UCC2804

UCC2804
application
INFO
available
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
Low-Power BiCMOS Current-Mode PWM
FEATURES
DESCRIPTION
• 100µA Typical Starting Supply Current
The UCC1800/1/2/3/4/5 family of high-speed, low-power integrated circuits contain all of the control and drive components required for off-line
and DC-to-DC fixed frequency current-mode switching power supplies
with minimal parts count.
• 500µA Typical Operating Supply
Current
• Operation to 1MHz
These devices have the same pin configuration as the UC1842/3/4/5
family, and also offer the added features of internal full-cycle soft start
and internal leading-edge blanking of the current-sense input.
• Internal Soft Start
• Internal Fault Soft Start
• Internal Leading-Edge Blanking of the
Current Sense Signal
• 1 Amp Totem-Pole Output
• 70ns Typical Response from
Current-Sense to Gate Drive Output
• 1.5% Tolerance Voltage Reference
• Same Pinout as UC3842 and
UC3842A
Part Number
UCCx800
UCCx801
UCCx802
UCCx803
UCCx804
UCCx805
The UCC1800/1/2/3/4/5 family offers a variety of package options, temperature range options, choice of maximum duty cycle, and choice of
critical voltage levels. Lower reference parts such as the UCC1803 and
UCC1805 fit best into battery operated systems, while the higher reference and the higher UVLO hysteresis of the UCC1802 and UCC1804
make these ideal choices for use in off-line power supplies.
o
o
The UCC180x series is specified for operation from –55 C to +125 C,
o
o
the UCC280x series is specified for operation from –40 C to +85 C, and
o
o
the UCC380x series is specified for operation from 0 C to +70 C.
Maximum Duty Cycle
100%
50%
100%
100%
50%
50%
Reference Voltage
5V
5V
5V
4V
5V
4V
Turn-On Threshold
7.2V
9.4V
12.5V
4.1V
12.5V
4.1V
Turn-Off Threshold
6.9V
7.4V
8.3V
3.6V
8.3V
3.6V
BLOCK DIAGRAM
UDG92009-3
SLUS270C - MARCH 1999 - REVISED JANUARY 2005
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS (Note 1)
VCC Voltage (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0V
VCC Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 30.0mA
OUT Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.0A
OUT Energy (Capacitive Load) . . . . . . . . . . . . . . . . . . . 20.0µJ
Analog Inputs (FB, CS) . . . . . . . . . . . . . . . . . . . . –0.3V to 6.3V
Power Dissipation at TA < +25°C (N or J Package) . . . . . 1.0W
Power Dissipation at TA < +25°C (D Package). . . . . . . . 0.65W
Power Dissipation at TA < +25°C (L Package) . . . . . . . 1.375W
Storage Temperature Range. . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . +300°C
Note 1: Values beyond which damage may occur. All voltages
are with respect to GND. All currents are positive into
the specified terminal. Consult Unitrode databook for
information regarding thermal specifications and limitations of packages.
Note 2: In normal operation VCC is powered through a current
limiting resistor. Absolute maximum of 12V applies
when VCC is driven from a low impedance source such
that ICC does not exceed 30mA (which includes gate
drive current requirement). The resistor should be
sized so that the VCC voltage, under operating conditions is below 12V but above the turn off threshold.
TSSOP-8 (Top View)
PW Package
1
COMP
REF
8
2
FB
VCC
7
3
CS
OUT
6
4
RC
GND
5
DIL-8, SOIC-8 (Top View)
J or N, D Package
COMP
1
8
REF
FB
2
7
VCC
CS
3
6
OUT
RC
4
5
GND
TEMPERATURE AND PACKAGE SELECTION
UCC180X
UCC280X
UCC380X
Temperature Range
–55°C to +125°C
–40°C to +85°C
0°C to +70°C
Available Packages
J, L
N, D, PW
N, D, PW
LCC-20
(TOP VIEW)
L Package
ORDERING INFORMATION
UCC
80
P ACKAGE
P RODUCT OP TION
TEMP ERATURE RANGE
2
PACKAGE PIN FUNCTION
FUNCTION
PIN
N/C
1
Comp
2
N/C
3-4
FB
5
N/C
6
CS
7
N/C
8-9
RC
10
N/C
11
PWR GND
12
GND
13
N/C
14
OUT
15
N/C
16
VCC
17
N/C
18-19
REF
20
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for –55°C ≤ TA ≤ +125°C for
UCC180x; –40°C ≤ TA ≤ +85°C for UCC280x; 0°C ≤ TA ≤ +70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;
CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ.
PARAMETER
TEST CONDITIONS
UCC180X
UCC280X
MIN
TYP
UCC380X
MAX
MIN
UNITS
TYP
MAX
TJ=+25°C, I=0.2mA, UCCx800/1/2/4
4.925 5.00 5.075 4.925 5.00
5.075
TJ=+25°C, I=0.2mA, UCCx803/5
3.94
4.00
4.06
10
25
mV
Reference Section
Output Voltage
4.00
4.06
10
30
3.94
V
Load Regulation
0.2mA<I<5mA
Line Regulation
TJ=+25°C,
VCC=10V to Clamp (IVCC=25mA)
1.9
1.9
mV/V
TJ=–55°C to +125°C,
VCC=10V to Clamp (IVCC=25mA)
2.5
2.1
mV/V
Total Variation
UCCx800/1/2/4 (Note 7)
4.88
5.00
5.10
4.88
5.00
5.10
V
UCCx803/5 (Note 7)
3.90
4.00
4.08
3.90
4.00
4.08
V
Output Noise Voltage
10Hz ≤ f ≤ 10kHz, TJ=+25°C (Note 9)
Long Term Stability
TA=+125°C, 1000 Hours (Note 9)
Output Short Circuit
130
130
µV
5
5
mV
–5
–35
–5
46
52
40
31
36
26
–35
mA
46
52
kHz
31
36
kHz
Oscillator Section
Oscillator Frequency
Temperature Stability
UCCx800/1/2/4 (Note 4)
40
UCCx803/5 (Note 4)
26
(Note 9)
2.5
Amplitude peak-to-peak
2.25
Oscillator Peak Voltage
2.40
2.5
2.55
2.25
2.45
2.40
%
2.55
2.45
V
V
Error Amplifier Section
Input Voltage
COMP=2.5V; UCCx800/1/2/4
2.44
2.50
2.56
2.44
2.50
2.56
COMP=2.0V; UCCx803/5
1.95
2.0
2.05
1.95
2.0
2.05
1
–1
Input Bias Current
–1
Open Loop Voltage Gain
60
COMP Sink Current
FB=2.7V, COMP=1.1V
0.3
COMP Source Current
FB=1.8V, COMP=REF–1.2V
–0.2
Gain Bandwidth Product
(Note 9)
80
–0.5
60
3.5
0.4
–0.8
–0.2
2
1
80
µA
dB
2.5
–0.5
V
–0.8
2
mA
mA
MHz
PWM Section
Maximum Duty Cycle
Minimum Duty Cycle
UCCx800/2/3
97
99
100
97
99
100
UCCx801/4/5
48
49
50
48
49
50
COMP=0V
0
%
0
%
Current Sense Section
Gain
(Note 5)
1.10
1.65
1.80
1.10
1.65
1.80
V/V
Maximum Input Signal
COMP=5V (Note 6)
0.9
1.0
1.1
0.9
1.0
1.1
V
–200
Input Bias Current
CS Blank Time
Over-Current Threshold
COMP to CS Offset
CS=0V
3
200
–200
200
nA
50
100
150
50
100
150
ns
1.42
1.55
1.68
1.42
1.55
1.68
V
0.45
0.90
1.35
0.45
0.90
1.35
V
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for –55°C ≤ TA ≤ +125°C for
UCC180x; –40°C ≤ TA ≤ +85°C for UCC280x; 0°C ≤ TA ≤ +70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;
CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ.
PARAMETER
TEST CONDITIONS
UCC180X
UCC280X
UCC380X
UNITS
Output Section
OUT Low Level
I=20mA, all parts
0.1
0.4
0.1
0.4
V
I=200mA, all parts
0.35
0.90
0.35
0.90
V
I=50mA, VCC=5V, UCCx803/5
0.15
0.40
0.15
0.40
V
I=20mA, VCC=0V, all parts
0.7
1.2
0.7
1.2
V
I=–20mA, all parts
0.15
0.40
0.15
0.40
V
I=–200mA, all parts
1.0
1.9
1.0
1.9
V
I=–50mA,VCC=5V, UCCx803/5
0.4
0.9
0.4
0.9
V
Rise Time
CL=1nF
41
70
41
70
ns
Fall Time
CL=1nF
44
75
44
75
ns
OUT High VSAT
(VCC-OUT)
Undervoltage Lockout Section
Start Threshold (Note 8)
Stop Threshold (Note 8)
UCCx800
6.6
7.2
7.8
6.6
7.2
7.8
V
UCCx801
8.6
9.4
10.2
8.6
9.4
10.2
V
UCCx802/4
11.5
12.5
13.5
11.5
12.5
13.5
V
UCCx803/5
3.7
4.1
4.5
3.7
4.1
4.5
V
UCCx1800
6.3
6.9
7.5
6.3
6.9
7.5
V
UCCx1801
6.8
7.4
8.0
6.8
7.4
8.0
V
UCCx802/4
7.6
8.3
9.0
7.6
8.3
9.0
V
UCCx803/5
3.2
3.6
4.0
3.2
3.6
4.0
V
Undervoltage Lockout Section (cont.)
Start to Stop Hysteresis
UCCx800
0.12
0.3
0.48
0.12
0.3
0.48
V
UCCx801
1.6
2
2.4
1.6
2
2.4
V
UCCx802/4
3.5
4.2
5.1
3.5
4.2
5.1
V
UCCx803/5
0.2
0.5
0.8
0.2
0.5
0.8
V
4
10
4
10
ms
Soft Start Section
COMP Rise Time
FB=1.8V, Rise from 0.5V to REF–1V
Overall Section
Start-up Current
VCC < Start Threshold
0.1
0.2
0.1
0.2
mA
Operating Supply Current
FB=0V, CS=0V
0.5
1.0
0.5
1.0
mA
VCC Internal Zener Voltage
ICC=10mA (Note 8), (Note 10)
12
13.5
15
12
13.5
15
V
0.5
1.0
0.5
1.0
VCC Internal Zener Voltage Minus UCCx802/4 (Note 8)
Start Threshold Voltage
Note 3: Adjust VCC above the start threshold before setting at 10V.
Note 4: Oscillator frequency for the UCCx800, UCCx802 and UCCx803 is the output frequency.
Oscillator frequency for the UCCx801, UCCx804 and UCCx805 is twice the output frequency.
∆ VCOMP
Note 5: Gain is defined by: A =
0 ≤ VCS ≤ 0.8V .
∆ VCS
Note 6: Parameter measured at trip point of latch with Pin 2 at 0V.
Note 7: Total Variation includes temperature stability and load regulation.
Note 8: Start Threshold, Stop Threshold and Zener Shunt Thresholds track one another.
Note 9: Guaranteed by design. Not 100% tested in production.
Note 10: The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.
4
V
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
PIN DESCRIPTIONS
COMP: COMP is the output of the error amplifier and the
input of the PWM comparator.
performance, keep the timing capacitor lead to GND as
short and direct as possible. If possible, use separate
ground traces for the timing capacitor and all other functions.
Unlike other devices, the error amplifier in the UCC3800
family is a true, low output-impedance, 2MHz operational
amplifier. As such, the COMP terminal can both source
and sink current. However, the error amplifier is internally
current limited, so that you can command zero duty cycle
by externally forcing COMP to GND.
The frequency of oscillation can be estimated with the
following equations:
UCCx800/1/2/4:
The UCC3800 family features built-in full cycle Soft Start.
Soft Start is implemented as a clamp on the maximum
COMP voltage.
F=
UCCx803, UCCx805:
1.5
R •C
F=
10
.
R •C
where frequency is in Hz, resistance is in ohms, and capacitance is in farads. The recommended range of timing
resistors is between 10k and 200k and timing capacitor is
100pF to 1000pF. Never use a timing resistor less than
10k.
CS: CS is the input to the current sense comparators.
The UCC3800 family has two different current sense
comparators: the PWM comparator and an over-current
comparator.
The UCC3800 family contains digital current sense filtering, which disconnects the CS terminal from the current
sense comparator during the 100ns interval immediately
following the rising edge of the OUT pin. This digital filtering, also called leading-edge blanking, means that in
most applications, no analog filtering (RC filter) is required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller
effective CS to OUT propagation delay. Note, however,
that the minimum non-zero On-Time of the OUT signal is
directly affected by the leading-edge-blanking and the CS
to OUT propagation delay.
To prevent noise problems, bypass VCC to GND with a
ceramic capacitor as close to the VCC pin as possible.
An electrolytic capacitor may also be used in addition to
the ceramic capacitor.
REF: REF is the voltage reference for the error amplifier
and also for many other functions on the IC. REF is also
used as the logic power supply for high speed switching
logic on the IC.
When VCC is greater than 1V and less than the UVLO
threshold, REF is pulled to ground through a 5k ohm resistor. This means that REF can be used as a logic output indicating power system status. It is important for
reference stability that REF is bypassed to GND with a
ceramic capacitor as close to the pin as possible. An
electrolytic capacitor may also be used in addition to the
ceramic capacitor. A minimum of 0.1µF ceramic is required. Additional REF bypassing is required for external
loads greater than 2.5mA on the reference.
The over-current comparator is only intended for fault
sensing, and exceeding the over-current threshold will
cause a soft start cycle.
FB: FB is the inverting input of the error amplifier. For
best stability, keep FB lead length as short as possible
and FB stray capacitance as small as possible.
GND: GND is reference ground and power ground for all
functions on this part.
To prevent noise problems with high speed switching
transients, bypass REF to ground with a ceramic capacitor very close to the IC package.
OUT: OUT is the output of a high-current power driver capable of driving the gate of a power MOSFET with peak
currents exceeding ± 750mA. OUT is actively held low
when VCC is below the UVLO threshold.
VCC: VCC is the power input connection for this device.
In normal operation VCC is powered through a current
limiting resistor. Although quiescent VCC current is very
low, total supply current will be higher, depending on
OUT current. Total VCC current is the sum of quiescent
VCC current and the average OUT current. Knowing the
operating frequency and the MOSFET gate charge (Qg),
average OUT current can be calculated from:
The high-current power driver consists of FET output devices, which can switch all of the way to GND and all of
the way to VCC. The output stage also provides a very
low impedance to overshoot and undershoot. This means
that in many cases, external schottky clamp diodes are
not required.
IOUT = Q g × F .
RC: RC is the oscillator timing pin. For fixed frequency
operation, set timing capacitor charging current by connecting a resistor from REF to RC. Set frequency by connecting a timing capacitor from RC to GND. For best
There should be a minimum of 1.0mF in parallel with a
0.1mF ceramic capacitor from VCC to ground located
close to the device
5
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
The UCC3800/1/2/3/4/5 oscillator generates a sawtooth
waveform on RC. The rise time is set by the time constant
of RT and CT. The fall time is set by CT and an internal transistor on-resistance of approximately 125 . During the fall
time, the output is off and the maximum duty cycle is reduced below 50% or 100% depending on the part number.
Larger timing capacitors increase the discharge time and reduce the maximum duty cycle and frequency.
Figure 2. Error amplifier gain/phase response.
Figure 1. Oscillator.
4.00
1000
Oscillator Freq. (kHz)
3.98
3.96
VREF (V)
3.94
3.92
3.90
3.88
10
0p
F
100
20
0p
33 F
0p
F
3.86
3.84
1n
F
10
3.82
4
4.2
4.4
4.6
4.8
5
5.2
VCC (V)
5.4
5.6
5.8
10
6
100
1000
RT (k )
Figure 3. UCC1803/5 VREF vs. VCC; ILOAD = 0.5mA.
Figure 4. UCC1800/1/2/4 oscillator frequency vs. RT and
CT.
6
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
1000
100
Maximum Duty Cycle (%)
0p
F
20
0p
F
33
0p
98
97.5
97
96.5
F
96
95.5
1n
F
10
10
pF
00
=1
CT
pF
00
=2
pF
30
=3
10
98.5
CT
100
99
CT
Oscillator Freq. (kHz)
99.5
95
100
1000
10
100
RT (k )
Figure 5. UCC1803/5 oscillator frequency vs. RT and CT.
Figure 6. UCC1800/2/3 maximum duty cycle vs.
oscillator frequency.
50
16
49.5
14
12
49
CT
ICC (mA)
pF
00
pF
30
=3
00
=2
pF
48
nF
,1
0V
=1
C
10
=1
CT
48.5
CT
Maximum Duty Cycle (%)
1000
Oscillator Frequency (kHz)
VC
8
F
n
V, 1
=8
C
VC
6
ad
47.5
4
47
VCC =
VCC = 8V,
2
0
0
46.5
10
100
1000
o Lo
10V, N
100
200
300
400
500
600
700
No Load
800
Oscillator Frequency (kHz)
Oscillator Frequency (kHz)
Figure 7. UCC1801/4/5 maximum duty cycle vs.
oscillator frequency.
Figure 8. UCC1800 ICC vs. oscillator frequency.
7
900 1000
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
8
500
450
7
UCC1803/5
,
0V
C
VC
ICC (mA)
5
400
=1
Dead Time (ns)
6
F
1n
nF
1
V,
8
C=
4
VC
3
VCC =
2
d
o Loa
10V, N
250
UCC1800/1/2/4
200
100
50
0
100
200
300
400
500
600
700
800
100
900 1000
Figure 8. UCC1805 ICC vs. oscillator frequency.
1.0
0.9
Slope = 1.8mV/°C
0.7
0.6
0
-55-50
-25
0
25
50
75
300
400
500
600
700
Figure 9. Dead time vs. CT, RT = 100k.
1.1
0.8
200
CT (pF)
Oscillator Frequency (kHz)
COMP to CS Offset (Volts)
300
150
d
, No Loa
VCC = 8V
1
0
0
350
100
125
Temperature (°C)
Figure 10. COMP to CS offset vs. temperature,
CS = 0V.
8
800
900
1000
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9451301MPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9451302MPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9451303MPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9451304MPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9451305MPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9451305VPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
UCC1800J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1800J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1800L883B
ACTIVE
LCCC
FK
20
1
TBD
UCC1801J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1801J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
UCC1802J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1802J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1803J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1803J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1804J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1804J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1805J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC1805J883B
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC2800D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2800DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2800DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2800DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2800N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2800NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2800PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2800PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2801D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2801NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2801PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2801PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2801QDRQ1G4
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC2802N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2802NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2802PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2802PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2803D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2803DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2803DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2803DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
UCC2803J
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
UCC2803N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2803NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2803PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2803PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2803PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2803PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2804D
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
UCC2804D/70021
OBSOLETE
SOIC
D
8
UCC2804DG4
ACTIVE
SOIC
D
8
UCC2804DR81221G4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
TBD
Call TI
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 2
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2804DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2804DTR/81221
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2804DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2804N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2804NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2804PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2804PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2804PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2804PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2805D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2805DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2805DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2805DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2805N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2805NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC2805PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2805PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3800D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3800DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3800DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3800DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3800N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3800NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3800PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3800PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC3801D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3801DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3801DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3801DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3801N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3801NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3801PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
UCC3801PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
UCC3801PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3801PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3802D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3802DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3802DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3802DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3802N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3802NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3802PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3802PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3803D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3803DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3803DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3803DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3803N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3803NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3803PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3803PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 4
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC3803PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3803PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3804D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3804DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3804DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3804DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3804N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3804NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3804PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3804PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3804PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3804PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3805D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3805DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3805DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3805DTR/81222G4
PREVIEW
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3805DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC3805N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3805NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3805PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3805PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC1800, UCC1801, UCC1802, UCC1803, UCC1804, UCC1805, UCC1805-SP, UCC2800, UCC2801,
UCC2802, UCC2802M, UCC2803, UCC2803M, UCC2804, UCC2805, UCC3800, UCC3801, UCC3802, UCC3803, UCC3804, UCC3805 :
UCC2800-Q1, UCC2801-Q1, UCC2802-Q1, UCC2803-Q1, UCC2804-Q1, UCC2805-Q1
• Automotive:
• Enhanced Product: UCC2800-EP, UCC2801-EP, UCC2802-EP, UCC2803-EP, UCC2804-EP, UCC2805-EP
NOTE: Qualified Version Definitions:
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
Enhanced
Product
- Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
UCC2800DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2801DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2802DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2803DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2803PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC2804DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2804DTR/81221
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2804PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC2805DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3800DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3801DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3801PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC3802DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3803DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3803PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC3804DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3804PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC3805DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC2800DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC2801DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC2802DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC2803DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC2803PWTR
TSSOP
PW
8
2000
346.0
346.0
29.0
UCC2804DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC2804DTR/81221
SOIC
D
8
2500
340.5
338.1
20.6
UCC2804PWTR
TSSOP
PW
8
2000
346.0
346.0
29.0
UCC2805DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3800DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3801DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3801PWTR
TSSOP
PW
8
2000
346.0
346.0
29.0
UCC3802DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3803DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3803PWTR
TSSOP
PW
8
2000
346.0
346.0
29.0
UCC3804DTR
SOIC
D
8
2500
340.5
338.1
20.6
UCC3804PWTR
TSSOP
PW
8
2000
346.0
346.0
29.0
UCC3805DTR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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