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LBI-38907B
MAINTENANCE MANUAL
ORION

UHF CONTROL LOGIC/IF BOARD
CMC-682/CMF-138
TABLE OF CONTENTS
Page
DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
CIRCUIT ANALYSIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
LOGIC (CMC-682) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
IF(CMF-138W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
IC DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
PRODUCTION CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
OUTLINE DIAGRAMS:
LOGIC (CMC-682) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
IF(CMF-138W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
SCHEMATIC DIAGRAMS:
LOGIC (CMC-682) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
IF(CMF-138W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
ILLUSTRATIONS
Figure 1 - Logic Section Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 2 - IF Section Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ericssonz
1
2
Ericsson Inc.
Private Radio Systems
Mountain View Road
Lynchburg, Virginia 24502
1-800-528-7711 (Outside USA, 804-528-7711)
Printed in U.S.A.
LBI-38907
LBI-38907
DESCRIPTION
The System Control Logic/IF circuit board combines functions of receive circuit 1st IF, 2nd IF, audio detection, audio
signal processing and system control on one circuit board. As
an option, an additional circuit board can be plugged into this
board to provide AEGIS (digital encryption system). Programming and personality information is stored in FLASH and
EEPROM memory on the logic/IF board. The audio speaker
amplifier is also part of the same board.
Electrical interfaces are achieved between this board and
the Control Unit (LCC), synthesizer, RF PA (APC) and the
Option and Remote Control Connector (ORCC) on the rear of
the assembled radio.
All radio control signals originate or terminate on the control logic/IF board. Two microcomputers share the processing
load. Control signals are connected through a high speed digital link with the control unit, either through the LCC or ORCC
connectors, making possible either front or remote control for
the radio. The same link also makes possible dual radio or dual
control head configuration. An RS-232 compatible digital link
is available at the ORCC interface, to facilitate programming
or Radio Data Interface to Mobile Digital terminals.
This circuit board also generates Type 99, Channel Guard,
GE-Star and DTMF signals if so programmed.
The System Control Logic/IF board consists of the following control logic, IF and audio circuits (see figures 1 & 2).
SYSTEM CONTROL LOGIC (CMC-682)
IF (CMF-138)
• Custom CMOS ASP Chip (IC601)
• Operational Amplifier (IC602, IC603)
• Audio Amplifier (IC604)
• 5 Volt Regulator (IC606, IC607)
• 9 Volt Regulator (IC605, IC608, IC609)
• Reset Circuit (IC610)
• Bilateral Switch (IC611, IC612)
CIRCUIT ANALYSIS
LOGIC SECTION (CMC-682)
Microcomputer
The main microcomputer circuit in the ORION radio consist of microprocessor IC701, EEPROM IC708, Flash
EEPROM IC707, RAM IC709 and custom ASIC IC703. This
circuitry runs at a 9.8304 MHz rate determined by crystal
X701 and controls the radio through a second microprocessor
IC702. This second microprocessor runs at a 4.9152 MHz rate.
The 4.9152 MHz rate is determined by ASIC IC703.
• Controlling the ASIC, FLASH EEPROM and RAM
• Loading data to the frequency synthesizer
• Fetching and processing the PTT, monitor, channel,
selection and volume control
• CMOS Microprocessor (IC701, IC702)
• Controlling the audio circuit (processor)
• Custom CMOS ASIC Chip (IC703)
• Decoding the squelch
• Address Decoder (IC704)
• Encoding/Decoding the Channel Guard and Digital
Channel Guard
• RS-485 (IC705)
• RS-232 (IC706)
• Controlling the loading interface for the radio data
(channel nujmber and signaling)
• Flash EEPROM (IC707)
• EEPROM (IC708)
FLASH EEPROM (IC707)
• CMOS SRAM (IC709)
This memory contains the software to control the microprocessor. This Flash EEPROM has a storage capacity of 256k
x 8 bits.
• CMOS Inverters (IC711)
• Silicon Serial Number (IC712)
• TTL Inverters (IC713)
CMOS SRAM (IC709)
This SCRATCH RAM has a storage capacity of 32k x 8
bits. The memory is available for variables, buffers, etc.
Figure 1 - Logic Section Block Diagram
1
LBI-38907
LBI-38907
EEPROM (IC708)
This EEPROM has a storage capacity of 8k x 8 bits. The
memory contatins the user configurable parameters that must
be maintained through a power cycle. This personality controls
various functions of the radio. The personality data is entered
from outside the radio through the ORCC connector to the microprocessor and then to the EEPROM.
The data mainly consists of the following:
• Chanel Frequency Data
• CG/DCG Data
• Rx Audio porcess with Tone Reject Filter, De-emphasis
and Programmable Attenuator.
• Data Limiting
• CG/DCG filtering and limiting
• Noise Squelch filtering and detecting
• 8 bits D/A Converter with sample and hold
• Squelch Data
• Display Data, etc.
• Data signal filtering
APPLICATION OF SPECIFIC INTEGRATED
CIRCUITS
ASIC (IC703)
The ASIC is basically a chip that integrates may miscelllaneous funtcions. The chip provides functions as follows:
• MODEM
• Watch Dog Timer
• Clock Control
• Interrupt Control
• Address Decode etc.
Voltage Regualtors (IC606, IC607) (IC605,
IC608, IC609)
Voltage regulators IC606 and IC607 each generate a 5 Vdc
for the Control Board. Voltage regulators IC605, IC608 and
IC609 each generate a 9 Vdc for the Control Board and Voice
Guard Adapter Module.
Audio Amplifier (IC604)
The audio amplifier is located between the audio processor
and the speaker. Amplifier IC604 amplifies the output signal of
the ASP (IC601) to the level adequate for driving the speaker.
Audio Signal Porocessor (ASP ) (IC601)
2
The functions of the audio processor are as follows:
• Tx audio process with microphone amplifier,
pre-emphasis, deviagion limiter, summing amplifier,
post limiter filter and progarmmable attenuator
• Tx Power, Tx MOdulation Data
Figure 2 - IF Section Block Diagram
under control of the microcomputer in compliance with the
function of the radio unit.
The audio process consists of a one-chip IC accommodating almost all of the audio functions. The audio functions are
• Two 6 bits programmable divider for clock and altet tone
All of these functions are made up of switched capacitor
filters, amplifiers and timing logic. The timing for this logic is
derive from the 4.9152 MHz clock generator (ASIC).
RS-485 (IC705)
This is a high speed differential TRI-STATE bus/line transceiver designed to meet the requirements of EIA standard RS485 specification. The IC705 is located between the Radio Unit
and the Control Unit.
RS-232 (IC706)
This IC consists of line drivers/receivers designed to meet
the requirements of EIA standard RS-232 specifications. The
IC706 is located between the radio unit and the ORCC.
Reset Circuit (IC610)
This is an active low reset IC which includes a delay time
generating circuit. Delay time can be set up by externally using
a capacitor and a resistor. The function of this IC is to accurately reset the system after detecting voltage at the time of
switching power on and instantaeous power off.
Option and Remote Control Connector (ORCC)
The ORCC is located on the rear of the radio and is used
for options and accessories when Control Unit and Radio Unit
are directly attached and for remote control in all other configurations. The ORCC allows various kinds of external equipment connections to be made. External equipment connecting
signals are as follows:
IC DATA
LBI-38907
PIN
SIGNAL
PIN
SIGNAL
The crystal filter output of FL501 is applied to the base of
1st IF amplifier transistor TR503. This amplified signal is
taken from the collector of TR503 through an impedance
matching network consisting inductor L505, capacitor C506
and resistor R507 that matches the amplifier output to the input
of 4-pole crystal filters FL502-1 and FL502-2 which provides
the second part of receiver IF selectivity. The output of the
crystal filters is coupled through an impedance-matching network consisting of inductor L507, capacitor C508, resistor
R508 and coupling capacitor C509 to the base of 2nd IF amplifier transistor TR505.
1
SUP GND
20
RTS
2
XDATA IN
21
INP1
3
XDATA OUT
22
OUT1
4
RS485+
23
INP2
5
RS485-
24
IGN A+
6
CTS
25
SW +
7
GND
26
HKSW
2nd Mixer
8
FPROG
27
EXTMIC
9
OUT2
28
EXTRX
10
IGN SEN
29
FDISC
11
MIC HI
30
EXTALO
The 82.2 MHz IF input is applied to transistor TR505 and
mixed with a 82.655 MHz frequency supplied by a crystal oscillator circuit consisting of X501 and oscillator transistor
TR504. Variable inductor L521 sets the frequency of the oscillator circuit. This signal can be monitored at test point TP5.
12
ALO
31
CUTST
13
VOL HI
32
SPARE
14
CTL ON
33
SPARE
15
XTONENC
34
SPARE
16
XTONEDEC
35
SDATA
17
RQST
36
SONOFF
18
SPKR1
37
HORNRING
19
SPKR2
IF SECTION (CMF-138)
1st IF
The 82.2 MHz 1st IF output signal is coupled from the output of the first mixer circuit, located on the Synthesizer/Receiver/IF board, through 30-pin connector P501-1 and
capacitor C501 to the source input of buffer amplifier Junction
Field Effect Transistors (JFET) TR501 and TR502. This input
can be monitored at test point TP1. The output of TR501 and
TR502 is coupled through inductor L502 to 4-pole crystal
band-pass filter FL501. The highly-selective crystal filters
FL501-1 and FL502-2 provide the first part of receiver IF selectivity. The output of the filters is coupled through the impedance matching network consisting of inductor L502 and
capacitors C504 and C505 to the base of 1st IF amplifier transistor TR503.
LBI-38907
Linear, IF Amplifier/Detector IC501
2nd IF And Detector
The output of the 2nd mixer is coupled to the input of 4pole ceramic filter FL503 which provides 455 kHz 2nd IF selectivity. The 455 kHz IF output of ceramic filter FL503 is
coupled to Pin 3 of Limiter/FM Detector IC501. The IF signal
is amplified internal to IC501 then applied to 4-pole ceramic
filter FL504 which provides additional 455 kHz IF selectivity
(Refer to IC DATA for IC501). The output of the 455 kHz filter
is applied to IC501, Pin 7. The 2nd IF signal is amplified and
limited internal to IC501. Inductor L523 shifts the IF signal by
90 and applies it to the internal FM detector. The FM detector
compares the shifted IF signal to the internal IF signal to recover the audio modulation. The audio output of the operational amplifier internal to IC501 is applied the input of buffer
amplifier IC502-2. The AUDIO output of IC502-2 is applied to
the System Control Logic circuit. This signal can be monitored
at test point TP4. The output on Pin 12 of IC501 is applied to
the input of amplifier buffer IC502-1. The output of IC502-1
provides a Receiver Signal Strength Indicator (RSSI) signal
also sent to the System Control Logic circuit. This signal can
be monitored at test point TP3.
Linear, Dual Operational Amplifier IC502
9 Volt Regulator
The 9-volt regualtor circuit powers the IF circuits of CMF138 and consists of regulator IC503 and filter capacitors C570,
C571 C572 and C573. An input voltage of +13.8 Vdc is applied to the input of IC503 This input is monitored at test
point TP2.
3
LBI-38907
IC DATA
Linear, Positive Voltage Regulator IC503
Linear Audio Amplifier IC602, IC603
Audio Signal Processor IC601
Audio Frequency Power Amplifier IC604
4
LBI-38907
LBI-38907
IC DATA
LBI-38907
Linear: Positive Voltage Regulator IC605, IC609
Linear: Positive Voltage Regulator IC607,IC608
Reset Circuit IC610
Linear: Positive Voltage Regulator IC608
5
LBI-38907
Bilateral Switch IC611, IC612
Central Processing Unit IC701
6
IC DATA
LBI-38907
LBI-38907
Central Processing Unit U702
IC DATA
LBI-38907
ASIC IC703
7
LBI-38907
IC DATA
Decoder IC704
RS-232 Driver/Receiver IC706
RS-485 Driver/Receiver IC705
Flash Memory IC707
8
LBI-38907
LBI-38907
IC DATA
LBI-38907
EEPROM IC708
Inverter IC711
Silicon Seral Number IC712
RAM IC709
Inverter IC713
9
IC DATA
LBI-38907
PARTS LIST
LOGIC/IF BOARD
LOGIC SECTION
CMC-682
(Used in P1, P2, P3)
SYMBOL
PART NO.
DESCRIPTION
------------------ CAPACITORS -------------
C601
C602
C603
NOTE: Parts listed
are for reference
only. Refer to
Service Section
for serviceable
parts.
Ceramic: 0.01 µF ±10% 50 VDC, temp coef ±15%.
Ceramic: 1 µF +80%/-20% 16 VDCW, temp coef
+22%/-82%.
Ceramic: 220 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
C604
Ceramic: 0.1 µF +80%/-20% 25 VDCW.
C605
Ceramic: 0.01 µF ±10% 50 VDC, temp coef ±15%.
SYMBOL
PARTS LIST
PART NO.
DESCRIPTION
C649
And
C650
Electrolytic: 22 µF ±20% 16 VDCW.
C651
And
C652
Ceramic: 0.47 µF +80%/-20% 25 VDCW temp coef
+30%/-80%.
C653
And
C654
Tantalum: 2.2 µF ±20% 16 VDCW.
C655
And
C656
Electrolytic: 10 µF ±20% 25 VDCW.
C657
And
C658
Ceramic: 3300 pF ±10% 50 VDCW, temp coef
±15%.
C701
Thru
C706
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
Ceramic: 1 µF +80%/-20% 16 VDCW, temp coef
+22%/-82%.
C707
C617
Tantalum: 0.33 µF ±20% 35 VDCW.
C618
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C708
And
C709
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C623
Tantalum: 22 µF ±20% 16 VDCW.
C624
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C625
Tantalum: 1 µF ±20% 16 VDCW.
C626
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C627
Tantalum: 22 µF ±20% 16 VDCW.
C628
And
C629
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C630
Tantalum: 22 µF ±20% 16 VDCW.
C631
And
C632
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C633
Tantalum: 22 µF ±20% 16 VDCW.
C634
Thru
C637
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C638
Ceramic: 220 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
C639
Electrolytic: 47 µF ±20% 25 VDCW.
C640
Ceramic: 0.1 F +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C641
And
C642
Electrolytic: 22 µF ±20% 16 VDCW.
C643
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C644
Electrolytic: 10 µF ±20% 25 VDCW.
C645
Ceramic: 1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C646
Ceramic: 1000 pF +80%/-20% 50 VDCW temp coef
+22%/-82%.
C647
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
10
Metal film: 470K ohms ±5% 100 VDCW 1/16W.
Linear: Positive Voltage Regulator; sim to SANYO
L78M05T.
Tantalum: 1 µF ±20% 16 VDCW.
C621
And
C622
Metal film: 100k ohms ±5% 100 VDCW 1/16W.
R616
--------------- INTEGRATED CIRCUITS -------------------
IC607
C670
C616
Metal film: 4.7K ohms ±5% 100 VDCW 1/16W.
R615
Linear: Positive Voltage Regulator; sim to MOTOROLA
MC7805CT.
C667
Ceramic: 100 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
R614
IC606
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C615
Fuse ,5A.
Linear Positive Voltage Regulator: sim to NJRC
NJM78L09UA.
C611
Tantalum: 0.33 µF ±20% 35 VDCW.
F601
IC605
Ceramic: 0.1 µF ±10% 25 VDCW, temp coef ±15%.
C614
Metal film: 39k ohms ±5% 100 VDCW 1/16W.
AF Power Amplifier: sim to NEC UPC2500H.
C665
And
C666
IC608
Ceramic: 47 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
Ceramic: 12 pF 20.25 pF 50 VDCW, temp coef 0±30
PPM/°C.
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
R612
And
R613
IC604
Tantalum: 1 µF ±20% 16 VDCW.
R610
And
R611
Zener 900mW 22 V: sim to Hitachi HZF12.
Tantalum: 1 µF ±20% 16 VDCW.
C610
DESCRIPTION
EMI Filter.
C659
And
C660
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
PART NO.
CX701
And
CX702
Linear Audio Amplifier: sim to NJRC 3403. PC1230H2.
C661
Thru
C664
SYMBOL
CD712
IC602
And
IC603
Tantalum: 1 µF ±20% 16 VDCW.
Tantalum: 1 µF ±20% 16 VDCW.
Silicon fast recovery (2 diodes in series):sim to
TOSHIBA ISS300.
Ceramic: 0.047 µF +80%/-20% 50 VDCW temp coef
+22%/-82%.
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
Tantalum: 3.3 µF ±20% 16 VDCW.
CD711
DESCRIPTION
Audio Signal PROCESSOR.
C607
Thru
C609
C613
PART NO.
IC601
C606
C612
SYMBOL
LBI-38907
B19/5DDCC00042
Linear: Positive Voltage Regulator; sim to SANYO
L78M09T.
R617
Metal film: 3.3 M ±10% 200 VDCW 1/10W.
R618
And
R619
Metal film: 100k ohms ±5% 100 VDCW 1/16W.
R620
Metal film: 47K ohms ±5% 100 VDCW 1/16W.
R621
Metal film: 22k ohms ±5% 100 VDCW 1/16W.
R622
Thru
R624
Metal film: 56K ohms ±5% 100 VDCW 1/16W.
R625
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
R626
Metal film: 56k ohms ±5% 100 VDCW 1/16W.
R627
Metal film: 150k ohms ±5% 100 VDCW 1/16W.
Metal film: 100K ohms ±5% 100 VDCW 1/16W.
B19/5DAAN00483
Linear Positive Voltage Regulator: sim to NJRC
NJM78L09UA.
R628
And
R629
IC610
B19/5DADX00002
Reset Circuit: sim to MITSUMI PST575.
R630
Metal film: 3.3M ohms ±10% 200 VDCW 1/10W.
IC611
And
IC612
B19/5DDAE01621
Bilateral Switch: sim to TOSHIBA TC4S66F.
R631
Metal film: 47k ohms ±5% 100 VDCW 1/16W.
R632
Metal film: 100K ohms ±5% 100 VDCW 1/16W
R633
Metal film: 22k ohms ±5% 100 VDCW 1/16W.
R634
Metal film: 1M ohms ±5% 100 VDCW 1/16W.
R635
Metal film: 6.8k ohms ±5% 100 VDCW 1/16W.
IC609
IC701
CPU: sim to HITACHI HD6475328F.
IC702
CPU: sim to HITACHI HD6473308RF.
IC703
ASIC: sim to TOSHIBA TC24SC090AF.
IC704
DECODER: Sim to MOTOROLA MC74HC139.
*R636
Metal film: 27k ohms ±5% 100 VDCW 1/16W.
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
Ceramic: 47 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
IC705
RS485 Driver/Receiver: sim to NS AS75176.
C711
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
IC706
RS232 Driver/Receiver: sim to MAXIM MA232EWE.
R637
Thru
R639
IC707
FLASH MEMORY: sim to INTEL N28F020.
R640
Metal film: 3.3k ohms ±5% 100 VDCW 1/16W.
C712
And
C713
Ceramic: 100 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
IC708
EEPROM: sim to HITACHI HN58C66FP.
R641
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
IC709
RAM: sim to SONY CXK58257AM.
R642
Metal film: 22k ohms ±5% 100 VDCW 1/16W.
Inverter: sim to MOTOROLA MC74HC04.
C714
IC712
Silicon Seral Number: sim to DALLAS DS2400.
R643
And
R644
Metal film: 22 ohms ±5% 100 VDCW 1/16W.
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
IC711
Inverter: sim to HITACHI HD74LS04FP.
R645
And
R646
Metal film: 1.0k ohms ±5% 100 VDCW 1/16W.
R647
Metal film: 8.2k ohms ±5% 100 VDCW 1/16W.
R648
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
R649
Metal film: 1M ohms ±5% 100 VDCW 1/16W.
C710
C715
Thru
C719
Tantalum: 1 µF ±20% 16 VDCW.
IC713
C720
Thru
C722
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
J701
Connector: 18 pins.
Connector: 24 pins.
C726
And
C727
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
J702
And
J703
J704
C728
Thru
C743
Ceramic: 100 pF ±5% 50 VDCW, temp coef 0±30
PPM/°C.
C744
And
C745
Ceramic: 0.1 µF +80%/-20% 25 VDCW, temp coef
+22%/-82%.
C746
Ceramic: 1000 pF ±10% 50 VDCW, temp coef
±15%.
------------------------- JACKS ----------------------------
----------------------- DIODES --------------------CD601
And
CD602
POWER Supply rectification diode: sim to SANKEN
SFPM-64V.
CD604
Silicon fast recovery (2 diodes in series):sim to
TOSHIBA ISS300.
*CD606
Zener.
CD701
Thru
CD705
Silicon fast recovery (2 diodes in series):sim to
TOSHIBA ISS302.
CD709
And
CD710
Silicon fast recovery (2 diodes in series):sim to
TOSHIBA ISS302.
R650
Metal film: 680 ohms ±5% 100 VDCW 1/16W.
Connector: 4 pins.
R652
Metal film: 100K ohms ±5% 100 VDCW 1/16W.
J706
Connector: 10 pins.
R653
Metal film: 15K ohms ±5% 100 VDCW 1/16W.
J707
Connector: 13 pins.
R654
Metal film: 15K ohms ±5% 100 VDCW 1/16W.
J708
Connector: 5 pins.
R655
Metal film: 56k ohms ±5% 100 VDCW 1/16W.
K601
Relay: sim to TAKAMIZAWA JY9H-K.
R656
Metal film: 1.0k ohms ±5% 100 VDCW 1/16W.
R657
---------------------- RESISTORS ------------------------
Carbon film: 560 ohms ±5% 200 VDCW 1/4W.
*R664
Metal film: 2.2k ohms ±5% 200 VDCW 1/4W.
R601
Metal film: 27k ohms ±5% 100 VDCW 1/16W.
Metal film: 56K ohms ±5% 100 VDCW 1/16W.
R701
Thru
R703
Metal film: 100 ohms ±5% 100 VDCW 1/16W.
R602
R603
Metal film: 120k ohms ±5% 100 VDCW 1/16W.
R704
Metal film: 68k ohms ±5% 100 VDCW 1/16W.
R604
Metal film: 220K ohms ±5% 100 VDCW 1/16W.
R705
Metal film: 100 ohms ±5% 100 VDCW 1/16W.
R605
Metal film: 470K ohms ±5% 100 VDCW 1/16W.
Metal film: 1.0k ohms ±5% 100 VDCW 1/16W.
R606
Metal film: 56K ohms ±5% 100 VDCW 1/16W.
R607
Metal film: 150K ohms ±5% 100 VDCW 1/16W.
R706
And
R707
R608
Metal film: 22k ohms ±5% 100 VDCW 1/16W.
Metal film: 2.2k ohms ±5% 100 VDCW 1/16W.
R709
And
R710
Metal film: 100 ohms ±5% 100 VDCW 1/16W.
*R609
R718
Metal film: 4.7k ohms ±5% 100 VDCW 1/16W.
R719
Metal film: 100k ohms ±5% 100 VDCW 1/16W.
R720
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
R721
Metal film: 47k ohms ±5% 100 VDCW 1/16W.
PARTS LIST
LBI-38907
SYMBOL
R724
And
R725
PART NO.
PARTS LIST
UHF LOGIC/IF BOARD
LOGIC SECTION
CMF-138W
(Used in P1, P2, P3)
DESCRIPTION
Metal film: 2.7K ohms ±5% 100 VDCW 1/16W.
R726
Metal film: 1M ohms ±5% 100 VDCW 1/16W.
R729
And
R730
Metal film: 0 ohms.
R732
Metal film: 0 ohms.
R733
Metal film: 4.7K ohms ±5% 100 VDCW 1/16W.
R734
Metal film: 1.0k ohms ±5% 100 VDCW 1/16W.
R735
Metal film: 4.7K ohms ±5% 100 VDCW 1/16W.
R736
Metal film: 6.8K ohms ±5% 100 VDCW 1/16W.
R737
Thru
R740
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
SYMBOL
PART NO.
C502
C503
C504
NOTE: Parts listed
are for reference
only. Refer to
Service Section
for serviceable
parts.
SYMBOL
FL504
DESCRIPTION
--------------- INTEGRATED CIRCUITS ------------
IC502
Linear, Dual OP AMP; sim to NJRC NJM3404.
IC503
Linear, Positive Voltage Regulator; sim to NJRC
NJM78L09UA.
Ceramic: 5pF 0.25 pF 50 VDCW temp coef 0±60 PPM.
P501
Connector: 30 Pins.
Ceramic: 10pF 0.5 pF 50 VDCW temp coef 0±60 PPM.
----------------------- COILS --------------------------
R741
Metal film: 27k ohms ±5% 100 VDCW 1/16W.
C506
Ceramic: 5pF 0.25 pF 50 VDCW temp coef 0±60 PPM.
L501
Coil: RF 1 H ±20%.
R742
And
R743
Metal film: 4.7K ohms ±5% 100 VDCW 1/16W.
C507
Ceramic: 1.5pF 0.25 pF 50 VDCW temp coef 0±250
PPM.
L502
Coil: RF .
L503
Coil: RF .
Metal film: 470 ohms ±5% 100 VDCW 1/10W.
Coil: RF .
R744
And
R745
L504
And
L505
L506
Coil: RF .
L507
Coil: RF .
L521
Coil: RF .
R747
Metal film: 0 ohms.
R748
Metal film: 10K ohms ±5% 100 VDCW 1/16W.
R749
Metal film: 100K ohms ±5% 100 VDCW 1/16W.
R750
And
R751
Metal film: 22k ohms ±5% 100 VDCW 1/16W.
R752
And
R753
Metal film: 10k ohms ±5% 100 VDCW 1/16W.
SW601
Slide Switch.
SW701
Slide Switch.
-------------------- TRANSISTORS -------------------
C508
Ceramic: 5pF 0.25 pF 50 VDCW temp coef 0±60 PPM.
C509
Thru
C512
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
C513
And
C514
Ceramic: 0.75pF 0.25pF 50 VDCW temp coef 0±250
PPM.
C515
And
C516
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
C521
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
C522
And
C523
Ceramic: 0.1F ±10% 25 VDCW temp coef ±15%.
C524
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
C525
Ceramic: 15pF ±5% 50 VDCW temp coef 0±60 PPM.
C526
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
L522
Coil: RF 0.22 H ±10%.
L523
Coil: RF .
--------------------RESISTORS ---------------------
R501
Metal film: 82 ohms ±5% 100 VDCW.1/10W.
R502
Metal film: 18 ohms ±5% 100 VDCW.1/10W.
R503
Metal film: 3.9K ohms ±5% 100 VDCW.1/16W.
R505
Metal film: 150K ohms ±5% 100 VDCW.1/16W.
R506
Metal film: 330 ohms ±5% 100 VDCW.1/16W.
Metal film: 10K ohms ±5% 100 VDCW.1/16W.
C527
Ceramic: 33pF ±5% 50 VDCW temp coef 0±60 PPM.
TR602
Transistor NPN: sim to SANYO 2SC3398.
C528
Ceramic: 15pF ±5% 50 VDCW temp coef 0±60 PPM.
TR603
Transistor NPN: sim to NEC 2SD596.
C529
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
R507
And
R508
TR701
Transistor NPN: sim to TOSHIBA RN2301.
C530
Ceramic: 0.01F ±10% 50 VDCW temp coef ±15%.
R509
Metal film: 220 ohms ±5% 100 VDCW.1/16W.
TR702
Thru
TR712
FET: sim to NEC 2SK1582.
C531
Ceramic: 1pF 0.25pF 50 VDCW temp coef 0±250 PPM.
R510
Metal film: 5.6K ohms ±5% 100 VDCW.1/16W.
C553
Ceramic: 0.01F ±10% 50 VDCW temp coef ±15%.
R511
Metal film: 330 ohms ±5% 100 VDCW.1/16W.
C554
Thru
C556
Ceramic: 0.1F ±10% 25 VDCW temp coef ±15%.
R521
Metal film: 15K ohms ±5% 100 VDCW.1/16W.
R522
Metal film: 4.7K ohms ±5% 100 VDCW.1/16W.
R523
Metal film: 1.5K ohms ±5% 100 VDCW.1/16W.
TR713
And
TR713
Transistor NPN: sim to TOSHIBA 2SC2859.
TR715
And
TR716
Transistor NPN: sim to NEC 2SC3736.
C557
Ceramic: 15pF ±5% 50 VDCW temp coef 0±60 PPM.
Ceramic: 0.1F ±10% 25 VDCW temp coef ±15%.
X701
Crystal: 9.8304 MHz CP12A.
C558
And
C559
C560
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
R527
Metal film: 4.7K ohms ±5% 100 VDCW.1/16W.
C561
Thru
C565
Ceramic: 0.1F ±10% 25 VDCW temp coef ±15%.
R528
Metal film: 10K ohms ±5% 100 VDCW.1/16W.
R529
Metal film: 1K ohms ±5% 100 VDCW.1/16W.
C567
Electrolytic: 10F ±20% 16 VDCW.
R530
Metal film: 10K ohms ±5% 100 VDCW.1/16W.
C571
And
C572
Ceramic: 0.1F ±10% 25 VDCW temp coef ±15%.
R531
Metal film: 100 ohms ±5% 100 VDCW.1/16W.
R552
Metal film: 1.5K ohms ±5% 100 VDCW.1/16W.
Electrolytic: 10F ±20% 16 VDCW.
R556
And
R557
Metal film: 1.5K ohms ±5% 100 VDCW.1/16W.
C573
------------------------FILTERS -------------------------FL501
And
FL502
Crystal Filter: 82.2 MHz.
FL503
Ceramic: Filter: 455 KHz.
R524
Metal film: 100 ohms ±5% 100 VDCW.1/16W.
R525
Metal film: 33 ohms ±5% 100 VDCW.1/16W.
R526
Metal film: 1K ohms ±5% 100 VDCW.1/16W.
R559
Metal film: 820 ohms ±5% 100 VDCW.1/16W.
R560
Metal film: 18K ohms ±5% 100 VDCW.1/16W.
R562
Metal film: 10K ohms ±5% 100 VDCW.1/16W.
R563
Metal film: 6.8K ohms ±5% 100 VDCW.1/16W.
R564
Metal film: 1.2K ohms ±5% 100 VDCW.1/16W.
R565
Metal film: 5.6K ohms ±5% 100 VDCW.1/16W.
R566
Metal film: 0 ohms, 1/16W.
RV501
Variable: 10K ohms.
PART NO.
DESCRIPTION
-------------------TRANSISTORS --------------------
TR501
And
TR502A
N-Channel, field effect 2SK1577.
TR503
Silicon, NPN; sim to NEC 2SC2223.
TR504
And
TR505
Silicon, NPN; sim to HITACHI 2SC2620.
X501
Quartz crystal: 82.655 MHz.
XS501A
And
XS501B
Crystal Socket.
---------------------- CRYSTALS -----------------------
--------------------CONNECTORS ---------------------
Ceramic: 7pF 0.5 pF 50 VDCW temp coef 0±60 PPM.
C505
SYMBOL
Ceramic: Filter: 455 KHz.
Linear, IF Amplifier/Audio Detector; sim to TOSHIBA
TA31132F.
Ceramic: 1000pF ±10% 50 VDCW temp coef ±15%.
Ceramic: 1.5pF 0.25 pF 50 VDCW temp coef 0±250
PPM.
PART NO.
IC501
DESCRIPTION
-------------------CAPACITORS-----------------C501
LBI-38907
PRODUCTION CHANGES
Changes in the equipment to improve performance or to simplify circuits are
identified by a "Revision Letter", which is stamped after the model number on
the unit. The revision stamped on the unit includes all previous revisions. Refer
to the Parts List for the description of parts affected by these revisions.
REV. A - UHF TX RX 344A4578P1, P2 & P3
Control Logic Board CMC-862
To eliminate "sneak" current path on switched outputs. Deleted diodes
CD713 and CD714.
REV. B - UHF TX RX 344A4578P1, P2 & P3
Control Logic Board CMC-862
To reduce TX hum and noise. Added 2.2k ohms resistor between capacitor C670 and capacitor C603.
REV. C - UHF TX RX 344A4578P1, P2 & P3
To improve Dual Radio speaker gain balance and improve RF Type
decoding. Removed CD606 and R651, R636 was 10k ohms, R609
was 22k ohms, added R664 and CD606 and connected R748 to Vcc1.
11
LBI-38907
PARTS LIST
COMPONENT SIDE
12
OUTLINE DIAGRAM
SOLDER SIDE
LBI-38907
LBI-38907
SCHEMATIC DIAGRAM
LBI-38907
LOGIC (CMC-682)
SYSTEM CONTROL
(DD00-CMC-682 1/2)
13
LBI-38907
LOGIC (CMC-682)
SYSTEM CONTROL
(DD00-CMC-682 2/2)
14
SCHEMATIC DIAGRAM
LBI-38907
LBI-38907
SCHEMATIC DIAGRAM
LBI-38907
IF(CMF-138W)
(DD0-CMF-138W)
15
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