TFP510

TFP510
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
D Digital Visual Interface (DVI) Compliant1
D Supports Resolutions From VGA to UXGA
D
D
(25-MHz–165-MHz Pixel Rates)
D Universal Graphics Controller Interface
D
D
− 12-Bit, Dual-Edge and 24-Bit,
Single-Edge Input Modes
− Adjustable 1.1-V to 1.8-V and Standard
3.3-V CMOS Input Signal Levels
− Fully Differential and Single-Ended Input
Clocking Modes
− Standard Intel 12-Bit Digital Video Port
Compatible as on Intel 81x Chipsets
Enhanced PLL Noise Immunity
− On-Chip Regulators and Bypass
Capacitors for Reducing Systems Costs
Enhanced Jitter Performance
D
D
D
D
D
− No HSYNC Jitter Anomaly
− Negligible Data-Dependent Jitter
Programmable Using I2C Serial Interface
Monitor Detection Through Hot-Plug and
Receiver Detection
Single 3.3-V Supply Operation
64-Pin TQFP Using TI’s PowerPAD
Package
TI’s Advanced 0.18 µm EPIC-5 CMOS
Process Technology
Pin Compatible With SiI164 and SiI168 DVI
Transmitters
High-Bandwidth Digital Content Protection
(HDCP) Specifications Compliant2
description
The TFP510 is a Texas Instruments PanelBus flat panel display product, part of a comprehensive family of
end-to-end DVI 1.0 compliant solutions, targeted at the PC and consumer electronics industry.
The TFP510 provides a universal interface to allow a glueless connection to most commonly available graphics
controllers. Some of the advantages of this universal interface include selectable bus widths, adjustable signal
levels, and differential and single-ended clocking. The adjustable 1.1-V to 1.8-V digital interface provides a
low-EMI, high-speed bus that connects seamlessly with 12-bit or 24-bit interfaces. The DVI interface supports
flat panel display resolutions up to UXGA at 165 MHz in 24-bit true color pixel format.
The TFP510 combines PanelBus circuit innovation with TI’s advanced 0.18 µm EPIC-5 CMOS process
technology and TI’s ultralow ground inductance PowerPAD package. The result is a compact 64-pin TQFP
package providing a reliable, low-noise, high-speed digital interface solution.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Footnotes:
1.
The digital visual interface (DVI) specification is an industry standard developed by the digital display working group (DDWG) for
high-speed digital connection to digital displays. The TFP510 is compliant to the digital visual interface (DVI) Revision 1.0
specification. The DVI 1.0 specification has been adopted by the industry leading PC and consumer electronics manufacturers.
2.
.The high−bandwidth digital content protection system (HDCP) is an industry standard for protecting DVI outputs from being copied.
HDCP was developed by Intel Corporation and is licensed by the Digital Content Protection, LLC. The TFP510 is compliant to the
HDCP Rev. 1.0 specification.
PanelBus, PowerPAD, and EPIC-5 are trademarks of Texas Instruments.
Intel is a trademark of Intel Corporation.
Copyright  2002, Texas Instruments Incorporated
!"# $%
$ ! ! & ' $$ ()% $ !* $ #) #$
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This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,
preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
pin assignments
DGND
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
RESERVED
RESERVED
DVDD
PAP PACKAGE
(TOP VIEW)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
32
49
50
31
51
30
52
29
53
28
54
27
55
26
56
25
57
24
58
23
59
22
60
21
61
20
62
19
63
18
64
1 2
3 4
5
17
6 7 8 9 10 11 12 13 14 15 16
DVDD
DE
VREF
HSYNC
VSYNC
DK3
MDA/DK2
MCL/DK1
EDGE/HTPLG
PD
MSEN
DVDD
ISEL/RST
DSEL/SDA
BSEL/SCL
DGND
NC
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
IDCK−
IDCK+
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
DGND
2
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TGND
TX2+
TX2−
TVDD
TX1+
TX1−
TGND
TX0+
TX0−
TVDD
TXC+
TXC−
TGND
TFADJ
PVDD
PGND
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
functional block diagram
Universal Input
IDCK±
DATA[23:0]
DE
VSYNC
12-/24-Bit
I/F
HSYNC
VREF
HDCP
Encryption
Data
Format
T.M.D.S. Transmitter
HDCP
Cipher
Encoder
Serializer
TX2±
Encoder
Serializer
TX1±
Encoder
Serializer
TX0±
Control
TXC±
EDGE/HTPLG
MSEN
PD
ISEL/RST
TFADJ
I2C Slave I/F
For DDC
BSEL/SCL
DSEL/SDA
1.8-V Regulators
With Bypass
Capacitors
I2C Master I/F
For EEPROM
MDA/DK2
MCL/DK1
PLL
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Input Pins
DATA[23:12]
36−47
I
The upper 12 bits of the 24-bit pixel bus.
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the top half of the 24-bit pixel bus.
In 12-bit, dual-edge input mode (BSEL = low), these bits are not used to input pixel data. In this mode,
the state of DATA[23:16] is input to the I2C register CFG. This allows 8 bits of user configuration data to
be read by the graphics controller through the I2C interface (see the I2C register descriptions section).
Note: All unused data inputs should be tied to GND or VDD.
DATA[11:0]
50−55,
58−63
I
The lower 12 bits of the 24-bit pixel bus/12-bit pixel bus input.
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the bottom half of the 24-bit pixel bus.
In 12-bit, dual-edge input mode (BSEL = low), this bus inputs 1/2 a pixel (12 bits) at every latch edge
(both rising and falling) of the clock.
DE
2
I
Data enable. As defined in the DVI 1.0 specification, the DE signal allows the transmitter to encode pixel
data or control data on any given input clock cycle. During active video (DE = high), the transmitter
encodes pixel data, DATA[23:0]. During the blanking interval (DE = low), the transmitter encodes
HSYNC, VSYNC, and CTL[3:1].
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Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
The operation of these three multifunction inputs depends on the setting of the ISEL (pin 13) input. All
three inputs support 3.3-V CMOS signal levels and contain weak pulldown resistors so that if left
unconnected they default to all low.
When the I2C bus is disabled (ISEL = low), then these three inputs become the de-skew inputs, DK[3:1],
used to adjust the setup and hold times of the pixel data inputs, DATA[23:0], relative to the clock input,
IDCK±.
When the I2C bus is enabled (ISEL = high), MDA and MCL are open-drain I/O pins used for the I2C
interface to the key EEPROM, which can be used by the HDCP. In this case, MCL is the memory clock
signal, while MDA is the memory data signal. The DK3 pin is not used in this mode. Pins 7−8 require a
5-kΩ resistor connected to VDD when used for EEPROM I2C interface.
Input Pins (Continued)
DK3
MDA/DK2
MCL/DK1
6
7
8
I/O
HSYNC
4
I
Horizontal sync input
IDCK−
IDCK+
56
57
I
Differential clock input. The TFP510 supports both single-ended and fully differential clock input modes.
In the single-ended clock input mode, the IDCK+ input (pin 57) should be connected to the single-ended
clock source and the IDCK input (pin 56) should be tied to GND. In the differential clock input mode, the
TFP510 uses the crossover point between the IDCK+ and IDCK− signals as the timing reference for
latching incoming data DATA[23:0], DE, HSYNC, and VSYNC. The differential clock input mode is only
available in the low-signal-swing mode.
VSYNC
5
I
Vertical sync input
Configuration/Programming Pins
BSEL/SCL
15
I/O
Input bus select / I2C clock input. The operation of this pin depends on whether the I2C interface is
enabled or disabled. This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), a high level selects 24-bit input, single-edge input mode. A low level
selects 12-bit input, dual-edge input mode.
When I2C is enabled (ISEL = high), this pin functions as the I2C clock input (see the I2C register
descriptions section). In this configuration, this pin has an open-drain output that requires an external
5-kΩ pullup resistor connected to VDD.
DSEL/SDA
14
I/O
DSEL/I2C data. The operation of this pin depends on whether the I2C interface is enabled or disabled.
This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), this pin is used with BSEL and VREF to select the single-ended or
differential input clock mode (see the universal graphics controller interface modes section).
When I2C is enabled (ISEL = high), this pin functions as the I2C bidirectional data line. In this
configuration, this pin has an open-drain output that requires an external 5-kΩ pullup resistor connected
to VDD.
Edge select/hot plug input. The operation of this pin depends on whether the I2C interface is enabled or
disabled. This input is 3.3-V tolerant only.
When I2C is disabled (ISEL = low), a high level selects the primary latch to occur on the rising edge of the
input clock IDCK+. A low level selects the primary latch to occur on the falling edge of the input clock
IDCK+. This is the case for both single-ended and differential input clock modes.
When I2C is enabled (ISEL = high), this pin is used to monitor the hot plug detect signal (see the DVI or
VESA P&D and DFP standards). When used for hot-plug detection, this pin requires a series 1-kΩ
resistor.
I2C interface select / I2C RESET (active low, asynchronous).
EDGE/HTPLG
9
I
ISEL/RST
13
I
If ISEL is high, then the I2C interface is active. Default values for the I2C registers can be found in the I2C
register descriptions section.
If ISEL is low, then I2C is disabled and the chip configuration is specified by the configuration pins
(BSEL, DSEL, EDGE, VREF) and state pins (PD, DKEN).
If ISEL is brought low and then back high, the I2C state machine is reset. The register values are
changed to their default values and are not preserved from before the reset.
4
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Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Configuration/Programming Pins (Continued)
MSEN
11
O
PD
10
I
VREF
3
I
Monitor sense/programmable output 1. The operation of this pin depends on whether the I2C interface is
enabled or disabled. This pin has an open-drain output and is only 3.3-V tolerant. An external 5-kΩ
pullup resistor connected to VDD is required on this pin.
When I2C is disabled (ISEL = low), a low level indicates a powered on receiver is detected at the
differential outputs. A high level indicates a powered-on receiver is not detected. This function is valid
only in dc-coupled systems.
When I2C is enabled (ISEL = high), this output is programmable through the I2C interface (see the I2C
register descriptions).
Power down (active low). In the power-down state only the digital I/O buffers and I2C interface remain
active.
When I2C is disabled (ISEL = low), a high level selects the normal operating mode. A low level selects
the power-down mode.
When I2C is enabled (ISEL = high), the power-down state is selected through I2C. In this configuration,
the PD pin should be tied to GND.
Note: The default register value for PD is low, so the device is in power-down mode when I2C is first
enabled or after an I2C RESET.
Input reference voltage. Selects the swing range of the digital data inputs (DATA[23:0], DE, HSYNC,
VSYNC, and IDCK±).
For high-swing 3.3-V input signal levels, VREF should be tied to VDD.
For low-swing input signal levels, VREF should be set to half of the maximum input voltage level. See the
recommended operating conditions section for the allowable range for VREF.
The desired VREF voltage level is typically derived using a simple voltage divider circuit.
Reserved
NC
RESERVED
49
I
No connection required. If connected, tie high.
34, 35
I
These pins are reserved and must be tied to GND for normal operation.
DVI Differential Signal Output Pins
TFADJ
19
I
Full-scale adjust. This pin controls the amplitude of the DVI output voltage swing, determined by the
value of the pullup resistor RTFADJ connected to TVDD.
TX0+
TX0−
25
24
O
Channel-0 DVI differential output pair. TX0± transmits the 8-bit blue pixel data during active video and
HSYNC and VSYNC during the blanking interval.
TX1+
TX1−
28
27
O
Channel-1 DVI differential output pair. TX1± transmits the 8-bit green pixel data during active video and
CTL[1] during the blanking interval.
TX2+
TX2−
31
30
O
Channel-2 DVI differential output pair. TX2± transmits the 8-bit red pixel data during active video and
CTL[3:2] during the blanking interval.
TXC+
TXC−
22
21
O
DVI differential output clock.
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PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Power and Ground Pins
DGND
16, 48, 64
Digital ground
DVDD
1, 12, 33
Digital power supply. Must be set to 3.3 V nominal
PGND
17
PLL ground
PVDD
TGND
18
PLL power supply. Must be set to 3.3 V nominal
20, 26, 32
TVDD
23, 29
Transmitter differential output driver ground
Transmitter differential output driver power supply. Must be set to 3.3 V nominal
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, DVDD, PVDD, TVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
Input voltage, logic/analog signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
External DVI single-ended termination resistance, r(T) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 Ω to open circuit
External TFADJ resistance, r(TFADJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Ω to open circuit
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Case temperature for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
ESD protection, DVI pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 kV Human body model
ESD protection, all other pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Human body model
JEDEC latchup (EIA/JESD78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
Supply voltage, VDD (DVDD, PVDD, TVDD)
Low-swing mode
Input reference voltage, VREF
High-swing mode
DVI termination supply voltage, AVDD (see Note 1)
At DVI receiver
DVI Single-ended termination resistance, r(T) (see Note 2)
At DVI receiver
TFADJ resistor for DVI-compliant V(SWING) range, r(TFADJ)
400 mV = V(SWING) = 600 mV
Operating free-air temperature range, TA
† VDDQ defines the maximum low−level input voltage, it is not an actual input voltage.
NOTES: 1. AVDD is the termination supply voltage of the DVI link.
2. r(T) is the single-ended termination resistance at the receiver end of the DVI link.
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MIN
NOM
MAX
3
3.3
VDDQ/2†
3.6
0.55
3.3
V
0.9
DVDD
3.14
UNIT
V
3.46
V
Ω
45
50
55
505
510
515
Ω
0
25
70
_C
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
dc specifications
PARAMETERS
TEST CONDITIONS
VREF = DVDD
MIN
TYP
MAX
0.7VDD
UNIT
VIH
High−level input voltage (CMOS input)
VIL
Low−level input voltage (CMOS input)
VOH
High-level digital output voltage (open-drain output)
VDD = 3 V
IOH = 20 µA
VOL
Low-level digital output voltage (open-drain output)
VDD = 3.6 V
IOL = 4 mA
0.4
V
IIH
High-level input current
VI = 3.6 V
±25
µA
IIL
Low-level input current
VI = 0
±25
µA
V(H)
DVI single-ended high-level output voltage
AVDD – 0.01
AVDD + 0.01
V
V(L)
DVI single-ended low-level output voltage
AVDD – 0.6
AVDD − 0.4
V
V(SWING)
DVI single-ended output swing voltage
V(OFF)
DVI single-ended standby/off output voltage
I(PD)
Power-down current (see Note 3)
0.55 V ≤ VREF ≤ 0.9 V
V
VREF + 0.2
VREF = DVDD
0.3 VDD
0.55 V ≤ VREF ≤ 0.9 V
VREF − 0.2
2.4
AVDD = 3.3 V ±5%
5%
r(T)‡ = 50 Ω ±10%
r(TFADJ) = 510 Ω ±1%
V
V
400
600
AVDD – 0.01
AVDD + 0.01
V
200
500
µA
200
250
mA
MAX
UNIT
165
MHz
ns
Worst case pattern§
I(IDD)
Normal power supply current
‡ r(T) is the single-ended termination resistance at the receiver end of the DVI link.
§ Black and white checkerboard pattern, each checker is one pixel wide.
NOTE 3: Assumes all inputs to the transmitter are not toggling.
mVP−P
ac specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
f(IDCK)
t(pixel)
IDCK frequency
25
Pixel time period (see Note 4)
6.06
40
t(IDCK)
t(ijit)
IDCK duty cycle
30%
70%
tr
tf
DVI output rise time (20−80%) (see Note 5)
75
240
DVI output fall time (20−80%) (see Note 5)
75
240
ps
tsk(D)
tsk(CC)
DVI output intra-pair + to − differential skew (see Note 6)
DVI output inter-pair or channel-to-channel skew (see Note 6)
1.2
ns
tojit
Output clock jitter, maximum (see Note 7)
150
ps
tsu(IDF)
Data, DE, VSYNC, HSYNC setup time to IDCK+ falling edge
th(IDF)
Data, DE, VSYNC, HSYNC hold time to IDCK+ falling edge
tsu(IDR)
Data, DE, VSYNC, HSYNC setup time to IDCK+ rising edge
th(IDR)
Data, DE, VSYNC, HSYNC hold time to IDCK+ rising edge
tsu(ID)
Data, DE, VSYNC, HSYNC setup time to IDCK+ falling/rising edge
th(ID)
Data, DE, VSYNC, HSYNC hold time to IDCK+ falling/rising edge
IDCK clock jitter tolerance
2
50
f(IDCK) = 165 MHz
Single edge
(BSEL = 1, DSEL = 0,
DKEN = 0, EDGE = 0)
1.2
Single edge
(BSEL = 1, DSEL = 0,
DKEN = 0, EDGE = 1)
1.2
Dual edge
(BSEL = 0, DSEL = 1,
DKEN = 0)
0.9
ns
1.3
ns
1.3
ns
1
t(STEP) De-skew trim increment
DKEN = 1
350
NOTES: 4. t(pixel) is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t(pixel).
5. Rise and fall times are measured as the time between 20% and 80% of signal amplitude.
6. Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger.
7. Relative to input clock (IDCK).
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ps
7
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
timing diagrams
tr
DVI
Outputs
tf
80% VOD
20% VOD
Figure 1. Rise and Fall Time for DVI Outputs
th(IDF)
IDCK−
IDCK+
tsu(IDF)
th(IDR)
tsu(IDR)
VIH
VIL
DATA[23:0], DE,
HSYNC, VSYNC
Figure 2. Control and Single-Edge-Data Setup/Hold Time to IDCK±
IDCK+
tsu(ID)
th(ID)
th(ID)
tsu(ID)
DATA[23:0], DE,
HSYNC, VSYNC
VIH
VIL
Figure 3. Dual-Edge Data Setup/Hold Times to IDCK+
tsk(D)
TX+
50%
TX−
Figure 4. Analog Output Intra-Pair ± Differential Skew
TXN
50%
tsk(CC)
TXM
50%
Figure 5. Analog Output Channel-to-Channel Skew
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functional description
The TFP510 is a DVI-compliant digital transmitter that is used in digital host monitor systems to T.M.D.S. encode
and serialize RGB pixel data streams. TFP510 supports resolutions from VGA to UXGA and can be controlled
in two ways: 1) configuration and state pins or 2) the programmable I2C serial interface (see the terminal
functions section).
The host in a digital display system, usually a PC or consumer electronics device, contains a DVI-compatible
transmitter such as the TI TFP510 that receives 24-bit pixel data along with appropriate control signals. The
TFP510 encodes the signals into a high speed, low voltage, differential serial bit stream optimized for
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor,
requires a DVI compatible receiver like the TI TFP501 to decode the serial bit stream back to the same 24-bit
pixel data and control signals that originated at the host. This decoded data can then be applied directly to the
flat panel drive circuitry to produce an image on the display. Since the host and display can be separated by
distances up to 5 meters or more, serial transmission of the pixel data is preferred (see the T.M.D.S. pixel data
and control signal encoding, pixel data and control signal encoding, universal graphics contoller interface
voltage signal levels, and unversal graphics controller interface clock inputs sections).
The TFP510 integrates a high-speed digital interface, an HDCP cipher, a T.M.D.S. encoder, and three
differential T.M.D.S. drivers. Data is driven to the TFP510 encoder across 12 or 24 data lines, along with
differential clock pair and sync signals. The flexibility of the TFP510 allows for multiple clock and data formats
that enhance system performance.
The TFP510 also has enhanced PLL noise immunity, an enhancement accomplished with on-chip regulators
and bypass capacitors.
The TFP510 is versatile and highly programmable to provide maximum flexibility for the user. An I2C host
interface is provided to allow enhanced configurations in addition to power-on default settings programmed by
pin-strapping resistors.
The TFP510 offers monitor detection through receiver detection, or hot-plug detection when I2C is enabled. The
monitor detection feature allows the user enhanced flexibility when attaching to digital displays or receivers (see
the terminal functions, hot-plug/unplug, and register descriptions sections).
The TFP510 has a data de-skew feature allowing the users to de-skew the input data with respect to the IDCK±
(see the data de-skew feature section).
The TFP510 incorporates high-bandwidth digital content protection (HDCP). This provides secure data
transmission for high-definition video (see the HDCP overview section).
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T.M.D.S. pixel data and control signal encoding
For T.M.D.S., only one of two possible T.M.D.S. characters for a given pixel is transmitted at a given time. The
transmitter keeps a running count of the number of ones and zeros previously sent and transmits the character
that minimizes the number of transitions and approximate a dc balance of the transmission line. Three T.M.D.S.
channels are used to transmit RGB pixel data during the active video interval (DE = high). These same three
channels are also used to transmit HSYNC, VSYNC, and three control signals, CTL[3:1], during the inactive
display or blanking interval (DE = low). The following table maps the transmitted output data to the appropriate
T.M.D.S. output channel in a DVI-compliant system.
INPUT PINS
(VALID FOR DE = high)
T.M.D.S. OUTPUT CHANNEL
TRANSMITTED PIXEL DATA
ACTIVE DISPLAY (DE = high)
DATA[23:16]
Channel 2 (TX2 ±)
Red[7:0]
DATA[15:8]
Channel 1 (TX1 ±)
Green[7:0]
DATA[7:0]
Channel 0 (TX0 ±)
Blue[7:0]
INPUT PINS
(VALID FOR DE = low)
T.M.D.S. OUTPUT CHANNEL
TRANSMITTED CONTROL DATA
BLANKING INTERVAL (DE = low)
CTL3, CTL2 (see Note 8)
Channel 2 (TX2 ±)
CTL[3:2]
CTL1 (see Note 8)
Channel 1 (TX1 ±)
CTL[1]
HSYNC, VSYNC
Channel 0 (TX0 ±)
HSYNC, VSYNC
NOTE 8: The TFP510 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval. The
TFP510 internally generates CTL3 for HDCP operation and the CTL[2:1] inputs are reserved for
future use. When DE = high, the CTL and SYNC pins must be held constant.
universal graphics controller interface voltage signal levels
The universal graphics controller interface can operate in the following two distinct voltage modes:
D The high-swing mode where standard 3.3-V CMOS signaling levels are used
D The low-swing mode where adjustable 1.1-V to 1.8-V signaling levels are used
To select the high-swing mode, the VREF input pin must be tied to the 3.3-V power supply.
To select the low-swing mode, the VREF input must be = 0.55 to 0.9 V.
In the low-swing mode, VREF is used to set the midpoint of the adjustable signaling levels. The allowable range
of values for VREF is from 0.55 V to 0.9 V. The typical approach is to provide VREF to the chip using a simple
voltage-divider circuit. The minimum allowable input signal swing in the low-swing mode is VREF ± 0.2 V. In
low-swing mode, the VREF input is common to all differential input receivers.
universal graphics controller interface clock inputs
The universal graphics controller interface of the TFP510 supports both single-ended and fully differential clock
input modes. In the differential clock input mode, the universal graphics controller interface uses the crossover
point between the IDCK+ and IDCK− signals as the timing reference for latching incoming data (DATA[23:0],
DE, HSYNC, and VSYNC). Differential clock inputs provide greater common-mode noise rejection. The
differential clock input mode is only available in the low-swing mode. In the single-ended clock input mode, the
IDCK+ input (pin 57) should be connected to the single-ended clock source and the IDCK− input (pin 56) should
be tied to GND.
The universal graphics controller interface of the TFP510 provides selectable 12-bit, dual-edge and 24-bit,
single-edge input clocking modes. In the 12-bit dual-edge mode, the 12-bit data is latched on each edge of the
input clock. In the 24-bit single-edge mode, the 24-bit data is latched on the rising edge of the input clock when
EDGE = 1 and the falling edge of the input clock when EDGE = 0.
DKEN and DK[3:1] allow the user to compensate the skew between IDCK± and the pixel data and control
signals. See the description of the CTL_3_MODE register for details.
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universal graphics controller interface modes
Table 1 is a tabular representation of the different modes for the universal graphics controller interface. The
12-bit mode is selected when BSEL = 0 and the 24-bit mode when BSEL = 1. The 12-bit mode uses dual-edge
clocking and the 24-bit mode uses single-edge clocking. The EDGE input is used to control the latching edge
in 24-bit mode, or the primary latching edge in 12-bit mode. When EDGE = 1, the data input is latched on the
rising edge of the input clock; and when EDGE = 0, the data input is latched on the falling edge of the input clock.
A fully differential input clock is available only in the low-swing mode. Single-ended clocking is not
recommended in the low-swing mode as this decreases common-mode noise rejection.
Note that BSEL, DSEL, and EDGE are determined by register CTL_1_MODE when I2C is enabled (ISEL = 1)
and by input pins when I2C is disabled (ISEL = 0).
Table 1. Universal Graphics Controller Interface Options (Tabular Representation)
VREF
0.55 V − 0.9 V
BSEL
EDGE
DSEL
BUS WIDTH
LATCH MODE
CLOCK EDGE
0
0
0
12-bit
Dual-edge
Falling
Differential (see Notes 9 and 10)
0.55 V − 0.9 V
0
0
1
12-bit
Dual-edge
Falling
Single-ended
0.55 V – 0.9V
0
1
0
12-bit
Dual-edge
Rising
Differential (see Notes 9 and 10)
0.55 V − 0.9 V
0
1
1
12-bit
Dual-edge
Rising
Single-ended
0.55 V – 0.9 V
1
0
0
24-bit
Single-edge
Falling
Single-ended
0.55 V – 0.9 V
1
0
1
24-bit
Single-edge
Falling
Differential (see Notes 9 and 11)
0.55 V – 0.9 V
1
1
0
24-bit
Single-edge
Rising
Single-ended
0.55 V – 0.9 V
1
1
1
24-bit
Single-edge
Rising
Differential (see Notes 9 and 11)
DVDD
0
0
X
12-bit
Dual-edge
Falling
Single-ended (see Note 12)
DVDD
0
1
X
12-bit
Dual-edge
Rising
Single-ended (see Note 12)
DVDD
1
0
X
24-bit
Single-edge
Falling
Single-ended (see Note 12)
1
1
X
24-bit
Single-edge
Rising
Single-ended (see Note 12)
DVDD
NOTES: 9.
10.
11.
12.
CLOCK MODE
The differential clock input mode is only available in the low signal swing mode (i.e., VREF ≤ 0.9 V).
The TFP510 does not support a 12-bit dual-clock, single-edge input clocking mode.
The TFP510 does not support a 24-bit single-clock, dual-edge input clocking mode.
In the high-swing mode (VREF = DVDD), DSEL is a don’t care; therefore, the device is always in the single-ended latch mode.
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universal graphics controller interface modes (continued)
12-Bit, Dual-Edge Input Mode (BSEL = 0)
DE
D[11:0]
P 0L
P 0H
P 1L
P 1H
PN−1H
PN L
PN H
PN+1L
L = Low Half Pixel
H = High Half Pixel
IDCK+
DSEL=1
EDGE=0
IDCK+
DSEL=1
EDGE=1
{(IDCK+) − (IDCK−)}
DSEL=0
EDGE=0
{(IDCK+) − (IDCK−)}
DSEL=0
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
First Latch Edge
Figure 6. Universal Graphics Controller Interface Options for 12-Bit Mode (Graphical Representation)
24-Bit, Single-Edge Input Mode (BSEL = 1)
DE
P0
D[23:0]
P1
PN-1
PN
IDCK+
DSEL=0
EDGE=0
IDCK+
DSEL=0
EDGE=1
{(IDCK+) − (IDCK−)}
DSEL=1
EDGE=0
{(IDCK+) − (IDCK−)}
DSEL=1
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
First Latch Edge
Figure 7. Universal Graphics Controller Interface Options for 24-Bit Mode (Graphical Representation)
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12-bit mode data mapping
P0
PIN
NAME
P1
P2
P0L
P0H
P1L
P1H
P2L
P2H
LOW
HIGH
LOW
HIGH
LOW
HIGH
D11
G0[3]
R0[7]
G1[3]
R1[7]
G2[3]
R2[7]
D10
G0[2]
R0[6]
G1[2]
R1[6]
G2[2]
R2[6]
D9
G0[1]
R0[5]
G1[1]
R1[5]
G2[1]
R2[5]
D8
G0[0]
R0[4]
G1[0]
R1[4]
G2[0]
R2[4]
D7
B0[7]
R0[3]
B1[7]
R1[3]
B2[7]
R2[3]
D6
B0[6]
R0[2]
B1[6]
R1[2]
B2[6]
R2[2]
D5
B0[5]
R0[1]
B1[5]
R1[1]
B2[5]
R2[1]
D4
B0[4]
R0[0]
B1[4]
R1[0]
B2[4]
R2[0]
D3
B0[3]
G0[7]
B1[3]
G1[7]
B2[3]
G2[7]
D2
B0[2]
G0[6]
B1[2]
G1[6]
B2[2]
G2[6]
D1
B0[1]
G0[5]
B1[1]
G1[5]
B2[1]
G2[5]
D0
B0[0]
G0[4]
B1[0]
G1[4]
B2[0]
G2[4]
24-bit mode data mapping
PIN NAME
P0
P1
P2
PIN NAME
P0
P1
P2
D23
R0[7]
R1[7]
D22
R0[6]
R1[6]
R2[7]
D11
G0[3]
G1[3]
G2[3]
R2[6]
D10
G0[2]
G1[2]
G2[2]
D21
R0[5]
D20
R0[4]
R1[5]
R2[5]
D9
G0[1]
G1[1]
G2[1]
R1[4]
R2[4]
D8
G0[0]
G1[0]
D19
G2[0]
R0[3]
R1[3]
R2[3]
D7
B0[7]
B1[7]
B2[7]
D18
R0[2]
R1[2]
R2[2]
D6
B0[6]
B1[6]
B2[6]
D17
R0[1]
R1[1]
R2[1]
D5
B0[5]
B1[5]
B2[5]
D16
R0[0]
R1[0]
R2[0]
D4
B0[4]
B1[4]
B2[4]
D15
G0[7]
G1[7]
G2[7]
D3
B0[3]
B1[3]
B2[3]
D14
G0[6]
G1[6]
G2[6]
D2
B0[2]
B1[2]
B2[2]
D13
G0[5]
G1[5]
G2[5]
D1
B0[1]
B1[1]
B2[1]
D12
G0[4]
G1[4]
G2[4]
D0
B0[0]
B1[0]
B2[0]
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data de-skew feature
The de-skew feature allows adjustment of the input setup/hold time. Specifically, the input data DATA[23:0] can
be latched slightly before or after the latching edge of the clock IDCK± depending on the amount of de-skew
desired. When de-skew enable (DKEN) is enabled, the amount of de-skew is programmable by setting the three
bits DK[3:1]. When disabled, a default de-skew setting is used. To allow maximum flexibility and ease of use,
DKEN and DK[3:1] are accessed directly through configuration pins when I2C is disabled, or through registers
of the same name when I2C is enabled. When using I2C mode, the DKEN pin should be tied to ground to avoid
a floating input.
The input setup/hold time (see Figure 8) can be varied with respect to the input clock by an amount tCD given
by the formula:
t(CD) = (DK[3:1] – 4) × t(STEP)
Where:
t(STEP) is the adjustment increment amount
DK[3:1] is a number from 0 to 7 represented as a 3-bit binary number
t(CD) is the cumulative de-skew amount
(DK[3:1]-4) is simply a multiplier in the range {-4,-3,-2,-1, 0, 1, 2, 3} for t(STEP). Therefore, data can be latched
in increments from 4 times the value of t(STEP) before the latching edge of the clock to 3 times the value of t(STEP)
after the latching edge. Note that the input clock is not changed, only the time when data is latched with respect
to the clock.
DATA[23:0]
IDCK±
−t(CD)
DK[3:1]
000
t(CD) −4 × t(STEP)
t(CD)
100
0
Default Falling
−t(CD)
000
111
3 × t(STEP)−4 × t(STEP)
t(CD)
100
0
Default Rising
111
3 × t(STEP)
Figure 8. De-Skew Function Timing Diagram
hot plug/unplug (auto connect/disconnect detection)
The TFP510 supports hot plug/unplug (auto connect/disconnect detection) for the DVI link. The receiver sense
input (RSEN) bit indicates if a DVI receiver is connected to TXC+ and TXC−. The HTPLG bit reflects the current
state of the HTPLG pin connected to the monitor via the DVI connector. When I2C is disabled (ISEL = 0), the
RSEN value is available on the MSEN pin. When I2C is enabled, the connection status of the DVI link and
HTPLG sense pins is provided by the CTL_2_MODE register. The MSEL bits of the CTL_2_MODE register can
be used to program the MSEN to output the HTPLG value, the RSEN value, an interrupt, or be disabled.
The source of the interrupt event is selected by TSEL in the CTL_2_MODE register. An interrupt is generated
by a change in status of the selected signal. The interrupt status is indicated in the MDI bit of CTL_2_MODE
and can be output on the MSEN pin. The interrupt continues to be asserted until a 1 is written to the MDI bit,
resetting the bit back to 1. Writing 0 to the MDI bit has no effect.
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device configuration and I2C RESET description
The TFP510 device configuration can be programmed by several different methods to allow maximum flexibility
for the user’s application. Device configuration is controlled depending on the state of the ISEL/RST pin,
configuration pins (BSEL, DSEL, EDGE, VREF) and state pin (PD). I2C bus select and I2C RESET (active low)
are shared functions on the ISEL/RST pin, which operates asynchronously.
Holding ISEL/RST low causes the device configuration to be set by the configuration pins (BSEL, DSEL, EDGE,
and VREF) and state pin (PD). The I2C bus is disabled.
Holding ISEL/RST high causes the chip configuration to be set based on the configuration bits (BSEL, DSEL,
EDGE) and state bits (PD, DKEN) in the I2C registers. The I2C bus is enabled.
Momentarily bringing ISEL/RST low and then back high while the device is operating in normal or power-down
mode resets the I2C registers to their default values, and the device configuration is changed to the default
power-up state with I2C enabled. After power up, the device must be reset. It is suggested that a low going pulse
with 100 ns minimum width be applied to this pin after all the power supplies are fully functional.
DE generator
The TFP510 contains a DE generator that can be used to generate an internal DE signal when the original data
source does not provide one. There are several I2C programmable values that control the DE generator (see
Figure 9). DE_GEN in the DE_CTL register enables this function. When enabled, the DE pin is ignored.
DE_TOP and DE_LIN are line counts used to control the number of lines after VSYNC goes active that DE is
enabled, and the total number of lines that DE remains active, respectively. The polarity of VSYNC must be set
by VS_POL in the DE_CTL register.
DE_DLY and DE_CNT are pixel counts used to control the number of pixels after HSYNC goes active that DE
is enabled, and the total number of pixels that DE remains active, respectively. The polarity of HSYNC must be
set by HS_POL in the DE_CTL register.
The TFP510 also counts the total number of HSYNC pulses between VSYNC pulses, and the total number of
pixels between HSYNC pulses. These values, the total vertical and horizontal resolutions, are available in
V_RES and H_RES, respectively. These values are available at all times, whether or not the DE generator is
enabled.
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PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
Full Vertical Frame
DE_TOP
DE_DLY
DE_CNT
V_RES
DE_LIN
Actual Display Area
H_RES
Figure 9. DE Generator Register Functions
HDCP overview
The TFP510 provides high-bandwidth digital content protection (HDCP) by encrypting the transmitted active
pixel data stream sent to an HDCP receiver (like the TFP501). The HDCP algorithm is fully incorporated, and
only requires an external source of HDCP keys and a software driver to implement an HDCP host.
The HDCP technology requires adherence to the HDCP license’s compliance (available from
www.digital-cp.com) and robustness rules. These rules require that HDCP implementation both protect the
confidentiality of keys and other values from compromise as well as deliver the desired protection for high-value
video content. The TFP510 provides a complete, easily implemented solution to these requirements.
Details of TFP510 HDCP operation are available in a separate document.
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register map
The TFP510 is a standard I2C slave device. All the registers can be written and read through the I2C interface
(unless otherwise specified). The TFP510 slave machine supports only byte read and write cycles. Page mode
is not supported. The 8-bit binary address of the I2C machine is 0111 000X, where X = 0 for write and X = 1 for
read on the TFP510.
REGISTER
VEN_ID
DEV_ID
REV_ID
RESERVED
RW
SUBADDRESS
R
00
VEN_ID[7:0]
R
01
VEN_ID[15:8]
R
02
DEV_ID[7:0]
R
03
DEV_ID[15:8]
R
04
REV_ID[7:0]
BIT7
BIT6
BIT5
BIT4
BIT3
R
05-07
CTL_1_MODE
RW
08
RSVD
CTL_2_MODE
RW
09
VLOW
CTL_3_MODE
RW
0A
R
0B
RESERVED
RW
0C-31
Reserved
DE_DLY
RW
32
DE_DLY[7:0]
DE_CTL
RW
33
RSVD
DE_TOP
RW
34
RSVD
RESERVED
RW
35
DE_CNT
RW
36
RW
37
RW
38
RW
39
R
3A
CFG
DE_LIN
H_RES
V_RES
RESERVED
R
3B
R
3C
R
3D
R
3E−FF
BIT2
BIT1
BIT0
EDGE
PD
Reserved
TDIS
VEN
HEN
DSEL
BSEL
TSEL
RSEN
DKEN
RSVD
MSEL
DK
HTPLG
MDI
CTL
RSVD
CFG
DE_GEN
VS_POL
HS_POL
RSVD
DE_DLY[8]
DE_DLY[6:0]
Reserved
DE_CNT[7:0]
Reserved
DE_CNT[10:8]
DE_LIN[7:0]
Reserved
DE_LIN[10:8]
H_RES[7:0]
Reserved
H_RES[10:8]
V_RES[7:0]
Reserved
V_RES[10:8]
register descriptions
VEN_ID
7
Sub-Address = 01−00
6
5
Read Only
4
3
Default = 0x014C
2
1
0
VEN_ID[7:0]
VEN_ID[15:8]
These read-only registers contain the 16-bit Texas Instruments vendor ID. VEN_ID is hardwired to 0x014C.
DEV_ID
7
Sub-Address = 03−02
6
5
Read Only
4
3
Default = 0x0510
2
1
0
DEV_ID[7:0]
DEV_ID[15:8]
These read-only registers contain the 16-bit device ID. DEV_ID is hardwired to 0x0510 for the TFP510.
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PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
register descriptions (continued)
REV_ID
Sub-Address = 04
7
6
5
Read Only
4
Default = 0x00
3
2
1
0
REV_ID[7:0]
This read-only register contains the revision ID.
RESERVED
Sub-Address = 07−05
6
7
5
Read Only
4
Default = 0x641400
3
2
1
0
RESERVED
CTL_1_MODE
Sub-Address = 08
Read/Write
Default = 0xBE
7
6
5
4
3
2
1
0
RSVD
TDIS
VEN
HEN
DSEL
BSEL
EDGE
PD
PD: This read/write register contains the power-down mode.
0: Power down (default after RESET)
1: Normal operation
EDGE: This read/write register contains the edge select mode.
0: Input data latches to the falling edge of IDCK+
1: Input data latches to the rising edge of IDCK+
BSEL: This read/write register contains the input bus select mode.
0: 12-bit operation with dual-edge clock
1: 24-bit operation with single-edge clock
DSEL:This read/write register is used in combination with BSEL and VREF to select the single-ended or differential
input clock mode. In the high-swing mode, DSEL is a don’t care because IDCK is always single-ended.
HEN: This read/write register contains the horizontal sync enable mode.
0: HSYNC input is transmitted as a fixed low
1: HSYNC input is transmitted in its original state
VEN: This read/write register contains the vertical sync enable mode.
0: VSYNC input is transmitted as a fixed low
1: VSYNC input is transmitted in its original state
TDIS: This read/write register contains the T.M.D.S. disable mode.
0: T.M.D.S. circuitry enable state is determined by PD
1: T.M.D.S. circuitry is disabled
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register descriptions (continued)
CTL_2_MODE
7
Sub-Address = 09
6
VLOW
5
Read/Write
4
MSEL[3:1]
Default = 0x00
3
2
1
0
TSEL
RSEN
HTPLG
MDI
MDI: This read/write register contains the monitor detect interrupt mode.
0: Detected logic level change in detection signal (to clear, write 1 to this bit)
1: Logic level remains the same
HTPLG: This read-only register contains the hot plug detection input logic state.
0: Low level detected on the EDGE/HTPLG pin (pin 9)
1: High level detected on the EDGE/HTPLG pin (pin 9)
RSEN: This read only register contains the receiver sense input logic state, which is valid only for dc-coupled systems.
0: A powered-on receiver is not detected
1: A powered-on receiver is detected (i.e., connected to the DVI transmitter outputs)
TSEL: This read/write register contains the interrupt generation source select.
0: Interrupt bit (MDI) is generated by monitoring RSEN
1: Interrupt bit (MDI) is generated by monitoring HTPLG
MSEL[3:1]: This read/write register contains the source select of the monitor sense output pin.
000: Disabled. MSEN output high
001: Outputs the MDI bit (interrupt)
010: Outputs the RSEN bit (receiver detect)
011: Outputs the HTPLG bit (hot plug detect)
VLOW: This read-only register indicates the VREF input level.
0: This bit is a logic level 0 if the VREF analog input selects high-swing inputs.
1: This bit is a logic level 1 if the VREF analog input selects low-swing inputs.
CTL_3_MODE
7
Sub-Address = 0A
6
DK[3:1]
5
Read/Write
4
3
DKEN
RSVD
Default = 0x80
2
1
CTL[2:1]
0
RSVD
CTL[2:1]:This read/write register contains the values of the two CTL[2:1] bits that are output on the DVI port during
the blanking interval. CTL[3] is not available on the TFP510 because it is inetrnally generated by the HDCP
circuitry.
DKEN: This read/write register controls the data de-skew enable.
0: Data de-skew is disabled; the values in DK[3:1] are not used.
1: Data de-skew is enabled; the de-skew setting is controlled through DK[3:1].
DK[3:1]: This read/write register contains the de-skew setting, each increment adjusts the skew by t(STEP).
000: Step 1 (minimum setup/maximum hold)
001: Step 2
010: Step 3
011: Step 4
100: Step 5 (default)
101: Step 6
110: Step 7
111: Step 8 (maximum setup/minimum hold)
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PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
register descriptions (continued)
CFG
Sub-Address = 0B
7
6
Read Only
5
4
3
2
1
0
CFG[7:0] (D[23:16])
This read-only register contains the state of the inputs D[23:16]. These pins can be used to provide the user with
selectable configuration data through the I2C bus.
RESERVED
7
Sub-Address = 0E−0C
6
5
Read/Write
4
3
Default = 0x97D0A9
2
1
2
1
0
RESERVED
RESERVED
RESERVED
These read/write registers have no effect on TFP510 operation.
DE_DLY
Sub-Address = 32
7
6
5
Read/Write
4
3
Default = 0x00
0
DE_DLY[7:0]
This read/write register defines the number of pixels after HSYNC goes active that DE is generated, when the DE
generator is enabled.
DE_CTL
Sub-Address = 33
Read/Write
7
6
5
4
3
Reserved
DE_GEN
VS_POL
HS_POL
Default = 0x00
2
1
Reserved
0
DE_DLY[8]
DE_DLY[8]: This read/write register contains the top bit of DE_DLY.
HS_POL: This read/write register sets the HSYNC polarity.
0: HSYNC is considered active low.
1: HSYNC is considered active high.
Pixel counts are reset on the HSYNC active edge.
VS_POL: This read/write register sets the VSYNC polarity.
0: VSYNC is considered active low.
1: VSYNC is considered active high.
Line counts are reset on the VSYNC active edge.
DE_GEN: This read/write register enables the internal DE generator.
0: DE generator is disabled. Signal required on DE pin
1: DE generator is enabled. DE pin is ignored.
DE_TOP
7
Sub-Address = 34
6
5
Read/Write
4
3
Default = 0x00
2
1
0
DE_TOP[7:0]
This read/write register defines the number of pixels after VSYNC goes active that DE is generated, when the DE
generator is enabled.
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PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
register descriptions (continued)
DE_CNT
7
Sub-Address = 37−36
6
5
Read/Write
4
3
Default = 0x0000
2
1
0
DE_CNT[7:0]
Reserved
DE_CNT[10:8]
These read/write registers define the width of the active display, in pixels, when the DE generator is enabled.
DE_LIN
7
Sub-Address = 39−38
6
5
Read/Write
4
3
Default = 0x0000
2
1
0
DE_LIN[7:0]
Reserved
DE_LIN[10:8]
These read/write registers define the height of the active display, in lines, when the DE generator is enabled.
H_RES
7
Sub-Address = 3B−3A
6
5
Read Only
4
3
2
1
0
H_RES[7:0]
Reserved
H_RES[10:8]
These read-only registers return the number of pixels between consecutive HSYNC pulses.
V_RES
7
Sub-Address = 3D−3C
6
5
Read Only
4
3
2
1
0
V_RES[7:0]
Reserved
V_RES[10:8]
These read-only registers return the number of lines between consecutive VSYNC pulses.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
I2C interface
The I2C interface is used to access the internal registers. This two-pin interface consists of the SCL clock line
and the SDA serial data line. The basic I2C access cycles are shown in Figures 9 and 10.
SDA
SCL
Start Condition (S)
Stop Condition (P)
Figure 10. I2C Start and Stop Conditions
The basic access write cycle consists of the following:
1.
2.
3.
4.
5.
A start condition
A slave address cycle
A sub-address cycle
Any number of data cycles
A stop condition
The basic access read cycle consists of the following:
1.
2.
3.
4.
5.
6.
7.
A start condition
A slave write address cycle
A sub-address cycle
A restart condition
A slave read address cycle
Any number of data cycles
A stop condition
The start and stop conditions are shown in Figure 9. The high-to-low transition of SDA while SCL is high defines
the start condition. The low to high transition of SDA while SCL is high defines the stop condition. Each cycle,
data or address, consists of 8 bits of serial data followed by one acknowledge bit generated by the receiving
device. Thus, each data/address cycle contains 9 bits as shown in Figure 10.
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
SDA
Slave Address
Sub-Address
Figure 11. I2C Access Cycles
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Data
Stop
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
I2C interface (continued)
Following a start condition, each I2C device decodes the slave address. The TFP510 responds with an
acknowledge by pulling the SDA line low during the ninth clock cycle if it decodes the address as its address.
During subsequent sub-address and data cycles, the TFP510 responds with acknowledge as shown in
Figure 11. The sub-address is auto-incremented after each data cycle.
The transmitting device must not drive the SDA signal during the acknowledge cycle so that the receiving device
may drive the SDA signal low. The master indicates a not acknowledge condition (/A) by keeping the SDA signal
high just before it asserts the stop condition (P). This sequence terminates a read cycle as shown in Figure 12.
In order to minimize the number of bits that must be transferred for the HDCP link integrity check, a second read
format is supported. This access, shown in Figure 13, has an implicit sub-address equal to the starting location
for the HDCP receiver link verification response (RȀi).
The slave address consists of 7 bits of address along with 1 bit of read/write information (i.e., read = 1 and
write = 0) as shown in Figures 12 and 13. For the TFP510 the slave addresses are 0x70 for write cycles and
0x71 for read cycles.
S
Slave Address
W
A
From Master
From Slave
Sub-Address
A
Data
A
Data
A
P
A Acknowledge
S Start condition
P Stop Conditon
R Read Condition = 1
W Write Condition = 0
Figure 12. I2C Write Cycle
S
Slave Address
W
A
Sub-Address
From Master
From Slave
A
Sr
Slave Address
R
A
Data
A
Data
/A
P
A Acknowledge
S Start condition
/A Not acknowledge (SDA high)
R Read Condition = 1
W Write Condition = 0
P Stop Conditon
Sr Restart Condition
Figure 13. I2C Read Cycle
S
Slave Address
From Master
From Slave
R
A
Data
A
Data
/A
P
A Acknowledge
S Start condition
/A Not acknowledge (SDA high)
P Stop Conditon
R Read Condition = 1
Figure 14. HDCP Port Link Integrity Message Read
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
23
PanelBusā  SLDS146B − JANUARY 2002 − REVISED DECEMBER 2002
TI 64-pin TQFP PowerPAD package
The TFP510 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10-mm × 10-mm × 1,0-mm TQFP outline with 0,5-mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP510 to the
application board is not required because the device power dissipation is well within the package capability
when not soldered.
Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.
Because the die pad is electrically connected to the chip substrate and hence to chip ground, connecting the
back side of the PowerPAD package to a PCG ground plane provides a low-inductance, low-impedance
connection to help improve EMI, ground bounce, and power-supply noise performance.
Table 2 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. TI 64-Pin TQFP (10 × 10 × 1,0 mm)/0,5 mm Lead-Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 14)
75.83°C/W
42.20°C/W
21.47°C/W
RθJA
Thermal resistance, junction-to-ambient
(see Notes 13 and 14)
RθJC
Thermal resistance, junction-to-case (see Notes 13 and 14)
7.80°/W
0.38°C/W
0.38°C/W
PD
Power handling capabilities of package (see Notes 13, 14,
and 15)
0.92 W
1.66 W
3.26 W
NOTES: 13. Specified with the bond pad on the backside of the PowerPAD package soldered to a 2-oz. Cu plate PCB thermal plane
14. Airflow is at 0 LFM (no airflow).
15. Specified at 150°C junction temperature and 80°C ambient temperature
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TFP510PAP
ACTIVE
HTQFP
PAP
64
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TFP510PAPG4
ACTIVE
HTQFP
PAP
64
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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