SPA™ Silicon Protection Array Products SP3001 Lead-Free/Green Series HF

SPA™ Silicon Protection Array Products SP3001 Lead-Free/Green Series HF
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF
RoHS
Pb
GREEN
SP3001 Lead-Free/Green Series
Description
The SP3001 has ultra low capacitance rail-to rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation. Their very low
loading capacitance also makes them ideal for protecting
high speed signal pins such as HDMI, DVI, USB2.0, and
IEEE 1394.
Pinout
Features
I/O 1
I/O 4
GND
VCC
I/O 2
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t&4%QSPUFDUJPOPGœL7
contact discharge, ±15kV
air discharge,
(IEC61000-4-2)
t4NBMM4$QBDLBHF
saves board space
t&'5QSPUFDUJPO
IEC61000-4-4,
40A (5/50ns)
I/O 3
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 2.5A
(8/20μs)
Applications
I/O4
VCC
t $PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
I/O1
GND
I/O3
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
39
Revised: February 9, 2010
SP3001 Lead-Free/Green Series
Lead-Free/Green SP3001
Functional Block Diagram
I/O2
t-PXDBQBDJUBODFPG
0.65pF (TYP) per I/O
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
2.5
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-50 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
Storage Temperature Range
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1μA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
VC
ESD Withstand Voltage1
Diode Capacitance1
1
Diode Capacitance
VESD
C*0(/%
Min
Typ
IPP=1A, tp=8/20μs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20μs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.8
0.9
pF
Reverse Bias=1.65V
0.55
0.65
pF
CI/O-I/O
Reverse Bias=0V
0.35
pF
/PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO
SP3001 Lead-Free/Green Series
40
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1
1.00
0
0.95
-1
0.90
I/O Capacitance (pF)
Insertion Loss [dB]
-2
-3
-4
-5
-6
-7
0.85
0.80
VCC = Float
0.75
0.70
VCC = 3.3V
0.65
VCC = 5V
-8
0.60
-9
0.55
-10
0.50
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
Capacitance vs. Frequency
1.4E-12
1.2E-12
Capacitance [F]
1E-12
8E-13
6E-13
4E-13
0
1.E+06
1.E+07
1.E+08
Lead-Free/Green SP3001
2E-13
1.E+09
Frequency [Hz]
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
41
Revised: February 9, 2010
SP3001 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Application Example
+5V
D2+
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
ASIC HDMI/DVI drivers can also be protected with the
SP300x-04, the +VCC pins on the SP300x-04 can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +VCC of the SP300x-04 can be
nPBUFEPS/$
HDMI or DVI application example for the Littelfuse
SP300x-04 protection devices. A single 4 channel
SP300x-04 device can be used to protect four of the data
lines in a HDMI/DVI interface. Two (2) SP300x-04 devices
provide protection for the main data lines. Low voltage
Soldering Parameters
Reflow Condition
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
Pb – Free assembly
3°C/second max
3°C/second max
- Temperature (TL) (Liquidus)
¡$
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tP)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP3001 Lead-Free/Green Series
42
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SC70-6
e
6
5
Package
SC70-6
Pins
6
4
E
JEDEC
HE
MO-203 Issue A
Millimeters
2
1
3
B
D
A2 A
A1
C
Solder Pad Layout
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.089
E
1.15
1.35
0.045
0.053
e
L
Part Numbering System
Inches
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.094
L
0.26
0.46
0.010
0.018
Product Characteristics
SP3001-04 J T G
Silicon
Protection
Array
G= Green
T= Tape & Reel
Series
Package
Number of Channels
J = SC70-6, 3000 quantity
-04 = 4 channel
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
/PUFT
1. All dimensions are in millimeters
Part Marking System
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
DX4
DX4
Product Series
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Number of Channels
6. Package surface matte finish VDI 11-13.
D = SP3001 series
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3001-04JTG
4$
DX4
3000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
43
Revised: February 9, 2010
SP3001 Lead-Free/Green Series
Lead-Free/Green SP3001
e
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Embossed Carrier Tape & Reel Specification - SC70-6
Symbol
Inches
Max
Min
Max
E
1.65
1.85
0.064
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.081
D
1.40
1.60
0.055
0.062
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.153
0.161
10P0
40.0+/- 0.20
W
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.960
K0
1.12
1.32
0.044
0.052
t
SP3001 Lead-Free/Green Series
Millimetres
Min
44
Revised: February 9, 2010
NBY
0.010 max
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
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