SONY CDJ-500 CD-ROM Changer Service Manual
The CDJ-500 is a CD-ROM Changer that can store and access up to 51 CD-ROM discs. It has a SCSI interface and supports CD-ROM XA (Mode2 Form1 and Mode2 Form2), CD-EXTRA (Single and multiple session), and Photo CD (Single and multiple session) formats. It is compatible with both CD-R and CD-RW discs.
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SERVICE MANUAL
CDJ-500
US Model
Canadian Model
Model Name Using Similar Mechanism
CD Mechanism Type
Base Unit Type
Optical Pick-up Type
NEW
CDM-56
BU-24
SPU3212
SPECIFICATIONS
CD-ROM CHANGER
MICROFILM
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these instruments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)
To Exposed Metal
Parts on Set
0.15
µ
F
1.5k
Ω
Earth Ground
AC voltmeter
(0.75V)
Fig. A. Using an AC voltmeter to check AC leakage.
2
TABLE OF CONTENTS
1. SERVICE NOTE
................................................................ 4
2. GENERAL
......................................................................... 29
3. DISASSEMBLY
3-1. Front Panel ......................................................................... 30
3-2. Illumination Assy ................................................................ 31
3-3. CD Mechanism Deck .......................................................... 31
3-4. Base Unit and Magnet Holder ............................................. 32
3-5. CD Mechanism Section ...................................................... 33
4. MECHANICAL ADJUSTMENTS
4-1. Disc Holder a Adjustment/Chucking Pulley
Position Adjustment ............................................................ 34
4-2. Disc Sensor Adjustment ...................................................... 36
5. ELECTRICAL ADJUSTMENTS
5-1. Tools and Measuring Instruments ....................................... 37
5-2. Trouble Shooting ................................................................. 40
6. THEORY OF OPERATION
........................................... 52
7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 53
7-2. Block Diagrams
• CD-ROM Drive (1/2) Section ........................................... 54
• CD-ROM Drive (2/2) Section ........................................... 55
• Main Section ..................................................................... 56
• Power Supply Section ....................................................... 57
7-3. Printed Wiring Board – CD-ROM Drive Section – ............ 58
7-4. Printed Wiring Board – CD-ROM Drive Section – ............. 59
7-5. Schematic Diagram – CD-ROM Drive (1/6) Section – ...... 60
7-6. Schematic Diagram – CD-ROM Drive (2/6) Section – ...... 61
7-7. Schematic Diagram – CD-ROM Drive (3/6) Section – ...... 62
7-8. Schematic Diagram – CD-ROM Drive (4/6) Section – ...... 63
7-9. Schematic Diagram – CD-ROM Drive (5/6) Section – ...... 64
7-10. Schematic Diagram – CD-ROM Drive (6/6) Section – ..... 65
7-11. Schematic Diagram – Main Section – ............................... 66
7-12. Printed Wiring Board – Main Section – ............................ 67
7-13. Schematic Diagram – Panel Section – .............................. 68
7-14. Printed Wiring Board – Panel Section – ............................ 69
7-15. Schematic Diagram – Sensor Section – ............................ 70
7-16. Printed Wiring Board – Sensor Section – ......................... 71
7-17. Schematic Diagram – SCSI Section – ............................... 72
7-18. Printed Wiring Board – SCSI Section – ............................ 73
7-19. Schematic Diagram – Power Section – ............................. 74
7-20. Printed Wiring Board – Power Section – .......................... 75
7-21. IC Block Diagrams ............................................................ 76
7-22. IC Pin Functions ................................................................ 83
8. EXPLODED VIEWS
8-1. Case Section ........................................................................ 90
8-2. Front Panel Section ............................................................. 91
8-3. Chassis Section ................................................................... 92
8-4. Mechanism Deck Section-1 (CDM-56) .............................. 93
8-5. Mechanism Deck Section-2 (CDM-56) .............................. 94
8-6. Base Unit Section ................................................................ 95
9. ELECTRICAL PARTS LIST
........................................ 96
3
SECTION 1
SERVICE NOTE
LOADING IN/OUT AGING
Loading in and loading out are repeatedly carried out in this aging mode.
Operations are stopped when an error occurs. (When loading in or loading out took more than 6 seconds.)
Procedure:
1. Set the DIP switches on the back panel as shown below.
TOTAL AGING
This mode is used for executing loading in and loading out of discs in any slits sequentially.
Operations are stopped when an error occurs.
Procedure:
1. Set the DIP switches on the back panel as shown below.
SCSI TERM
MODE
ID SELECT
SCSI TERM
MODE
ID SELECT
ON
DRIVE
4 2 1 4 2 1
OFF
CHANGER
ON
Remove the shield.
ON
DRIVE
4 2 1 4 2 1
CHANGER
ON
Remove the shield.
2. While pressing the OPEN button, DISC SKIP – button, and
DISC SKIP + button simultaneously, press the
U button to turn ON the power. When the CHANGER indicator starts to blink, release the OPEN , DISC SKIP – and DISC SKIP + buttons.
3. The front door opens automatically. Set one disc in any slot.
4. Close the front door.
5. Loading in and loading out of the disc are repeated.
6. To end, press the
U button to turn OFF the power.
DISC TABLE AGING
* This mode is used for operating the disc table randomly.
Operations will continue unless an error occur.
Procedure:
1. Set the DIP switches on the back panel as shown below.
2. While pressing the OPEN button, DISC SKIP – button, and
DISC SKIP + button simultaneously, press the
U button to turn ON the power. When the CHANGER indicator starts to blink, release the OPEN , DISC SKIP – and DISC SKIP + buttons.
3. The front door opens automatically. Set discs in any slot.
4. Close the front door to start aging.
5. During aging, operations are repeated in the order of “rotation of disc table” n ”loading in” n ”disc access” n ”loading out” n ”rotation of disc table”.
6. To end aging, press the OPEN button .
SCSI TERM
MODE
ID SELECT
ON
DRIVE
4 2 1 4 2 1
ON
CHANGER
OFF Remove the shield.
2. While pressing the OPEN button, DISC SKIP – button, and
DISC SKIP + button simultaneously, press the
U button to turn ON the power. When the CHANGER indicator starts to blink, release the OPEN , DISC SKIP – and DISC SKIP + buttons.
3. The front door opens automatically.
4. Close the front door to start aging.
5. To end aging, press the OPEN button.
4
CHECKING OPERATIONS USING THE FIELD50.EXE
PROGRAM
• When this program is executed, the operations of each part are checked so that faulty parts can be investigated during repairs.
It is recommended that this program is executed before returning the unit to the customer after completing repairs and that all test items are checked that they are satisfactory.
An instruction manual in PDF file format describing the details is provided with the program file. Refer to this manual for further details.
Preparations:
• IBM PC compatible Personal computer and display:
Use a personal computer with an HDD
• OS;
MS-DOS or PC-DOS version 5.0 or later.
• Floppy disk with latest “FIELD50.EXE” software (Includes the instruction manual (FIELD50.PDF)) (CDJ-001:J-2501-172-A)
• SCSI board;
The “Adaptec AVA-2904E” provided with the unit is recommended. If this is not available, use an equivalent.
• Setting the ASPI manager
Install the “ASPI manager” suitable for the SCSI board, and rewrite the “CONFIG. SYS” file. (Refer to the following procedure.)
ASPI managers (In the case of Adaptec products)
SCSI Board
AVA-2904E
AHA-1510B
AHA-1542CF
AHA-2940AU
ASPI Manager
Aspi8dos. sys
Aspi2dos. sys
Aspi4dos. sys
Aspi8dos. sys
• General CD-ROM
• SONY test disc (TGRS-21: Green disc) (J-2501-110-A)
• SCSI cable
• Speakers with amplifier or equivalent. (Use only when checking the AUDIO output)
Installing the “FIELD50.EXE”:
1. Create the directory “CDJC50S” in the C drive of the PC used, and copy the “FIELD50.EXE” file there.
2. Create another directory “DATA” in the directory created in step
1.
Installing the “ASPI manager”:
1. Create the desired directory in the C drive. The “EZSCSI” directory is explained here as an example.
2. Copy the file of the ASPI manager corresponding to the directory created in step 1. The “ASPI8DOS.SYS” file is explained here as an example.
File copied at item 2.
Directory created at item 1.
3. Edit the “CONFIG.SYS” file and add the device so that the file copied at 2 is referred to.
Add the /D switch
File copied at item 2.
Directory created at item 1.
Note:
ASPI manager version
Operations of the “FIELD50.EXE” program are guaranteed when the following ASPI manager version is used. Operations using other
ASPI managers are not guaranteed.
ASPI manager
Aspi2dos. sys
Aspi4dos. sys
Aspi8dos. sys
3.661J
3.34
1.26
Usable Version
3.68
3.68s
3.35
1.32
3.36s
1.32s
-------
3.36s
1.32s
5
Connection
Connected to
SCSI connector of the PC
IN
SCSI
OUT
ANALOG-OUT
DIGITAL-OUT
SCSI TERM
MODE
ID SELECT
DRIVE
4 2 1 4 2 1
CHANGER
SCSI cable (Accessory) SCSI IN
Connected to active speaker, etc.
(only when checking the audio output)
Fig. Connection of equipment
Setting
• DIP switch settings
1 Set SCSI TERM to “ON”, and do not
connect other SCSI equipment as much
as possible.
2 Set MODE to “ON”.
ON: Normal mode. Control the changer
using the PC.
OFF: Manual mode. Control the changer
manually using buttons.
3 Setting of SCSI ID of the drive
Set a desired ID number except 7.
Be careful not to use an ID number
already in use for the changer.
SCSI TERM
MODE
ID SELECT
DRIVE
4 2 1 4 2 1
CHANGER
4 Setting of SCSI ID of the changer
Set a desired ID number except 7.
Be careful not to use an ID number
already in use for the drive.
Fig. DIP Switch Setting
6
Operating procedure:
Note:
Operations of this program are not guaranteed when used in the
DOS prompt mode with starting up Windows.
Refer to the instruction manual of the PC used, set the DOS prompt mode, and execute the program.
1. Turn on the power of the PC and set the DOS prompt mode.
2. Change the directory to “CDJC50S”.
3. Enter “FIELD50” and press the ENTER key.”
4. If directory for storing the data is not available, enter “Y” at the following screen and press the ENTER key.
5. The following screen appears.
Default file name
(Suffix number of file name will increase automatically)
Enter a desired file name using less than 8 characters.
(If numbers are used for the suffix of the file name, these will be counted up automatically the next time.)
When only the ENTER key is pressed, the default file name will be set.
This file will be saved as the log file in the directory “DATA”.
After entering the file name, press the ENTER key.
6. If a file name already used once is specified, the following screen appears. Enter “Y” or “N” according to whether to overwrite the file, and press the ENTER key.
7
The following screen appears when the file name is not already in use.
The SCSI ID of the changer detected is displayed as the default value.
For example, as the ID of the changer is set to “6” and the ID of the drive is set to “3”, these values will be displayed.
Enter “6” for the ID of the media changer to be checked using this program, and press the ENTER key.
7. The following screen appears. Enter the serial number of the unit and press the ENTER key.
Enter the serial number of the unit.
8. The number of the slot set with a disc will be displayed. The screen asks whether the inspection is started. Enter “Y” and press the ENTER key.
Displays the slot number (s) holding a disc.
(If all slots are empty, — will be displayed.)
Enter Y.
8
9. The following screen appears. These inspection items can be excuted one by one. The following describes the example of executing all the tests. Enter “A” to execute all the inspection items and press the ENTER key.
10. The following screen appears and the front door opens automatically. Insert the general CD-ROM into the 14th slot, and close the door.
11. The following screen appears and the front door opens automatically. Insert the SONY test disc (TGRS-21: Green disc) in the 1st slot, and close the door.
Take note that if the door is closed without inserting any disc, the following screen appears and tests end.
Serial number entered
Enter “A”.
9
12. When the inspections are executed, the status will be displayed at the bottom of the screen. The results of each inspection will be displayed on the right side of the screen.
The results of the inspection will be displayed as OK or NG.
The value of the test results will be displayed.
The status of the inspection currently performed are displayed at real-time.
13. The following appears at the bottom of the screen. Check the audio signal here. During this test, analog audio signals are output from the ANALOG OUT and digital audio signals from the
DIGITAL OUT.
Check the sounds according to the instructions on the screen.
After completing preparations to check the sounds, press the space key.
14. When the following screen appears, the 1 KHz sine wave is output from the L-CH. Enter “Y” and press the ENTER key if
OK. If no sounds are produced from the L-CH or produced from
R-CH, enter “N” and press the ENTER key for negative.
After checking, enter “Y” or “N”.
10
15. The following screen appears at the bottom, and 1 KHz sine wave is out put from the R-CH. If OK, enter “Y” and press the
ENTER key. Like in step 14, enter “N” and press the ENTER key if negative.
16. The following screen appears and the results of each test are displayed.
If the test results are satisfactory, “OK” will be displayed. For details on the test results, refer to the PDF file provided with the “FIELD50.EXE” software.
After checking, enter “Y” or “N”.
To end, enter “E”, or to continue, enter the corresponding number.
17. If there is a inspection to be executed again, enter the corresponding number and press the ENTER key. To end, enter “E” and press the ENTER key.
18. The following screen appears at the bottom left of the screen.
Remove the disc and close the front door.
19. The program is completed, and the following will be displayed.
Referring to the Log File:
• The results executing “FIELD50.EXE” are stored as the log file.
This file is the file name entered at step 5. To see this file on the screen, enter the following:
11
• If no problems occurred, the following will be displayed.
File name entered at step 5.
SCSI bus device
Structure of this unit detected on the SCSI bus
Serial number entered at step 7.
Slot number (s) holding a disc.
Test results
12
• When an error has occurred, the following is displayed inspection results
Displayed when
SCSI errors occur
For details of the error codes displayed here, refer to the PDF file of the instruction manual provided with the “FIELD50.EXE” program.
13
TROUBLE SHOOTING FLOW
START
POWER ON?
POWER LED lights green
EXECUTE FIELD50.EXE
POWER FAILURE
DETECT as SCSI DEVICE?
CDU-625&CDJ-C50S/500 are recognized as unique SCSI ID respectively.
SCSI FAILURE
HARDWARE ERROR
CAUTION on SCREEN?
CHANGER LED FLASHING?
INSERT DISC?
General CD-ROM disc into SLOT 14
Green disc into SLOT 1
KEY FAILURE
MEDIA MAPPING OK?
Confirm the identification between real location and media mapping
DISC SENSOR FAILURE
START
INSPECTION
NO.1to6
Select "A" on menu screen and start
14
START
INSPECTION
NO.1to6
NO.1 OK ?
NO.2 OK ?
NO.3 to 5 OK ?
NO.6 OK ?
END
SCSI INTEGRITY FAILURE
GO DRIVE CHECK SECTION
CHECK MECHANICAL PARTS
AUDIO FAILURE
15
CHECK POINT
POWER FAILURE
• POWER MOUNT
• FILTER MOUNT
• POWER CORD
• POWER HARNNES
SCSI FAILURE(except CDU-625)
• MAIN MOUNT
• SCSI IN/OUT MOUNT
• D.SW MOUNT
• SCSI FFC CABLE
• HARNNES(MAIN to D.SW)
HARDWARE ERROR
Check it out according to the sense code in the caution message,
There are 6 cases, as follows.
1. Mount Error (sense code 04-53-80)
• MAIN MOUNT
• MOTOR MOUNT
• PICKER
• HARNNES(MAIN to MOTOR)
2. Un mount Error(sense code 04-53-81)
Equivalent to 1
3. Disc Sensor Error
• DISC SENSOR ADJUSTMENT
• DISC SENSOR (S/R) MOUNT
• MAIN MOUNT
• HARNNES(MAIN to DISC SENSOR(S))
4. Drive Chuck Error(04-53-83)
• MAIN MOUNT
• DRIVE UNIT
• FFC (MAIN to MAC-30)
5. Drive Unchuck Error(04-53-84)
Equivalent to 4
6. Door Motor Error(04-53-85)
• D.MOTOR MOUNT
• MAIN MOUNT
• HARNNES (MAIN to D.MOTOR)
KEY FAILURE
• KEY MOUNT
• HARNNES (MAIN to KEY)
DISC SENSOR FAILURE
• DISC SENSOR ADJUSTMENT
• DISC SENSOR (S/R) MOUNT
• MAIN MOUNT
• HARNNES(MAIN to DISC SENSOR(S))
SCSI INTEGRITY FAILURE
• CSI TERMINATOR (SCSI OUT MOUNT)
• SCSI CABLE LENGTH
CHECK MECHANICAL PARTS
• MECHANICAL MAINTENANCE and ADJUSTMENT
AUDIO FAILURE
• P.JACK MOUNT
• MAC-30 MOUNT
• AUDIO HARNNES
16
DOWNLOADING THE CHANGER PROGRAM USING
THE UPDATEF.EXE PROGRAM
• Execute this program to rewrite the program of the changer of this unit.
Preparations:
• IBM PC compatible Personal computer and display:
Use a personal computer with an HDD
• OS:
MS-DOS or PC-DOS version 5.0 or later.
• Floppy disk with latest UPDATEF.EXE software
(Includes the instruction manual (UPDATEF.PDF)) (CDJ-002:J-
2501-175-A)
• SCSI board;
The “Adaptec AVA-2904E” provided with the unit is recommended.
If this is not available, use an equivalent.
• Setting the ASPI manager;
For details, refer to “Installing the ASPI manager” on page 5.
• SCSI cable
Connection:
Connected to
SCSI connector of the PC
LINE-OUT
IN
SCSI
OUT
SCSI TERM
MODE
ID SELECT
DIGITAL-OUT
DRIVE
4 2 1 4 2 1
CHANGER
SCSI cable (Accessory) SCSI IN
Setting:
• DIP switch settings
1 Set SCSI TERM to “ON”, and do not
connect other SCSI equipment as much
as possible.
2 Set MODE to “ON”.
ON: Normal mode. Control the changer
using the PC.
OFF: Manual mode. Control the changer
manually using buttons.
3 Setting of SCSI ID of the drive Set a
desired ID number except 7.
Each SCSI ID must be set exclusively.
Fig. Connection of equipment
SCSI TERM
MODE
ID SELECT
DRIVE
4 2 1 4 2 1
CHANGER
17
Operations:
1. Create a desired directory in the C drive of the PC, and copy the
UPDATEF.EXE file and the HEX file supplied with it there (e.g.
XXXXXX.HEX).
(The following assumes that the “CDJC50S” directory is created.)
2. The download program can be executed on Windows 95/98 running. Close all applications first. The following describes the state where the DOS prompt is excuted from Windows 98. The following screen appears.
3. Enter “CD \CDJC50S” and press the ENTER key. (The following screen appears.)
4. Enter “UPDATEF” and press the ENTER key. The following screen appears.
If CDJ-500 is detected, the number corresponded to SCSI adress is displayed. Press the ENTER key to update program for this changer.
(It is not necessary to enter number.)
18
Enter the number of the changer displayed or press the ENTER key.
The changer detected and corresponding number are displayed.
5. The program searches for the HEX file for the changer stored in the directory and displays the lists. To download the latest HEX file, only press the ENTER key. (It is necessary enter number, to downlord another HEX file.)
Enter the number of the HEX file displayed or press the ENTER key.
6. As the HEX file selected is displayed, press the ENTER key.
(“Y” is entered as the default)
Detected HEX file
7. Revision 1.01 is rewritten to 1.02 and the display switches as follows. The product information is still displayd old revision.
If downloaded successfully, “Finish Verifying” is displayed.
(If failed, “Failed Downloading” or “Failed Verifying” is displayed.)
19
8. The CHANGER indicator light up when download completes successfully. To restart the updated proglam, press the
U button to turn OFF the power, and press it again to turn ON the power again.”
9. Enter “UPDATEF” and press the ENTER key. The following is displayed on the screen.
10. Check the Revision here. Check that the Revision has been rewritten to that downloaded, enter “E”, and press the ENTER key to end the program.”
Check that the Revision is the downloaded revision.
Recovering when writing failed:
• If this unit does not operate normally after writing, perform writing again using the following procedure.
1. Remove the shield with the power OFF, set the “RECOVERY”
DIP switch to OFF, press the
U button and turn ON the power.
2. Execute the “UPDATEF” and perform the writing process again using the method described earlier.
3. After writing, turn OFF the power of the unit once.
4. Set the “RECOVERY” DIP switch to ON, and press the
U button to turn ON the power.
5. Execute the “UPDATEF” using item 10 of the procedure described earlier.
Check that “Revision” has been updated.
SCSI TERM
MODE
ID SELECT
DRIVE
4 2 1 4 2 1
CHANGER
Remove the shield.
RECOVERY DIP switch (Figure shows the ON state)
20
DOWNLOADING THE DRIVE PROGRAM USING THE
DWN-ASPI.EXE PROGRAM
• Execute this program to rewrite the program of the drive of this unit.
Preparations:
• IBM PC compatible personal computer and display:
Use a personal computer with an HDD
• OS:
MS-DOS or PC-DOS version 5.0 or later.
Windows 95 or Windows 98 (When using Windows, follow the settings on Windows described later.)
• Floppy disk with the “DWN-ASP1.EXE” and “625_ XXX .HEX” software
(CDM-002:J-2501-176-A)
• Floppy disk with latest drive program (625_
XXX
.HEX) (Supplied as necessary)
• SCSI board:
Use “Adaptec AVA-2904E” provided with this unit.
If not available, use an equivalent.
• ASPI manager setting:
For details, refer to “Installing ASPI manager” on page 5.
• SCSI cable:
Connection:
Connected to
SCSI connector of the PC
IN
SCSI
OUT
LINE-OUT
SCSI TERM
MODE
ID SELECT
DIGITAL-OUT
DRIVE
4 2 1 4 2 1
CHANGER
SCSI cable (Accessory) SCSI IN
Setting:
• DIP switch settings
1 Set SCSI TERM to “ON”, and do not
connect other SCSI equipment as much
as possible.
2 Set MODE to “ON”.
ON: Normal mode. Control the changer
using the PC.
OFF: Manual mode. Control the changer
manually using buttons.
3 Setting of SCSI ID of the drive
Set a desired ID number except 7.
Each SCSI ID must be set exclusively.
Fig. Connection of equipment
SCSI TERM
MODE
ID SELECT
DRIVE
4 2 1 4 2 1
CHANGER
21
Settings on WINDOWS:
• To run this program in Windows, it must be set using the following procedure before hand.
1. Select “SYSTEM” on the “CONTROL PANEL” on Windows.
2. Display the “CD-ROM” device from “DEVICE MANAGER”, and select “SONY CD-ROM CDU625”.
(See following diagram.)
Uncheck “Sync data transfer”
Uncheck “Auto insert notification”
3. Uncheck “Sync data transfer” and “Auto insert notification” at this screen.
4. Restart and the changes made will be set.
22
Operations:
1. Create a desired directory in the C drive of the PC used, and copy the DWN-ASPI.EXE file, and HEX file provided (e.g.
625_
XXX
.HEX).
(The following assumes that the “CDJC50S” directory is created.)
2. The downloaded program can be executed on Windows 95/98.
The following describes the state where the DOS prompt is executed from Windows 98. The following screen appears.
3. Set the directory copied with the program at item 1. Enter
“CD\CDJC50S” and press the ENTER key.
4. Enter “DWN-ASPI” and press the ENTER key. The following screen appears.
(The following explains the example of rewriting the program
1.0W of the drive with 1.0Y.)
The HEX file in the directory executing the program is displayed.
23
5. Check that the HEX file copied in item 1 is present in the HEX file displayed.
6. Press any key and end the program.
7. Enter the HEX file name checked at step 6 as “DWN-ASPI
625_
XXX
” and press the ENTER key.
File name copied at item 1.
8. The following screen appears. Check that the HEX file is correct and enter “Y”.
9. The following screen appears. If the ID is correct, enter “Y”.
(When “N” is entered, the CD-ROM drive of another ID will be detected.)
The version of the program currently set.
24
10. The following screen appears. Press the ENTER key.
11. The following screen appears and files are downloaded one by one.
25
12. When downloading is finished, the following screen appears.
Newly rewritten program version
26
13. When “Complete” is displayed at all items, it means that downloading”. If “Failure” or “Verify Error!” is displayed, correct the cause and repeat the procedure again.
Note:
If downloading failed halfway through, the CD-ROM device name changes to CD ROM LOADER. Check system environment especially SCSI configration.
To download another time, select this device.
(The screen shows the following for step 10.)
14. To end, press the ESC key.
15. The POWER indicator and CHANGER indicator of the unit light up. To set the changes, press the
U button to turn OFF the power, and press it again to turn ON the power again.”
27
Note: Note on repairring the Base Unit assy.
When opening or repairing the unit, grounding is required to prevent damage caused by static electricity and is as follows:
1. Grounding for the human body
Be sure to wear a wrist-strap for grounding (with impedance lower than 10 8
Ω
) whose other end is ground. The strap works to drain away the static electricity build-up on the human body.
2. Grounding for the work table
Be sure to lay a conductive sheet (with impedance lower than
10 9
Ω
) on the table, such as a sheet of copper, which is ground.
3. As static electricity built-up on clothes does not drain away, be careful not to let your clothes touch the unit.
1
Wrist-Strap for grounding
Flexible cable
1M
Ω
Base unit assy
4. Do not apply excessive force to the lens when wiping. Optical device is structured by very sensitive mechanical parts. The lens holding mechanism may have damage if excessive force is applied.
Cotton Swab
1M
Ω
2
Conductive sheet or copper plate
BU holder assy
28
LOCATION OF PARTS AND CONTROLS
Front Panel
1
SECTION 2
GENERAL
2 3
1
u button
2
Emergency eject hole
3
OPEN button
4
POWER indicator
5
DRIVE indicator
6
CHANGER indicator
7
DISC SKIP + button
8
DISC SKIP – button
8 7 6 5 4
29
SECTION 3
DISASSEMBLY
Note:
Follow the disassembly procedure in the numerical order given.
3-1. FRONT PANEL
3
Connector
LED board: CN841
To MAIN board
4
Two screws (BVTT3x6)
5
Bracket (illumination)
(with illumination assy)
1
Screw (BVTT3x6)
2
Screw (BVTT3x6)
A
!∞
Front panel
!£
Claw
Expand the front panel in the direction of arrow
A to release catching claws.
6
Two screws
(BVTT3x6)
7
Two clamps
8
Screw
(BVTT3x6)
0
Connector
9
Beam
MAIN borad: CN601
MAIN borad: CN602
!¢
Claw
Expand the front panel in the direction of arrow
B to release catching claws.
!¡
Flat type wire
(9 core)
B
!™
Six screws (BVTT3x10)
30
3-2. ILLUMINATION ASSY
While pressing arrows
A
,
B
, and
C
, rotate the illumination assembly in arrow direction
D
and remove it.
ILLUMINATION ASSY
Note: Adhesives are given to these places.
B
A
C
D
3-3. CD MECHANISM DECK
5
Three screws
(BVTT3x10)
7
Connectotr
1
Screw
8
Flat type wire
(12 core)
(PTPWH2.6x8)
!∞
Screw
!§
Screw
(BVTT3x14)
(BVTT3x10)
2
Table (50)
3
Two screws
(+BV SUMITITE B3)
4
Ring (B2)
!¢ CD mechanism deck
6
Connector
DISC SENSOR (S) board: CN53
!£
Earth wire
9
Connectotr
0
Connectotr
!¡
Connector SW board: CN54
!¶
Connector
TABLE SENSOR board: CN52
!•
Connector
TABLE SENSOR board: CN51
!™
Connector
MOTOR board: CN61
!ª
CD mechanism base unit
31
3-4. BASE UNIT AND MAGNET HOLDER
3
Two screws
(BTP2.6x8)
5
6
7
1
Two screws
(BTP2.6x8)
2
Braket (DS) assy
4
Two screws
(PTPWH2.6x8)
8
PC board assy
Remove the torsion spring and take out the magnet holder with pulling up the claw toward you.
9
Magnet holder
0
Torsion spring (Holder)
!¢
BU holder assy
!£
Screw
(PTPWH2.6x8)
!¡
Screw P(2x4)
!™
Leaf spring (BU)
!∞
Two screws
(M) step
!§
Two screws
(M) step
!¶
Base unit
32
3-5. CD MECHANISM SECTION
NOTE:
Adjust the position of the gear as shown in the figure when attaching.
2
Cover
(Lever)
1
Screw
(BTP2.6x8)
0
Slider (Cam)
9
Slider (Lock)
8
Screw
(PTPWH M2)
3
Disc holder
(B)
7
Cam cover
!£
Slider
(Loading)
6
Screw
(BTP2.6x8)
!¡
Disc holder A2
!™
Torsion spring
(Loading)
!¢
Tension coil spring (Lever)
!∞
Loading lever Assy
4
Screw
(BTP2.6x8)
5
SW board
33
SECTION 4
MECHANICAL ADJUSTMENTS
4-1. DISC HOLDER A ADJUSTMENT/CHUCKING
PULLEY POSITION ADJUSTMENT
Proceure:
1. Remove the plate shown in figure with the power OFF. (Fig.1)
2. Remove the shield, set the DIP switches on the back panel as shown below.
Remove the screw and clamp
Remove these screws
Remove this plate
SCSI TERM
MODE
ID SELECT
PARITY
Fig. 1
OFF
DRIVE
4 2 1 4 2 1
OFF
CHANGER
OFF
Remove the shield.
3. Press the
U button to turn ON the power, and press the OPEN button to open the front door. Insert a disc in the “PLUS ONE” slit. Prease use a flat disc.
Note: If the “PLUS ONE” slit is not at the front, press the OPEN button and the “PLUS ONE” slit will come to the front automatically.
4. Close the front door. The disc table rotates and the disc is chucked.
5. Press the
U button to turn OFF the power.
6. While pressing the OPEN button, DISC SKIP – button, and
DISC SKIP + button simultaneously, press the
U button to turn ON the power. (Keep on pressing three buttons untill
CHANGER LED is flasing.)
7. Continue pressing the DISC SKIP + button until loading end.
8. Rotate the pulley with finger (Fig. 2) to stop the disc holder A2 slightly away from the disc (Fig. 3).
9. Check that disc holder A2 is not touching the disc, and adjust the adjusting screw A until the edge of the disc meets the edge of the disc holder as shown in the figure. (Fig. 4, Fig. 5)
Disc holder A2
Disc
Fig. 2
Disc holder A2
Fig. 3
Disc
Pulley
Disc holder A2
Clearance:0.1 to 0.3mm
Fig. 4
Apply screwlock
No clearance
BU holder
NOTE) No screwlock at the BU holder
Adjusting screw A
Disc
Fig. 5
Base loading
34
10. After adjusting, apply screwlock.
11. Continue pressing the DISC SKIP – button. After loading out, continue pressing the DISC SKIP + button until loading in again.
12. Check that the disc is at the position adjusted to in step 7.
13. Continue pressing the DISC SKIP + button until loading end.
14. Visually check the chucking pulley, and adjust the adjusting screw B shown in the figure so that the positional relation of the holder (magnet) and chucking pulley satisfies the specified values. (Fig. 4, Fig. 5).
A
B
Holder
15. After adjusting, apply screwlock.
16. By pressing the DISC SKIP + and DISC SKIP - button, check the loading in and out operations can be performed properly.
17. Remove the disc and press the
U button to turn OFF the power.
18. Set the DIP switch as below and attach the shield.
SCSI TERM
MODE
ID SELECT
PARITY
DRIVE
4 2 1 4 2 1
ON
CHANGER
Attach the shield.
19. Attach the plate removed in step 1.
Chucking pulley
Fig. 6
No clearance
Adjusting screw B
Apply screwlock
Fig. 7
Specified value: Clearance A = Clearance B
35
4-2. DISC SENSOR ADJUSTMENT
Connection: MAIN Board
2
1
4
3
MAIN board
CN606
SENS
GND
T.P
TP: Pin
1
SENS: Pin
3
GND: Pin
2 oscilloscope
Note: Remove all discs before adjustment.
Procedure:
1. Connect the oscilloscope to CN606 of the MAIN board as shown in the connection diagram.
2. Remove the shield, set the DIP switches on the back panel as shown below.
6. Press the DISC SKIP – button. The disc table starts to rotate in the counterclockwise direction.
7. Check that the waveform on the oscilloscope is the same as that adjusted in step 5. Repeat from step 4 if it is not.
8. Tighten the fixed screw C properly to secure the holder (sensor
R). Check the adjustment in step 4 to 7.
9. Apply screwlock and press the
U button to turn OFF the power.
10. Remove the oscilloscope connected in step 1.
11. Set the DIP switch as below and attach the shield.
SCSI TERM
MODE
ID SELECT
PARITY
DRIVE
4 2 1 4 2 1
ON
CHANGER
Attach the shield.
SCSI TERM
MODE
ID SELECT
PARITY
OFF
DRIVE
4 2 1 4 2 1
OFF
ON
CHANGER
Remove the shield.
You can change the direction dinamically by pressing DISC SKIP+,
DISC SKIP– button while adjustment mode.
You can stop rotation by pressing OPEN button.
Adjustment Location :
[ MAIN BOARD ] — Side B —
3. While pressing the OPEN button, DISC SKIP – button, and
DISC SKIP + button simultaneously, press the
U button to turn ON the power. (Keep on pressing three buttons untill
CHANGER LED is flashing.)
4. Press the DISC SKIP + . The disc table starts to rotate in the clockwise direction.
5. Loosen the fixed screw C to move the holder (sensor R) and secure it when the H portion of the T.P. waveform of the oscilloscope comes to the center of the H portion of the SENSOR waveform.
SENSOR
18
1
IC603
CN606
10
SENS
GND
T.P
9
T.P
More than
10ms
Apply screwlock
Set to the center approximately.
Holder
Fixed screw C
36
SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. TOOLS AND MEASURING INSTRUMENTS
5-1-1. GENERAL AND SPECIAL TOOLS LIST
5-1-2. Setting Single-Operation of CDM-56 Mechanism
Block
Jig
CD test disc (YEDS-18) : 3-702-101-01
The tools and measuring instruments for performing maintenance on the CDM-56 series are listed below.
5-1-1-1. General Tools
⊕
Driver 2mm
⊕
Driver 2.6mm
Tweezers
Round Nose Plier
Cutter
Soldering Iron (20W)
Desoldering Metal Braid (Solder Wick)
Multi Meter (DRM)
5-1-1-2. Special Tools
SONY Parts No.
(7-700-749-01)
(7-700-749-03)
(7-700-753-02)
(7-700-757-01)
(7-700-758-02)
MAIN BOARD
CDM-56
IBM PS/VP System
PS/VP and the monitor (640kbyte RAM, 3.5" FDD, HDD, Video
RAM-CGA or Higher, DOS Ver. 6.2 or later)
SCSI board AVA-2904E that is supplied as an accessory of CDJ-
500 or equivalent.
Active Speaker
SCSI cable (Attached or equal cable)
5-1-1-3. Test Disc
SONY Test Disc (YEDS-18)
SONY Test Disc (TGRS-21)
5-1-1-4. Measuring Equipments
Osilloscope Dual Trace 20MHz (probe x10)
DC Volt Meter (min. 10mA)
5-1-1-5. Software
(3-702-101-01)
(J-2501-110-A)
ATP625 Disc (CDM-001)
Field50. EXE Disc (CDJ-001)
Dwn-Aspi. EXE (CDM-002)
Update f. EXE Disc (CDJ-002)
(J-2501-173-A)
(J-2501-172-A) (*NOTE)
(J-2501-176-A) (*NOTE)
(J-2501-175-A) (*NOTE)
*: marked is refer to SERVICING NOTE
5-1-1-6. Expendable and Chemical Supplies
Cotton Swab (200 pieces)
Lens Cleaning Liquid
Molykote Grease (EM-30L)
Hanarl (SFL-9)
(7-740-900-65)
(J-2501-000-A)
(4-918-645-01)
(7-400-000-00)
ID2
ON
ID1
OFF
ID0
ON
PARITY
ON
3. While pressing the TEST button of the MAIN BOARD, turn on the power of the CDJ-C50S or power supply unit.
4. After about 1 second later, release the TEST button.
5. This sets the test mode. To enter the other mode, refer to the following table, set the dip switch, and press the TEST button.
Setting of Single-Operation Mode
Mode
Test Mode
ID2
ON
ID1
OFF
ID0
ON
PARITY
ON
CNJ201
Single-Operation of CDM-56
1. Chuck the disc beforehand.
2. Set the COMMAND SW of the controller to the test mode.
Command list of Single-Operation Mode
Mode
Initialize x1 speed x4 speed x8 speed x12 –x24(Partial CAV) speed
Tracking servo OFF
Tracking servo ON
PlayAudio (23’47”)
PlayAudio (5’00”)
PlayAudio (55’00”)
ID2
ON
ON
ON
ON
OFF
ON
ON
OFF
OFF
OFF
ID1
ON
ON
OFF
OFF
ON
ON
ON
OFF
ON
OFF
ID0
ON
OFF
ON
OFF
ON
OFF
ON
ON
OFF
OFF
PARITY
ON
ON
ON
ON
ON
OFF
OFF
ON
ON
ON
37
5-1-3. SYSTEM CONFIGURATION
5-1-3-1. Set up PS/VP System
a. Add the ANSI.SYS (Device = ANSI. SYS) and ASPI 8 DOS.SYS
in Config. SYS.
(Refer to Instruction Manual for more detail) b. Set the jumpers on the Adaptec SCSI Interface board as follows.
(Refer to Instruction Manual for Adaptec SCSI board AHA-
1520B or 2940 in detail)
Setting of SW and Configuration file.
AHA-1520B (for ISA BUS)…
All of DIP SW (1 to 4) are OFF.…
AHA-2940 (for PCI BUS)…AVA-2904E (for PCI BUS)
No Jumper and SW setting on the board.
Use default parameter for SSI Select configuration utility.
It is not necessary to install the device driver when using on the windows ’95.
It is necessary to install the device driver at first line of config.
sys when using on DOS.
c. Install the SCSI Interface board in the PS/VP System.
5-1-3-2. System Configuration
PS/VP System
Note: AVA-2904E is supplied as an accessory of the set.
SCSI Interface board
Adaptec AHA-1520B or 2940 or AVA-2904
Attached or egual cable
38
ATP625 Disc
Firmware Program Disc
To SCSI IN
SONY Test Disc
(TRGS-21) (for ATP)
ATP/DOWNLOAD System
Active Speaker
Dip SW
MAIN PCB
SCSI TERM : ON
MODE : OFF
SCSI TERM
MODE
S707
ON
OFF
ID2 ID1 ID0
Dip SW
PARITY
S706
Function check
CDM-56
*Note:
It is not needed to disconnect the internal SCSI cable.
SW601
TEST
MAIN BOARD
39
5-2. TROUBLE SHOOTING
This section describes trouble shooting methods.
Section 4-2-2. shows the flowchart of the processing routine of the unit. Section 4-2-3. describes the ATP procedures. These sections define the detective parts under operating conditions.
5-2-1. BEFORE TROUBLE SHOOTING
The following procedures are recommended to verify if the drive is really faulty or not: a. Poor connection with the host system
(esp. GND-related connection, frame GND, etc.) b. Incorrect operational procedure.
c. Program error of host system d. The SCSI TERM of DIP SW on the rear of set is not set to ON.
e. Wrong Drive Number selection f. Wrong supply voltage g. Environmental conditions (where electrical noise easily jumps into signal) h. Influence of strong magnetic field.
5-2-2. FLOWCHART FOR TROUBLE SHOOTING
START
ATP
(Refer to section 5-2-3.)
Fail
Optical Pick-up Cleaning
Pass
END
Perform drive function check
(Refer to section 5-2-4.)
Fail
Pass
Part Replacement
40
5-2-3. PROCEDURE OF ATP TEST
5-2-3-1. Pre-setting
a. Connect the CDJ-500 to the Computer. (Refer to Fig. 5-1-3-2.) b. Set the Jumpers on the Adaptec SCSI board. (Refer to Fig. 5-1-3-2.) c. Set the COMMAND SW of back panel as below.
ID2
OFF
ID1
ON
ID0
ON
PARITY
ON d. Turn on the power of Computer.
e. After loading the system, “C >” is displayed on the screen. Then, insert ATP625 Disc. (Carry out before starting up with Dos prompt.) f. Change the directory in the drive A. (“A >” is displayed on the screen.) g. Type A T P 6 2 5 and hit Enter key. (After loading the test program, Display 5-2-3-1. (a) shows up.)
Sony SCSI CD-ROM Failure Verification Test Ver. 1.03.00
[ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520
ATP625.CFG X-XXX-XX-XX
00: Inquiry Check
01: TEST UNIT READY
02: TOC Read
03: Incremental Read
04: Random Seek &Read
05: Spin Up/Down
06: Spin Up/Down
07: Spin Up/Down
08: Full seek Read
09: 1/3 seek Read
(X1)
(X4)
(MAX)
(X1)
(X1)
10: Full seek Read
11: 1/3 seek Read
12: Full seek Read
13: 1/3 seek Read
14: Play Audio (De-TRCK)
(X4)
(X4)
(MAX)
(MAX)
15: Play Audio (E-Volume)
16: Play Audio (Play Mode)
17: Play Audio (X’Talk L->R)
18: Play Audio (X’Talk R->L)
19: Sub Code Read
?
[MAR. -04-1997]
Drive Status Column
Hit any key to start or Esc to exit.
Display 5-2-3-1. (a)
41
5-2-3-2. Test Procedure
TEST item Check point
To execute ATP test of the drive.
1. Hit any key to start ATP test.
Note:
When some errors occurr during the test, “ A bort R etry I gnore” message will be displayed i=on the drive status column, at that time hit A key to exit and then check which part is broken in accordance with 3-4.
Note:
If each test result satisfies the specification, the word of “Pass” or value of the test result will be displayed on the judgement column.
a. Inquity check test will be executed.
b. “Returned Data OK ? (Y/N) = >?” message will be displayed on the drive status column, then check the inquiry data and hit Y key.
c. When “Place CD-ROM TEST DISC (TGRS-21)...” is displayed, press the OPEN button of the CDJ-500 to open the door, insert the TGRS-21 DISC to the front slot and close the door.
The TEST DISC will be carried to the DRIVE (CDM-56) automatically, and the disc will be chucked.
d. TOC Read test will be executed.
e. Incremental Read Test will be executed.
f. Random Seek & Read test will be executed.
g. Spin Up, Spin Down test (normal) will be executed.
h. Spin Up, Spin Down test (quadruple) will be executed.
i. Spin Up, Spin Down test (Max) will be executed.
j. Full seek test (normal) will be executed.
k. 1/3 seek test (normal) will be executed.
l. Full seek test (quadruple) will be executed.
m. 1/3 seek test (quadruple) will be executed.
n. Full seek test (Max) will be executed.
o. 1/3 seek test (Max) will be executed.
2. After Seek test completion, Play Audio (DeTRCK) test will be executed.
a. “Hit any key when ready” message will be displayed on the drive status column, then hit any key.
b. Play Audio (E-Volume) test will be executed.
The music (both left and right channel) can be heard from the active speaker.
The music (both left and right channel) will be faded-out slowly.
(After several minutes, the drive is set to mute mode.) c. “Any key when Okay or Esc when NG” message will be displayed on the drive status column, then hit any key.
d. Play Audio (Play Mode) test will be executed.
The music (both left and right channel) can be heard from the active speaker. And the play mode can be changed by pushing some key.
(Refer to Drive Status Column) e. “Space bar when ready, ESC to abort” message will be displayed on drive status column, then hit space bar.
f. Play Audio (X’Talk L nR) test will be executed.
g. “Any key when Okay or Esc when NG” message will be displayed on drive status column, then hit any key.
h. Play Audio (X’Talk R nL) test will be executed.
The sound (only left channel) can be heard for 3 sec. from the active speaker.
The sound (only right channel) can be heard for 3 sec. from the active speaker.
i. “Any key when Okay or Esc when NG” message will be displayed on drive status column, then hit any key.
3. After Audio test completion, Sub Code Read test will be executed.
42
TEST item Check point
4. After sub code Read test completion, Door will be opened automatically. The ATP test ends.
Note:
If all of test items are completed, words of OK will be displayed on the screen.If not, NG will be displayed.
The disc will automatically be unchucked, the door will be opened.
Remove the disc when the door is opened.
Sony SCSI CD-ROM Failure Verification Test Ver. 1.00.00
[Nov. -22-1996]
[ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520
ATP625.CFG
00: Inquiry check
01: TEST UNIT READY
02: TOC read
03: Incremental Read
04: Random Seek & Read
05: Spin Up/Down (X1)
06: Spin Up/Down (X4)
07: Spin Up/Down (Max)
08: Full seek Read (X1)
09: 1/3 seek Read (X1)
10: Full seek Read (X4)
11: 1/3 seek Read (X4)
[ Pass ] [ ID:3 ]=SONY CD-ROM CDU625 X.Xx
[ Pass ] READY
[ Pass ]
[ Pass ]
[ Pass ]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
12: Full seek Read (Max)
13: 1/3 seek Read (Max)
14: Play Audio (DeTRCK)
15: Play Audio (E-Volume)
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ]
[ Pass ]
Ave : XXXX [ms]
Ave : XXXX [ms]
16: Play Audio (Play Mode) [ Pass ]
17: Play Audio (X’Talk L->R) [ Pass ]
18: Play Audio (X’Talk R->L) [ Pass ]
19: Sub Code Read [ Pass ] LOAD : 4758 [ms]
OK
Remove the DISC Hit any key when ready
Sony SCSI CD-ROM Failure Verification Test Ver. 1.00.00
[Nov. -22-1996]
[ID:7]=ASW-1210 V 3.60 ADAPTEC AHA-1520ADAPTEC AHA-1520
ATP625.CFG
0: Inquiry check
1: TEST UNIT READY
2: TOC read
3: Incremental Read
4: Random Seek & Read
5: Spin Up/Down (X1)
6: Spin Up/Down (X4)
7: Spin Up/Down (Max)
8: Full seek Read (X1)
9: 1/3 seek Read (X1)
10: Full seek Read (X4)
11: 1/3 seek Read (X4)
[ Pass ] [ ID:3 ]=SONY CD-ROM CDU625 X.Xx
[ Pass ] READY
[ Pass ]
[ Pass ]
[ Pass ]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXX [ms]
[ Pass ] Spin Up : XXXX [ms] Spin Down : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
Ave : XXXX [ms]
12: Full seek Read (Max)
13: 1/3 seek Read (Max)
14: Play Audio (DeTRCK)
15: Play Audio (E-Volume)
[ Pass ] Max : XXXX [ms]
[ Pass ] Max : XXXX [ms]
[ NG ]
[ Pass ]
Ave : XXXX [ms]
Ave : XXXX [ms]
16: Play Audio (Play Mode) [ Pass ]
17: Play Audio (X’Talk L->R) [ Pass ]
18: Play Audio (X’Talk R->L) [ Pass ]
19: Sub Code Read [ Pass ] LOAD : 4698 [ms]
NG
Remove the DISC Hit any key when ready
Note:
Even if one of items has an “NG”, the result of test will be reqarded as NG.
43
5-2-4. DRIVE FUNCTION CHECK
Since CDM-56 models is adjustment-free drive, there is no potentiometer fo electrical adjustment in the MA-C30 Mounted Board.
Therefore BU or MA Mounted Board can be swapped over without any manual adjustment so that you will easily find defective components (if the trouble depends on BU or MA Mounted Board).
(Refer to 5-2-4-2.)
Note: All of adjustment items, will be automatically performed after power-on by the function of CD DSP IC.
The page 23 shows the sequence of execution items in Power-
On Reset Actions. It will help you finding any defective point on the drive to know the specified processing sequence of the auto adjustment items and drive’s action in the Power-On Reset Actions.
Preparing
The following tools and measuring equipments are necessary for performing this section.
Oscilloscope
Sony Test Disc (YEDS-18) (3-702-101-01)
5-2-4-1. Pre-Setting for Test Mode Operation
Note: This section is performed only specified following sections.
Note: This section describes usages of Test Mode Operation and signal checking on the CDM-56 drives with the with the
COMMAND SW on the back panel and the TEST button
(MAIN board).
ON
OFF
SCSI TERM
MODE
S707
ID2 ID1 ID0
TEST
SW601
S706
PARITY a. Set the COMMAND SW on the back panel as below.
ID2
ON
ID1
OFF
ID0
ON
PARITY
ON b. While pressing the TEST button of the controller, turn on the power of the CDJ-C50S.
d. About 1 second later, release the TEST button.
Note: Even if drive is Test Mode, OPEN button is activated.
44
5-2-4-2. Flowchart
Note:
These flowchart is described assuming that IC failure causes any trouble.
Start
Mechanical or Electrical trouble ?
Mechanical Checking/Repairing
Mechanical
Electrical
Nothing in action in Power-On ?
No action
Proceeding Adjustment Action
IC303 (CPU) failure
IC305 (gate-array) failure
IC304 (Flash-ROM) failure
BU/Main PWB/HP PWB dependent ?
(check by swapping BU or PWBs.)
BU dependent
HP PWB dependent
BU/OP checking/Replace BU
HP PWB checking
Main PWB dependent
Power-On Reset actions Completes or
Failed/action NG ?
Failed /NG
IC201 (CD DSP/servo IC) failure
IC101 (RF Amp IC) failure
Drive ICs failure
Completed
NG
Refer to Flowchart (2)-Power-on Reset Actions
IC301 (CDROM/SCSI I/F IC) failure
IC304 (Flash-ROM) failure
SCSI command execution communication OK or NG ?
(check with any SCSI command)
OK
Read Operation
OK
End
Access Time NG
IC201 (CD DSP/servo IC) failure
Motor Driver ICs failure
Read Data Error
IC301 (CDROM/SCSI I/F IC) failure
IC302 (buffer RAM) failure
Flowchart (1) Repairing/Trouble Shooting-General
45
46
Power on Reset Action
Failed/Action NG
Retry for detailed checking
Trouble/Failed in Step (2)-(11)
(Spin-up/Focus-on)
NG
OK/Passed
Trouble/Failed in Step (12)-(15)
(Auto Adjustment Functions)
NG
Focus Search (Refer to 5-2-4-6.)
Spindle Motor Driver IC (Refer to 5-2-4-11.)
RF Signal (Refer to 4-2-4-13.)
Check Focus/Tracking Servo Error Signal
RF Signal (Refer to 5-2-4-13.)
OK/Passed
Trouble/Failed in Step (16)-(21)
(Read TOC/Set x8 speed)
OK/Passed
OK/Completed
(Try Read operation)
NG
RF Signal (Refer to 5-2-4-13.)
Spindle Motor Driver IC (Refer to 5-2-4-11.)
Flowchart (2) Repairing/Trouble Shooting-Power-on Reset Actions
IC101
IC106
IC101
IC201
IC106
IC101
IC201
Power on Reset Actions
(12)
(13)
(14)
(15)
(8)
(9)
(10)
(11)
(4)
(5)
(6)
(7)
Step
(1)
(2)
(3)
Item
Drive Power-On
Sled Offset/Hall element Adjustment
Tentative spindle servo gain setting
LD On
Focus Search
Focus On
Spindle servo gain setting
Tracking Servo On
Spindle Servo On
— sync pattern detection —
Focus Bias Voltage Auto Adjustment
Focus Servo Gain Auto Adjustment
Track Servo Gain Auto Adjustment
— sync pattern detection —
Disc Diameter (8cm/12cm) Detection
(16)
(17)
(18)
(19)
(20)
(21)
Read TOC
Jump to 00:02:00
— Subcode-Q detection —
Disc Linear Speed Detection
Set max. rotational speed
— sync pattern detect & subcode-Q detection—
— Completed —
LD to turn on
OP lens to move up and down
Drive Action
(You will hear a small beep sound from the drive during these auto adjustment.)
(You will see RF Signal with Spindle-Kicking waveform.)
Note: When a disc is replaced, the above steps excluding item (1) to (3) will be executed.
The item (1) to (3) will be performed only after power-on.
47
5-2-4-3. Test Command List
ID2
ON
ON
ON
OFF
ON
ON
OFF
OFF
OFF
ID1
ON
ON
OFF
OFF
ON
ON
ON
OFF
ON
ID0
ON
OFF
ON
ON
ON
OFF
OFF
OFF
ON
PARITY
ON
ON
ON
ON
OFF
OFF
ON
ON
ON
Drive Action
Initialize Drive
Set Normal Speed
Set Quadruple Speed
Play Audio (from 23’47”)
Tracking Servo on
Tracking Servo off
Play Audio (from 5’00”)
Play Audio (from 50’00”)
Partial CAV (x12–x24)
OFF : PARITY or ID0 – 2 test point to be high (5V).
ON : PARITY or ID0 – 2 test point to be low (Ground).
Command Execute
In the test mode, above listed function can be executed. Turn on
COMMAND SW on the back panel of CDJ-500.
The command will be latched by TEST down edge, and executed by rising edge.
Command Setting
5-2-4-5. Sled Gear Train
Check the mechanical burden
a. Disassemble the CHUCK HOLDER.
b. Check if there is any broken tooth in the gears.
c. Try to move sled gears by hand and check if it gets unsmooth in certain position.
d. In case there is unsmooth protion, replace Base Unit Ass'y.
5-2-4-6. 2-Axis Actuator
Check Focus search operation
a. Disassemble the CHUCK HOLDER so that the optical pick-up is exposed.
b. Turn on the drive power and watch if the objective lens moves upward and downward.
c. If the lens does not move, check the resistance of the 2-axis actuator coils. It should be 6.1±1.1
Ω
between FCS+ and FSC–.
PARITY or ID0 – 2
TEST
Command Execute
(RELEASE TEST button)
Command Latch
(PUSH TEST button)
5-2-4-4. Spindle Motor
Check resistance
a. Pull the spindle motor flexible cable out from the connector.
b. Measure the resistance between 3 motor terminals respectively
(u-v, v-w, w-u).
c. The resistance shall be 8
Ω
± 10%.
d. Otherwise replace the motor.
W
V
U
Check noise from spindle motor
a. Listen carefully the sound from the spindle motor while drive is spinning up.
b. If you hear the strong striking noise from the motor, it is suspected that there is too much clearance between the bearing metal and the shaft, that is; NG motor!!
Note: As the CDM-56 adopts the CAM motor for the spindle motor, clattering sounds of the ball bearings are produced during spinning up and spinning down.
Differentiate these from slipping sounds.
FCS+
TRK+
TRK–
FCS– d. Otherwise replace the optical device.
e. If the coils are normal, replace the Driver IC (IC103).
5-2-4-7. Focusing (Focus Bias)
a. Insert any discs into the drive after the check of 5-2-4-4.
b. Check if the drive can make a focus.
c. In case of failure, it is possible that Focus Bias or Focus Gain
Servo circuit had not been controlled well.
d. So watch RF signal by a oscilloscope and see if the quality is good or not.
e. In case the quality is not good, check servo circuit.
5-2-4-8. Laser Power
Check Laser beam
a. Disassemble the drive so that the optical device is exposed.
b. Turn on the drive power and look into the objective lens carefully while the drive is in process of focus search.
c. Check if the red beam comes out from the optical pick-up.
Warning: Do not look into LD beam closely with naked eyes.
d. In case of no beam from optical device, the LD must have been broken down, so replace the optical pick-up.
48
Check Laser Current
a. Touch the IOP test land IOP on the MA-C30 Mounted Board.
b. Measure the voltage generated by the laser current while the drive in process of focus search.
c. It is supposed to be about 4.5V because the voltage of IOP will drop by IOP x10
Ω
from 5V-A.
d. Otherwise replace the optical pick-up.
Check G Sensor
a. Pull the SE-C7 P. W. B. cable out from the connector.
b. Measure the resistance between 3 terminals respectively.
(VSG-GND, GND-5V) c. The resistance should be 3.7 ± 1M
Ω
between VSG and GND, and 94 ± 6k
Ω
between GND and 5V.
5-2-4-9. Chucking Mechanism
a. Listen the sound from the drive while the drive is spinning up.
b. Check if there is any slipping noise among the Turntable, the
Chucking Pulley Ass'y and the Disc.
c. If you hear any, check the mechanical adjustments (SECTION 4).
d. Otherwise disassemble the drive and check if there is excessive dust or any contamination on the Turntable or the disc.
Note: As the CD-56 adopts the VCAN (Vibration Cancel) motor for the spindle motor, clattering sounds of the ball bearings are produced during spinning up and spinning down.
Differentiate these from slipping sounds.
5-2-4-10. Sled Motor
a. Disconnect the SE-C7 P. W. B. cable from the SE-C7 board.
b. Check the resistance between 2 terminals of sled motor.
c. It should be 10.8
Ω ± 10%
.
VSG
GND
5V
[MA-C30 BOARD] (SIDE B)
IC104
TP IOP
Laser Current Check
CNJ102
IC106
CNJ103
CNJ201
CNJ104
49
5-2-4-11. EF Balance
Note:
• Before performing electrical block checks, solder a lead wire to
TP RF EQ, TP VC, and TP TE of the MA-C30 board.
• Chuck the disk (YEDS-18) beforehand.
• Refer to 5-2-4-1. and set the test mode.
• Insert a SONY test disc (YEDS-18) into the test drive.
• Press the OPEN button to open the door, place the disc in the slot in front, close the door to chuck the disc.
1. Connect the oscilloscope to TP TE and TP VC of the MA-C30 board.
2. Set the COMMAND SW of the controller to INITIALIZE and press the TEST button.
ID2
ON
ID1
ON
ID0
ON
PARITY
ON
3. Set the COMMAND SW of the controller to x1 speed, and press the TEST button.
ID2
ON
ID1
ON
ID0
OFF
PARITY
ON
4. Set the COMMAND SW of the controller to Play Audio (23’47”), and press the TEST button.
ID2
OFF
ID1
OFF
ID0
ON
PARITY
ON
5. Set the COMMAND SW of the controller to tracking off, and press the TEST button.
ID2
ON
ID1
ON
ID0
OFF
PARITY
OFF
6. Check the level B of the oscilloscope’s waveform and the A (DC voltage) of the center of the Traverse waveform.
Confirm the following:
• A/B x 100 = less than ±22 (%)
Center of the waveform
5-2-4-12. RF Level
Note:
• Before performing electrical block checks, solder a lead wire to
TP RFEQ and TP VC of the MA-C30 board.
• Chuck the disk (YEDS-18) beforehand.
• Refer to 5-2-4-1. and set the test mode.
• Press the OPEN button to open the door, place the disc in the slot in front, close the door to chuck the disc.
1. Connect the oscilloscope to TP RF and TP VC of the MA-C30 board.
2. Set the COMMAND SW of the controller to INITIALIZE and press the TEST button.
ID2
ON
ID1
ON
ID0
ON
PARITY
ON
3. Set the COMMAND SW of the controller to x1 speed, and press the TEST button.
ID2
ON
ID1
ON
ID0
OFF
PARITY
ON
4. Set the COMMAND SW of the controller to Play Audio (23’
47”), and press the TEST button.
ID2
OFF
ID1
OFF
ID0
ON
PARITY
ON
5. Check that the oscilloscope waveform is clear, and the RF level is proper.
* A clear RF signal waveform is as follows.
level : 0.9V –1.6 V
(RF Level Specification)
0V (VC)
B (Traverse level)
A (DC voltage)
Removing the disc
Press the OPEN button. The disc unloads from the drive, comes to the front automatically, and the door opens.
Loading the disc
Press the OPEN button to open the door, place the disc in the slot in front, then close the door with your hand.
The disc will automatically be chucked in the drive.
7. After checking, set the COMMAND SW of the controller to tracking on, and press the TEST button.
ID2
ON
ID1
ON
ID0
ON
PARITY
OFF
50
SCSI TERM
MODE
S707
S706
ON
OFF
ID2 ID1 ID0
PARITY
TEST
SW601
Adjustment Location :
[ MA-C30 BOARD ] — Side B —
CNJ201
TP VC
RF Level Check & EF balance Check
CNJ102
IC106
CNJ103
IC110
IC104
TP RF (RF EQ)
RF Level Check
TP TE
EF balance Check
CNJ104
51
P-CAV Drive
By using latest P-CAV (partical CAV) technology, the CDM-56 realizes data transferring with variable transfer rate, from 12* (inner track) to 24X (outer track).
Achieving 20X (3000kBytes/s) average data transfer rate, the CDM-
56 shows excellent performance.
*In the case of scanning velocity 1.3m/s and 60 min. disk reading.
FUNCTION OF PARTICAL CAV
CDM-56 (Drive unit) features Partical CAV capability for Maximum Speed, taking advantage of Wide Capture Range capability of
PLL (Phase Locked Loop) in its fastest speed mode.
Refer to the illustration on the left-hand side;
Spindle Motor rotates constantly at approximately 6,000 rpm, equal to the rotational speed of 12X CLV on the innermost track, in the area between the innermost track and the point of approximately 39 minuites (CAV area).
In the disc area outside the fore said 39 minutes, the spindle motor follows the spindle speed curve of 24X CLV (CLV area).
Spindle Rotational Speed
Spindle Rotational Speed
12X-24X CAV area
6000
24X CLV area
5000
SECTION 6
THEORY OF OPERATION
Disc In Balalaned Disc cancellation function
1 VCAN (Vibration Cancel) motor adopted by SPINDLE
CDM-56 has new type of spindle motor that cancels imbalance of a disc automatically. Thanks to the new spindle motor, self -vibration of the drive is reduced when the drive reads the imbalance disc.
2 Shock sensor adopted
CDM-56 has a feature that can detect excess vibration caused by imbalance disc. Thanks to this feature, CDM-56 (CDM-57) automatically reduce it's spindle speed to 8X-20X CAV mode when such imbalance disc is inserted. It contributes to less vibration, less audible noise, better readability and provides comfortable operating condition to end user.
Capable of Reading CD-RW disc
CDM-56 has the capability of reading CD-RW disc. CDM-56 can automatically adjust RF amp gain and error amp gain to the proper value for CD-RW disc, when CD-RW disc is inserted. But CDM-
56 can read CD-RW disc only at 4X speed.
Fast Access Time
Random access time is 90 ms* at P-CAV mode, which reduces vibration of spindle rotational speed so that the access time improved.
Power Saving Mode
CDM-56 has a power saving mode. If any command which requires disc access (such as READ or SEEK command) is not issued to the drive for more than the inactivity time, which can be set by mode select command, the drive goes into "standby mode" automatically.
Any command that requires disc access can resume the drive from
"standby mode".
0 39
Adress on the disc (min)
Data Transfer Rate
Data Transfer Rate (x 150kB/s)
24X
60
Average 20X
12X
0 39
Adress on the disc (min)
60
52
SECTION 7
DIAGRAMS
P. SW board
LED board
AC FILTER board
D. SW board
P. JACK board
D. OUT board
SCSI OUT board
SCSI IN board
KEY board
MAIN board
POWER board
TABLE SENSOR board
DOOR MOTOR board
DISC SENSOR (S) board
DISC SENSOR (R) board
SE-C7 board
MA-C30 board
CHUCK SW board
MOTOR board
53 53
CDJ-500
CDJ-500
7-2. BLOCK DIAGRAMS
– CD-ROM DRIVE (1/2) SECTION –
OPTICAL PICK-UP
BLOCK (SPU3212)
E
DETECTOR
A C
B D
F
9
10
13
11
12
8
LASER
DIODE
LD
14
PD
TRACKING
COIL
FOCUS
COIL
14
LD
POWER
15
14 TRK +
14 TRK –
1 FCS +
4 FCS –
M001
SPINDLE
MOTOR
HALL
Q101
LD
DRIVE
+
+
+
7
TNI
4
FNI
5
FPI
6
TPI
9
LDO
8
MDI
RF AMP
IC101
RF AMP
FOCUS
ERROR
AMP
TRACKING
ERROR
AMP
AUTO
POWER
CONTROL
RFNZ
30
AGC IN
27
RFO
28
RFGO
25
24
FEO
16
RFRPIN
FEN
17
TEO
14
INVERTER
TEN
GVSW
13
26
2
22
20
15
12
11
10
RFGC
RFCT
RFRP
SBAD
2VRO
TEB
SEL
Q103
RFEQ
Q102, 104
EQ SW
SOL102
FE
SDL101
TE
GVSW
GMAD
VRO
3
19 VC
Q105
SWITCH
RF3
TRACKING/FOCUS/
MOTOR DRIVER
IC103
V IN 3A
10 22
W OUT +
21
W OUT –
24
V OUT + MOTOR
DRIVE
23
V OUT –
VS 1
VS 2
27
20
V IN 2A
8
19
MUTE 2
SPINDLE
MOTOR DRIVER
IC106
7
U OUT
V OUT
4
W OUT
2
9
U IN 1
U IN 2
10
V IN 1
11
V IN 2
12
W IN 1
13
W IN 2
VH –
14
15 HALL BIAS
MOTOR
DRIVE
FG
24
PS 23
22
1
TRACKING
FILTER SW
IC105
DRVEN
T OUT
DRVEN
5
RF 1
RF3
97
33
38
DIGITAL SERVO,
DIGITAL SIGNAL PROCESSOR
IC201
XHSO
RFI
FEI
VCOREF
PDOS
PDO
TMAXS
TMAX
LPFN
LPFO
25
26
27
29
22
23
24
LRCK
BCK
IPF
AOUT
SBOK
DATA
SFSY
SBSY
CLCK
7
11
12
13
8
100
2
6
3
LRCK
BCK
C2P0
SBS
SBCK
41 TEI
DOUT 4
LO
RO
80
77
2VRO
X201
40MHz
42 TEZI
46 RFGC
35 RFCT
37 RFRP
36 RFZI
39 SBAD
51 2VREF
20 P2VREF
47 TEBC
52 SEL
69
PXI
70 PXO
44
43
50
TRO
FOO
DMO
D OUT
BUS 0
BUS 1
BUS 2
BUS 3
BUCK
XCCE
XRST
FLG A
FLG B
FLG C
FLG D
53
54
55
56
XI 73
IO 0
IO 1
59
60
4
85
86
87
88
91
92
95
Q202
SWITCH
Q205, 206
AUDIO
MUTE
IC203
SRDR
SFDR
Q203
MUTE
SW
IC451
OPTICAL
DIGITAL
OUT
IC202
LPF
SWITCH
Q207
SRPLL
LOCK
L
R
WRPLL
LOCK
LRCK
BCK
C2P0
MDT
SBOK
SBS
SFSY
SBSY
SBCK
J451
ANALOG OUT
XAMUTE
BUS 0
BUS 1
BUS 2
BUS 3
BUCK
XCCE
XRST
FLG A
FLG B
FLG C
FLG D
DCLK
CVSW
A
(Page 55)
TRBST
7
6
IC104 (3/4)
BUFFER
LOW BOOST
PHASE
COMPENSATE
FILTER
IC104 (1/4)(2/4)
IC104 (4/4)
BUFFER
SDL108
SP
2
•
3
IC110
SPINDLE MOTOR
CAV/CLV SELECT
4
1
13 5
BUFFER
IC109
X1
SHOCK SENSOR
IC1
HE 1
H
M002
SLED
MOTOR
SLD +
IC111, 112
HE 2
H
SLED MOTOR
SPEED
SENSOR
M
SLD –
VSG
IC107
SLED MOTOR DRIVE/DECODER
34
33
30
29
HA +
HA –
HB +
HB –
10
ERO
16
15
14
25
13
19
11
18
32
31
28
27
17
CA –
CB +
CB –
CTRL
VLO
VL –
TKC
A +
A –
B +
B –
CA +
ER –
TKC
HVDET A
HVDET B
PWM 0
SDL103
+
PWM 1
SDC104
DVO
DV +
BYPS
DV –
7
9
12
26
8
DVI
+
SLCON –
SRDR
+
SLCON +
SFDR
VSG
HVDET A
HVDET B
SLDOM
SLDOP
TKC
SLCON –
SLCON +
PWM 0
PWM 1
TRBST
DRVEN
FG
CAVSW
GLVSW
GAVG 0
09
• Signal path
: DATA
: AUDIO
54 54
CDJ-500
A
(Page 54)
09
PWM 1
VSG
RF 1
FLG A
FLG B
FLG C
FLG D
LOCK
GVSW
TRBST
DRVEN
HVDET A
HVDET B
SLDOM
SLDOP
TKC
SLCON –
SLCON +
CLVSW
CAVSW
CLVG 0
CLVG 1
CAVG 0
FG
XAMUTE
DCLK
XRESET
BUS 0
BUS 1
BUS 2
BUS 3
XCCE
BUCK
PWM 0
– CD-ROM DRIVE (2/2) SECTION –
MDT
LRCK
BCK
C2P0
SBS
SFSY
SBSY
SBCK
SBDK
BUFFER MEMORY
IC302
I/O 1 I/O16 A0 A8
2-5 • 7-10 • 31-34 • 36-39
16-19 • 22-26 14 28 29 13
BCK
96
97
95
94
MDAT
LRCK
BCLK
C2P0
SBS
SFSY
SBCK
91
93
SBIN
WFCK
92 SBSY
100 GSCR
90 EXCK
71-78 • 80-87
MDB0-MDB15
54-60 • 62 • 63 65 66 67 68
MA0 MA8
CD ROM DECODE
&
SCSI INTERFACE
IC301
X301
40MHz
48 XTL 2
49 XTL 1
D0 D7 A0 A6
131-138 123-129 143 144 142 50 141 122
XDBO-7
11
•
15
•
17
•
19
8
•
10
•
3
•
5
•
XDBP
XATN
XBSY
XACK
XSRS
XMSG
XSEL
XCD
XREQ
XIO 43
22
24
26
29
30
35
36
39
ADDRESS BUS
DATA BUS
SBS
SFSY
SBSY
SBCK
SBOK
INVERTER
Q106
47
46
17
48
50
53
54
52
SBS
SFSY
SBCY
SBCK
SBOK
CLVO
CAVO
51
55
GN0O
GN1O
CAV
49 FGIN
7 XAMUTE
62
12
DCLK
XDRS
23
22
BUS 0
BUS 1
21
20
18
BUS 2
BUS 3
XCCE
19 BUCK
64 PWM 0
25-32 33-40
D0-D7 A0-A4 • A17-A19
GATE ARRAY
IC305
43 42
61
57
PWM 1
EXC 0
CCK
F20M
CXDCS
63
45
42
XEJC
XLDO
XLD
XULD
XTOUT
5
9
2
1
8
XEJECT
XBVSY
XLD
XUNLOAD
XTOUT
X302
33.86MHz
58 EXCI
55 55
SCSI DATA BUS
SCSI CONTROL BUS
FLASH MEMORY
IC304
D0 D7 A0 A15
A18
13-15 • 17-21 12-5 • 27 • 26 • 23 • 25 • 4 • 28 • 29 • 3 22 24 31
A18
43
71
XWAT
XAIR
13-20 22-29 • 31-42
D0-D7 A0 A19
55 56
TDIR 5
ID 0
ID 1
ID 2
60
63
64
51
70
8
9
10
76
75
EXTAL
XGAINT
GVSW
WRPLL
TRBST
DRVEN
FLG A
4
73
2
3
FLG B
FLG C
FLG D
LOCK
6
59
RF 1
VSG
61 HVDET A
62 HVDET B
65 SLDOM
66 SLDOP
74 TKC
MICRO
COMPUTER
IC303
TEST
PARITY
1
80
79
SLCON + PWEN 7
XTIN
SW601
(MAIN BOARD)
• SIGNAL PATH
: DATA
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DBP
2
10
1
9
20
30
ATN
BSY
ACK
RST
MSG
SEL
C/D
REQ
I/O
40
50
54
39
49
53
19
CN691
OUT
29
CN681
IN
SCSI
TIN
ID0
ID1
ID2
DBP
ATN
BSY
ACK
RST
MSG
SEL
C/D
REQ
I/O
DB0-DB7
B
(Page 56)
XTOUT
XUNLOAD
TOUT
UNCHUCK
XLD
XEJET
CHUCK
XEJET
C
(Page 56)
PARITY
PWEN
XBUSY
BUSY
D
(Page
56)
E
(Page
57)
F
(Page
56)
CDJ-500
– MAIN SECTION –
C
(Page
55)
TIN
TOUT
XEJECT
CHUCK
U CHK
D ID0
D ID1
D ID2
DB0-DB7
SCSI DATA BUS
B
(Page
55)
DBP
ATN
BSY
ACK
RST
MSG
SEL
C/D
REQ
I/O
SCSI
CONTROL
BUS
RESET
IC608
SW602
IC606
5V
X602
40MHz
IC606
LEVEL SHIFT
48 CLK
47 XCS
Q51
DISC
SENSOR
TABLE SENSOR1-3
IC51-53
T.SENS1-3
D.SENS
S51
UP
18
20
•
22
SD0
SD7
25
•
27
28
29
XSDP
XATN
30
32
33
34
35
37
38
39
XBSY
XACK
XRST
XMSG
XSEL
XCD
XREQ
XIO
IC609
SCSI INTERFACE
CHUCK
SWITCH
55
PAD0
PAD7
58
•
60
63
A0
A3
49
•
50
•
52
•
53
XINT
XWR
XRD
42
45
46
AD0-7
S52
DOWN
44 RESET
IC605
ADDRESS DECODER
7 Y7 A
B
C
1
2
3
A17
A18
A19
Y0 15
Y1 14
CE
CE
!∞
!¢
TIN
TOUT
XEJECT
CHUCK
U CHK
D ID0
D ID1
D ID2
D.SENS
T.SENS1
T.SENS2
T.SENS3
79
80
P30
P31
1
2
4
15
16
P32
P33
P35
P00
P01
17
59
P02
ANI3
76
75
T.SENS1
T.SENS2
74 T.SENS3
53 P16
54 P17
43 AD0
36 AD7
24 A8
26
•
28
A15
A17
34 A19
72 INTP0
22 XWR
23 XRD
IC602
CPU
TO2 3
TO0 5
PWM1 48
PWM0 47
P14
P15
51
52
P00
P01
P02
P76
P75
P77
P06
P26
P12
P22
P72
P71
P70
58
57
56
12
13
14
62
61
63
18
77
49
73
DOOR M SENS
XC LED
DOOR SENS
S703-705
XO KEY
XL KEY
XR KEY
KEY SW
(OPEN)
(REW)
(RF)
DATA BUS
ADDRESS BUS
7 XRESET
44 ASTB
2 D1
9 D8
IC604
D LATCH
Q1 12
Q8 19
11 STB
IC603
MOTOR DRIVE
3 RIN
2 FIN
16 RIN
17 FIN
OUT+
OUT–
OUT–
OUT+
8
9
10
11
M
M61
LOADING MOTOR
M
M62
TABLE MOTOR
IC601
MOTOR DRIVE
4 FIN
5 RIN
OUT1
OUT2
1
7
VREF 6
M
M005
DOOR MOTOR
VCC BUFFER
Q601
12V
D ID0
D ID1
D ID2
C ID0
C ID1
C ID2
MODE2
MODE1
MODE0
F RECOV
S706, 707
SWITCH
F_RECOV
MODE1
MODE2
PARITY
S ID0-2
D ID0-2
MIS
TERM
IC607
FLASH MEMORY
2 A16
2
12
•
23
•
25
A0
A15
29
WE 31
CE 22
OE 24
13
15
•
17
D0
D7
21
PRITY
D701
POWER
D701
BUSY (DRIVE)
+5V
LED SW
Q701
XC LED
DOOR SENS
DOOR M SENS
!∞
D
(Page 55)
+5V
S702
DOOR SENS
S701
DOOR MOTOR
SENS
BUSY
F
(Page 55)
1
21
•
23
A0
A14
26
IC610
S-RAM
CE 20
OE 22
WE 27
11
13
•
15
D0
D7
19
!¢
56 56
– POWER SUPPLY SECTION –
+12V
PRV 12V
E
5V–A
PWEN
(Page 55)
+5V(5V–D)
+5V–P
–12V
5V REG
IC501
+12V REG
IC901
+B BUFF
Q702
SWITCH
Q701
–12V REG
IC903
+5V
(5V–D)
D51
DISC SENSOR (S)
+5V REG
IC902
RECT
D905-908
D841
D842
D843
INTERNAL
ILLUMINATION
09
RECT
D901
T901
POWER
TRANSFORMER
T902
LINE
FILTER
S901
POWER
CNP901
AC IN
57
CDJ-500
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise specified.
•
¢
: internal component.
•
C
: panel designation.
Note:
The components identified by mark !
or dotted line with mark !
are critical for safety.
Replace only with part number specified.
Note:
Les composants identifiés par une marque
!
sont critiques pour la sécurité.
Ne les remplacer que par une piéce por tant le numéro spécifié.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions.
no mark : STOP
( ) : PLAY
*
: can not be mounted
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
F
: AUDIO
• Abbreviation
CND : Canadian model.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• p
: parts mounted on the conductor side.
•
®
: Through hole.
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Indication of transistor
C
Q
These are omitted
B E
WAVEFORMS
– CD ROM SECTION –
1
1.2Vp-p
2
3
4
5
8
1.8Vp-p
(PLAY)
IC101
@∞
RFGO
34MHz
IC305
%¶
EXCO
9
5Vp-p
APPROX 40mVp-p
(PLAY)
IC101
!¢
TEO
17MHz
IC305
^£
CCK
!º
3Vp-p
APPROX 10mVp-p
(PLAY)
IC101
!§
FEO
2.5Vp-p
!¡
40MHz
(PLAY)
IC201
&º
PXO
!™
2Vp-p
34MHz
(PLAY)
IC201
&£
XI
40MHz
IC301
$•
XTL2
1.415MHz
IC301
(∞
BCK
44.2kHz
IC301
(¶
LRCK
5.4Vp-p
5.4Vp-p
6
5.4Vp-p
1.415MHz
(PLAY)
IC201
2
BCK
7
5.4Vp-p
44.2kHz
(PLAY)
IC201
`⁄‚‚
LRCK
B C E
These are omitted
57
CDJ-500
7-3. PRINTED WIRING BOARD – CD-ROM DRIVE SECTION –
• See page 53 for Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
IC104
IC106
IC110
IC112
IC501
B-4
B-5
B-5
B-2
B-2
Q205
Q206
Q701
C-2
C-2
A-2
(Page 75)
(Page 67)
(Page 69)
58 58
(Page 71)
TP
(RFEQ)
TP
(TE)
TP
(VC)
(Page 69)
7-4. PRINTED WIRING BOARD – CD-ROM DRIVE SECTION –
• See page 53 for Circuit Boards Location.
(Page 67)
59 59
CDJ-500
• Semiconductor
Location
Ref. No.
Location
D101
D201
D301
D701
B-1
C-3
D-1
B-5
Q101
Q102
Q103
Q104
Q105
Q106
Q202
Q203
Q207
Q702
IC101
IC103
IC105
IC107
IC109
IC111
IC201
IC202
IC203
IC301
IC302
IC303
IC304
IC305
A-1
B-2
A-2
B-2
B-2
C-2
B-4
C-3
B-3
A-4
C-3
D-4
D-3
D-3
D-1
D-1
A-2
A-3
B-3
A-3
B-1
B-4
C-4
B-3
CDJ-500
7-5. SCHEMATIC DIAGRAM – CD-ROM DRIVE (1/6) SECTION –
• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.
(Page
70)
(Page 61) (Page 62) (Page 62)
60 60
(Page 64)
(Page 63)
(Page 68)
(Page 68)
7-6. SCHEMATIC DIAGRAM – CD-ROM DRIVE (2/6) SECTION –
• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.
61 61
(Page 60)
(Page 62)
(Page 62)
(Page 62)
CDJ-500
CDJ-500
7-7. SCHEMATIC DIAGRAM – CD-ROM DRIVE (3/6) SECTION –
• See page 57 for Waveforms.
• See page 76 for IC Block Diagrams.
(Page
60)
(Page
61)
(Page
61)
(Page
61)
62 62
(Page 60)
(Page
64)
(Page
64)
(Page
64)
(Page
64)
(Page
66)
(Page
64)
(Page
64)
(Page
64)
CDJ-500
(Page
64)
(Page
64)
7-8. SCHEMATIC DIAGRAM – CD-ROM DRIVE (4/6) SECTION –
• See page 57 for Waveforms.
• See page 78 for IC Block Diagrams.
• See page 83 for IC Pin Functions.
(Page
60)
(Page
64)
(Page 65)
63 63
(Page 65)
(Page 74)
(Page 66)
CDJ-500
7-9. SCHEMATIC DIAGRAM – CD-ROM DRIVE (5/6) SECTION –
• See page 57 for Waveforms.
• See page 78 for IC Block Diagrams.
• See page 86 for IC Pin Functions.
(Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 62) (Page 60)
(Page 65)
64 64
(Page 65) (Page 63) (Page 63) (Page 63)
7-10. SCHEMATIC DIAGRAM – CD-ROM DRIVE (6/6) SECTION –
• See page 57 for Waveforms.
• See page 79 for IC Block Diagrams.
(Page 63)
(Page
64)
(Page 63)
CDJ-500
(Page
64)
65 65
CDJ-500
7-11. SCHEMATIC DIAGRAM – MAIN SECTION –
• See page 80 for IC Block Diagrams.
• See page 88 for IC Pin Functions.
(Page 68)
(Page 74)
(Page 70) (Page 62)
(Page 68) (Page 68)
(Page 68)
(Page 68)
(Page 74)
(Page 68)
(Page 68)
(Page
72)
(Page
72)
(Page
63)
66 66
7-12. PRINTED WIRING BOARD – MAIN SECTION –
• See page 53 for Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
IC601
IC602
IC604
IC605
IC606
IC607
IC608
IC609
IC610
D-4
C-3
C-2
B-2
B-2
D-1
D-1
B-3
B-1
Q601 D-3
(Page
73)
(Page
73)
(Page
58)
(Page 75)
CDJ-500
(Page 75)
(Page 69)
(Page 59)
(Page 69)
(Page 69)
(Page 69)
(Page 69) (Page 69) (Page 69)
• Semiconductor
Location
Ref. No.
Location
IC603 C-2
(Page 71)
67 67
CDJ-500
7-13. SCHEMATIC DIAGRAM – PANEL SECTION –
(Page 60)
(Page 60)
(Page 66)
(Page 72)
(Page 66)
(Page 66)
68 68
(Page 66)
(Page 66)
(Page 66)
(Page 66)
7-14. PRINTED WIRING BOARD – PANEL SECTION –
• See page 53 for Circuit Boards Location.
(Page 58)
(Page 73) (Page 67)
(Page 67)
(Page 58)
(Page 67)
(Page 67)
69 69
(Page 67)
CDJ-500
(Page 67)
(Page 67)
CDJ-500
7-15. SCHEMATIC DIAGRAM – SENSOR SECTION –
70 70
(Page 60)
(Page 66)
7-16. PRINTED WIRING BOARD – SENSOR SECTION –
• See page 53 for Circuit Boards Location.
(Page 71)
71 71
(Page 67)
CDJ-500
CDJ-500
7-17. SCHEMATIC DIAGRAM – SCSI SECTION –
(Page 74)
(Page 68)
(Page 66)
72 72
(Page 66)
7-18. PRINTED WIRING BOARD – SCSI SECTION –
• See page 53 for Circuit Boards Location.
(Page 67)
(Page 69)
(Page 75)
73 73
(Page 73)
CDJ-500
CDJ-500
7-19. SCHEMATIC DIAGRAM – POWER SECTION –
• See page 82 for IC Block Diagrams.
74 74
(Page 63)
(Page 72)
(Page 66)
(Page 66)
7-20. PRINTED WIRING BOARD – POWER SECTION –
• See page 53 for Circuit Boards Location.
(Page 67) (Page 58)
(Page 67)
(Page 73)
• Semiconductor Location
Ref. No.
Location
D902
D903
D904
D905
D906
D907
D-2
B-2
B-3
C-1
C-1
C-1
Ref. No.
Location
D908 C-1
IC901
IC902
IC903
C-2
C-3
B-1
75 75
CDJ-500
CDJ-500
7-21. IC BLOCK DIAGRAMS
• MA-C30 Board
IC101 TA2112FN (EL)
100k
60k 60k
20k
FEO 16
150k
10p
40p
FEN 17
60k
36k
SEB 18
VRO 19
RFRP
BTC
20
21
2VRO
11k
100k
20k
100
20k
20k
20k
RFCT 22
50
µ
A
12k
12k
100k
PKC
RFR PIN
23
24
11k
BOTTOM
PEAK
20k
RFGO
GUP
25
26
12k
5.5k
AGCIN
27
4.9k
RFO 28
GND
29
1.2k
150k
40p
RFN2
30
15k
15k
10k
10k
20
µ
A
50k 50k
36p
30k
20k
16.7k
10p
30k
15p
24k
238k
48k
2.9k
15
14
SBAD
TEO
13k
I–I
13 TEN
12
2VRO
11
TEB
83k
3 STATUE
DET.
1k
1.4k
2.26k
10 SEL
9
LDO
8
MDI
I(1/5)
I(4/5)
7 TNI
238k
15p
I–I
I(1/5)
I(4/5)
6 TPI
5
4
3
2
1
FPI
FNI
GMAD
RFGC
VCC
IC103 LA6539M-TE-L
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
76
IC105 TC4W53FU
VCC CH1 CH0 ADR
8 7 6 5
1 2 3 4
COM INH VEE VSS
IC106 BA6849FP-E2
A3
A2
A1
2
4
7
DRIVER
GAIN
CONTROL
GND 8
TL
HALL AMP
H
1
+ 9
H
1–
10
H
2
+
11
H
2– 12
H
3
+ 13
H
3–
14
TSD
D R
CK
Q
/Q
28 R
NF
27
V
M1
26
V
M2
CURRENT
SENSE AMP
25
V
CC
TORQUE
SENSE AMP
PS
24
FG
23
PS
22 E
C
21 E
CR
V
CC
SHORT BRAKE
HALL BIAS
20 FR
18
SB
17
C
NF
15 V
H
IC107 LA6527N
VCC2
MTR+
GND
GND
1
2
3
4
VCC
34 33 32 31 30 29 28 27 26 25
MPU
I/F
24
VC
BUFFER
23
22
VH+
VH–
VARIABLE
VOLTAGE
REF.
COMP
EDGE
DET
21
GND
COMP
AND
+
2 TO 4 DECODER
VC
MTR–
5
BUFFER
VC 6
DV AMP
7
VC
8 9 10
VC
ER AMP
11 12 13
VL AMP
14 15 16 17
20
19
18
GND
VL–
TKC
76
IC110 MC14066BF
IN/OUT 1
OUT/IN 2
OUT/IN 3
IN/OUT 4
CONTROL IN 5
CONTROL IN 6
V
SS
7
14 V
DD
13 CONTROL IN
12 CONTROL IN
11 IN/OUT
10 OUT/IN
9 OUT/IN
8 IN/OUT
IC201 TC9449AF (BS, D, 24A)
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
DV
DD
BUCK
/CCE
TEST4
/TSMOD
/RST
TEST0
89
90
91
92
85
86
87
88
93
94
95
96
80
81
82
83
84
76
77
78
79
RO
DV
SS
DVR
LO
DV
DD
TEST1
TEST2
TEST3
BUS0
BUS1
BUS2
BUS3
V
DD
V
SS
/HSO
/UHSO
97
98
EMPH
LRCK
99
100
LPF
1 BIT
DAC
CLOCK
GENERATOR
SERVO
CONTROL
MICRO
COMPUTER
INTERFACE
ADDRESS
CIRCUIT
ERROR
CORRECTOR
16K RAM
AUDIO OUTPUT
CIRCUIT
DIGITAL
OUTPUT
ROM
RAM
DIGITAL
EQUALIZER
AUTOMATIC
ALIGNMENT
CIRCUIT
CLV SERVO
SYNC SIGNAL
PROTECT
EFM
DEMODULATOR
PWM
AD
DATA
SLICER
VCO
SUBCODE
DEMODULATOR
STATUS
PLL TMAX
PWM
D/A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
36
35
RFZI
RFCT
34 AV
DD
33
32
RFI
SLCO
31
30
29
28
AV
SS
VCOF
VCOREF
PVREF
27 LPFO
26 LPFN
50
49
48
47
DMO
FVO
FMO
TEBC
46
45
44
43
RFGC
VREF
TRO
42
41
FOO
TEZI
TEI
40
39
TSIN
SBAD
38
37
FEI
RFRP
77
A0
A7
A8
OE
VCAS
LCAS
A1
A2
A3
VCC
VSS
A4
A5
A6
21
22
23
24
25
26
27
28
29
16
17
18
19
20
78
IC301 CXD1818R
GRST
XROF
109
110
TST0
TST1
TST2
111
112
113
TST3
V
SS
114
115
TST4
116
TST5 117
TST6
TST7
V
SS
V
DD
118
119
120
121
XWAT
A0
A1
122
123
124
A2
A3
A4
A5
125
126
127
128
A6
V
SS
129
130
131
D0
D1
D2
132
133
D3
D4
D5
D6
D7
V
SS
V
DD
INT
XCS
141
142
XWR
XRD
143
144
134
135
136
137
138
139
140
108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73
SUB
CPU
I/F
16 BYTE
FIFO
CD DSP
I/F
MICROCODE
CORE
&
REGISTERS
CLOCK
GEN.
VCO
68
67
66
65
72
71
70
69
MDB1
MDB0
V
DD
V
SS
XMWR
XLCAS
XUCAS
XRAS
MA9
MA8
MA7
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
64
63
62
61
60
59
58
57
56
55
54
53
V
V
V
SS
SS
XCD
V
DD
SS
XTL2
AV
DD
AV
SS
AC
CM1
XIO
V
SS
XREQ
MA6
MA5
MA4
MA3
MA2
MA1
MA0
XRES
V
DD
V
SS
CLK
XTL1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
IC302 MSM5416258B-35JDR1
RAS
NC
14
15
/RAS CLOCK
GENERATOR
/CAS CLOCK
GENERATOR
/WE CLOCK
GENERATOR
/OE CLOCK
GENERATOR
REFRESH
COUNTER
9
DATA I/O BUS
COLUMN DECODERS
X
0
Y
0
~Y
8
~X
8
SENSE AMPLIFIERS
512x16
512
MEMORY
ARRAY
256Kx16
I/O BUFFER
13
WE
12
11
NC
NC
I/O 8
I/O 7
I/O 6
I/O 5
NC
I/O 4
I/O 3
I/O 2
I/O 1
VCC
6
5
8
7
2
1
4
3
10
9
30 31 32 33 34 35 36 37 38 39 40
IC303 HD6433032SSNM11F
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
PORT 6
CLOCK
OSCILLATOR
H8/300H CPU
43 42 41
PORT 5
ADDRESS BUS
DATA BUS (HIGH)
DATA BUS (LOW)
BUS
CONTROLLER
P7
2
/AN
2
61
P7
3
/AN
3
62
P7
4
/AN
4
P7
5
/AN
5
P7
6
/AN
6
63
64
P7
7
/AN
7
VREF
AVSS
65
66
67
68
P8
0
/IRQ
0
69
70
P8
1
/IRQ
1
P8
2
/IRQ
2
P8
3
/IRQ
3
71
72
ROM
(MASK ROM)
RAM
16 BIT
INTEGRATED
TIMER UNIT
(ITU)
PROGRAMMABLE
TIMING PATTERN
CONTROLLER
(TPC)
INTERNUPTION
CONTROLLER
WATCH DOG TIMER
(WDT)
SERIAL COMMUNICATION
INTERFACE
(SCI) x 1CH
A/D CONVERTER
PA
PA
2
3
/TP
/TP
2
3
PA
0
/TP
0
/TCLKA
PA
1
/TP
1
/TCLKB
/TIOCA
/TIOCB
PA
PA
5
/TP
5
PA
PA
4
6
7
/TP
/TP
/TP
0
0
4
6
7
/TCLKC
/TCLKD
/TIOCA
/TIOCB
1
/TIOCA
/TIOCB
1
2
2
73
74
75
76
77
78
79
80
PORT B
1 2 3 4 5 6 7 8
PORT 9
9 10 11 12
PORT 3
13 14 15 16 17 18 19 20
29
28
27
26
30 VSS
A
7
/P1
7
A
6
/P1
6
A
5
/P1
5
A
4
/P1
4
25
24
A
3
/P1
3
A
2
/P1
2
23 A
1
/P1
1
22
21
A
0
/P1
VCC
0
40
39
A
17
/P5
2
A
16
/P5
1
38
37
36
35
34
33
32
31
A
A
14
/P2
6
A
A
12
/P2
4
A
11
/P2
3
A
A
A
15
13
10
9
8
/P2
/P2
/P2
/P2
/P2
1
0
7
5
2
IC304 SST29EE512-90-4C-NHTR
26 25 24 23 22 21 20 19 18 17 16 15 14 13
A8 27
A13
A14
28
29
NC
WE
VCC
30
31
32
OE,CE,AND WE
LOGIC
DATA LATCH
INPUT/OUTPUT
BUFFERS
Y-GATING
CELL MATRIX
Y DECODER
X DECODER
1 2 3 4 5 6 7 8 9 10 11 12
79
VIN1 1
FIN1 2
RIN1 3
IOUT
4
VREF 5
VOLTAGE OUTPUT
VREG
6
VCC 7
OUT1+
8
OUT19
• MAIN Board
IC601 BA6287F
OUT1 1
VM 2
VCC 3
TSD
DRIVER DRIVER
CONTROL LOGIC
POWER
SAVE
FIN 4
IC603 BA6780
18
VIN2
17
FIN2
16
RIN2
15
CT2
14 VEE
13 FBIN-
12 FBIN+
11
OUT2+
10
OUT2-
IC604 SN74HC573BNS
8 GND
7 OUT2
6 VREF
5 RIN
D3 5
D4 6
D5
7
D6
8
D7 9
GND 10
OE 1
D0 2
D1 3
D2 4
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
D
G
Q
OE
16
Q3
15 Q4
14 Q5
13 Q6
20 VCC
19 Q0
18 Q1
17 Q2
12
Q7
11 LE
IC605 SN74HC138ANS
VCC
16
Y0
15
Y1
14
Y2
13
DATA OUTPUTS
Y3
12
Y4
11
Y5
10
Y6
9
A
Y0
B
Y1
C
Y2 Y3
G2A G2B
Y4
G1
Y5
Y7
Y6
1
A
2
B
SELECT
3
C
4
G2A
5
G2B
ENABLE
6
G1
OUTPUT
7
Y7
8
GND
IC608 M51953BFP
GND 2
5k
27k
ON/OFF 4
REFERENCE
VOLTAGE
+
–
OVERHEAT
PROTECTION
IN 1
OVERCURRENT
LIMITTER
5 REF
VOL
3 OUT
80
IC602 uPD784031GC-8BT
P32/SCL
P33/SDO/SDA
P34/T00
P35/T01
P36/T02
P37/T03
3
4
5
6
1
2
TIMER/
COUNTER 0
(16 BIT)
80 79
RESET
VDD
X2
X1
VSS
7
8
9
10
11
78 77 76 75 74 73 72 71
PORT 2
UART
CLOCKED
SERIAL I/F
TIMER/COUNTER 2
(16BIT)
70 69 68 67 66 65 64
D/A
CONVERTER
PROGRAMMABLE
INTERRUPT
CONTROLLER
TIMER/COUNTER 1
(16BIT)
A/D
CONVERTER
63 62 61
WATCH
DOG TIMER
UART
P00
P01
P02
P03
P04
P05
P06
P07
12
13
14
15
16
17
18
19
CLOCKED
SERIAL I/F
PWM
PORT 6
BUS VF
PORT 5 PORT 4
P67/REFRQ/HLDAK 20
60
59
58
57
56
55
54
53
52
51
50
49
48
47
P74/AN14
P73/AN13
P72/AN12
P71/AN11
P70/AN10
VDD
P17
P16
P15
P14/Tx02/S02
P13/Rx02/S12
P12/ASCK2/SCK2
P11/PWM1
P10/PWM0
46
45
44
TEST
VSS
ASTB/CLKOUT
43
42
41
P40/A00
P41/A01
P42/A02
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
81
GND 3
INPUT
VOLTAGE/
VCC
4
COMPEN-
SATION
5
• POWER Board
IC901 MC34166D2TR4
VOLTAGE
FEEDBACK
INPUT
1
SWITCH
OUTPUT
2
82
48
49
50
45
46
47
41
42
43
44
38
39
40
35
36
37
31
32
33
34
28
29
30
24
25
26
27
21
22
23
18
19
20
15
16
17
11
12
13
14
8
9
10
5
6
7
Pin No.
1
2
3
4
7-22. IC PIN FUNCTIONS
• IC301 CD-ROM DECODER AND SCSI INTERFACE (CXD1818R) (MA-C30 board)
VDD
XCD
VSS
XREQ
VSS
XIO
XCM1
AC
AVSS
AVDD
XTL2
XTL1
CLK
VSS
VSS
VDD
VSS
XMSG
XSEL
VSS
XATN
VSS
XBSY
VSS
VDD
XACK
XSRS
XDB4
VSS
VSS
VDD
XDB5
VSS
XDB6
VSS
XDB7
VSS
VDD
XDBP
VSS
VSS
VDD
XDB0
Pin Name
VSS
XDB1
VSS
VDD
XDB2
VSS
XDB3
–
O
I
–
I
O
–
I/O
–
I/O
–
I/O
O
I/O
I/O
–
–
–
–
–
I/O
–
–
I/O
I/O
–
I/O
–
–
I/O
–
I/O
I/O
–
I/O
–
–
–
–
I/O
–
–
I/O
–
I/O
/O
I/O
–
–
I/O
–
Function
Ground
Power supply (+5V)
SCSI data bus bit0
Ground
SCSI data bus bit1
Ground
Power supply (+5V)
SCSI data bua bit2
Ground
SCSI data bus bit3
SCSI data bus bit4
Ground
Ground
Power supply (+5V)
SCSI data bus bit5
Ground
SCSI data bus bit6
Ground
SCSI data bus bit7
Ground
Power supply (+5V)
SCSI data bus parity
Ground
SCSI control bus/ATN signal
Ground
SCSI control bus/BSY signal
Ground
Power supply (+5V)
SCSI control bus/ACK signal
SCSI control bus/RST signal
Ground
Ground
Power supply (+5V)
Ground
SCSI control bus/MSG signal
SCSI control bus/SEL signal
Ground
Power supply (+5V)
SCSI control bus/CD signal
Ground
SCSI control bus/REQ signal
Ground
SCSI control bus/IO signal
VCO charge pump output for multiplying
VCO control voltage input for multiplying
Analog ground
Analog power supply (+5V)
Output of crystal oscillating circuit
Input of crystal oscillating circuit
Clock output
83
94
95
96
91
92
93
97
98
99
100
87
88
89
90
84
85
86
81
82
83
78
79
80
74
75
76
77
71
72
73
67
68
69
70
64
65
66
61
62
63
57
58
59
60
Pin No.
51
52
53
54
55
56
VDD
EXCK
SBIN
SBSY
WFCK
C2P0
BCLK
DATA
LRCK
VSS
DSPCK
GSCR
MDB5
MDB6
MDB7
VSS
MDB8
MDB9
MDBA
MDBB
MDBC
MDBD
MDBE
MDBF
VSS
MA8
MA9
XRAS
XUCAS
XLCAS
XMWR
VSS
VDD
MDB0
MDB1
MDB2
MDB3
MDB4
MA2
MA3
MA4
MA5
MA6
VSS
MA7
VSS
VDD
XRES
MA0
MA1
Pin Name
84
–
I
I
I
I
I
I
I
I
I
–
–
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
–
I/O
I/O
O
–
–
I/O
I/O
I/O
I/O
O
O
O
–
O
O
O
O
O
O
O
O
O
I/O
–
–
I
O
Function
Ground
Power supply (+5V)
CXD1804R reset signal
Address bus output bit0 to buffer memory
Address bus output bit1 to buffer memory
Address bus output bit2 to buffer memory
Address bus output bit3 to buffer memory
Address bus output bit4 to buffer memory
Address bus output bit5 to buffer memory
Address bus output bit6 to buffer memory
Ground
Address bus output bit7 to buffer memory
Address bus output bit8 to buffer memory
Address bus output bit9 to buffer memory
Buffer memory RAS (Row Address Strobe) signal
Buffer memory CAS (Column Address Strobe) signal
Buffer memory CAS (Column Address Strobe) signal
Buffer memory data write strobe signal
Ground
Power supply (+5V)
Buffer memory data bus bit0
Buffer memory data bus bit1
Buffer memory data bus bit2
Buffer memory data bus bit3
Buffer memory data bus bit4
Buffer memory data bus bit5
Buffer memory data bus bit6
Buffer memory data bus bit7
Ground
Buffer memory data bus bit8
Buffer memory data bus bit9
Buffer memory data bus bit10
Buffer memory data bus bit11
Buffer memory data bus bit12
Buffer memory data bus bit13
Buffer memory data bus bit14
Buffer memory data bus bit15
Ground
Power supply (+5V)
SBIN reading clock (Connected to CXD3000 EXCK pin/pin 65)
Subcode serial signal (Connected to CXD3000 SBSO pin/pin 64)
Subcode sync signal (Connected to CXD3000 SBSY pin/pin 63)
Write frame clock (Connected to CXD3000 WFCK pin/pin 62)
C2 pointer signal, indicating an error in MDAT.
Bit clock, MDAT strobe signal
Serial data stream from DSP for CD
LR signal, indicating Lch and Rch of MDAT.
Ground
Enter DSP clock
SCOR syncronizing with DSP data output (Connected to CXD3000 GRSCOR pin/pin 113)
132
133
134
135
136
137
125
126
127
128
129
130
131
138
139
140
141
142
143
144
118
119
120
121
122
123
124
111
112
113
114
115
116
117
Pin No.
101
102
103
104
105
106
107
108
109
110
D2
D3
D4
D5
D6
D7
VSS
A4
A5
A6
VSS
D0
D1
VDD
INT
XCS
XWR
XRD
VSS
VDD
XWAT
A0
A1
A2
A3
SD2
SD3
VSS
SD4
SD5
SD6
SD7
DATO
Pin Name
XLAT
DSTB
VSS
VDD
BCKO
DACD
LRCO
GRST
XROF
SD0
SD1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
–
I/O
I
I
I
I
I
I
I
–
–
O
O
I
I
I
–
–
I
I
–
I
I
I
I
O
I
I
O
O
O
I/O
O
–
–
O
O
Function
Serial data output from sub CPU to CD DSP
DAT0 latch signal. Latch at leading edge
DAT0 transfer clock
Ground
Power supply (+5V)
Bit clock (Connected to CXD3000 BCKI pin/pin 30)
Audio data output to DAC (Connected to CXD3000 PCMDI pin/pin 28)
LR clock output to DAC (Connected to CXD3000 LRCKI pin/pin 26)
Output for GRSCOR resyncronizing (Connected to CXD3000 SCSY pin/pin 68)
DSP RAM Overflow input (Connected to CXD3000/ROF pin/pin 45)
Test pin0
Test pin1
Test pin2
Test pin3
Ground
Test pin4
Test pin5
Test pin6
Test pin7
Ground
Power supply (+5V)
Wait signal for sub CPU buffer memory access
CXD1804R built-in register address bus0
CXD1804R built-in register address bus1
CXD1804R built-in register address bus2
CXD1804R built-in register address bus3
CXD1804R built-in register address bus4
CXD1804R built-in register address bus5
CXD1804R built-in register address bus6
Ground
Sub CPU data bus0
Sub CPU data bus1
Sub CPU data bus2
Sub CPU data bus3
Sub CPU data bus4
Sub CPU data bus5
Sub CPU data bus6
Sub CPU data bus7
Ground
Power supply (+5V)
Interruption to sub CPU
CXD1804R chip select signal
CXD1804R built-in register write signal
CXD1804R built-in register read signal
85
• IC305 GATA ARRAY (BU6260AKV) (MA-C30 board)
XCS2
XRD
XWR
XAIR
XINT
SFSY
SBS
SBCK
FGIN
SBOK
A1
A2
A3
A4
A17
A18
A19
D2
D3
D4
D5
D6
D7
A0
BUS2
BUS1
BUS0
GND
D0
D1
RSTB
VAIN
TST1
SBSY
XCCE
BUCK
BUS3
XULD
Pin Name
XLD
XUSL
XSLT
XEJC
XHMT
XAMT
XTOUT
XLDO
GND
VDD
XDRS
PRST
44
45
46
47
41
42
43
48
49
50
38
39
40
34
35
36
37
31
32
33
28
29
30
25
26
27
21
22
23
24
18
19
20
14
15
16
17
11
12
13
8
9
10
Pin No.
1
2
3
6
7
4
5
I
I
I
O
I
I
I
I
O
I
I
I
I
I
I
I
I/O
I
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
I/O
I/O
I/O
I/O
–
I
I
I
–
O
O
I/O
O
O
–
I
O
O
I/O
I
I
I
I
CPU data bus
CPU data bus
CPU data bus
CPU data bus
CPU data bus
CPU data bus
CPU address bus
CPU address bus
CPU address bus
CPU address bus
CPU address bus
CPU address bus
CPU address bus
CPU address bus
Monet chip enable
CPU read strobe
CPU write strobe
Power supply
CPU interrupt
DSP
DSP
DSP
Spindle driver
DSP
Switch
Switch
Ground
Ground
Switch
Headphone mute
Audio mute
LED
LED
Ground
Power supply
DSP reset
CPU/Monet reset
Reset
Reset
Not used
DSP subcode sync
DSP
DSP
DSP
DSP
DSP
DSP
Ground
CPU data bus
CPU data bus
86
Function
Pin No.
51
52
53
54
58
59
60
55
56
57
61
62
63
64
EXC1
GND
TEST
PWM1
DCK
CCK
PWM0
GN1 O
Pin Name
GN0 O
CLV0
CAV0
CAV
VDD
EXC0
O
O
O
I
–
I
O
O
O
–
O
I/O
O
O
O
Spindle driver 1 on
Spindle driver 0 on
CLV on
CAV on
Spindle control
Power supply
33.86MHz
16.93MHz
Ground
Ground
Control the outside spindle motor
DSP clock 33.86MHz
DSP clock 33.86MHz
Control the outside spindle motor
Function
87
46
47
48
49
50
43
44
45
40
41
42
37
38
39
33
34
35
36
30
31
32
27
28
29
23
24
25
26
20
21
22
16
17
18
19
13
14
15
10
11
12
7
8
9
Pin No.
1
2
5
6
3
4
• IC609 SCSI CONTROL (SYM53CF92A) (MAIN board)
RD
CS
CLK
A0
A1
I_O
VDD
MODE
INT
VSS
RESET
WR
RST
MSG
SEL
VSS
C_D
REQ
VSS
SD7
SDP
ATN
BSY
VSS
ACK
SD1
SD2
VSS
SD3
SD4
SD5
SD6
VSS
DB6
DB7
DBP
VDD
SD0
DB0
DB1
DB2
VSS
DB3
DB4
DB5
VSS
DREQ
Pin Name
DACK
DBWR
VDD
I
I
I
I
I
I
I
I
I
–
I/O
I
–
I/O
O
I/O
–
O
–
O
O
I/O
I/O
I
I/O
–
I/O
I/O
I/O
I/O
–
I/O
I/O
I/O
–
I/O
I/O
I/O
I/O
–
I/O
I/O
I/O
–
I/O
–
O
I
I
–
I/O
Ground
SCSI data signal
SCSI data signal
Schmitt trigger input
SCSI output
Ground
SCSI output
SCSI output
SCSI phase signal
Selector signal
Ground
SCSI phase signal
SCSI output
SCSI phase signal
+5V Power supply
Mode selector
Interrupt status input
Ground
Reset signal input
Write signal input
Read signal input
Select signal input
Clock signal input
Address inputs
Address inputs
Ground
Not used
DMA controller
DMA write signal
+5V Power supply
DMA data bus
DMA data bus
DMA data bus
Ground
DMA data bus
DMA data bus
DMA data bus
Ground
DMA data bus
DMA data bus
Odd parity for DB7–0
Power supply
SCSI data signal
SCSI data signal
SCSI data signal
Ground
SCSI data signal
SCSI data signal
SCSI data signal
SCSI data signal
88
Function
60
61
62
63
57
58
59
64
Pin No.
51
52
53
54
55
56
PAD1
PAD2
PAD3
VSS
PAD4
PAD5
VSS
A2
A3
TEST
PAD0
Pin Name
PAD6
PAD7
VDD
I/O
I/O
I/O
I/O
–
I/O
I/O
I/O
–
I
I
–
I/O
I/O
–
Ground
Address inputs
Address inputs
Ground
Processor address data
Processor address data
Processor address data
Processor address data
Ground
Processor address data
Processor address data
Processor address data
Processor address data
Power supply
Function
89
SECTION 8
EXPLODED VIEWS
NOTE:
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
• The mechanical parts with no reference number in the exploded views are not supplied.
• Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.
• Abbreviation
CND : Canadian model
8-1. CASE SECTION
1
2
2
2
The components identified by mark ! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
20
#3 not supplied
7
3
4
2
#3
14
#3
8
#3
9
5
#3
#3
15
#3
#3
11
10
18
not supplied
19
#3 not supplied
17
not supplied
17
16
12
13
4
#3
4
#3
#3
6
not supplied
#3
#1
#3
#3
#3
#3
#3
#3
#2 not supplied
FRONT PANEL
#9
* 1
2
* 3
4
* 5
Ref. No.
Part No.
Description
4-214-126-01 CASE
3-704-366-41 SCREW (CASE) (M3X6)
4-214-105-01 COVER (PS)
4-951-620-41 SCREW (2.6), +BVTP
4-224-380-01 PANEL, BACK
6
* 7
* 8
* 9
* 10
3-703-244-00 BUSHING (2104), CORD
1-672-165-11 LED BOARD
1-672-159-11 AC FILTER BOARD
1-672-162-11 D.SW BOARD
1-672-364-11 SCSI IN BOARD
Remark Ref. No.
Part No.
* 11
* 12
* 13
14
15
Description
1-672-365-11 SCSI OUT BOARD
1-672-161-11 P.JACK BOARD
1-672-166-11 DOUT BOARD
1-790-228-11 CORD (WITH CONNECTOR)
X-4948-515-1 ILLUMINATION ASSY
16
* 17
* 18
* 19
20
X-4946-543-2 FOOT (SMALL) ASSY
4-978-398-21 CUSHION
3-703-150-11 CLAMP
4-988-534-01 COVER, MOTOR
1-783-531-41 CORD, POWER
Remark
90
8-2. FRONT PANEL SECTION
52
#4
#4 not supplied
54
65
55
56
65
57
65
58
65
not supplied
#7
62
65
59
65
not supplied
#8
60
65
#7
70
#7
61
not supplied
64
65
M901
66
65
63
65
65
65
65
65
#5
67
not supplied
#4 not supplied
68
69
53
51
Ref. No.
Part No.
51
52
53
54
55
Description
X-4950-435-1 DOOR ASSY
4-212-610-01 SHIELD (W)
4-933-134-71 SCREW (+PTPWH M2.6X6)
X-4952-278-1 PANEL ASSY, FRONT
4-212-602-01 BUTTON (POWER)
* 56
* 57
58
59
60
1-672-160-11 P.SW BOARD
4-213-893-02 COVER (PW)
4-212-611-01 LEVER (LOCK)
4-212-613-01 SPRING, TORSION
4-212-600-01 GEAR (CAM)
Remark Ref. No.
Part No.
61
62
63
* 64
65
Description
4-212-612-01 GEAR (A)
X-4950-368-1 BRACKET (DL) ASSY
3-354-963-32 DAMPER
A-4724-449-A KEY (A) BOARD, COMPLETE
4-217-468-01 SCREW (2.6X8)
* 66
67
68
69
70
1-672-164-11 DOOR.M BOARD
4-212-818-01 CUSHION (W)
4-212-819-01 CUSHION (B)
4-217-302-01 CUSHION (B2)
X-4951-511-1 DOOR MOTOR ASSY
* M901 1-541-590-11 MOTOR, DC
Remark
91
8-3. CHASSIS SECTION
102
101
#10
#9
#9
#9
114
108
not supplied
#3
105
106
114
#3
#3
103
104
#9
107
not supplied not supplied
T901 not supplied
#3
#3
#3
#3
#9
#9 not supplied
#3
109
not supplied
104
not supplied
#3
114
#3
#3
111
110
113
114
not supplied
112
Ref. No.
Part No.
101
102
103
* 104
105
Description
4-214-144-01 TABLE (50)
4-957-577-11 SCREW PTP WH (2.6X8) (DIA. 10)
4-951-620-41 SCREW (2.6), +BVTP
3-703-150-11 CLAMP
4-214-145-01 RING (A)
106
107
4-214-107-01 RING (B2)
4-988-439-01 HOLDER, TABLE
The components identified by mark
! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque ! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
Remark Ref. No.
Part No.
108
* 109
110
Description
4-214-106-01 CUSHION (RING)
A-4724-442-A POWER (A) BOARD, COMPLETE
1-790-229-11 WIRE (FLAT TYPE) (9 CORE)
Remark
111
112
* 113
! T901
114
1-790-230-11 WIRE (FLAT TYPE) (12 CORE)
1-790-231-11 WIRE (FLAT TYPE) (12 CORE)
A-4724-461-A MAIN BOARD, COMPLETE
1-433-542-11 TRANSFORMER, POWER
3-970-608-41 +BV SUMITITE (B3)
92
8-4. MECHANISM DECK SECTION-1 (CDM-56)
229
211
206
205
202 203
207
228
226
211
233
227
#11
224
#12 not supplied
223
#16
#15
225
228
237
221
#14
216
222
219
#15
#14
220
#13
#16
218
#13
212
#13
213
217
215
214
230
231
232
not supplied
#16
#15
204 208
209
210
211
#15
201
#15
#16
#16
236
#16
233
not supplied not supplied
235
233
234
#16 not supplied
* 206
207
208
209
210
211
212
213
214
215
216
* 217
218
219
Ref. No.
Part No.
* 201
* 202
203
204
205
Description
1-672-171-11 CHUCK SW BOARD
4-988-427-01 COVER, CAM
4-988-420-01 SLIDER (LOADING)
4-214-140-01 SPRING (LD), TORSION
4-218-013-01 HOLDER (A2), DISC
4-988-417-01 SLIDER (CAM)
4-988-433-01 SLIDER (LOCK)
X-4950-568-1 LEVER (LD) ASSY
4-214-141-01 SPRING (LEVER), TENSION
4-214-120-01 SPRING, HOLDER RETURN
4-214-138-01 CUSHION (BU)
4-213-445-01 BASE, LOADING
4-214-117-01 SPRING (BU), LEAF
4-988-419-01 HOLDER (B), DISC
4-988-431-01 ROLLER (DISC)
4-992-069-01 SCREW (+PTPWH) (M2) (DIA. 7)
4-988-454-01 COVER (LEVER)
4-213-447-01 HOLDER (MAGNET)
A-4672-779-A PULLEY ASSY, CHUCKING
Remark
231
232
233
* 234
* 235
* 236
* 237
221
222
* 223
224
225
226
227
228
229
230
Ref. No.
Part No.
220
Description
4-214-316-01 COVER (PULLEY)
3-910-095-11 RUBBER, VIBRATION PROOF
X-4950-566-1 BRACKET (DS) ASSY
1-672-170-11 DISC SENSOR (S) BOARD
4-214-267-01 BALANCER (K2)
4-214-268-01 BALANCER (K3)
4-214-269-01 BALANCER (K4)
4-974-711-01 SCREW (2X5)(P TYIGHT),(+)PTTWH
4-981-923-01 SCREW (M), STEP
X-4950-567-1 HOLDER ASSY, BU
7-624-101-04 STOP RING 1.2 (E TYPE)
Remark
4-214-137-01 ROLLER (MG)
X-4950-569-1 SUPPORT (MG) ASSY
4-957-577-11 SCREW PTP WH (2.6X8) (DIA. 10)
A-4724-437-A MA-C30 (A) BOARD, COMPLETE
4-214-119-01 COVER, PC BOARD
4-214-118-01 SHEET (CDM)
4-976-473-01 HOLDER (LED-S)
93
8-5. MECHANISM DECK SECTION-2 (CDM-56)
251 252
253
254
255
254
256
257
252
#18
258
259
252
260
M62
261
#17
M61
262
Ref. No.
Part No.
* 251
252
253
254
255
Description
1-672-168-11 TABLE SENSOR BOARD
4-219-823-01 SCREW (+PTPWH 2.6X8 B TYTE)
4-214-143-01 BELT
4-988-425-01 PULLEY
4-988-424-01 GEAR (TABLE)
256 4-988-423-01 GEAR (A) (LOADING)
Remark Ref. No.
Part No.
257
* 258
259
* 260
Description
4-988-432-01 GEAR (B) (LOADING)
1-672-169-11 DISC SENSOR (R) BOARD
8-729-926-31 PHOTO TRANSISTOR PT483F1
4-990-669-01 HOLDER (SENSOR)
* 261
* 262
M61
M62
4-988-426-01 BASE (CDM)
1-672-167-11 MOTOR BOARD
X-4591-512-1 MOTOR ASSY (LOADING)
X-4591-512-1 MOTOR ASSY (TABLE)
Remark
94
8-6. BASE UNIT SECTION (BU-24)
312
313
314
not supplied
315
301
301
M101 not supplied not supplied
301
302
317
301
310
304
303
311
305
306
307
308
309
318
#11 not supplied
317
317
M102
Ref. No.
Part No.
301
302
* 304
305
306
Description
4-974-711-01 SCREW (2X5) (P TYGHT), (+) PTTWH
1-777-692-11 WIRE (FLAT TYPE) (11 CORE)
4-974-724-01 SHAFT (MAIN)
4-992-850-02 GEAR, RACK
4-214-266-01 CUSHION (K)
Remark
307
! 308
309
* 310
* 311
4-992-851-01 SPRING, COMPRESSION
1-758-088-11 OPTICAL PICK-UP SPU-3212
1-782-368-12 WIRE (FLAT TYPE) (16 CORE)
4-214-264-01 PLATE, SHIELD
A-4724-441-A SE-C7 BOARD, COMPLETE
The components identified by mark
! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
Ref. No.
Part No.
312
313
* 314
315
317
Description
A-4683-010-A GEAR ASSY, LIMITTER
4-974-767-01 SPRING, COMPRESSION
4-973-786-01 GEAR (S-C1)
A-4683-012-A GEAR ASSY (B), LIMITTER
4-993-513-03 INSULATOR (K)
Remark
318
303
4-974-725-01 SCREW (M1.7X2.5), P
1-790-251-11 WIRE (FLAT TYPE) (11 CORE)
M101 A-4672-641-A SPINDLE ASSY (SPINDLE)
* M102
X-4951-510-1 MOTOR, DC (SLED)
95
AC FILTER
D.OUT
CHUCK SW
D.SW
SECTION 9
ELECTRICAL PARTS LIST
Note:
The components identified by mark
! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
When indicating parts by reference number, please include the board name.
• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
• -XX, -X mean standardized parts, so they may have some difference from the original one.
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
• RESISTORS
All resistors are in ohms
METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
• SEMICONDUCTORS
In each case, u: µ , for example: uA...: µ A..., uPA...: µ PA..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD...
• CAPACITORS uF : µ F
• COILS uH : µ H
• Abbreviation
CND : Canadian model
Ref. No.
Part No.
*
Description
1-672-159-11 AC FILTER BOARD
***************
< CAPACITOR >
! C902
! C903
! C904
! C905
! C906
! C907
1-113-925-11 CERAMIC
1-113-925-11 CERAMIC
1-113-920-11 CERAMIC
1-113-920-11 CERAMIC
1-113-920-11 CERAMIC
1-113-920-11 CERAMIC
< CONNECTOR >
0.0022uF
20%
Remark
0.01uF
0.01uF
20% 250V
20% 250V
0.0022uF
20% 250V
0.0022uF
20% 250V
0.0022uF
20% 250V
250V
Ref. No.
*
C455 1-163-038-91 CERAMIC CHIP 0.1uF
C456 1-126-964-11 ELECT
C457
* CN452
Part No.
Description
1-672-166-11 D.OUT BOARD
***********
< CAPACITOR >
1-163-038-91 CERAMIC CHIP
< CONNECTOR >
1-568-941-11 PIN, CONNECTOR 3P
< IC >
IC451 8-749-921-12 IC GP1F32T
10uF
0.1uF
* CN902
1-580-230-11 PIN, CONNECTOR (PC BOARD) 2P
CN903 1-564-321-00 PIN, CONNECTOR 2P
* CN904
1-568-226-11 PIN, CONNECTOR 2P
< COMPOSITION CIRCUIT BLOCK >
CP902 1-537-771-21 TERMINAL BOARD, GROUND
< FUSE >
20%
Remark
25V
50V
25V
**************************************************************
*
1-672-162-11 D.SW BOARD
**********
< CAPACITOR >
! F901
FH901
FH902
1-532-388-51 FUSE (2A/250V)
< FUSE HOLDER >
1-533-293-11 FUSE HOLDER
1-533-293-11 FUSE HOLDER
< TRANSFORMER >
T902
! T901
1-416-321-11 COIL, LINE FILTER
1-433-542-11 TRANSFORMER, POWER
**************************************************************
*
1-672-171-11 CHUCK SW BOARD
**************
< CONNECTOR >
* CN54
S51
S52
1-568-941-11 PIN, CONNECTOR 3P
< SWITCH >
1-571-958-11 SWITCH, PUSH (1 KEY)(UP)
1-571-958-11 SWITCH, PUSH (1 KEY)(DOWN)
C704 1-163-038-91 CERAMIC CHIP 0.1uF
C705 1-163-038-91 CERAMIC CHIP 0.1uF
C706 1-163-038-91 CERAMIC CHIP 0.1uF
C707 1-163-038-91 CERAMIC CHIP 0.1uF
C708 1-163-038-91 CERAMIC CHIP 0.1uF
C709 1-163-038-91 CERAMIC CHIP 0.1uF
C710 1-163-038-91 CERAMIC CHIP 0.1uF
C711 1-163-038-91 CERAMIC CHIP 0.1uF
C712 1-163-038-91 CERAMIC CHIP 0.1uF
C713 1-163-038-91 CERAMIC CHIP 0.1uF
C751
C752
C753
CN702 1-779-549-11 CONNECTOR,FFC(LIF(NON-ZIF))12P
CN703 1-506-481-11 PIN, CONNECTOR 2P
CP701
CP702
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
< CONNECTOR >
0.1uF
0.1uF
0.1uF
< COMPOSITION CIRCUIT BLOCK >
1-537-771-21 TERMINAL BOARD, GROUND
1-537-771-21 TERMINAL BOARD, GROUND
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
**************************************************************
< JUMPER RESISTOR >
JC701 1-216-295-91 SHORT 0
96
Ref. No.
Part No.
Description
< SWITCH >
D.SW
Remark
DISC SENSOR (R)
DOOR MOTOR
Ref. No.
Part No.
KEY
Description
< SWITCH >
DISC SENSOR (S)
LED MA-C30
Remark
S706 1-570-598-11 SWITCH, DIP
S707 1-554-556-00 SWITCH, DIP
**************************************************************
*
1-672-169-11 DISC SENSOR (R) BOARD
*********************
S701 1-762-149-11 SWITCH, PUSH (1 KEY)(DOOR)
S702 1-762-936-11 SWITCH, LEVER (DOOR MOTOR)
S703 1-554-303-21 SWITCH, TACTILE (OPEN)
S704 1-554-303-21 SWITCH, TACTILE (DISC SKIP -)
S705 1-554-303-21 SWITCH, TACTILE (DISC SKIP +)
**************************************************************
************************************************************** *
*
*
1-672-170-11 DISC SENSOR (S) BOARD
*********************
4-976-473-01 HOLDER (LED-S)
1-672-165-11 LED BOARD
*********
< CONNECTOR >
CN841 1-506-481-11 PIN, CONNECTOR 2P
* CN53
< CONNECTOR >
1-568-951-11 PIN, CONNECTOR 2P
< DIODE >
*
D51
R54
8-719-055-84 DIODE GL-528VS1
< RESISTOR >
1-259-151-21 CARBON 220 5% 1/4W
R841 1-216-029-00 METAL CHIP
R842 1-216-029-00 METAL CHIP
R843 1-216-029-00 METAL CHIP
************************************************************** **************************************************************
1-672-164-11 DOOR MOTOR BOARD
****************
*
A-4724-437-A MA-C30 BOARD, COMPLETE
**********************
< CAPACITOR >
150
150
150
5%
5%
5%
1/10W
1/10W
1/10W
< CONNECTOR >
* CN705 1-568-951-11 PIN, CONNECTOR 2P
< DIODE >
D841 8-719-058-17 DIODE LNG401NPYJA
D842 8-719-058-17 DIODE LNG401NPYJA
D843 8-719-058-17 DIODE LNG401NPYJA
< RESISTOR >
**************************************************************
*
C701
C702
A-4724-449-A KEY BOARD, COMPLETE
*******************
< CAPACITOR >
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
0.1uF
0.1uF
C703 1-163-038-91 CERAMIC CHIP 0.1uF
25V
25V
25V
C101 1-164-004-11 CERAMIC CHIP 0.1uF
C102 1-164-004-11 CERAMIC CHIP 0.1uF
C103 1-124-778-00 ELECT CHIP
C104 1-124-778-00 ELECT CHIP
22uF
22uF
C105 1-164-004-11 CERAMIC CHIP 0.1uF
C106 1-124-778-00 ELECT CHIP 22uF
C107 1-163-038-91 CERAMIC CHIP 0.1uF
C108 1-164-505-11 CERAMIC CHIP 2.2uF
C110 1-164-505-11 CERAMIC CHIP 2.2uF
C111 1-164-004-11 CERAMIC CHIP 0.1uF
10% 25V
10% 25V
20% 6.3V
20% 6.3V
10% 25V
20% 6.3V
25V
16V
16V
10% 25V
CN701
< CONNECTOR >
1-778-720-11 CONNECTOR, FFC/FPC 9P
< DIODE >
D701 8-719-018-46 DIODE SEL3510C-CD (POWER)
D702 8-719-023-94 DIODE SEL3910A-CD (DRIVE)
D703 8-719-023-95 DIODE SEL3710K-CD (CHANGER)
C112 1-164-489-11 CERAMIC CHIP 0.22uF
C113 1-164-489-11 CERAMIC CHIP 0.22uF
C114 1-164-489-11 CERAMIC CHIP 0.22uF
C115 1-163-038-91 CERAMIC CHIP 0.1uF
C116 1-163-227-11 CERAMIC CHIP 10PF
C118 1-163-087-00 CERAMIC CHIP 4PF
C120 1-163-038-91 CERAMIC CHIP 0.1uF
C121 1-163-038-91 CERAMIC CHIP 0.1uF
C122 1-163-038-91 CERAMIC CHIP 0.1uF
C123 1-163-038-91 CERAMIC CHIP 0.1uF
10% 16V
10% 16V
10% 16V
25V
0.5PF
50V
50V
25V
25V
25V
25V
< TRANSISTOR >
Q701 8-729-424-08 TRANSISTOR UN2111
< RESISTOR >
R701 1-216-031-00 METAL CHIP
R702 1-216-033-00 METAL CHIP
R703 1-216-033-00 METAL CHIP
180
220
220
5%
5%
5%
1/10W
1/10W
1/10W
C124 1-163-038-91 CERAMIC CHIP 0.1uF
C125 1-164-346-11 CERAMIC CHIP 1uF
25V
16V
C126 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C127 1-163-023-00 CERAMIC CHIP 0.015uF
5% 50V
C129 1-164-004-11 CERAMIC CHIP 0.1uF
10% 25V
C130 1-163-038-91 CERAMIC CHIP 0.1uF
C131 1-163-038-91 CERAMIC CHIP 0.1uF
25V
25V
97
MA-C30
Ref. No.
Part No.
Description
C132 1-163-007-11 CERAMIC CHIP 680PF
C134 1-163-038-91 CERAMIC CHIP 0.1uF
C138 1-163-031-11 CERAMIC CHIP 0.01uF
C139
C140
C141
C142
C143
1-163-031-11 CERAMIC CHIP
1-163-031-11 CERAMIC CHIP
1-163-021-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
0.01uF
0.01uF
0.01uF
0.1uF
0.1uF
Remark Ref. No.
Part No.
10% 50V
25V
50V
C235
C236
C238
Description
1-163-251-11 CERAMIC CHIP
1-163-251-11 CERAMIC CHIP
1-164-004-11 CERAMIC CHIP
C240 1-124-778-00 ELECT CHIP
100PF
100PF
0.1uF
22uF
5%
5%
10%
20%
Remark
50V
50V
25V
6.3V
C241 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V 50V
50V
10% 50V
25V
25V
C144 1-164-182-11 CERAMIC CHIP 0.0033uF
10% 50V
C145 1-164-182-11 CERAMIC CHIP 0.0033uF
10% 50V
C147 1-163-133-00 CERAMIC CHIP 470PF
C148 1-126-395-11 ELECT 22uF
5%
20%
50V
16V
C149 1-163-014-00 CERAMIC CHIP 0.0027uF
10% 50V
C153 1-163-038-91 CERAMIC CHIP 0.1uF
25V
C154 1-163-014-00 CERAMIC CHIP 0.0027uF
10% 50V
C155 1-163-014-00 CERAMIC CHIP 0.0027uF
10% 50V
C156 1-163-014-00 CERAMIC CHIP 0.0027uF
10% 50V
C157 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V
C158 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V
C159 1-163-038-91 CERAMIC CHIP 0.1uF
25V
C160 1-163-038-91 CERAMIC CHIP 0.1uF
C166 1-107-823-11 CERAMIC CHIP 0.47uF
10%
25V
16V
C167 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V
C168 1-163-038-91 CERAMIC CHIP 0.1uF
C169 1-164-346-11 CERAMIC CHIP 1uF
C170 1-163-275-11 CERAMIC CHIP 0.001uF
5%
C171 1-163-275-11 CERAMIC CHIP 0.001uF
5%
C173 1-163-235-11 CERAMIC CHIP 22PF 5%
25V
16V
50V
50V
50V
C176 1-163-038-91 CERAMIC CHIP 0.1uF
C177 1-163-038-91 CERAMIC CHIP 0.1uF
25V
25V
C178 1-163-038-91 CERAMIC CHIP 0.1uF
25V
C179 1-164-161-11 CERAMIC CHIP 0.0022uF
10% 100V
C180 1-164-004-11 CERAMIC CHIP 0.1uF
10% 25V
C181 1-163-038-91 CERAMIC CHIP 0.1uF
C182 1-163-038-91 CERAMIC CHIP 0.1uF
C201 1-164-505-11 CERAMIC CHIP 2.2uF
C204 1-163-243-11 CERAMIC CHIP 47PF
C205 1-163-243-11 CERAMIC CHIP 47PF
5%
5%
25V
25V
16V
50V
50V
C242
C301
C302
C303 1-163-038-91 CERAMIC CHIP 0.1uF
C305 1-163-038-91 CERAMIC CHIP 0.1uF
C306
C307
C308
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-141-00 CERAMIC CHIP
1-164-346-11 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
0.1uF
0.1uF
0.001uF
1uF
0.1uF
0.1uF
C309 1-163-038-91 CERAMIC CHIP 0.1uF
C310 1-164-004-11 CERAMIC CHIP 0.1uF
C311
C312
C313
C314 1-163-038-91 CERAMIC CHIP 0.1uF
C315 1-163-038-91 CERAMIC CHIP 0.1uF
C316
C318
C319
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
0.1uF
0.1uF
0.1uF
C330 1-163-038-91 CERAMIC CHIP 0.1uF
C332 1-163-038-91 CERAMIC CHIP 0.1uF
C333
C334
C335
1-164-505-11 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-115-565-11 CERAMIC CHIP
2.2uF
0.1uF
2.2uF
C336 1-164-346-11 CERAMIC CHIP 1uF
5%
25V
25V
50V
25V
25V
16V
25V
25V
25V
10% 25V
10%
C340 1-163-017-00 CERAMIC CHIP 0.0047uF
5%
C342
C501
C502
1-164-346-11 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
C701 1-126-204-11 ELECT CHIP
C702 1-126-392-11 ELECT CHIP
C703
C704
C705
1-163-038-91 CERAMIC CHIP
1-163-224-11 CERAMIC CHIP
1-163-224-11 CERAMIC CHIP
1-163-038-91 CERAMIC CHIP
1-126-392-11 ELECT CHIP
1-163-038-91 CERAMIC CHIP
1uF
0.1uF
0.1uF
0.1uF
7PF
7PF
47uF
100uF
0.1uF
100uF
0.1uF
25V
25V
25V
25V
25V
16V
25V
10V
25V
25V
16V
25V
25V
16V
50V
0.25PF 50V
0.25PF 50V
20%
20%
20%
25V
16V
6.3V
25V
6.3V
25V
C208 1-163-019-00 CERAMIC CHIP 0.0068uF
10% 50V
C209 1-163-021-91 CERAMIC CHIP 0.01uF
10% 50V
C210 1-163-014-00 CERAMIC CHIP 0.0027uF
10% 50V
C211 1-163-017-00 CERAMIC CHIP 0.0047uF
5% 50V
C213 1-164-505-11 CERAMIC CHIP 2.2uF
16V
C214 1-164-004-11 CERAMIC CHIP 0.1uF
C217 1-163-038-91 CERAMIC CHIP 0.1uF
10% 25V
25V
C218 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V
C219 1-163-809-11 CERAMIC CHIP 0.047uF
10% 25V
C220 1-163-038-91 CERAMIC CHIP 0.1uF
25V
< CONNECTOR >
* CNJ101 1-770-415-11 CONNECTOR, FFC/FPC 11P
CNJ102 1-770-674-11 CONNECTOR, FFC/FPC 16P
* CNJ103 1-770-415-11 CONNECTOR, FFC/FPC 11P
* CNJ104 1-564-518-11 PLUG, CONNECTOR 3P
CNJ105 1-770-695-11 CONNECTOR, FFC/FPC 12P
C221 1-163-275-11 CERAMIC CHIP 0.001uF
5%
C222 1-164-346-11 CERAMIC CHIP 1uF
C223 1-164-004-11 CERAMIC CHIP 0.1uF
C224 1-164-004-11 CERAMIC CHIP 0.1uF
C227 1-164-004-11 CERAMIC CHIP 0.1uF
C228 1-164-004-11 CERAMIC CHIP 0.1uF
C229 1-164-004-11 CERAMIC CHIP 0.1uF
C230 1-164-004-11 CERAMIC CHIP 0.1uF
C233 1-115-363-11 CERAMIC CHIP 10uF
C234 1-115-363-11 CERAMIC CHIP 10uF
10%
10%
10%
10%
10%
10%
50V
16V
25V
25V
25V
25V
25V
25V
10V
10V
* CNJ107 1-568-941-11 PIN, CONNECTOR 3P
* CNJ201 1-770-416-11 PIN, CONNECTOR (PC BOARD) 54P
< COMPOSITION CIRCUIT BLOCK >
CP103 1-690-880-51 LEAD (WITH CONNECTOR)
< DIODE >
D101 8-719-987-69 DIODE DAN217
D201 8-719-938-75 DIODE SB05-05CP
D301 8-719-938-75 DIODE SB05-05CP
D701 8-719-157-42 DIODE RD8.2M-B
98
Ref. No.
Part No.
Description
< IC >
IC101 8-759-471-19 IC TA2112FN(EL)
IC103 8-759-449-84 IC LA6539M-TE-L
IC104 8-759-701-36 IC NJM3403AM
IC105 8-759-082-61 IC TC4W53FU
IC106 8-759-471-18 IC BA6849FP-E2
IC107 8-759-384-55 IC LA6527N
IC109 8-759-338-78 IC BA10324AFV-E2
IC110 8-759-008-67 IC MC14066BF
IC111 8-759-338-78 IC BA10324AFV-E2
IC112 8-759-505-70 IC L2726
IC201 8-759-471-17 IC TC9449AF(BS,D,24A)
IC202 8-759-710-79 IC NJM2107F
IC203 8-759-082-57 IC TC7W04FU
IC301 8-752-388-69 IC CXD1818R
IC302 8-759-578-85 IC MSM5416258B-35JDR1
IC303 8-759-522-95 IC HD6433032SSNM11F
IC304 8-759-435-26 IC AT29C512-90JC-T
IC305 8-759-497-15 IC BU6260AKV
IC501 8-759-259-77 IC PQ20VZ5U
< COIL >
L101 1-414-267-11 INDUCTOR 10uH
L200 1-414-235-22 INDUCTOR CHIP 0uH
L201 1-414-235-22 INDUCTOR CHIP 0uH
L202 1-414-235-22 INDUCTOR CHIP 0uH
L203 1-414-267-11 INDUCTOR
L701 1-500-425-11 FERRITE
L702 1-500-425-11 FERRITE
< TRANSISTOR >
10uH
0uH
0uH
Q101 8-729-101-07 TRANSISTOR 2SB798-DL
Q102 8-729-107-30 TRANSISTOR 2SC3545-T42
Q103 8-729-027-39 TRANSISTOR DTA144TKA-T146
Q104 8-729-107-30 TRANSISTOR 2SC3545-T42
Q105 8-729-421-19 TRANSISTOR UN2213
Q106 8-729-421-19 TRANSISTOR UN2213
Q202 8-729-107-30 TRANSISTOR 2SC3545-T42
Q203 8-729-216-22 TRANSISTOR 2SA1162-G
Q205 8-729-107-46 TRANSISTOR 2SC3624A-L15
Q206 8-729-107-46 TRANSISTOR 2SC3624A-L15
Q207 8-729-421-19 TRANSISTOR UN2213
Q701 8-729-421-22 TRANSISTOR UN2211
Q702 8-729-926-85 TRANSISTOR 2SB1424-T101-Q
< RESISTOR >
R100 1-216-625-11 METAL CHIP
R101 1-216-610-11 METAL CHIP
R102 1-216-610-11 METAL CHIP
R103 1-216-651-11 METAL CHIP
R104 1-216-687-11 METAL CHIP
R105 1-216-687-11 METAL CHIP
R106 1-216-699-11 METAL CHIP
R107 1-216-693-11 METAL CHIP
R108 1-216-001-00 METAL CHIP
R109 1-216-673-11 METAL CHIP
82
20
20
1K
33K
33K
100K
56K
10
8.2K
0.5% 1/10W
0.50% 1/10W
0.50% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
0.5% 1/10W
Remark Ref. No.
Part No.
Description
R110 1-216-657-11 METAL CHIP
R111 1-216-671-11 METAL CHIP
R112 1-216-001-00 METAL CHIP
R113 1-216-001-00 METAL CHIP
R114 1-216-001-00 METAL CHIP
R115 1-216-001-00 METAL CHIP
R118 1-216-295-91 SHORT
R119 1-216-673-11 METAL CHIP
R120 1-216-295-91 SHORT
R121 1-216-673-11 METAL CHIP
R122 1-216-001-00 METAL CHIP
R123 1-216-663-11 METAL CHIP
R124 1-216-651-11 METAL CHIP
R125 1-216-683-11 METAL CHIP
R126 1-216-683-11 METAL CHIP
R127 1-216-668-11 METAL CHIP
R129 1-216-677-11 METAL CHIP
R130 1-216-659-11 METAL CHIP
R131 1-216-677-11 METAL CHIP
R132 1-216-675-11 METAL CHIP
R133 1-216-677-11 METAL CHIP
R139 1-216-025-91 RES,CHIP
R140 1-216-033-00 METAL CHIP
R141 1-220-745-11 RES,CHIP
R142 1-216-675-11 METAL CHIP
R143 1-216-675-11 METAL CHIP
R144 1-218-756-11 METAL CHIP
R145 1-216-687-11 METAL CHIP
R146 1-218-764-11 METAL CHIP
R149 1-216-699-11 METAL CHIP
R150 1-216-667-11 METAL CHIP
R151 1-218-764-11 METAL CHIP
R152 1-216-699-11 METAL CHIP
R153 1-218-758-11 METAL CHIP
R155 1-216-679-11 METAL CHIP
R156
R157
R158
R161
R163
R169
R182
R188
R189
1-216-675-11 METAL CHIP
1-218-754-11 METAL CHIP
1-216-677-11 METAL CHIP
1-216-675-11 METAL CHIP
1-216-675-11 METAL CHIP
R164 1-216-675-11 METAL CHIP
R166 1-220-149-11 REGISTER
R167 1-220-149-11 REGISTER
R168 1-216-675-11 METAL CHIP
1-216-663-11 METAL CHIP
R171 1-216-295-91 SHORT
R174 1-216-295-91 SHORT
R180 1-216-295-91 SHORT
R181 1-216-675-11 METAL CHIP
1-216-667-11 METAL CHIP
R183 1-216-699-11 METAL CHIP
R184 1-216-667-11 METAL CHIP
R186 1-216-121-91 RES,CHIP
R187 1-216-675-11 METAL CHIP
1-216-675-11 METAL CHIP
1-216-073-00 METAL CHIP
R191 1-216-073-00 METAL CHIP
4.7K
330K
100K
180K
15K
10K
120K
12K
10K
10K
12K
100
220
0.56
10K
10K
150K
33K
330K
100K
10
3.3K
1K
22K
22K
5.1K
12K
2.2K
12K
10K
1.8K
6.8K
10
10
10
10
0
8.2K
0
8.2K
100K
4.7K
1M
10K
10K
10K
10K
10K
2.2
2.2
10K
3.3K
0
0
0
10K
4.7K
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
0.5% 1/10W
0.5% 1/10W
5%
5%
1/10W
1/10W
MA-C30
Remark
0.5% 1/10W
0.5% 1/10W
5%
5%
5%
1/10W
1/10W
1/10W
5% 1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
5%
5%
1/10W
1/2W
0.5% 1/10W
0.5% 1/10W
0.50% 1/10W
0.5% 1/10W
0.50% 1/10W
0.5% 1/10W
0.5% 1/10W
0.50% 1/10W
0.5% 1/10W
0.50% 1/10W
0.5% 1/10W
0.5% 1/10W
0.50% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
10% 1/2W
10% 1/2W
0.5% 1/10W
0.5% 1/10W
99
MA-C30
Ref. No.
Part No.
Description
R192 1-216-669-11 METAL CHIP
R193 1-216-669-11 METAL CHIP
R194 1-216-669-11 METAL CHIP
R195 1-216-669-11 METAL CHIP
R196 1-216-691-11 METAL CHIP
R197 1-216-691-11 METAL CHIP
R198 1-216-691-11 METAL CHIP
R199 1-216-691-11 METAL CHIP
R200 1-216-009-91 RES,CHIP
R201 1-216-033-00 METAL CHIP
R203 1-216-675-11 METAL CHIP
R204 1-216-691-11 METAL CHIP
R205 1-216-675-11 METAL CHIP
R206 1-216-691-11 METAL CHIP
R207 1-216-687-11 METAL CHIP
R208 1-216-699-11 METAL CHIP
R209 1-216-675-11 METAL CHIP
R210 1-216-683-11 METAL CHIP
R211 1-216-675-11 METAL CHIP
R212 1-216-683-11 METAL CHIP
R213 1-216-675-11 METAL CHIP
R214 1-216-675-11 METAL CHIP
R215 1-216-663-11 METAL CHIP
R216 1-216-663-11 METAL CHIP
R217 1-216-033-00 METAL CHIP
R218 1-216-675-11 METAL CHIP
R219 1-216-683-11 METAL CHIP
R221 1-216-295-91 SHORT
R222 1-216-057-00 METAL CHIP
R223 1-216-041-00 METAL CHIP
R224 1-216-065-91 RES,CHIP
R226 1-216-057-00 METAL CHIP
R227 1-216-041-00 METAL CHIP
R228 1-216-065-91 RES,CHIP
R229 1-216-651-11 METAL CHIP
R230 1-216-651-11 METAL CHIP
R231 1-216-651-11 METAL CHIP
R232 1-216-651-11 METAL CHIP
R234 1-216-665-11 METAL CHIP
R235 1-216-665-11 METAL CHIP
R236 1-216-675-11 METAL CHIP
R237 1-216-677-11 METAL CHIP
R238 1-216-089-91 RES,CHIP
R239 1-216-675-11 METAL CHIP
R240 1-216-675-11 METAL CHIP
R241 1-216-687-11 METAL CHIP
R242 1-216-033-00 METAL CHIP
R243 1-218-760-11 METAL CHIP
R244 1-216-695-11 METAL CHIP
R245 1-216-683-11 METAL CHIP
R247 1-216-121-91 RES,CHIP
R249 1-216-667-11 METAL CHIP
R250 1-216-663-11 METAL CHIP
R251 1-216-655-11 METAL CHIP
R256 1-216-097-91 RES,CHIP
R257 1-216-097-91 RES,CHIP
R308 1-216-001-00 METAL CHIP
2.2K
470
4.7K
2.2K
470
4.7K
1K
1K
1K
1K
10K
22K
10K
10K
3.3K
3.3K
220
10K
22K
0
22
220
10K
47K
10K
47K
33K
100K
10K
22K
5.6K
5.6K
5.6K
5.6K
47K
47K
47K
47K
68K
22K
1M
4.7K
3.3K
1.5K
100K
100K
10
3.9K
3.9K
10K
12K
47K
10K
10K
33K
220
220K
5%
5%
5%
5%
5%
0.5%
Remark
Ref. No.
Part No.
1/10W
0.5% 1/10W
0.5% 1/10W
Description
R310 1-216-073-00 METAL CHIP
0.5%
0.5%
0.5%
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R311 1-216-033-00 METAL CHIP
R316 1-216-065-91 RES,CHIP
R318 1-216-025-91 RES,CHIP
R319 1-216-025-91 RES,CHIP
R320 1-216-025-91 RES,CHIP
5%
5%
0.5%
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R321 1-216-025-91 RES,CHIP
R322 1-216-001-00 METAL CHIP
R323 1-216-001-00 METAL CHIP
R330 1-216-009-91 RES,CHIP
R331 1-216-009-91 RES,CHIP
0.5%
0.5%
0.5%
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R333 1-216-089-91 RES,CHIP
R334 1-216-073-00 METAL CHIP
R335 1-216-089-91 RES,CHIP
R336 1-216-033-00 METAL CHIP
R337 1-216-089-91 RES,CHIP
0.5%
0.5%
0.5%
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R338 1-216-113-00 METAL CHIP
R340 1-216-033-00 METAL CHIP
R341 1-216-033-00 METAL CHIP
R342 1-216-033-00 METAL CHIP
R343 1-216-113-00 METAL CHIP
0.5%
5%
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R344 1-216-667-11 METAL CHIP
R345 1-216-667-11 METAL CHIP
R346 1-216-089-91 RES,CHIP
R347 1-216-667-11 METAL CHIP
R349 1-216-033-00 METAL CHIP
1/10W
1/10W
1/10W
1/10W
1/10W
R350 1-216-033-00 METAL CHIP
R351 1-216-687-11 METAL CHIP
R352 1-216-627-11 METAL CHIP
R355 1-216-089-91 RES,CHIP
R356 1-216-089-91 RES,CHIP
5%
0.5%
0.5%
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
R358 1-216-049-91 RES,CHIP
R359 1-216-049-91 RES,CHIP
R401 1-216-049-91 RES,CHIP
R502 1-216-295-91 SHORT
R701 1-216-073-00 METAL CHIP
0.5%
0.5%
0.5%
5%
1/10W
1/10W
1/10W
0.5% 1/10W
1/10W
R702 1-220-262-11 RES,CHIP
R703 1-218-618-11 METAL CHIP
R704 1-218-618-11 METAL CHIP
R705 1-216-663-11 METAL CHIP
R706 1-216-651-11 METAL CHIP
10K
220
4.7K
100
100
100
100
10
10
22
22
47K
10K
47K
220
47K
470K
220
220
220
470K
4.7K
4.7K
47K
4.7K
220
220
33K
100
47K
47K
1K
1K
1K
0
10K
680
22
22
3.3K
1K
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
0.5%
0.5%
5%
0.5%
5%
5%
0.5%
0.5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
0.5%
0.5%
< COMPOSITION CIRCUIT BLOCK >
Remark
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/4W
1W
1W
1/10W
1/10W
0.5%
0.5%
0.5%
5%
0.50%
1/10W
1/10W
1/10W
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
0.5% 1/10W
0.5% 1/10W
RB301 1-233-578-11 RES, CHIP NETWORK 47K
RB302 1-233-576-11 RES, CHIP NETWORK 100
RB303 1-236-908-11 RES, CHIP NETWORK 10K (3216)
RB304 1-236-908-11 RES, CHIP NETWORK 10K (3216)
RB305 1-233-578-11 RES, CHIP NETWORK 47K
RB306 1-233-578-11 RES, CHIP NETWORK 47K
< VIBRATOR >
0.5% 1/10W
5%
5%
5%
1/10W
1/10W
1/10W
X201 1-767-382-11 OSCILLATOR, CERAMIC (40MHz)
X301 1-767-382-11 OSCILLATOR, CERAMIC (40MHz)
X302 1-579-834-11 VIBRATOR, CRYSTAL (33.86MHz)
**************************************************************
100
MAIN
Ref. No.
*
Part No.
Description
A-4724-461-A MAIN BOARD, COMPLETE
********************
< CAPACITOR >
C601 1-163-038-91 CERAMIC CHIP 0.1uF
C602 1-163-038-91 CERAMIC CHIP 0.1uF
C603 1-163-001-11 CERAMIC CHIP 220PF
C604 1-163-038-91 CERAMIC CHIP 0.1uF
C605 1-163-101-00 CERAMIC CHIP 22PF
C606 1-163-038-91 CERAMIC CHIP 0.1uF
C607 1-126-394-11 ELECT CHIP 10uF
C608 1-163-038-91 CERAMIC CHIP 0.1uF
C609 1-163-101-00 CERAMIC CHIP 22PF
C610 1-163-038-91 CERAMIC CHIP 0.1uF
C611
C612
1-163-038-91 CERAMIC CHIP
1-126-396-11 ELECT CHIP
0.1uF
47uF
C614 1-163-038-91 CERAMIC CHIP 0.1uF
C615 1-163-038-91 CERAMIC CHIP 0.1uF
C616
C621
1-164-222-11 CERAMIC CHIP
1-126-396-11 ELECT CHIP
0.22uF
C617 1-163-038-91 CERAMIC CHIP 0.1uF
C618 1-126-394-11 ELECT CHIP 10uF
C619 1-163-038-91 CERAMIC CHIP 0.1uF
C620 1-126-392-11 ELECT CHIP 100uF
47uF
C622 1-163-109-00 CERAMIC CHIP 47PF
< CONNECTOR >
* CN601 1-568-951-11 PIN, CONNECTOR 2P
CN602 1-770-640-11 CONNECTOR, FFC/FPC 9P
CN603 1-770-643-11 CONNECTOR, FFC/FPC 12P
CN604 1-506-468-11 PIN, CONNECTOR 3P
* CN605
1-568-955-11 PIN, CONNECTOR 6P
CN606 1-506-469-11 PIN, CONNECTOR 4P
* CN608
1-568-951-11 PIN, CONNECTOR 2P
CN609 1-506-469-11 PIN, CONNECTOR 4P
CN611 1-770-643-11 CONNECTOR, FFC/FPC 12P
* CN612
1-770-416-11 PIN, CONNECTOR (PC BOARD) 54P
< IC >
25V
20% 16V
25V
25V
25V
25V
20% 16V
25V
20% 6.3V
20% 16V
5% 50V
IC601 8-759-040-83 IC BA6287F
IC602 8-759-569-86 IC uPD784031GC-8BT
IC603 8-759-356-03 IC BA6780
IC604 8-759-926-80 IC SN74HC573BNS
IC605 8-759-926-11 IC SN74HC138ANS
IC606 8-759-927-72 IC TL1591CP
IC607 8-759-587-80 IC SST29EE010-90-4C-NH-1.00
IC608 8-759-634-43 IC M51953BFP
IC609 8-759-384-47 IC SYM53CF92A-64QFP
IC610 8-759-497-29 IC uPD43256BGU-70LL-E2
< COIL >
25V
25V
10% 50V
25V
5% 50V
25V
20% 16V
5%
25V
50V
25V
Remark
Ref. No.
Part No.
Description
< RESISTOR >
R601 1-216-041-00 METAL CHIP
R602 1-216-041-00 METAL CHIP
R603 1-216-073-00 METAL CHIP
R604 1-216-085-00 METAL CHIP
R605 1-216-073-00 METAL CHIP
R606 1-216-073-00 METAL CHIP
R607 1-216-073-00 METAL CHIP
R608 1-216-073-00 METAL CHIP
R609 1-216-073-00 METAL CHIP
R610 1-216-073-00 METAL CHIP
R611 1-216-073-00 METAL CHIP
R612 1-216-073-00 METAL CHIP
R613 1-216-073-00 METAL CHIP
R614 1-216-073-00 METAL CHIP
R615 1-216-073-00 METAL CHIP
R616 1-216-073-00 METAL CHIP
R617 1-216-073-00 METAL CHIP
R618 1-216-033-00 METAL CHIP
R619 1-216-033-00 METAL CHIP
R620 1-216-033-00 METAL CHIP
R621
R622
R623
R624
R625
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
R626 1-216-073-00 METAL CHIP
R627 1-216-073-00 METAL CHIP
R628 1-216-079-00 METAL CHIP
R629 1-216-068-00 METAL CHIP
R630
R631
R632
R633
R634
R635
1-216-073-00 METAL CHIP
1-216-033-00 METAL CHIP
1-218-603-91 METAL CHIP
1-218-603-91 METAL CHIP
1-216-033-00 METAL CHIP
1-216-057-00 METAL CHIP
R636 1-216-025-91 RES,CHIP
R637 1-216-073-00 METAL CHIP
R638 1-216-065-91 RES,CHIP
R639 1-216-033-00 METAL CHIP
R640 1-216-073-00 METAL CHIP
R641
RB601
RB602
RB603
RB604
RB605
1-216-073-00 METAL CHIP
470
470
10K
33K
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
220
220
220
10K
10K
10K
10K
10K
10K
10K
18K
6.2K
10K
220
1.2
1.2
220
2.2K
100
10K
4.7K
220
10K
10K
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
< COMPOSITION CIRCUIT BLOCK >
1-233-414-11 RES, CHIP NETWORK 4.7K (3216)
1-233-414-11 RES, CHIP NETWORK 4.7K (3216)
1-236-908-11 RES, CHIP NETWORK 10K (3216)
1-236-908-11 RES, CHIP NETWORK 10K (3216)
1-236-908-11 RES, CHIP NETWORK 10K (3216)
Remark
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1W
1W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
L601
L602
L603
1-414-235-22 INDUCTOR CHIP 0uH
1-500-202-11 FERRITE
1-500-202-11 FERRITE
< TRANSISTOR >
0uH
0uH
Q601 8-729-107-46 TRANSISTOR 2SC3624A-L15
RB606 1-236-908-11 RES, CHIP NETWORK 10K (3216)
RB607 1-236-908-11 RES, CHIP NETWORK 10K (3216)
< SWITCH >
SW601 1-570-313-11 SWITCH, KEY BOARD
SW602 1-570-313-11 SWITCH, KEY BOARD
101
MAIN
MOTOR
P.JACK
P.SW
POWER
Ref. No.
Part No.
Description
< VIBRATOR >
Remark
Ref. No.
Part No.
Description
C923 1-104-666-11 ELECT 220uF
X601 1-760-225-11 VIBRATOR, CERAMIC
X602 1-767-325-21 OSCILLATOR, CRYSTAL
< CONNECTOR >
**************************************************************
*
1-672-167-11 MOTOR BOARD
***********
CN905 1-564-321-00 PIN, CONNECTOR 2P
CN906 1-691-766-11 PLUG (MICRO CONNECTOR) 4P
CN907 1-691-766-21 PLUG (MICRO CONNECTOR) 4P
* CN908
1-568-951-11 PIN, CONNECTOR 2P
* CN909 1-568-951-11 PIN, CONNECTOR 2P
Remark
20% 25V
*
< CONNECTOR >
CN61 1-506-469-11 PIN, CONNECTOR 4P
A-4724-442-A POWER BOARD, COMPLETE
*********************
< CAPACITOR >
C908 1-125-742-11 ELECT(BLOCK) 12000uF 20% 35V
C911 1-126-965-11 ELECT 22uF 20% 50V
C912 1-163-125-00 CERAMIC CHIP 220PF
C913 1-104-666-11 ELECT 220uF
C915 1-126-965-11 ELECT 22uF
5%
20%
20%
50V
25V
50V
C916 1-164-699-11 CERAMIC CHIP 0.0033uF
5%
C917 1-104-666-11 ELECT 220uF 20%
50V
25V
C920 1-126-941-11 ELECT
C921 1-126-941-11 ELECT
C922 1-126-951-11 ELECT
470uF
470uF
470uF
20%
20%
20%
25V
25V
35V
< COMPOSITION CIRCUIT BLOCK >
CP901 1-537-771-21 TERMINAL BOARD, GROUND
**************************************************************
*
1-672-161-11 P.JACK BOARD
************
< CONNECTOR >
* CN451 1-564-506-11 PLUG, CONNECTOR 3P
< DIODE >
D902 8-719-025-03 DIODE RBA-402-SL
D903 8-719-210-39 DIODE EC10QS-04
D904 8-719-210-39 DIODE EC10QS-04
D905
D906
8-719-210-33 DIODE EC10DS2
8-719-210-33 DIODE EC10DS2
< JACK >
1-770-719-11 JACK, PIN 2P
D907 8-719-210-33 DIODE EC10DS2
D908 8-719-210-33 DIODE EC10DS2
J451
L451
L452
L453
< COIL >
1-414-235-22 INDUCTOR CHIP 0uH
1-414-235-22 INDUCTOR CHIP 0uH
1-414-235-22 INDUCTOR CHIP 0uH
**************************************************************
* 1-672-160-11 P.SW BOARD
**********
< FUSE >
1-532-388-51 FUSE (2A/250V) ! F904
< FERRITE BEAD >
FB901 1-410-397-21 FERRITE BEAD INDUCTOR
FB902 1-410-397-21 FERRITE BEAD INDUCTOR
< FUSE HOLDER >
FH903 1-533-293-11 FUSE HOLDER
FH904 1-533-293-11 FUSE HOLDER
< CAPACITOR >
C901 1-113-920-11 CERAMIC 0.0022uF
20% 250V
< IC >
< CONNECTOR >
* CN901 1-568-226-11 PIN, CONNECTOR 2P
IC901 8-759-442-83 IC MC34166D2TR4
IC902 8-759-442-83 IC MC34166D2TR4
IC903 8-759-245-86 IC TA7912S
< COIL >
< SWITCH >
S901 1-762-581-11 SWITCH, AC POWER PUSH (1 KEY)(
U)
**************************************************************
L901
L902
1-415-951-11 INDUCTOR
1-415-951-11 INDUCTOR
< RESISTOR >
220uH
220uH
R901
R904
R905
R906
1-216-073-00 METAL CHIP
1-216-069-00 METAL CHIP
1-216-045-00 METAL CHIP
1-216-073-00 METAL CHIP
R907 1-216-105-91 RES,CHIP
R910 1-216-073-00 METAL CHIP
R911 1-216-089-91 RES,CHIP
10K
6.8K
680
10K
220K
10K
47K
5%
5%
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
**************************************************************
The components identified by mark
! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque ! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
102
SE-C7
SCSI IN
SCSI OUT TABLE SENSOR
Ref. No.
*
Part No.
Description
A-4724-441-A SE-C7 BOARD, COMPLETE
*********************
1-790-251-11 WIRE (FLAT TYPE) (11 CORE)
Remark
Ref. No.
Part No.
Description
< IC >
IC691 8-759-464-52 IC BH9598FP-YE2
< RESISTOR >
Remark
C2
C3
C4
C5
< CAPACITOR >
1-115-467-11 CERAMIC CHIP 0.22uF
1-162-962-11 CERAMIC CHIP 470PF
1-115-156-11 CERAMIC CHIP 1uF
1-115-156-11 CERAMIC CHIP 1uF
10% 10V
10% 50V
10V
10V
R691 1-216-073-00 METAL CHIP 10K 5% 1/10W
**************************************************************
IC1
< IC >
8-759-702-02 IC NJM062M
*
1-672-168-11 TABLE SENSOR BOARD
******************
< CONNECTOR >
R6
R7
R8
R9
R10
R1
R2
R3
R4
R5
R11
R12
< RESISTOR >
1-218-732-11 METAL CHIP
1-218-732-11 METAL CHIP
1-218-714-11 METAL CHIP
1-218-752-11 METAL CHIP
1-218-732-11 METAL CHIP
1-218-909-11 RES,CHIP
1-218-716-11 METAL CHIP
1-218-668-11 METAL CHIP
1-219-570-11 RES,CHIP
1-219-570-11 RES,CHIP
1-218-738-11 METAL CHIP
1-218-728-11 METAL CHIP
< VIBRATOR >
47K
47K
8.2K
330K
47K
390K
10K
100
10M
10M
82K
33K
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
0.50% 1/16W
5% 1/16W
5% 1/16W
0.50% 1/16W
0.50% 1/16W
* CN51 1-568-944-11 PIN, CONNECTOR 6P
CN52 1-506-481-11 PIN, CONNECTOR 2P
< IC >
IC51
IC52
IC53
R51
R52
R53
8-749-924-18 IC PHOTO INTERRUPTER RPI-1391
8-749-924-18 IC PHOTO INTERRUPTER RPI-1391
8-749-924-18 IC PHOTO INTERRUPTER RPI-1391
< RESISTOR >
1-216-047-91 RES,CHIP
1-216-047-91 RES,CHIP
1-216-047-91 RES,CHIP
820
820
820
1-790-228-11 CORD (WITH CONNECTOR)
1-783-531-41 CORD, POWER
1-790-229-11 WIRE (FLAT TYPE) (9 CORE)
1-790-230-11 WIRE (FLAT TYPE) (12 CORE)
1-790-231-11 WIRE (FLAT TYPE) (12 CORE)
8-729-926-31 PHOTO TRANSISTOR PT483F1
1-777-692-11 WIRE (FLAT TYPE) (11 CORE)
1-758-088-11 OPTICAL PICK-UP SPU-3212
1-782-368-12 WIRE (FLAT TYPE) (16 CORE)
X-4951-512-1 MOTOR ASSY (SPINDLE)
5%
5%
5%
1/10W
1/10W
1/10W
**************************************************************
**************************************************************
*
X1 1-803-503-21 SENSOR, SHOCK
1-672-364-11 SCSI IN BOARD
*************
14
! 21
110
111
112
CN681
CN682
< CONNECTOR >
1-785-592-11 PIN, CONNECTOR (PC BOARD) 50P
1-793-168-11 PIN, CONNECTOR (HALF PITCH)50P
259
303
308
309
M61
MISCELLANEOUS
*************
**************************************************************
*
1-672-365-11 SCSI OUT BOARD
**************
M62 X-4951-512-1 MOTOR ASSY (LOADING)
M101 A-4672-641-A SPINDLE ASSY (TABLE)
* M102
X-4951-510-1 MOTOR, DC (SLED)
! T901 1-433-542-11 TRANSFORMER, POWER
< CAPACITOR >
**************************************************************
C691 1-163-038-91 CERAMIC CHIP 0.1uF
C692 1-126-402-11 ELECT CHIP 2.2uF
25V
20% 50V
CN691
CN694
< CONNECTOR >
1-785-592-11 PIN, CONNECTOR (PC BOARD) 50P
1-793-168-11 PIN, CONNECTOR (HALF PITCH)50P
ACCESSORIES & PACKING MATERIALS
*******************************
1-761-178-11 BOARD, SCSI
1-790-517-11 CORD, CONNECTION
1-790-661-11 CORD, CONNECTION (SCSI)
3-867-854-11 MANUAL, INSTRUCTION (ENGLISH)
3-866-765-11 MANUAL (CD-ROM), INSTRUCTION (ENGLISH)
< DIODE >
4-214-059-01 LABEL (DISC)
D691 8-719-210-39 DIODE EC10QS-04
**************************************************************
< FUSE >
F691 1-533-817-21 THERMISTOR
The components identified by mark ! or dotted line with mark
! are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
! sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant le numéro spécifié.
103
CDJ-500
#12
#13
#14
#15
#16
#7
#8
#9
#10
#11
#17
#18
Ref. No.
#1
#2
#3
#4
#5
Part No.
Description
*************
HARDWARE LIST
*************
7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S
7-682-135-01 SCREW +P 2.5X6
7-685-871-01 SCREW +BVTT 3X6 (S)
7-685-104-14 SCREW +P 2X6 TYPE2 SLIT
7-621-772-18 SCREW +B 2X4
7-624-105-04 STOP RING 2.3, TYPE -E
7-621-255-25 SCREW +P 2X4
7-685-873-09 SCREW +BVTT 3X10 (S)
7-685-875-09 SCREW +BVTT 3X14 (S)
7-628-253-00 SCREW +PS 2X4
7-628-254-15 SCREW +PS 2.6X6
7-685-102-19 SCREW +P 2X4 NON-SLIT TYPE 2
7-685-107-11 SCREW +P 2X12 TYPE2 NON-SLIT
7-685-534-19 SCREW +BTP 2.6X8 TYPE2 N-S
7-685-862-09 SCREW +BVTT 2.6X6 (S)
7-685-546-19 SCREW +BTP 3X8 TYPE2 N-S
7-685-532-19 SCREW +BTP 2.6X5 TYPE2 N-S
Remark
9-928-997-11
104
Sony Corporation
Home Audio Company
99H0923-1D
Printed in Japan © 1999. 8
Published by Quality Assurance Dept.
Advertisement
Key Features
- 51 CD-ROM slots
- SCSI interface
- CD-ROM XA, CD-EXTRA, Photo CD formats
- CD-R and CD-RW compatible