TB2926HQ × 4-ch BTL Audio Power IC 45 W

TB2926HQ × 4-ch BTL Audio Power IC 45 W
TB2926HQ
TOSHIBA Bi-CMOS Linear Integrated Circuit
Silicon Monolithic
TB2926HQ
45 W × 4-ch BTL Audio Power IC
The TB2926HQ is a four-channel BTL power amplifier for car
audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (POUT MAX) of 45 W.
It includes a standby switch, mute function and various
protection features.
Features
•
High output power
•
POUT MAX (1) = 45 W (typ.)
(VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 Ω)
•
POUT MAX (2) = 43 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 Ω)
•
POUT (1) = 26 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
•
POUT (2) = 23 W (typ.)
(VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
Weight: 7.7 g (typ.)
•
Low THD: 0.007% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
•
Low noise: VNO = 60 µVrms (typ.)
(VCC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)
•
Standby switch (pin 4)
•
Mute function (pin 22)
•
Output DC offset detection (pin 25)
•
Various protection features
Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting
•
Operating supply voltage: VCC (opr) = 8.0 to 18 V (RL = 4 Ω)
Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed.
Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It
is not guaranteed that they will prevent the IC from being damaged.
Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features,
resulting in an IC damage due to output short-circuits.
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TB2926HQ
C1
11
10
1
6
20
Ripple
TAB
VCC2
VCC1
IN1
9
8
C3
C2
C5
Block Diagram
+B
Out1 (+)
PW-GND1
RL
Out1 (−)
7
C1
12
IN2
5
2
13 Pre-GND
C1
15
3
IN3
17
Out2 (+)
PW-GND2
RL
Out2 (−)
Out3 (+)
PW-GND3
C6
C1
18
16 AC-GND
14
19
IN4
21
24
5V
Play
23
Out4 (+)
PW-GND4
RL
Out4 (−)
22 Mute
C4
Mute
4 Stby
R1
RL
Out3 (−)
Offset/short
25
Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.
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Detailed Description
1. Standby Switch (pin 4)
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is
set at about 3 VBE (typ.). The power supply
current is about 0.01 µA (typ.) in the standby
state.
VCC
ON
Power
4
10 kΩ
≈ 2 VBE
OFF
to Bias
filter network
Standby Control Voltage (VSB): Pin 4
Standby
Power
VSB (V)
ON
OFF
0 to 0.9
OFF
ON
2.9 to VCC
Figure 1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.
Benefits of the Standby Switch
(1)
VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.
(2)
Since the control current is minuscule, a low-current-rated switching relay can be used.
Relay
High-current-rated switch
Battery
VCC
Battery
From
microcontroller
VCC
– Conventional Method –
Low-current-rated switch
Battery
Standby
From microcontroller
Battery
Standby
VCC
VCC
– Using the Standby Switch –
Figure 2 Standby Switch
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2. Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 4 and 5.)
The value of the external pull-up resistor is determined, based on pop noise value.
For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V/5 V × 47 kΩ = 31 kΩ
ATT – VMUTE
20
VCC = 13.2 V
f = 1 kHz
RL = 4 Ω
VO = 20dBm
−20 BW = 400 Hz to 30 kHz
Mute attenuation ATT
(dB)
0
5V
R1
22
C4
1 kΩ
Mute On/Off
control
−40
−60
−80
−100
−120
0
0.5
1
1.5
2
2.5
Pin 22 control voltage: VMUTE
3
(V)
Figure 4 Mute Attenuation − VMUTE (V)
Figure 3 Mute Function
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TB2926HQ
3. DC Offset Detection
The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs,
produced by the input capacitor due to leakage current or short-circuit.
Positive DC offset (+)
(caused by RS1)
V
VCC/2 (normal DC voltage)
Leakage current
or short-circuit
Vref
Negative DC offset (−)
(caused by RS2)
+
RS1
Vref/2
RS2
Elec. vol
Vbias
5V
−
25
LPF
A
To a microcontroller
B
The microcontroller shuts down the
system if the output is lower than
the specified voltage.
Figure 5 DC Offset Detection Mechanism
OUT(-)
Amp output
VCC/2
Offset detection
threshold voltage
OUT(+)
GND
Time
Voltage at (A)
(pin 25)
GND
Time
Voltage at (B)
(LPF output)
GND
Time
RS2
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TB2926HQ
4. Layer Short Detection
The TB2926HQ may be properly connected to a load such as a 4-Ω speaker, but one of the speaker lines may
be shorted to ground through a low-impedance path. The TB2926HQ can detect such a condition.
VCC
out
IC
SP = 4 Ω
out
GND
The negative (−) speaker connection is shorted to ground
through a low-impedance path due to some irregularities.
Figure 6 Layer Short
As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the
speaker lines as shown above. The detection impedance is 4.5 Ω (typ.).
This feature allows detection of a short-circuit through a low-impedance path other than the speaker
impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system
reliability.
Detection impedance vs junction temperature
Detection impedance (Ω)
12
Test conditions
Vcc = 13.2 V
Internal resistor
= 200 Ω
5 V-10 kΩ
Pull-up
10
8
6
4
2
0
-50
0
50
100
150
200
Tj (℃)
Figure 7 Typical Detection Impedance vs Junction Temperature (Intended as a Guide)
Note 3: The detection impedance varies with temperature, as shown above. Experiment with actual hardware.
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5. Prevention of speaker damage (in case of a layer short-circuit of the speaker)
When the DC resistance between the OUT+ and OUT− pins falls below 1 Ω, the output current exceeds 4 A.
At this time, the protection circuit is activated to limit the current draw into the speaker.
This feature prevents the speaker from being damaged, as follows:
< Speaker damaging scenario >
A DC current of over 4 V is applied to the speaker due to an external circuit failure (Note 4).
(Abnormal DC output offset)
↓
The speaker impedance becomes 1 Ω or less due to a layer short.
↓
A current of over 4 A flows into the speaker, damaging the speaker.
Current into the speaker
The short-circuit protection is activated
Less than 4 A
Speaker Impedance
About 1 Ω
4Ω
Figure 8
Note 4: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage
current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines.
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6. Pop Noise Suppression
Since the TB2926HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all
amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4.
Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of
unbalanced DC currents.
To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1
and C6. Note, however, that C2 also affects the time required from power-on to audio output.
The pop noise generated by the muting and unmuting of the audio output varies with the time constant of
C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is
applied to C4 to when the mute function is enabled.
7. External Component Constants
Effects
Component
Recommended
Value
C1
0.22 µF
To eliminate DC
Cut-off frequency is
increased.
Cut-off frequency is reduced.
C2
47 µF
To reduce ripple
Powering on/off is faster.
Powering on/off is slower.
C3
0.1 µF
To provide
sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
C4
1 µF
To reduce pop
noise
High pop noise. Duration until Low pop noise. Duration until
mute function is turned on/off mute function is turned on/off
is short.
is long.
C5
3900 µF
Ripple filter
Power supply humming and ripple filtering.
C6
1 µF
Purpose
Common
reference voltage
for all input
When lower than
recommended value
When higher than
recommended value
Pop noise is suppressed when C1: C6 = 1:4.
8
Notes
Pop noise is
generated
when VCC is
turned on.
Pop noise is
generated
when VCC is
turned on.
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TB2926HQ
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VCC (surge)
50
V
DC supply voltage
VCC (DC)
25
V
Operating supply voltage
VCC (opr)
18
V
Peak supply voltage (0.2 s)
Output current (peak)
IO (peak)
Power dissipation
PD (Note 7)
9
A
125
W
Operating temperature
Topr
−40 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 5: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified)
Characteristics
Symbol
Test
Circuit
ICCQ

POUT MAX (1)
Min
Typ.
Max
Unit
VIN = 0

160
320
mA

VCC = 15.2 V, max POWER

45

POUT MAX (2)

VCC = 14.4 V, max POWER

43

POUT MAX (3)

VCC = 13.7 V, max POWER

39

POUT (1)

VCC = 14.4 V, THD = 10%

26

POUT (2)

THD = 10%
21
23

THD

POUT = 5 W

0.007
0.07
%
GV

VOUT = 0.775 Vrms
25
26
27
dB
∆GV

VOUT = 0.775 Vrms
−1.0
0
1.0
dB
VNO (1)

Rg = 0 Ω, DIN45405

60

VNO (2)

Rg = 0 Ω,
BW = 20 Hz to 20 kHz

60
70
Ripple rejection ratio
R.R.

frip = 100 Hz, Rg = 620 Ω
Vrip = 0.775 Vrms
50
65

dB
Crosstalk
C.T.

Rg = 620 Ω
POUT = 4 W

80

dB
VOFFSET


−90
0
90
mV
Input resistance
RIN



90

kΩ
Standby current
ISB

Standby condition, V4=0,V22=0

0.01
1
µA
VSB H

POWER: ON
2.9

VCC
VSB L

POWER: OFF
0

0.9
VM H

MUTE: OFF
2.9

6.0
VM L

MUTE: ON, R1 = 47 kΩ
0

0.9
Quiescent supply current
Output power
Total harmonic distortion
Voltage gain
Channel-to-channel voltage gain
Output noise voltage
Output offset voltage
Standby control voltage
Mute control voltage
Test Condition
9
W
µVrms
V
V
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TB2926HQ
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
ATT M

MUTE: ON、DIN_AUDIO
VOUT = 7.75 Vrms → Mute: OFF
85
100

dB
Fth

GV = 26dB, −3dB

250

kHz
Voff-set

Rpull-up = 10 kΩ, +V = 5.0 V
Out(+)-Out(-)
±1.0
±1.5
±2.0
V
R half-short

Rpull-up = 10 kΩ, +V = 5.0 V
channel (+) or (−) shorted to
GND, when between Rs
impedance output to GND.
2.0
4.5

Ω
P25-Sat

Rpull-up = 10 kΩ, +V = 5.0 V
(pin 25 = low)

100
500
V
Characteristics
Mute attenuation
Upper cut-off frequency
DC offset threshold voltage
Layer short detection impedance
Pin 25 saturation voltage
(at each detector ON condition)
1
TAB
6
VCC2
20
VCC1
C1: 0.22 µF IN1
11
9
8
C3: 0.1 µF
10
Ripple
C5:
3900 µF
C2: 47 µF
Test Circuit
+B
Out1 (+)
PW-GND1
RL = 4 ohm
Out1 (−)
7
C1: 0.22 µF IN2
12
5
2
13 Pre-GND
3
C1: 0.22 µF IN3
15
17
Out2 (+)
PW-GND2
RL = 4 ohm
Out2 (−)
Out3 (+)
PW-GND3
C6: 1 µF
Out3 (−)
16 AC-GND
19
C1: 0.22 µF IN4
14
21
24
5V
Play
C4: 1 µF
Mute
4 Stby
R1: 47 kΩ
RL = 4 ohm
18
23
Out4 (+)
PW-GND4
RL = 4 ohm
Out4 (−)
22 Mute
Offset/short
25
Components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.
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TB2926HQ
THD – POUT (ch1)
100
THD – POUT (ch2)
100
VCC = 13.2 V
RL = 4 Ω
50
RL = 4 Ω
30
Filter
30
Filter
100 Hz : to 30 kHz
5
1kHz
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
10
10 kHz : 400 Hz to
20 kHz : 400 Hz to
5
Total harmonic distortion THD (%)
10
Total harmonic distortion THD (%)
VCC = 13.2 V
50
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1 kHz
1 kHz
0.01
0.005
1kHz
0.01
f = 100 Hz
0.005
0.003
f = 100 Hz
0.003
0.001
0.1
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
0.3 0.5
(W)
VCC = 13.2 V
50
RL = 4 Ω
30
Filter
30
Filter
100 Hz : to 30 kHz
10
10 kHz : 400 Hz to
20 kHz : 400 Hz to
5
3
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
30 50
100
(W)
1kHz
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
1
20 kHz
0.5
0.3
10 kHz
0.1
0.05
0.03
1 kHz
0.01
f = 100 Hz
0.005
0.003
0.001
0.1
100
3
1 kHz
0.01
0.005
POUT
30 50
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
5
10
VCC = 13.2 V
RL = 4 Ω
10
5
THD – POUT (ch4)
100
50
1kHz
3
Output power
THD – POUT (ch3)
100
1
f = 100 Hz
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
(W)
0.3 0.5
1
3
Output power
11
5
10
POUT
(W)
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TB2926HQ
THD – POUT (ch1)
THD – POUT (ch2)
100
100
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
13.2 V
Filter
400 Hz to 30 kHz
10
5
5
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
400 Hz to 30 kHz
10
3
VCC = 9 V
16 V
1
0.5
0.3
0.1
0.05
0.03
3
VCC = 9 V
0.5
0.3
0.1
0.05
0.03
0.01
0.005
0.005
0.003
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
0.3 0.5
(W)
THD – POUT (ch3)
3
5
10
POUT
30 50
100
(W)
THD – POUT (ch4)
100
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
VCC = 13.2 V
50 RL = 4 Ω
30 f = 1 kHz
13.2 V
Filter
13.2 V
Filter
400 Hz to 30 kHz
400 Hz to 30 kHz
10
10
5
5
Total harmonic distortion THD (%)
Total harmonic distortion THD (%)
1
Output power
100
3
VCC = 9 V
16 V
1
0.5
0.3
0.1
0.05
0.03
3
VCC = 9 V
0.5
0.3
0.1
0.05
0.03
0.01
0.005
0.005
0.003
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
(W)
0.3 0.5
1
3
Output power
12
16 V
1
0.01
0.001
0.1
16 V
1
0.01
0.001
0.1
13.2 V
Filter
5
10
POUT
30 50
100
(W)
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TB2926HQ
muteATT – f
THD – f
3
0
VCC = 13.2 V
RL = 4 Ω
−20
VOUT = 7.75 Vrms (20dBm)
Total harmonic distortion THD (%)
Mute attenuation muteATT (dB)
VCC = 13.2 V
−40
−60
−80
1 ch to 4 ch
−100
−120
10
100
1k
10 k
frequency f
RL = 4 Ω
1
POUT = 5 W
No filter
0.3
0.1
4 ch
0.03
0.01
0.003
2 ch
0.001
0.01
100 k
1 ch
3 ch
0.1
(Hz)
1
frequency f
GV – f
10
100
10
100
(Hz)
R.R. – f
40
0
(dB)
30
20
10
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
0
0.01
0.1
1
frequency f
10
RL = 4 Ω
Vrip = 0.775 Vrms (0dBm)
−20
R.R.
1 ch to 4 ch
Ripple rejection ratio
Voltage gain GV (dB)
VCC = 13.2 V
−40
−60
3ch
2ch
4ch
1ch
−80
0.01
100
0.1
1
frequency f
(Hz)
13
(Hz)
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VIN – POUT (ch1)
40
VIN – POUT (ch2)
40
10 kHz
20 kHz
10 kHz
100 Hz
20
Output power
Output power
20 kHz
1 kHz
30
POUT
30
(W)
1 kHz
POUT
(W)
100 Hz
10
VCC = 13.2 V
20
10
VCC = 13.2 V
RL = 4 Ω
No filter
0
0
2
4
Input voltage
6
VIN
8
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
VIN
8
(Vrms)
20 kHz
(W)
100 Hz
1 kHz
10 kHz
1 kHz
30
POUT
20
Output power
Output power
POUT
(W)
100 Hz
30
10
VCC = 13.2 V
20
10
VCC = 13.2 V
RL = 4 Ω
No filter
0
0
2
4
Input voltage
6
VIN
8
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
4
ICCQ – VCC
10
(Vrms)
PDMAX – Ta
Allowable power dissipation PDMAX (W)
(mA)
ICCQ
VIN
8
120
RL = ∞
VIN = 0 V
160
120
80
40
0
0
6
Input voltage
2000
Quiescent Current
10
VIN – POUT (ch4)
40
10 kHz
20 kHz
6
Input voltage
VIN – POUT (ch3)
40
4
5
10
Supply voltage
15
VCC
20
(1) INFINITE HEAT SINK
RθJC = 1°C/W
100
(V)
(3) NO HEAT SINK
RθJA = 39°C/W
80
(1)
60
40
20
(2)
(3)
0
0
25
(2) HEAT SINK (RθHS = 3.5°C/W
RθJC + RθHS = 4.5°C/W
25
50
75
Ambient temperature
14
100
125
150
Ta (°C)
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C.T. – f (ch1)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
(dB)
−20
C.T. – f (ch2)
0
Cross talk C.T.
Cross talk C.T.
(dB)
0
−40
CT (1-2)
CT (1-3)
−60
−20
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−40
CT (2-1)
CT (2-3)
−60
CT (1-4)
−80
10
100
1k
frequency f
10 k
CT (2-4)
−80
10
100 k
100
(Hz)
1k
frequency f
C.T. – f (ch3)
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
(dB)
−20
−40
−60
100 k
(Hz)
C.T. – f (ch4)
0
Cross talk C.T.
Cross talk C.T.
(dB)
0
10 k
CT (3-1)
−20
VCC = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−40
CT (4-1)
−60
CT (3-1)
CT (4-2)
CT (3-2)
−80
10
100
1k
frequency f
10 k
CT (4-3)
−80
10
100 k
100
(Hz)
1k
VNO – Rg
80
VCC = 13.2 V
f = 1 kHz
RL = 4 Ω
Filter:
RL = 4 Ω
4ch drive
(W)
(µVrms)
20 Hz~20 kHz
200
Power dissipation PD
Output noise voltage VNO
100 k
(Hz)
PD – POUT
300
100
1ch to 4ch
0
10
10 k
frequency f
100
1k
10 k
60
18 V
40
13.2 V
20
VCC = 9.0 V
0
0
100 k
Signal source resistance Rg (Ω)
16 V
5
10
15
Output power
15
20
POUT
25
30
(W)
2006-11-27
TB2926HQ
Package Dimensions
Weight: 7.7 g (typ.)
16
2006-11-27
TB2926HQ
• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current
can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to
not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip.
In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon
rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink
installation, refer to individual technical datasheets or IC databooks.
17
2006-11-27
TB2926HQ
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
18
2006-11-27
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