Applications Features SMD NTC Thermistor

SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Applications
Temperature measurement and compensation for mobile phone applications, automotive and
data systems
Features
-
-
Standard EIA chip size 1206
SMD NTC with Ni - Barrier termination (Ag/Ni/Sn)
The component is compliant with ROHS (DIRECTIVE 2002/95/EC OF THE EUROPEAN
PARLIAMENT AND THE COUNCIL of 27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment)
Suitable for lead-free soldering process
Electrical Specifications
Part Number
Zero-Power Resistance
(at 25°C)
B57621C5102*062
1 kΩ
J for ∆R/R25 = ± 5%
K for ∆R/R25 = ± 10%
* = Resistance Tolerance:
Climatic Category (IEC 60068-1)
Lower category temperature
Higher category temperature
Power rating at 25°C
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
Weigth of component
1)
55/125/21
-55°C
125°C
300mW 1)
approx. 5 mW/K 1)
approx. 10 s 1)
approx. 50 mJ/K 1)
approx. 18 mg
P25
Gth
Tth
Cth
Depends on mounting situation
Part Dimensions
Type
1206
L
3.2±0.20
W
W
T
k
1.60±0.20 1.30 max. 0.50±0.25
Dimensions in mm
L
k
Term ination Ag/Ni/Sn
ISSUE DATE
07.07.06
ISSUE
a
PUBLISHER
T
KB S PE
Dim ensions in [m m]
PAGE
1/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Resistance - Temperature Characteristic
R at 25°C
1000 Ω ± 5%
ISSUE DATE
T
R_Nom
R_Min
R_Max
∆R/R25
∆T
[°C]
[Ω]
[Ω]
[Ω]
[±%]
[±°C]
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
59.147,00
42.651,00
31.088,00
22.903,00
17.052,00
12.827,00
9.746,00
7.477,00
5.790,00
4.523,00
3.564,00
2.832,00
2.267,00
1.829,00
1.486,00
1.215,00
1.000,00
828,20
689,90
577,80
486,60
411,80
350,20
299,20
256,70
221,20
191,40
166,20
144,80
126,70
111,20
97,87
86,43
76,55
67,99
60,56
54,07
48.631,00
35.521,00
26.207,00
19.530,00
14.700,00
11.172,00
8.572,00
6.638,00
5.186,00
4.086,00
3.246,00
2.599,00
2.096,00
1.703,00
1.393,00
1.146,00
950,00
781,60
647,20
539,10
451,40
380,00
321,40
273,20
233,20
200,00
172,20
148,80
129,10
112,40
98,22
86,10
75,72
66,79
59,09
52,42
46,63
69.664,00
49.781,00
35.969,00
26.276,00
19.405,00
14.482,00
10.920,00
8.316,00
6.394,00
4.961,00
3.883,00
3.065,00
2.438,00
1.955,00
1.578,00
1.283,00
1.050,00
874,70
732,50
616,60
521,80
443,70
379,00
325,20
280,20
242,40
210,60
183,60
160,60
140,90
124,10
109,60
97,14
86,31
76,90
68,69
61,52
17,80
16,70
15,70
14,70
13,80
12,90
12,00
11,20
10,40
9,70
8,90
8,20
7,50
6,90
6,30
5,60
5,00
5,60
6,20
6,70
7,20
7,70
8,20
8,70
9,20
9,60
10,00
10,50
10,90
11,30
11,70
12,00
12,40
12,80
13,10
13,40
13,80
2,70
2,60
2,50
2,50
2,40
2,30
2,20
2,20
2,10
2,00
1,90
1,80
1,70
1,60
1,50
1,40
1,30
1,50
1,70
1,90
2,10
2,40
2,60
2,80
3,00
3,30
3,50
3,80
4,00
4,30
4,50
4,80
5,00
5,30
5,60
5,90
6,20
07.07.06
ISSUE
a
PUBLISHER
KB S PE
PAGE
2/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Reliability
Tests of SMD NTC thermistors are made according to IEC 60068. The parts are mounted on
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
∆R25 / R25
(typical)
Standard
Test conditions
IEC 60068-2-2
(=JIS C 0021)
Storage at upper category
temperature
T: 125°C
t: 1000h
Storage in IEC 60068-2-3
damp heat, (=JIS C 0022)
steady state
Temperature of air: 40°C
relative humidity of air: 93%
Duration: 21days
Rapid
IEC 60068-2-14 Lower test temperature: -55°C
temperature (=JIS C 0025) Upper test temperature: 125°C
Number of cycles: 10
cycling
Endurance
at Pmax
-
Pmax=300mW
Duration: 1000h
Remarks
< 6%
< 3%
No visible damage
< 3%
< 5%
Solderability IEC 60068-2-58 Solderability:
(=JIS C 0054)
215°C/3s (Pb-cont. solder)
245°C/3s (Pb-free solder)
95% of termination
wetted
Resistance to soldering heat:
260°C/10s
Resistance
drift after
soldering
ISSUE DATE
-
07.07.06
reflow soldering profile
wave soldering profile
ISSUE
a
PUBLISHER
< 5%
KB S PE
PAGE
3/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Mounting Instructions
1. Termination
Ni-barrier termination (Ag/Ni/Sn)
2. Recommended geometry of solder pads
Size
1206
A
[mm]
1.8
B
B
[mm]
1.2
C
A
C
[mm]
2.1
D
[mm]
4.5
B
A
D
3. Requirements for Solderability
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas ≥ 95%.
Pb-containing solder: Sn(60)Pb(40)
Bath temperature (°C): 215 ± 3
Dwell time (s): 3 ± 0.3
Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 245 ± 5
Dwell time (s): 3 ± 0.3
- Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Leaching of side edges ≤ 1/3.
Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 260 ± 5
Dwell time (s): 10 ± 1
ISSUE DATE
07.07.06
ISSUE
a
PUBLISHER
KB S PE
PAGE
4/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
4. Recommended soldering profiles
Reflow soldering profile: (according to CECC 00802)
Temperature characteristics at component terminals during reflow soldering (two cycles are
permitted).
Wave soldering profile:
Temperature characteristics at component terminals during wave soldering can be recommended
once in general.
5. Storage conditions
Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier termination,
provided that the components are stored in the original packages.
Storage temperature: -25 ... +45°C
Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and
wetness are inadmissible.
ISSUE DATE
07.07.06
ISSUE
a
PUBLISHER
KB S PE
PAGE
5/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Taping and Packing
Taping:
Tape and reel packing comply with specifications of IEC 60286-3
Blister tape
A
D
0
Section A-A
P
2
P
0
E
F
W
B0
K0
T
A
2
G
D1
A
0
P
1
Direction of unreeling
Dimensions and tolerances:
Definition
Symbol
Dimension (mm)
Tol. (mm)
Size 1206
Compartment width x Compartments length
A 0 x B0
1.9 x 3.5
± 0.2
Compartment height
K0
1.4
max.
Overall thickness
T2
2.5
max.
Sprocket hole diameter
D0
1.5
+0.1/-0
Compartment hole diameter
D1
1.0
min.
Sprocket hole pitch
P0
4.0
± 0.1
Distance centre hole to centre compartment
P2
2.0
± 0.05
Pitch of the component compartments
P1
4.0
± 0.1
Tape width
W
8.0
± 0.3
Distance edge to centre of hole
E
1.75
± 0.1
Distance centre hole to centre compartment
F
3.5
± 0.05
Distance edge to centre compartment
G
0.75
min.
1)
1)
≤ 0.2 mm over 10 sprocket holes.
Part orientation in tape pocket
equivalent terminations
because of unipolar component
ISSUE DATE
07.07.06
ISSUE
a
PUBLISHER
KB S PE
PAGE
6/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57621C5102*062
Data sheet
Reel Packing:
Reel material:
PS.
Tape material:
Blister
Tape break force:
min. 10N
Top cover tape peel force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle between top cover
tape and the direction of feed during peel off: 165 -180°.
Top cover tape strength:
min. 10N
Length of tape:
Leader section: additional top cover tape, length min 400 mm, before component section (including
carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities).
Trailer section: length min. 40 mm.
Empty part cavities at leader and trailer section on tape are sealed with top cover tape.
Cavity play:
Each part rests in the cavity so that the angle between the part centreline and the cavity centreline is
no more than 20°.
Weight of loaded reel:
max. 1500 g
Packing units:
2000pcs.
Package 8 mm tape
Definition
Reel diameter
Reel width (inside)
Reel width (outside)
Symbol
A
W1
W2
Dim. (mm)
180
8.4
14.4
Tol. (mm)
-3/+0
+1.5/-0
max.
 EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and
Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless
otherwise agreed.
ISSUE DATE
07.07.06
ISSUE
a
PUBLISHER
KB S PE
PAGE
7/7

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project