REG113-5

REG113

SBVS031D – MARCH 2001 – REVISED SEPTEMBER 2005

DMOS

400mA Low-Dropout Regulator

FEATURES

CAP-FREE DMOS TOPOLOGY:

Ultra Low Dropout Voltage:

250mV typ at 400mA

Output Capacitor not Required for Stability

UP TO 500mA PEAK, TYPICAL

FAST TRANSIENT RESPONSE

VERY LOW NOISE: 28

µ

Vrms

HIGH ACCURACY:

±

1.5% max

HIGH EFFICIENCY:

I

GND

= 850

µ

A at I

OUT

= 400mA

Not Enabled: I

GND

= 0.01

µ

A

2.5V, 2.85V, 3.0V, 3.3V, AND 5.0V OUTPUT VERSIONS

OTHER OUTPUT VOLTAGES AVAILABLE UPON

REQUEST

FOLDBACK CURRENT LIMIT

THERMAL PROTECTION

SMALL SURFACE-MOUNT PACKAGES:

SOT23-5 and MSOP-8

APPLICATIONS

PORTABLE COMMUNICATION DEVICES

BATTERY-POWERED EQUIPMENT

PERSONAL DIGITAL ASSISTANTS

MODEMS

BAR-CODE SCANNERS

BACKUP POWER SUPPLIES

DESCRIPTION

The REG113 is a family of low-noise, low-dropout linear regulators with low ground pin current. Its new DMOS topology provides significant improvement over previous designs, including low-dropout voltage (only 250mV typ at full load), and better transient performance. In addition, no output capacitor is required for stability, unlike conventional lowdropout regulators that are difficult to compensate and require expensive low ESR capacitors greater than 1

µ

F.

Typical ground pin current is only 850

µ

A (at I

OUT

= 400mA) and drops to 10nA when not enabled. Unlike regulators with

PNP pass devices, quiescent current remains relatively constant over load variations and under dropout conditions.

The REG113 has very low output noise (typically 28

µ

Vrms for V

OUT

= 3.3V with C

NR

= 0.01

µ

F), making it ideal for use in portable communications equipment. Accuracy is maintained over temperature, line, and load variations. Key parameters are tested over the specified temperature range

(–40

°

C to +85

°

C).

The REG113 is well protected—internal circuitry provides a current limit which protects the load from damage, furthermore, thermal protection circuitry keeps the chip from being damaged by excessive temperature. The REG113 is available in SOT23-5 and MSOP-8 packages.

Enable

V

IN

+

0.1

µ

F

REG113

+

V

OUT

C

OUT

(1)

NR

(2)

GND

NOTES: (1) Optional. (2) NR = Noise Reduction.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2001-2005, Texas Instruments Incorporated

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ABSOLUTE MAXIMUM RATINGS

(1)

Supply Input Voltage, V

IN

....................................................... –0.3V to 12V

Enable Input Voltage, V

NR Pin Voltage, V

NR

EN

....................................................... –0.3V to V

IN

............................................................. –0.3V to 6.0V

Output Short-Circuit Duration ...................................................... Indefinite

Operating Temperature Range (T

J

) ................................ –55

°

C to +125

°

C

Storage Temperature Range (T

A

) ................................... –65

°

C to +150

°

C

Lead Temperature (soldering, 3s) .................................................. +240

°

C

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

(1)

PRODUCT

REG113xx-

yyyy/zzz

XX is package designator.

YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable).

ZZZ is package quantity.

V

OUT

(2)

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.

(2) Output voltages from 2.5V to 5.1V in 50mV increments are available; minimum order quantities apply. Contact factory for details and availability.

PIN CONFIGURATIONS

Top View

SOT

V

IN

1

GND 2

Enable 3

(N Package)

5 V

OUT

4 NR

MSOP

Enable 1

V

IN

2

V

OUT

3

NR 4

(E Package)

8 GND

7 GND

6 GND

5 GND

NOTE: Leads 5 through 8 are fused to the lead frame and can be used for improved thermal dissipation.

2

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REG113

SBVS031D

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range, T

J

= –40

°

C to +85

°

C.

At T

J

= +25

°

C, V

IN

= V

OUT

+ 1V, V

ENABLE

= 1.8V, I

OUT

= 5mA, C

NR

= 0.01

µ

F, and C

OUT

= 0.1

µ

F

(1)

, unless otherwise noted.

PARAMETER

OUTPUT VOLTAGE

Output Voltage Range

REG113-2.5

REG113-2.85

REG113-3

REG113-3.3

REG113-5

Accuracy

Over Temperature vs Temperature

vs Line and Load

Over Temperature

DC DROPOUT VOLTAGE

(2)

For all models

Over Temperature

VOLTAGE NOISE

f = 10Hz to 100kHz

Without C

NR

With C

NR

OUTPUT CURRENT

Current Limit

(3)

Over Temperature

Short-Circuit Current Limit

RIPPLE REJECTION

f = 120Hz

ENABLE CONTROL

I

V

ENABLE

V

ENABLE

I

ENABLE

ENABLE

HIGH (output enabled)

LOW (output disabled)

HIGH (output enabled)

LOW (output disabled)

Output Disable Time

Output Enable Softstart Time

THERMAL SHUTDOWN

Junction Temperature

Shutdown

Reset from Shutdown

GROUND PIN CURRENT

Ground Pin Current

Enable Pin LOW

INPUT VOLTAGE

Operating Input Voltage Range

(5)

Specified Input Voltage Range

Over Temperature

TEMPERATURE RANGE

Specified Range

Operating Range

Storage Range

Thermal Resistance

SOT23-5 Surface-Mount

MSOP-8 Surface-Mount

dV

V

I

V

OUT

V

I

OUT

/dT

DROP

I

I

V

V n

CL

SC

ENABLE

ENABLE

GND

IN

T

J

T

J

T

A

θ

JA

θ

JC

θ

JA

I

OUT

I

OUT

CONDITION

= 5mA to 400mA, V

IN

= 5mA to 400mA, V

IN

C

V

ENABLE

C

C

NR

V

OUT

OUT

I

I

I

OUT

OUT

OUT

C

NR

ENABLE

= 1.0

= 1.0

µ

= (V

OUT

= (V

OUT

= 5mA

= 400mA

= 400mA

= 0, C

OUT

= 0.01

= 1.8V to V

IN

= 0V to 0.5V

µ

µ

F, C

, V

IN

= 1.8V to 6.5

(4)

F, R

OUT

= 10

µ

F

LOAD

= 13

F, R

LOAD

= 13

I

OUT

= 5mA

I

OUT

V

= 400mA

ENABLE

0.5V

V

IN

V

IN

> 1.8V

> 1.8V

= 0

Junction-to-Ambient

Junction-to-Case

+ 0.4V) to 10V

+ 0.6V) to 10V

Junction-to-Ambient

MIN

425

1.8

–0.2

1.8

V

OUT

V

OUT

+ 0.4

+ 0.6

–40

–55

–65

23

µ

REG113NA

REG113EA

TYP

2.5

2.85

3.0

3.3

5.0

±

0.5

50

±

4

1

2

35

1

250

Vrms/V • V

7

µ

Vrms/V • V

500

200

65

50

1.5

160

140

400

850

0.01

200

(6)

160

(6)

OUT

OUT

MAX

±

1.5

±

2.3

±

2.3

±

2.3

±

3.0

10

325

410

575

600

V

IN

0.5

100

100

500

1000

0.2

10

10

10

+85

+125

+150

UNITS

µ

µ

°

V

V

V

V

V

%

% ppm/

°

C

%

%

mV mV mV

Vrms

Vrms mA mA mA dB

V

V nA nA

µ s ms

°

°

°

°

°

C

C

µ

A

µ

A

µ

A

V

V

V

C

C

C

°

C/W

°

C/W

C/W

NOTES: (1) The REG113 does not require a minimum output capacitor for stability. However, transient response can be improved with proper capacitor selection.

(2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at V

IN

+ 1V at fixed load.

= V

OUT

(3) Current limit is the output current that produces a 10% change in output voltage from V

IN

= V

OUT

+ 1V and I

OUT

= 5mA.

(4) For V

ENABLE

> 6.5V, see typical characteristic I

ENABLE

vs V

ENABLE

.

(5) The REG113 no longer regulates when V

IN

< V

OUT

+ V

DROP (MAX)

. In dropout, the impedance from V

IN

to V

OUT

is typically less than 1

at T

J

= +25

°

C.

(6) See Figure 7.

REG113

SBVS031D

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3

4

TYPICAL CHARACTERISTICS

For all models, at T

J

= +25

°

C and V

ENABLE

= 1.8V, unless otherwise noted.

1.0

0.8

0.6

0.4

0.2

0

–0.2

–0.4

–0.6

–0.8

–1.0

0

OUTPUT VOLTAGE CHANGE vs I

OUT

(Referred to I

OUT

= 200mA at +25

°

C)

–55

+25

°

°

+125

C

C

°

C

50 100 150 200 250 300 350 400

Output Current (mA)

40

30

20

10

0

–10

–20

–30

–40

0

LINE REGULATION

(Referred to V

IN

= V

OUT

+ 1V at I

O

= 200mA)

5mA

200mA

400mA

1 2 3 4

V

IN

– V

OUT

(V)

5 6 7

–0.4

–0.5

–0.6

–0.7

0

–0.1

–0.2

–0.3

–0.8

–0.9

–50 –25

LOAD REGULATION vs TEMPERATURE

(V

IN

= V

OUT

+ 1V)

I

OUT

= 40mA to 400mA

I

OUT

= 5mA to 400mA

0 25 50

Temperature (

°

C)

75 100 125

0

–0.05

–0.10

–0.15

–0.20

–0.25

–0.30

–0.35

–0.40

–0.45

–0.50

–50 –25

LINE REGULATION vs TEMPERATURE

I

OUT

= 200mA, (V

OUT

+ 1V) < V

IN

< 10

I

OUT

= 200mA, (V

OUT

+ 0.4V) < V

IN

< 10

0

I

OUT

= 400mA, (V

OUT

+ 1V) < V

IN

< 10

I

OUT

= 400mA, (V

OUT

+ 0.4V) < V

IN

< 10

25 50

Temperature (

°

C)

75 100 125

400

350

300

250

200

150

100

50

0

0

DC DROPOUT VOLTAGE vs OUTPUT CURRENT

50 100 150 200 250

Output Current (mA)

300

–55

°

C

+25

°

C

+125

°

C

350 400

DC DROPOUT VOLTAGE vs TEMPERATURE

400

350

300

250

200

150

100

50

0

–50

I

OUT

= 400mA

–25 0 25 50 75

Junction Temperature (

°

C)

100 125

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REG113

SBVS031D

TYPICAL CHARACTERISTICS

(Cont.)

For all models, at T

J

= +25

°

C and V

ENABLE

= 1.8V, unless otherwise noted.

10

8

6

4

18

16

14

12

2

0

OUTPUT VOLTAGE ACCURACY HISTOGRAM

Error (%)

0.8

0.6

0.4

0.2

0

–0.2

–0.4

–0.6

–0.8

–50 –25

OUTPUT VOLTAGE vs TEMPERATURE

(Referred to I

OUT

= 200mA at +25

°

C)

I

OUT

= 5mA

I

I

OUT

OUT

= 200mA

= 400mA

0 25 50

Temperature (

°

C)

75 100 125

10

5

0

20

15

30

25

OUTPUT VOLTAGE DRIFT HISTOGRAM

V

OUT

Drift (ppm/

°

C)

GROUND PIN CURRENT, NOT ENABLED vs TEMPERATURE

1

µ

V

ENABLE

= 0.5V

V

IN

= V

OUT

+ 1V

100n

10n

1n

100p

–50 –25 0 25 50

Temperature (

°

C)

75 100 125

1000

900

800

700

600

500

400

300

200

100

0

0

GROUND CURRENT vs LOAD CURRENT

V

V

V

OUT

OUT

OUT

= 2.5V

= 3.3V

= 5.0V

50 100 150 200 250 300 350 400

Load Current (mA)

1000

950

GROUND CURRENT vs TEMPERATURE

I

OUT

= 400mA

V

OUT

= 2.5V

V

OUT

= 3.3V

V

OUT

= 5.0V

900

850

800

750

700

–50 –25 0 25 50

Temperature (

°

C)

75 100 125

REG113

SBVS031D

www.ti.com

5

6

TYPICAL CHARACTERISTICS

(Cont.)

For all models, at T

J

= +25

°

C and V

ENABLE

= 1.8V, unless otherwise noted.

RIPPLE REJECTION vs FREQUENCY

80

70

60

50

I

OUT

= 2mA

I

OUT

= 100mA

40

30

I

C

OUT

OUT

= 2mA

= 10

µ

F

I

OUT

C

= 100mA

OUT

= 10

µ

F

20

10

0

10 100 1k

C

OUT

= 0

10k

µ

F

Frequency (Hz)

100k 1M 10M

RIPPLE REJECTION vs (V

IN

– V

OUT

)

20

15

30

25

10

5

Frequency = 100kHz

C

OUT

= 10

µ

F

V

OUT

= 3.3V

I

OUT

= 100mA

0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

V

IN

– V

OUT

(V)

0.2

0.1

0

60

50

RMS NOISE VOLTAGE vs C

OUT

REG113-5.0

40

30

REG113-3.3

20

10

0

0.1

C

OUT

= 0.01

µ

F

10Hz < BW < 100kHz

1

C

OUT

(

µ

F)

REG113-2.5

10

RMS NOISE VOLTAGE vs C

NR

110

100

90

80

REG113-3.3

REG113-5.0

70

60

50

REG113-2.5

40

30

20

1

C

OUT

= 0

µ

F

10Hz < BW < 100kHz

10 100

C

NR

(pF)

1k 10k

10

I

OUT

C

NR

= 100mA

= 0

µ

F

NOISE SPECTRAL DENSITY

1

C

OUT

= 1

µ

F

0.1

C

OUT

= 0

µ

F

C

OUT

= 10

µ

F

0.01

10 100 1k

Frequency (Hz)

10k 100k

10

I

OUT

C

NR

= 100mA

= 0.01

µ

F

NOISE SPECTRAL DENSITY

1

0.1

0.01

10

C

OUT

= 1

µ

F

100 1k

Frequency (Hz)

C

OUT

= 0

µ

F

10k

C

OUT

= 10

µ

F

100k

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REG113

SBVS031D

TYPICAL CHARACTERISTICS

(Cont.)

For all models, at T

J

= +25

°

C and V

ENABLE

= 1.8V, unless otherwise noted.

CURRENT LIMIT FOLDBACK

3.5

3.0

2.5

2.0

V

OUT

= 3.3V

I

CL

1.5

1.0

I

SC

0.5

0

0 50 100 150 200 250 300 350 400 450 500 550

Output Current Limit (mA)

400

350

300

250

600

550

500

450

200

150

100

–50 –25

CURRENT LIMIT vs TEMPERATURE

0

I

CL

(Current Limit)

I

SC

(Short-Circuit Current)

25 50

Temperature (

°

C)

75 100 125

400mA

40mA

LOAD TRANSIENT RESPONSE

C

OUT

= 0

REG113-3.3

V

IN

= 4.3V

V

OUT

C

OUT

= 10

µ

F

V

OUT

I

OUT

5.3V

4.3V

10

µ s/div

LINE TRANSIENT RESPONSE

C

OUT

= 0

REG113-3.3

I

OUT

= 400mA

V

OUT

C

OUT

= 10

µ

F

V

OUT

50

µ s/div

V

IN

TURN-ON

R

C

OUT

= 0

µ

LOAD

= 660

F

C

OUT

R

LOAD

= 10

µ

F

= 13

C

OUT

R

LOAD

= 0

µ

F

= 13

V

OUT

REG113-3.3

V

IN

= V

C

NR

OUT

+ 1V

= 0.01

µ

F

V

ENABLE

250

µ s/div

C

OUT

R

LOAD

= 0

µ

F

= 660

TURN-OFF

C

OUT

R

LOAD

= 10

µ

F

= 13

C

OUT

= 1.0

R

LOAD

µ

F

= 13

V

OUT

V

ENABLE

REG113-3.3

200

µ s/div

REG113

SBVS031D

www.ti.com

7

TYPICAL CHARACTERISTICS

(Cont.)

For all models, at T

J

= +25

°

C and V

ENABLE

= 1.8V, unless otherwise noted.

I

ENABLE

vs V

ENABLE

10

µ

1.0

µ

100n

10n

T = +125

°

C

T = +25

°

C

1n

6 7

T = –55

°

C

8

V

ENABLE

(V)

9 10

V

R

OUT

= 3.0V

LOAD

= 12

POWER-UP/POWER-DOWN

1s/div

8

BASIC OPERATION

The REG113 series of LDO (low dropout) linear regulators offers a wide selection of fixed output voltage versions and an adjustable output version. The REG113 belongs to a family of new generation LDO regulators that use a DMOS pass transistor to achieve ultra low-dropout performance and freedom from output capacitor constraints. Ground pin current remains under 1mA over all line, load, and temperature conditions. All versions have thermal and over-current protection, including foldback current limit.

The REG113 does not require an output capacitor for regulator stability and is stable over most output currents and with almost any value and type of output capacitor up to 10

µ

F or more. For applications where the regulator output current drops below several milliamps, stability can be enhanced by adding a 1k

to 2k

load resistor, using capacitance values smaller than 10

µ

F, or keeping the effective series resistance greater than 0.05

including the capacitor ESR and parasitic resistance in printed circuit board traces, solder joints, and sockets.

Although an input capacitor is not required, it is a good standard analog design practice to connect a 0.1

µ

F low

ESR capacitor across the input supply voltage; this is recommended to counteract reactive input sources and improve ripple rejection by reducing input voltage ripple.

Figure 1 shows the basic circuit connections for the fixed voltage models.

INTERNAL CURRENT LIMIT

The REG113 internal current limit has a typical value of

500mA. A foldback feature limits the short-circuit current to a typical short-circuit value of 200mA. A curve of V

OUT versus I

OUT

is given in Figure 2, and in the Typical Characteristics section.

V

IN

Enable

0.1

µ

F

In

REG113

Gnd NR

Out

C

NR

0.01

µ

F

C

OUT

V

OUT

Optional

FIGURE 1. Fixed Voltage Nominal Circuit for the REG113.

CURRENT LIMIT FOLDBACK

1.5

1.0

0.5

3.5

3.0

2.5

2.0

V

OUT

= 3.3V

I

SC

I

CL

0

0 50 100 150 200 250 300 350 400 450 500 550

Output Current Limit (mA)

FIGURE 2. Foldback Current Limit of the REG113-3.3 at 25

°

C.

ENABLE

The Enable pin is active high and compatible with standard

TTL-CMOS levels. Inputs below 0.5V (max) turn the regulator off and all circuitry is disabled. Under this condition, ground pin current drops to approximately 10nA. When not used, the Enable pin can be connected to V

IN

.

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REG113

SBVS031D

OUTPUT NOISE

A precision bandgap reference is used to generate the internal reference voltage, V

REF

. This reference is the dominant noise source within the REG113 and generates approximately 29

µ

Vrms in the 10Hz to 100kHz bandwidth at the reference output. The regulator control loop gains up the reference noise, so that the noise voltage of the regulator is approximately given by:

V

N

=

29

µ

Vrms

R

1

+

R

2

R 2

=

29

µ

Vrms

V

OUT

V

REF

(1)

Since the value of V

REF

is 1.26V, this relationship reduces to:

V

N

=

23

µ

Vrms

V

V

OUT

(2)

Connecting a capacitor, C

NR

, from the Noise Reduction (NR) pin to ground (as shown in Figure 3) forms a low-pass filter for the voltage reference. For C

NR

= 10nF, the total noise in the 10Hz to 100kHz bandwidth is reduced by approximately a factor of 2.8 for V

OUT

= 3.3V. This noise reduction effect is shown in Figure 4, and as RMS Noise Voltage vs C

NR

in the

Typical Characteristics section.

Noise can be further reduced by carefully choosing an output capacitor, C

OUT

. Best overall noise performance is achieved with very low (< 0.22

µ

F) or very high (> 2.2

µ

F) values of C

OUT

(see the RMS Noise Voltage vs C

OUT

typical characteristic).

The REG113 uses an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the

DMOS pass element above V

IN

. The charge-pump switching noise (nominal switching frequency = 2MHz) is not measurable at the output of the regulator over most values of I

OUT and C

OUT

.

DROPOUT VOLTAGE

The REG113 uses an N-channel DMOS as the pass element. When (V

IN

– V

OUT

) is less than the dropout voltage

(V

DROP

), the DMOS pass device behaves like a resistor; therefore, for low values of (V

IN

– V

OUT

), the regulator inputto-output resistance is the Rds

ON

of the DMOS pass element

(typically 600m

). For static (DC) loads, the REG113 will

RMS NOISE VOLTAGE vs C

NR

110

100

90

80

REG113-5.0

REG113-3.3

70

60

REG113-2.5

50

40

30

20

0.1

C

OUT

= 0

µ

F

10Hz < BW < 100kHz

10 100

C

NR

(pF)

1k 10k

FIGURE 4. Output Noise versus Noise Reduction Capacitor.

typically maintain regulation down to a (V

IN

– V

OUT

) voltage drop of 250mV at full rated output current. In Figure 5, the bottom line (DC dropout) shows the minimum V

IN

to V

OUT voltage drop required to prevent dropout under DC load conditions.

600

500

400

300

200

DROPOUT VOLTAGE vs I

OUT

Dropout for 0mA to I

OUT

Transient

DC Dropout

100

0

0 50 100 150 200 250

I

OUT

(mA)

FIGURE 5. Transient and DC Dropout.

300 350 400

V

IN

NR

Low-Noise

Charge Pump

C

NR

(optional)

V

REF

(1.26V)

DMOS

Output

Over-Current

Over Temp

Protection

V

OUT

Enable

REG113

GND

FIGURE 3. Block Diagram.

REG113

SBVS031D

www.ti.com

9

For large step changes in load current, the REG113 requires a larger voltage drop across it to avoid degraded transient response. The boundary of this transient dropout region is shown as the top line in Figure 5. Values of V

IN

to V

OUT

voltage drop above this line insure normal transient response.

In the transient dropout region between DC and Transient, transient response recovery time increases. The time required to recover from a load transient is a function of both the magnitude and rate of the step change in load current and the available headroom V

IN

to V

OUT

voltage drop. Under worst-case conditions (full-scale load change with (V

IN

– V

OUT

) voltage drop close to DC dropout levels), the REG113 can take several hundred microseconds to re-enter the specified window of regulation.

TRANSIENT RESPONSE

The REG113 response to transient line and load conditions improves at lower output voltages. The addition of a capacitor

(nominal value 0.47

µ

F) from the output pin to ground may improve the transient response. In the adjustable version, the addition of a capacitor, C

FB

(nominal value 10nF), from the output to the adjust pin also improves the transient response.

THERMAL PROTECTION

Power dissipated within the REG113 can cause the junction temperature to rise, however, the REG113 has thermal shutdown circuitry that protects the regulator from damage.

The thermal protection circuitry disables the output when the junction temperature reaches approximately 160

°

C, allowing the device to cool. When the junction temperature cools to approximately 140

°

C, the output circuitry is again enabled. Depending on various conditions, the thermal protection circuit can cycle on and off. This limits the dissipation of the regulator, but can have an undesirable effect on the load.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink.

For reliable operation, junction temperature should be limited to 125

°

C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered. Use worst-case loads and signal conditions. For good reliability, thermal protection should trigger more than 35

°

C above the maximum expected ambient condition of the application. This produces a worst-case junction temperature of 125

°

C at the highest expected ambient temperature and worst-case load.

The internal protection circuitry of the REG113 is designed to protect against overload conditions and is not intended to replace proper heat sinking. Continuously running the REG113 into thermal shutdown will degrade reliability.

POWER DISSIPATION

The REG113 is available in two different package configurations. The ability to remove heat from the die is different for each package type and, therefore, presents different considerations in the printed circuit board (PCB) layout. On the MSOP-8 package, leads 5 through 8 are fused to the lead frame and may be used to improve the thermal performance of the package.

The PCB area around the device that is free of other components moves the heat from the device to the ambient air.

Although it is difficult or impossible to quantify all of the variables in a thermal design of this type, performance data for several simplified configurations are shown in Figure 6. In all cases the PCB copper area is bare copper, free of solder resist mask, and not solder plated. All examples are for 1-ounce copper and in the case of the MSOP-8, the copper area is connected to fused leads 5 to 8. See Figure 7 for thermal resistance for varying areas of copper. Using heavier copper can increase the effectiveness in removing the heat from the device. In those examples where there is copper on both sides of the PCB, no connection has been provided between the two sides. The addition of plated through holes will improve the heat sink effectiveness.

3.0

2.5

MAXIMUM POWER DISSIPATION vs TEMPERATURE

Condition 1

Condition 2

Condition 3

2.0

1.5

1.0

0.5

0

–50 –25 0 25 50 75

Ambient Temperature (

°

C)

100 125

CONDITION PACKAGE

1

2

3

MSOP-8

MSOP-8

SOT-23-8

PCB AREA

1 sq. in. Cu, 1 Side

0.25 sq. in. Cu, 1 Side

None

θ

JA

71

90

200

FIGURE 6. Maximum Power Dissipation versus Ambient Temperature for the Various Packages and PCB Heat

Sink Configurations.

10

www.ti.com

REG113

SBVS031D

Power dissipation depends on input voltage, load conditions, and duty cycle and is equal to the product of the average output current times the voltage across the output element (V

IN

to V

OUT voltage drop):

P

D

=

( V

IN

– V

OUT

)

I

OUT

(3)

Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage.

THERMAL RESISTANCE vs PCB COPPER AREA

160

150

140

130

120

110

100

90

80

70

60

0 1 2 3

Copper Area (inches

2

)

4 5

FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8.

REG113

SBVS031D

www.ti.com

11

www.ti.com

PACKAGE OPTION ADDENDUM

16-Mar-2007

PACKAGING INFORMATION

Orderable Device Status

(1)

REG113EA-2.5/250 ACTIVE

Package

Type

MSOP

Package

Drawing

DGK

REG113EA-2.5/250G4

REG113EA-2.5/2K5

REG113EA-2.5/2K5G4

REG113EA-2.85/250

REG113EA-2.85/2K5

REG113EA-3.3/250

REG113EA-3.3/2K5

REG113EA-3/250

REG113EA-3/250G4

REG113EA-3/2K5

REG113EA-3/2K5G4

REG113EA-5/250

REG113EA-5/250G4

REG113EA-5/2K5

REG113EA-5/2K5G4

REG113EA285250G4

REG113EA2852K5G4

REG113EA33250G4

REG113EA332K5G4

REG113NA-2.5/250

REG113NA-2.5/250G4

REG113NA-2.5/3K

REG113NA-2.5/3KG4

REG113NA-2.85/250

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DBV

DBV

DBV

DBV

DBV

Eco Plan

(2)

Pins Package

Qty

8 250 Green (RoHS & no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU Level-2-260C-1 YEAR

8 CU NIPDAU Level-2-260C-1 YEAR

8

250 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

8 CU NIPDAU Level-2-260C-1 YEAR

8

8

8

8

8

8

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

8 CU NIPDAU Level-2-260C-1 YEAR

8

8

8

8

8

8

8

8

2500 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

Level-2-260C-1 YEAR

8

5

5

5

5

5

2500 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Addendum-Page 1

www.ti.com

PACKAGE OPTION ADDENDUM

16-Mar-2007

Orderable Device

REG113NA-2.85/3K

REG113NA-2.85/3KG4

REG113NA-3.3/250

REG113NA-3.3/250G4

REG113NA-3.3/3K

REG113NA-3.3/3KG4

REG113NA-3/250

REG113NA-3/250G4

REG113NA-3/3K

REG113NA-3/3KG4

REG113NA-5/250

REG113NA-5/250G4

REG113NA-5/3K

REG113NA-5/3KG4

REG113NA2.85/250G4

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package

Type

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

Package

Drawing

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

DBV

Pins Package

Qty

5

Eco Plan

(2)

3000 Green (RoHS & no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU Level-1-260C-UNLIM

5 3000 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

5

5

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

5 CU NIPDAU Level-1-260C-UNLIM

5

5

5

3000 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

5 CU NIPDAU Level-1-260C-UNLIM

5

5

5

5

5

5

3000 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

3000 Green (RoHS & no Sb/Br)

250 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

Addendum-Page 2

www.ti.com

PACKAGE OPTION ADDENDUM

16-Mar-2007 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

6-Nov-2008

*All dimensions are nominal

Device

REG113EA-2.5/250

REG113EA-2.5/2K5

REG113EA-2.85/250

REG113EA-2.85/2K5

REG113EA-3.3/250

REG113EA-3.3/2K5

REG113EA-3/250

REG113EA-3/2K5

REG113EA-5/250

REG113EA-5/2K5

REG113NA-2.5/250

REG113NA-2.5/3K SOT-23 DBV

REG113NA-2.85/250 SOT-23 DBV

REG113NA-2.85/3K

REG113NA-3.3/250

REG113NA-3.3/3K

REG113NA-3/250

REG113NA-3/3K

Package

Type

Package

Drawing

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

SOT-23

SOT-23

SOT-23

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

MSOP DGK

SOT-23 DBV

DBV

DBV

SOT-23 DBV

SOT-23 DBV

DBV

Pins

8

8

8

8

8

8

8

8

8

8

5

5

5

5

5

5

5

5

SPQ

2500

250

2500

250

3000

250

3000

250

250

2500

250

2500

250

2500

250

3000

250

3000

330.0

180.0

330.0

179.0

179.0

179.0

179.0

179.0

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

180.0

12.4

330.0

180.0

12.4

12.4

330.0

180.0

330.0

180.0

12.4

12.4

12.4

12.4

179.0

179.0

179.0

8.4

8.4

8.4

8.4

8.4

8.4

8.4

12.4

12.4

12.4

8.4

A0 (mm)

3.2

3.2

3.2

3.2

5.3

5.3

5.3

3.2

5.3

5.3

5.3

5.3

5.3

5.3

5.3

3.2

3.2

3.2

B0 (mm)

3.2

3.2

3.2

3.2

3.4

3.4

3.4

3.2

3.4

3.4

3.4

3.4

3.4

3.4

3.4

3.2

3.2

3.2

K0 (mm) P1

(mm)

W

(mm)

Pin1

Quadrant

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

1.4

4.0

4.0

4.0

4.0

8.0

8.0

8.0

4.0

8.0

8.0

8.0

8.0

8.0

8.0

8.0

4.0

4.0

4.0

8.0

8.0

8.0

8.0

12.0

12.0

12.0

8.0

12.0

12.0

12.0

12.0

12.0

12.0

12.0

8.0

8.0

8.0

Q3

Q3

Q3

Q3

Q1

Q1

Q1

Q3

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q3

Q3

Q3

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

6-Nov-2008

Device

REG113NA-5/250

REG113NA-5/3K

Package

Type

Package

Drawing

SOT-23

SOT-23

DBV

DBV

Pins

5

5

SPQ

250

3000

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

179.0

8.4

179.0

8.4

A0 (mm)

3.2

3.2

B0 (mm)

3.2

3.2

K0 (mm) P1

(mm)

W

(mm)

Pin1

Quadrant

1.4

1.4

4.0

4.0

8.0

8.0

Q3

Q3

*All dimensions are nominal

Device

REG113EA-2.5/250

REG113EA-2.5/2K5

REG113EA-2.85/250

REG113EA-2.85/2K5

REG113EA-3.3/250

REG113EA-3.3/2K5

REG113EA-3/250

REG113EA-3/2K5

REG113EA-5/250

REG113EA-5/2K5

REG113NA-2.5/250

REG113NA-2.5/3K

REG113NA-2.85/250

REG113NA-2.85/3K

REG113NA-3.3/250

Package Type Package Drawing Pins

MSOP

MSOP

MSOP

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

MSOP

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DGK

DBV

DBV

DBV

DBV

DBV

8

5

5

8

8

5

5

5

8

8

8

8

8

8

8

SPQ

2500

250

2500

250

3000

250

3000

250

250

2500

250

2500

250

2500

250

Length (mm) Width (mm) Height (mm)

346.0

190.5

346.0

195.0

195.0

195.0

195.0

195.0

190.5

346.0

190.5

346.0

190.5

346.0

190.5

212.7

346.0

212.7

346.0

212.7

346.0

212.7

346.0

212.7

346.0

200.0

200.0

200.0

200.0

200.0

29.0

31.8

29.0

45.0

45.0

45.0

45.0

45.0

31.8

29.0

31.8

29.0

31.8

29.0

31.8

Pack Materials-Page 2

www.ti.com

PACKAGE MATERIALS INFORMATION

6-Nov-2008

Device

REG113NA-3.3/3K

REG113NA-3/250

REG113NA-3/3K

REG113NA-5/250

REG113NA-5/3K

Package Type Package Drawing Pins

SOT-23

SOT-23

SOT-23

SOT-23

SOT-23

DBV

DBV

DBV

DBV

DBV

5

5

5

5

5

SPQ

3000

250

3000

250

3000

Length (mm) Width (mm) Height (mm)

195.0

195.0

195.0

195.0

195.0

200.0

200.0

200.0

200.0

200.0

45.0

45.0

45.0

45.0

45.0

Pack Materials-Page 3

IMPORTANT NOTICE

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

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