Chip Bead Cores.pdf

Chip Bead Cores.pdf
Chip Bead Cores
Chip Bead Cores
Type:
EXCCL
EXCML
EXC3B
■ Features
■ Recommended Applications
● Effective noise suppression for power lines and high
speed signal lines
● Easy pattern layout on PC Board
● For flow soldering and reflow soldering
● Digital equipment such as PCs, word processors,
printers, HDD, PCC, CD-ROMs, DVD-ROMs.
● Digital audio and video equipment such as VCRs,
DVC, CD Players, DVD Players.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
Type: EXCCL, EXCML
● Low DC Resistance 3 to 8 m액 typical: Rated
current (3 and 4 Amperes) (type: EXCML)
● Low impedance
Type: EXC3B
● High impedance for high speed signal line noise
● Increased attenuation
● 60 액-1 A, 120 액-0.5 A are achieved by using 1608
size (type: EXC3BP)
■ Type: EXCCL
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
C
C
L
3
2
1
6
U
1
Type
Part kind
Size
Bead core
Code Dimensions (mm)
Product Code
Noise Filter
Chip type
4532
3225
3216
4.5x3.2x1.8
3.2x2.5x1.6
3.2x1.6x1.6
Form
12
Suffix
Code
Packing
U
Embossed Carrier Taping
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
■ Construction
L
■ Dimensions in mm (not to scale)
A
A
W
L
Ferrite core
Dimensions (mm)
W
H
Type
(inches)
Electrode
L
A
EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
(1812)
EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
(1210)
EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
(1206)
Mass
(Weight)
[mg/pc.]
125.8
60.5
37
■ Type: EXCML
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
X
C
M
L
2
0
A
3
9
0
U
Type
Part kind
Product Code
Multilayer
Chip type
Noise Filter
Bead core
Material
Code Dimensions (mm)
45
32
20
16
■ Construction
Size
4.5x1.6 x1.1
3.2x1.6 x0.9
2.0x1.25x0.9
1.6x0.8 x0.8
Nominal Impedance
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Form
Code
Packing
U
Embossed Carrier Taping
(EXCML16 to 32)
Embossed Carrier Taping
(EXCML45)
H
■ Dimensions in mm (not to scale)
T
e
Type
(inches)
Conductor
Electrode
W
L
Ferrite core
EXCML16
(0603)
EXCML20
(0805)
EXCML32
(1206)
EXCML45
(1806)
L
1.6±0.2
Dimensions (mm)
W
T
0.8±0.2
e
Mass
(Weight)
[mg/pc.]
0.8±0.2
(0.4)
4.5
2.0±0.2 1.25±0.20 0.9±0.2
(0.5)
10.5
3.2±0.3
1.6±0.3
0.9±0.2
(0.6)
21.5
4.5±0.3
1.6±0.3
1.1±0.2
(0.6)
36.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
■ Type: EXC3B
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
E
X
C
3
B
B
2
2
1
H
Product Code
Noise Filter
Size
Code Dimensions (mm)
3
1.6x0.8x0.8
Type Characteristics
Multilayer
Chip type
Bead Core
B
P
Nominal Impedance
High frequency
High attenuation
for signal Lines
High frequency
High attenuation
for Power Lines
■ Construction
11
Form
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
12
Suffix
Code
Packing
H
Embossed Carrier Taping
■ Dimensions in mm (not to scale)
T
e
Ferrite core
W
L
Inner Conductor
Electrode
Type
(inches)
EXC3BB
(0603)
EXC3BP
(0603)
Dimensions (mm)
W
T
L
Mass
(Weight)
[mg/pc.]
e
1.6±0.2
0.8±0.2
0.8±0.2 0.30±0.15
4.5
1.6±0.2
0.8±0.2
0.8±0.2 0.30±0.15
4.5
■ Ratings
Impedance
Rated Current
(mA DC)
DC Resistance
(액) max.
Type
Part Number
4532
EXCCL4532U1
115
2000
0.1
3225
EXCCL3225U1
45
2000
0.05
3216
EXCCL3216U1
25
2000
0.05
4516
EXCML45A910H
91
3000
0.016
3216
EXCML32A680U
68
3000
0.012
2012
EXCML20A390U
39
4000
0.008
1608
EXCML16A270U
27
4000
0.006
EXC3BP600H
60
1000
0.07
EXC3BP121H
120
500
0.1
EXC3BB221H
220
200
0.3
EXC3BB601H
600
100
0.8
EXC3BB102H
1000
50
1608
(액) at 100 MHz
tol.(%)
±25
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1
Feb. 2006
Chip Bead Cores
■ Impedance Characteristics (Reference Data)
훺Z훺, R, X(액)
훺Z훺, R, X(액)
Z
R
X
1
10
R : Resistance
1000
100
140
120
100
80
60
40
20
0
Z
1
10000
10
Frequency(MHz)
Z
R
X
1
10
1000
100
R
X
10
훺Z훺, R, X(액)
훺Z훺, R, X(액)
100
1000
Frequency(MHz)
10000
●EXCML32A680U (3216)
Z
R
X
10
10000
Z
1
10000
●EXCCL3216U1 (3216)
1
X
100
1000
Frequency(MHz)
140
120
100
80
60
40
20
0
Frequency(MHz)
140
120
100
80
60
40
20
0
R
●EXCML20A390U (2012)
훺Z훺, R, X(액)
훺Z훺, R, X(액)
●EXCCL3225U1 (3225)
140
120
100
80
60
40
20
0
X : Reactance
●EXCML16A270U (1608)
●EXCCL4532U1 (4532)
140
120
100
80
60
40
20
0
Measured by HP4291A
앚Z앚 : Impedance
100
1000
140
120
100
80
60
40
20
0
Z
R
X
1
10000
10
Frequency(MHz)
100
1000
Frequency(MHz)
10000
●EXCML45A910H (4516)
훺Z훺, R, X(액)
180
160
140
120
100
80
60
40
20
0
Z
R
X
1
10
100
1000
Frequency(MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
10000
Feb. 2006
Chip Bead Cores
■ Impedance Characteristics (Reference Data)
Measured by HP4291A
앚Z앚 : Impedance
1400
1200
1000
800
600
400
200
0
200
Z
1
R
X
100
10
1000
Z
150
R
100
X
50
0
10000
1
10
Frequency(MHz)
10000
●EXC3BP600H (1608)
200
R
훺Z훺, R, X(액)
1400
1200
1000
800
600
400
200
0
1000
100
Frequency(MHz)
●EXC3BB601H (1608)
훺Z훺, R, X(액)
X : Reactance
●EXC3BP121H (1608)
훺Z훺, R, X(액)
훺Z훺, R, X(액)
●EXC3BB221H (1608)
R : Resistance
Z
X
1
10
100
150
Z
100
R
50
X
0
1000
10000
1
10
100
1000
10000
Frequency(MHz)
Frequency(MHz)
훺Z훺, R, X(액)
●EXC3BB102H (1608)
1400
1200
1000
800
600
400
200
0
Z
R
X
1
10
100
1000
10000
Frequency(MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
EXCCL4532U1
Pitch (P1)
Quantity
8 mm
1000 pcs./reel
EXCCL3225U1
2000 pcs./reel
EXCCL3216U1
EXCML45A910H
Embossed Carrier Taping
EXCML32A680U
3000 pcs./reel
4 mm
EXCML20A390U
4000 pcs./reel
EXCML16A270U
EXC3B첸첸첸첸H
● Embossed Carrier Taping
● Taping Reel
T
Compartment
fD0
fC
B
F
W
A
P1
t2
Chip component
fB
Sprocket hole
E
t1
fD
P2
E
P0
Tape running direction
W
fA
t
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
F
EXCCL4532U1
3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1
EXCCL3225U1
2.9±0.2 3.6±0.2
EXCCL3216U1
2.0±0.2 3.6±0.2
E
P1
P2
P0
fD0
t1
t2
8.0±0.1
2.4 max.
8.0±0.2 3.5±0.1
2.1 max.
EXCML45A910H
1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.20±0.05 1.8 max.
EXCML32A680U
1.9±0.2 3.5±0.2
EXCML20A390U
1.5±0.2 2.3±0.2
EXCML16A270U
1.1±0.2 2.1±0.2
EXC3B첸첸첸첸H
1.0±0.1 1.8±0.1
8.0±0.2 3.5±0.1
1.6 max.
0.25±0.05
Standard Reel Dimensions (mm)
Part Number
fA
fB
fC
fD
E
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
0
180.0–3.0
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
W
T
13.0+0.5
–1.0
16.5 max.
09.5+0.5
–1.0
13 max.
–1.0
13.0+0.5
16.5 max.
09.5+0.5
–1.0
13 max.
t
1.2±0.5
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B첸첸첸첸H
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Please contact us for additional information when used in conditions other than those specified.
● Please measure the temperature of the terminals and study every kind of solder and printed circuit board
for solderability before actual use.
The limit of resistance
to reflow soldering heat
270
260
Rising temperature I
Preheating
Gradual
cooling
Main
Rising temperature II heating
Temperature (°C)
Temperature of terminals (°C)
<Recommended reflow soldering temperature>
250
240
230
220
210
200
Time (min.)
Solder
Rising temperature I
For soldering
(Sn-37Pb)
The normal time
for preheating
30 s to 60 s
For lead-free
soldering
(Sn-3Ag-0.5Cu)
The normal time
for preheating
30 s to 60 s
0
10
20
30
40
50
60
70
Time (s)
Preheating
Rising temperature II
Main heating
Gradual cooling
140 °C to 160 °C Preheating to 200 °C
20 s to 40 s
60 s to 120 s
235±10 °C
Peak
200 °C to 100 °C
1 °C to 4 °C/s
150 °C to 170 °C Preheating to 210 °C
20 s to 40 s
60 s to 120 s
250+10
– 5 °C
Peak
210 °C to 100 °C
1 °C to 4 °C/s
✽ Reflow soldering shall be performed a maximum of two times.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
■ Recommended Land Pattern Dimensions in mm (not to scale)
A
C
B
(mm)
Part Number
A
B
C
EXCCL4532U1
3
5.4
2.8
EXCCL3225U1
1.7
4.1
2.1
EXCCL3216U1
1.7
4.1
1.2
EXCML45A910H
2.6 to 3
5.5 to 6.5
1.2 to 1.6
EXCML32A680U
1.6 to 2
4 to 5
1.2 to 1.6
EXCML20A390U
0.8 to 1.2
3 to 4
1 to 1.2
EXCML16A270U
0.6 to 1
2 to 3
0.8 to 1
EXC3B첸첸첸첸H
0.8 to 1
2 to 2.6
0.8 to 1
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. With regard to flow soldering, consult with our sales person in advance.
2. Use rosin-based flux or halogen-free flux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.
Excessive mechanical stress may damage the bead cores. Handle with care.
5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection
indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
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