1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose... SST39SF010A / SST39SF020A / SST39SF040 FEATURES:

1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose... SST39SF010A / SST39SF020A / SST39SF040 FEATURES:
1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
SST39SF010A / 020A / 0405.0V 1Mb / 2Mb / 4Mb (x8) MPF memories
Data Sheet
FEATURES:
• Organized as 128K x8 / 256K x8 / 512K x8
• Single 4.5-5.5V Read and Write Operations
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption
(typical values at 14 MHz)
– Active Current: 10 mA (typical)
– Standby Current: 30 µA (typical)
• Sector-Erase Capability
– Uniform 4 KByte sectors
• Fast Read Access Time:
– 55 ns
– 70 ns
• Latched Address and Data
• Automatic Write Timing
– Internal VPP Generation
• Fast Erase and Byte-Program
– Sector-Erase Time: 18 ms (typical)
– Chip-Erase Time: 70 ms (typical)
– Byte-Program Time: 14 µs (typical)
– Chip Rewrite Time:
2 seconds (typical) for SST39SF010A
4 seconds (typical) for SST39SF020A
8 seconds (typical) for SST39SF040
• End-of-Write Detection
– Toggle Bit
– Data# Polling
• TTL I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm)
– 32-pin PDIP
• All devices are RoHS compliant
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST39SF010A/020A/040 are CMOS Multi-Purpose
Flash (MPF) manufactured with SST’s proprietary, high
performance CMOS SuperFlash technology. The split-gate
cell design and thick oxide tunneling injector attain better
reliability and manufacturability compared with alternate
approaches. The SST39SF010A/020A/040 devices write
(Program or Erase) with a 4.5-5.5V power supply. The
SST39SF010A/020A/040 devices conform to JEDEC standard pinouts for x8 memories.
Featuring high performance Byte-Program, the
SST39SF010A/020A/040 devices provide a maximum
Byte-Program time of 20 µsec. These devices use Toggle
Bit or Data# Polling to indicate the completion of Program
operation. To protect against inadvertent write, they have
on-chip hardware and Software Data Protection schemes.
Designed, manufactured, and tested for a wide spectrum of
applications, these devices are offered with a guaranteed
typical endurance of 100,000 cycles. Data retention is rated
at greater than 100 years.
function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash
technology uses less current to program and has a shorter
erase time, the total energy consumed during any Erase or
Program operation is less than alternative flash technologies. These devices also improve flexibility while lowering
the cost for program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Program cycles.
To meet high density, surface mount requirements, the
SST39SF010A/020A/040 are offered in 32-lead PLCC and
32-lead TSOP packages. A 600 mil, 32-pin PDIP is also
available. See Figures 2, 3, and 4 for pin assignments.
The SST39SF010A/020A/040 devices are suited for applications that require convenient and economical updating of
program, configuration, or data memory. For all system
applications, they significantly improve performance and
reliability, while lowering power consumption. They inherently use less energy during erase and program than alternative flash technologies. The total energy consumed is a
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Device Operation
is latched on the rising edge of the sixth WE# pulse. The
internal Erase operation begins after the sixth WE# pulse.
The End-of-Erase can be determined using either Data#
Polling or Toggle Bit methods. See Figure 10 for timing
waveforms. Any commands written during the SectorErase operation will be ignored.
Commands are used to initiate the memory operation functions of the device. Commands are written to the device
using standard microprocessor write sequences. A command is written by asserting WE# low while keeping CE#
low. The address bus is latched on the falling edge of WE#
or CE#, whichever occurs last. The data bus is latched on
the rising edge of WE# or CE#, whichever occurs first.
Chip-Erase Operation
Read
The SST39SF010A/020A/040 provide Chip-Erase operation, which allows the user to erase the entire memory
array to the “1s” state. This is useful when the entire device
must be quickly erased.
The Read operation of the SST39SF010A/020A/040 is
controlled by CE# and OE#, both have to be low for the
system to obtain data from the outputs. CE# is used for
device selection. When CE# is high, the chip is deselected and only standby power is consumed. OE# is the
output control and is used to gate data from the output
pins. The data bus is in high impedance state when
either CE# or OE# is high. Refer to the Read cycle timing
diagram (Figure 5) for further details.
The Chip-Erase operation is initiated by executing a sixbyte Software Data Protection command sequence with
Chip-Erase command (10H) with address 5555H in the last
byte sequence. The internal Erase operation begins with
the rising edge of the sixth WE# or CE#, whichever occurs
first. During the internal Erase operation, the only valid read
is Toggle Bit or Data# Polling. See Table 4 for the command
sequence, Figure 11 for timing diagram, and Figure 19 for
the flowchart. Any commands written during the ChipErase operation will be ignored.
Byte-Program Operation
The SST39SF010A/020A/040 are programmed on a byteby-byte basis. Before programming, the sector where the
byte exists must be fully erased. The Program operation is
accomplished in three steps. The first step is the three-byte
load sequence for Software Data Protection. The second
step is to load byte address and byte data. During the ByteProgram operation, the addresses are latched on the falling
edge of either CE# or WE#, whichever occurs last. The
data is latched on the rising edge of either CE# or WE#,
whichever occurs first. The third step is the internal Program operation which is initiated after the rising edge of the
fourth WE# or CE#, whichever occurs first. The Program
operation, once initiated, will be completed, within 20 µs.
See Figures 6 and 7 for WE# and CE# controlled Program
operation timing diagrams and Figure 16 for flowcharts.
During the Program operation, the only valid reads are
Data# Polling and Toggle Bit. During the internal Program
operation, the host is free to perform additional tasks. Any
commands written during the internal Program operation
will be ignored.
Write Operation Status Detection
The SST39SF010A/020A/040 provide two software means
to detect the completion of a Write (Program or Erase)
cycle, in order to optimize the system Write cycle time. The
software detection includes two status bits: Data# Polling
(DQ7) and Toggle Bit (DQ6). The End-of-Write detection
mode is enabled after the rising edge of WE# which initiates the internal Program or Erase operation.
The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or
Toggle Bit read may be simultaneous with the completion
of the Write cycle. If this occurs, the system may possibly
get an erroneous result, i.e., valid data may appear to conflict with either DQ7 or DQ6. In order to prevent spurious
rejection, if an erroneous result occurs, the software routine
should include a loop to read the accessed location an
additional two (2) times. If both reads are valid, then the
device has completed the Write cycle, otherwise the rejection is valid.
Sector-Erase Operation
The Sector-Erase operation allows the system to erase the
device on a sector-by-sector basis. The sector architecture
is based on uniform sector size of 4 KByte. The SectorErase operation is initiated by executing a six-byte command load sequence for Software Data Protection with
Sector-Erase command (30H) and sector address (SA) in
the last bus cycle. The sector address is latched on the falling edge of the sixth WE# pulse, while the command (30H)
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Data# Polling (DQ7)
Software Data Protection (SDP)
When the SST39SF010A/020A/040 are in the internal Program operation, any attempt to read DQ7 will produce the
complement of the true data. Once the Program operation
is completed, DQ7 will produce true data. Note that even
though DQ7 may have valid data immediately following the
completion of an internal Write operation, the remaining
data outputs may still be invalid: valid data on the entire
data bus will appear in subsequent successive Read
cycles after an interval of 1 µs. During internal Erase operation, any attempt to read DQ7 will produce a ‘0’. Once the
internal Erase operation is completed, DQ7 will produce a
‘1’. The Data# Polling is valid after the rising edge of fourth
WE# (or CE#) pulse for Program operation. For Sector- or
Chip-Erase, the Data# Polling is valid after the rising edge
of sixth WE# (or CE#) pulse. See Figure 8 for Data# Polling
timing diagram and Figure 17 for a flowchart.
The SST39SF010A/020A/040 provide the JEDEC
approved Software Data Protection scheme for all data
alteration operations, i.e., Program and Erase. Any Program operation requires the inclusion of a series of threebyte sequence. The three-byte load sequence is used to
initiate the Program operation, providing optimal protection
from inadvertent Write operations, e.g., during the system
power-up or power-down. Any Erase operation requires the
inclusion of six-byte load sequence. The SST39SF010A/
020A/040 devices are shipped with the Software Data Protection permanently enabled. See Table 4 for the specific
software command codes. During SDP command
sequence, invalid commands will abort the device to read
mode, within TRC.
Product Identification
The Product Identification mode identifies the device as the
SST39SF040, SST39SF010A, or SST39SF020A and
manufacturer as SST. This mode may be accessed by software operations. Users may wish to use the software Product Identification operation to identify the part (i.e., using the
device ID) when using multiple manufacturers in the same
socket. For details, Table 4 for software operation, Figure
12 for the software ID entry and read timing diagram and
Figure 18 for the ID entry command sequence flowchart.
Toggle Bit (DQ6)
During the internal Program or Erase operation, any consecutive attempts to read DQ6 will produce alternating 0s
and 1s, i.e., toggling between 0 and 1. When the internal
Program or Erase operation is completed, the toggling will
stop. The device is then ready for the next operation. The
Toggle Bit is valid after the rising edge of fourth WE# (or
CE#) pulse for Program operation. For Sector- or ChipErase, the Toggle Bit is valid after the rising edge of sixth
WE# (or CE#) pulse. See Figure 9 for Toggle Bit timing diagram and Figure 17 for a flowchart.
TABLE 1: Product Identification
Address
Data
0000H
BFH
SST39SF010A
0001H
B5H
SST39SF020A
0001H
B6H
SST39SF040
0001H
B7H
Manufacturer’s ID
Data Protection
Device ID
The SST39SF010A/020A/040 provide both hardware and
software features to protect nonvolatile data from inadvertent writes.
T1.2 1147
Hardware Data Protection
Product Identification Mode Exit/Reset
Noise/Glitch Protection: A WE# or CE# pulse of less than 5
ns will not initiate a Write cycle.
In order to return to the standard Read mode, the Software
Product Identification mode must be exited. Exit is accomplished by issuing the Exit ID command sequence, which
returns the device to the Read operation. Please note that
the software reset command is ignored during an internal
Program or Erase operation. See Table 4 for software command codes, Figure 13 for timing waveform and Figure 18
for a flowchart.
VDD Power Up/Down Detection: The Write operation is
inhibited when VDD is less than 2.5V.
Write Inhibit Mode: Forcing OE# low, CE# high, or WE#
high will inhibit the Write operation. This prevents inadvertent writes during power-up or power-down.
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
SuperFlash
Memory
X-Decoder
Memory Address
Address Buffers & Latches
Y-Decoder
CE#
I/O Buffers and Data Latches
Control Logic
OE#
WE#
DQ7 - DQ0
1147 B1.2
A4
A3
A17
WE#
VDD
A18
A16
A15
A12
A17
A4
NC
A5
WE#
A5
VDD
A5
WE#
6
VDD
A6
NC
A6
NC
A6
A16
5
A15
A7
A16
A7
A15
A7
A12
SST39SF020A
SST39SF010A
SST39SF040 SST39SF020A SST39SF010A
A12
SST39SF040
FIGURE 1: Functional Block Diagram
4
3
2
1
32 31 30
29
SST39SF010A SST39SF020A
SST39SF040
A14
A14
28
A13
A13
A13
7
27
A8
A8
A8
A4
8
26
A9
A9
A9
A3
A3
9
25
A11
A11
A11
A2
A2
A2
10
24
OE#
OE#
OE#
A1
A1
A1
11
23
A10
A10
A10
A0
A0
A0
12
22
CE#
CE#
CE#
DQ0
DQ0
DQ0
13
21
14 15 16 17 18 19 20
DQ7
DQ7
DQ7
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
32-lead PLCC
Top View
DQ1
SST39SF040
SST39SF020A SST39SF010A
A14
1147 32-plcc P2.4
FIGURE 2: Pin Assignments for 32-lead PLCC
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
SST39SF040 SST39SF020A
A11
A9
A8
A13
A14
A17
WE#
VDD
A18
A16
A15
A12
A7
A6
A5
A4
A11
A9
A8
A13
A14
A17
WE#
VDD
NC
A16
A15
A12
A7
A6
A5
A4
SST39SF010A
A11
A9
A8
A13
A14
NC
WE#
VDD
NC
A16
A15
A12
A7
A6
A5
A4
SST39SF010A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Standard Pinout
Top View
Die Up
SST39SF020A
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
SST39SF040
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
1147 32-tsop P1.1
FIGURE 3: Pin Assignments for 32-lead TSOP (8mm x 14mm)
SST39SF040 SST39SF020A SST39SF010A
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
SST39SF010A SST39SF020A
1
2
3
4
5
32-pin
6
PDIP
7
8 Top View
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
WE#
A17
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
SST39SF040
VDD
WE#
A17
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
1147 32-pdip P3.2
FIGURE 4: Pin Assignments for 32-pin PDIP
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 2: Pin Description
Symbol
Pin Name
Functions
AMS1-A0
Address Inputs
To provide memory addresses.
During Sector-Erase AMS-A12 address lines will select the sector.
DQ7-DQ0
Data Input/output
To output data during Read cycles and receive input data during Write cycles.
Data is internally latched during a Write cycle.
The outputs are in tri-state when OE# or CE# is high.
CE#
Chip Enable
To activate the device when CE# is low.
OE#
Output Enable
To gate the data output buffers.
WE#
Write Enable
To control the Write operations.
VDD
Power Supply
To provide 5.0V supply (4.5-5.5V)
VSS
Ground
NC
No Connection
Unconnected pins.
T2.2 1147
1. AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
TABLE 3: Operation Modes Selection
Mode
CE#
OE#
WE#
Read
Program
DQ
Address
VIL
VIL
VIL
VIH
VIH
DOUT
AIN
VIL
DIN
AIN
X1
Sector address,
XXH for Chip-Erase
Erase
VIL
VIH
VIL
Standby
VIH
X
X
High Z
X
X
VIL
X
High Z/ DOUT
X
X
X
VIH
High Z/ DOUT
X
VIL
VIL
VIH
Write Inhibit
Product Identification
Software Mode
See Table 4
T3.3 1147
1. X can be VIL or VIH, but no other value.
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 4: Software Command Sequence
Command
Sequence
1st Bus
Write Cycle
Addr1
Data
2nd Bus
Write Cycle
Addr1
Data
3rd Bus
Write Cycle
Addr1
4th Bus
Write Cycle
Data
Addr1
Data
Data
5th Bus
Write Cycle
6th Bus
Write Cycle
Addr1
Data
Addr1
Data
Byte-Program
5555H
AAH
2AAAH
55H
5555H
A0H
BA2
Sector-Erase
5555H
AAH
2AAAH
55H
5555H
80H
5555H
AAH
2AAAH
55H
SAX3
30H
5555H
AAH
2AAAH
55H
5555H
10H
Chip-Erase
5555H
AAH
2AAAH
55H
5555H
80H
Software ID Entry4,5
5555H
AAH
2AAAH
55H
5555H
90H
2AAAH
55H
5555H
F0H
Software ID Exit6
XXH
F0H
Software ID Exit6
5555H
AAH
T4.2 1147
1. Address format A14-A0 (Hex), Addresses AMS-A15 can be VIL or VIH, but no other value, for the Command sequence.
AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
2. BA = Program Byte address
3. SAX for Sector-Erase; uses AMS-A12 address lines
4. The device does not remain in Software Product ID mode if powered down.
5. With AMS-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,
SST39SF010A Device ID = B5H, is read with A0 = 1
SST39SF020A Device ID = B6H, is read with A0 = 1
SST39SF040 Device ID = B7H, is read with A0 = 1
6. Both Software ID Exit operations are equivalent
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
Operating Range
Range
Commercial
Industrial
Ambient Temp
VDD
0°C to +70°C
4.5-5.5V
-40°C to +85°C
4.5-5.5V
AC Conditions of Test
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 55 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 70 ns
See Figures 14 and 15
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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01/10
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 5: DC Operating Characteristics VDD = 4.5-5.5V1
Limits
Symbol
Parameter
IDD
Power Supply Current
Min
Max
Units
Test Conditions
Address input=VILT/VIHT, at f=1/TRC Min
VDD=VDD Max
Read2
25
mA
CE#=VIL, OE#=WE#=VIH, all I/Os open
Program and Erase
35
mA
CE#=WE#=VIL, OE#=VIH
ISB1
Standby VDD Current
(TTL input)
3
mA
CE#=VIH, VDD=VDD Max
ISB2
Standby VDD Current
(CMOS input)
100
µA
CE#=VIHC, VDD=VDD Max
ILI
Input Leakage Current
1
µA
VIN=GND to VDD, VDD=VDD Max
ILO
Output Leakage Current
10
µA
VOUT=GND to VDD, VDD=VDD Max
VIL
Input Low Voltage
0.8
V
VDD=VDD Min
VIH
Input High Voltage
2.0
V
VDD=VDD Max
VIHC
Input High Voltage (CMOS)
VDD-0.3
V
VDD=VDD Max
VOL
Output Low Voltage
VOH
Output High Voltage
0.4
2.4
V
IOL=2.1 mA, VDD=VDD Min
V
IOH=-400 µA, VDD=VDD Min
T5.10 1147
1. Typical conditions for the Active Current shown on the front data sheet page are average values at 25°C
(room temperature), and VDD = 5V for SF devices. Not 100% tested.
2. Values are for 70 ns conditions. See the Multi-Purpose Flash Power Rating application note for further information.
TABLE 6: Recommended System Power-up Timings
Symbol
TPU-READ
Parameter
1
TPU-WRITE1
Minimum
Units
Power-up to Read Operation
100
µs
Power-up to Program/Erase Operation
100
µs
T6.1 1147
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 7: Capacitance (Ta = 25°C, f=1 Mhz, other pins open)
Parameter
Description
Test Condition
Maximum
CI/O1
I/O Pin Capacitance
VI/O = 0V
12 pF
Input Capacitance
VIN = 0V
6 pF
CIN
1
T7.0 1147
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 8: Reliability Characteristics
Symbol
NEND
1,2
Parameter
Minimum Specification
Units
Endurance
10,000
Cycles
JEDEC Standard A117
100
Years
JEDEC Standard A103
100 + IDD
mA
JEDEC Standard 78
TDR1
Data Retention
ILTH1
Latch Up
Test Method
T8.2 1147
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
2. NEND endurance rating is qualified as a 10,000 cycle minimum for the whole device. A sector- or block-level rating would result in a
higher minimum specification.
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
AC CHARACTERISTICS
TABLE 9: Read Cycle Timing Parameters VDD = 4.5-5.5V
SST39SF010A/020A/040-55
Symbol
Parameter
Min
55
Max
SST39SF010A/020A/040-70
Min
Max
Units
TRC
Read Cycle Time
TCE
Chip Enable Access Time
55
70
ns
TAA
Address Access Time
55
70
ns
TOE
Output Enable Access Time
30
35
ns
TCLZ1
TOLZ1
TCHZ1
TOHZ1
TOH1
CE# Low to Active Output
0
0
ns
OE# Low to Active Output
0
0
ns
70
ns
CE# High to High-Z Output
15
25
ns
OE# High to High-Z Output
15
25
ns
Output Hold from Address Change
0
0
ns
T9.4 1147
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 10: Program/Erase Cycle Timing Parameters
Symbol
Parameter
Min
Max
Units
TBP
Byte-Program Time
TAS
Address Setup Time
0
TAH
Address Hold Time
30
ns
TCS
WE# and CE# Setup Time
0
ns
TCH
WE# and CE# Hold Time
0
ns
TOES
OE# High Setup Time
0
ns
TOEH
OE# High Hold Time
10
ns
TCP
CE# Pulse Width
40
ns
TWP
WE# Pulse Width
40
ns
TWPH1
WE# Pulse Width High
30
ns
TCPH1
CE# Pulse Width High
30
ns
TDS
Data Setup Time
40
ns
TDH1
Data Hold Time
0
TIDA1
Software ID Access and Exit Time
TSE
Sector-Erase
25
ms
TSCE
Chip-Erase
100
ms
20
µs
ns
ns
150
ns
T10.1 1147
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TRC
TAA
ADDRESS AMS-0
TCE
CE#
TOE
OE#
TOHZ
TOLZ
VIH
WE#
TOH
TCLZ
DQ7-0
HIGH-Z
TCHZ
DATA VALID
HIGH-Z
DATA VALID
1147 F03.1
Note: AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 5: Read Cycle Timing Diagram
INTERNAL PROGRAM OPERATION STARTS
TBP
5555
ADDRESS AMS-0
2AAA
5555
ADDR
TAH
TDH
TWP
WE#
TAS
TDS
TWPH
OE#
TCH
CE#
TCS
DQ7-0
AA
55
A0
DATA
SW0
SW1
SW2
BYTE
(ADDR/DATA)
1147 F04.1
Note: AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 6: WE# Controlled Program Cycle Timing Diagram
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
INTERNAL PROGRAM OPERATION STARTS
TBP
5555
TAH
ADDRESS AMS-0
2AAA
5555
ADDR
TDH
TCP
CE#
TDS
TCPH
TAS
OE#
TCH
WE#
TCS
DQ7-0
AA
SW0
55
A0
SW1
SW2
DATA
BYTE
(ADDR/DATA)
1147 F05.1
Note: AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 7: CE# Controlled Program Cycle Timing Diagram
ADDRESS AMS-0
TCE
CE#
TOES
TOEH
OE#
TOE
WE#
DQ7
D
D#
D#
D
1147 F06.1
Note: AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 8: Data# Polling Timing Diagram
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
ADDRESS AMS-0
TCE
CE#
TOEH
TOES
TOE
OE#
WE#
DQ6
Note
TWO READ CYCLES
WITH SAME OUTPUTS
Note: Toggle bit output is always high first.
AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
1147 F07.1
FIGURE 9: Toggle Bit Timing Diagram
TSE
SIX-BYTE CODE FOR SECTOR-ERASE
5555
ADDRESS AMS-0
2AAA
5555
5555
2AAA
SAX
CE#
OE#
TWP
WE#
DQ7-0
AA
55
80
AA
55
30
SW0
SW1
SW2
SW3
SW4
SW5
1147 F08.1
Note: This device also supports CE# controlled Sector-Erase operation. The WE# and CE# signals are
interchageable as long as minimum timings are met. (See Table 10)
SAX = Sector Address
AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 10: WE# Controlled Sector-Erase Timing Diagram
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TSCE
SIX-BYTE CODE FOR CHIP-ERASE
5555
ADDRESS AMS-0
2AAA
5555
5555
2AAA
5555
CE#
OE#
TWP
WE#
AA
DQ7-0
SW0
55
80
AA
55
10
SW1
SW2
SW3
SW4
SW5
1147 F17.1
Note: This device also supports CE# controlled Chip-Erase operation. The WE# and CE# signals are
interchageable as long as minimum timings are met. (See Table 10)
SAX = Sector Address
AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
FIGURE 11: WE# Controlled Chip-Erase Timing Diagram
Three-byte Sequence for
Software ID Entry
ADDRESS A14-0
5555
2AAA
5555
0000
0001
CE#
OE#
TIDA
TWP
WE#
TWPH
DQ7-0
AA
55
SW0
SW1
TAA
90
BF
Device ID
SW2
1147 F09.2
Device ID = B5H for SST39SF010A, B6H for SST39SF020A, and B7H for SST39SF040
FIGURE 12: Software ID Entry and Read
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
THREE-BYTE SEQUENCE FOR
SOFTWARE ID EXIT AND RESET
ADDRESS A14-0
5555
DQ7-0
2AAA
AA
5555
55
F0
TIDA
CE#
OE#
TWP
WE#
TWHP
SW0
SW1
SW2
1147 F10.0
FIGURE 13: Software ID Exit and Reset
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
VIHT
INPUT
VIT
REFERENCE POINTS
VOT
OUTPUT
VILT
1147 F11.1
AC test inputs are driven at VIHT (3.0V) for a logic “1” and VILT (0V) for a logic “0”. Measurement reference points for inputs
and outputs are VIT (1.5V) and VOT (1.5V). Input rise and fall times (10% ↔ 90%) are <5 ns.
Note: VIT - VINPUT Test
VOT - VOUTPUT Test
VIHT - VINPUT HIGH Test
VILT - VINPUT LOW Test
FIGURE 14: AC Input/Output Reference Waveforms
VDD
TO TESTER
RL HIGH
TO DUT
RL LOW
CL
1147 F12.0
FIGURE 15: A Test Load Example
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Start
Load data: AAH
Address: 5555H
Load data: 55H
Address: 2AAAH
Load data: A0H
Address: 5555H
Load Byte
Address/Byte
Data
Wait for end of
Program (TBP,
Data# Polling
bit, or Toggle bit
operation)
Program
Completed
1147 F13.1
FIGURE 16: Byte-Program Algorithm
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Internal Timer
Toggle Bit
Data# Polling
Byte
Program/Erase
Initiated
Byte
Program/Erase
Initiated
Byte
Program/Erase
Initiated
Read byte
Read DQ7
Wait TBP,
TSCE, or TSE
Read same
byte
Program/Erase
Completed
No
Is DQ7 =
true data?
Yes
No
Does DQ6
match?
Program/Erase
Completed
Yes
Program/Erase
Completed
1147 F14.0
FIGURE 17: Wait Options
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Software Product ID Entry
Command Sequence
Software Product ID Exit &
Reset Command Sequence
Load data: AAH
Address: 5555H
Load data: AAH
Address: 5555H
Load data: F0H
Address: XXH
Load data: 55H
Address: 2AAAH
Load data: 55H
Address: 2AAAH
Wait TIDA
Load data: 90H
Address: 5555H
Load data: F0H
Address: 5555H
Return to normal
operation
Wait TIDA
Wait TIDA
Read Software ID
Return to normal
operation
1147 F15.1
FIGURE 18: Software Product Command Flowcharts
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Chip-Erase
Command Sequence
Sector-Erase
Command Sequence
Load data: AAH
Address: 5555H
Load data: AAH
Address: 5555H
Load data: 55H
Address: 2AAAH
Load data: 55H
Address: 2AAAH
Load data: 80H
Address: 5555H
Load data: 80H
Address: 5555H
Load data: AAH
Address: 5555H
Load data: AAH
Address: 5555H
Load data: 55H
Address: 2AAAH
Load data: 55H
Address: 2AAAH
Load data: 10H
Address: 5555H
Load data: 30H
Address: SAX
Wait TSCE
Wait TSE
Chip erased
to FFH
Sector erased
to FFH
1147 F16.1
FIGURE 19: Erase Command Sequence
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
PRODUCT ORDERING INFORMATION
SST
39
XX
SF 010A
XX XXXX
-
70
XX
-
4C
XX
NH
- XXX
E
X
Environmental Attribute
E = non-Pb
Package Modifier
H = 32 pins or leads
Package Type
N = PLCC
P = PDIP
W = TSOP (type 1, die up, 8mm x 14mm)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
55 = 55 ns
70 = 70 ns
Version
A = Special Feature Version
Device Density
040 = 4 Mbit
020 = 2 Mbit
010 = 1 Mbit
Voltage
S = 4.5-5.5V
Product Series
39 = Multi-Purpose Flash
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
Valid combinations for SST39SF010A
SST39SF010A-55-4C-NHE
SST39SF010A-55-4C-WHE
SST39SF010A-70-4C-NHE
SST39SF010A-70-4C-WHE
SST39SF010A-55-4I-NHE
SST39SF010A-55-4I-WHE
SST39SF010A-70-4I-NHE
SST39SF010A-70-4I-WHE
SST39SF010A-70-4C-PHE
Valid combinations for SST39SF020A
SST39SF020A-55-4C-NHE
SST39SF020A-55-4C-WHE
SST39SF020A-70-4C-NHE
SST39SF020A-70-4C-WHE
SST39SF020A-55-4I-NHE
SST39SF020A-55-5I-WHE
SST39SF020A-70-4I-NHE
SST39SF020A-70-4I-WHE
SST39SF020A-70-4C-PHE
Valid combinations for SST39SF040
SST39SF040-55-4C-NHE
SST39SF040-55-4C-WHE
SST39SF040-70-4C-NHE
SST39SF040-70-4C-WHE
SST39SF040-55-4I-NHE
SST39SF040-55-4I-WHE
SST39SF040-70-4I-NHE
SST39SF040-70-4I-WHE
SST39SF040-70-4C-PHE
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales
representative to confirm availability of valid combinations and to determine availability of new combinations.
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
PACKAGING DIAGRAMS
TOP VIEW
Optional
Pin #1
Identifier .048
.042
SIDE VIEW
.495
.485
.453
.447
2
1
32
.112
.106
.020 R.
MAX.
.029 x 30˚
.023
.040 R.
.030
.042
.048
.595 .553
.585 .547
BOTTOM VIEW
.021
.013
.400 .530
BSC .490
.032
.026
.050
BSC
.015 Min.
.095
.075
.050
BSC
.140
.125
.032
.026
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32-plcc-NH-3
FIGURE 20: 32-lead Plastic Lead Chip Carrier (PLCC)
SST Package Code: NH
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
1.05
0.95
Pin # 1 Identifier
0.50
BSC
8.10
7.90
0.27
0.17
0.15
0.05
12.50
12.30
DETAIL
1.20
max.
0.70
0.50
14.20
13.80
0˚- 5˚
0.70
0.50
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
1mm
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
32-tsop-WH-7
FIGURE 21: 32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
SST Package Code: WH
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
32
CL
Pin #1 Identifier
1
1.655
1.645
.075
.065
7˚
4 PLCS.
Base
Plane
Seating
Plane
.625
.600
.550
.530
.200
.170
.050
.015
.080
.070
.065
.045
.022
.016
.100 BSC
.150
.120
0˚
15˚
.012
.008
.600 BSC
Note: 1. Complies with JEDEC publication 95 MO-015 AP dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
32-pdip-PH-3
FIGURE 22: 32-pin Plastic Dual In-line Pins (PDIP)
SST Package Code: PH
©2010 Silicon Storage Technology, Inc.
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 11: Revision History
Number
Description
2002 Data Book
Date
02
•
03
•
04
•
•
Document status changed from “Preliminary Specification” to “Data Sheet”
Changed IDD Program and Erase max values from 25 to 35 in Table 5 on page 8
Oct 2003
05
•
•
2004 Data Book
Added non-Pb MPNs and removed footnote (See page 21)
Nov 2003
06
•
Corrected Revision History for Version 04:
IDD max value was incorrectly stated as 30 mA instead of 35 mA
Aug 2004
07
•
Removed leaded parts from valid combinations. See PSN-D0PB0001
Mar 2009
08
•
Changed endurance from 10,000 to 100,000 in Product Description, page 1
Sep 2009
09
•
•
End of Life for all 45 ns valid combinations. See S71147(02).
Added replacement 55 ns valid combinations
Jan 2010
May 2002
Changes to Table 5 on page 8
– Added footnote for MPF power usage and Typical conditions
– Clarified the Test Conditions for Power Supply Current and Read parameters
– Clarified IDD Write to be Program and Erase
Mar 2003
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2010 Silicon Storage Technology, Inc.
S71147-09-000
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01/10
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