RC1206 Yageo.pdf

RC1206 Yageo.pdf
DATA SHEET
GENERAL PURPOSE CHIP RESISTORS
RC1206 (Pb Free)
Product specification – Sep 03, 2004 V.2
5%; 1%
Product specification
Chip Resistor Surface Mount
RC
SERIES
2
10
1206 (Pb Free)
SCOPE
This specification describes RC1206 series chip resistors with lead-free terminations made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and
resistance value.
YAGEO ORDERING CODE
CTC
ORDERING EXAMPLE
CODE
RC1206
X X X XX XXXX L
(1) (2) (3)
(4)
(5)
(6)
(1) TOLERANCE
F = ±1%
J = ±5%
(2) PACKAGING TYPE
R = Paper/PE taping reel
(3) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
The ordering code of a RC1206 chip resistor, value
56 X with ±1% tolerance, supplied in 7-inch tape reel
is: RC1206FR-0756RL.
NOTE
1. The “L” at the end of the code is only for ordering. On the reel
label, the standard CTC will be mentioned an additional stamp
“LFP”= lead free production.
2. Products with lead in terminations fulfil the same requirements
as mentioned in this datasheet.
3. Products with lead in terminations will be phased out in the
coming months (before July 1st, 2006)
(4) TAPING REEL
07 = 7 inch dia. Reel
10 = 10 inch dia. Reel (not preferred)
13 = 13 inch dia. Reel
(5) RESISTANCE VALUE
5R6, 56R, 560R, 5K6, 56K, 22M.
(6) RESISTOR TERMINATIONS
L = Lead free terminations (pure Tin)
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
RC
SERIES
3
10
1206 (Pb Free)
MARKING
RC1206
E-24 series: 3 digits
ynsc001
Fig. 1
Value=10 KΩ
First two digits for significant figure and 3rd digit for number of zeros
Both E-24 and E-96 series: 4 digits
ynsc004
Fig. 2 Value=10 KΩ
First three digits for significant figure and 4th digit for number of zeros
For marking codes, please see EIA-marking code rules in data sheet “Chip resistors instruction”.
CONSTRUCTION
The resistors are constructed out of
a high-grade ceramic body. Internal
handbook, 4 columns
metal electrodes are added at each
end and connected by a resistive
H
paste. The composition of the paste
is adjusted to give the approximate
I2
required resistance and laser cutting
of this resistive layer that achieves
Fig. 3 Chip resistor construction
tolerance trims the value. The
resistive layer is covered with a
protective coat and printed with the
resistance value. Finally, the two external terminations (pure Tin) are added. See fig. 3.
protective coat
resistor layer
inner electrode
end termination
ceramic substrate
MBE940_a
DIMENSIONS
Table 1
TYPE
protective coat
RC1206
L (mm)
3.10 ±0.10
W (mm)
1.60 ±0.10
H (mm)
0.55 ±0.10
I1 (mm)
0.45 ±0.20
I2 (mm)
0.40 ±0.20
I1
W
MBE940_a
L
Fig. 4 Chip resistor dimension
For dimension see Table 1
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
RC
SERIES
ELECTRICAL CHARACTERISTICS
FOOTPRINT AND SOLDERING
PROFILES
Table 2
RC1206 1/4 W
CHARACTERISTICS
Operating Temperature Range
–55 °C to +155 °C
Maximum Working Voltage
200 V
Maximum Overload Voltage
400 V
Dielectric Withstanding Voltage
500 V
5% (E24) 1 Ω to 22 MΩ
Resistance Range
1% (E96) 1 Ω to 10 MΩ
Zero Ohm Jumper < 0.05 Ω
Temperature Coefficient
Jumper Criteria
4
10
1206 (Pb Free)
10 Ω < R ≤ 10 MΩ
±100 ppm/°C
R ≤ 10 Ω; R > 10 MΩ
±200 ppm/°C
Rated Current
2.0 A
Maximum Current
10.0 A
For recommended footprint and
soldering profiles, please see the
special data sheet “Chip resistors
mounting”.
ENVIRONMENTAL DATA
For material declaration
information (IMDS-data) of the
products, please see the
separated info “Environmental
data”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PRODUCT TYPE
PACKING STYLE
REEL DIMENSION
RC1206
Paper / PE Taping Reel (R)
7" (178 mm)
QUANTITY PER REEL
5,000 units
10" (254 mm) / not preferred
10,000 units
13" (330 mm)
20,000 units
NOTE
1. For Paper/PE tape and reel specification/dimensions, please see the special data sheet “Packing” document.
www.yageo.com
Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
RC
SERIES
5
10
1206 (Pb Free)
FUNCTIONAL DESCRIPTION
POWER RATING
MRA632
Pmax
(%Prated)
RC1206 rated power at 70°C is 1/4 W
RATED VOLTAGE
100
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
50
V=√(P X R)
0
−55
0
155
100
Tamb (°C)
50 70
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
Fig. 5 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb )
P=Rated power (W)
R=Resistance value (X)
PULSE LOADING CAPABILITIES
MBD641
10 4
Vmax
(V)
1.2/50 µs
10
3
10/700 µs
10 2
10
10
10 2
10 3
10 4
10 5
10 6
R n (Ω)
10 7
Fig. 6 Maximum permissible peak pulse voltage without failing to open circuit’ in accordance with DIN IEC 60040 (CO) 533 for type:
RC1206
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
10
RC
SERIES
6
10
1206 (Pb Free)
MBD585
3
P max
(W)
10 2
single pulse
10
t p /t i =1000
1
10 1
10 6
10 5
10 4
10 3
10 2
10 1
1
t i (s)
Fig. 7 Pulse on a regular basis for type: RC1206; maximum permissible peak pulse power as a function of pulse duration for single
pulse and repetitive pulse tp/ti = 1000
MBD586
600
Vmax
(V)
400
200
0
10 6
10 5
10 4
10 3
10 2
10 1
t i (s)
1
Fig. 8 Pulse on a regular basis for type: RC1206; maximum permissible peak pulse voltage as a function of pulse duration
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
RC
7
10
1206 (Pb Free)
SERIES
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Temperature
Coefficient of
Resistance
(T.C.R.)
TEST METHOD
PROCEDURE
REQUIREMENTS
MIL-STD-202F-method 304;
At +25/–55 °C and +25/+125 °C
Refer to table 2
JIS C 5202-4.8
Formula:
R2–R1
T.C.R= ------------------------×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Thermal Shock
MIL-STD-202F-method 107G;
IEC 60115-1 4.19
Low
Temperature
Operation
MIL-R-55342D-Para 4.7.4
Short Time
Overload
MIL-R-55342D-Para 4.7.5;
At –65 (+0/–10) °C for 2 minutes and at +155
(+10/–0) °C for 2 minutes; 25 cycles
±(0.5%+0.05 Ω) for 1% tol.
At –65 (+0/–5) °C for 1 hour; RCWV applied
for 45 (+5/–0) minutes
±(0.5%+0.05 Ω) for 1% tol .
±(1.0%+0.05 Ω) for 5% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
IEC 60115-1 4.13
2.5 × RCWV applied for 5 seconds at room
temperature
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
No visible damage
Insulation
Resistance
MIL-STD-202F-method 302;
RCOV for 1 minute
IEC 60115-1 4.6.1.1
Type
Voltage (DC)
Dielectric
Withstand
Voltage
≥10 GΩ
RC1206
400 V
MIL-STD-202F-method 301;
Maximun voltage (Vrms) applied for 1 minute
IEC 60115-1 4.6.1.1
Type
RC1206
Voltage (AC)
500 Vrms
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
Life
MIL-STD-202F-method 108A;
IEC 60115-1 4.18
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
No breakdown or flashover
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
±(1%+0.05 Ω) for 1% tol.
±(3%+0.05 Ω) for 5% tol.
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
TEST
Solderability
Bending
Strength
Resistance to
Solvent
Noise
RC
SERIES
TEST METHOD
PROCEDURE
REQUIREMENTS
MIL-STD-202F-method 208A;
Solder bath at 245±3 °C
Well tinned (≥95% covered)
IEC 60115-1 4.17
Dipping time: 2±0.5 seconds
No visible damage
Resistors mounted on a 90 mm glass epoxy
resin PCB (FR4)
±(1.0%+0.05 Ω) for 1% tol.
Bending: 5 mm
No visible damage
No smeared
IEC 60115-1 4.29
lsopropylalcohol (C3H7OH) or dichloromethane
(CH2Cl2) followed by brushing
JIS C 5202 5.9;
Maximum voltage (Vrms) applied.
Resistors range
Value
R < 100 Ω
10 dB
100 Ω ≤ R < 1 KΩ
20 dB
1 KΩ ≤ R < 10 KΩ
30 dB
10 KΩ ≤ R < 100 KΩ
40 dB
100 KΩ ≤ R < 1 MΩ
46 dB
1 MΩ ≤ R ≤ 22 MΩ
48 dB
JIS C 5202.6.14;
IEC 60115-1 4.15
MIL-STD-202F-method 215;
IEC 60115-1 4.12
Humidity
(steady state)
Leaching
Intermittent
Overload
Resistance to
Vibration
Moisture
Resistance
Heat
8
10
1206 (Pb Free)
±(1.0%+0.05 Ω) for 5% tol.
JIS C 5202 7.5;
1,000 hours; 40±2 °C; 93(+2/–3)% RH
IEC 60115-8 4.24.8
±(0.5%+0.05 Ω) for 1% tol.
RCWV applied for 1.5 hours on and 0.5 hour off
±(2.0%+0.05 Ω) for 5% tol.
EIA/IS 4.13B;
Solder bath at 260±5 °C
No visible damage
IEC 60115-8 4.18
Dipping time: 30±1 seconds
JIS C 5202 5.8
At room temperature; 2.5 × RCWV applied for
1 second on and 25 seconds off; total 10,000
cycles
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
On request
On request
MIL-STD-202F-method 106F;
42 cycles; total 1,000 hours
±(0.5%+0.05Ω) for 1% tol.
IEC 60115-1 4.24.2
Shown as figure 9
±(2.0%+0.05Ω) for 5% tol.
No visible damage
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
75
RC
80 − 98%
RH
90 − 98% RH
temperature
[°C]
SERIES
90 − 98% RH
9
10
1206 (Pb Free)
80 − 98%
RH
90 − 98% RH
initial drying
24 hours
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
50
end of final cycle;
measurements
as specified in 2.7
+10 °C (+18 °F)
−2 °C (−3.6 °F)
25
initial measurements
as specified in 2.2
0
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
voltage applied as specified in 2.4
STEP1
STEP2
prior to first
cycle only
HBK073
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP3
STEP4
STEP5
STEP6
STEP7
one cycle 24 hours; repeat as specified in 2.5
0
5
10
15
20
25
time [h]
Fig. 9 Moisture resistance test requirements
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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
RC
SERIES
10
10
1206 (Pb Free)
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 2
Sep 03, 2004
-
- Test method and procedure updated
- PE tape added (paper tape will be replaced by PE tape)
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Sep 03, 2004 V.2
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