Download datasheet for ML22341 by LAPIS Semiconductor

Download datasheet for ML22341 by LAPIS Semiconductor
FEDL22340DIGEST-01
Issue Date: Jan.6, 2011
ML22Q340/340/Q341/341
LAPIS Semiconductor ADPCM Speech Synthesis LSI
GENERAL DESCRIPTION
The ML22340/ML22Q340/ML22341/ML22Q341, which include mask ROM and Flash memory for storing speech data,
respectively, are speech synthesis LSIs which can controll speech playback utilizing an event input system.
It includes speaker amplifier and 16bit DA Converter, so it is possible to have high quality sound and solution for playback with
1chip..
FEATURES
 Playback Time
Capasitance
of
ROM(
bit)
640K
896K
Product Name
ML22Q340/340
ML22Q341/341
 Speech sysnthesis system:
 Speech ROM capacity
 Sampling frequency:





Analog output:
Interface:
Sequencer output function:
Maximum event count:
Input pin setting:
 Output pin setting:





Source oscillation frequency:
Power supply voltage:
Flash memory rewrite cycles
Operating temperature range:
Package:
 Product name:
(*1)
Maximum Playback time(s)
Fsam=8.0kHz
HQ-ADPCM
4bitADPCM2
16bitPCM
35
20
28
5
7
4-bit ADPCM2
8-bit/16-bit straight PCM system
8-bit nonlinear PCM system
HQ-ADPCM (*1) (ML22Q341/341)
(can be specified for each phrase)
ML22340:
640-Kbit Mask ROM
ML22Q340: 640-Kbit Flash
ML22341:
896-Kbit Mask ROM
ML22Q341: 896-Kbit Flash
8.0/16.0 /32.0kHz, 6.4/12.8/25.6 kHz/, 10.7/21.3 kHz
(fsam can be specified in units of phrase)
Built-in 16-bit DA converter
Event input system (built-in noise elimination function)
16 types
30 events
High-impedance input (CMOS input), pull-down input, or pull-up input is selectable based
on ROM data
High-impedance output, CMOS output, Pch open drain output, Nch open drain output, or
LED drive is selectable based on ROM data
4.096 MHz (Typ.)
2.3V to 5.5V
80 times (ML22Q340/Q341)
40C to +85C
30-pin plastic SSOP (SSOP30-56-0.65-6K)
48-pin plastic TQFP (TQFP48-0707-0.50-K) TBD
ML22340-xxxMB (xxx: ROM code number)
ML22341-xxxMB (xxx: ROM code number)
ML22Q340-NNNMB/ML22Q340-xxxMB (xxx: ROM code number)
ML22Q341-NNNMB/ML22Q341-xxxMB (xxx: ROM code number)
HQ-ADPCM is audio compression technology featuring high-quality sound. It was developed by “Ky’s”.
“Ky’s” is a registered trademark of Kyushu Institute of Technology, one of the national universities in Japan.
1/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
DESCRIPTION OF FUNCTIONS
Event Activation
Power-down is released by the change in the input signal to the EVIN0-4 pins and the event number specified by the EVIN0-4 pins
in time tCHT is internally captured and the event execution according to the number is started.
Disconnection Detection
Set the event1 (EVIN0=“H”, EVIN1-4=“L”) , operate the disconnection detection. If disconnection detection, the “ERR” pin
output “H”. And the 100ms “H” pulse is output right after the event start.
During the event operating, the disconnention detecction can’t be operated.
Thermal Detection
In the case of setting the thermal detection mode, if higher temperature than the judgement temperature, the “ERR” pin output
“H”.
Edit Phrase
Two or more voice phrases are joined and it can be played continuously. Moreover, the silent section can be inserted between
voice phrases.
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FEDL22340DIGEST-01
ML22Q340/340/Q341/341
Setting of Mask Option
The following table shows the items which can be set by using the Mask option (ROM data):
Parameter
Setting of the internal speaker amplifier
Setting of thermal detection
Setting of judgement temperature
EVIN0-4 pin input setting
Setting of the initial value of SEQ0-6 pin
output
Setting of SEQ0-6 pin output
Setting of use or unuse of SEQ0-6 pins
Speech synthesis system
Setting value
Use or unuse of the internal speaker amplifier selectable
Use or unuse of thermal detection selectable
150°C or 125°C or 100°C selectable
High-impedance input (CMOS input), pull-up input, or pull-down input selectable
(EVIN0 pin can specify only high-impedance input and pull-up input )
“L” output, or “H” output state selectable
(SEQ0 pin can specify only the “L” output)
CMOS output, Nch open drain, Pch open drain, high-impedance or LED drive pin
selectable
(SEQ0 pin can specify only the CMOS output)
Use or unuse of the SEQ output of SEQ0-6 pins selectable
(SEQ0 pin can specify only the “use”)
4-bit ADPCM2/8-bit/16-bit straight PCM system
8-bit nonlinear PCM system
HQ-ADPCM (apply to ML22Q341/341)
Sampling frequency
8.0/16.0 /32.0kHz, 6.4/12.8/25.6 kHz/, 10.7/21.3 kHz
Event execution mode
Play once mode, scheduled play mode and change immediately mode can be
selected for each execution event.
Setting of the SEQ output pattern of SEQ0-6
pins
SEQ pattern: 01h to 10h selectable
SEQ pattern 01h to 08h : Level Output
SEQ pattern 09h to 0Ch : Pulse Output
SEQ pattern 0Dh to10h : Edit silent/sound detection output with edit playback
0 to 1020 ms ((00h~FFh)4ms) selectable
Transfer time for pop noise elimination, play
start, and power down: WS1 ~ WS4
Setting of the count of Pulse output of SEQ
output pattern
Delay time / Pulse width of SEQ output
pattern: tSEQD /tSEQW
1 to 256 times ((00h~FFh)+1 times) output selectable
4 to 1024 ms ((00h~FFh)4ms+4ms) selectable
And volume setting is as follows.
Setting value
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
Volume [dB]
+2.98
+2.70
+2.40
+2.10
+1.78
+1.45
+1.11
+0.76
+0.39
+0.00
Setting value
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
Volume [dB]
-0.41
-0.83
-1.28
-1.75
-2.25
-2.77
-3.34
-3.94
-4.58
-5.28
-6.04
Setting value
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
Volume [dB]
-6.87
-7.79
-8.82
-9.99
-11.34
-12.94
-14.90
-17.44
-21.04
-27.31
OFF
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ML22Q340/340/Q341/341
Event contents
There are three kinds of event contents, Stop (00h), Disconnection Detection (01h), and Play (02h~1Fh), as follows.
EVENT
No.
Input pattern
EVIN4
EVIN3
EVIN2
EVIN1
EVIN0
00h
01h
02h
03h
04h
05h
06h
07h
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
Contents
Stop
Disconnection Detection
Play
4/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
BLOCK DIAGRAM
ML22Q340-NNN/ML22Q341-NNN
VDD
GND
Regulator
Controller
VDDL
EVIN4
EVIN3
EVIN2
EVIN1
EVIN0
Address
EVENT
Phrase
Address Latch
16bit
Multiplexer
640Kbit (896Kbit)
Flash
16bit
Address Counter
ADPCM/PCM
Synthesizer
VPP
Interface
LPF
TEST
SEQ6/LED3
SEQ5/LED2
SEQ4/LED1
SEQ3/LED0
SEQ2
SEQ1
SEQ0
ERR
16bit DAC
Timing
Controller
SP
SEQ
Interface
AMP
OSC
SPVDD
SPGND
SPM
SPP
RESET_N
OSC0
OSC1 AOUT
SG
SPIN
():Applies to ML22Q341
5/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
BLOCK DIAGRAM
ML22340-xxx/ML22341-xxx
VDD
GND
Controller
VDDL
EVIN4
EVIN3
EVIN2
EVIN1
EVIN0
Address
Regulator
EVENT
Phrase
Address Latch
16bit
Multiplexer
640Kbit (896Kbit)
ROM
16bit
Address Counter
ADPCM/PCM
Synthesizer
Interface
LPF
TEST
SEQ6/LED3
SEQ5/LED2
SEQ4/LED1
SEQ3/LED0
SEQ2
SEQ1
SEQ0
ERR
Timing
Controller
16bit DAC
SEQ
SP
SPVDD
Interface
AMP
SPGND
OSC
SPM
SPP
RESET_N
OSC0
OSC1 AOUT
SG
SPIN
():Applies to ML22341
6/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
PIN CONFIGURATION (TOP VIEW)
ML22Q340-NNNMB/ML22Q341-NNNMB
VDD
OSC0
OSC1
VDDL
VPP
ERR
SEQ0
SEQ1
SEQ2
GND
RESET_N
TEST
EVIN4
EVIN3
EVIN2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
SPP
SPM
NC
SPGND
SPVD D
SPIN
AOUT
SG
GND
SEQ6/LED3
SEQ5/LED2
SEQ4/LED1
SEQ3/LED0
EVIN0
EVIN1
NC Unused pin
30-pin Plastic SSOP
ML22340-xxxMB/ML22341-xxxMB
VDD
OSC0
OSC1
VDDL
NC
ERR
SEQ0
SEQ1
SEQ2
GND
RESET_N
TEST
EVIN4
EVIN3
EVIN2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
SPP
SPM
NC
SPGND
SPVDD
SPIN
AOUT
SG
GND
SEQ6/LED3
SEQ5/LED2
SEQ4/LED1
SEQ3/LED0
EVIN0
EVIN1
NC Unused pin
30-pin Plastic SSOP
7/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
PIN DESCRIPTIONS
Pin No.
symbol
I/O
Description
11
RESET_N
I
Place this pin at a “L” level when powered on. After the supply voltage is settled,
place this pin at a “H” level.
17
16
15
14
13
EVIN0
EVIN1
EVIN2
EVIN3
EVIN4
I
Event specifying input pins.
Event execution or stop can be performed by changes in the input signals
to the activation pins set by the EVIN0 pin or Mask option
Set the unused pins to be pulled up or pulled down.
And the SEQ0 pin can specify only the SEQ pattern 6.
12
TEST
I
Input pin for testing. Fix this pin at a “L” level (GND level).
2
OSC0
I
Pin for connecting a crystal or a ceramic vibrator.
A feed back resistor (about 1 M) is included between OSC0 and OSC1 pins.
When a vibrator is used, place it as close to the LSI as possible.
3
OSC1
O
Pin for connecting a crystal or a ceramic vibrator.
When a vibrator is used, place it as close to the LSI as possible.
6
ERR
O
7
8
9
SEQ0
SEQ1
SEQ2
O
18
19
20
21
SEQ3/LED0
SEQ4/LED1
SEQ5/LED2
SEQ6/LED3
O
24
AOUT
O
5
VPP
*Note 1
—
1
VDD
—
4
VDDL
—
10,22
27
26
25
GND
SPGND
SPVDD
SPIN
—
—
—
I
23
SG
O
30
29
SPP
SPM
O
O
Error output pin for thermal detection and disconnection detection.
If disconnection detection or a higher temperature than the judgment
temperature is detected, this pin output “H”. Setting event 1 , operate the
disconnection detection.
And the 100ms “H” pulse is output right after the event start.
Sequencer output pins.
This pin is output SEQ pattern 01h~10h based on ROM data.
The SEQ patterns (01h to 10h) set by Mask option are output.
And the SEQ0 pin can specify only the SEQ pattern 6.
Sequencer output pins.
These pins can drive LED.
The patterns set by Mask option are output.
Playback signal output pin.
When you use built-in speaker amplifier, connect with the SPIN pin.
Power supply pin for rewriting Flash memory.
Fix this pin to GND except when rewriting Flash memory.
Digital power supply pin.
Connect a capacitor of 0.1 F or more between this pin and GND.
Output pin of the regulator for the internal logic power supply.
Connect a electrolytic capacitor of 10 uF or more and a ceramic capacitor of 0.1
F or more between the VDDL and GND pins.
Digital ground pin.
Speaker amplifier ground pin.
Speaker amplifier power supply pin.
Analog input pin of internal speaker amplifier.
Built-in speaker amplifier’s reference voltage output pin.
Connect a capacitor of 0.1 F or more between this pin and GND.
Positive output pin of the built-in speaker amplifier.
Negative output pin of the built-in speaker amplifier.
Notes: 1. Applies to ML22Q340-NNN / ML22Q341-NNN.
8/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
(GND = SPGND = 0 V)
Unit
Digital power supply voltage
Speaker power supply
voltage
Internal logic power supply
voltage
Flash power supply voltage
(Note 1)
VDD
0.3 to +7.0
V
SPVDD
0.3 to +7.0
V
0.3 to +3.6
V
0.3 to +9.5
V
Condition
Ta = 25 °C
VDDL
VPP
Input voltage
VIN
Ta = 25 °C
When JEDEC 2-layer board is
mounted
0.3 to VDD+0.3
V
Power dissipation
PD
Ta = 25 °C
861
mW
ISC1
except LED drive pin,
Ta = 25 °C
12 to +11
mA
ISC2
LED drive pin, Ta = 25 °C
12 to +20
mA
TSTG
—
55 to +150
°C
Output short current
Storage temperature
Note 1: Applies to the ML22Q340-NNN/ML22Q341-NNN.
RECOMMENDED OPERATING CONDITIONS
Symbol
Condition
—
2.3 to 5.5
Digital power supply voltage
VDD
ML22Q340 / ML22Q341 read
2.3 to 5.5
ML22Q340 / ML22Q341 write
2.7 to 5.5
SPVDD
—
2.3 to 5.5
V
Flash power supply voltage
VPP
ML22Q340 / ML22Q341 write
7.7 to 8.3
V
Flash memory rewrite cycles
N
ML22Q340 / ML22Q341
80
—
TOP1
ML22340 / ML22341
40 to +85
TOP2
ML22Q340 / ML22Q341 read
-40 to +85
TOP3
ML22Q340 / ML22Q341 write
Speaker power supply
voltage
Operating temperature
Source oscillation frequency
fOSC
—
Range
(GND = SPGND = 0 V)
Unit
Parameter
V
°C
0 to +40
Min.
Typ.
Max.
3.5
4.096
4.5
MHz
9/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
“H” input voltage
“L” voltage
Symbol
VIH
VIL
“H” output voltage 1
VOH1
“H” output voltage 2
VOH2
“L” output voltage 1
VOL1
“L” output voltage 2
VOL2
“L” output voltage 3
VOL4
“H” input current 1
IIH1
“H” input current 2
IIH2
“H” input current 3
IIH3
“L” input current 1
IIL1
“L” input current 2
IIL2
“L” input current 3
IIL3
Supply current during
operate
Supply current during
power down
IDD1
IDD2
VDD = SPVDD = 2.3 to 5.5 V, GND = SPGND = 0 V, Ta = 40 to +85°C
Condition
Min.
Typ.
Max.
Unit
—
0.7VDD
—
VDD
V
—
IOH = 0.5 mA
CMOS output,
Pch open drain selected
IOH = 100 µA
OSC2 pin
IOL = 0.5 mA
CMOS output,
Nch open drain selected
IOL = 100 µA
OSC1 pin
2.3V
IOL = 8 mA, VDD
LED mode selected
VIH = VDD
High-impedance input selected
VIH = VDD
TEST pin
VIH = VDD
Pull-down input selected
VIL1 = GND
High-impedance input selected
VIL = GND
RESET_N pin
VIH = VDD
Pull-up input selected
Non-loaded output
VDD = SPVDD = 3.0V
Non-loaded output
VDD = SPVDD = 5.0V
0
—
0.3VDD
V
VDD0.5
—
—
V
VDD0.5
—
—
V
—
—
0.5
V
—
—
0.5
V
—
—
0.5
V
—
—
1
µA
0.02
0.3
1.5
mA
2
30
250
µA
1
—
—
µA
1.5
0.3
0.02
mA
250
30
2
µA
—
2.5
12
—
8
12
mA
IDDS1
Ta
40°C
—
0.5
2.0
IDDS2
Ta
85°C
—
0.5
8.0
µA
10/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
Analog Characteristics
Parameter
Symbol
VDD = SPVDD = 2.3 to 5.5 V, GND = SPGND = 0 V, Ta = 40 to +85°C
Condition
Min.
Typ.
Max.
Unit
AOUT output load resistance
RLAO
During 1/2 DVDD output
10
—
—
k
AOUT output voltage range
SG output voltage
SG output resistance
SPM, SPP output load resistance
VAOUT
VSG
RSG
RLSP
1/6VDD
0.95xVDD/2
57
8
—
VDD/2
96

5/6VDD
1.05xVDD/2
135

V
V
k
Speaker amplifier output power
PSPO

1

W
Output offset voltage between SPM
and SPP with no signal present
VOF
No output load



SPVDD=5.0V f=1kHz ,
RSPO=8 THD 10%
SPIN-SPM gain=0dB
8 load
-50

50
mV
11/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
Event Control example
 Event Control example 1 (Only one playback in Play once mode)
Operation:
Only one event specified is executed after event activation.
Control method: Input the event number to be executed to the EVIN0-4 pins.
EVIN0-4
Event n
“00”
Good morning
 Event Control example 2 (Only one playback in Scheduled play mode)
Operation:
Only one specification mode is executed
Control method: Input the event number to be executed to the EVIN0-4 pins. After event activation, input “00” to the
EVIN0-4 pins before event execution is ended.
EVIN0-4
Event n
“00”
Good morning
Good morning
 Event Control example 3 (Repetitive playback in Scheduled play mode)
Operation:
While the EVIN0-4 pin states are held, the event execution is repeated.
In the case of the event execution stop, the event execution is terminated.
Control method: Input the event number to be executed to the EVIN0-4 pins. After event activation, hold the EVIN0-4 pin
states. When desired to stop event execution, input all “0s” to the EVIN0-4 pins.
EVIN0-4
Event n
“00”
Good morning
Good morning
 Event Control example 4 (Change in playback phrase in Scheduled play mode)
Operation:
The event execution specified first is ended and newly specified event execution is started.
Control method: Input the event number to be executed to the EVIN0-4 pins. After event activation, input the event number to
be executed next to the EVIN0-4 pins and hold the EVIN0-4 pin states until the current event execution is
ended.
EVIN0-4
Event n
Event m
Good morning
“00”
Good afternoon
12/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
 Event Control example 5 (Repetitive playback in Change immediately mode)
Operation:
Event execution is performed until the EVIN0-4 pin states are changed. The event execution stops when the
EVIN0-4 pin states are changed.
Control method: Input the event number to be executed to the EVIN0-4 pins. After event activation, hold the EVIN0-4 pin
states while the event execution is to be performed. When desired to stop event execution, input all “0s” to
the EVIN0-4 pins
EVIN0-4
Event n
Good morning
“00”
Good mo
 Event Control example 6 (Change in playback phrase in Change immediately mode)
Operation:
The event execution specified first is ended and newly specified event execution is started.
Control method: Input the event number to be executed to the EVIN0-4 pins. After event activation, input the event number to
be executed next to the EVIN0-4 pins
EVIN0-4
Event m
Event n
Good morning
Good mo
“00”
Good af
13/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
Configuration of Built-in ROM
The built-in ROM consists of the initialization, event management, and speech data areas.
Initialization area
Event management area
Speech data area
Built-in ROM configuration
Notes:
Since the data which exceeds 64 K bytes in one phrage cannot be played, please devide the voice phrase to be set to
each below 64 K bytes, and join those data by the edit phrase function.
14/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
EXAMPLE OF APPLICATION CIRCUIT
RESET_N
EVIN4
EVIN3
EVIN2
EVIN1
EVIN0
TEST
SEQ6
SEQ5
SEQ4
SEQ3
SEQ2
SEQ1
SEQ0
AOUT
SPIN
SPP
SPM
SG
0.1uF
DVDD
24pF
OSC0
4.096MHz
OSC1
3V
SPVDD
GND
24pF
SPGND
0.1uF
VDDL
10uF
15/17
FEDL22340DIGEST-01
ML22Q340/340/Q341/341
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number,
package code and desired mounting conditions (reflow method, temperature and times).
16/17
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NOTICE
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Co., Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and
operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any
damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for
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The technical information specified herein is intended only to show the typical functions of and examples of application
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responsibility whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as
audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical
injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and
fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the
prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely
high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human
injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the
Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a
ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign
Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Copyright 2008 - 2011 LAPIS Semiconductor Co., Ltd.
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