Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
Multilayer Ceramic Chip Capacitors
Kyocera's series of Multilayer Ceramic Chip Capacitors are
designed to meet a wide variety of needs. We offer a
complete range of products for both general and
specialized applications, including the general-purpose
CM series, the high-voltage CF series , the low profile CT
series, and the DN series for automotive uses.
Features
• We have factories worldwide in order to supply our global customer bases
quickly and efficiently and to maintain our reputation as one of the
highest-volume producers in the industry.
• All our products are highly reliable due to their monolithic structure of
high-purity and superfine uniform ceramics and their integral internal
electrodes.
• By combining superior manufacturing technology and materials with high
dielectric constants, we produce extremely compact components with
exceptional specifications.
• Our stringent quality control in every phase of production from material
procurement to shipping ensures consistent manufacturing and super
quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to meet
specific configurational requirements.
CM
series
General
CU
CA
series
Arrays
Multilayer
Ceramic Chip
Capacitors
series
Low ESR
CT
series
Low Profile
DN/DR
series
Automotive
CF
series
High-Voltage
Structure
External Termination
Electrodes
Nickel Barrier Termination Products
Internal Electrodes
(Pd, Pd/Ag, Ni or Cu)
Ni Plating
Dielectric Ceramic Layer
Temperature compensation :Titanate family
High dielectric constant :
Barium Titanate family
Tape and Reel
Ag or Cu or
CuNi
Sn Plating or
Sn/Pb Plating
Bulk Cassette
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
Multilayer Ceramic Chip Capacitors
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Series
Dieletric Options
Typical Applications
Features
CM
C0G (NP0)
X5R
X7R
X6S
X7S
Y5V
NTC∗
General Purpose
Wide Cap Range
Nickel Barrier
0201, 0402, 0603
0805, 1206, 1210
1812, 2211, 2220
CF
C0G (NP0)
X7R
High Voltage
&
Power Circuits
High Voltage
250VDC, 630VDC
1000VDC, 2000VDC
3000VDC, 4000VDC
Nickel Barrier
0805, 1206, 1210
1812, 2208, 1808
2220
CT
C0G (NP0)
X5R
X7R
Y5V
PLCC
(Decoupling)
Low Profile
Nickel Barrier
0402, 0603, 0805
1206, 1210
∗DN/DR
C0G (NP0)
U (750)
X7R
Automotive
Thermal shock
Resistivity
High Reliability
Nickel Barrier
0603, 0805, 1206
CU
C0G (NP0)
RF Circuit
Low ESR
Nickel Barrier
0402, 0603
CA
C0G (NP0)
X5R
Digital Signal
Pass line
Reduction in
Placing Costs
Nickel Barrier
0405, 0508, 0612
∗ NTC: Negative Temperature coefficient types are available on request.
∗ DN Series: Silver Palladium termination is available on request.
∗ CA Series: X7R, Y5V are available on request.
Terminations
Available Size (EIA)
Multilayer Ceramic Chip Capacitors
Dimensions
W
L
T
P
P~P
P
External
Terminations
Electrode
External Dimensions
Tape & Reel
Size
EIA CODE
Dimensions (mm)
EIAJ CODE
L
W
P min
P max
P to P min
T max
03
0201
0603
0.6±0.03
0.3±0.03
0.10
0.20
0.20
0.33
05
0402
1005
1.0±0.05
0.5±0.05
0.15
0.35
0.30
0.55
105
0603
1608
1.6±0.10
0.8±0.10
0.20
0.60
0.50
0.90
21
0805
2012
2.0±0.10
1.25±0.10
0.20
0.75
0.70
1.35
316
1206
3216
3.2±0.20
1.60±0.15
0.30
0.85
1.40
1.75
32
1210
3225
3.2±0.20
2.50±0.20
0.30
1.00
1.40
2.70
42
1808
4520
4.5±0.20
2.00±0.20
0.15
0.85
2.60
2.20
43
1812
4532
4.5±0.30
3.20±0.20
0.30
1.10
2.00
3.0
52
2208
5720
5.7±0.40
2.00±0.20
0.15
0.85
4.20
2.20
53
2211
5728
5.7±0.40
2.80±0.20
0.15
0.85
4.20
2.80
55
2220
5750
5.7±0.40
5.00±0.40
0.30
1.40
2.50
2.70
W
T
• CT21, CT316 : (L) 3.2±0.2mm and (W)1.6±0.2mm
• T (Thickness) depends on capacitance value.
Standard thickness is shown on the appropriate product pages.
• DR series 105, 21 size (L)(W)(T) Tolerance ±0.15mm
• CA series (please refer page 19)
Bulk Cassette
P
Size
EIA CODE
EIAJ CODE
L
P to P
min
max
min
05
0402
1005
1.0±0.05
0.5±0.05
0.5±0.05
0.15
0.35
0.30
105
0603
1608
1.6±0.07
0.8±0.07
0.8±0.07
0.20
0.60
0.50
21
0805
2012
2.0±0.1
1.25±0.1
0.6±0.1/1.25±0.1
0.20
0.75
0.70
Multilayer Ceramic Chip Capacitors
Ordering Information
KYOCERA PART NUMBER:
CM
21
X7R
104
SERIES CODE
CM
CF
CT
DN/DR
=
=
=
=
General Purpose
High Voltage
Low Profile
Automotive
CA =
CU =
Capacitor Arrays
Low ESR
SIZE CODE
SIZE
03 =
05 =
105 =
F12 =
F13 =
EIA (EIAJ)
0201 (0603)
0402 (1005)
0603 (1608)
0508 (1220)/4cap
0612 (1632)/4cap
SIZE
21
316
32
42
43
=
=
=
=
=
EIA (EIAJ)
0805 (2012)
1206 (3216)
1210 (3225)
1808 (4520)
1812 (4532)
SIZE
52
53
55
D11
D12
=
=
=
=
=
EIA (EIAJ)
2208 (5720)
5728 (2211)
2220 (5750)
0405 (1012)/2cap
0508 (1220)/2cap
DIELECTRIC CODE
CODE
EIA CODE
CG = C0G (NPO)
X7S = X7S
X5R = X5R
X6S = X6S (Option)
X7R = X7R
Y5V = Y5V
Negative dielectric types are available on request.
CAPACITANCE CODE
Capacitance expressed in pF. 2 significant digits plus
number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg. 100000pF = 104
1.5pF
= 1R5
0.1µF
= 104
0.5pF
= R50
4700pF
= 472
100µF
= 107
TOLERANCE CODE
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1pF
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Z = -20 to +80%
VOLTAGE CODE
04
06
10
16
25
35
50
=
=
=
=
=
=
=
4VDC
6.3VDC
10VDC
16VDC
25VDC
35VDC
50VDC
100
250
400
630
=
=
=
=
100VDC
250VDC
400VDC
630VDC
1000
2000
3000
4000
=
=
=
=
1000VDC
2000VDC
3000VDC
4000VDC
TERMINATION CODE
A = Nickel Barrier
B = Silver Palladium (∗option)
C = Silver (∗option)
PACKAGING CODE
B = Bulk
C = Bulk Cassette
T = 7" Reel Taping & 4mm Cavity pitch
OPTION
Thickness max value is indicated in CT series
EX. 125 → 1.25mm max
095 → 0.95mm max
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
K
50
A
T
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
High Dielectric Constant
EIA Dielectric
Temperature Range
X5R
−55 to 85°C
X7R
−55 to 125°C
X7S
−55 to 125°C
X6S
−55 to 105°C
Y5V
−30 to 85°C
∆Cmax
±15%
±22%
−82 to +22%
Temperature Compensation Type
Electric Code
Value (pF)
1B/C0G
P∆
N150
R∆
N220
S∆
N330
T∆
N470
U∆
N750
SL
+350 to −1000
0.5-2.7
CK
PK
RK
SK
TK
UK
SL
3.0-3.9
CJ
PJ
RJ
SJ
TJ
UJ
SL
4.0-9.0
CH
PH
RH
SH
TH
UJ
SL
≥10
CG
PH
RH
SH
TH
UJ
SL
K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C
e.g. CG = 0±30ppm/°C, PH = −150±60ppm/°C
Note: All parts will be marked as "CG" but will conform to the above table.
Available Tolerances
E Standard Number
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric
Standard Tolerance
∗4
∗4
E3
Capacitance
A=±0.05pF
≤0.5pF
B=±0.1pF
≤5pF
COG
NTC ∗1
J=±5%
K=±10%
X5R
X6R
X7R
Y5V
∗3
K=±10%
M=±20%
Z=−20% to +80%
E24 (Option)
1.0
1.0
1.1
1.2
1.2
1.3
1.5
1.5
1.6
1.8
1.8
2.0
2.2
2.2
2.4
2.7
2.7
3.0
3.3
3.3
3.6
3.9
3.9
4.3
4.7
4.7
5.1
5.6
5.6
6.2
6.8
6.8
7.5
8.2
8.2
9.1
1.0
1.5
∗2
<10pF
2.2
F=±1pF
G=±2%
E12
1.0
C=±0.25pF
D=±0.50pF
E6
≥10pF
2.2
E12 Series
3.3
E6 Series
4.7
E3 Series
Note:
∗1 NTC : Negative Temperature Compensation types are available on request as shown on
product pages.
∗2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF, 10pF.
∗3 J = ±5% for X7R(X5R) is available on request.
∗4 option
4.7
6.8
CM Series
Nickel Barrier Terminations
Features
Application
We offer a diverse product line ranging from ultra-compact (0.6×0.3
mm) to large (5.7×5.0 mm) components configured for a variety of
temperature characteristics, rated voltages, and packages. We offer the
choice and flexibility for almost any applications.
This standard type is ideal for use in a wide range of applications, from
commercial to industrial equipment.
Temperature Compensation Dielectrics
CM03
(0603)
Size (mm)
Temperature
Characteristics
Rated Voltage (VDC)
Capacitance (pF)
R20
R50
1R0
1R5
100
120
101
121
102
122
103
123
0.2
0.5
1.0
1.5
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
12000
15000
18000
CM05
(1005)
C∆
10
16
U∆
25
16
SL
25
25
A
A
C∆
16
25
U∆
SL
50
50
50
B
B
B
CM105
(1608)
CM21
(2012)
CM316
(3216)
CM32
(3225)
C∆
C∆
C∆
C∆
50
100
16
25
50
100
25
50
100
50
A
A
C
A
A
D
B
B
D
C
D
D
D
D
E
D
E
E
E
G
E
G
E
H
F
H
Thickness and standard package quantity
Size
03
05
105
∗105
21, 316, 32
A
B
C
C
D
E
F
G
H
I
J
K
L
0.3±0.03
0.5±0.05
0.8±0.1
0.8±0.1
0.6±0.1
0.85±0.1
1.15±0.1
1.25±0.1
1.4max
1.6max
1.6±0.15
2.0±0.2
2.5±0.2
Taping(180 dia reel)
15kp(P8)
10kp(P8)
4kp(P8)
8kp(P8)
4kp(P8)
4kp(P8)
3kp(E8)
3kp(E8)
2kp(E8)
1kp(E8)
Taping(330 dia reel)
———
50kp(P8) 10kp(P8)
20kp(P8)
10kp(P8)
10kp(P8)
5kp(E8)
———
Thickness
(mm)
Size
Thickness
(mm)
43, 55
J
K
L
M
1.6±0.15
2.0±0.2
2.5±0.2
2.8±0.2
Taping(178 dia reel)
1kp(E12)
Taping(330 dia reel)
———
1kp(E12) 0.5kp(E12) 0.5kp(E12)
———
———
———
10kp(E8) 10kp(E8)
3kp(E8) 2.5kp(E8) 2.5kp(E8)
10kp(E8)
Note : P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗ Carrier tape 2mm pitch from one capacitor to another.
5kp(E8)
5kp(E8)
CM Series
Nickel Barrier Terminations
X5R Dielectric
CM03
(0603)
Size (mm)
Rated Voltage (VDC)
Capacitance (pF)
101
151
102
152
103
153
104
154
105
155
106
10
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
10000
15000
22000
33000
47000
68000
100000
150000
220000
330000
470000
680000
1000000
1500000
2200000
3300000
4700000
6800000
10000000
16
CM05
(1005)
25
4
;;
105
106
107
16
25
50
4
6.3
10
16
25
35
50
6.3
10
16
25
35
50
B
A
C
A
B
;
∗
B
;;
;;
; ;;
;;
10
16
G
C
B
G
C
∗1
∗1 C
C
∗1
∗1 C
C
∗1
25
35
50
6.3
∗1
∗1 G
G
∗2
10
∗
∗
C
G
16
25
35
50
H∗
K
H
K
G
∗1 G
∗1
CM32
(3225)
CM316
(3216)
6.3
D
E
C
B
B
Rated Voltage (VDC)
Capacitance (pF)
100000
220000
470000
1000000
2200000
4700000
10000000
22000000
47000000
100000000
10
CM21
(2012)
A
Size (mm)
104
6.3
CM105
(1608)
6.3
CM43
(4532)
10
25
50
F
F
J
∗
∗2
J
∗
J
∗2
∗2
J
∗2
J
∗ Non standard specification, please contact us for further information.
Optional Spec.
∗1 Length(L, T) tolerance ±0.15
∗2 Length(L, T) tolerance ±0.2
∗2
L
K
L∗
I
L
L
L
L
∗
∗2
L
M
L
CM Series
Nickel Barrier Terminations
X7R, X7S Dielectric
Size (mm)
CM03
(0201)
Rated Voltage (VDC)
Capacitance (pF)
16
101
151
102
152
103
153
104
154
105
155
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
10000
15000
22000
33000
47000
68000
100000
150000
220000
330000
470000
680000
1000000
1500000
2200000
3300000
4700000
CM05
(0402)
6.3
16
104
105
106
50
6.3
10
16
25
B
50
100
C
C
4
10
16
25
50
100
D
E
B
B
∗
∗
∗
∗
B
G
C
∗
∗
∗
∗
G
G
C
G
∗
∗
∗
∗
CM316
(1206)
6.3
10
16
F
J
F
∗2
∗
∗
J
G
CM32
(1210)
25
G
D
E
C
C
Rated Voltage (VDC)
Capacitance (pF)
10000
22000
47000
100000
220000
470000
1000000
2200000
4700000
10000000
22000000
25
CM21
(0805)
A
Size (mm)
103
CM105
(0603)
50
100
E
F
F
J
6.3
10
J
∗
16
I
L
CM43
(1812)
25
50
16
50
100
J
L
L
H
K
L
H
K
H
K
L
100
CM55
(2220)
100
L
L
L
∗ Only X7S available
∗2 Length(W, T) Tolerance ±0.2, X7S available
Y5V Dielectric
Size (mm)
Rated Voltage (VDC)
Capacitance (pF)
102
472
103
473
104
474
105
475
106
476
1000
2200
4700
10000
22000
47000
100000
220000
470000
1000000
2200000
4700000
10000000
22000000
47000000
CM03
(0201)
6.3
10
CM05
(0402)
16
25
CM105
(0603)
50
10
16
25
CM21
(0805)
50
10
16
CM316
(1206)
25
50
D
E
G
E
G
10
16
J
F
J
25
CM32
(1210)
50
10
16
25
J
H
J
50
A
B
B
A
C
B
C
E
C
C
G
F
G
H
F
K
Thickness and standard package quantity
Size
03
05
105
∗105
21, 316, 32
A
B
C
C
D
E
F
G
H
I
J
K
L
0.3±0.03
0.5±0.05
0.8±0.1
0.8±0.1
0.6±0.1
0.85±0.1
1.15±0.1
1.25±0.1
1.4max
1.6max
1.6±0.15
2.0±0.2
2.5±0.2
Taping(180 dia reel)
15kp(P8)
10kp(P8)
4kp(P8)
8kp(P8)
4kp(P8)
4kp(P8)
3kp(E8)
3kp(E8)
2kp(E8)
1kp(E8)
Taping(330 dia reel)
———
50kp(P8) 10kp(P8)
20kp(P8)
10kp(P8)
10kp(P8)
5kp(E8)
———
Thickness
(mm)
Size
Thickness
(mm)
43, 55
J
K
L
M
1.6±0.15
2.0±0.2
2.5±0.2
2.8±0.2
Taping(178 dia reel)
1kp(E12)
Taping(330 dia reel)
———
1kp(E12) 0.5kp(E12) 0.5kp(E12)
———
———
———
10kp(E8) 10kp(E8)
3kp(E8) 2.5kp(E8) 2.5kp(E8)
10kp(E8)
Note : P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗ Carrier tape 2mm pitch from one capacitor to another.
5kp(E8)
5kp(E8)
Multilayer Ceramic Chip Capacitors
Electrical Characteristics
Capacitance-Temperature
(temperature compensation)
For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms
at 1MHz, 1Vrms
10
5
C∆
P∆
R∆
S∆
T∆
U∆
0
-5
DCapacitance(%)
10
DCapacitance(%)
Aging
(change of capacitance over time)
C∆
X7R
0
-10
Y5V
-20
∗Initial value should be after 48hr of Heat treatment.
-10
-60
-40
-20
0
20
40
60
80
100
-30
10
120
100
1,000
Capacitance-Temperature
(high dielectric constant)
Y5U, X7R, Y5V
100,000
Impedance-Frequency
at 1kHz, 1Vrms
20
X7R(X5R) at 0VDC
0
-20
Impedance(Ω)
∆Capacitance(%)
10,000
Duration(hrs)
Temperature(°C)
X7R(X5R) at RV/2
-40
-60
Y5V at 0VDC
-80
100 W
W5
5R(
R(B
B)/
)10
Y5V
00p
0
.01
F
W5
µ
10
F
R(B
)/Y
5V
0.1
µF
1 W5
R(B
)1Y
5V
1µ
Y
F
0.1 5V 10
µF
Y5
V1
00µ
0.01
F
at 1Vrms
CH
CH
CH
10
CH
10
pF
1p
F
0p
F
10
00
pF
Y5V at RV/2
-100
-60
-40
-20
0
20
40
60
80
100
0.001
0.1
120
1
Temperature(˚C)
1,000
10,000
AC Voltage
For temperature compensation at 1MHz, 1Vrms
For high dielectric constant at 1kHz, 1Vrms
20
25
CH
0
For temperature compensation : 1MHz
1 Vrms/for high dielectric constant : 1kHz
Rated at 25V : Y5U
Rated at 25V : C∆, X7R, Y5V
20
DCapacitance(%)
X7R(X5R)
−20
∆C/C(%)
100
Frequency(MHz)
DC Bias
Rated at 25V : Y5U
Rated at 25V : C∆, X7R, Y5V
10
−40
−60
Y5V
15
Y5V
X7R
10
5
0
−80
C∆
-5
−100
0
5
10
15
20
25
-10
VDC
Please verify individual characteristics at the design stage to ensure total suitability
1
2
3
AC Voltage(Vrms)
4
5
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test conditions and Specification for Temperature Compensation type(C∗ to U∗ • SL characteristics)
Test Items
Specification (C: nominal capacitance)
Capacitance Value
Within tolerance
C≤1000pF
1MHz±10%
0.5 to
Q
C≥30pF: Q≥1000
C<30pF: Q≥400+20C
C>1000pF
1kHz±10%
5Vrms
Insulation resistance (IR) (∗6)
10,000MΩ or 500MΩ•µF min, whichever is less
Measured after the rated voltage is applied for one
minute at normal room temperature and humidity. (∗4)
Dielectric Resistance
No problem observed
(∗1) Apply 3 times of the rated voltage for 1 to 5 seconds.
(∗6)
Appearance
No problem observed
Microscope(10×magnification)
Termination strength
(∗2)
No problem observed
Apply a sideward force of 500g(5N) (∗7) to a PCB-mounted
sample.
Bending strength
(∗2)
No mechanical damage at 1mm bent
Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Appearance
No significant change is detected.
∆C
Within tolerance
Q
C≥30pF: Q≥1000
C<30pF: Q≥400+20C
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
Appearance
No significant change is detected.
Vibration
test
Soldering
heat
resistance
∆C
±2.5% or ±0.25pF max, whichever is larger.
Q
C≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR
(∗6)
Withstand voltage
(∗6)
Solderability
Temperature
cycle (∗3)
Humidity
test (∗5)
Resists without problem
No significant change is detected.
∆C
±2.5% or ±0.25pF max, whichever is larger.
Q
C≥30pF: Q≥1000
C<30pF: Q≥400+20C
(∗6)
Resists without problem
Appearance
No significant change is detected.
∆C
±7.5% or ±0.75pF max, whichever is larger.
Q
C≥30pF: Q≥200
C<30pF: Q≥100+10C/3
(∗6)
Time
2minutes
2minutes
Soaking Condition
Sn63 Solder
235±5°C
Sn-3Ag-0.5Cu 245±5°C
2±0.5sec.
3±0.5sec.
After five cycles (∗3), measure after
24±2hours.
Measure the test sample after storing it
24±2hours at a temperature of 40°C±2°C
and a relative humidity of 90-95% Rh.
for 500+24/−0hours.
500MΩ or 25MΩ•µF min, whichever is smaller
Appearance
No significant change is detected.
∆C
±3% or ±0.3pF max, whichever is larger.
Q
C≥30pF: Q≥350
10pF≤C<30pF: Q≥275+5C/2
C<10pF: Q≥200+10C
(∗6)
Temperature
80 to 100°C
150 to 200°C
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
10,000MΩ or 500MΩ•µF min, whichever is samller
Withstand voltage
(∗6)
IR
∗2
∗3
∗4
Order
1
2
10,000MΩ or 500MΩ•µF min, whichever is smaller
Appearance
IR
Hightemperature
with
loading
Soak the sample in 260°C±5°C
solder for 10±0.5seconds
and place in a room at normal temperature
and humidity; measure after 24±2hours.
(Preheating Conditions)
Ni/Br termination: 90% min
IR
∗1
Test Conditions
After applying (∗1) twice of the rated voltage
at a temperature of 125±3°C for
1000+48/−0hours, measure the sample
after storing 24±2hours.
1,000MΩ or 50MΩ•µF min, whichever is smaller
For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when
the rated voltage exceeds 630V.
Except CT series
Different specification for Nickel Barrier termination DN/DR series. (Alumina Substrate)
Apply 500V for 1minite in case the rated voltage is 1000V or higher.
∗5
∗6
∗7
Except CF series.
The charge and discharge current of the capacitor must not exceed 50mA.
2N at 0201 Size
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V)
Specification
Test Items
X7R/X5R
Capacitance Value
Within tolerance
2.5%max, 3.5%max (∗2), 7.0%max (∗12)
5.0%max (∗3), 7.5%max (∗17)
tanδ(%)
Do previous treatment (∗8, ∗14)
Capacitance
Fire
Vol
C≤10µF
1kHz±10% 1.0±0.1Vrms
C>10µF
120Hz±10% 0.5±0.1Vrms
10,000MΩ or 500MΩ•µF min, whichever is less
Measured after the rated voltage is applied for 2minutes
at normal room temperature and humidity. (∗10)
Dielectric Resistance (∗15)
No problem observed
(∗1) Apply 2.5 times of the rated voltage for 1 to 5 seconds.
Appearance
No problem observed
Microscope(10×magnification)
Termination strength
(∗6)
No problem observed
Apply a sideward force of 500g(5N) (∗16) to a
PCB-mounted sample.
Bending strength test
(∗6)
No problem observed at 1mm bent
Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration
Appearance
No significant change is detected.
test
∆C
Within tolerance
tanδ(%)
Satisfies the initial value.
Appearance
No significant change is detected.
∆C
Within ±7.5%
IR
10,000MΩ or 500MΩ•µF min, whichever is smaller
(∗15)
Appearance
Within ±20%
tanδ(%)
Satisfies the initial value.
IR
10,000MΩ or 500MΩ•µF min, whichever is smaller
(∗15)
Withstand voltage
(∗15)
Resists without problem
Appearance
No significant change is detected.
tanδ(%)
IR
(∗15)
Appearance
∆C
IR
Within ±12.5%
Within ±30%
200% max of
initial value
150% max of
initial value
(∗15)
2±0.5sec.
3±0.5sec.
Do previous treatment (∗8)
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
After five cycles (∗7), measure after
48±4hours.
Do previous treatment (∗9)
After storing it at a temperature of
40°C±2°C and a relative humidity of
90-95% for 500+24/−0hours, measure
the sample after storing 48±4hours.
500MΩ or 25MΩ•µF min, whichever is smaller
No significant change is detected.
Within ±12.5%
tanδ(%)
Do previous treatment (∗8)
Soak the sample in 260°C±5°C
solder for 10±0.5seconds
and place in a room at normal temperature
and humidity; measure after 48±4hours.
(Preheating Conditions)
Order
Temperature
Time
1
80 to 100°C
2minutes
2
150 to 200°C
2minutes
Soaking Condition
Sn63 Solder
235±5°C
Sn-3Ag-0.5Cu 245±5°C
No significant change is detected.
Within ±7.5%
∆C
Hightemperature
with
loading
Resists without problem
Ni/Br termination: 90% min
∆C
Humidity
test (∗11)
Within ±20%
Satisfies the initial value.
Solderability
Temperature
cycle (∗7)
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
tanδ(%)
Withstand voltage
(∗15)
*2
*3
*4
*5
*6
*7
*8
*9
5.0%max, 7.0%max (∗13)
9.0%max (∗4), 12.5%max (∗5)
Test Condition
Insulation resistance (IR) (∗15)
Soldering
heat
resistance
*1
Y5V
200% max of
initial value
Within ±30%
150% max of
initialinitial
valuevalue
Do previous treatment (∗9)
After applying twice (∗18) of the rated
voltage at the highest operating temperature
for 1000+48/−0hours, measure the sample
after storing 48±4hours.
1,000MΩ or 50MΩ•µF min, whichever is smaller
Use 1.5 times when the rated voltage is 250V or over.
Use 1.2 times when the rated voltage is 630V or over.
Apply to X5R 35V type, X7R 16V/25V type.
Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type.
Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type).
Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226.
Exclude CT series with thickness of less than 0.66mm and CA series.
Different Specification for Nickel Barrier termination DN/DR series. (Alumina Substrate)
Keep specimen at 150°C+0/−10°C for one hour, leave specimen at room ambient for 48±4 hours.
Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours.
*10
*11
*12
*13
*14
*15
*16
*17
*18
For the CF series over 1000V, apply 500V for 1 minutes at room ambient.
Except CF series.
Apply to X5R 10V type, X7S 4V type.
Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over.
Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type.
The charge/discharge current of the capacitor must not exceed 50mA.
2N at 0201 Size
Apply to X5R 4V and 6.3V type.
Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105).
Use 1.2times when the rated voltage is 630V or over.
Multilayer Ceramic Chip Capacitors
Packaging Options
Tape and Reel
Reel (code : T)
• Reel
W2
E
C
B
Code
Reel
A
B
7-inch Reel
(CODE : T, H)
178±2.0
φ60min
13-inch Reel
(CODE : L, N)
330±2.0
φ100±1.0
Code
Reel
E
W1
D
R
7-inch Reel
(CODE : T, H)
A
13-inch Reel
(CODE : L, N)
W1
(Unit : mm)
C
D
13±0.5
21±0.8
W2
R
16.5max
1.0
10.0±1.5
2.0±0.5
9.5±1.0
∗Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 14±1.5,
W2 : 18.4mm max
F=2mm(03, 05, 105 Type)
Punched rectangular hole to hold capacitor
J
Feed Hole
Carrier Tape
(Paper)
E
A
(Unit : mm)
Type
A
B
F
03 (0.6×0.3)
0.37±0.03
0.67±0.03
2.0±0.05
D
C
B
F
F
H
03 Type: 0.5MAX
05 Type: 0.75MAX
F=4mm(105, D11, D12, F12, F13, 21, 316, 32, 42, 52 Type)
(Plastic)
Punched rectangular hole to hold capacitor
J
Feed Hole
05 (1.0×0.5)
0.65±0.1
1.15±0.1
2.0±0.05
105 (1.6×0.8)
1.0±0.2
1.8±0.2
4.0±0.1
D11 (1.37×1.0)
1.15±0.1
1.55±0.1
4.0±0.1
D12 (1.25×2.0)
1.5±0.2
2.3±0.2
4.0±0.1
(Paper)
2.8MAX
E
F12 (1.25×2.0)
1.5±0.2
2.3±0.2
4.0±0.1
F13 (1.6×3.2)
2.0±0.2
3.6±0.2
4.0±0.1
1.5±0.2
2.3±0.2
4.0±0.1
A
D
F
H
21 (2.0×1.25)
φ1.0 +0.2
−0
C
B
G
0.6MAX
Holes only for plastic carrier tape.
316 (3.2×1.6)
2.0±0.2
3.6±0.2
4.0±0.1
32 (3.2×2.5)
2.9±0.2
3.6±0.2
4.0±0.1
1.1MAX
F=8mm(43, 53, 55 Type)
(Plastic)
Punched rectangular hole to hold capacitor
Feed Hole J
2.8MAX
42 (4.5×2.0)
2.4±0.2
4.9±0.2
4.0±0.1
43 (4.5×3.2)
3.6±0.2
4.9±0.2
8.0±0.1
52 (5.7×2.0)
2.4±0.2
6.0±0.2
4.0±0.1
53 (5.7×2.8)
3.2±0.2
6.0±0.2
8.0±0.1
55 (5.7×5.0)
5.3±0.2
6.0±0.2
8.0±0.1
E
A
D
φ1.0 +0.2
−0
C
B
(Unit : mm)
F
F
H
G
2.0
±0.05
Bulk Cassette
(Unit : mm)
12
36
Slider
Shutter
110
Connection Area
Carrier Tape
C
D
8.0
±0.3
3.5
±0.05
12.0
±0.3
5.5
±0.05
E
G
1.75
±0.1
2.0
±0.05
H
J
0.6MAX
4.0
±0.1
8.0
±0.1
8mm
Paper
8mm
Plastic
12mm
Plastic
4.0
1.5
±0.1 +0.1/−0
Multilayer Ceramic Chip Capacitors
Precautions
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance
which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause
a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave
consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability
design different from that of general purpose capacitors.
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur.
The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this
effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for
usage. Also, please make certain temperature rises remain below 20ºC.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super-imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations,
may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,
even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load
voltage at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in
the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage
change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective
product in order that the assembled product function appropriately.
Storage
1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is
exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Dimensions for recommended typical land
Standard
Land Pattern
Sample capacitor
c
b
a
Soldering resist
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to the
amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist
(Unit : mm)
Size
L×W
a
b
c
03
0.6×0.3
0.20 to 0.30
0.25 to 0.35
0.30 to 0.40
05
1.0×0.5
0.30 to 0.50
0.35 to 0.45
0.40 to 0.60
105
1.6×0.8
0.70 to 1.00
0.80 to 1.00
0.60 to 0.80
21
2.0×1.25
1.00 to 1.30
1.00 to 1.20
0.80 to 1.10
316
3.2×1.6
2.10 to 2.50
1.10 to 1.30
1.00 to 1.30
32
3.2×2.5
2.10 to 2.50
1.10 to 1.30
1.90 to 2.30
42
4.5×2.0
2.50 to 3.20
1.80 to 2.30
1.50 to 1.80
43
4.5×3.2
2.50 to 3.20
1.80 to 2.30
2.60 to 3.00
52
5.7×2.0
4.20 to 4.70
2.00 to 2.50
1.50 to 1.80
53
5.7×2.8
4.20 to 4.70
2.00 to 2.50
2.20 to 2.60
55
5.7×5.0
4.20 to 4.70
2.00 to 2.50
4.20 to 4.70
∗ CA series : Please refer Page 19.
DN/DR Automotive Series
(Unit : mm)
Size
L×W
a
b
c
105
1.6×0.8
0.60 to 0.90
0.80 to 1.00
0.70 to 1.00
21
2.0×1.25
0.90 to 1.20
0.80 to 1.20
0.90 to 1.40
316
3.2×1.6
1.40 to 1.90
1.00 to 1.30
1.30 to 1.80
Ideal Solder Thickness
T/3 to T/2
Chip Capacitor
T
Solder
;;
;;
;
PCB
Typical mounting problems
Item
Not recommended example
Recommended example/Separated by solder resist
Solder resist
Multiple parts mount
Solder resist
Mount with
leaded parts
Leaded parts
Leaded parts
Soldering iron
Solder resist
Wire soldering
after mounting
Wire
Solder resist
Overview
Solder resist
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
Recommended chip position on PCB to minimize stress from PCB warpage
(Not recommended)
(Ideal)
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
Crack
Support pin
4) When the positioning hook begins to wear, unstable mechanical shock may be applied to the chip capacitor, resulting in cracking.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low
shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such
gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
(Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm, and
capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free.
Recommendable Temperature Profile(62Sn Solder)
Reflow
Recommendable Temperature Profile(Sn-3Ag-0.5Cu)
Reflow
Peak temperature
230°C±5°C
15seconds maximum
300
250°C±5°C
5 to 10sec. Max.
Preheat
300
250
∆T
Temperature
200
150
100
More than180°C,
40seconds maximum
200
1 to 3°C/sec.
170 to 180°C
150
100
50
50
0
0
60seconds
Preheat
250
Temperature
Cool at normal room
temperature after
removing from
furnace.
60seconds
220°C Max.
90±30sec.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
Wave
Wave
300
300
Preheat
250
150
230°C
to
260°C
100
50
250
Temperature
Temperature
∆T
200
;;;;;;;
;;;;;;;
;;;;;;;
;;;;;;;
245 to 260˚C
Cool at normal
room temperature
200
150
100
∆T
Preheat
0
90±30sec.
60 to 120sec.
q
w
e
r
3sec. max
Ensure that the chip capacitor is preheated adequately.
Ensure that the temperature difference (∆T) does not exceed 150°C.
Cool naturally after soldering.
Stop wave in more than CM32.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference (∆T) does not exceed 150°C.
e Cool naturally after soldering.
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
350°C max
30W max
φ3.0mm max
3sec. max
5) Cautions
a) Pre-heating is necessary Rapid heating must be avoided.
Delta T≤130˚C.
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
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