
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
7.2 Specified Parameters, continued
All parameters specified are @ VDD = 3.0 V and TA = 25°C. External LPF @ 2kHz.
PARAMETER
CONDITIONS
MIN
TYP
MAX
2.7
3.0
4.5
±1
3.3
POWER SUPPLY (VDD)
Operating Voltage Range
Quiescent Supply Current
Supply Current Change Over
Specified Temperature
TEMPERATURE SENSOR
Sensitivity
Offset
Output Impedance
Range -20 to +85°C
4
1.25
12
TEMPERATURE RANGE
Specified Temperature Range
7.3
-20
V
mA
mA
mV/°C
V
k
+85
°C
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
Power Supply Voltage (VDD)
2.7
3.0
3.3
V
20
ms
Power Supply Voltage (VDD)
Rise Time (10% - 90%)
7.4
UNITS
Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device under these conditions is not implied. Exposure
to the absolute maximum rating conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage
-0.3V to +3.6V
Acceleration (Any Axis, unpowered)
10,000g for 0.3ms
Operating Temperature Range
-40 to +105°C
Storage Temperature Range
-40 to +125°C
9 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
7.5
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Reference Circuit
VDD
ISZ-500
Oscillator
ZAGC
15
Coriolis
Sense
300k
24 AZ
Output Gain
Demodulator
Gain
Z-Rate
Sensor
Low-Pass
Filter
4.5X
+
14 Z4.5OUT
Z4.5IN
16
0.22µF
Auto Zero
Supply
2.2
9 VDD
1.0µF
LDO 0.1µF
Temperature
Sensor
Memory
Trim
Charge Pump
Regulator
Reference
Z-OUT
20
750
0.1µF
19 VDD
23
PTATS
CPOUT
12
GND
2
8
26
27
28
22
VREF
0.1µF/25V
Figure 2
Bill of Material for External Components
Component
Specification
Low Pass Filter Capacitor
0.1µF ±20% / 10V
AGC Capacitor
0.22µF ±10% / 10V
VDD Bypass Capacitor
0.1µF ±20% / 10V
Charge Pump Capacitor
0.1µF ±20% / 25V
LDO Input Filter Capacitor
1.0µF / Ratings Dependent upon Supply Voltage
LDO Input Filter Resistor
2.2Ω ±1%
Low Pass Filter Resistor
750Ω ±1%
10 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
8. Application Information
8.1
Pin Out and Signal Description
Number
Pin
2, 8, 26, 27, 28
GND
Ground
Description
9, 19
VDD
Positive supply voltage
12
CPOUT
14
Z4.5OUT
Charge pump capacitor connection
15
ZAGC
Amplitude control capacitor connection
16
Z4.5IN
Z-axis input to the 4.5X amplifier
20
Z-OUT
Rate output for rotation about the Z-axis (±500°/sec FSR)
22
VREF
Precision reference output
23
PTATS
Temperature Sensor Output
24
AZ
10, 11, 13, 21, 25
RESV
1, 3, 4, 5, 6, 7, 17, 18
NC
Z-axis output of the 4.5X amplifier (±110°/sec FSR)
Auto Zero control pin
Reserved. Do not connect.
Not internally connected. May be used for PCB trace routing.
Top View
GND
GND
GND
RESV
AZ
PTATS
VREF
RESV
28
27
26
25
24
23
22
21
NC
1
20
Z-OUT
GND
2
19
VDD
NC
3
18
NC
NC
4
17
NC
NC
5
16
Z4.5IN
NC
6
15
ZAGC
Z
+Z
Y
ISZ-500
7
8
9
10
11
12
13
14
NC
GND
VDD
RESV
RESV
CPOUT
RESV
Z4.5OUT
28-pin, 4mm x 5mm x 1.2mm
QFN Package
Figure 3
11 of 24
ISZ
- 50
0
X
Orientation of Axis of
Sensitivity and Polarity
of Rotation
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
8.2
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Design Considerations
8.2.1
Power Supply Rejection Ratio
The gyro is most susceptible to power supply noise (ripple) at frequencies less than 100Hz. At less
than 100Hz, the PSRR is determined by the overall internal gain of the gyroscope. Above 100Hz, the
PSRR is determined by the characteristics of the on-chip low-pass filter. Above 1kHz, the PSRR is
relatively constant except for a narrow frequency range corresponding to the resonant frequency of the
Z-gyroscope.
8.2.2
Power Supply Filtering
The Power Supply Voltage (VDD) rise time (10% - 90%) must be less than 20ms at VDD (Pins 9 and
19) for proper device operation.
The ISZ-500 gyroscope should be isolated from system power supply noise by a combination of an RC
filter that attenuates high frequency noise and a Low Drop Out linear regulator (LDO) that attenuates
low frequency noise. Figure 4 shows a typical configuration.
2.2Ω
Supply
VIN
1.0µF
EN
Linear
Regulator
(LDO)
VOUT
9
VDD
19
VDD
ISZ-500
0.1µF
GND
Figure 4
The low-pass RC filter should be chosen such that it provides significant attenuation of system noise at
high frequencies. The LDO should be a low noise regulator (<100V/rtHz) that exhibits good noise
rejection at low frequencies.
8.2.3
Amplitude Control
The scale factor of the gyroscope depends on the amplitude of the mechanical motion and the trim
setting of the internal programmable gain stages. The oscillation circuit precisely controls the
amplitude to maintain constant sensitivity over the specified temperature range. The capacitor
connected to Pin 15 (ZAGC) is a compensation capacitor for the amplitude control loop.
8.2.4
Temperature Sensor
A built-in Proportional-To-Absolute-Temperature (PTAT) sensor provides temperature information on
Pin 23 (PTATS). The temperature sensor output signal is analog, and has a bias of approximately
1.25V at room temperature, and increases at a rate of 4mV/ºC. The output impedance is nominally
12k and is therefore not designed to drive low impedance loads. If necessary, the output can be
externally buffered with a low offset-drift buffer, and optionally a low-pass filter to minimize noise.
8.2.5
Internal Low-Pass Filter
After the demodulation stage, there is a low-pass filter. This filter limits noise and high frequency
artifacts from the demodulator before final amplification. The following graph shows the typical gain
and phase response. The low-pass filter has been designed for a nominally flat gain up to the cutoff
frequency while still achieving a low phase delay at 10Hz and 30Hz.
12 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
LPF Phase & Gain
10
10
5
5
0
0
-5
-5
-10
-10
Phase
-15
-15
-20
-20
-25
-25
-30
Phase (deg)
Filter Response (dB)
Gain
-30
1
10
100
1000
Nominal
Limits
Frequency (Hz)
Figure 5
8.2.6
External Low-Pass Circuitry
To further attenuate high-frequency noise, an optional external low-pass filter may be used.
8.2.7
Gyro Outputs
The ISZ-500 gyro has two Z-outputs, with scale factors and full-scale sensitivities as summarized
below.
Axis
Z
Gyro Output
Sensitivity (mV/º/s)
Full-Scale Range (±º/s)
Z-OUT
2
500
Z4.5OUT
9.1
110
Having two sensitivities and two full-scale ranges for one axis allows the end user to have one output
that can be used for faster motions (over a full scale range of ±500º/sec), and a second output that can
be used for slower motions (over a full scale range of ±110º/sec). Thus a lower-resolution analog-todigital converter (ADC) may be used to digitize the motion, with the gain of 4.5 in the Z4.5OUT output
effectively giving the user additional two-plus bits of resolution.
The ISZ-500 gyro outputs are independent of supply voltage (i.e. they are not ratiometric).
Gyro rotation rate is calculated as:
(Gyro Output Voltage – Gyro Zero-Rate Out) / Sensitivity
where the Zero-Rate Output (ZRO) is nominally VREF. There is a temperature dependence to ZRO,
and an initial accuracy to ZRO.
8.2.8
Auto Zero
Auto Zero (AZ) is a function that is used to maximize the gyro‟s dynamic range when using the
Z4.5OUT output.
AZ works by keeping the gyro‟s Zero-Rate Output (ZRO) close to VREF, and thus allows the user to
achieve a wider usable signal range, without using an external analog high pass filter.
13 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
When activated, the Auto Zero circuit internally nulls the ZRO to approximately VREF. The typical
usage of Auto Zero is in conditions where:
1. The gyro‟s motion is known, such as when:
a. The gyro is stationary.
b. Other sensors can report angular rotation rate.
2. The DC value of the gyro output is not important, but only the AC value is. In this case, a digital
ac filter may be used to extract the gyro data, which provides a higher-quality output than is
possible with an analog R-C filter.
The Auto Zero function is initiated on the rising edge of the AZ pin. The Auto Zero settling time is
typically 7ms. This time includes the time required for nulling the ZRO and for the settling of the
internal low pass filter (LPF). If the external LPF bandwidth is less than 200Hz, the Auto Zero settling
time will be longer than specified.
The AZ pulse width should meet the specified minimum time requirement of 2µs to start the Auto Zero
function, and should be shorter than the maximum specified time of 1,500µs. The Auto Zero pulse
should occur after the start-up period to cancel any initial calibration error.
If the AutoZero function is not used, the AZ pin ( pin 24) should be connected to ground.
8.2.9
High Impedance Nodes
The ZAGC pin is a high impedance node (>1Mohm). Any coating, glue or epoxy on this pin or on the
capacitor connected to this pin, will affect part performance and should be avoided.
8.2.10
Charge Pump
The on-chip charge pump requires a capacitor for stable operation. This capacitor should be 0.1µF and
rated for 25V.
8.2.11
Proper Interface Cleaning
Proper cleaning of PCB solder pads prior to assembly is recommended. PCB surface contaminants at
pin 15 may affect part performance.
8.2.12
Acoustic Noise Sensitivity
The ISZ-500 gyroscope is insensitive to vibration except for a narrow frequency range near the gyro‟s
resonant frequency and at odd multiples of the resonant frequency. The typical bandwidth of the
acoustic sensitivity is 200Hz. It is recommended that products using the ISZ-500 gyroscope along with
mechanical actuators be designed such that the acoustic noise in the 20kHz to 31kHz range be
attenuated by the product‟s enclosure avoids these frequency ranges.
8.2.13
Electrostatic Discharge Sensitivity
The ISZ-500 gyroscope can be permanently damaged by an electrostatic discharge. ESD precautions
for handling and storage are recommended.
14 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
9. Assembly
9.1
2X
Package Dimensions
0.15
TOP VIEW
BOTTOM VIEW
A
2X
D2
D
C
0.15 C
E2
E
Chamfer,
0.10mm
L
e
B
0.10
DETAIL „A‟
S
Y
M
B
O
L
C
A
SEATING
PLANE
A
b
0.10 M C
B
MIN.
1.10
A3
A3
C
COMMON
DIMENSIONS MILLIMETERS
A
SIDE VIEW
15 of 24
NOM.
MAX.
MIN.
1.15
1.20
0.042
0.203 BSC
NOM.
MAX
0.044
0.046
0.008 BSC
b
0.18
0.25
0.30
0.007
0.009
0.011
D
3.85
4.00
4.15
0.150
0.156
0.161
D2
2.65
2.80
2.95
0.103
0.109
0.115
E
4.85
5.00
5.15
0.189
0.195
0.200
E2
3.50
3.65
3.80
0.137
0.142
0.148
e
Figure 6
DIMENSIONS INCH
0.50 BSC
0.019 BSC
L
0.30
0.35
0.40
0.011
0.013
0.015
L1
0.00
0.08
0.15
0.000
0.003
0.006
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
9.2
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Package Marking Specification
Line 1 = Company Name
Line 2 = Part Number
Line 3 = Lot Traceability Code
Line 4 = Fabricator, Assembly, Date Code, Revision
InvenSense
ISZ-500
XXXXXX-XX
XX XXXX X
Top View
9.3
Tape & Reel Specification
DETAIL „A‟
(l) Measured from centerline of sprocket hole to centerline of pocket.
(ll) Cumulative tolerance of 10 sprocket holes is ± 0.20.
(lll) Measured from centerline of sprocket holes to centerline of pocket.
(lV) Other material available.
ALL DIMENSIONS IN MILLIMETERS UNLESS OTHERWISE STATED.
CARRIER TAPE (mm)
PKG
SIZE
Tape
Width
(W)
Pocket
Pitch
(P1)
Ao
Bo
Ko
F
Leader
Length
(Min.)
Trailer
Length
(Min.)
4x5
16.00 ±0.3
12.00 ±0.1
5.30 ±0.1
4.30 ±0.1
1.65 ±0.1
7.50 ±0.1
300
300
Figure 7
16 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Figure 8
PKG
SIZE
REEL (mm)
4x5
L
V
W
Z
330
100
16.4
3.0
User Direction of
Feed
Package Orientation
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Label
Pin 1
Terminal Tape
Reel
Figure 9
Quantity Per Reel
5000
Reels per Pizza Box
1
Pizza Boxes Per Carton (max)
3 full pizza boxes packed in the center of the
carton, buffered by two empty pizza boxes
(front and back).
Pieces/Carton (max)
15,000
17 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
9.4
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Label
Location of Label
9.5
Packing
Anti-static Label
Moisture-Sensitive
Caution Label
Tape & Reel Label
Moisture Barrier Bag
With Labels
Reel in Pizza Box
Moisture-Sensitive Caution Label
Pizza Box with Tape & Reel Label
18 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
9.6
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
9.7
Soldering Exposed Die Pad
The exposed die pad is internally connected to VSS, and should not be soldered to the PCB since soldering
to it contributes to performance changes due to package thermo-mechanical stress.
9.8
Component Placement
There are no specific design considerations other than generally accepted industry design practices for
component placement near the ISZ-500 gyroscope to prevent noise coupling.
9.9
AGC Node
The gyro pin marked ZAGC is a high impedance node that is sensitive to current leakage, which can impact
gyroscope performance. Care should be taken to ensure that this node is not contaminated by residue such
as flux and is clean.
9.10 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
InvenSense‟s ISZ-500 gyroscopes have a shock tolerance of 10,000g. InvenSense packages its gyroscopes
as it deems proper for protection against normal handling and shipping. It recommends the following
handling precautions to prevent potential damage:

Individually packaged gyroscopes or trays of gyroscopes should not be dropped on hard surfaces.
Components placed in trays could be subject to g-forces in excess of 10,000g if dropped.

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
9.11 Gyroscope Surface Mount Guidelines
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
In order to assure gyroscope performance, several industry standard guidelines need to be considered for
surface mounting. These guidelines are for both printed circuit board (PCB) design and surface mount
assembly and are available from packaging and assembly houses.
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and
assembly could affect the output offset and its value over a wide range of temperatures. This is caused by
the mismatch between the Coefficient Temperature Expansion (CTE) of the package material and the PCB.
Care must be taken to avoid package stress due to mounting.
9.12 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about another axis, for example, the Z-axis gyroscope responding to
rotation about the X or Y axes. The orientation mounting errors are illustrated in the figure below.
19 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
Z
Y
ISZ
- 50
0
X
Package Gyro Axes (
) Relative to PCB Axes (
) with Orientation Error ( )
Figure 10
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope‟s sensitivity for a
given orientation error.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
( )
Cross-Axis Sensitivity
(sin )
0º
0%
0.5º
0.87%
1º
1.75%
The specification for cross-axis sensitivity in Section 7 includes the effect of the die orientation error with
respect to the package.
20 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
9.13 Reflow Specification
The approved solder reflow curve shown in the figure below conforms to IPC/JEDEC J-STD-020D.01
(Moisture/Reflow Sensitivity Classification for Non hermetic Solid State Surface Mount Devices) with a
maximum peak temperature (Tc = 260°C). This is specified for component-supplier reliability qualification
testing using lead-free solder for package thicknesses less than 1.6 mm. The reliability qualification preconditioning used by InvenSense incorporates three of these conforming reflow cycles. All temperatures
refer to the topside of the QFN package, as measured on the package body surface. Customer solder-reflow
processes should use the solder manufacturer‟s recommendations, making sure to never exceed the
constraints listed in the table and figure below, as these represent the maximum tolerable ratings for the
device. For optimum results, production solder reflow processes should use lower temperatures, reduced
exposure times to high temperatures, and lower ramp-up and ramp-down rates than those listed below.
Approved IR/Convection Solder Reflow Curve
Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
Step
Setting
A
B
C
D
Troom
TSmin
TSmax
TLiquidus
TPmin
E
F
G
H
I
[≤TPmax-5˚C,255°C]
TPmax [260°C]
TPmin
TLiquidus
Troom
Temp (°C)
25
150
200
217
CONSTRAINTS
Time (sec)
Rate (°C/sec)
60 < tBC < 120
r(TL-TPmax) < 3
255
r(TL-TPmax) < 3
260 -0/+5°C
255
217
25
21 of 24
tAF < 480
tEG < 30
60 < tDH < 120
r(TL-TPmax) < 3
r(TPmax-TL) < 6
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
9.14 Storage Specifications
The storage specification of the ISZ-500 gyroscope conforms to Moisture Sensitivity Level (MSL) 3, as
defined by IPC/JEDEC J-STD-020D.01.
Storage Specifications for ISZ-500
Calculated shelf-life in moisture-sealed bag
12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168 hours -- Storage conditions: ambient ≤30°C at 60% RH
10. Reliability
10.1 Qualification Test Policy
InvenSense‟s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan follows the JEDEC 47D Standards, “Stress-Test-Driven Qualification of Integrated
Circuits,” with the individual tests described below.
10.2 Qualification Test Plan
Accelerated Life Tests
Lot
Quantity
Samples
/ Lot
Accept /
Reject
Criteria
JEDEC JESD22-A108C, Dynamic, 3.63V biased,
Tj>125°C
[read-points 168, 500, 1000 hours]
3
77
(1/2)
Steady-State
Temperature Humidity
Unbiased Life (1)
JEDEC JESD22-A101C, 85°C/85%RH
[read-points 168, 500, 1000 hours]
3
77
(1/2)
High Temperature
Storage Life
JEDEC JESD22-A103C, Cond. A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]
3
77
(1/2)
Lot
Quantity
Samples
/ Lot
Accept /
Reject
Criteria
Test
Method/Condition
High Temperature
Operating Life
(HTOL/LFR)
Device Component Level Tests
Test
Method/Condition
ESD-HBM
JEDEC JESD22-A114F, Class 2 (2KV)
1
15
(0/1)
ESD-MM
JEDEC JESD22-A115-A, Class B (200V)
1
12
(0/1)
Latch Up
JEDEC JESD78B Class 1 (25°C), Level 1 ( +/- 100mA)
1
6
(0/1)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883, method 2002,
Cond. D, 10,000g’s, 0.3ms, ±X,Y,Z – 6 directions, 5
times/direction
3
5
Vibration
JEDEC JESD22-B103B, Variable Frequency (random),
Cond. B, 5-500Hz, X,Y,Z – 4 times/direction
3
5
(0/1)
Temperature Cycling (1)
JEDEC JESD22-A104D Condition N, -40°C to +85°C,
Soak Mode 2, 100 cycles
3
77
(1/2)
(1)
Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
22 of 24
(0/1)
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
11. Environmental Compliance
The ISZ-500 gyroscope is RoHS and Green compliant.
Assembler:
Package Type:
Package Total Mass (mg):
Component
Lingsen Precision Industries, Inc.
QFN 28L 4x5x1.2mm
61.25
Substance
CAS Number
Percent (%)
Material
Weight (mg)
Amount of
Substance (mg)
7440-21-3
100
6.94
6.94
Semiconductor Device
Silicon Chip
Doped Silicon (Si)
Lead Frame (ASM 28N C7025AG, with JAU JANQ Matte Sn Finish)
Base Metal
Copper (Cu)
7440-50-8
Balance
Base Metal
Iron (Fe)
7439-89-6
2.1-2.6
Base Metal
Phosphorus (P)
7723-14-0
0.015-0.15
Base Metal
Zinc (Zn)
7440-66-6
0.05-0.20
0.013
Finish Plating
Matte Tin (Sn)
7440-31-5
1.04
0.107
Bond Wire (Sumitomo Metal Mining 1.0MIL (2KM) SGL-2 Gold Wire)
Gold Metal
Gold (Au)
7440-57-5
Die Attach Adhesive (Henkel Ablebond 2025D)
Dimethyl Siloxane,
Filler
DimethylvinylsiloxyTerminated
9.964
0.227
>99.99
068083-19-2
Balance
10.32
1.12
0.009
1.120
0.679
0.78
0.078
Filler
Trimethylated Silica
068909-20-6
7-13
Filler
Dimethyl, Methylhydrogen
Siloxane, HydrogenTerminated
069013-23-6
1-5
0.023
Mold Compound (Sumitomo Bakelite GREEN EME-G770H)
Filler
Epoxy Resin-1
Trade Secret
2-5
1.475
Filler
Epoxy Resin-2
Trade Secret
1-3
0.843
Filler
Phenol Resin
Trade Secret
2-5
Hardener
Silica
60676-86-0
Balance
Coloring Material
Carbon Black
1333-86-4
Approx. 0.2
0.084
Filler
Metal Hydroxide
Trade Secret
1-10
2.318
-
Others
-
Max. 5
2.107
1.475
42.14
33.84
Test results for RoHS banned substances/compounds:
Substance/
Compound
Test Method
Die
Lead-frame
Bond Wire
Die Attach
Adhesive
Mold
Compound
Hexavalent
Chromium
EPA3060A/ 7196A
Not Available
ND(<5)
ND(<2)
ND(<1)
ND (<2)
Cadmium
EN1122 Method
B:2001
Not Available
ND(<5)
ND(<2)
ND(<2)
ND (<2)
Mercury
US EPA 3052
Not Available
ND(<5)
ND(<2)
ND(<2)
ND (<2)
Lead
US EPA 3050B
Not Available
ND(<10)
ND(<2)
ND(<2)
ND (<2)
PBBs
EPA3540B/ 3550B
Not Available
ND(<250)
ND(<5)
ND(<5)
ND(<5)
PBDEs
EPA3540B/ 3550B
Not Available
ND(<250)
ND(<5)
ND(<5)
ND(<5)
ND = Not Detected
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity documents for the above
component are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers.
This information has not been validated by InvenSense.
23 of 24
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0500B-00-06
Release Date: 05/20/10
.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense
TM
is a registered trademark of InvenSense, Inc. ISZ
TM
and ISZ-500
TM
are trademarks of InvenSense, Inc.
©2009 InvenSense, Inc. All rights reserved.
24 of 24
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