Chip Bead Array EXC28B ■ Features

Chip Bead Array EXC28B ■ Features
Chip Bead Array
Chip Bead Array
Type:
EXC28B
■ Features
■ Recommended Applications
● Space saving
● SSOP package (0.5 mm pitch) compatibility
● Small size and lightweight
● Small digital equipment such as PCs, printers, HDD,
DVD-ROMs, CD-ROMs, LCDs.
● Digital audio and video equipment such as DSC,
DVC, CD Players, DVD Players, MD Players.
● Electronic musical instruments, and other digital
equipment.
Type: EXC28BB
● Suitable for high speed signals (over 50 MHz)
● Excellent cross talk characteristics (100 MHz:<-25 dB)
Type: EXC28BA
● Reduces waveform ringing noise
● Excellent cross talk characteristics (100 MHz:<-30 dB)
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
C
2
8
B
B
1
2
1
U
Product Code
Noise Filter
Chip size 1005 mm
x4 Array
Size
B
Multilayer
Chip bead
Type Characteristics
Nominal Impedance
A Ringing Suppression Type
B High Speed Signal Type
■ Construction
12
Form
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Suffix
Code
Packing
U
Embossed Carrier Taping
■ Dimensions in mm (not to scale)
B
Ferrite Core
A
D
C
E
Inner Conductor
Electrode
Type
(inches)
F
Dimensions (mm)
A
B
EXC28B
1.00±0.15 2.0±0.2
(0804)
C
D
E
F
0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mass
(Weight)
[mg/pc.]
5.2
Feb. 2006
Chip Bead Array
■ Ratings
Type
Part Number
BA
BB
Impedance
(액) at 100MHz
tol.(%)
EXC28BA121U
120
EXC28BA221U
220
EXC28BB121U
120
EXC28BB221U
220
Rated Current
(mA DC)
DC Resistance
(액) max.
0.5
±25
0.7
100
0.5
0.7
■ Impedance Characteristics (Reference Data) Measured by HP4291A
● EXC28BB121U (2010)
400
400
350
350
300
300
| Z| ,R,X(액)
| Z| ,R,X(액)
● EXC28BA121U (2010)
250
200
150
Z
100
Z
200
R
150
100
R
X
50
50
X
0
1
10
0
100
1000
Frequency(MHz)
10000
● EXC28BA221U (2010)
1
400
400
350
350
300
300
Z
250
200
R
150
10
100
1000
Frequency(MHz)
10000
● EXC28BB221U (2010)
| Z| ,R,X(액)
| Z| ,R,X(액)
250
Z
R
250
200
150
100
100
X
50
50
X
0
0
1
10
100
1000
Frequency(MHz)
1
10000
훺Z훺 : Impedance
R : Resistance
10
100
1000
Frequency(MHz)
10000
X : Reactance
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Array
■ Circuit Configuration
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
Pitch (P1)
Quantity
EXC28B첸첸첸첸U
Embossed Carrier Taping
4 mm
5000 pcs./reel
● Embossed Carrier Taping
● Taping Reel
T
Compartment
f D0
fC
B
F
A
fB
E
Sprocket hole
W
t1
fD
E
P1
t2
P2
Chip component
P0
Tape running direction
fA
W
t
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
EXC28B첸첸첸첸U 1.20±0.15 2.25±0.15 8.0±0.2
F
E
P1
3.5±0.1 1.75±0.10 4.0±0.1
P2
P0
2.0±0.1
4.0±0.1
fD0
t1
t2
1.5±0.1 0.20±0.05 0.9±0.1
Standard Reel Dimensions (mm)
Part Number
EXC28B첸첸첸첸U
fA
0
–3.0
180
fB
fC
fD
E
W
T
t
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
9.0±0.3
11.4±1.5
1.2±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Array
■ Recommended Land Pattern Design
E
F
E
B
F
E
F
E
Dimension (mm)
1.4
B
1.75
C
0.4
D
A
C
D
A
D
0.5
E
0.25
F
0.25
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Please contact us for additional information when used in conditions other than those specified.
● Please measure the temperature of the terminals and study every kind of solder and printed circuit board
for solderability before actual use.
The limit of resistance
to reflow soldering heat
270
260
Rising temperature I
Preheating
Gradual
cooling
Main
Rising temperature II heating
Temperature (°C)
Temperature of terminals (°C)
<Recommended reflow soldering temperature>
250
240
230
220
210
200
Time (min.)
Solder
Rising temperature I
For soldering
(Sn-37Pb)
The normal time
for preheating
30 s to 60 s
For lead-free
soldering
(Sn-3Ag-0.5Cu)
The normal time
for preheating
30 s to 60 s
0
10
20
30
40
50
60
70
Time (s)
Preheating
Rising temperature II
Main heating
Gradual cooling
140 °C to 160 °C Preheating to 200 °C
20 s to 40 s
60 s to 120 s
235±10 °C
Peak
200 °C to 100 °C
1 °C to 4 °C/s
150 °C to 170 °C Preheating to 210 °C
60 s to 120 s
20 s to 40 s
250+10
– 5 °C
Peak
210 °C to 100 °C
1 °C to 4 °C/s
✽ Reflow soldering shall be performed a maximum of two times.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. When possible, do not mount Chip Bead Array (hereafter called the bead arrays) by flow soldering. It is highly
possible that flow soldering may cause bridges between the electrodes.
2. Use rosin-based flux or halogen-free flux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to the bead arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
may be chipped, affecting their performance. Excessive mechanical stress may damage the bead arrays. Handle
with care.
5. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
60 %, where there are no rapid changes in temperature or humidity.
6. Use the bead arrays within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
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