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TPA3101D2
QFN
HTQFP
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
1
FEATURES
•
10-W/ch into an 8-
Ω
Load From a 13-V Supply
•
9.2-W/ch into an 8-
Ω
Load From a 12-V Supply
•
Operates from 10 V to 26 V
•
87% Efficient Class-D Operation Eliminates
Need for Heat Sinks
•
Four Selectable, Fixed Gain Settings
•
Differential Inputs
•
Thermal and Short-Circuit Protection With
Auto Recovery Feature
•
Clock Output for Synchronization With
Multiple Class-D Devices
•
Surface Mount 7 mm
×
7 mm, 48-pin QFN
Package
•
Surface Mount 7 mm
×
7 mm, 48-pin HTQFP
Package
APPLICATIONS
•
Televisions
DESCRIPTION
The TPA3101D2 is a 10-W (per channel) efficient,
Class-D audio power amplifier for driving bridged-tied stereo speakers. The TPA3101D2 can drive stereo speakers as low as 4 Ω . The high efficiency of the
TPA3101D2, 87%, eliminates the need for an external heat sink when playing music.
The gain of the amplifier is controlled by two gain select pins. The gain selections are 20, 26, 32,
36 dB.
The outputs are fully protected against shorts to
GND, V
CC
, and output-to-output shorts with an auto recovery feature and monitor output.
TV Audio
Processor
Shutdown
Control
Mute Control
Gain Select
Sync Control
Fault Flag
10 V to 26 V
Simplified Application Circuit
RINP
RINN
LINN
TPA3101D2
BSRN
ROUTN
ROUTP
BSRP
LINP
SHUTDOWN
MUTE
VCLAMPR
PGNDR
VREG
VBYP
ROSC
GAIN0
GAIN1
MSTR/SLV
SYNC
FAULT
PVCCR
PVCCL
AVCC
AGND
BSLN
LOUTN
LOUTP
BSLP
VCLAMPL
PGNDL
100 kW
10 nF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
TPA3101D2 www.ti.com
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
V
V
T
T
T
R
CC
I
A
J stg
(Load)
Supply voltage AVCC, PVCC
SHUTDOWN, MUTE
Input voltage
GAIN0, GAIN1, RINN, RINP, LINN, LINP, MSTR/SLV,
SYNC
Continuous total power dissipation
Operating free-air temperature range
Operating junction temperature range
(2)
Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Load Resistance
Electrostatic discharge
Human body model
(3)
(all pins)
Machine model
(4)
(all pins)
Charged-device model
(5)
(all pins)
UNIT
–0.3 V to 30 V
–0.3 V to V
CC
+ 0.3 V
–0.3 V to VREG + 0.5 V
See Dissipation Rating Table
–40
°
C to 85
°
C
–40
°
C to 150
°
C
–65
°
C to 150
°
C
260
°
C
3.2
Ω Minimum
±2 kV
±200 V
±500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The TPA3101D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical
Briefs SLMA002 for more information about using the HTQFP thermal pad.
(3) In accordance with JEDEC Standard 22, Test Method A114-B.
(4) In accordance with JEDEC Standard 22, Test Method A115-A
(5) In accordance with JEDEC Standard 22, Test Method C101-A
TYPICAL DISSIPATION RATINGS
PACKAGE
48-pin RGZ (QFN)
48-pin PHP (HTQFP)
T
A
≤ 25
°
C
4.39 W
4.82 W
DERATING FACTOR
35.1 mW/
°
C
(1)
38.6 mW/
°
C
(2)
T
A
= 70
°
C
2.81 W
3.09 W
T
A
= 85
°
C
2.28 W
2.51 W
(1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad.
(2) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more information about using the
HTQFP thermal pad.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V
CC
V
IH
V
IL
I
IH
PARAMETER
Supply voltage
High-level input voltage
Low-level input voltage
High-level input current
TEST CONDITIONS
PVCC, AVCC
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV,
SYNC
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV,
SYNC
SHUTDOWN, V
I
= V
CC
, V
CC
= 24 V
MUTE, V
I
= V
CC
, V
CC
= 24 V
GAIN0, GAIN1, MSTR/SLV, SYNC, V
I
V
CC
= 24 V
= VREG,
MIN
10
2
MAX UNIT
26 V
V
0.8
125
75
2
V
µA
2
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TPA3101D2 www.ti.com
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
RECOMMENDED OPERATING CONDITIONS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
I
IL
V
OH
V
OL f
OSC
T
A
Low-level input current
High-level output voltage
Low-level output voltage
Oscillator frequency
Operating free-air temperature
TEST CONDITIONS
SHUTDOWN, V
I
= 0, V
CC
= 24 V
SYNC, MUTE, GAIN0, GAIN1, MSTR/SLV, V
I
V, V
CC
= 24 V
= 0
FAULT, I
OH
= 1 mA
FAULT, I
OL
= -1 mA
R osc
Resistor = 100 k Ω , MSTR/SLV = 2 V
MIN
VREG - 0.6
200
–40
MAX UNIT
2
1
µA
AGND + 0.4
300
85
V
V kHz
°
C
DC CHARACTERISTICS
T
A
= 25
°
C, V
CC
= 24 V, R
L
= 8 Ω (unless otherwise noted)
| V
OS
|
PSRR
I
CC
I
CC(SD)
I
CC(MUTE) r
DS(on)
G t
ON t
OFF
PARAMETER
Class-D output offset voltage (measured differentially)
Bypass reference for input amplifier
4-V internal supply voltage
DC Power supply rejection ratio
Quiescent supply current
V
I
= 0 V, Gain = 36 dB
VBYP, no load
TEST CONDITIONS
VREG, no load, V
CC
= 10 V to 26 V
V
CC
= 12 V to 24 V, inputs ac coupled to AGND,
Gain = 36 dB
SHUTDOWN = 2 V, MUTE = 0 V, no load, filter or snubber
Quiescent supply current in shutdown mode SHUTDOWN = 0.8 V, no load, filter or snubber
Quiescent supply current in mute mode MUTE = 2 V, no load, filter or snubber
Drain-source on-state resistance
Gain
Gain matching
Turn-on time
Turn-off time
V
T
CC
J
= 12 V, I
= 25
°
C
O
GAIN1 = 0.8 V
= 500 mA,
High Side
Low side
Total
GAIN0 = 0.8 V
GAIN0 = 2 V
GAIN1 = 2 V
GAIN0 = 0.8 V
GAIN0 = 2 V
Between channels
C
(VBYP)
= 1 µF, SHUTDOWN = 2 V
C
(VBYP)
= 1 µF, SHUTDOWN = 0.8 V
MIN TYP MAX UNIT
5 50 mV
1.1
1.25
1.45
3.75
4 4.25
V
V
-70 dB
22 26.5
mA
19
25
31
35
300 400
8 10
µA mA
370
370 m Ω
780 950
20
26
21
27
32
36
33
37
2%
25
0.1
dB dB ms ms
DC CHARACTERISTICS
T
A
= 25
°
C, V
CC
= 12 V, R
L
= 8 Ω (unless otherwise noted)
| V
OS
|
PSRR
I
CC
I
CC(SD)
I
CC(MUTE) r
DS(on)
PARAMETER
Class-D output offset voltage (measured differentially)
Bypass reference for input amplifier
4-V internal supply voltage
DC Power supply rejection ratio
Quiescent supply current
V
I
TEST CONDITIONS
= 0 V, Gain = 36 dB
VBYP, no load
VREG, no load
V
CC
= 12 V to 24 V, Inputs ac coupled to AGND,
Gain = 36 dB
SHUTDOWN = 2 V, MUTE = 0 V, no load, filter or snubber
Quiescent supply current in shutdown mode SHUTDOWN = 0.8 V, no load, filter or snubber
Quiescent supply current in mute mode MUTE = 2 V, no load, filter or snubber
Drain-source on-state resistance
V
T
CC
J
= 12 V, I
= 25
°
C
O
= 500 mA,
High Side
Low side
Total
MIN TYP MAX UNIT
5 50 mV
1.1
1.25
1.45
3.75
4 4.25
-70
V
V dB
18 22.5
mA
180 300
7 9
µA mA
370
370
780 950 m
Ω
Copyright © 2005–2007, Texas Instruments Incorporated
Product Folder Link(s):
TPA3101D2
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3
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
DC CHARACTERISTICS (continued)
T
A
= 25
°
C, V
CC
= 12 V, R
L
= 8 Ω (unless otherwise noted)
PARAMETER
G t
ON t
OFF
Gain
Turn-on time
Turn-off time
GAIN1 = 0.8 V
TEST CONDITIONS
GAIN0 = 0.8 V
GAIN0 = 2 V
GAIN1 = 2 V
GAIN0 = 0.8 V
GAIN0 = 2 V
C
(VBYP)
= 1 µF, SHUTDOWN = 2 V
C
(VBYP)
= 1 µF, SHUTDOWN = 0.8 V
AC CHARACTERISTICS
T
A
= 25
°
C, V
CC
= 24 V, R
L
= 8 Ω (unless otherwise noted)
PARAMETER
K
SVR
Supply ripple rejection
P
O
Continuous output power
THD+N Total harmonic distortion + noise
TEST CONDITIONS
200 mV
PP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND
THD+N = 0.09%, f = 1 kHz (thermally limited) f = 1 kHz, P
O
= 5 W (half-power)
V n
Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
SNR
Crosstalk
Signal-to-noise ratio
Thermal trip point
Thermal hysteresis
V
O
= 1 Vrms, Gain = 20 dB, f = 1 kHz
Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted
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MIN TYP MAX UNIT
19 20 21 dB
25 26 27
31
35
32
36
33
37 dB
25
0.1
ms ms
MIN TYP MAX UNIT
–70 dB
10
0.09%
100
–80
–92
W
102
150
30
µV dBV dB dB
°
C
°
C
AC CHARACTERISTICS
T
A
= 25
°
C, V
CC
= 12 V, R
L
= 8 Ω (unless otherwise noted)
PARAMETER
K
SVR
P
O
Supply ripple rejection
Continuous output power
THD+N Total harmonic distortion + noise
TEST CONDITIONS
200 mV
PP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND
THD+N = 7%, f = 1 kHz
THD+N = 10%, f = 1 kHz
THD+N = 10%, f = 1 kHz, V
CC
= 13 V
THD+N = 0.26%, f = 1 kHz, R
L limited)
= 4 Ω (thermally
R
L
= 8 Ω , f = 1 kHz, P
O
= 4.5 W (half-power)
R
L
= 4 Ω , f = 1 kHz, P
O
= 5 W (half-power)
V n
Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
SNR
Crosstalk
Signal-to-noise ratio
Thermal trip point
Thermal hysteresis
P o
= 1 W, Gain = 20 dB, f = 1 kHz
Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted
MIN TYP MAX UNIT
–70 dB
8.7
9.2
10
10
W
0.08%
0.11%
100
–80
–94
98
150
30
µV dBV dB dB
°
C
°
C
4
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TPA3101D2
Copyright © 2005–2007, Texas Instruments Incorporated
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48 PIN, QFN PACKAGE
(TOP VIEW)
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
48 PIN, HTQFP PACKAGE
(TOP VIEW)
NC
RINN
RINP
AGND
LINP
LINN
NC
GAIN0
GAIN1
MSTR/SLV
SYNC
NC
6
7
1
2
3
4
5
8
9
10
11
12
48 47 46 45 44 43 42 41 40 39 38 37
Exposed
Thermal Pad
13 14 15 16 17 18 19 20 21 22 23 24
36
35
29
28
27
26
25
34
33
32
31
30
NC
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
NC
GND
RINN
RINP
AGND
LINP
LINN
GAIN0
GAIN0
GAIN1
MSTR/SLV
SYNC
GND
48
47 46 45 44 43 42 41 40 39 38 37
8
9
10
11
12
1
4
5
2
3
6
7
Exposed
Thermal Pad
13 14 15 16 17 18 19 20 21 22 23 24
36
35
34
33
32
31
30
29
28
27
26
25
GND
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
GND
TERMINAL FUNCTIONS
MUTE
FAULT
BSLP
PVCCL
LOUTP
PGNDL
LOUTN
BSLN
VCLAMPL
VCLAMPR
BSRN
ROUTN
PGNDR
NAME
SHUTDOWN
RINN
RINP
LINN
LINP
GAIN0
GAIN1
GND
TERMINAL
QFN
NO.
44
2
3
6
5
8
9
45
46
18
26, 27
19, 20
28, 29
21, 22
23
30
31
38
39, 40
32, 33
HTQFP
NO.
44
2
3
6
5
7, 8
9
1, 12, 13,
24, 25, 36,
37
45
46
18
26, 27
19, 20
28, 29
21, 22
23
30
31
38
39, 40
32, 33
Copyright © 2005–2007, Texas Instruments Incorporated
I/O DESCRIPTION
I
I
I
I
I
I
I
I
O
I/O
O
O
I/O
I/O
O
Shutdown signal for IC (LOW = disabled, HIGH = operational). TTL logic levels with compliance to AVCC.
Negative audio input for right channel. Biased at VREG/2.
Positive audio input for right channel. Biased at VREG/2.
Negative audio input for left channel. Biased at VREG/2.
Positive audio input for left channel. Biased at VREG/2.
Gain select least significant bit. TTL logic levels with compliance to VREG.
Gain select most significant bit. TTL logic levels with compliance to VREG.
Connect to the thermal pad.
Mute signal for quick disable/enable of outputs (HIGH = outputs high-Z,
LOW = outputs enabled). TTL logic levels with compliance to AVCC.
TTL compatible output. HIGH = short-circuit fault. LOW = no fault. Only reports short-circuit faults. Thermal faults are not reported on this terminal.
Bootstrap I/O for left channel, positive high-side FET.
Power supply for left channel H-bridge, not internally connected to PVCCR or AVCC.
Class-D 1/2-H-bridge positive output for left channel.
Power ground for left channel H-bridge.
Class-D 1/2-H-bridge negative output for left channel.
Bootstrap I/O for left channel, negative high-side FET.
Internally generated voltage supply for left channel bootstrap capacitor.
Internally generated voltage supply for right channel bootstrap capacitor.
Bootstrap I/O for right channel, negative high-side FET.
Class-D 1/2-H-bridge negative output for right channel.
Power ground for right channel H-bridge.
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TPA3101D2
TPA3101D2
NAME
ROUTP
PVCCR
BSRP
AGND
ROSC
MSTR/SLV
SYNC
VBYP
VREG
AVCC
NC
10
11
16
15
10
11
16
15
47, 48
I
I/O
O
O
Not internally connected.
DESCRIPTION www.ti.com
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
TERMINAL FUNCTIONS (continued)
TERMINAL
QFN
NO.
41, 42
34, 35
43
4, 17
14
HTQFP
NO.
41, 42
34, 35
43
4, 17
14
I/O
O
I/O
I/O
Class-D 1/2-H-bridge positive output for right channel.
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
Bootstrap I/O for right channel, positive high-side FET.
Analog ground for digital/analog cells in core.
I/O for current setting resistor of ramp generator.
Master/Slave select for determining direction of SYNC terminal.
HIGH=Master mode, SYNC terminal is an output; LOW = slave mode,
SYNC terminal accepts a clock input. TTL logic levels with compliance to
VREG.
Clock input/output for synchronizing multiple class-D devices. Direction determined by MSTR/SLV terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up time via external capacitor sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and
MSTR/SLV pins only. Not specified for driving other external circuitry.
High-voltage analog power supply. Not internally connected to PVCCR or
PVCCL.
48
1, 7, 12,
13, 24, 25,
36, 37, 47
Thermal Pad -
Connect to AGND and PGND – should be star point for both grounds.
Internal resistive connection to AGND and PGND. Thermal vias on the PCB should connect this pad to a large copper area on an internal or bottom layer for the best thermal performance. The Thermal Pad must be soldered
to the PCB for mechanical reliability.
6
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VBYP
AVCC
VBYP
AVCC
RINN
RINP
VBYP
Gain
Control
GAIN0
GAIN1
FAULT
ROSC
SYNC
MSTR/SLV
VREG
SHUTDOWN
Gain
Control
8
To Gain Adj.
Blocks and
Startup Logic
MUTE
TLL Input
Buffer
(VCC Compliant)
TLL Input
Buffer
(VCC Compliant)
Ramp
Generator
VREG
LINN
LINP
VBYP
Gain
Control
4V Reg
Gain
Gain
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
FUNCTIONAL BLOCK DIAGRAM
PVCCR
PVCCR
PVCCR
VCLAMPR
BSRN
Gain
Gate
Drive
ROUTN
PWM
Logic
VClamp
Gen
PVCCR
BSRP
Gate
Drive
VBYP
AVCC
Biases and
References
Startup
Protection
Logic
SC
Detect
Thermal
VREG
VREGok
AVCC
VCCok
PWM
Logic
Gate
Drive
Gate
Drive
PVCCL
VClamp
Gen
PVCCL
ROUTP
PGNDR
PVCCL
PVCCL
VCLAMPL
BSLN
LOUTN
BSLP
LOUTP
Gain PGNDL
AGND
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
(1)
THD+N
THD+N
V
CC k
SVR
Total harmonic distortion + noise
Total harmonic distortion + noise
Closed-loop response
Output power
Efficiency
Supply current
Crosstalk
Supply ripple rejection ratio
(1) All graphs were measured using the TPA3101D2 EVM.
vs Frequency vs Output power vs Frequency vs Supply voltage vs Output power vs Total output power vs Frequency vs Frequency
FIGURE
1, 2, 3, 4
5, 6, 7, 8
9, 10
11. 12
13, 14
15, 16
17, 18
19, 20
Copyright © 2005–2007, Texas Instruments Incorporated
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
TOTAL HARMONIC DISTORTION + NOISE vs
FREQUENCY
10
5
2
V
CC
= 12 V,
R = 8
W
,
Gain = 20 dB
1
P
O
= 2.5 W
0.5
0.2
0.1
P
O
= 5 W
0.05
0.02
0.01
0.005
0.003
20
P
O
= 1 W
50 100 200 500 1k 2k f - Frequency - Hz
5k 10k 20k
NOTE: Power above 10 W may require increased heatsinking.
Figure 1.
TOTAL HARMONIC DISTORTION + NOISE vs
FREQUENCY
10
5
2
V
CC
= 24 V,
R = 8
W
,
Gain = 20 dB
1
0.5
0.2
0.1
P
O
= 10 W
0.05
P
O
= 1 W
P
O
= 5 W
0.02
0.01
0.005
0.003
20 50 100 200 500 1k 2k f - Frequency - Hz
5k 10k 20k
NOTE: Power above 10 W may require increased heatsinking.
Figure 3.
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TOTAL HARMONIC DISTORTION + NOISE vs
FREQUENCY
10
5
2
1
V
CC
= 18 V,
R = 8
W
,
Gain = 20 dB
0.5
0.2
0.1
P
O
= 10 W
0.05
0.02
0.01
0.005
0.003
20
P
O
= 1 W
P
O
= 2.5 W
50 100 200 500 1k 2k f - Frequency - Hz
5k 10k 20k
NOTE: Power above 10 W may require increased heatsinking.
Figure 2.
TOTAL HARMONIC DISTORTION + NOISE vs
FREQUENCY
10
5
V
CC
= 12 V,
R = 4
W
,
Gain = 20 dB
2
1
0.5
P
O
= 2.5 W
0.2
0.1
0.05
0.02
0.01
0.005
0.003
20
P
O
= 1 W
50 100 200 500 1k 2k f - Frequency - Hz
5k 10k 20k
NOTE: Power above 10 W may require increased heatsinking.
Figure 4.
8
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TOTAL HARMONIC DISTORTION + NOISE vs
OUTPUT POWER
10
5
V
CC
= 12 V,
R = 8
W
,
Gain = 32 dB
2
1
0.5
1 kHz
10 kHz
0.2
0.1
0.05
0.02
20 Hz
0.01
10m 50m 100m 200m 1 2 5 10 20
P
O
- Output Power - W
40
NOTE: Power above 10 W may require increased heatsinking.
Figure 5.
TOTAL HARMONIC DISTORTION + NOISE vs
OUTPUT POWER
10
5
V
CC
= 24 V,
R = 8
W
,
Gain = 32 dB
2
1
0.5
1 kHz
0.2
0.1
10 kHz
0.05
0.02
20 Hz
0.01
10m 50m 100m 200m 1 2 5 10 20
P
O
- Output Power - W
40
NOTE: Power above 10 W may require increased heatsinking.
Figure 7.
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
TOTAL HARMONIC DISTORTION + NOISE vs
OUTPUT POWER
10
5
V
CC
= 18 V,
R = 8
W
,
Gain = 32 dB
2
1
0.5
1 kHz
10 kHz
0.2
0.1
0.05
0.02
20 Hz
0.01
10m 50m 100m 200m 1 2 5 10 20
P
O
- Output Power - W
40
NOTE: Power above 10 W may require increased heatsinking.
Figure 6.
TOTAL HARMONIC DISTORTION + NOISE vs
OUTPUT POWER
10
5
V
CC
= 12 V,
R = 4
W
,
Gain = 32 dB
2
1
0.5
1 kHz
10 kHz
0.2
0.1
20 Hz
0.05
0.02
0.01
10m 50m 100m 200m 1 2 5 10 20
P
O
- Output Power - W
40
NOTE: Power above 10 W may require increased heatsinking.
Figure 8.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
CLOSED LOOP RESPONSE vs
FREQUENCY
40
35
200
150
Gain
30 100
25 50
Phase
20 0
15
10
V
CC
= 12 V
W
V = 0.1 V rms
-50
-100
5
Gain = 32 dB
RC filter = 100
W
, 10 nF
-150
0
10 100 1 k f - Frequency - Hz
Figure 9.
10 k
-200
100 k
OUTPUT POWER vs
SUPPLY VOLTAGE
37.5
35
32.5
30
27.5
25
22.5
20
17.5
15
12.5
10
7.5
5
10 12
W
Gain = 20 dB
THD+N = 10%
THD+N = 1%
Power Beyond 10 W
May Require More
Heatsinking.
14 16 18 20
V
CC
- Supply Voltage - V
Figure 11.
22 24 26 www.ti.com
CLOSED LOOP RESPONSE vs
FREQUENCY
40
35
200
150
Gain
30 100
25 50
Phase
20 0
15
10
V
CC
= 24 V
W
V = 0.1 V rms
-50
-100
14
12
10
8
6
4
5
0
10
Gain = 32 dB
RC filter = 100
W
, 10 nF
100 1 k f - Frequency - Hz
Figure 10.
10 k
OUTPUT POWER vs
SUPPLY VOLTAGE
20
18
16
W
Gain = 20 dB
THD+N = 10%
THD+N = 1%
2
0
10
Power Beyond 10 W
May Require More
Heatsinking.
-150
-200
100 k
13 11 12
V
CC
- Supply Voltage - V
Figure 12.
10
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EFFICIENCY vs
OUTPUT POWER
100
90
80
70
60
V
CC
= 12 V
V
CC
= 18 V
50
40
V
CC
= 24 V
30
20
10
R
L
= 8 W
Gain = 20 dB
0
0 2 4 6 8 10 12 14 16 18 20
P
O
− Output Power (Per Channel) − W
Figure 13.
SUPPLY CURRENT vs
TOTAL OUTPUT POWER
2.5
R
L
= 8 Ω
Gain = 32 dB
V
CC
= 18 V
2
V
CC
= 12 V
1.5
V
CC
= 24 V
1
0.5
0
0
Power Beyond 10 W
May Require More
Heatsinking.
10 20 30
P
O
− Total Output Power − W
Figure 15.
40
1
0.5
0
0
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
EFFICIENCY vs
OUTPUT POWER
100
90
80
70
60
V
CC
= 12 V
50
40
30
20
10
0
0
R
L
= 4 Ω
Gain = 32 dB
2 4 6 8 10 12 14 15
P
O
− Output Power (Per Channel) − W
Figure 14.
SUPPLY CURRENT vs
TOTAL OUTPUT POWER
2.5
R
L
= 4 Ω
Gain = 32 dB
2
V
CC
= 12 V
1.5
Power Beyond 10 W
May Require More
Heatsinking.
10 20 30
P
O
− Total Output Power − W
Figure 16.
40
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
-40
−60
V
CC
R
L
= 12 V
= 8 Ω
Gain = 20 dB
CROSSTALK vs
FREQUENCY
−80
R to L
−100
L to R
−120
−50
−60
−70
−80
−140
20 100 1k f − Frequency − Hz
Figure 17.
SUPPLY RIPPLE REJECTION RATIO vs
FREQUENCY
0
−10
−20
V
CC
= 12 V
W
Gain = 20 dB
V
(RIPPLE)
= 200 mV
PP
−30
10k 20k
−40
−90
−100
20 10k 20k 100 1k f − Frequency − Hz
Figure 19.
www.ti.com
-40
−60
V
CC
R
L
= 24 V
= 8 Ω
Gain = 20 dB
CROSSTALK vs
FREQUENCY
L to R
−80
−100
R to L
−120
−50
−60
−70
−80
−140
20 100 1k f − Frequency − Hz
Figure 18.
SUPPLY RIPPLE REJECTION RATIO vs
FREQUENCY
0
−10
−20
V
CC
= 18 V
W
Gain = 20 dB
V
(RIPPLE)
= 200 mV
PP
−30
10k 20k
−40
−90
−100
20 10k 20k 100 1k f − Frequency − Hz
Figure 20.
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
APPLICATION INFORMATION
470pF
20 W
470pF
8 W
10 V - 26 V
220nF 220nF
Differential
Analog
Inputs
4-Step
Gain Control
Synchronize Multiple
Class-D Devices
NC
RINN
RINP
AGND
LINP
LINN
NC
GAIN0
GAIN1
MSTR/SLV
SYNC
NC
TPA3101D2
100 kW
10 nF
220nF
470pF
20 W
220nF
470pF
20 W
Figure 21. Stereo Class-D With Differential Inputs (QFN)
NC
10 V - 26 V
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
NC
10 V - 26 V
8 W
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
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10 V - 26 V
470pF
20 W
470pF
20 W
220nF 220nF
Single-Ended
Analog
Inputs
4-Step
Gain Control
Synchronize Multiple
Class-D Devices
NC
RINN
RINP
AGND
LINP
LINN
NC
GAIN0
GAIN1
MSTR/SLV
SYNC
NC
TPA3101D2
100 kW
10 nF
220nF
470pF
20 W
470pF
220nF
20 W
Figure 22. Stereo Class-D With Single-Ended Inputs (QFN)
NC
10 V - 26 V
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
NC
10 V - 26 V
8 W
8 W
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10 V - 26 V
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
470pF
20 W
470pF
20 W
220nF 220nF
8 W
Differential
Analog
Inputs
4-Step
Gain Control
Synchronize Multiple
Class-D Devices
GND
RINN
RINP
AGND
LINP
LINN
GAIN0
GAIN0
GAIN1
MSTR/SLV
SYNC
GND
TPA3101D2
100 kW
10 nF
220nF
470pF
20 W
20 W
470pF
220nF
Figure 23. Stereo Class-D With Differential Inputs (HTQFP)
10 V - 26 V
GND
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
GND
10 V - 26 V
8 W
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
www.ti.com
10 V - 26 V
470pF
20 W
470pF
20 W
220nF
220nF
Single-Ended
Analog
Inputs
4-Step
Gain Control
Synchronize Multiple
Class-D Devices
GND
RINN
RINP
AGND
LINP
LINN
GAIN0
GAIN0
GAIN1
MSTR/SLV
SYNC
GND
TPA3101D2
100 kW
10 nF
220nF
470pF
20 W
470pF
220nF
20 W
Figure 24. Stereo Class-D With Single-Ended Inputs (HTQFP)
10 V - 26 V
GND
PVCCR
PVCCR
PGNDR
PGNDR
VCLAMPR
VCLAMPL
PGNDL
PGNDL
PVCCL
PVCCL
GND
10 V - 26 V
8 W
8 W
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
CLASS-D OPERATION
This section focuses on the class-D operation of the TPA3101D2.
Traditional Class-D Modulation Scheme
The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, V
CC the differential prefiltered output varies between positive and negative V
CC
. Therefore,
, where filtered 50% duty cycle yields
0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in
. Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high, causing high loss and thus causing a high supply current.
OUTP
OUTN
Differential Voltage
Across Load
+12 V
0 V
-12 V
Current
Figure 25. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms into an
Inductive Load With No Input
TPA3101D2 Modulation Scheme
The TPA3101D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage.
However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50% and
OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most of the switching period, greatly reducing the switching current, which reduces any I
2
R losses in the load.
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
OUTP
Differential
Voltage
Across
Load
OUTN
+12 V
0 V
-12 V
Current www.ti.com
Output = 0 V
OUTP
Differential
Voltage
Across
Load
OUTN
+12 V
0 V
-12 V
Output > 0 V
Current
Figure 26. The TPA3101D2 Output Voltage and Current Waveforms Into an Inductive Load
Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 x V
CC
, and the time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive, whereas an LC filter is almost purely reactive.
The TPA3101D2 modulation scheme has little loss in the load without a filter because the pulses are short and the change in voltage is V
CC instead of 2 x V
CC
. As the output power increases, the pulses widen, making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load. The filter has less resistance but higher impedance at the switching frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
When to Use an Output Filter for EMI Suppression
Design the TPA3101D2 without the filter if the traces from amplifier to speaker are short (< 10 cm). Powered speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without a filter.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and
CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high impedance at high frequencies, but low impedance at low frequencies.
Use an LC output filter if there are low frequency (<1 MHz) EMI-sensitive circuits and/or there are long wires from the amplifier to the speaker.
When both an LC filter and a ferrite bead filter are used, the LC filter should be placed as close as possible to the IC followed by the ferrite bead filter.
OUTP
33
m
H
L1
C2
1 mF
OUTN
33 mH
L2
C3
1 mF
Figure 27. Typical LC Output Filter, Cutoff Frequency of 28 kHz, Speaker Impedance = 8
Ω
OUTP
15
m
H
L1
C2
2.2 mF
OUTN
15 mH
L2
C3
2.2 mF
Figure 28. Typical LC Output Filter, Cutoff Frequency of 28 kHz, Speaker Impedance = 4
Ω
Ferrite
Chip Bead
OUTP
1 nF
Ferrite
Chip Bead
OUTN
1 nF
Figure 29. Typical Ferrite Chip Bead Filter (Chip Bead Example: Fair-Rite 2512067007Y3)
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
Using the LC filter in
Figure 27 , the TPA3101D2 EVM passed the FCC Part 15 Class B radiated emissions test
with 21 inch speaker wires. Quasi-peak measurements were taken for the 4 standard test configurations, and the
TPA3101D2 EVM passed with at least 14-dB margin. A plot of the peak measurement for the horizontal rear configuration is shown in
.
National Technical Systems, Plano Tx
Radiated Emissions 30 MHz - 1000 MHz
FCC B Limits
70
30
20
60
50
40
10
0
-10
30 M
FCC B Limit
Peak dB
230 M 430 M f − Frequency − Hz
630 M
Figure 30. Radiated Emissions Prescan 30 MHz - 1000 MHz
830 M
Inductors used in LC filters must be chosen carefully. A significant change in inductance at the peak output current of the TPA3101D2 will cause increased distortion. The change of inductance at currents up to the peak output current must be less than 0.1
μ H per amp to avoid this. Also note that smaller inductors than 33 μ H may cause an increase in distortion above what is shown in preceding graphs of THD versus frequency and output power.
Capacitors used in LC filters must also be chosen carefully. A significant change in capacitance at the peak output voltage of the TPA3101D2 will cause increased distortion. LC filter capacitors should have DC-voltage ratings of at least twice the peak application voltage (the power supply voltage) and should be made of X5R or better material. In all cases, avoid using capacitors with loose temperature ratings like Y5V.
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Adaptive Dynamic Range Control
TPA3101D2
Closest Competitor
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
TPA3101D2
Closest Competitor
Figure 31. 1-kHz Sine Output at 10% THD+N Figure 32. 8-kHz Sine Output at 10% THD+N
The Texas Instruments patent-pending adaptive dynamic range control (ADRC) technology removes the notch inherent in class-D audio power amplifiers when they come out of clipping. This effect is more severe at higher frequencies as shown in
Gain setting via GAIN0 and GAIN1 inputs
The gain of the TPA3101D2 is set by two input terminals, GAIN0 and GAIN1.
The gains listed in
are realized by changing the taps on the input resistors and feedback resistors inside the amplifier. This causes the input impedance (Z
I
) to be dependent on the gain setting. The actual gain settings are controlled by ratios of resistors, so the gain variation from part-to-part is small. However, the input impedance from part-to-part at the same gain may shift by ±20% due to shifts in the actual resistance of the input resistors.
For design purposes, the input network (discussed in the next section) should be designed assuming an input impedance of 12.8 k Ω , which is the absolute minimum input impedance of the TPA3101D2. At the lower gain settings, the input impedance could increase as high as 38.4 k
Ω
GAIN1
0
0
1
1
Table 1. Gain Setting
GAIN0
0
1
0
1
AMPLIFIER GAIN (dB)
TYP
20
26
32
36
INPUT IMPEDANCE
(k Ω )
TYP
32
16
16
16
INPUT RESISTANCE
Changing the gain setting can vary the input resistance of the amplifier from its smallest value, 16 k Ω ±20%, to the largest value, 32 k Ω ±20%. As a result, if a single capacitor is used in the input high-pass filter, the -3 dB or cutoff frequency may change when changing gain steps.
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
www.ti.com
Z f
Input
Signal
C i
IN
Z i
The -3-dB frequency can be calculated using
. Use the Z
I
1 f =
2 p
Z C i i values given in
.
(1)
INPUT CAPACITOR, C
I
In the typical application, an input capacitor (C
I
) is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, C
I and the input impedance of the amplifier (Z
I
) form a high-pass filter with the corner frequency determined in
-3 dB f = c
1
2
p
Z C i i f c
(2)
The value of C
I is important, as it directly affects the bass (low-frequency) performance of the circuit. Consider the example where Z
I is 20 k Ω and the specification calls for a flat bass response down to 20 Hz.
is reconfigured as
.
1
C = i
2 p
Z f i c
(3)
In this example, C
I is 0.4 µF; so, one would likely choose a value of 0.47
the gain is known and is constant, use Z
I from
to calculate C
I
μ
F as this value is commonly used. If
. A further consideration for this capacitor is the leakage path from the input source through the input network (C
I
) and the feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at 2 V, which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in the application. Additionally, lead-free solder can create dc offset voltages and it is important to ensure that boards are cleaned properly.
Power Supply Decoupling, C
S
The TPA3101D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1
μ
F to 1 µF placed as close as possible to the device V
CC lead works best. For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 220 μ F or greater placed near the audio power amplifier is recommended. The 220
μ
F capacitor also serves as local storage capacitor for supplying current during large signal transients on the amplifier outputs. The PVCC terminals provide the power to the output transistors, so a 220 µF or larger capacitor should be placed on each PVCC terminal. A 10 µF capacitor on the AVCC terminal is adequate.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
IC Output Snubbers
In
Figure 33 , the 470-pF capacitors in series with 20-
Ω resistors from the outputs of the TPA3101D2 IC to ground are switching snubbers. They linearize switching transitions and reduce overshoot and ringing. By doing so they improve THD+N at lower power levels and they improve EMC by 2 to 4 dB at middle frequencies. They increase quiescent current by 3 to 12 mA depending on power supply voltage.
OUTP
OUTN
470 pF
20 W
470 pF
20 W
Figure 33. IC Output Snubbers
BSN and BSP Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the high side of each output to turn on correctly. A 220-nF ceramic capacitor, rated for at least 25 V, must be connected from each output to its corresponding bootstrap input. Specifically, one 220-nF capacitor must be connected from xOUTP to BSxx, and one 220-nF capacitor must be connected from xOUTN to BSxx. (See the application circuit diagram in
.)
The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs turned on.
VCLAMP Capacitors
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two internal regulators clamp the gate voltage. Two 1μ F capacitors must be connected from VCLAMPL (pin 30) and
VCLAMPR (pin 31) to ground and must be rated for at least 16 V. The voltages at the VCLAMP terminals may vary with V
CC and may not be used for powering any other circuitry.
Internal Regulated 4-V Supply (VREG)
The VREG terminal (pin 15) is the output of an internally generated 4-V supply, used for the oscillator, preamplifier, and gain control circuitry. It requires a 10-nF capacitor, placed close to the pin, to keep the regulator stable.
This regulated voltage can be used to control GAIN0, GAIN1, MSTR/SLV, and MUTE terminals, but should not be used to drive external circuitry.
VBYP Capacitor Selection
The internal bias generator (VBYP) nominally provides a 1.25-V internal bias for the preamplifier stages. The external input capacitors and this internal reference allow the inputs to be biased within the optimal common-mode range of the input preamplifiers.
The selection of the capacitor value on the VBYP terminal is critical for achieving the best device performance.
During power up or recovery from the shutdown state, the VBYP capacitor determines the rate at which the amplifier starts up. When the voltage on the VBYP capacitor equals VBYP, the device starts a 16.4-ms timer.
When this timer completes, the outputs start switching. The charge rate of the capacitor is calculated using the standard charging formula for a capacitor, I = C x dV/dT. The charge current is nominally equal to 250µA and dV is equal to VBYP. For example, a 1-µF capacitor on VBYP would take 5 ms to reach the value of VBYP and begin a 16.4-ms count before the outputs turn on. This equates to a turn-on time of <30 ms for a 1-µF capacitor on the VBYP terminal.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
A secondary function of the VBYP capacitor is to filter high-frequency noise on the internal 1.25-V bias generator.
A value of at least 0.47µF is recommended for the VBYP capacitor. For the best power-up and shutdown pop performance, the VBYP capacitor should be greater than or equal to the input capacitors.
ROSC Resistor Selection
The resistor connected to the ROSC terminal controls the class-D output switching frequency using
1
F
OSC
=
2 x ROSC x COSC
(4)
COSC is an internal capacitor that is nominally equal to 20 pF. Variation over process and temperature can result in a ±15% change in this capacitor value.
For example, if ROSC is fixed at 100 k Ω , the frequency from device to device with this fixed resistance could vary from 217 kHz to 294 kHz with a 15% variation in the internal COSC capacitor. The tolerance of the ROSC resistor should also be considered to determine the range of expected switching frequencies from device to device. It is recommended that 1% tolerance resistors be used.
Differential Input
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To use the TPA3101D2 with a differential source, connect the positive lead of the audio source to the INP input and the negative lead from the audio source to the INN input. To use the TPA3101D2 with a single-ended source, ac ground the INP or INN input through a capacitor equal in value to the input capacitor on INN or INP and apply the audio source to either input. In a single-ended input application, the unused input should be ac grounded at the audio source instead of at the device input for best noise performance.
SHUTDOWN OPERATION
The TPA3101D2 employs a shutdown mode of operation designed to reduce supply current (I
CC
) to the absolute minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling
SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state. Never leave
SHUTDOWN unconnected, because amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown or mute mode prior to removing the power supply voltage.
MUTE Operation
The MUTE pin is an input for controlling the output state of the TPA3101D2. A logic high on this terminal disables the outputs. A logic low on this pin enables the outputs. This terminal may be used as a quick disable/enable of outputs when changing channels on a television or transitioning between different audio sources.
The MUTE terminal should never be left floating. For power conservation, the SHUTDOWN terminal should be used to reduce the quiescent current to the absolute minimum level.
The MUTE terminal can also be used with the FAULT output to automatically recover from a short-circuit event.
When a short-circuit event occurs, the FAULT terminal transitions high indicating a short-circuit has been detected. When directly connected to MUTE, the MUTE terminal transitions high, and clears the internal fault flag. This causes the FAULT terminal to cycle low, and normal device operation resumes if the short-circuit is removed from the output. If a short remains at the output, the cycle continues until the short is removed.
If external MUTE control is desired, and automatic recovery from a short-circuit event is also desired, an OR gate can be used to combine the functionality of the FAULT output and external MUTE control, see
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External GPIO
Control
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
TPA3101D2
MUTE
FAULT
Figure 34. External MUTE Control
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
MSTR/SLV and SYNC operation
The MSTR/SLV and SYNC terminals can be used to synchronize the frequency of the class-D output switching.
When the MSTR/SLV terminal is high, the output switching frequency is determined by the selection of the resistor connected to the ROSC terminal (see ROSC Resistor Selection). The SYNC terminal becomes an output in this mode, and the frequency of this output is also determined by the selection of the ROSC resistor. This TTL compatible, push-pull output can be connected to another TPA3101D2, configured in the slave mode. The output switching is synchronized to avoid any beat frequencies that could occur in the audio band when two class-D amplifiers in the same system are switching at slightly different frequencies.
When the MSTR/SLV terminal is low, the output switching frequency is determined by the incoming square wave on the SYNC input. The SYNC terminal becomes an input in this mode and accepts a TTL compatible square wave from another TPA3101D2 configured in the master mode or from an external GPIO. If connecting to an external GPIO, recommended frequencies are 200 kHz to 300 kHz for proper device operation, and the maximum amplitude is 4 V.
USING LOW-ESR CAPACITORS
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance, the more the real capacitor behaves like an ideal capacitor.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
The TPA3101D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during output-to-output shorts, output-to-GND shorts, and output-to-V
CC shorts. When a short circuit is detected on the outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the voltage on the SHUTDOWN pin or MUTE pin. This clears the short-circuit flag and allows for normal operation if the short was removed. If the short was not removed, the protection circuitry again activates.
The FAULT terminal can be used for automatic recovery from a short-circuit event, or used to monitor the status with an external GPIO. For automatic recovery from a short-circuit event, connect the FAULT terminal directly to the MUTE terminal. When a short-circuit event occurs, the FAULT terminal transitions high indicating a short-circuit has been detected. When directly connected to MUTE, the MUTE terminal transitions high, and clears the internal fault flag. This causes the FAULT terminal to cycle low, and normal device operation resumes if the short-circuit is removed from the output. If a short remains at the output, the cycle continues until the short is removed. If external MUTE control is desired, and automatic recovery from a short-circuit event is also desired, an OR gate can be used to combine the functionality of the FAULT output and external MUTE control, see
THERMAL PROTECTION
Thermal protection on the TPA3101D2 prevents damage to the device when the internal die temperature exceeds 150
°
C. There is a ±15
°
C tolerance on this trip point from device to device. Once the die temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30
°
C. The device begins normal operation at this point with no external system interaction.
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
Because the TPA3101D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit board (PCB) should be optimized according to the following guidelines for the best possible performance.
•
Decoupling capacitors—The high-frequency 1µF decoupling capacitors should be placed as close to the
PVCC (pins 26, 27, 34, and 35) and AVCC (pin 48) terminals as possible. The VBYP (pin 16) capacitor,
VREG (pin 15) capacitor, and VCLAMP (pins 30 and 31) capacitor should also be placed as close to the device as possible. Large (220 µF or greater) bulk power supply decoupling capacitors should be placed near the TPA3101D2 on the PVCCL, PVCCR, and AVCC terminals.
•
Grounding—The AVCC (pin 48) decoupling capacitor, VREG (pin 15) capacitor, VBYP (pin 16) capacitor, and
ROSC (pin 14) resistor should each be grounded to analog ground (AGND, pin 17). The PVCC decoupling capacitors and VCLAMP capacitors should each be grounded to power ground (PGND, pins 28, 29, 32, and
33). Analog ground and power ground should be connected at the thermal pad, which should be used as a central ground connection or star ground for the TPA3101D2.
•
Output filter—The ferrite EMI filter ( Figure 29
) should be placed as close to the output terminals as possible
for the best EMI performance. The LC filter ( Figure 27
and
Figure 28 ) should be placed close to the outputs.
The capacitors used in both the ferrite and LC filters should be grounded to power ground. If both filters are used, the LC filter should be placed first, following the outputs.
•
Thermal Pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal reliability. The dimensions of the thermal pad and thermal land should be 5,1 mm by 5,1 mm. Five rows of solid vias (five vias per row, 0,3302 mm or 13 mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias. See TI Technical Briefs
SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical Briefs
SLMA002 for more information about using the HTQFP thermal pad. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3101D2 Evaluation Module (TPA3101D2EVM) User Manual, (SLOU179).
Both the EVM user manual and the thermal pad application note are available on the TI Web site at http://www.ti.com.
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SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
BASIC MEASUREMENT SYSTEM
This application note focuses on methods that use the basic equipment listed below:
•
Audio analyzer or spectrum analyzer
•
Digital multimeter (DMM)
•
Oscilloscope
•
Twisted-pair wires
•
Signal generator
•
Power resistor(s)
•
Linear regulated power supply
•
Filter components
•
EVM or other complete audio circuit
shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine wave is normally used as the input signal because it consists of the fundamental frequency only (no other harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to reduce the noise and distortion injected into the APA through the power pins. A System Two audio measurement system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one package.
The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling capacitors, (C
IN
), so no additional coupling is required. The generator output impedance should be low to avoid attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the analyzer-input impedance should be high. The output resistance, R
OUT milliohms and can be ignored for all but the power-related calculations.
, of the APA is normally in the hundreds of
output. This amplifier circuit can be directly connected to the AP-II or other analyzer input.
This is not true of the class-D amplifier system shown in
(b), which requires low-pass filters in most cases in order to measure the audio output waveforms. This is because it takes an analog input signal and converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some analyzers.
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Power Supply
TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
Signal
Generator
APA R
L
Analyzer
20 Hz - 20 kHz
Signal
Generator
Power Supply
(a) Basic Class-AB
Class-D APA
R
L
(See note A)
Low-Pass RC
Filter
Low-Pass RC
Filter
Analyzer
20 Hz - 20 kHz
(b) Filter-Free and Traditional Class-D
A.
For efficiency measurements with filter-free Class-D, R
L should be an inductive load like a speaker.
Figure 35. Audio Measurement Systems
The TPA3101D2 uses a modulation scheme that does not require an output filter for operation, but they do sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer can measure the output sine wave.
DIFFERENTIAL INPUT AND BTL OUTPUT
All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs.
Differential inputs have two input pins per channel and amplify the difference in voltage between the pins.
Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180 degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling the output power to the load and eliminating a dc blocking capacitor.
A block diagram of the measurement circuit is shown in
Figure 36 . The differential input is a balanced input,
meaning the positive (+) and negative (-) pins have the same impedance to ground. Similarly, the BTL output equates to a balanced output.
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
Generator
V
GEN
R
GEN
R
GEN
C
IN
Evaluation Module
Audio Power
Amplifier
C
IN
R
IN
R
OUT
R
IN
R
OUT
R
L
Low-Pass
RC Filter
Low-Pass
RC Filter
R
ANA
R
ANA
Analyzer
C
ANA
C
ANA www.ti.com
Twisted-Pair Wire Twisted-Pair Wire
Figure 36. Differential Input, BTL Output Measurement Circuit
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise in the circuit and providing the most accurate measurement.
The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs:
•
Use a balanced source to supply the input signal.
•
Use an analyzer with balanced inputs.
•
Use twisted-pair wire for all connections.
•
Use shielding when the system environment is noisy.
•
Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the large currents (see
).
shows the recommended wire size for the power supply and load cables of the APA system. The real concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations are based on 12-inch long wire with a 20-kHz sine-wave signal at 25
°
C.
P
OUT
(W)
10
2
1
< 0.75
Table 2. Recommended Minimum Wire Size for Power Cables
R
L
( Ω )
8
8
4
4
18
18
22
22
AWG Size
22
22
28
28
DC POWER LOSS
(MW)
16 40
3.2
2
1.5
8
8
6.1
AC POWER LOSS
(MW)
18 42
3.7
2.1
1.6
8.5
8.1
6.2
CLASS-D RC LOW-PASS FILTER
An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff frequency is set above the audio band. The high frequency of the square wave has negligible impact on measurement accuracy because it is well above the audible frequency range, and the speaker cone cannot respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx).
The component values of the RC filter are selected using the equivalent output circuit as shown in
L is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be available and substituted for R
ANA and C
ANA
. The filter components, R
FILT and C
FILT
, can then be derived for the system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin to minimize ground loops.
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TPA3101D2
SLOS473B – DECEMBER 2005 – REVISED SEPTEMBER 2007
R
L
Load
V
L
= V
IN
C
ANA
R
ANA
C
ANA
R
ANA
AP Analyzer Input RC Low-Pass Filters
R
FILT
C
FILT
V
OUT
R
FILT
C
FILT
To APA
GND
Figure 37. Measurement Low-Pass Filter Derivation Circuit-Class-D APAs
The transfer function for this circuit is shown in
where
ω
C
EQ
= (C
FILT
+ C
ANA
). The filter frequency should be set above f
MAX
O
= R
EQ
C
EQ
, R
EQ
= R
FILT
|| R
ANA and
, the highest frequency of the measurement bandwidth, to avoid attenuating the audio signal.
provides this cutoff frequency, f
C
. The value of R
FILT must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize the attenuation of the analyzer-input voltage through the voltage divider formed by R
FILT that R
FILT should be small (~100 Ω ) for most measurements. This reduces the measurement error to less than
1% for R
ANA
≥
10 k
Ω
.
and R
ANA
. A general rule is
(
V
OUT
V
IN
)
=
(
R
ANA
R
ANA
1 + j
(
+ R
FILT w
)
)
(5) w
O f = c
Ö
2 x f max
(6)
An exception occurs with the efficiency measurements, where R
FILT must be increased by a factor of ten to reduce the current shunted through the filter. C
FILT must be decreased by a factor of ten to maintain the same cutoff frequency. See
for the recommended filter component values.
Once f
C is determined and R
FILT is selected, the filter capacitance is calculated using . When the calculated value is not available, it is better to choose a smaller capacitance value to keep f
C above the minimum desired value calculated in
.
C
FILT
=
1
2 p x f x R c FILT
(7)
shows recommended values of R
FILT and C was originally calculated to be 28 kHz for an f
MAX
FILT based on common component values. The value of f
C of 20 kHz. C
FILT
, however, was calculated to be 57,000 pF, but the nearest values of 56,000 pF and 51,000 pF were not available. A 47,000-pF capacitor was used instead, and f
C is 34 kHz, which is above the desired value of 28 kHz.
Table 3. Typical RC Measurement Filter Values
MEASUREMENT
Efficiency
All other measurements
R
FILT
1000 Ω
100 Ω
C
FILT
5,600 pF
56,000 pF
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PACKAGE OPTION ADDENDUM
20-Aug-2007
PACKAGING INFORMATION
Orderable Device
TPA3101D2PHP
TPA3101D2PHPG4
TPA3101D2PHPR
TPA3101D2PHPRG4
TPA3101D2RGZR
TPA3101D2RGZRG4
TPA3101D2RGZT
TPA3101D2RGZTG4
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
HTQFP
HTQFP
HTQFP
HTQFP
QFN
QFN
QFN
QFN
Package
Drawing
PHP
PHP
PHP
PHP
RGZ
RGZ
RGZ
RGZ
Eco Plan
(2)
Pins Package
Qty
48 250 Green (RoHS & no Sb/Br)
Lead/Ball Finish MSL Peak Temp
(3)
CU NIPDAU Level-3-260C-168 HR
48 CU NIPDAU Level-3-260C-168 HR
48
250 Green (RoHS & no Sb/Br)
1000 Green (RoHS & no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
48 CU NIPDAU Level-3-260C-168 HR
48
48
48
48
1000 Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br)
250 Green (RoHS & no Sb/Br)
250 Green (RoHS & no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
11-Mar-2008
*All dimensions are nominal
Device
TPA3101D2PHPR
TPA3101D2RGZR
TPA3101D2RGZT
Package
Type
Package
Drawing
HTQFP
QFN
QFN
PHP
RGZ
RGZ
Pins
48
48
48
SPQ
1000
2500
250
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
330.0
16.4
330.0
180.0
16.4
16.4
A0 (mm)
9.6
7.3
7.3
B0 (mm)
9.6
7.3
7.3
K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
1.5
1.5
1.5
12.0
16.0
12.0
16.0
12.0
16.0
Q2
Q2
Q2
Pack Materials-Page 1
www.ti.com
PACKAGE MATERIALS INFORMATION
11-Mar-2008
*All dimensions are nominal
Device
TPA3101D2PHPR
TPA3101D2RGZR
TPA3101D2RGZT
Package Type Package Drawing Pins
HTQFP
QFN
QFN
PHP
RGZ
RGZ
48
48
48
SPQ
1000
2500
250
Length (mm) Width (mm) Height (mm)
346.0
346.0
190.5
346.0
346.0
212.7
33.0
33.0
31.8
Pack Materials-Page 2
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Table of contents
- 1 FEATURES
- 1 APPLICATIONS
- 1 DESCRIPTION
- 2 ABSOLUTE MAXIMUM RATINGS
- 2 TYPICAL DISSIPATION RATINGS
- 2 RECOMMENDED OPERATING CONDITIONS
- 3 DC CHARACTERISTICS
- 3 DC CHARACTERISTICS
- 4 AC CHARACTERISTICS
- 4 AC CHARACTERISTICS
- 7 TYPICAL CHARACTERISTICS
- 13 APPLICATION INFORMATION
- 17 CLASS-D OPERATION
- 17 Traditional Class-D Modulation Scheme
- 17 TPA3101D2 Modulation Scheme
- 18 Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
- 18 When to Use an Output Filter for EMI Suppression
- 21 Adaptive Dynamic Range Control
- 21 Gain setting via GAIN0 and GAIN1 inputs
- 21 INPUT RESISTANCE
- 22 INPUT CAPACITOR, CI
- 22 Power Supply Decoupling, CS
- 23 IC Output Snubbers
- 23 BSN and BSP Capacitors
- 23 VCLAMP Capacitors
- 23 Internal Regulated 4-V Supply (VREG)
- 23 VBYP Capacitor Selection
- 24 ROSC Resistor Selection
- 24 Differential Input
- 24 SHUTDOWN OPERATION
- 24 MUTE Operation
- 26 MSTR/SLV and SYNC operation
- 26 USING LOW-ESR CAPACITORS
- 27 SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
- 27 THERMAL PROTECTION
- 27 PRINTED-CIRCUIT BOARD (PCB) LAYOUT
- 28 BASIC MEASUREMENT SYSTEM
- 29 DIFFERENTIAL INPUT AND BTL OUTPUT
- 30 CLASS-D RC LOW-PASS FILTER