Emerson | ROC364 | ROC364 SS - Tecno Controles, CA

2:ROC364
August 2001
Specification Sheet
ROC364 Remote Operations Controller
The ROC364 Remote Operations Controller (ROC) is
a microprocessor-based controller that provides the
functions required for a variety of field automation
applications. The unit is used primarily where there is
a need to monitor, measure, and control equipment
remotely. The unit is ideal for applications requiring
flow computation, PID control, and logic/sequencing
control. It is available with either a FlashPAC or a
ROCPAC memory module.
The ROC364 features modular, single-point I/O. The
modular I/O allows a high degree of application
flexibility: any combination of discrete inputs, discrete
outputs, analog inputs, analog outputs, and pulse
inputs can be accommodated, up to a maximum of 64
channels. This makes it possible to buy only the I/O
needed for the immediate requirements of the
application, while allowing field expansion or changes
in the I/O later on.
FLASHPAC
®
POWER
2A S.B., 32 VDC
F2
AUX OUT 1
5A, 32 VDC
F3
AUX OUT 2
5A, 32 VDC
SYSTEM
STATUS
DC PWR
IN
2
ROM
3
COM2
POWER
AUX OUT 1
AUX OUT 2
+
+
AUX PWR
OUT 1
1
REMOTE OPERATIONS
CONTROLLER
RAM
MEMORY EXPANSION
F1
ROC
+
+
-
GND
COM1
DISPLAY
OPERATOR
INTERFACE
AUX PWR
OUT 2
DOC0119A
®
MODULE RACK
1
A
B
2
C
A
B
3
C
A
B
5
4
C
A
B
C
A
B
7
6
C
A
B
C
A
B
8
C
A
B
C
A
B
11
10
9
C
A
B
C
A
B
C
12
A
B
14
13
C
A
B
C
A
B
15
C
A
B
GND
16
C
A
B
C
GND
DOC0030C
Typical ROC364 Master Controller Unit and I/O Module Rack
Flow Computer Division
Website: www.EmersonProcess.com/flow
2: ROC364
Page 2
Specification Sheet
Master Controller Unit
The Master Controller Unit (MCU) is the key component of the ROC364 and consists of:
♦
♦
♦
♦
♦
♦
♦
NEC V25+ microprocessor with on-board memory
On-board memory
FlashPAC or ROCPAC module
Slots for expansion RAM (used only for ROCPAC)
Connections for operator interface
Sockets for two optional communications cards
Status indicators and diagnostic inputs
MCU under software control and can be used for
auxiliary devices, such as a radio. The source of
auxiliary power is the input power.
LED indicators display ROC status, input power, and
auxiliary power. The ROC status indicator shows
whether operation is normal. The power and auxiliary
output indicators light to show that power is applied.
Diagnostic inputs are provided for monitoring
conditions, such as board temperature, input power
voltage, and transmitter supply voltage.
ROC units with a FlashPAC have some additional
features, such as 1992 AGA flow calculations contained in firmware. See the FlashPAC specifications
sheet (2:MFP) for more information.
The MCU has a metal case that helps protect the
electronics from physical damage. For protection from
outdoor environments, the unit must be housed in a
ROC enclosure (see other specification sheets).
The NEC V25+ is a 16-bit CMOS microprocessor that
can address up to one megabyte of memory space.
The MCU comes standard with 128 kilobytes of onboard, battery-backed, static random access memory
(SRAM) for storing data and 32 kilobytes of electrically-erasable read-only memory (EEPROM) for
storing configuration parameters.
Options
The FlashPAC or ROCPAC module contains the
operating system, ROC communications protocol, and
applications firmware (see other specification sheets).
Both modules provide additional RAM for user
programs and history logs; however, the FlashPAC
has maximum RAM, while the RAM for the ROCPAC
can be expanded by adding RAM modules (described
under “Options”).
The operator interface port provides a means for a
direct link between the ROC364 and a personal
computer. With the computer running ROCLINK
Software (see Specification Sheet 4:RL101 or 4:RFW),
the user can configure the ROC364 and monitor its
operation.
A complete ROC364 consists of a Master Controller
Unit and a variety of options. The name and the
quantity of each option that can be accommodated is
shown in Table 1.
Table 1. ROC364 Options
Option
Quantity
Module Rack, 16 socket
1, 2, 3, or 4
Backplate
0 or 1
I/O Power Converter Card
0 or 1
I/O Modules
0 to 64
Communication Cards
0, 1, or 2
RAM Expansion Modules*
0, 1, 2, or 3
*Used only when ROCPAC is installed.
The display port is dedicated to communications
between the MCU and the Local Display Panel
accessory (see Specification Sheet 2.2:LDP).
Through this panel, the user can access information
stored in the ROC364.
The Module Rack provides sockets for up to 16 I/O
modules. A minimum of one Module Rack is required
for any ROC364 connected to field I/O. Up to four
Module Racks can be used with one MCU. The first
Module Rack plugs directly into the MCU. Additional
racks plug into the previous rack.
The communications card expansion sockets allow
one or two communications cards to be added to the
ROC364. The cards make use of the COM1 and
COM2 ports and can be any of the ROC300-series
communications cards (described under “Options”).
The Backplate provides a mounting panel for a MCU
and Module Racks. Various backplates are available
for accommodating one, two, or four Module Racks.
The four-rack backplate is used for either three or four
racks.
Fuses for input and auxiliary power are readily
accessible from the front of the MCU. Screw
terminals, also located on the front, provide
connections for input power and auxiliary output
power. Auxiliary power outputs are switched by the
The I/O Power Converter Card converts the MCU
input power from 12 volts to 24 volts (nominal) for field
transmitters. The converter, which is required only for
12-volt input voltage, can accommodate up to 25
transmitter loops at 20 milliAmps each.
2: ROC364
Page 3
Specification Sheet
I/O modules can be added as needed to satisfy a
wide variety of field I/O requirements. The types of
modules (see respective specification sheets) that can
be used are:
♦
♦
♦
♦
♦
♦
♦
♦
Analog input (loop, differential, or source)
Analog output
Discrete input (source or isolated)
Discrete output (source or isolated)
Pulse input (normal, slow, or low-level)
Relay output
RTD input
HART® interface
Communication cards provide the means for communicating with a host computer or other device. One
or two cards of the following types in any combination
can be accommodated (see Specification Sheets
2:COM1, 2:COM2, and 2.5:RMI for more information):
♦ EIA-232 (RS-232) for point-to-point
asynchronous serial communications.
♦ EIA-422/EIA-485 (RS-422/RS-485) for multiplepoint asynchronous serial communications.
♦ Dual Communications (RMI) for sensor to ROC
communications.
♦ Radio modem for communications to a radio.
♦ Leased line modem for communications over
customer-owned or leased lines.
♦ Dial-up modem for communications over a
telephone network.
RAM expansion modules (for ROCPAC units only)
are available in two sizes: 128 and 256 kilobytes. Up
to three RAM modules can be accommodated. The
amount of expansion RAM needed depends primarily
on the number of database points that must be
archived and the user programs to be loaded into it.
Additional information about RAM modules is
contained in Specification Sheet 2:MEM.
Accessories
A number of accessory items are available for the
ROC364 that provide environmental housing, power,
communications, local monitoring, and I/O lightning
protection. These items are described in other
specification sheets. See your local sales
representative for more information.
Specifications
PROCESSOR MEMORY
NEC V25+ running at 8 MHz.
On-Board: 128K battery-backed SRAM for data.
32K EEPROM for configuration.
FlashPAC: Plug-in module with 512K (352K used)
Flash read-only memory (ROM) and 512K of
battery-backed static RAM (SRAM).
ROCPAC: One plug-in module with 128K EPROM
and 128K battery-backed SRAM.
RAM Expansion Option (for ROCPAC only):
Three slots provided for 128K or 256K batterybacked SRAM plug-in modules.
Memory Reset: Optional LDP permits a cold start
initialization when used during power-up.
OPERATOR INTERFACE PORT
EIA-232D (RS-232D) serial format for use with
portable operator interface. Baud is selectable from
300 to 9600. Asynchronous format, 7 or 8-bit
(software selectable). Parity can be odd, even, or
none (software selectable). 9-pin, female D-shell
connector provided.
TIME FUNCTIONS
Clock Type: 32 KHz crystal oscillator with regulated
supply, battery-backed. Year/Month/Day and
Hour/Minute/Second.
Clock Accuracy: 0.01%.
Watchdog Timer: Hardware monitor expires after
1.2 seconds and resets the processor. Processor
restart is automatic.
DIAGNOSTICS
These values are monitored: real-time clock/system
clock compare, AI module mid-scale voltage, DI
module default status, AO module D/A voltage, DO
module latch value, I/O transmitter voltage, power
input voltage, auxiliary output 1 & 2 voltage
(ROCPAC only), MCU board temperature.
POWER REQUIREMENTS
11 to 16 Vdc (12.5V to start up) or 22 to 30 Vdc (25V
to start up), jumper selectable. 1 watt typical,
excluding I/O power.
(Specifications continued on Page 4)
2:ROC364
Page 4
Specification Sheet
Specifications (Cont’d)
AUXILIARY OUTPUT POWER
Input power is software switched to two sets of
auxiliary output power terminals. Each output fused
for 5 A maximum. Output voltage is 0 to 2 Vdc less
than input voltage, depending on load.
I/O POWER CONVERTER (OPTIONAL)
Input: 11 to 16 Vdc, 15 mA with no load or shorted
output.
Output: 22 to 24 Vdc, up to 0.6 A for transmitter
power.
I/O CAPACITY
Up to 16 I/O channels per Module Rack. Up to 4
Module Racks (64 I/O channels) per MCU.
ENVIRONMENTAL
Operating Temperature: -40° to 70° C (-40° to
158° F).
Storage Temperature: -50° to 85° C (-58° to
185° F).
Operating Humidity: To 95%, non-condensing.
Transient Protection: Meets IEEE C37.90.11989.
EMI Susceptibility: Meets IEC 801-2, level 3 and
SAMA PMC 33.1-1978, 2-abc, 1% of reading.
EMI Emissions: Meets FCC 47 CFR, Part 15,
Subpart J, Class A verified.
DIMENSIONS
MCU: 2 in. D by 8 in. H by 12 in. W (51 mm by 203
mm by 305 mm). Add 1.5 in. (38 mm) to depth
dimension for memory modules.
Module Rack: 0.5 in. D by 5 in. H by 12 in. W (13
mm by 127 mm by 305 mm).
Backplates: 16 Ga. steel.
MCU w/one Module Rack: 12.25 in. W by 14 in. H
(311 mm by 356 mm).
MCU w/two Module Racks: 12.25 in. W by 22.25 in.
H (311 mm by 565 mm).
MCU w/three or four Module Racks: 12.25 in. W by
29.25 in. H (311 mm by 743 mm).
WEIGHT
MCU: 5 lbs (2.3 kg) nominal.
Module Rack: 1 lb (0.5 kg) nominal.
Backplate: 3 to 6.5 lbs (1.4 to 3 kg).
ENCLOSURE
MCU metal chassis with 2-piece cover and Module
Rack case meet NEMA 1 rating.
APPROVALS
Approved by CSA for hazardous locations Class I,
Division 2, Groups A, B, C, and D.
Fisher and ROCLINK are marks of one of the Emerson Process Management companies The Emerson logo is a trademark and service mark of Emerson Electric Co. All
other marks are the property of their respective owners.
The contents of this publication are presented for informational purposes only. While every effort has been made to ensure informational accuracy, they are not to be
construed as warranties or guarantees, express or implied, regarding the products or services described herein or their use or applicability. Fisher Controls reserves the right
to modify or improve the designs or specifications of such products at any time without notice.
Emerson Process Management
Flow Computer Division
th
1612 S. 17 Avenue Marshalltown, IA 50158 U.S.A.
© Fisher Controls International, Inc. 1991-2001. All Rights Reserved.
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