BQ2002C

BQ2002C
bq2002C
NiCd/NiMH Fast-Charge Management IC
Features
General Description
➤
The bq2002C Fast-Charge IC is a lowcost CMOS battery-charge controller
providing reliable charge termination
for both NiCd and NiMH battery applications. Controlling a current-limited
or constant-current supply allows the
bq2002C to be the basis for a costeffective stand-alone or system-integrated charger. The bq2002C integrates fast charge with pulsed-trickle
control in a single IC for charging one
or more NiCd or NiMH battery cells.
➤
➤
Fast charge of nickel cadmium
or nickel-metal hydride batteries
Direct LED output displays
charge status
Fast-charge termination by -∆V,
maximum voltage, maximum
temperature, and maximum
time
➤
Internal band-gap voltage reference
➤
Selectable pulse-trickle charge
rates
➤
Low-power mode
➤
8-pin 300-mil DIP or 150-mil
SOIC
Pin Connections
Fast charge is initiated on application
of the charging supply or battery
replacement. For safety, fast charge is
inhibited if the battery temperature
and voltage are outside configured
limits.
Fast charge is terminated by any of
the following:
n
Peak voltage detection (PVD)
n
Negative delta voltage (-∆V)
n
Maximum voltage
n
Maximum temperature
n
Maximum time
After fast charge, the bq2002C pulsetrickles the battery per t he preconfigured limits. Fast charge may be
inhibited using the INH pin. The
bq2002C may also be placed in lowstandby-power mode to reduce
system power consumption.
Pin Names
TM
1
8
CC
LED
2
7
INH
BAT
3
6
VCC
VSS
4
5
TS
TM
Timer mode select input
TS
Temperature sense input
LED
Charging status output
VCC
Supply voltage input
BAT
Battery voltage input
INH
Charge inhibit input
VSS
System ground
CC
Charge control output
8-Pin DIP or
Narrow SOIC
PN-200201.eps
SLUS136 - SEPTEMBER 1997
1
bq2002C
TM
Charge control output
CC
Pin Descriptions
An open-drain output used to control the
charging current to the battery. CC switching to high impedance (Z) enables charging
current to flow, and low to inhibit charging
current. CC is modulated to provide pulse
trickle.
Timer mode input
A three-level input that controls the settings
for the fast charge safety timer, voltage termination mode, pulse-trickle, and voltage
hold-off time.
LED
Functional Description
Charging output status
Open-drain output that indicates the charging
status.
BAT
Figure 2 shows a state diagram and Figure 3 shows a
block diagram of the bq2002C.
Battery input voltage
Battery Voltage and Temperature
Measurements
The battery voltage sense input. The input to
this pin is created by a high-impedance resistor divider network connected between
the positive and negative terminals of the
battery.
VSS
System ground
TS
Temperature sense input
Battery voltage and temperature are monitored for
maximum allowable values. The voltage presented on
the battery sense input, BAT, should represent a
single-cell potential for the battery under charge. A
resistor-divider ratio of
RB1
=N-1
RB2
Input for an external battery temperature
monitoring thermistor.
VCC
is recommended to maintain the battery voltage within
the valid range, where N is the number of cells, RB1 is
the resistor connected to the positive battery terminal,
and RB2 is the r esistor connected to the negative
battery terminal. See Figure 1.
Supply voltage input
5.0V ± 20% power input.
INH
Charge inhibit input
Note: This resistor-divider network input impedance to
end-to-end should be at least 200kΩ and less than 1 MΩ.
When high, INH suspends the fast charge in
progress. When returned low, the IC resumes operation at the point where initially
suspended.
A ground-referenced negative temperature coefficient
thermistor placed near the battery may be used as a lowcost temperature-to-voltage transducer. The temperature
sense voltage input at TS is developed using a resistorthermistor network between VCC and VSS. See Figure 1.
VCC
PACK +
RT
RB1
VCC
R3
BAT
bq2002C
TM
RB2
TS
N
T
C
bq2002C
R4
VSS
VSS
BAT pin connection
Mid-level
setting for TM
Thermistor connection
NTC = negative temperature coefficient thermistor.
Fg2002/C.eps
Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration
2
bq2002C
Chip on
4.0V
VCC
Battery Voltage
too High?
VBAT > 2V
VBAT < 2V
Battery Voltage
too Low?
VBAT < 0.84V
0.84V < VBAT
VTS > VCC/2
VTS < VCC/2
Battery
Temperature?
Charge
Pending
Fast
LED =
Low
VBAT > 0.84V and
VBAT < 2V and
VTS > VCC/2
VBAT > 2V or
VTS < VCC/2 or
PVD or - V or
Maximum Time Out
Trickle
LED =
Flash
VBAT > 2V
VBAT
2V
Trickle
LED = Z
SD2002C.eps
Figure 2. State Diagram
Clock
Phase
Generator
OSC
TM
Timing
Control
Sample
History
Voltage
Reference
PVD, - V
ALU
A to D
Converter
INH
Charge-Control
State Machine
LBAT
Check
HTF TCO
Check Check
Power-On
Reset
CC
LED
TS
Power
Down
VCC
MCV
Check
BAT
VSS
Bd2002CEG.eps
Figure 3. Block Diagram
3
bq2002C
VCC = 0
Fast Charging
Pulse-Trickle
Fast Charging
1s
CC Output
See
Table 1
Charge initiated by application of power
Charge initiated by battery replacement
LED
TD2002C1.eps
Figure 4. Charge Cycle Phases
pending state. In this state pulse trickle charge is
applied to the battery and the LED flashes until the
voltage and temperature come into the allowed fast
charge range or VBAT rises above VMCV. Anytime VBAT
≥ VMCV, the IC enters the Charge Complete/Battery
Absent state. In this state the LED is off and trickle
charge is applied to the battery until the next new
charge cycle begins.
Starting A Charge Cycle
Either of two events starts a charge cycle (see Figure 4):
1. Application of power to VCC or
2. Voltage at the BAT pin falling through the maximum
cell voltage VMCV where
Fast charge continues until termination by one or more of
the five possible termination conditions:
VMCV = 2V ±5%.
If the battery is within the configured temperature and
voltage limits, the IC begins fast charge. The valid
battery voltage range is VLBAT < VBAT < VMCV, where
VLBAT = 0.175 ∗ VCC ±20%
The valid temperature range is VTS > VHTF where
VHTF = 0.6 ∗ VCC ±5%.
n
Peak voltage detection (PVD)
n
Negative delta voltage (-∆V)
n
Maximum voltage
n
Maximum temperature
n
Maximum time
If VBAT ≤ VLBAT or VTS ≤ VHTF, the IC enters the charge-
Table 1. Fast-Charge Safety Time/Hold-Off Table
PulseTrickle
Rate
PulseTrickle
Pulse Width
(ms)
Maximum
Synchronized
Sampling
Period
(seconds)
Corresponding
Fast-Charge
Rate
TM
Termination
Typical
FastCharge
Time Limits
(minutes)
C/2
Mid
PVD
160
300
C/32
73
18.7
1C
Low
PVD
80
150
C/32
37
18.7
2C
High
-∆V
40
75
C/32
18
9.4
Notes:
Typical PVD
and -∆V
Hold-Off
Time (seconds)
Typical conditions = 25°C, VCC = 5.0V
Mid = 0.5 * VCC ±0.5V
Tolerance on all timing is ±12%.
4
bq2002C
Maximum charge time is configured using the TM pin.
Time settings are available for corresponding charge
rates of C/2, 1C, and 2C. Maximum time-out termination is enforced on the fast-charge phase, then reset, and
enforced again on the top-off phase, if selected. There is
no time limit on the trickle-charge phase.
PVD and -∆V Termination
There are two modes for voltage termination, depending on the state of TM. For -∆V (TM = high), if VBAT is
lower than any previously measured value by 12mV
±3mV, fast charge is terminated. For PVD (TM = low or
mid), a decrease of 2.5mV ±2.5mV terminates fast
charge. The PVD and -∆V tests are valid in the range
1V < VBAT < 2V.
Pulse-Trickle Charge
Pulse-trickle is used to compensate for self-discharge
while the battery is idle in the charger. The battery is
pulse-trickle charged by driving the CC pin active once
per second for the period specified in Table 1. This
results in a trickle rate of C/32.
Synchronized Voltage Sampling
Voltage sampling at the BAT pin for PVD and -∆V termination may be synchronized to an external stimulus
using t he INH input. Low-high-low input pulses
between 100ns and 3.5ms in width must be applied at
the INH pin with a frequency greater than the “maximum synchronized sampling period” set by the state of
the TM pin as shown in Table 1. Voltage is sampled on
the falling edge of such pulses. If the time between
pulses is greater than the synchronizing period, voltage
sampling “free-runs” at once every 17 seconds. A sample
is taken by averaging together voltage measurements
taken 57µs apart. The IC takes 32 measurements in
PVD mode and 16 measurements in -∆V mode. The
resulting sample periods (9.17 and 18.18ms, respectively) filter out harmonics centered around 55 and
109Hz. This technique minimizes the effect of any AC
line ripple that may feed through the power supply from
either 50 or 60Hz AC sources. If the INH input remains
high for more than 12ms, the voltage sample history
kept by the IC and used for PVD and -∆V termination
decisions is erased and a new history is started. Such a
reset is required when transitioning from free-running
to synchronized voltage sampling. The response of the
IC to pulses less than 100ns in width or between 3.5ms
and 12ms is indeterminate. The tolerance on all timing
is ± 12%.
TM Pin
The TM pin is a three-level pin used to select the
charge timer, top-off, voltage termination mode, trickle
rate, and voltage hold-off period options. Table 1
describes the states selected by the TM pin. The
mid-level selection input is developed by a resistor
divider between VCC and ground that fixes the voltage on TM at VCC/2 ± 0.5V. See Figure 4.
Charge Status Indication
A fast charge in progress is uniquely indicated when the
LED pin goes low. In the charge pending state, the LED
pin is driven low for 500ms, then to high-Z for 500ms.
The LED pin is driven to the high-Z state for all other
conditions. Figure 2 outlines the state of the LED pin
during charge.
Charge Inhibit
Fast charge and top-off may be inhibited by using the
INH pin. When high, INH suspends all fast charge and
top-off activity and the internal charge timer. INH
freezes t h e c u r r e n t s t a t e of LED until inhibit is
removed. Temperature monitoring is not affected by the
INH pin. During charge inhibit, the bq2002C continues
to pulse-trickle charge the battery per the TM selection.
When INH returns low, charge control and the charge
timer resume from the point where INH became active.
Voltage Termination Hold-off
A hold-off period occurs at the start of fast charging.
During the hold-off time, the PVD and -∆V terminations
are disabled. This avoids premature termination on the
voltage spikes sometimes produced by older batteries
when fast-charge current is first applied. Maximum
voltage and temperature terminations are not affected
by the hold-off period.
Low-Power Mode
The IC enters a low-power state when VBAT is driven
above the power-down threshold (VPD) where
Maximum Voltage, Temperature, and Time
VPD = VCC - (1V ±0.5V)
Any time the voltage on the BAT pin exceeds the maximum cell voltage, VMCV, fast charge is terminated.
Both the CC pin and the LED pin are driven to the
high-Z state. The operating current is reduced to less
than 1µA in this mode. When VBAT returns to a value
below VPD, the IC pulse-trickle charges until the next
new charge cycle begins.
Maximum temperature termination occurs anytime the
voltage on the TS pin falls below the temperature cut-off
threshold VTCO, where
VTCO = 0.5 ∗ VCC ± 5%.
5
bq2002C
Absolute Maximum Ratings
Symbol
Parameter
Minimum
Maximum
Unit
VCC
VCC relative to VSS
-0.3
+7.0
V
VT
DC voltage applied on any pin
excluding VCC relative to VSS
-0.3
+7.0
V
TOPR
Operating ambient temperature
0
+70
°C
TSTG
Storage temperature
-40
+85
°C
TSOLDER
Soldering temperature
-
+260
°C
TBIAS
Temperature under bias
-40
+85
°C
Note:
Commercial
10 sec max.
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability.
DC Thresholds
Symbol
Notes
(TA = 0 to 70°C; VCC ± 20%)
Parameter
Rating
Tolerance
Unit
Notes
VTCO
Temperature cutoff
0.5 * VCC
±5%
V
VTS ≤ VTCO inhibits/terminates
fast charge
VHTF
High-temperature fault
0.6 ∗ VCC
±5%
V
VTS ≤ VHTF inhibits fast charge
start
VMCV
Maximum cell voltage
2
±5%
V
VBAT ≥ VMCV inhibits/terminates
fast charge
VLBAT
Minimum cell voltage
0.175 ∗ VCC
±20%
V
VBAT ≤ VLBAT inhibits fast charge
-∆V
BAT input change for
-∆V detection
-12
±3
mV
PVD
BAT input change for
PVD detection
-2.5
±2.5
mV
6
bq2002C
Recommended DC Operating Conditions (TA = 0 to 70°C)
Symbol
Condition
Minimum
Typical
Maximum
Unit
4.0
5.0
6.0
V
Notes
VCC
Supply voltage
VDET
-∆V, PVD detect voltage
1
-
2
V
VBAT
Battery input
0
-
VCC
V
VTS
Thermistor input
0.5
-
VCC
V
VTS < 0.5V prohibited
VIH
Logic input high
0.5
-
-
V
INH
Logic input high
VCC - 0.5
-
-
V
TM
Logic input mid
VCC
-
+ 0.5
V
TM
VIM
2
VIL
- 0.5
VCC
2
Logic input low
-
-
0.1
V
INH
Logic input low
-
-
0.5
V
TM
VOL
Logic output low
-
-
0.8
V
LED, CC, IOL = 10mA
VPD
Power down
VCC - 1.5
-
VCC - 0.5
V
VBAT ≥ VPD max. powers
down bq2002C;
VBAT < VPD min. =
normal operation.
I CC
Supply current
-
-
500
µA
Outputs unloaded,
VCC = 5.1V
I SB
Standby current
-
-
1
µA
VCC = 5.1V, VBAT = VPD
I OL
LED, CC sink
10
-
-
mA
@VOL = VSS + 0.8V
IL
Input leakage
-
-
±1
µA
INH, CC, V = VSS to VCC
I OZ
Output leakage in
high-Z state
-5
-
-
µA
LED, CC
Note:
All voltages relative to VSS.
7
bq2002C
Impedance
Minimum
Typical
Maximum
Unit
RBAT
Symbol
Battery input impedance
50
-
-
MΩ
RTS
TS input impedance
50
-
-
MΩ
Timing
Symbol
Parameter
(TA = 0 to +70°C; VCC ± 10%)
Parameter
Minimum
Typical
Maximum
Unit
-12
-
12
%
dFCV
Time base variation
Note:
Typical is at TA = 25°C, VCC = 5.0V.
8
Notes
bq2002C
8-Pin DIP (PN)
8-Pin PN (0.300" DIP)
Inches
D
E1
E
A
B1
A1
L
C
B
S
e
G
9
Millimeters
Dimension
A
Min.
Max.
Min.
Max.
0.160
0.180
4.06
4.57
A1
0.015
0.040
0.38
1.02
B
0.015
0.022
0.38
0.56
B1
0.055
0.065
1.40
1.65
C
0.008
0.013
0.20
0.33
D
0.350
0.380
8.89
9.65
E
0.300
0.325
7.62
8.26
E1
0.230
0.280
5.84
7.11
e
0.300
0.370
7.62
9.40
G
0.090
0.110
2.29
2.79
L
0.115
0.150
2.92
3.81
S
0.020
0.040
0.51
1.02
bq2002C
8-Pin SOIC Narrow (SN)
8-Pin SN (0.150" SOIC)
Inches
10
Millimeters
Dimension
A
Min.
Max.
Min.
Max.
0.060
0.070
1.52
1.78
A1
0.004
0.010
0.10
0.25
B
0.013
0.020
0.33
0.51
C
0.007
0.010
0.18
0.25
D
0.185
0.200
4.70
5.08
E
0.150
0.160
3.81
4.06
1.40
e
0.045
0.055
1.14
H
0.225
0.245
5.72
6.22
L
0.015
0.035
0.38
0.89
bq2002C
Data Sheet Revision History
Change No.
Page No.
1
All
Note:
Description
Revised format and outline of this data sheet
Change 1 = Sept. 1997 B changes from Dec. 1995.
Ordering Information
bq2002C
Package Option:
PN = 8-pin plastic DIP
SN = 8-pin narrow SOIC
Device:
bq2002C Fast-Charge IC
11
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
BQ2002CPN
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
BQ2002CPNE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
BQ2002CSN
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2002CSNG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2002CSNTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2002CSNTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ2002CSNTR
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.4
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ2002CSNTR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement