TB2929HQ.pdf

TB2929HQ.pdf
TB2929HQ
TOSHIBA Bi-CMOS Linear Integrated Circuit
Silicon Monolithic
TB2929HQ
45W × 4-ch BTL Audio Power IC
The TB2929HQ is a four-channel BTL power amplifier for car
audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (POUT MAX) of 45 W.
It includes a standby switch, mute function and various
protection features.
Features
•
High output power
•
POUT MAX (1) = 45 W (typ.)
(VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 Ω)
•
POUT MAX (2) = 41 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 Ω)
•
POUT (1) = 24 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
•
POUT (2) = 21 W (typ.)
(VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
Weight: 7.7 g (typ.)
•
Low THD: 0.007% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
•
Low noise: VNO = 60 μVrms (typ.)
(VCC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)
•
Standby switch (pin 4)
•
Mute function (pin 22)
•
Built-in AUX amplifier from single input to 2 channels output (pin 25)
•
Various protection features
Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting
•
Operating supply voltage: VCC (opr) = 8.0 to 18 V (RL = 4 Ω)
Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed.
Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It
is not guaranteed that they will prevent the IC from being damaged.
Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features,
resulting in an IC damage due to output short-circuits.
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Block Diagram
Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.
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Detailed Description
1. Standby Switch (pin 4)
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is
set at about 3 VBE (typ.). The power supply
current is about 0.01 μA (typ.) in the standby
state.
VCC
ON
Power
4
10 kΩ
≈ 2 VBE
OFF
to Bias
filter network
Standby Control Voltage (VSB): Pin 4
Standby
Power
VSB (V)
ON
OFF
0 to 0.9
OFF
ON
2.9 to VCC
Figure 1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.
Benefits of the Standby Switch
(1)
VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.
(2)
Since the control current is minuscule, a low-current-rated switching relay can be used.
Relay
High-current-rated switch
Battery
VCC
Battery
From
microcontroller
VCC
– Conventional Method –
Low-current-rated switch
Battery
Standby
From microcontroller
Battery
Standby
VCC
VCC
– Using the Standby Switch –
Figure 2 Standby Switch
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2. Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 3 and 4.)
The value of the external pull-up resistor is determined, based on pop noise value.
For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V / 5 V × 47 kΩ = 31 kΩ
ATT – VMUTE
20
VCC = 13.2 V
f = 1 kHz
RL = 4 Ω
VO = 20dBm
−20 BW = 400 Hz to 30 kHz
Mute attenuation ATT
(dB)
0
5V
R1
22
C4
1 kΩ
Mute On/Off
control
−40
−60
−80
−100
−120
0
0.5
1
1.5
2
Pin 22 control voltage: VMUTE
2.5
3
(V)
Figure 4 Mute Attenuation − VMUTE (V)
Figure 3 Mute Function
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20dBAMP
-20dBAMP
3. AUX Input (pin 25)
The pin 25 is for input terminal of AUX
amplifier.
The total gain is 0dB by using of AUX
amplifier.
Therefore, the μ-COM can directly drive
the AUX amplifier.
BEEP sound or voice synthesizer signal can be
input to pin 25 directly.
When AUX function is not used, this pin must be
connected to PRE-GND (pin 13) via a capacitor.
IN
OUT (+)
OUT (−)
μ-COM
AUX-IN
AUX AMP
25
-20dB
Figure 5
5
AUX IN
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4. Prevention of speaker damage (in case of a layer short-circuit of the speaker)
When the DC resistance between the OUT+ and OUT− pins falls below 1 Ω, the output current exceeds 4 A.
At this time, the protection circuit is activated to limit the current draw into the speaker.
This feature prevents the speaker from being damaged, as follows:
< Speaker damaging scenario >
A DC current of over 4 V is applied to the speaker due to an external circuit failure (Note 4).
(Abnormal DC output offset)
↓
The speaker impedance becomes 1 Ω or less due to a layer short.
↓
A current of over 4 A flows into the speaker, damaging the speaker.
Current into the speaker
The short-circuit protection is activated
Less than 4 A
Speaker Impedance
About 1 Ω
4Ω
Figure 6
Note 3: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage
current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines.
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5. Pop Noise Suppression
Since the TB2929HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all
amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4.
Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of
unbalanced DC currents.
To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1
and C6. Note, however, that C2 also affects the time required from power-on to audio output.
The pop noise generated by the muting and unmuting of the audio output varies with the time constant of
C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is
applied to C4 to when the mute function is enabled.
6. External Component Constants
Effects
Component
Recommended
Value
C1
0.22 μF
To eliminate DC
Cut-off frequency is
increased.
Cut-off frequency is reduced.
C2
10 μF
To reduce ripple
Powering on/off is faster.
Powering on/off is slower.
C3
0.1 μF
To provide
sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
C4
1 μF
To reduce pop
noise
High pop noise. Duration until Low pop noise. Duration until
mute function is turned on/off mute function is turned on/off
is short.
is long.
C5
3900 μF
Ripple filter
Power supply humming and ripple filtering.
C6
1 μF
C7
0.22 μF
Purpose
When lower than
recommended value
Common
reference voltage
for all input
Pop noise is suppressed when C1: C6 = 1:4.
To eliminate DC
Cut-off frequency is
increased in AUX
7
Notes
When higher than
recommended value
Pop noise is
generated
when VCC is
turned on.
Pop noise is
generated
when VCC is
turned on.
Cut-off frequency is reduced
in AUX.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VCC (surge)
50
V
DC supply voltage
VCC (DC)
25
V
Operating supply voltage
VCC (opr)
18
V
Peak supply voltage (0.2 s)
Output current (peak)
IO (peak)
Power dissipation
PD (Note 4)
9
A
125
W
Operating temperature
Topr
−40 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 4: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified)
Characteristics
Symbol
Test
Circuit
ICCQ
⎯
POUT MAX (1)
Min
Typ.
Max
Unit
VIN = 0
⎯
160
320
mA
⎯
VCC = 15.2 V, max POWER
⎯
45
⎯
POUT MAX (2)
⎯
VCC = 14.4 V, max POWER
⎯
41
⎯
POUT MAX (3)
⎯
VCC = 13.7 V, max POWER
⎯
37
⎯
POUT (1)
⎯
VCC = 14.4 V, THD = 10%
⎯
24
⎯
POUT (2)
⎯
THD = 10%
19
21
⎯
THD
⎯
POUT = 5 W
⎯
0.007
0.07
%
GV
⎯
VOUT = 0.775 Vrms
25
26
27
dB
ΔGV
⎯
VOUT = 0.775 Vrms
−1.0
0
1.0
dB
VNO (1)
⎯
Rg = 0 Ω, DIN45405
⎯
60
⎯
VNO (2)
⎯
Rg = 0 Ω,
BW = 20 Hz to 20 kHz
⎯
60
70
Ripple rejection ratio
R.R.
⎯
frip = 100 Hz, Rg = 620 Ω
Vrip = 0.775 Vrms
50
65
⎯
dB
Crosstalk
C.T.
⎯
Rg = 620 Ω
POUT = 4 W
⎯
80
⎯
dB
VOFFSET
⎯
⎯
−90
0
90
mV
Input resistance
RIN
⎯
⎯
⎯
90
⎯
kΩ
Standby current
ISB
⎯
Standby condition, V4=0,V22=0
⎯
0.01
1
μA
VSB H
⎯
POWER: ON
2.9
⎯
VCC
VSB L
⎯
POWER: OFF
0
⎯
0.8
VM H
⎯
MUTE: OFF
2.9
⎯
VCC
VM L
⎯
MUTE: ON, R1 = 47 kΩ
0
⎯
0.8
Quiescent supply current
Output power
Total harmonic distortion
Voltage gain
Channel-to-channel voltage gain
Output noise voltage
Output offset voltage
Standby control voltage
Mute control voltage
Test Condition
8
W
μVrms
V
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Characteristics
Mute attenuation
Upper cut-off frequency
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
ATT M
⎯
MUTE: ON、DIN_AUDIO
VOUT = 7.75 Vrms → Mute: OFF
80
100
⎯
dB
Fth
⎯
GV = 26dB, −3dB
⎯
250
⎯
kHz
Test Circuit
Components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.
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THD – POUT (ch1)
100
THD – POUT (ch2)
100
VCC = 13.2 V
RL = 4 Ω
50
RL = 4 Ω
30
Filter
30
Filter
100 Hz : to 30 kHz
5
1kHz
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
10
10 kHz : 400 Hz to
20 kHz : 400 Hz to
5
Total harmonic distortion THD (%)
10
Total harmonic distortion THD (%)
VCC = 13.2 V
50
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1kHz
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1 kHz
1 kHz
0.01
0.01
f = 100 Hz
0.005
0.005
f = 100 Hz
0.003
0.003
0.001
0.1
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
0.3 0.5
(W)
VCC = 13.2 V
50
RL = 4 Ω
30
Filter
30
Filter
100 Hz : to 30 kHz
10
10 kHz : 400 Hz to
20 kHz : 400 Hz to
5
3
1
POUT
30 50
100
30 50
100
(W)
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
5
10
VCC = 13.2 V
RL = 4 Ω
10
5
THD – POUT (ch4)
100
50
1kHz
3
Output power
THD – POUT (ch3)
100
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1kHz
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1 kHz
1 kHz
0.01
0.01
f = 100 Hz
0.005
f = 100 Hz
0.005
0.003
0.001
0.1
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
(W)
0.3 0.5
1
3
Output power
10
5
10
POUT
(W)
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THD – POUT (ch1)
THD – POUT (ch2)
100
100
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
13.2 V
Filter
400 Hz to 30 kHz
10
5
5
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
400 Hz to 30 kHz
10
3
VCC = 9 V
16 V
1
0.5
0.3
0.1
0.05
0.03
3
VCC = 9 V
0.5
0.3
0.1
0.05
0.03
0.01
0.005
0.005
0.003
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
0.3 0.5
(W)
THD – POUT (ch3)
3
5
10
POUT
30 50
100
(W)
THD – POUT (ch4)
100
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
13.2 V
Filter
13.2 V
Filter
400 Hz to 30 kHz
400 Hz to 30 kHz
10
10
5
5
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
1
Output power
100
3
VCC = 9 V
16 V
1
0.5
0.3
0.1
0.05
0.03
3
VCC = 9 V
0.5
0.3
0.1
0.05
0.03
0.01
0.005
0.005
0.003
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
(W)
0.3 0.5
1
3
Output power
11
16 V
1
0.01
0.001
0.1
16 V
1
0.01
0.001
0.1
13.2 V
Filter
5
10
POUT
30 50
100
(W)
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muteATT – f
THD – f
3
0
VCC = 13.2 V
RL = 4 Ω
−20
VOUT = 7.75 Vrms (20dBm)
Total harmonic distortion THD (%)
Mute attenuation muteATT (dB)
VCC = 13.2 V
−40
−60
−80
1ch 3ch
−100
2ch 4ch
−120
10
100
1k
10 k
frequency f
RL = 4 Ω
1
POUT = 5 W
No filter
0.3
0.1
4 ch
0.03
2 ch
0.01
1 ch
0.003
0.001
0.01
100 k
3 ch
0.1
(Hz)
1
frequency f
GV – f
10
100
(KHz)
R.R. – f
40
0
30
Ripple rejection ratio R.R. (dB)
Voltage gain GV (dB)
VCC = 13.2 V
1 ch~4 ch
20
10
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
0
0.01
0.1
1
frequency f
10
RL = 4 Ω
Vrip = 0.775 Vrms (0dBm)
−20
−40
1ch 4 ch
2 ch 4 ch
−60
3 ch
1 ch
−80
0.01
100
2ch 3ch
0.1
1
frequency f
(KHz)
12
10
100
(KHz)
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VIN – POUT (ch1)
VIN – POUT (ch2)
40
40
1 kHz 10 kHz
Output power
Output power
20
10
VCC = 13.2 V
20
10
VCC = 13.2 V
RL = 4 Ω
No filter
0
0
2
4
6
Input voltage
VIN
8
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
4
VIN – POUT (ch3)
(Vrms)
1 kHz 10 kHz
(W)
100 Hz
20 kHz
30
100 Hz
20 kHz
POUT
30
Output power
20
10
VCC = 13.2 V
20
10
VCC = 13.2 V
RL = 4 Ω
No filter
0
0
2
4
Input voltage
6
VIN
8
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
4
ICCQ – VCC
VIN
8
10
(Vrms)
PDMAX – Ta
(W)
120
Allowable power dissipation PDMAX
RL = ∞
VIN = 0 V
160
120
80
40
0
0
6
Input voltage
2000
ICCQ (mA)
10
VIN – POUT (ch4)
POUT
(W)
VIN
8
40
1 kHz 10 kHz
Output power
6
Input voltage
40
Quiescent Current
100 Hz
20 kHz
30
POUT
(W)
100 Hz
20 kHz
30
POUT
(W)
1 kHz 10 kHz
5
10
Supply voltage
15
VCC
20
(1) INFINITE HEAT SINK
RθJC = 1°C/W
100
(V)
(3) NO HEAT SINK
RθJA = 39°C/W
80
(1)
60
40
20
(2)
(3)
0
0
25
(2) HEAT SINK (RθHS = 3.5°C/W
RθJC + RθHS = 4.5°C/W
25
50
75
100
125
150
Ambient temperature Ta (°C)
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C.T. – f (ch1)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
(dB)
−20
C.T. – f (ch2)
0
Cross talk C.T.
Cross talk C.T.
(dB)
0
−40
CT (1-2)
−60
CT (1-4)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−20
−40
CT (2-4)
−60
CT (2-1)
CT (1-3)
−80
10
100
1k
frequency f
10 k
CT (2-3)
−80
10
100 k
100
(Hz)
1k
frequency f
C.T. – f (ch3)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
(dB)
−20
−40
−60
CT (3-2)
(Hz)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−20
−40
−60
CT (3-4)
CT (3-1)
CT (4-1)
CT (4-3)
−80
10
100
1k
frequency f
10 k
CT (4-2)
−80
10
100 k
100
(Hz)
1k
VNO – Rg
100 k
(Hz)
PD – POUT
80
f = 1 kHz
RL = 4 Ω
Filter:
RL = 4 Ω
4ch drive
(W)
VCC = 13.2 V
20 Hz to 20 kHz
200
Power dissipation PD
Output noise voltage VNO (μVrms)
10 k
frequency f
300
100
1ch~4ch
0
10
100 k
C.T. – f (ch4)
0
Cross talk C.T.
Cross talk C.T.
(dB)
0
10 k
100
1k
10 k
16 V
40
Signal source resistance Rg (Ω)
13.2 V
20
VCC = 9.0 V
0
0
100 k
18 V
60
5
10
15
Output power
14
25
20
POUT
30
(W)
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Package Dimensions
Weight: 7.7 g (typ.)
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• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current
can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to
not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip.
In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon
rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink
installation, refer to individual technical datasheets or IC databooks.
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
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TB2929HQ
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2009-01-29
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